CN112517309B - Mesh microstructure for high-viscosity liquid atomization and manufacturing method thereof - Google Patents
Mesh microstructure for high-viscosity liquid atomization and manufacturing method thereof Download PDFInfo
- Publication number
- CN112517309B CN112517309B CN201910875322.3A CN201910875322A CN112517309B CN 112517309 B CN112517309 B CN 112517309B CN 201910875322 A CN201910875322 A CN 201910875322A CN 112517309 B CN112517309 B CN 112517309B
- Authority
- CN
- China
- Prior art keywords
- mesh
- layer
- array
- silicon
- template
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 18
- 238000009688 liquid atomisation Methods 0.000 title abstract description 15
- 239000000463 material Substances 0.000 claims abstract description 32
- 239000000758 substrate Substances 0.000 claims abstract description 30
- 239000007788 liquid Substances 0.000 claims abstract description 21
- 238000000889 atomisation Methods 0.000 claims abstract description 9
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 46
- 229910052710 silicon Inorganic materials 0.000 claims description 46
- 239000010703 silicon Substances 0.000 claims description 46
- 238000000034 method Methods 0.000 claims description 15
- 239000002184 metal Substances 0.000 claims description 10
- 229910052751 metal Inorganic materials 0.000 claims description 10
- 238000005530 etching Methods 0.000 claims description 3
- 239000012528 membrane Substances 0.000 claims description 3
- 229920001721 polyimide Polymers 0.000 claims description 3
- 239000004593 Epoxy Substances 0.000 claims 1
- 239000004642 Polyimide Substances 0.000 claims 1
- 230000003670 easy-to-clean Effects 0.000 abstract description 4
- 238000002360 preparation method Methods 0.000 abstract description 3
- 230000001133 acceleration Effects 0.000 description 13
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical group [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 12
- 238000004049 embossing Methods 0.000 description 6
- 229910052759 nickel Inorganic materials 0.000 description 6
- 230000008859 change Effects 0.000 description 4
- 230000009286 beneficial effect Effects 0.000 description 3
- 230000007423 decrease Effects 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 238000005094 computer simulation Methods 0.000 description 2
- 230000003247 decreasing effect Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 238000001020 plasma etching Methods 0.000 description 2
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 239000009719 polyimide resin Substances 0.000 description 2
- 239000011148 porous material Substances 0.000 description 2
- 239000007921 spray Substances 0.000 description 2
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- 238000003491 array Methods 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 238000003486 chemical etching Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000001312 dry etching Methods 0.000 description 1
- 238000005323 electroforming Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 230000002209 hydrophobic effect Effects 0.000 description 1
- 238000000608 laser ablation Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 1
- 239000004926 polymethyl methacrylate Substances 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B17/00—Apparatus for spraying or atomising liquids or other fluent materials, not covered by the preceding groups
- B05B17/04—Apparatus for spraying or atomising liquids or other fluent materials, not covered by the preceding groups operating with special methods
- B05B17/06—Apparatus for spraying or atomising liquids or other fluent materials, not covered by the preceding groups operating with special methods using ultrasonic or other kinds of vibrations
- B05B17/0607—Apparatus for spraying or atomising liquids or other fluent materials, not covered by the preceding groups operating with special methods using ultrasonic or other kinds of vibrations generated by electrical means, e.g. piezoelectric transducers
- B05B17/0653—Details
Landscapes
- Fuel-Injection Apparatus (AREA)
Abstract
本发明公开一种用于高粘度液体雾化的网孔微结构及其制作方法。所述制作方法包括:制作网孔模板,其中所述网孔模板具有具有凸柱阵列;在衬底上形成网孔材料层;将所述网孔模板压印所述网孔材料层,其中所述凸柱阵列完全陷入所述网孔材料层内,并固化所述网孔材料层;去除所述网孔模板和所述衬底,以获得振动膜片,其中所述振动膜片的与所述凸柱阵列正对的位置形成网孔。网孔微结构可以实现从低粘度到高粘度液体的常温雾化,且雾化充分、雾化液滴体积小、流量大,网孔表面平整、坚固又易于清洗,同时该制作方法工艺稳定、易于重复。
The invention discloses a mesh microstructure for high-viscosity liquid atomization and a preparation method thereof. The manufacturing method includes: making a mesh template, wherein the mesh template has an array of convex pillars; forming a mesh material layer on a substrate; imprinting the mesh template on the mesh material layer, wherein the mesh material layer is printed on the mesh template. The convex column array is completely immersed in the mesh material layer, and the mesh material layer is cured; the mesh template and the substrate are removed to obtain a vibrating diaphragm, wherein the vibrating diaphragm and the A mesh hole is formed at the position facing the convex column array. The mesh microstructure can realize the normal temperature atomization of liquid from low viscosity to high viscosity, and the atomization is sufficient, the atomized droplet volume is small, the flow rate is large, the mesh surface is flat, firm and easy to clean, and the production method is stable and easy to clean. Easy to repeat.
