CN112510140A - LED packaging structure applied to automobile photoelectric coupler - Google Patents
LED packaging structure applied to automobile photoelectric coupler Download PDFInfo
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- CN112510140A CN112510140A CN202011474992.3A CN202011474992A CN112510140A CN 112510140 A CN112510140 A CN 112510140A CN 202011474992 A CN202011474992 A CN 202011474992A CN 112510140 A CN112510140 A CN 112510140A
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- infrared light
- led
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- silica gel
- slide holder
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
- H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
Abstract
The invention relates to an LED packaging structure applied to an automobile photoelectric coupler, which comprises an upper frame and an infrared light-emitting LED, wherein a slide holder is arranged on the upper frame, and the infrared light-emitting LED is arranged on the slide holder. The LED packaging structure can recycle some chips with parameters exceeding the standard, reduces the rejection rate, has low chip pairing requirement and is convenient to produce.
Description
Technical Field
The invention relates to the technical field of automobile photoelectric coupler packaging, in particular to an LED packaging structure applied to an automobile photoelectric coupler.
Background
With the development of automobile technology and electronic technology, a large number of electronic control devices are used on modern automobiles, dozens or dozens of electronic control units are adopted on many medium-high-grade cars, each electronic control unit is connected with a plurality of sensors and actuators, and information exchange is required among the control units, so that electronic components, wire harnesses and plug connectors are more and more, a magnetic field exists around a power-on wire, the problem of electromagnetic interference is more and more serious, and a photoelectric coupler has good electromagnetic interference resistance and the like, so that the photoelectric coupler is more and more widely applied to automobiles, such as a photoelectric coupling type automobile body height sensor, a steering wheel rotation angle sensor, a light guide transmitter and the like.
The Current Transfer Ratio (CTR) is the ratio of the output current and the input current of the linear optocoupler, can also be called as the amplification factor of the optocoupler, and is a key index of the optocoupler. CTR is determined by the power of the light emitting LED (IR) (PO), the receiving PT magnification (HFE), and the Transmission Path Efficiency (TPE) 3 factors; for the fixed structure and the maturation process, the main influencing factors are the first two. Due to process fluctuation, parameters of the LED chip and the PT chip are changed, and classification is carried out in a grading mode.
Patent publication No. CN210296369U discloses an optical coupling package structure, which includes: the upper frame comprises a first slide holder, and a light gathering structure is arranged on the first slide holder; the infrared light-emitting LED is arranged on the first slide holder of the upper frame and used for emitting light; the lower frame comprises a second slide holder, and the second slide holder is positioned below the first slide holder; the infrared receiving IC is arranged on the second slide holder of the lower frame and used for receiving light; the silica gel is arranged on the first slide holder of the upper frame and used for packaging the infrared light-emitting LED; the outer packaging body is in a cuboid shape, the upper frame, the infrared light-emitting LED, the lower frame, the infrared receiving IC and the silica gel are packaged into a whole, and the upper frame and the lower frame extend out of the outer packaging body along opposite directions.
Above-mentioned optical coupling packaging structure has reached and has made the luminous direction of LED concentrate, improve the effective light intensity that arrives infrared receipt IC, improve product current transmission ratio CTR and concentration, improve the technological effect of product yield, but in order to reach predetermined current transmission ratio in the optical coupling production process, need pair IR (infrared LED chip) and two kinds of chips of PT (infrared receipt chip), if the chip does not have suitable pairing, just can't produce, cause scrapping of material even, the technical scheme of above-mentioned patent can not effectively solve this technical problem.
Disclosure of Invention
The invention aims to provide an LED packaging structure applied to an automobile photoelectric coupler, which controls the efficiency of a transmission light path by changing the light transmittance, so that an infrared light-emitting LED chip and an infrared receiving chip can be properly matched to achieve a preset current transmission ratio.
