CN112514245A - Broadband millimeter wave front end integrated circuit - Google Patents

Broadband millimeter wave front end integrated circuit Download PDF

Info

Publication number
CN112514245A
CN112514245A CN201980039603.3A CN201980039603A CN112514245A CN 112514245 A CN112514245 A CN 112514245A CN 201980039603 A CN201980039603 A CN 201980039603A CN 112514245 A CN112514245 A CN 112514245A
Authority
CN
China
Prior art keywords
signal
ifiq
transceivers
loiq
generator
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201980039603.3A
Other languages
Chinese (zh)
Inventor
迟太运
王�华
托马斯·陈
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Suzhou Siweite Technology Co.,Ltd.
Original Assignee
Swift Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US16/005,472 external-priority patent/US10135478B2/en
Application filed by Swift Technology Co Ltd filed Critical Swift Technology Co Ltd
Publication of CN112514245A publication Critical patent/CN112514245A/en
Pending legal-status Critical Current

Links

Images

Classifications

    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04BTRANSMISSION
    • H04B1/00Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
    • H04B1/38Transceivers, i.e. devices in which transmitter and receiver form a structural unit and in which at least one part is used for functions of transmitting and receiving
    • H04B1/40Circuits
    • H04B1/44Transmit/receive switching
    • H04B1/48Transmit/receive switching in circuits for connecting transmitter and receiver to a common transmission path, e.g. by energy of transmitter
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03DDEMODULATION OR TRANSFERENCE OF MODULATION FROM ONE CARRIER TO ANOTHER
    • H03D7/00Transference of modulation from one carrier to another, e.g. frequency-changing
    • H03D7/16Multiple-frequency-changing
    • H03D7/165Multiple-frequency-changing at least two frequency changers being located in different paths, e.g. in two paths with carriers in quadrature
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03LAUTOMATIC CONTROL, STARTING, SYNCHRONISATION, OR STABILISATION OF GENERATORS OF ELECTRONIC OSCILLATIONS OR PULSES
    • H03L7/00Automatic control of frequency or phase; Synchronisation
    • H03L7/06Automatic control of frequency or phase; Synchronisation using a reference signal applied to a frequency- or phase-locked loop
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03LAUTOMATIC CONTROL, STARTING, SYNCHRONISATION, OR STABILISATION OF GENERATORS OF ELECTRONIC OSCILLATIONS OR PULSES
    • H03L7/00Automatic control of frequency or phase; Synchronisation
    • H03L7/06Automatic control of frequency or phase; Synchronisation using a reference signal applied to a frequency- or phase-locked loop
    • H03L7/08Details of the phase-locked loop
    • H03L7/099Details of the phase-locked loop concerning mainly the controlled oscillator of the loop
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04BTRANSMISSION
    • H04B1/00Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
    • H04B1/38Transceivers, i.e. devices in which transmitter and receiver form a structural unit and in which at least one part is used for functions of transmitting and receiving
    • H04B1/40Circuits
    • H04B1/401Circuits for selecting or indicating operating mode
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04BTRANSMISSION
    • H04B1/00Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
    • H04B1/38Transceivers, i.e. devices in which transmitter and receiver form a structural unit and in which at least one part is used for functions of transmitting and receiving
    • H04B1/40Circuits
    • H04B1/403Circuits using the same oscillator for generating both the transmitter frequency and the receiver local oscillator frequency

Abstract

According to one embodiment, a millimeter wave (mm-wave) front end integrated circuit includes an array of millimeter wave transceivers, wherein each millimeter wave transceiver transmits and receives coherent mm-wave signals having variable amplitudes and phase shifts. The mm-wave front-end IC chip further includes a broadband frequency synthesizer coupled to the mm-wave transceiver. A full baseband or wideband frequency synthesizer generates and provides Local Oscillator (LO) signals to the various mm-wave transceivers to enable the mm-wave transceivers to mix, modulate, and/or demodulate the mm-wave signals. The mm-wave wideband transceiver array and the wideband frequency synthesizer may be implemented in a single IC chip as a single mm-wave front-end IC chip or package.