Description
技术领域technical field
本发明属于液体雾化技术领域,具体地讲,涉及一种用于高粘度液体雾化的网孔微结构及其制作方法。The invention belongs to the technical field of liquid atomization, and in particular relates to a mesh microstructure used for high-viscosity liquid atomization and a manufacturing method thereof.
背景技术Background technique
用于高粘度液体雾化的网孔微结构是一种通过压电片振动带动网孔片振动,接触液体,并带动液体喷射的喷雾装置。其中,振动网孔片上液体出口面的网孔直径是决定雾化液滴直径的关键因素,且网孔的微结构是决定雾化液体粘度的因素之一。目前业界实现振动式网孔微结构的方式主要是激光烧蚀、化学刻蚀或电铸技术,雾化网孔的孔径及形貌要求、材料的选择等受制造技术的限制很大,难以满足小孔径尤其是直径1-2μm的孔径或常温下高粘度液体的雾化需求。The mesh microstructure for high-viscosity liquid atomization is a spray device that drives the mesh sheet to vibrate through the vibration of the piezoelectric sheet, contacts the liquid, and drives the liquid to spray. Among them, the mesh diameter of the liquid outlet surface on the vibrating mesh sheet is a key factor in determining the diameter of the atomized droplets, and the microstructure of the mesh is one of the factors determining the viscosity of the atomized liquid. At present, the main methods of realizing the vibrating mesh microstructure in the industry are laser ablation, chemical etching or electroforming technology. The aperture and morphology requirements of the atomized mesh, and the selection of materials are greatly limited by the manufacturing technology, which is difficult to meet. Small pore size, especially the pore size of 1-2 μm in diameter or the atomization requirements of high viscosity liquids at room temperature.
发明内容SUMMARY OF THE INVENTION
(一)本发明所要解决的技术问题(1) Technical problem to be solved by the present invention
本发明解决的技术问题是:如何制作形成可喷射高粘度液体的用于高粘度液体雾化的网孔微结构。The technical problem solved by the present invention is: how to make a mesh microstructure for high-viscosity liquid atomization capable of spraying high-viscosity liquid.
(二)本发明所采用的技术方案(2) Technical scheme adopted in the present invention
为解决上述的技术问题,本发明采用如下技术方案:In order to solve the above-mentioned technical problems, the present invention adopts the following technical solutions:
一种用于高粘度液体雾化的网孔微结构的制作方法,所述制作方法包括:A method for making a mesh microstructure for high-viscosity liquid atomization, the making method comprising:
制作网孔模板,其中所述网孔模板具有凸柱阵列;making a mesh template, wherein the mesh template has an array of convex pillars;
在衬底上制作形成网孔材料层;Fabricating and forming a mesh material layer on the substrate;
将所述网孔模板压印所述网孔材料层,其中所述凸柱阵列完全陷入所述网孔材料层内,并固化所述网孔材料层;stamping the mesh material layer on the mesh template, wherein the convex pillar array is completely immersed in the mesh material layer, and curing the mesh material layer;
去除所述网孔模板和所述衬底,以获得振动膜片,其中所述振动膜片的与所述凸柱阵列正对的位置形成网孔。The mesh template and the substrate are removed to obtain a vibrating diaphragm, wherein a mesh hole is formed at the position of the vibrating diaphragm which is opposite to the array of convex pillars.