In view of the above situation, in a first technical scheme provided by the present invention, an LED package structure includes an upper frame and an infrared light emitting LED, wherein a stage is disposed on the upper frame, the infrared light emitting LED is disposed on the stage, a package transmission layer for sealing the infrared light emitting LED is further disposed on the stage, the package transmission layer includes silicone rubber and silicone resin powder, and the silicone rubber and the silicone resin powder are mixed.
According to the second technical scheme, the LED packaging structure comprises an upper frame and an infrared light-emitting LED, a slide holder is arranged on the upper frame, the infrared light-emitting LED is arranged on the slide holder, a packaging transmission layer used for sealing the infrared light-emitting LED is further arranged on the slide holder, and the packaging transmission layer comprises silica gel and carbon black powder.
Further, the silica gel and the carbon black powder are mixed.
Further, the silica gel and the carbon black powder are arranged in a layered mode, and the packaging transmission layer comprises a silica gel layer and a carbon black powder layer.
Further, the silica gel layer is arranged between the infrared light-emitting LED and the carbon black powder layer.
Further, the carbon black powder layer is arranged between the infrared light-emitting LED and the silica gel layer.
The invention has the beneficial effects that:
1. when a certain parameter value in the efficacy (PO) of the infrared light-emitting LED or the amplification factor (HFE) of the infrared receiving chip is higher, the light transmittance of the infrared light-emitting LED after passing through the packaging transmission layer can be reduced by 0-5% by adjusting the proportion of the silica gel and the organic silicon resin powder.
2. When the efficacy (PO) of the infrared light-emitting LED or the amplification factor (HFE) of the infrared receiving chip is higher than a certain parameter value, the thickness of the carbon black layer is adjusted, so that the light transmittance of light emitted by the infrared light-emitting LED after passing through the packaging transmission layer is reduced by 0-100%.
3. The infrared light-emitting LED chip and the infrared receiving chip are low in matching requirement by arranging the packaging transmission layer, and production is facilitated.
Drawings
Fig. 1 is a partial schematic view of an internal structure of an optical coupler according to an embodiment of the present invention.
In the figure, an upper frame 100, a stage 110; an infrared light emitting LED 200; encapsulating the transmissive layer 300.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more clearly understood, the following description, with reference to the accompanying drawings and embodiments, further describes in detail an LED package structure applied to an automotive photocoupler. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
Example one
The utility model provides a be applied to LED packaging structure of car photoelectric coupler, including upper frame 100 and infrared light emitting LED200, be equipped with slide holder 110 on the upper frame 100, infrared light emitting LED200 is located slide holder 110, still be equipped with the encapsulation transmission layer 300 that is used for sealed infrared light emitting LED200 on the slide holder 110, encapsulation transmission layer 300 includes silica gel and organic silicon resin powder, wherein, silica gel and organic silicon resin powder mix the setting, when certain parameter value in the efficiency (PO) of infrared light emitting LED200 or the amplification factor (HFE) of infrared receiving chip is on the high side, through adjusting the proportion of silica gel and organic silicon resin powder, can make the light transmissivity decline 0-5% behind the infrared light emitting LED200 transmission layer 300 through the encapsulation.
Example two
The utility model provides a be applied to LED packaging structure of car photoelectric coupler, including upper ledge 100 and infrared light emitting LED200, be equipped with slide holder 110 on the upper ledge 100, infrared light emitting LED200 is located slide holder 110, still be equipped with the encapsulation transmission layer 300 that is used for sealed infrared light emitting LED200 on the slide holder 110, encapsulation transmission layer 300 includes silica gel and carbon black powder, wherein, silica gel and carbon black powder mix the setting, when certain parameter value in the efficiency (PO) of infrared light emitting LED200 or the amplification factor (HFE) of infrared receiving chip is on the high side, through adjusting the proportion of carbon black powder and silica gel, can make the light transmissivity decline 0-100% behind the infrared light emitting LED200 transmission layer 300 through the encapsulation transmission layer.