Description

Broadband millimeter wave front end integrated circuit
Technical Field
Embodiments of the present invention generally relate to mobile devices. More particularly, embodiments of the present invention relate to millimeter wave (mm wave) front end modules for mobile devices.
Background
With the development of wireless communication technology, a multimode or multiband wireless system may be generally used. Such systems may divide different functions into different Integrated Circuit (IC) devices. For example, a wireless system may include a modem or baseband processor, a transceiver, control circuitry, receive circuitry, or transmit circuitry, among others. Such multiple IC devices are sometimes inconvenient and cost-inefficient.
Drawings
Embodiments of the invention are illustrated by way of example, and not by way of limitation, in the figures of the accompanying drawings in which like reference numerals refer to similar elements.
Fig. 1 is a block diagram illustrating an example of a wireless communication apparatus according to an embodiment of the present invention.
Fig. 2 is a block diagram illustrating an example of an RF front end integrated circuit according to one embodiment of the invention.
Fig. 3 is a schematic diagram illustrating an example of an RF front end integrated circuit according to one embodiment of the invention.
Fig. 4 is a schematic diagram illustrating an example of a transmitter according to an embodiment of the present invention.
Fig. 5 is a schematic diagram illustrating an example of a receiver according to an embodiment of the present invention.
Fig. 6 is a schematic diagram illustrating an example of an RF front end integrated circuit according to another embodiment of the invention.
Fig. 7 is a block diagram illustrating an example of an RF front end integrated circuit according to another embodiment of the invention.
Detailed Description
Various embodiments and aspects of the inventions will be described with reference to details discussed below, and the accompanying drawings will illustrate the various embodiments. The following description and drawings are illustrative of the invention and are not to be construed as limiting the invention. Numerous specific details are described to provide a thorough understanding of various embodiments of the invention. However, in certain instances, well-known or conventional details are not described in order to provide a concise discussion of embodiments of the present inventions.
Reference in the specification to "one embodiment" or "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the invention. The appearances of the phrase "in one embodiment" in various places in the specification are not necessarily all referring to the same embodiment.
In accordance with some embodiments, a millimeter wave (mm-wave) front end IC device includes one or more mm-wave transceiver arrays. Each mm-wave transceiver transmits and receives coherent mm-wave signals with variable amplitude and phase shift. The mm-wave front-end IC chip also includes a wideband (wideband) frequency synthesizer coupled to the mm-wave transceiver. A full baseband or wide band frequency synthesizer generates and provides a Local Oscillator (LO) signal to each mm-wave transceiver to enable the mm-wave transceiver to mix, modulate and/or demodulate the mm-wave signal. The mm-wave wideband transceiver array and the wideband frequency synthesizer may be implemented as a single mm-wave front-end IC chip or package within a single IC chip.
The wideband frequency synthesizer includes a phase-lock loop (PLL) circuit or block to generate an LO signal based on a clock reference signal, which may be provided by a local oscillator. Each mm-wave transceiver includes: a full-band or wide-band transmitter for transmitting mm-wave signals; and a full-band or wideband receiver for receiving mm-wave signals in a frequency band (e.g., approximately in the range of 24 to 43 gigahertz or GHz); and a transmit and receive (T/R) switch coupled to the transmitter and the receiver. The T/R switch is used to couple the mm-wave antenna to the transmitter or receiver at a given point in time.
According to an aspect of the invention, an RF front-end IC device includes a first transceiver to transmit and receive RF signals associated with a first RF channel according to a first amplitude and phase shift setting within a predetermined frequency band. The RF front-end IC device also includes a second transceiver to transmit and receive RF signals associated with a second RF channel according to a second amplitude and phase shift setting within the predetermined frequency band. The second amplitude and phase shift setting may be different from the first amplitude and phase shift setting. The RF front-end IC device also includes a frequency synthesizer coupled to the first transceiver and the second transceiver for frequency synchronization in a wide frequency spectrum. The frequency synthesizer generates LO signals to the first and second transceivers to enable the first and second transceivers to transmit and receive RF signals associated with the first and second RF channels, respectively. The first transceiver, the second transceiver, and the frequency synthesizer are embedded within a single IC chip.
According to one embodiment, RF signals associated with the first RF channel are to be transmitted and received via a first antenna configured to radiate and receive according to the first amplitude and phase shift setting. RF signals associated with the second RF channel are to be transmitted and received via a second antenna configured to radiate and receive according to the second amplitude and phase shift setting.
In one embodiment, the first transceiver and the second transceiver each comprise: a transmitter for transmitting a first RF signal to a first remote device; a receiver for receiving a second RF signal from a second remote device; and a switch coupled to the transmitter and the receiver. The switch is configured to couple the transmitter or the receiver to an antenna associated with the transceiver at a given point in time.
In one embodiment, the transmitter comprises: an in-phase and quadrature (IQ) generator (IFIQ generator) for generating an IFIQ signal based on an IF signal received from a modem or baseband processor. The transmitter further includes: a first LO IQ (LOIQ) generator to generate a LOIQ signal based on an LO signal received from the frequency synthesizer. The transmitter further includes: a first mixer coupled to the first IFIQ generator and the first LOIQ generator to generate the first RF signal based on the IFIQ signal and the LOIQ signal.
In one embodiment, each transceiver further comprises: a first IF amplifier coupled to the first IFIQ generator and the first mixer. The first IF amplifier is configured to amplify the IFIQ signal and provide the amplified IFIQ signal to the first mixer. Each transceiver further comprises: a first wideband (also referred to as an RF amplifier) coupled to the first mixer to amplify the first RF signal received from the first mixer.
In one embodiment, the first IF amplifier comprises: a second IF amplifier for receiving and amplifying an in-phase IF signal derived from the IFIQ signal. Mixing the in-phase IF signal with an in-phase LO signal derived from the LOIQ signal. The first IF amplifier further includes: a third IF amplifier for receiving and amplifying a quadrature IF signal derived from the IFIQ signal. Mixing the quadrature IF signal with a quadrature LO signal derived from the LOIQ signal.
In one embodiment, the receiver comprises: a second wideband/RF amplifier configured to receive the second RF signal; a second LOIQ generator for generating a LOIQ signal based on the LO signal received from the frequency synthesizer; and a second mixer coupled to the second wideband amplifier and the second LOIQ generator. The second mixer is configured to generate an IFIQ signal based on the amplified second RF signal and the LOIQ signal. The receiver further comprises: a fourth IF amplifier coupled to the second mixer to receive and amplify the IFIQ signal from the second mixer. The receiver further includes an IFIQ combiner coupled to the fourth IF amplifier to generate a combined IF signal based on the IFIQ signal.
In one embodiment, the fourth IF amplifier comprises: a fifth IF amplifier for receiving and amplifying an in-phase IF signal derived from said IFIQ signal; and a sixth IF amplifier for receiving and amplifying a quadrature IF signal derived from said IFIQ signal. The IFIQ combiner is configured to combine the in-phase IF signal and the quadrature IF signal to generate a combined IF signal.