优选地,所述网孔模板的制作方法如下:Preferably, the making method of described mesh template is as follows:
制作硅印模,其中所述硅印模上具有硅圆柱阵列;making a silicon stamp, wherein the silicon stamp has an array of silicon cylinders thereon;
在基底上形成压印层,并将所述制作硅印模压印所述压印层,其中硅圆柱阵列完全陷入所述压印层内;forming an imprint layer on a substrate, and imprinting the imprint layer with the fabricated silicon stamp, wherein the silicon cylinder array is completely embedded in the imprint layer;
固化所述压印层并进行脱模,其中所述压印层的与所述硅圆柱阵列正对的位置上形成凹槽阵列;curing the imprint layer and performing demolding, wherein a groove array is formed on the imprint layer at a position facing the silicon cylinder array;
在所述压印层上制作形成金属层,所述金属层覆盖所述凹槽阵列;forming a metal layer on the imprint layer, the metal layer covering the groove array;
去除所述压印层与所述基底,以获得网孔模板,其中所述网孔模板的与所述凹槽阵列正对的位置上形成凸柱阵列。The embossing layer and the substrate are removed to obtain a mesh template, wherein a convex column array is formed on a position of the mesh template opposite to the groove array.
优选地,所述凸柱阵列的凸柱的半径大小从远离网孔模板本体的一端至靠近网孔模板本体的一端递增,且所述凸柱的侧面为凹弧面。Preferably, the radius of the convex columns of the convex column array increases from one end away from the mesh template body to the end close to the mesh template body, and the sides of the convex columns are concave arc surfaces.
优选地,所述制作方法还包括清除所述网孔内残留的压印胶残膜。Preferably, the manufacturing method further includes removing the residual film of the embossing glue in the mesh.
优选地,所述网孔材料层的材料为聚酰亚胺或环氧树脂。Preferably, the material of the mesh material layer is polyimide or epoxy resin.
优选地,制作硅印模的方法包括:Preferably, the method of making a silicon stamp comprises:
在硅基底上形成掩膜图案层;forming a mask pattern layer on the silicon substrate;
对所述硅基底进行刻蚀,以形成硅圆柱阵列;etching the silicon substrate to form an array of silicon cylinders;
去除所述掩膜图案层,以获得制作硅印模。The mask pattern layer is removed to obtain a silicon stamp.
优选地,所述网孔的半径大小沿着所述振动膜片的第一表面至第二表面的方向递减,且所述网孔的内壁面为弧面,其中第一表面和第二表面相对设置。Preferably, the radius of the mesh hole decreases along the direction from the first surface to the second surface of the vibrating membrane, and the inner wall surface of the mesh hole is an arc surface, wherein the first surface and the second surface are opposite to each other set up.
优选地,所述网孔的半径R与所述网孔的高度H满足如下关系:Preferably, the radius R of the mesh hole and the height H of the mesh hole satisfy the following relationship:
R=a-H,其中H表示所述网孔内壁面与所述第一表面之间的距离,a表示设计常数且a>1。R=a -H , wherein H represents the distance between the inner wall surface of the mesh and the first surface, a represents a design constant and a>1.
或者,所述网孔的半径R与所述网孔的高度H满足如下关系:Or, the radius R of the mesh hole and the height H of the mesh hole satisfy the following relationship:
R=H-b,其中H表示所述网孔内壁面与所述第一表面之间的距离,b表示设计常数且b>1。R=H −b , where H represents the distance between the inner wall surface of the mesh and the first surface, b represents a design constant and b>1.
本发明还公开了一种用于高粘度液体雾化的网孔微结构,由上述任一种的制作方法制成。The invention also discloses a mesh microstructure for high-viscosity liquid atomization, which is made by any one of the above-mentioned manufacturing methods.
