CN112509992B - Display panel, electronic equipment and manufacturing method of display panel - Google Patents
Display panel, electronic equipment and manufacturing method of display panel Download PDFInfo
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- CN112509992B CN112509992B CN202011373455.XA CN202011373455A CN112509992B CN 112509992 B CN112509992 B CN 112509992B CN 202011373455 A CN202011373455 A CN 202011373455A CN 112509992 B CN112509992 B CN 112509992B
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 16
- 239000000758 substrate Substances 0.000 claims abstract description 232
- 238000005452 bending Methods 0.000 claims description 23
- 238000007789 sealing Methods 0.000 claims description 16
- 239000000565 sealant Substances 0.000 claims description 15
- 238000000034 method Methods 0.000 claims description 12
- 239000000853 adhesive Substances 0.000 claims description 5
- 230000001070 adhesive effect Effects 0.000 claims description 5
- 238000005530 etching Methods 0.000 claims description 4
- 239000003292 glue Substances 0.000 claims description 3
- 230000000149 penetrating effect Effects 0.000 claims description 3
- 239000012945 sealing adhesive Substances 0.000 claims 2
- 238000004806 packaging method and process Methods 0.000 abstract description 34
- 238000012858 packaging process Methods 0.000 abstract description 7
- 230000000694 effects Effects 0.000 abstract description 6
- 239000010408 film Substances 0.000 description 42
- 239000010409 thin film Substances 0.000 description 14
- 238000010586 diagram Methods 0.000 description 13
- 238000005538 encapsulation Methods 0.000 description 8
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 6
- 230000001681 protective effect Effects 0.000 description 5
- 230000004888 barrier function Effects 0.000 description 3
- 150000001875 compounds Chemical class 0.000 description 3
- 239000004642 Polyimide Substances 0.000 description 2
- 229910004205 SiNX Inorganic materials 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 230000000903 blocking effect Effects 0.000 description 2
- 238000002955 isolation Methods 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 229910052814 silicon oxide Inorganic materials 0.000 description 2
- -1 specifically Substances 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000000356 contaminant Substances 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 230000000750 progressive effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/301—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements flexible foldable or roll-able electronic displays, e.g. thin LCD, OLED
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Theoretical Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Electroluminescent Light Sources (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
The invention provides a display panel, electronic equipment and a manufacturing method of the display panel. The display module is packaged through the flexible substrate, the packaging process is simple, and the packaging effect is enhanced. Besides, the thickness of the flexible substrate is smaller than that of the conventional film packaging layer, so that the thickness of the display panel provided by the invention is reduced.
Description
Technical Field
The present invention relates to the field of display technologies, and in particular, to a display panel, an electronic device, and a method for manufacturing the display panel.
Background
At present, a conventional packaging mode of a flexible display panel is film packaging, specifically, film packaging is to coat an organic film on the basis of an inorganic film, and then deposit an inorganic film on the basis of the organic film, so that the stacked film packaging layers isolate external pollution. In addition, in order to further prevent the thin film packaging layer from being scratched and blocking water vapor, a protective film is attached to the surface of the thin film packaging layer. The inventor finds that the packaging process of the current display panel is complex, the binding force between the deposited film and the substrate is not high, cracks are easy to generate during bending, packaging failure is caused, and in addition, the packaging layer is thicker and is not beneficial to the design of a narrow frame of the display panel.
Disclosure of Invention
In view of the above, the present invention provides a display panel, an electronic device and a method for manufacturing the display panel, which can simplify the packaging process of the display panel and enhance the packaging effect.
In order to achieve the above purpose, the present invention provides the following technical solutions:
The utility model provides a display panel, includes flexible substrate and display module assembly, and wherein, flexible substrate includes first sub-flexible substrate and second sub-flexible substrate, and second sub-flexible substrate includes first parcel portion, and the edge portion of first sub-flexible substrate is lived to the parcel at least after the first parcel portion is buckled, forms the sealed cavity that is used for built-in display module assembly.
An electronic device comprises the display panel.
A manufacturing method of a display panel comprises the following steps:
providing a rigid substrate;
Forming a flexible substrate comprising a first sub-flexible substrate and a second sub-flexible substrate on one side surface of the rigid substrate, wherein the second sub-flexible substrate comprises a first wrapping part;
a display module to be packaged is arranged on the surface of one side of the first sub-flexible substrate far away from the rigid substrate;
bending the first wrapping part of the second sub-flexible substrate, so that the first wrapping part wraps at least one side edge of the first sub-flexible substrate far away from the second sub-flexible substrate after bending to form a sealed cavity;
Etching or laser causes the rigidity to separate from the flexible substrate.