According to another aspect of the invention, an RF front-end IC arrangement comprises: an array of transceivers, each of the transceivers corresponding to one of the RF channels. Each of the RF channels includes a phase shifter configured to transmit and receive RF signals within a predetermined frequency band according to a respective phase shift setting, including shifting or compensating a phase of the RF signals according to the respective phase shift setting. The RF front-end IC device also includes a frequency synthesizer coupled to each of the transceivers for frequency synchronization in a wide frequency spectrum. The frequency synthesizer generates an LO signal for each of the transceivers to enable each of the transceivers to transmit and receive the RF signal within its respective RF channel. The RF front-end IC device also includes an up-converter coupled to each of the transceivers and the frequency synthesizer. The upconverter is configured to upconvert a first Intermediate Frequency (IF) signal to a first RF signal to be transmitted by the transceiver based on an LO signal. The RF front-end IC device also includes a downconverter coupled to each of the transceivers and the frequency synthesizer. The downconverter is configured to downconvert a second RF signal received from the transceiver to a second IF signal based on the LO signal. The transceiver array, the frequency synthesizer, the up-converter and the down-converter are embedded within a single IC chip.
In one embodiment, the up-converter comprises: an IFIQ generator for receiving the first IF signal; a LOIQ generator for receiving the LO signal from the frequency synthesizer to generate a LOIQ signal based on the LO signal; and an upconversion mixer coupled to the IFIQ generator and the LOIQ generator. The up-conversion mixer is configured to generate the first RF signal based on a first IF signal and the LOIQ signal. In one embodiment, the up-converter further comprises: an IF amplifier coupled between the IFIQ generator and the up-conversion mixer to amplify the first IF signal. The upconverter further includes a power splitter coupled to the upconversion mixer to divide the first RF signal into a plurality of first RF sub-signals. Each first RF sub-signal is provided to one of the transceivers for transmission.
In one embodiment, the down converter includes: a LOIQ generator for receiving the LO signal from the frequency synthesizer to generate a LOIQ signal based on the LO signal; a down-conversion mixer coupled to the LOIQ generator. The down-conversion mixer is configured to generate an IFIQ signal based on the second RF signal and the LOIQ signal received from the transceiver. The downconverter further includes an IFIQ combiner that generates the second IF signal based on the IFIQ signal received from the downconversion mixer. In one embodiment, the down converter further comprises: a power combiner coupled between the down-conversion mixer and the transceiver. The power combiner is configured to combine second RF sub-signals received from the transceivers to generate the second RF signals, each second RF sub-signal corresponding to one of the transceivers. The down converter further includes: an IF amplifier coupled between an IFIQ combiner and the down-conversion mixer to amplify the IFIQ signal.
In one embodiment, each of the transceivers includes: a transmitter for transmitting an RF signal to a first remote device; a receiver for receiving an RF signal from a second remote device; and a switch configured to couple the transmitter or the receiver to one of a plurality of antennas at a given point in time, wherein each of the antennas corresponds to one of the transceivers.
According to another aspect of the invention, the RF front-end IC arrangement comprises: a frequency synthesizer having a PLL circuit and an LO buffer to generate an LO signal based on a clock signal; an IFIQ generator for receiving the first IF signal from the modem or the baseband processor to generate a first IFIQ signal; an IFIQ combiner for generating a second IF signal based on the second IFIQ signal. The second IF signal is to be processed by the modem or the baseband processor. The RF front-end IC device further comprises: a plurality of transceivers coupled to the frequency synthesizer. Each of the transceivers is associated with one of the RF channels configured to transmit and receive RF signals according to one of an amplitude and phase shift setting within a predetermined frequency band.
In one embodiment, each of the transceivers includes: a transmitter coupled to the frequency synthesizer to upconvert the first IFIQ signal to a first RF signal to be transmitted to a first remote device using the LO signal. Each transceiver further comprises: a receiver coupled to the frequency synthesizer to downconvert a second RF signal received from a second remote device to a second IFIQ signal using the LO signal. The plurality of transceivers, the frequency synthesizer, the IFIQ generator and the IFIQ combiner are embedded within a single IC chip.
In one embodiment, the transmitter comprises: a phase shifter for receiving an LO signal from the frequency synthesizer and shifting the LO signal according to a predetermined shift phase; a LOIQ generator for generating a LOIQ signal based on the phase-shifted LO signal; and an up-conversion mixer to generate the first RF signal based on a first Intermediate Frequency (IF) signal and the LOIQ signal received from a modem or a baseband processor.
In one embodiment, the receiver comprises: a phase shifter for receiving an LO signal from the frequency synthesizer and shifting the LO signal according to a predetermined shift phase; a LOIQ generator for generating a LOIQ signal based on the phase-shifted LO signal; and a down-conversion mixer to generate the second IFIQ signal based on the second RF signal and the LOIQ signal. In one embodiment, each of the transceivers further includes a switch coupled to the transmitter and the receiver. The switch is configured to couple the transmitter or the receiver to an antenna associated with a respective transceiver at a given point in time.
Fig. 1 is a block diagram illustrating an example of a wireless communication apparatus according to one embodiment of the present invention. Referring to fig. 1, a wireless communication device 100 (also referred to simply as a wireless device) includes a mm-wave front-end module 101 (also referred to simply as an RF front-end module) and a modem or baseband processor 102, and the like. The modem may include an IF to baseband frequency (IF/BF) down converter, a BF/IF up converter, and a baseband processor (e.g., digital processor or DSP). The wireless device 100 may be any type of wireless communication device, such as a mobile phone, laptop, tablet, network equipment device (e.g., internet of things or IOT device), and so forth. Alternatively, wireless device 100 may represent a base station or a cell tower, or the like.
In radio receiver circuits, an RF front end (such as a mm-wave RF front end, etc.) is a generic term for the antenna up to and including all circuits between mixer stages. The RF front-end consists of all components in a receiver that processes signals at the original input RF frequency before converting them to a lower intermediate frequency. In microwave and satellite receivers, the RF front-end is commonly referred to as a low-noise block (LNB) or low-noise down converter (LND) and is typically located at or near the antenna so that the signal from the antenna can be transmitted to the rest of the receiver at an intermediate frequency that is easier to process. The baseband processor is a device (chip or part of a chip) in the network interface that manages all radio functions (all functions that require the antenna).
In one embodiment, the RF front-end module 101 includes an array of RF transceivers (e.g., mm-wave RF transceivers). Each RF transceiver transmits and receives coherent RF signals (e.g., mm-wave signals) within a particular frequency band (e.g., a particular frequency range such as a non-overlapping frequency range) via one of a plurality of mm-wave antennas. In MM-wave technology, MM-waves occupy a spectrum ranging from 30GHz to 300 GHz. Front-end IC chip 101 also includes a full-band or wide-band frequency synthesizer coupled to the RF transceiver. The wideband frequency synthesizer generates and provides Local Oscillator (LO) signals to the various RF transceivers to enable the RF transceivers to mix, modulate, and/or demodulate RF signals over a wide frequency band (e.g., 24-43 GHz). The RF transceiver array and the wideband frequency synthesizer may be integrated within a single IC chip as a single RF front-end IC chip or package.
Note that for illustrative purposes only, a mm-wave front end module is used as an example of an RF front end module. Similarly, a mm-wave transceiver is used as an example of the RF transceiver. However, the techniques described throughout this application may also be applicable to other RF circuits in other frequency spectrums or bands.