EXAMPLE III
An LED packaging structure applied to an automobile photoelectric coupler comprises an upper frame 100 and an infrared light-emitting LED200, wherein a slide holder 110 is arranged on the upper frame 100, the infrared light-emitting LED200 is arranged on the slide holder 110, a packaging transmission layer 300 for sealing the infrared light-emitting LED200 is also arranged on the slide holder 110, the packaging transmission layer 300 comprises a silica gel layer and a carbon black powder layer, the silica gel layer is arranged between the infrared light-emitting LED200 and the carbon black powder layer, thus, the preparation process is simpler, if the light transmittance is not adjusted to the required specific range, the carbon black powder can be conveniently and rapidly coated to increase the thickness so as to achieve the effect of changing the light transmittance, when a certain parameter value in the efficacy (PO) of the infrared light emitting LED200 or the amplification factor (HFE) of the infrared receiving chip is higher, by adjusting the thickness of the carbon black layer, the light transmittance of the infrared light emitting LED200 can be reduced by 0-100% after passing through the encapsulation transmissive layer 300.
Example four
The utility model provides a be applied to LED packaging structure of car photoelectric coupler, including upper frame 100 and infrared light emitting LED200, be equipped with slide holder 110 on the upper frame 100, infrared light emitting LED200 is located slide holder 110, still be equipped with the encapsulation transmission layer 300 that is used for sealed infrared light emitting LED200 on the slide holder 110, encapsulation transmission layer 300 includes silica gel layer and carbon black powder layer, the carbon black powder layer is located between infrared light emitting LED200 and the silica gel layer, when certain parameter value in the efficiency (PO) of infrared light emitting LED200 or the amplification factor (HFE) of infrared receiving chip is on the high side, through adjusting the thickness of carbon black layer, can make the light transmissivity decline 0-100% behind the encapsulation transmission layer 300 of the light that infrared light emitting LED200 sent.
Comparative example
In contrast to example 1, the transmissive encapsulation layer was made of silicone.
Comparative tables for examples of the invention and comparative examples are as follows:
| PO | PT | efficiency of transmission light path | |
| Example 1 | 0.65-0.70 | 1200-1300 | 95％-100％ |
| Example 2 | 0.65-0.70 | 1200-1300 | 0-100％ |
| Example 3 | 0.65-0.70 | 1200-1300 | 0-100％ |
| Example 4 | 0.65-0.70 | 1200-1300 | 0-100％ |
| Comparative example | 0.65-0.70 | 1200-1300 | 100％ |
In the chip pairing process, when the average value range of PO is 0.65-0.70, to achieve the predetermined current transmission ratio, PT needs to be in the range of 1100-; the encapsulation transmission layer 300 made of silica gel and carbon black powder is applied to the embodiments 2 to 4, so that the efficiency of a transmission light path can be reduced by 0 to 100 percent; in summary, we can reasonably select the composition of the packaging transmissive layer 300 according to the range of the chip parameter exceeding the standard in the actual production activity.
Although the present invention has been described with reference to a preferred embodiment, it should be understood that various changes, substitutions and alterations can be made herein without departing from the spirit and scope of the invention as defined by the appended claims.
Claims (6)
1. The utility model provides a be applied to LED packaging structure of car photoelectric coupler, includes upper ledge and infrared light emitting LED, be equipped with the slide holder on the upper ledge, infrared light emitting LED locates the slide holder is bench, its characterized in that, the slide holder bench still is equipped with and is used for sealing infrared light emitting LED's encapsulation transmission layer, the encapsulation transmission layer includes silica gel and organic silicon resin powder, silica gel with the mixed setting of organic silicon resin powder.
2. The utility model provides a be applied to LED packaging structure of car photoelectric coupler, includes upper ledge and infrared light emitting LED, be equipped with the slide holder on the upper ledge, infrared light emitting LED locates on the slide holder, its characterized in that, still be equipped with on the slide holder and be used for sealing infrared light emitting LED's encapsulation transmission layer, the encapsulation transmission layer includes silica gel and carbon black powder.
3. The LED package structure of claim 2, wherein the silica gel and the carbon black powder are mixed.
4. The LED package structure of claim 2, wherein the silica gel is layered with the carbon black powder, and the package transmissive layer comprises a silica gel layer and a carbon black powder layer.