Compared with the prior art, the technical scheme provided by the invention has the following advantages:
the display panel comprises a flexible substrate and a display module, wherein the flexible substrate comprises a first sub-flexible substrate and a second sub-flexible substrate, the second sub-flexible substrate comprises a first wrapping part, at least the edge part of the first sub-flexible substrate is wrapped after the first wrapping part is bent, a sealed cavity is formed, and the display module is arranged in the sealed cavity. The display module is packaged through the flexible substrate, the packaging process is simple, and the packaging effect is enhanced. Besides, the thickness of the flexible substrate is smaller than that of the conventional film packaging layer, so that the thickness of the display panel provided by the invention is reduced.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings that are required to be used in the embodiments or the description of the prior art will be briefly described below, and it is obvious that the drawings in the following description are only embodiments of the present invention, and that other drawings can be obtained according to the provided drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic diagram of a conventional display panel;
FIG. 2 is a schematic diagram of another structure of a display panel according to the prior art;
Fig. 3 is a schematic structural diagram of a display panel according to an embodiment of the present invention;
fig. 4 is a schematic structural diagram of a display panel according to an embodiment of the invention;
Fig. 5 is a schematic structural diagram of a display panel according to an embodiment of the invention;
fig. 6 is a schematic structural diagram of a display panel according to an embodiment of the invention;
fig. 7 is a schematic structural diagram of a display panel according to an embodiment of the invention;
Fig. 8 is a schematic structural diagram of a display panel according to an embodiment of the invention;
fig. 9 is a schematic diagram of another structure of a display panel according to an embodiment of the invention;
Fig. 10 is a schematic diagram of another structure of a display panel according to an embodiment of the invention;
fig. 11 is a schematic diagram of an electronic device according to an embodiment of the present invention;
Fig. 12 is a schematic flow chart of a method for manufacturing a display panel according to an embodiment of the present invention;
fig. 13 is a schematic structural diagram of a display panel according to an embodiment of the invention.
Detailed Description
As described in the background art, the conventional flexible display panel adopts a thin film packaging manner, and as shown in fig. 1, the display panel includes a substrate 11, a display module 12, a thin film packaging layer 13, and a protective film 14. Specifically, the display module 12 is disposed on one side of the substrate 11, and may include an array layer, a light emitting layer (not shown in the figure), wherein the array layer includes at least a thin film transistor, and the light emitting layer includes at least a light emitting unit, and the specific structure of the display module is not described in detail herein.
Thereafter, a thin film encapsulation layer 13 is disposed on the surface of the display module 12 away from the substrate 11, and typically, the thin film encapsulation layer is a structure of an organic film and an inorganic film, and in fig. 1, the thin film encapsulation layer is a three-layer structure of an inorganic film 131+an organic film 132+an inorganic film 133, specifically, a lower layer SiNx/SiOx inorganic film (inorganic film 131) is deposited on the surface of the display module 12 away from the substrate 11, then an IJP organic film (organic film 132) is coated on the surface of the inorganic film 131 away from the display module 12, and then an upper layer SiNx/SiOx inorganic film (inorganic film 133) is deposited again. The film packaging layer 13 can prevent water vapor, dust and the like from entering the display module so as to realize the protection of the display module.
Besides, a protective film 14 can be attached to the surface of the film packaging layer 13 far away from the display module 12, and the protective film 14 is arranged to prevent the film packaging layer from being scratched, and meanwhile, impurities such as water vapor and the like are further blocked. Specifically, the protective film 14 and the inorganic film 133 may be attached to each other by an adhesive 141, and other attachment methods may be used, which will not be described in detail herein.
The inventor has found that the conventional thin film packaging layer 13 shown in fig. 1 requires two inorganic films and one organic film, and that the three films need to be subjected to refractive index matching in order to ensure the transmittance of the thin film packaging layer 13, which makes the manufacturing process of the thin film packaging layer more complicated. In addition, in order to prevent the organic film from overflowing during the curing process, as shown in fig. 2, at least two barriers 21 are required to be provided at the edge of the thin film encapsulation layer 13 with a certain interval between adjacent barriers 21 so that the barriers 21 block the organic material IJP. In order to enhance the packaging effect, a certain area 22 is generally expanded outwards at the edge of the retaining wall 21, which makes the frame width of the display panel after the encapsulation of the thin film packaging layer affected by the retaining wall and the expanded area, contrary to the development trend of the narrow frame of the display panel. In addition, the organic film has water absorption, which may cause the package failure of the thin film package layer.