(三)有益效果(3) Beneficial effects
本发明公开了一种用于高粘度液体雾化的网孔微结构及其制作方法,与现有技术相比,具有如下优点和有益效果:利用上述制作方法制造的用于高粘度液体雾化的网孔微结构,可以实现从低粘度到高粘度液体的常温雾化,且雾化充分、雾化液滴体积小、流量大,网孔表面平整、坚固又易于清洗,同时该制作方法工艺稳定、易于重复。The invention discloses a mesh microstructure for high-viscosity liquid atomization and a preparation method thereof. Compared with the prior art, the invention has the following advantages and beneficial effects: The microstructure of the mesh hole can realize the normal temperature atomization of liquid from low viscosity to high viscosity, and the atomization is sufficient, the atomized droplet volume is small, the flow rate is large, the mesh surface is flat, strong and easy to clean. Stable and easy to repeat.
附图说明Description of drawings
图1是本发明的实施例的用于高粘度液体雾化的网孔微结构的制作方法的流程图;Fig. 1 is the flow chart of the manufacture method of the mesh microstructure for high-viscosity liquid atomization of the embodiment of the present invention;
图2是本发明的实施例的硅印模的剖面示意图;2 is a schematic cross-sectional view of a silicon stamp according to an embodiment of the present invention;
图3是本发明的实施例的网孔模板的剖面示意图;3 is a schematic cross-sectional view of a mesh template of an embodiment of the present invention;
图4是本发明的实施例的网孔材料层与衬底的剖面示意图;4 is a schematic cross-sectional view of a mesh material layer and a substrate according to an embodiment of the present invention;
图5是本发明的实施例的网孔模板压印网孔材料层的示意图;5 is a schematic diagram of a mesh template imprinting a mesh material layer according to an embodiment of the present invention;
图6是本发明的实施例的用于高粘度液体雾化的网孔微结构的剖面示意图;6 is a schematic cross-sectional view of a mesh microstructure for high-viscosity liquid atomization according to an embodiment of the present invention;
图7是本发明的实施例的用于高粘度液体雾化的网孔微结构的俯视图;7 is a top view of a mesh microstructure for high viscosity liquid atomization according to an embodiment of the present invention;
图8是本发明的实施例的含有加速度的函数A随高度H的指数函数aH变化曲线;Fig. 8 is the variation curve of the exponential function a H of the function A containing acceleration with the height H according to the embodiment of the present invention;
图9是本发明的实施例的含有加速度的函数A随高度H的Hb幂函数变化曲线。FIG. 9 is a curve of the H b power function change curve of the function A including the acceleration with the height H according to the embodiment of the present invention.
具体实施方式Detailed ways
为了使本发明的目的、技术方案及优点更加清楚明白,以下结合附图及实施例,对本发明进一步详细说明。应当理解,此处所描述的具体实施例仅仅用以解释本发明,并不用于限定本发明。In order to make the objectives, technical solutions and advantages of the present invention clearer, the present invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention, but not to limit the present invention.
为了解决现有的振动网孔片不能有效地对高粘度液体进行雾化的情况下,本申请提出一种用于高粘度液体雾化的网孔微结构的制作方法。如图1所示的流程图,本实施例的用于高粘度液体雾化的网孔微结构的制作方法包括如下步骤:In order to solve the situation that the existing vibrating mesh sheet cannot effectively atomize the high-viscosity liquid, the present application proposes a method for making a mesh microstructure for atomizing the high-viscosity liquid. As shown in the flow chart shown in Figure 1, the method for making a mesh microstructure for high-viscosity liquid atomization in this embodiment includes the following steps:
步骤S10:制作网孔模板30,其中网孔模板30具有凸柱阵列31。Step S10 : making a
具体来说,该网孔模板30优选采用金属模板,该网孔模板30的具体制作方法如下:Specifically, the
步骤S11:制作硅印模100,其中所述硅印模100上具有硅圆柱阵列101。Step S11 : fabricating a
如图2所示,具体来说该步骤S11包括如下步骤:As shown in Figure 2, specifically, step S11 includes the following steps:
步骤S111:在硅基底上形成掩膜图案层。具体来说,首先对硅基底进行清洗处理,接着在硅基底上用等离子体增强化学气相沉积法(PECVD)沉积介质膜,介质膜的材料可采用氧化硅或氮化硅,最后对介质膜进行光刻和干法刻蚀以形成掩膜图案层。Step S111 : forming a mask pattern layer on the silicon substrate. Specifically, the silicon substrate is first cleaned, and then a dielectric film is deposited on the silicon substrate by plasma enhanced chemical vapor deposition (PECVD). The material of the dielectric film can be silicon oxide or silicon nitride, and finally the dielectric film is subjected to Photolithography and dry etching to form a mask pattern layer.