Fig. 2 is a block diagram illustrating an example of an RF front end integrated circuit according to one embodiment of the invention. The RF front-end IC device 101 may be a mm wave front-end IC device. Referring to FIG. 2, the RF front end 101 includes a wide-band or full-band frequency synthesizer 200 coupled to an array of RF transceivers 211-213, etc. Each RF transceiver 211-213 is configured to transmit and receive coherent RF signals, such as mm-wave signals with variable amplitude and phase shift, via one of the mm-wave antennas 221-223. By providing appropriate amplitude and phase shift settings for each transceiver 221-223, the entire transceiver array can direct one or more beams in a desired direction (referred to as the broadcast direction, or radiation angle or radiation direction). In one embodiment, each transceiver 211-213 is configured to receive an LO signal from wideband frequency synthesizer 200. The LO signal is generated for a particular frequency band (e.g., 24-43 GHz band). The LO signals are used by the respective transceivers 221-223 for mixing, modulation, demodulation in order to transmit and receive mm-wave signals in the respective frequency bands.
Alternatively, each RF transceiver 221-223 may be associated with a different frequency band (such as non-overlapping or minimally overlapping frequency ranges, etc.). Each transceiver is configured to transmit and receive RF signals within a respective frequency band using a particular LO signal for the respective frequency band generated by frequency synthesizer 200.
Fig. 3 is a block diagram illustrating an example of an RF front end integrated circuit according to one embodiment of the invention. The RF front-end IC device 300 may represent the RF front-end IC device 101 of fig. 2. Referring to fig. 3, in one embodiment, RF front-end IC device 300 includes frequency synthesizer 200 and an array of RF transceivers 301A-301B (collectively transceivers 301). Although two RF transceivers 301A-301B are shown, more RF transceivers may be included. The frequency synthesizer 200 is configured to generate LO signals for the respective transceivers 301 to allow the respective transceivers to modulate RF signals onto and demodulate RF signals from carrier frequency signals to be transmitted to and received from remote devices. Each transceiver 301 is associated with an antenna, such as antennas 302A-302B (collectively antennas 302). The antenna 302 may be located at different locations of the mobile device that are capable of transmitting and receiving RF signals according to a particular broadcast direction or angle.
In this embodiment, the RF front-end IC device 300 includes a first transceiver 301A for transmitting and receiving RF signals associated with a first RF channel according to a first RF amplitude and phase shift setting within a predetermined frequency band. The RF front-end IC device 300 further comprises a second transceiver 301B for transmitting and receiving RF signals associated with a second RF channel according to a second RF amplitude and phase shift setting within a predetermined frequency band. The second RF amplitude and phase shift setting may be different from the first RF amplitude and phase shift setting. The RF front-end IC arrangement 300 further comprises a frequency synthesizer 200, the frequency synthesizer 200 being coupled to the first transceiver 301A and the second transceiver 301B for frequency synchronization in a wide frequency spectrum. The frequency synthesizer 200 generates LO signals to the first transceiver 301A and the second transceiver 301B to enable the first transceiver 301A and the second transceiver 301B to transmit and receive RF signals associated with the first RF channel and the second RF channel, respectively. First transceiver 301A, second transceiver 301B, and frequency synthesizer 200 are embedded within a single IC chip 300.
According to one embodiment, RF signals associated with a first RF channel are transmitted and received via a first antenna 302A configured to radiate and receive according to a first RF amplitude and phase shift setting, and RF signals associated with a second RF channel are transmitted and received via a second antenna 302B configured to radiate and receive according to a second RF amplitude and phase shift setting. Note that the antenna 302 may not be part of the RF front-end IC device 300.
In one embodiment, the first transceiver 301A and the second transceiver 301B each comprise: a transmitter (e.g., transmitters 303A-303B, collectively transmitters 303) for transmitting a first RF signal to a first remote device; a receiver (e.g., receivers 304A-304B, collectively referred to as receivers 304) for receiving a second RF signal from a second remote device; and switches (e.g., switches 306A-306B, collectively referred to as switches 306) coupled to the transmitter and receiver. The switch is configured to couple the transmitter or receiver to an antenna associated with the transceiver at a given point in time. That is, only one of the transmitter or receiver may be coupled to a respective antenna at any given point in time.
In one embodiment, each transmitter 303 includes a first IFIQ generator (such as IFIQ generators 311A-311B, etc.) to generate an IFIQ signal based on an IF signal received from a modem or baseband processor. Each transmitter also includes a first LOIQ generator (e.g., LOIQ generators 314A-314B) to generate a LOIQ signal based on the LO signal received from frequency synthesizer 200. Each transmitter also includes a first mixer (e.g., mixers 313A-313B, collectively upconverting mixers 313) coupled to the first IFIQ generator and the first LOIQ generator to generate a first RF signal based on the IFIQ signal and the LOIQ signal.
In one embodiment, each transceiver 301 further includes a first IF amplifier (e.g., IF amplifiers 312A-312B, collectively IF amplifiers or amplifiers 312) coupled to the first IFIQ generator and the first mixer. The first IF amplifier is configured to amplify the IFIQ signal and provide the amplified IFIQ signal to the first mixer. Each transceiver 301 also includes a first wideband amplifier (e.g., wideband or RF amplifiers 315A-315B, collectively wideband or RF amplifiers or amplifiers 315) coupled to the first mixer to amplify the first RF signal received from the first mixer.
In one embodiment, each receiver 304 includes a second wideband amplifier (e.g., RF amplifiers 321A-321B, collectively RF amplifiers or amplifiers 321) configured to receive a second RF signal. Each receiver also includes a second LOIQ generator (e.g., LOIQ generators 323A-323B, collectively referred to as LOIQ generators 323) to generate LOIQ signals based on the LO signals received from frequency synthesizer 200. Each receiver also includes a second mixer (e.g., mixers 322A-322B, collectively referred to as down-conversion mixers 322) coupled to the second wideband amplifier and the second LOIQ generator. The second mixer is configured to generate an IFIQ signal based on the amplified second RF signal and the LOIQ signal. Each receiver also includes a fourth IF amplifier (e.g., IF amplifiers 324A-324B, collectively IF amplifiers or amplifiers 324) coupled to the second mixer to receive and amplify the IFIQ signals from the second mixer. Each receiver also includes an IFIQ combiner (e.g., IFIQ combiners 325A-325B, collectively referred to as IFIQ combiner 325) coupled to the fourth IF amplifier to generate a combined IF signal based on the IFIQ signal.
In one embodiment, frequency synthesizer 200 includes: a phase-locked loop (PLL) circuit 231 to generate an LO signal associated with a predetermined frequency band based on a clock reference signal; and LO buffering means 232 coupled to the PLL circuitry to buffer and provide first and second LO signals derived from the LO signal to the first and second transceivers, respectively.
A PLL is a control system that generates an output signal whose phase is related to the phase of an input signal. Although there are several different types, it is initially easy to consider it as an electronic circuit consisting of a variable frequency oscillator and a phase detector. The oscillator generates a periodic signal and the phase detector compares the phase of this signal with the phase of the incoming periodic signal, adjusting the oscillator to maintain phase matching. Bringing the output signal back to the input signal for comparison is referred to as a feedback loop, since the output is "fed back" to the input forming a loop. Keeping the input and output phases in the locking step also means keeping the input and output frequencies the same. Thus, in addition to the synchronization signal, the phase locked loop may track the input frequency, or it may generate a frequency that is a multiple of the input frequency. These properties are used for computer clock synchronization, demodulation, and frequency synthesis. Phase locked loops are widely used in radio, telecommunications, computer and other electronic applications. They can be used to demodulate signals, recover signals from noisy communication channels, generate stable frequencies at multiples of the input frequency (frequency synthesis), or distribute precisely timed clock pulses in digital logic circuits such as microprocessors and the like.