Based on the above, the invention provides a display panel, which comprises a flexible substrate and a display module, wherein the flexible substrate comprises a first sub-flexible substrate and a second sub-flexible substrate, the second sub-flexible substrate comprises a first wrapping part, the first wrapping part wraps at least the edge part of the first sub-flexible substrate after being bent to form a sealed cavity, and the display module is arranged in the sealed cavity.
The invention also provides electronic equipment comprising the display panel.
Besides, the invention also provides a manufacturing method of the display panel, which comprises the following steps:
providing a rigid substrate;
Forming a flexible substrate comprising a first sub-flexible substrate and a second sub-flexible substrate on one side surface of the rigid substrate, wherein the second sub-flexible substrate comprises a first wrapping part;
a display module to be packaged is arranged on the surface of one side of the first sub-flexible substrate far away from the rigid substrate;
bending the first wrapping part of the second sub-flexible substrate, so that the first wrapping part wraps at least one side edge of the first sub-flexible substrate far away from the second sub-flexible substrate after bending to form a sealed cavity;
Etching or laser causes the rigidity to separate from the flexible substrate.
Therefore, the display panel provided by the invention has the advantages that the display module is packaged through the flexible substrate, the packaging process is simple, and the packaging effect is enhanced. Besides, the thickness of the flexible substrate is smaller than that of the conventional film packaging layer, so that the thickness of the display panel provided by the invention is reduced.
The foregoing is a core idea of the present invention, and in order that the above-mentioned objects, features and advantages of the present invention can be more clearly understood, a technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
Referring to fig. 3, fig. 3 is a schematic structural diagram of a display panel according to an embodiment of the present invention, where the display panel includes a flexible substrate 31 and a display module 32, in this embodiment, the flexible substrate 31 includes a first sub-flexible substrate 311 and a second sub-flexible substrate 312, and the second sub-flexible substrate 312 includes a first wrapping portion 312a, and the first wrapping portion 312a wraps at least an edge portion 311a of the first sub-flexible substrate after being bent to form a sealed cavity 313 (an area indicated by a dashed frame in the drawing). A display module 32 is disposed in the sealed cavity 313.
In the present embodiment, the material and characteristics of the flexible substrate are not limited, and for example, it may have characteristics of being stretchable, foldable, bendable or crimpable, and the flexible substrate may be formed of a flexible insulating material, specifically, polyimide (PI), polycarbonate (PC), polyethylene terephthalate (PET), or the like.
Specifically, in the present embodiment, the first sub-flexible substrate 311 and the second sub-flexible substrate 312 may be in an integrated structure, as shown in fig. 3, in the integrated structure, one end of the first sub-flexible substrate 311, which is not connected to the second sub-flexible substrate 312, is an edge portion 311a of the first sub-flexible substrate, and one end of the second sub-flexible substrate 312, which is not connected to the first sub-flexible substrate 311, is a first wrapping portion 312a of the second sub-flexible substrate 312. In this embodiment, the first wrapping portion 312a of the second sub-flexible substrate 312 is bent, so that the edge portion 311a of the first sub-flexible substrate is wrapped by the bent first wrapping portion 312a, the first sub-flexible substrate 311 and the second sub-flexible substrate 312 form a sealed cavity 313, and then a device waiting for packaging of the display module is disposed in the sealed cavity 313, so as to realize packaging of the display module by the flexible substrate.
It is worth mentioning that, this scheme is through the encapsulation of flexible substrate carrying out the display module assembly, compares in the mode of current film encapsulation, and flexible substrate need not to carry out the refractive index matching between the multiple film layers, and its encapsulation process is simple. As can be seen from fig. 3, the distance d2 between the display module 32 and the first wrapping portion 312a may be zero (for convenience of illustration, d2 in fig. 3 is not zero), so that the frame of the display panel packaged by the flexible substrate is smaller than the frame width d1 of the display panel packaged by the film packaging layer, and accords with the development trend of the narrow frame of the display panel.
Of course, as shown in fig. 4, the first sub-flexible substrate 311 and the second sub-flexible substrate 312 may also be in a split structure. In fig. 4, the first sub-flexible substrate 311 and the second sub-flexible substrate 312 are shown as separate structures, so the right side in fig. 4 is regarded as a non-sealing structure, but in practice, the first wrapping portion 312a of the second sub-flexible substrate 312 is only required to wrap the edge portion 311a of the first sub-flexible substrate 311, so that the first sub-flexible substrate 311 and the second sub-flexible substrate 312 form a sealing cavity 313 for disposing a device to be packaged (e.g., the display module 32 in the figure).