步骤S112:对所述硅基底进行刻蚀,以硅圆柱阵列。具体来说,以掩膜图案层作为硬掩模,用反应离子刻蚀法(RIE)刻蚀硅基底,形成硅圆柱阵列,不同硅基底上的圆柱101高度范围10μm-50μm。Step S112 : etching the silicon substrate to form an array of silicon cylinders. Specifically, using the mask pattern layer as a hard mask, the silicon substrate is etched by reactive ion etching (RIE) to form a silicon cylinder array, and the heights of the
步骤S113:去除所述掩膜图案层,以获得硅印模100。具体地,硅圆柱阵列101形成后,采用湿法工艺去除覆盖在硅圆柱阵列101上的全部介质膜,得到具有不同圆柱阵列的硅印模100,其中硅圆柱阵列101的圆柱的直径从远离硅基底本体的一端至靠近硅基底本体的一端的依次递增。作为优选实施例,圆柱的直径大小从远离硅基底本体的一端至靠近硅基底本体的一端的范围为0.5μm到5μm,且圆柱的外表面为凹弧面。Step S113 : removing the mask pattern layer to obtain the
步骤S12:在基底上形成压印层,并将所述硅印模100压印所述压印层,其中硅圆柱阵列101完全陷入所述压印层内。其中,压印层的材料可选用PMMA。Step S12 : forming an imprint layer on the substrate, and imprinting the imprint layer with the
步骤S13:固化所述压印层并进行脱模,其中所述压印层的正对硅圆柱阵列101的位置上形成凹槽阵列。Step S13 : curing the imprint layer and performing demolding, wherein a groove array is formed on the imprint layer facing the
步骤S14:在所述压印层上制作形成金属层,所述金属层覆盖所述凹槽阵列。Step S14 : forming a metal layer on the imprint layer, the metal layer covering the groove array.
具体来说,金属层的材料优选为镍。首先在脱模后的压印层表面上沉积一层镍薄膜,且镍薄膜覆盖凹槽阵列,接着以镍薄膜为种子层,采用电镀工艺在压印层表面形成镍金属层,且镍金属层填充凹槽阵列。Specifically, the material of the metal layer is preferably nickel. First, a nickel film is deposited on the surface of the embossed layer after demolding, and the nickel film covers the groove array, and then the nickel film is used as the seed layer to form a nickel metal layer on the surface of the embossed layer by electroplating process, and the nickel metal layer Fill the groove pattern.
步骤S15:去除所述压印层与所述基底,以获得网孔模板30,其中所述网孔模板30的与所述凹槽阵列正对的位置上形成凸柱阵列31。Step S15 : removing the embossing layer and the substrate to obtain a
具体地,如图3所示,凸柱阵列31的凸柱的半径大小从远离网孔模板本体的一端至靠近网孔模板本体的一端递增,且凸柱的侧面为凹弧面。Specifically, as shown in FIG. 3 , the radius of the convex columns of the
步骤S20:在衬底40上制作形成网孔材料层50。Step S20 : fabricating and forming a
具体地,如图4所示,衬底40采用透明衬底,例如石英玻璃,在衬底40上涂覆网孔材料形成网孔材料层,其中网孔材料可采用聚酰亚胺或环氧树脂。Specifically, as shown in FIG. 4 , the
步骤S30:将所述网孔模板30压印所述网孔材料层50,其中所述凸柱阵列31完全陷入所述网孔材料层50内,并固化所述网孔材料层50,如图5所示。Step S30 : embossing the
步骤S40:去除所述网孔模板30和所述衬底40,以获得振动膜片10,其中所述振动膜片10的与所述凸柱阵列31正对的位置形成网孔20,如图6所示。Step S40 : removing the
进一步地,制作方法还包括:清除所述网孔20内残留的压印胶残膜。Further, the manufacturing method further includes: removing the residual film of the embossing glue in the
具体来说,如图6和图7所示,振动膜片10具有相对设置的第一表面11和第二表面12,若干网孔20呈阵列排布且贯穿第一表面11和第二表面12,网孔20的半径大小沿着所述第一表面11至所述第二表面12的方向递减,且所述网孔20的内壁面为弧面。作为优选实施例,网孔20的内壁面为朝向第一表面11的凸弧面。Specifically, as shown in FIG. 6 and FIG. 7 , the vibrating
进一步地,作为优选实施例,所述网孔20的半径R与所述网孔20的高度H满足如下关系:Further, as a preferred embodiment, the radius R of the
(1)R=a-H,其中H表示网孔20内壁面与所述第一表面11之间的距离,a表示设计常数且a>1。(1) R=a −H , where H represents the distance between the inner wall surface of the
当然在其他实施方式中,所述网孔20的半径R与所述网孔20的高度H满足如下关系:Of course, in other embodiments, the radius R of the