Fig. 4 is a schematic diagram illustrating an example of a transmitter according to an embodiment. Transmitter 400 may represent any of the transmitters in any of the transceivers described above, such as transmitter 303 of fig. 3. Referring to fig. 4, transmitter 400 includes an IFIQ generator 411, an IF amplifier 412 having an IF amplifier 412A and an IF amplifier 412B, a mixer 413, a LOIQ generator 414, an RF amplifier 415, and a phase rotator or phase shifter 420.
In one embodiment, the IF amplifier 412 (including the second IF amplifier 412A and the third IF amplifier 412B) may represent the IF amplifier 312. The IFIQ generator 411 is configured to generate an in-phase (also referred to as I-path) IF signal and a quadrature (also referred to as Q-path) IF signal. The I-path IF signal and the Q-path IF signal are then amplified by respective IF amplifiers, such as IF amplifiers 412A-412B. In one embodiment, LOIQ generator 414 is configured to generate an I-path LO signal and a Q-path LO signal.
The I-path LO signal and the Q-path LO signal may be shifted in phase by phase rotator 420. Phase rotator 420 may include a first phase rotator to phase shift the I-path LO signal and a second phase rotator to phase shift the Q-path LO signal. In one embodiment, the I-path IF signal and the Q-path IF signal are mixed with the I-path LO signal and the Q-path LO signal, respectively, and upconverted from IF to RF by an upconverter mixer 413 to generate an RF signal. The RF signal may then be amplified by an RF amplifier 415 for transmission to a remote device via an associated antenna.
Fig. 5 is a schematic diagram illustrating an example of a receiver according to one embodiment. Receiver 500 may represent any receiver in any transceiver as described above, such as receiver 304 of fig. 3. Referring to fig. 5, in one embodiment, receiver 500 includes a phase rotator or phase shifter 520, an RF amplifier 521, a down-conversion mixer 522, a LOIQ generator 523, an IF amplifier 524 having an IF amplifier 424A and an IF amplifier 424B, and an IFIQ combiner 525.
In one embodiment, LOIQ generator 523 generates or separates an LO signal received from a frequency synthesizer (e.g., frequency synthesizer 200) into an I-path LO signal and a Q-path LO signal. The I-path LO signal and the Q-path LO signal may be shifted or rotated in phase by a phase rotator or phase shifter 520. Phase rotator 520 may include a first phase rotator to offset the I path LO signal and a second phase rotator to offset the Q path LO signal. The RF signal received from the antenna may be amplified by RF amplifier 521 and mixed with the offset I-path LO signal and the offset Q-path LO signal and downconverted from RF to IF by downconversion mixer 522 to generate an I-path IF signal and a Q-path IF signal. The I-path IF signal and the Q-path IF signal are then amplified by IF amplifiers 524A to 524B, respectively. The amplified I and Q path IF signals are then combined by an IFIQ combiner 525 to generate an IF signal to be processed by a modem or baseband processor, where the IF signal includes both in-phase and quadrature components.
Referring back to fig. 3, in this embodiment, each transceiver 301 is configured to transmit and receive RF signals at the same frequency or within the same frequency band. However, each transceiver 301 is configured to transmit and receive RF signals at different amplitude and phase shift settings. Each antenna 302 is connected to an RF transceiver to transmit and receive RF signals in a predetermined broadcast direction.
In the present embodiment, each transceiver 301 includes its own IFIQ generator/combiner, up/down conversion mixer, and LOIQ generator. In particular, each transmitter of each transceiver includes its own IFIQ generator, up-conversion mixer and LOIQ generator. Each receiver of each transceiver includes its own IFIQ combiner, down conversion mixer and LOIQ generator. The IF signal stream, down-converted and processed by the receiver, is then processed by a modem or baseband processor, for example, in the digital domain. The IF signal of different amplitude and phase may be further down-converted to a BF signal, which is then processed by a digital processor by combining the BF signal with amplitude and phase compensation to increase the strength or amplitude of the BF signal. Alternatively, amplitude and phase compensation may be performed at the IF stage before the IF signal is downconverted to a BF signal.
Fig. 6 is a schematic diagram illustrating an example of an RF front-end IC device according to another embodiment. The RF front-end IC device 600 may represent the RF front-end IC device 101 as described above. In one embodiment, RF front-end IC device 600 includes an array of transceivers 301, each transceiver 301 corresponding to one of the RF channels. Each RF transceiver 301 includes a phase shifter configured to transmit and receive RF signals according to a respective transmission direction within a predetermined frequency band. The RF front-end IC arrangement further comprises a frequency synthesizer 200 coupled to the respective transceivers 301 for frequency synchronization in a wide frequency spectrum. Frequency synthesizer 200 generates LO signals for each transceiver 301 to enable each transceiver 301 to transmit and receive RF signals within its respective RF channel.
RF front-end IC arrangement 600 also includes an up-converter 601 coupled to each of transceivers 301 and frequency synthesizer 200. Upconverter 601 is configured to upconvert the first IF signal to a first RF signal to be transmitted by transceiver 301 based on the LO signal. RF front-end IC arrangement 600 also includes a downconverter 602 coupled to each of transceivers 301 and frequency synthesizer 200. The downconverter 602 is configured to downconvert a second RF signal received from the transceiver 301 to a second IF signal based on the LO signal. The array of transceivers 301, frequency synthesizer 200, up-converter 601 and down-converter 602 are embedded in a single IC chip.
In one embodiment, the up-converter 601 includes: an IFIQ generator 311 for receiving the first IF signal; a LOIQ generator 314 to receive the LO signal from the frequency synthesizer 200 to generate a LOIQ signal based on the LO signal; and an up-conversion mixer 313 coupled to the IFIQ generator 311 and the LOIQ generator 314. The up-conversion mixer 313 is configured to generate a first RF signal based on the first IF signal and the LOIQ signal. In one embodiment, the up-converter 601 further comprises an IF amplifier 312 coupled between the IFIQ generator 311 and the up-conversion mixer 313 to amplify the first IF signal. The up-converter 601 further comprises a power splitter 603 coupled to the up-conversion mixer 313 to split the first RF signal into a plurality of first RF sub-signals, wherein each first RF sub-signal is provided to one of the transceivers 301 for transmission.
In one embodiment, the down converter 602 includes: a LOIQ generator 323 to receive the LO signal from the frequency synthesizer 200 to generate a LOIQ signal based on the LO signal; and a down-conversion mixer 322 coupled to the LOIQ generator 323. The down-conversion mixer 322 is configured to generate an IFIQ signal based on the second RF signal and the LOIQ signal received from the transceiver 301. Downconverter 602 also includes an IFIQ combiner 325 to generate a second IF signal based on the IFIQ signal received from the downconversion mixer 323. In one embodiment, the downconverter 602 further comprises a power combiner 604 coupled between the downconversion mixer 322 and the transceiver 301. Power combiner 604 is configured to combine the second RF sub-signals received from transceivers 301 to generate second RF signals, each second RF sub-signal corresponding to one of transceivers 301. Downconverter 602 further includes an IF amplifier 324 coupled between IFIQ combiner 325 and downconversion mixer 322 to amplify the IFIQ signal.
In one embodiment, each of the transceivers 301 includes: a transmitter (e.g., transmitter 303) for transmitting an RF signal to a first remote device; a receiver (e.g., receiver 304) for receiving an RF signal from a second remote device; and a switch (e.g., switch 306) configured to couple either the transmitter or the receiver to one of the antennas 302 at a given point in time. Each antenna corresponds to one of the transceivers 301.