5. The LED package structure of claim 4, wherein the silicone layer is disposed between the infrared light-emitting LED and the carbon black powder layer.
6. The LED package structure of claim 4, wherein the carbon black powder layer is disposed between the infrared light-emitting LED and the silica gel layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011474992.3A CN112510140A (en) | 2020-12-14 | 2020-12-14 | LED packaging structure applied to automobile photoelectric coupler |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011474992.3A CN112510140A (en) | 2020-12-14 | 2020-12-14 | LED packaging structure applied to automobile photoelectric coupler |
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| Publication Number | Publication Date |
|---|---|
| CN112510140A true CN112510140A (en) | 2021-03-16 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011474992.3A Pending CN112510140A (en) | 2020-12-14 | 2020-12-14 | LED packaging structure applied to automobile photoelectric coupler |
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Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101974228A (en) * | 2010-10-11 | 2011-02-16 | 广州亿锘有机硅技术有限公司 | Organic silica-gel material for encapsulating luminous element and preparation method thereof |
| CN104409607A (en) * | 2014-11-04 | 2015-03-11 | 常州晶玺照明有限公司 | High color rendering index 360 DEG light emitting LED filament lamp |
| CN108091613A (en) * | 2017-12-25 | 2018-05-29 | 无锡少小科技有限公司 | The method for adjusting photoelectrical coupler amplifying power |
| CN110098306A (en) * | 2018-09-03 | 2019-08-06 | 深圳市洲明科技股份有限公司 | A kind of integration packaging display module |
| CN210296369U (en) * | 2019-10-30 | 2020-04-10 | 宁波群芯微电子有限责任公司 | Optical coupler packaging structure |
| CN111244248A (en) * | 2020-01-17 | 2020-06-05 | 盐城东山精密制造有限公司 | LED packaging device capable of increasing light-emitting angle and display application |
| CN111739990A (en) * | 2020-05-20 | 2020-10-02 | 天津中环电子照明科技有限公司 | Ultraviolet LED packaging method and ultraviolet LED packaging |
-
2020
- 2020-12-14 CN CN202011474992.3A patent/CN112510140A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101974228A (en) * | 2010-10-11 | 2011-02-16 | 广州亿锘有机硅技术有限公司 | Organic silica-gel material for encapsulating luminous element and preparation method thereof |
| CN104409607A (en) * | 2014-11-04 | 2015-03-11 | 常州晶玺照明有限公司 | High color rendering index 360 DEG light emitting LED filament lamp |
| CN108091613A (en) * | 2017-12-25 | 2018-05-29 | 无锡少小科技有限公司 | The method for adjusting photoelectrical coupler amplifying power |
| CN110098306A (en) * | 2018-09-03 | 2019-08-06 | 深圳市洲明科技股份有限公司 | A kind of integration packaging display module |
| CN210296369U (en) * | 2019-10-30 | 2020-04-10 | 宁波群芯微电子有限责任公司 | Optical coupler packaging structure |
| CN111244248A (en) * | 2020-01-17 | 2020-06-05 | 盐城东山精密制造有限公司 | LED packaging device capable of increasing light-emitting angle and display application |
| CN111739990A (en) * | 2020-05-20 | 2020-10-02 | 天津中环电子照明科技有限公司 | Ultraviolet LED packaging method and ultraviolet LED packaging |
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Effective date of registration: 20210325 Address after: Room d4f07, 4th floor, CLP Plaza building, 2070 Shennan Middle Road, Fuqiang community, Huaqiangbei street, Futian District, Shenzhen, Guangdong 518000 Applicant after: Shenzhen Qunxin Microelectronics Co.,Ltd. Address before: 315000 workshops 23 and 24, 68 Yuhai East Road, Hangzhou Bay New District, Ningbo City, Zhejiang Province Applicant before: Ningbo qunzi Microelectronics Co.,Ltd. |
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Application publication date: 20210316 |
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