(2)R=H-b,其中H表示网孔20内壁面与所述第一表面11之间的距离,b表示设计常数且b>1。(2) R=H −b , where H represents the distance between the inner wall surface of the
当网孔20的半径R与半径的高度H满足上述关系(1)或(2)时,该网孔20能有效地将高粘度的液体进行雾化,具体证明过程如下:When the radius R of the
毛细力压强公式(1):Capillary pressure formula (1):
其中表面张力σ和接触角θ,由液体的种类和振动片的材料表面的亲疏水特性决定,亦即表面张力越大,毛细力越大在接触角小于90度的情况下,接触角越大,则毛细力越小;在接触角大于90度情况,毛细力方向反向。其中,表面张力σ和接触角θ是和液体及网孔材料有关的量。半径R是和网孔结构设计有关的量,R越小,则毛细力Pcap越大;而R的变化量越大,则毛细力压强Pcap梯度越大,通过毛细力进行液体补充速度就越快。The surface tension σ and the contact angle θ are determined by the type of liquid and the hydrophilic and hydrophobic properties of the material surface of the vibrating piece, that is, the greater the surface tension, the greater the capillary force. When the contact angle is less than 90 degrees, the greater the contact angle , the smaller the capillary force; when the contact angle is greater than 90 degrees, the direction of the capillary force is reversed. where the surface tension σ and the contact angle θ are quantities related to the liquid and the mesh material. The radius R is a quantity related to the design of the mesh structure. The smaller R is, the greater the capillary force P cap is; and the greater the variation of R, the greater the gradient of the capillary force pressure P cap , and the faster the liquid replenishment through the capillary force. sooner.
进一步地,假设网孔20的半径R与网孔20的高度H满足如下指数函数关系:Further, it is assumed that the radius R of the
R=a-H (2)R=a -H (2)
为保证该指数函数单调递减,需要满足a>1,a为设计常数。In order to ensure that the exponential function is monotonically decreasing, a>1 needs to be satisfied, and a is a design constant.
将式(2)代入式(1)中,可得毛细力压强函数为:Substituting Equation (2) into Equation (1), the capillary pressure function can be obtained as:
根据牛顿第二定律,将网孔在高度方向细分为ΔH的小段,可得According to Newton's second law, the mesh is subdivided into small segments of ΔH in the height direction, we can get
F=ma1, (4)F=ma 1 , (4)
其中,a1为加速度,Δm为ΔH高度内的液体质量,ρ为密度,v为速度,t为时间。可见网孔内微流体的加速度a1与毛细力压强Pcap成正比。进一步地,网孔内微流体的加速度a1可表示为:Among them, a 1 is the acceleration, Δm is the liquid mass within the ΔH height, ρ is the density, v is the velocity, and t is the time. It can be seen that the acceleration a 1 of the microfluid in the mesh is proportional to the capillary pressure P cap . Further, the acceleration a 1 of the microfluid in the mesh can be expressed as:
根据式(7)可知,则网孔内的微流体加速度a1也按指数函数形式随网孔高度H增加而增加。为了进一步更加直观地看出微流体加速度和网孔高度的关系,假设A为含有加速度的函数,并假设设计常数a=2,利用计算机模拟可得出加速度函数A与网孔高度H的变化关系曲线,如图8所示。According to formula (7), it can be known that the microfluidic acceleration a 1 in the mesh also increases with the increase of the mesh height H in the form of an exponential function. In order to see the relationship between microfluidic acceleration and mesh height more intuitively, suppose A is a function containing acceleration, and assuming that the design constant a = 2, the curve of the change between the acceleration function A and the mesh height H can be obtained by computer simulation, as shown in Figure 8.