According to one embodiment, RF front-end IC arrangement 600 includes a wideband frequency synthesizer 200 coupled to an array of transceivers 301A-301B, similar to RF front-end IC arrangement 300 of fig. 3. Each transceiver 301 includes a transmitter (e.g., transmitter 303) and a receiver (e.g., receiver 304). However, in the present embodiment, the IFIQ generator/synthesizer, the up/down conversion mixer and the LOIQ generator are removed from the transmitter 303 or the receiver 304 of the transceiver 301. In one embodiment, all transceivers 301 use and share an upconverter 601 and a downconverter 602. The up-converter 601 includes an IFIQ generator, an up-conversion mixer, and a LOIQ generator, which are the same or similar in function and/or operation as described above. The downconverter 602 includes a LOIQ generator, a downconversion mixer, and an IFIQ combiner, which may be the same or similar in function and/or operation to those described above.
On the transmit path, in one embodiment, the up-converter 601 includes the IFIQ generator 311, the IF amplifier 312, the up-conversion mixer 313, and the LOIQ generator 314 as described above. In addition, the up-converter 601 further comprises a power divider 603, in this example an N-way power divider. The power splitter 603 is configured to receive the RF signal from the mixer 313 and split the RF signal into a plurality of RF signals, referred to as RF sub-signals, having a lower power (e.g., 1/N of the power of the original signal received from the mixer 313, where N represents the number of transmitters 313). The RF sub-signal is then fed to the transmitter 303 for processing.
According to one embodiment, each transmitter 303 includes a phase shifter (e.g., phase shifters 611A-611B, collectively phase shifters 611). Similar to phase rotators 420 and 520 of FIGS. 4-5, the phase shifters are configured to shift signals, such as generated RF beams, in a desired direction. In addition, each transmitter 303 may include a variable gain amplifier (e.g., variable gain amplifiers 612A-612B, collectively referred to as variable gain amplifiers 612). The variable gain amplifier 612 is configured to compensate for amplitude variations due to the phase shift operation of the phase shifter 611. In one embodiment, in response to a particular offset phase, the variable gain amplifier 612 is configured to look up in a look-up table (not shown) based on the offset phase to obtain a gain value, and adjust the gain of the variable gain amplifier 612 for amplitude compensation.
On the receive path, down-converter 602, in one embodiment, includes down-conversion mixer 322, LOIQ generator 323, IF amplifier 324, and IFIQ combiner 325. The functions and operations of down-conversion mixer 322, LOIQ generator 323, IF amplifier 324, and IFIQ combiner 325 are the same or similar to those described above. In addition, the down-converter 602 includes a power combiner 604. In the present embodiment, the power combiner 604 is configured to combine the RF signals from all of the receivers 304, for example, by adding the power of the RF signals together in total to increase the signal strength.
According to one embodiment, each receiver 304 includes a phase shifter (e.g., phase shifters 613A-613B, collectively phase shifters 613). Phase shifter 613 functions or operates the same or similar to phase shifter 611. Each receiver 304 may also include a variable gain amplifier (e.g., variable gain amplifiers 614A-614B, collectively referred to as variable gain amplifiers 614). The function or operation of the variable gain amplifier 614 is the same as or similar to the variable gain amplifier 612.
In this embodiment, since the functions of the up-converter 601 and down-converter 602 have been removed from the transceiver 301 and shared by all transceivers 301, the physical size and DC power consumption of the RF front-end IC arrangement can be reduced compared to the structure shown in fig. 3. However, the look-up operation by the variable gain amplifier 612 may introduce delays, which may affect the beam switching performance of the RF front-end IC device depending on the particular situation. Furthermore, the structure shown in fig. 3 is capable of transmitting or receiving multiple beams simultaneously in the digital domain (multiple input multiple output (MIMO) operation), whereas the structure shown in fig. 6 is capable of transmitting or receiving only one beam at a given time.
Fig. 7 is a schematic diagram illustrating an example of an RF front-end IC device according to another embodiment. The RF front-end IC device 700 may represent the RF front-end IC device 101. According to one embodiment, the RF front-end IC arrangement 700 includes a frequency synthesizer 200 having a PLL circuit and an LO buffer to generate an LO signal based on a clock signal; an IFIQ generator 311 for receiving the first IF signal from the modem or the baseband processor to generate a first IFIQ signal; and an IFIQ combiner 325 to generate a second IF signal based on the second IFIQ signal, the second IF signal processed by the modem or the baseband processor. The RF front-end IC arrangement 700 further comprises a plurality of transceivers 301 coupled to the frequency synthesizer 200. Each transceiver 301 is associated with one of the RF channels configured to transmit and receive RF signals according to one of an amplitude and phase shift setting within a predetermined frequency band (e.g., 24-43 GHz).
In one embodiment, each of the transceivers 301 includes: a transmitter (e.g., transmitter 303) coupled to frequency synthesizer 200 to upconvert the first IFIQ signal to a first RF signal to be transmitted to the first remote device using the LO signal; and a receiver (e.g., receiver 304) coupled to the frequency synthesizer 200 to downconvert a second RF signal received from a second remote device to a second IFIQ signal using the LO signal. Transceiver 301, frequency synthesizer 200, IFIQ generator 311, and IFIQ combiner 325 may be embedded in a single IC chip.
In one embodiment, the transmitter 303 includes: a phase shifter 611 for receiving the LO signal from the frequency synthesizer 200 and shifting the LO signal according to a predetermined shift phase; a LOIQ generator 314 for generating a LOIQ signal based on the phase-shifted LO signal; and an up-conversion mixer 313 for generating a first RF signal based on a first Intermediate Frequency (IF) signal and a LOIQ signal received from the modem or the baseband processor.
In one embodiment, the receiver 304 includes: a phase shifter 613 for receiving the LO signal from the frequency synthesizer 200 and shifting the LO signal according to a predetermined shift phase; a LOIQ generator 323 for generating an LOIQ signal based on the phase-shifted LO signal; and a down-conversion mixer 322 for generating a second IFIQ signal based on the second RF signal and the LOIQ signal.
In this embodiment, because the conversion gain of mixers 313 and 322 is generally less affected by the amplitude of the LO signal as long as the LO signal is sufficiently large, the gain variation of phase shifters 611 and 613 may not affect the conversion gain of mixers 313 and 322. Thus, variable gain amplifiers 612 and 614 may be optional. On the other hand, however, since the transmitter 303 and the receiver 304 each include a mixer, power consumption of the respective transmitter and receiver may be higher as compared with the structure in fig. 6.
Thus, depending on the specific application and/or IC layout constraints, different embodiments as shown in FIGS. 3 and 6-7 may be utilized. The RF front-end IC device 300 as shown in fig. 3 may have the best flexibility among all devices. It also supports multiple beams simultaneously by processing the IF signals of the various transceiver channels in the digital domain. However, the RF front-end IC device 300 may require the largest footprint or size and DC power consumption. The RF front-end IC device 600 as shown in fig. 6 may have a minimum footprint or size of a chip and DC power consumption. However, when forming a beam in a particular direction, 2-dimensional calibration of amplitude and phase shift settings may be required, which may result in high delays during beam switching. The RF front-end IC device 700 as shown in fig. 7 is between the RF front-end IC device 300 and the RF front-end IC device 600 in terms of DC power consumption and size of the IC chip.
In the foregoing specification, embodiments of the invention have been described with reference to specific exemplary embodiments thereof. It will be evident that various modifications may be made thereto without departing from the broader spirit and scope of the invention as set forth in the following claims. The specification and drawings are, accordingly, to be regarded in an illustrative sense rather than a restrictive sense.