On the basis of the above embodiment, in order to further improve the sealability of the flexible substrate, in the display panel provided in the embodiment of the present invention, as shown in fig. 5, a first support column 51 arranged along a first direction X perpendicular to the second sub-flexible substrate 312 is disposed between the edge portion 311a of the first sub-flexible substrate 311 and the second sub-flexible substrate 312, and a sealant 52 is filled between the first wrapping portion 312a and the first support column 51, so as to enhance the sealability between the first sub-flexible substrate 311 and the second sub-flexible substrate 312 by adding a sealant bonding support column.
Specifically, in the present embodiment, along the first direction X, the sealant 52 covers at least the edge portion 311a of the first sub-flexible substrate or the first support post 51. For example, the sealant 52 may fill the space between the first support column 51 and the first wrapping portion 312a and the edge portion 311a of the first sub-flexible substrate, or may fill only the region between the first support column 51 and the first wrapping portion 312a, or may fill only the region between the edge portion 311a of the first sub-flexible substrate and the first wrapping portion 312 a. However, in this embodiment, no matter what filling method is adopted, it is only necessary to ensure that the edge portion 311a of the first sub-flexible substrate and the first wrapping portion 312a of the second sub-flexible substrate are sealed by the sealant 52.
In addition, in this embodiment, the first support columns 51 can not only play a role in supporting the second sub-flexible substrate 312, but also play a role in blocking the sealant from diffusing into the sealed cavity by setting the heights of the support columns, so that the distance between the second sub-flexible substrate 312 and the first sub-flexible substrate is equal, the usage amount of the sealant is reduced, and the packaging cost is further reduced.
In the above embodiment, the sealing glue is used to enhance the sealing property between the edge portion 311a of the first sub-flexible substrate and the first wrapping portion 312a, and further, in this embodiment, the sealing property between the edge portion 311a of the first sub-flexible substrate and the first wrapping portion 312a is enhanced by providing the edge portion 311a of the first sub-flexible substrate and the first wrapping portion 312 a.
Specifically, as shown in fig. 6, in the display panel provided in this embodiment, the first structure 61 is disposed on a side of the first sub-flexible substrate close to the first wrapping portion 312a, and correspondingly, the second structure 62 is disposed on a side of the first wrapping portion 312a close to the first sub-flexible substrate. The first structure 61 and the second structure 62 are in physical sealing connection, so that the sealing performance of the display panel is improved.
In the present embodiment, the specific shapes of the first structure 61 and the second structure 62 are not limited, for example, the surface of the first structure 61 close to the second structure 62 may be a convex structure, the surface of the second structure 62 close to the first structure 61 may be a concave structure, and the convex structure is disposed corresponding to the concave structure, so as to improve the tightness between the edge portion 311a of the first sub-flexible substrate and the first wrapping portion 312 a. For another example, the surface of the first structure 61 near the second structure 62 is wavy, and correspondingly, the surface of the second structure 62 near the first structure 61 is wavy, and the sealing performance between the edge portion 311a of the first sub-flexible substrate and the first wrapping portion 312a is improved through the cooperation between the first structure 61 and the second structure 62.
In addition, the display panel provided in the embodiment of the invention may further include a retaining wall 71 as shown in fig. 7. The retaining wall 71 is disposed between the first structure 61 and the second structure 62, disposed along the first direction X. It should be noted that, in the present embodiment, one side 71a of the retaining wall 71 is in contact with the first structure 61, and the other side 71b of the retaining wall 71 is in contact with the second structure 62. In the present embodiment, it is not limited how one side and the other side of the retaining wall 71 are in contact with the first structure and the second structure, for example, in addition to the contact manner shown in fig. 7, one side 71a of the retaining wall 71 in fig. 7 may be in contact with the first structure 61, and the other side 71c of the retaining wall 71 may be in contact with the second structure 62. Accordingly, the sealant 52 is disposed between the retaining wall 71 and the first wrapping portion 312 a. In this embodiment, the retaining wall 71 can prevent the sealant 52 from diffusing to the outside of the display panel, so as to improve the sealing property between the edge portion 311a of the first sub-flexible substrate and the first wrapping portion 312 a.
In this embodiment, the sealed cavity may be provided with any semiconductor device to be packaged, and thus, the structure of the display module is not particularly limited in this embodiment, and for example, the display module may be any one of structures in fig. 8 to 10.