由于网孔内的受毛细力驱动的加速度在上述条件下随高度不断提升,将有利于克服随着孔径减小而增大的流阻;毛细力驱动的加速度增量变化越大,越有利于克服流阻,实现液体在网孔内的及时补充,以提升可喷射液体粘度。从而满足高频振动网孔片大量小液滴喷雾的需求。Since the acceleration driven by capillary force in the mesh hole continuously increases with the height under the above conditions, it will help to overcome the flow resistance which increases with the decrease of the hole diameter; the larger the incremental change of the acceleration driven by the capillary force, the more beneficial Overcome the flow resistance and realize the timely replenishment of the liquid in the mesh to increase the viscosity of the sprayable liquid. So as to meet the needs of a large number of small droplets sprayed by the high-frequency vibrating mesh sheet.
当进一步地,假设网孔20的半径R与网孔20的高度H满足如下幂函数关系:Further, it is assumed that the radius R of the
R=H-b (8)R=H -b (8)
为保证该指数函数单调递减,需要满足b>1,b为设计常数。In order to ensure that the exponential function is monotonically decreasing, it needs to satisfy b>1, where b is a design constant.
类似地,根据式(3)、(4)、(5)、(6)和(8)的计算可得,Similarly, according to the calculation of equations (3), (4), (5), (6) and (8), we can get,
根据式(9)可知,则网孔内的微流体加速度a1也按指数函数形式随网孔高度H增加而增加。假设b=2,利用计算机模拟可得出加速度函数A与网孔高度H的变化关系曲线,如图9所示。According to formula (9), it can be known that the microfluidic acceleration a 1 in the mesh also increases with the increase of the mesh height H in the form of an exponential function. Assumption b=2, the curve of the change relationship between the acceleration function A and the mesh height H can be obtained by computer simulation, as shown in FIG. 9 .
综上可知,当所述网孔20的半径R与所述网孔20的高度H满足关系(1)和关系(2)时,相应的用于高粘度液体雾化的网孔微结构均喷射出高粘度的液体。To sum up, when the radius R of the
利用上述制作方法制造的用于高粘度液体雾化的网孔微结构,可以实现从低粘度到高粘度液体的常温雾化,且雾化充分、雾化液滴体积小、流量大,网孔表面平整、坚固又易于清洗,同时该制作方法工艺稳定、易于重复。The mesh microstructure for high-viscosity liquid atomization manufactured by the above preparation method can realize normal temperature atomization from low-viscosity to high-viscosity liquids, and the atomization is sufficient, the volume of atomized droplets is small, the flow rate is large, and the mesh The surface is flat, strong and easy to clean, while the manufacturing method is stable and easy to repeat.
上面对本发明的具体实施方式进行了详细描述,虽然已表示和描述了一些实施例,但本领域技术人员应该理解,在不脱离由权利要求及其等同物限定其范围的本发明的原理和精神的情况下,可以对这些实施例进行修改和完善,这些修改和完善也应在本发明的保护范围内。The specific embodiments of the present invention have been described in detail above. Although some embodiments have been shown and described, those skilled in the art should understand that the principles and spirit of the present invention, which are defined in the scope of the claims and their equivalents, are not departed from. Under the circumstances, these embodiments can be modified and perfected, and these modifications and improvements should also fall within the protection scope of the present invention.