Claims (20)

1. A radio frequency front end integrated circuit (RF) device, an RF front end IC device, comprising:
a first transceiver for transmitting and receiving RF signals associated with a first RF channel according to a first amplitude and phase shift setting within a predetermined frequency band;
a second transceiver to transmit and receive RF signals associated with a second RF channel within the predetermined frequency band according to a second amplitude and phase shift setting, wherein the second amplitude and phase shift setting is different from the first amplitude and phase shift setting; and
a frequency synthesizer coupled to the first and second transceivers for frequency synchronization in a wide frequency spectrum, wherein the frequency synthesizer generates LO signals to the first and second transceivers to enable the first and second transceivers to transmit and receive RF signals associated with the first and second RF channels, respectively, wherein LO represents a local oscillator, an
Wherein the first transceiver, the second transceiver, and the frequency synthesizer are embedded within a single IC chip.
2. The RF front-end IC apparatus of claim 1, wherein RF signals associated with the first RF channel are to be transmitted and received via a first antenna configured to radiate and receive according to the first amplitude and phase shift setting, and wherein RF signals associated with the second RF channel are to be transmitted and received via a second antenna configured to radiate and receive according to the second amplitude and phase shift setting.
3. The RF front-end IC device of claim 1, wherein the first transceiver and the second transceiver each comprise:
a transmitter for transmitting a first RF signal to a first remote device;
a receiver for receiving a second RF signal from a second remote device; and
a switch coupled to the transmitter and the receiver, wherein the switch is configured to couple the transmitter or the receiver to an antenna associated with a respective transceiver at a given point in time.
4. The RF front-end IC device of claim 3, wherein the transmitter comprises:
a first intermediate frequency in-phase and quadrature generator, i.e., a first IFIQ generator, for generating an IFIQ signal based on an IF signal received from a modem or a baseband processor, wherein IF represents an intermediate frequency and IQ represents in-phase and quadrature;
a first LO IQ generator, i.e., a first LOIQ generator, for generating an LOIQ signal based on an LO signal received from the frequency synthesizer; and
a first mixer coupled to the first IFIQ generator and the first LOIQ generator to generate the first RF signal based on the IFIQ signal and the LOIQ signal.
5. The RF front-end IC device of claim 4, wherein the first transceiver and the second transceiver each further comprise:
a first IF amplifier coupled to the first IFIQ generator and the first mixer, wherein the first IF amplifier is configured to amplify the IFIQ signal and provide the amplified IFIQ signal to the first mixer; and
a first wideband amplifier coupled to the first mixer to amplify the first RF signal received from the first mixer.
6. The RF front-end IC device of claim 5, wherein the first IF amplifier comprises:
a second IF amplifier for receiving and amplifying an in-phase IF signal derived from the IFIQ signal, wherein the in-phase IF signal is mixed with an in-phase LO signal derived from the LOIQ signal; and
a third IF amplifier for receiving and amplifying a quadrature IF signal derived from the IFIQ signal, wherein the quadrature IF signal is mixed with a quadrature LO signal derived from the LOIQ signal.
7. The RF front-end IC device of claim 3, wherein the receiver comprises:
a second wideband amplifier configured to receive the second RF signal;
a second LOIQ generator for generating a LOIQ signal based on the LO signal received from the frequency synthesizer; and
a second mixer coupled to the second wideband amplifier and the second LOIQ generator, wherein the second mixer is configured to generate an IFIQ signal based on the amplified second RF signal and the LOIQ signal.
8. The RF front-end IC device of claim 7, wherein the receiver further comprises:
a fourth IF amplifier coupled to the second mixer to receive and amplify the IFIQ signal from the second mixer; and
an IFIQ combiner coupled to the fourth IF amplifier to generate a combined IF signal based on the IFIQ signal.
9. The RF front-end IC arrangement of claim 8, wherein the fourth IF amplifier comprises:
a fifth IF amplifier for receiving and amplifying an in-phase IF signal derived from said IFIQ signal; and
a sixth IF amplifier to receive and amplify a quadrature IF signal derived from the IFIQ signal, wherein the IFIQ combiner is configured to combine the in-phase IF signal and the quadrature IF signal to generate the combined IF signal.
10. The RF front-end IC arrangement of claim 1, wherein the frequency synthesizer comprises:
a phase-locked loop circuit, i.e., a PLL circuit, for generating an LO signal associated with the predetermined frequency band based on a clock reference signal; and
LO buffering means coupled to the PLL circuit to buffer first and second LO signals derived from the LO signal and to provide the first and second LO signals to the first and second transceivers, respectively.
11. A radio frequency front end integrated circuit (RF) device, an RF front end IC device, comprising:
an array of transceivers, each of the transceivers corresponding to one of a plurality of RF channels, wherein each of the RF channels includes a phase shifter configured to transmit and receive RF signals within a predetermined frequency band according to a respective phase shift setting, including shifting or compensating a phase of the RF signals according to the respective phase shift setting;
a frequency synthesizer coupled to each of the transceivers for frequency synchronization in a wide frequency spectrum, wherein the frequency synthesizer generates an LO signal for each of the transceivers to enable each of the transceivers to transmit and receive the RF signal within its respective RF channel, wherein LO represents a local oscillator;
an upconverter coupled to each of the transceivers and the frequency synthesizer, wherein the upconverter is configured to upconvert a first IF signal, wherein IF represents an intermediate frequency, to a first RF signal to be transmitted by the transceivers based on an LO signal; and
a downconverter coupled to each of the transceivers and the frequency synthesizer, wherein the downconverter is configured to downconvert second RF signals received from the transceivers to second IF signals based on the LO signal,
wherein the array of transceivers, the frequency synthesizer, the upconverter and the downconverter are embedded within a single IC chip.
12. The RF front-end IC arrangement of claim 11, wherein the up-converter comprises:
an IF in-phase and quadrature generator, i.e. an IFIQ generator, for generating an IFIQ signal based on the first IF signal, wherein IQ represents in-phase and quadrature;
a LOIQ generator for receiving the LO signal from the frequency synthesizer to generate a LOIQ signal based on the LO signal; and
an upconversion mixer coupled to the IFIQ generator and the LOIQ generator, wherein the upconversion mixer is configured to generate the first RF signal based on the IFIQ signal and the LOIQ signal.
13. The RF front-end IC arrangement of claim 12, wherein the up-converter further comprises:
an IF amplifier coupled between the IFIQ generator and the up-conversion mixer to amplify the first IF signal; and
a power splitter coupled to the up-conversion mixer to split the first RF signal into a plurality of first RF sub-signals, wherein each first RF sub-signal is provided to one of the transceivers for transmission.
14. The RF front-end IC arrangement of claim 11, wherein the downconverter comprises:
a LOIQ generator for receiving the LO signal from the frequency synthesizer to generate a LOIQ signal based on the LO signal;
a down-conversion mixer coupled to the LOIQ generator, wherein the down-conversion mixer is configured to generate an IFIQ signal based on the LOIQ signal and the second RF signal received from the transceiver; and
an IFIQ combiner to generate the second IF signal based on the IFIQ signal received from the down-conversion mixer.
15. The RF front-end IC arrangement of claim 14, wherein the downconverter further comprises:
a power combiner coupled between the down-conversion mixer and the transceivers, wherein the power combiner is configured to combine a plurality of second RF sub-signals received from the transceivers to generate the second RF signals, each second RF sub-signal corresponding to one of the transceivers; and
an IF amplifier coupled between the IFIQ combiner and the down-conversion mixer to amplify the IFIQ signal.
16. The RF front-end IC device of claim 11, wherein each of the transceivers comprises:
a transmitter for transmitting an RF signal to a first remote device;
a receiver for receiving an RF signal from a second remote device; and
a switch configured to couple the transmitter or the receiver to one of a plurality of antennas at a given point in time, wherein each of the antennas corresponds to one of the transceivers.
17. A radio frequency front end integrated circuit (RF) device, an RF front end IC device, comprising:
a frequency synthesizer having a PLL and an LO buffer to generate an LO signal based on a clock signal, wherein the PLL represents a phase-locked loop and the LO represents a local oscillator;
an IF in-phase and quadrature generator, i.e., an IFIQ generator, for receiving a first IF signal from a modem or baseband processor to generate a first IFIQ signal, wherein IQ represents in-phase and quadrature;
an IFIQ combiner to generate a second IF signal based on a second IFIQ signal to be processed by the modem or baseband processor; and
a plurality of transceivers coupled to the frequency synthesizer, wherein each of the transceivers is associated with one of a plurality of RF channels configured to transmit and receive RF signals according to one of a plurality of amplitude and phase shift settings within a predetermined frequency band, wherein each of the transceivers comprises:
a transmitter coupled to the frequency synthesizer to upconvert the first IFIQ signal to a first RF signal to be transmitted to a first remote device using the LO signal, an
A receiver coupled to the frequency synthesizer to downconvert a second RF signal received from a second remote device to the second IFIQ signal using the LO signal,
wherein the plurality of transceivers, the frequency synthesizer, the IFIQ generator, and the IFIQ combiner are embedded within a single IC chip.
18. The RF front-end IC device of claim 17, wherein the transmitter comprises:
a phase shifter to receive the LO signal from the frequency synthesizer and to shift the LO signal according to a predetermined shift phase;
an LO inphase and quadrature generator, i.e., an LOIQ generator, for generating an LOIQ signal based on the phase-shifted LO signal, wherein IQ represents inphase and quadrature; and
an up-conversion mixer to generate the first RF signal based on a first IF signal and the LOIQ signal received from a modem or a baseband processor, wherein IF represents an intermediate frequency.
19. The RF front-end IC device of claim 17, wherein the receiver comprises:
a phase shifter to receive the LO signal from the frequency synthesizer and to shift the LO signal according to a predetermined shift phase;
an LO inphase and quadrature generator, i.e., an LOIQ generator, for generating an LOIQ signal based on the phase-shifted LO signal, wherein IQ represents inphase and quadrature; and
a down-conversion mixer to generate the second IFIQ signal based on the second RF signal and the LOIQ signal.
20. The RF front-end IC device of claim 17, wherein each of the transceivers comprises a switch coupled to the transmitter and the receiver, wherein the switch is configured to couple the transmitter or the receiver to an antenna associated with the respective transceiver at a given point in time.
CN201980039603.3A 2018-06-11 2019-05-30 Broadband millimeter wave front end integrated circuit Pending CN112514245A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US16/005,472 2018-06-11
US16/005,472 US10135478B2 (en) 2017-04-10 2018-06-11 Wideband millimeter-wave frontend integrated circuit
PCT/US2019/034739 WO2019240961A1 (en) 2018-06-11 2019-05-30 Wideband millimeter-wave frontend integrated circuit

Publications (1)

Publication Number Publication Date
CN112514245A true CN112514245A (en) 2021-03-16

Family

ID=68843500

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201980039603.3A Pending CN112514245A (en) 2018-06-11 2019-05-30 Broadband millimeter wave front end integrated circuit

Country Status (5)

Country Link
JP (1) JP7187583B2 (en)
KR (1) KR102444887B1 (en)
CN (1) CN112514245A (en)
CA (1) CA3103569C (en)
WO (1) WO2019240961A1 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112689961A (en) * 2020-03-20 2021-04-20 华为技术有限公司 Receiving device, transmitting device and signal processing method
US11601156B2 (en) * 2020-07-06 2023-03-07 Mediatek Inc. Apparatus and methods for improved transmit power
WO2022173470A1 (en) * 2021-02-11 2022-08-18 Georgia Tech Research Corporation Mimo with scalable cascadable autonomous spatial filters for full-fov multi-blocker/signal management

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030138034A1 (en) * 2002-01-18 2003-07-24 Zhongming Shi Direct conversion RF transceiver with automatic frequency control
JP2004317524A (en) * 2004-07-30 2004-11-11 Fujitsu Ltd Radar system
US7181205B1 (en) * 2004-05-11 2007-02-20 Rf Micro Devices, Inc. I/Q calibration
US20130314280A1 (en) * 2012-05-23 2013-11-28 Alexander Maltsev Multi-element antenna beam forming configurations for millimeter wave systems
CN103716080A (en) * 2012-10-05 2014-04-09 Nxp股份有限公司 A phased array antenna and associated methods
US20160308626A1 (en) * 2015-04-17 2016-10-20 Apple Inc. Electronic Device With Over-The-Air Wireless Self-Testing Capabilities
WO2017111920A1 (en) * 2015-12-21 2017-06-29 Intel Corporation Microelectronic devices designed with high frequency communication modules having steerable beamforming capability

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005012648A (en) * 2003-06-20 2005-01-13 Toshiba Corp Radio communication apparatus and its transmitting/receiving circuit
US7209720B2 (en) * 2003-08-26 2007-04-24 Freescale Semiconductor, Inc. Multiband and multimode transmitter and method
JP2005094282A (en) * 2003-09-17 2005-04-07 Renesas Technology Corp Semiconductor integrated circuit for communication
JP2007019939A (en) * 2005-07-08 2007-01-25 Renesas Technology Corp Radio communications equipment and portable telephone terminal using the same
US8890625B2 (en) * 2013-01-03 2014-11-18 Qualcomm Incorporated Systems and methods for frequency synthesis to improve coexistence
KR101736876B1 (en) 2014-01-06 2017-05-17 삼성전자주식회사 Method and apparatus for transceiving for beam forming in wireless communication system
RU2595941C2 (en) 2014-05-06 2016-08-27 Общество с ограниченной ответственностью "Радио Гигабит" Radio relay communication system with beam control

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030138034A1 (en) * 2002-01-18 2003-07-24 Zhongming Shi Direct conversion RF transceiver with automatic frequency control
US7181205B1 (en) * 2004-05-11 2007-02-20 Rf Micro Devices, Inc. I/Q calibration
JP2004317524A (en) * 2004-07-30 2004-11-11 Fujitsu Ltd Radar system
US20130314280A1 (en) * 2012-05-23 2013-11-28 Alexander Maltsev Multi-element antenna beam forming configurations for millimeter wave systems
CN103716080A (en) * 2012-10-05 2014-04-09 Nxp股份有限公司 A phased array antenna and associated methods
US20160308626A1 (en) * 2015-04-17 2016-10-20 Apple Inc. Electronic Device With Over-The-Air Wireless Self-Testing Capabilities
WO2017111920A1 (en) * 2015-12-21 2017-06-29 Intel Corporation Microelectronic devices designed with high frequency communication modules having steerable beamforming capability

Also Published As

Publication number Publication date
CA3103569A1 (en) 2019-12-19
KR20210025044A (en) 2021-03-08
JP2022517453A (en) 2022-03-09
WO2019240961A1 (en) 2019-12-19
CA3103569C (en) 2022-12-06
JP7187583B2 (en) 2022-12-12
KR102444887B1 (en) 2022-09-16

Similar Documents

Publication Publication Date Title
US10135478B2 (en) Wideband millimeter-wave frontend integrated circuit
US10128896B2 (en) Fully integrated complete multi-band RF frontend system integrated circuit (IC) chip
US7991368B2 (en) Integrated RF-IF converter
CA3103569C (en) Wideband millimeter-wave frontend integrated circuit
CN114450894B (en) Scalable dual-polarization millimeter wave multiband 5G phased array with LO generator of multiple multipliers
CA3100684C (en) Wide-band 360 degree phase shifter utilizing right-hand and left-hand transmission line switches for rf communications
US10777891B2 (en) Scalable radio frequency antenna array structures
US20190190546A1 (en) Communication unit
KR102435469B1 (en) Double Polarized Millimeter Wave Front-End Integrated Circuit
US11539383B2 (en) Bidirectional image-rejection active array with reduced LO requirement
US20240106463A1 (en) Intermediate frequency filter for millimeter-wave carrier aggregation
US20220303106A1 (en) Scalable phased-array system for wireless systems
Luo et al. A Phased-Array Transceiver With 2-Dimension Continuously Auto Link-Tracking Operation and Time Division Modulator

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
TA01 Transfer of patent application right
TA01 Transfer of patent application right

Effective date of registration: 20220127

Address after: Room (112) - 117, logistics building, No. 88, modern Avenue, Suzhou Industrial Zone, Suzhou area, China (Jiangsu) pilot Free Trade Zone, Suzhou, Jiangsu

Applicant after: Suzhou Siweite Technology Co.,Ltd.

Address before: British Columbia

Applicant before: Swift Technology Co.,Ltd.