Claims (7)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201910875322.3A CN112517309B (en) | 2019-09-17 | 2019-09-17 | Mesh microstructure for high-viscosity liquid atomization and manufacturing method thereof |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201910875322.3A CN112517309B (en) | 2019-09-17 | 2019-09-17 | Mesh microstructure for high-viscosity liquid atomization and manufacturing method thereof |
Publications (2)
Publication Number | Publication Date |
---|---|
CN112517309A CN112517309A (en) | 2021-03-19 |
CN112517309B true CN112517309B (en) | 2022-04-22 |
Family
ID=74974573
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201910875322.3A Active CN112517309B (en) | 2019-09-17 | 2019-09-17 | Mesh microstructure for high-viscosity liquid atomization and manufacturing method thereof |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN112517309B (en) |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8828246B2 (en) * | 2010-02-18 | 2014-09-09 | Anpac Bio-Medical Science Co., Ltd. | Method of fabricating micro-devices |
CN102303843B (en) * | 2011-08-15 | 2014-07-16 | 中国科学技术大学 | Nano fluid channel and manufacturing method thereof |
KR101218486B1 (en) * | 2012-03-23 | 2013-01-21 | 한국과학기술원 | Polymer template, manufacturing method for the same, and microfluidic channel using the same and manufacturing method for the microfluidic channel |
CN103135342A (en) * | 2013-03-07 | 2013-06-05 | 中国科学院合肥物质科学研究院 | Method for manufacturing nanofluid channel of integrated scaleplate based on flexible template |
CN106595727B (en) * | 2016-11-30 | 2019-06-11 | 华中科技大学 | Photonic crystal nanofluidic sensor based on nano-replication molding and preparation method |
-
2019
- 2019-09-17 CN CN201910875322.3A patent/CN112517309B/en active Active
Also Published As
Publication number | Publication date |
---|---|
CN112517309A (en) | 2021-03-19 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN100565796C (en) | The manufacture method of semiconductor device and system | |
CN101573659A (en) | Method for expelling gas positioned between a substrate and a mold | |
US8835195B2 (en) | Corrugated membrane MEMS actuator fabrication method | |
CN104768868B (en) | Superoleophobic surface and the method for preparing it | |
CN100549735C (en) | The preparation method of plastic material film device and the device that obtains thus | |
KR100714256B1 (en) | Color filter forming method | |
KR100714255B1 (en) | Method of forming conductive pattern | |
KR101346063B1 (en) | Free-standing polymer membrane having through-hole and method of manufacturing the same | |
US20150131034A1 (en) | Apparatus and method for manufacturing micro lens array, and micro lens array manufactured using the same | |
CN103373071A (en) | Formation of a funnel-shaped nozzle | |
CN108089398A (en) | A kind of nanometer of through-hole array polymer template and preparation method thereof | |
CN112517309B (en) | Mesh microstructure for high-viscosity liquid atomization and manufacturing method thereof | |
Sharma et al. | Vibrating mesh atomizer for spin-spray deposition | |
CN103302939B (en) | Self-cleaning structure and manufacturing method thereof | |
JP5531463B2 (en) | Master plate used for manufacturing micro contact print stamps and manufacturing method thereof, micro contact printing stamp and manufacturing method thereof, and pattern forming method using micro contact printing stamp | |
KR101107474B1 (en) | Soft Mold and Pattern Method Using the Same | |
CN115428153B (en) | A lens array and a method for preparing the same | |
CN112517308B (en) | Vibrating screen type atomizer and manufacturing method thereof | |
JP2000229410A (en) | Water repellent structure, manufacturing method thereof, ink jet recording head and ink jet recording apparatus | |
KR20060135310A (en) | Fine pattern formation method using soft mold | |
JP2001212966A (en) | Hydrophilic structure and inkjet recording head | |
KR101547533B1 (en) | Method of a forming structure with fine patterns | |
US9955584B2 (en) | Stamp for printed circuit process and method of fabricating the same and printed circuit process | |
CN107431010B (en) | Substrate with mask and method for manufacturing substrate with concave-convex structure | |
JP2009028947A (en) | Microcontact printing plate and method of manufacturing electronic device |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
GR01 | Patent grant | ||
GR01 | Patent grant |