Referring to fig. 8, in the display panel, the display module 82 includes a first array layer 821, a first light emitting layer 822 and a first touch layer 823, wherein the first array layer 821 may include a PVEE area, a SPACE area, a VSR area and an AA area, the first light emitting layer 822 may include a pixel defining layer, an anode, a cathode, etc., and the first touch layer 823 may include a plurality of touch electrodes 823a.
Specifically, the positional relationship of each film layer in the display module 82 is as follows:
The first array layer 821 is disposed on a side surface of the first sub-flexible substrate 811, the first light emitting layer 822 is disposed on a side of the first array layer 821 away from the first sub-flexible substrate 811, and the first touch layer 823 is disposed on a side surface of the second sub-flexible substrate 812 close to the first sub-flexible substrate 811.
It can be seen that, in this embodiment, the first array layer can be packaged, and the light emitting layer can be packaged, in addition to this, the touch electrode 823a can also be packaged in the sealed cavity formed by the first sub-array substrate and the second sub-array substrate, so that the packaging of the display module is realized, the packaging of the touch electrode is also realized, and the performances of the touch electrode, such as water vapor isolation, are improved.
In addition, as shown in fig. 9, the display module may further include a first binding area 91 and a second support post 92.
Wherein the first binding area 91 is located at a side of the first support column 51 near the display area and between the first support column 51 and the second support column 92. A second binding region 93 is disposed on a side of the first sub-flexible substrate 911 away from the second sub-flexible substrate 912, one end of the first trace 94 extending along the sidewall of the wrapping portion 312a is electrically connected to the first binding region 91, and the other end is electrically connected to the second binding region 93.
Specifically, in this embodiment, the first binding area 91 includes a first binding sub-portion 91a and a second binding sub-portion 91b, where the first binding sub-portion 93a is disposed on a side of the second sub-flexible substrate 912 close to the first sub-flexible substrate 911, the second binding sub-portion 93b is disposed on a side of the first sub-flexible substrate 911 close to the second sub-flexible substrate 912, and the first binding sub-portion 91a and the second binding sub-portion 91b are electrically connected by conductive adhesive. In the display panel provided in this embodiment, the second binding area 93 is electrically connected to the flexible circuit board.
It can be seen that in this embodiment, the first binding area can be connected with the flexible circuit board through the first trace extending along the side wall of the wrapping portion 312a, so that the first array layer in the display module provided in this embodiment is not required to be folded, compared with the prior art, the folding area is set, and the first binding area is folded to the back of the display panel.
In addition, as shown in fig. 10, the display module may further include a third binding area 101 and a third support column 102, where in this embodiment, the third binding area 101 is located at a side of the first support column 51 near the display area and between the first support column 51 and the third support column 102.
Specifically, in this embodiment, a flexible circuit board 103 is disposed on a side of the second sub-flexible substrate 1012 away from the first sub-flexible substrate 1011, and a sealing compound 104 is disposed between the third support column 103 and the first support column 51. A via 105 penetrating through the second sub-flexible substrate 1012 and the sealing compound 104 is provided between the first support column 51 and the third support column 102, and the via is filled with a conductive compound, so that the flexible circuit board 103 is electrically connected with the third bonding area 101.
In this embodiment, the array layer and the light emitting layer are both encapsulated in the sealed cavity, so that isolation of contaminants such as water vapor of the array layer is further achieved. In addition, in this embodiment, the display module may further include a first bending region 106, and after the display panel is packaged, the circuit located in the bending region and far from the display region is bent to the back of the display region, so as to reduce the frame of the display panel.
In order to further improve the bending characteristic of the display panel, in this embodiment, it is further defined that the first bending region is located at a side of the third support column near the display region, along a first direction perpendicular to the plane where the first sub-flexible substrate is located, and/or along a second direction parallel to the plane where the first sub-flexible substrate is located, the first bending region is in a bending structure, so that after the first bending region and the bending region are bent, the third binding region is located at a side of the first sub-flexible substrate far away from the display module.
That is, in the present embodiment, the bending resistance of the second sub-flexible substrate is increased by arranging the second sub-flexible substrate corresponding to the bending region into a bending structure.
It should be noted that, in this embodiment, the third support column may be present together with the second support column in the above embodiment, or in this embodiment, only the third support column is included, and the second support column is not included, that is, in the present invention, the first, second, and third are only for distinguishing, and it is not required that the display panel includes the third support column and includes the first support column and the second support column at the same time.
In summary, the display panel provided by the invention comprises a flexible substrate and a display module, wherein the flexible substrate comprises a first sub-flexible substrate and a second sub-flexible substrate, the second sub-flexible substrate comprises a first wrapping part, at least the edge part of the first sub-flexible substrate is wrapped after the first wrapping part is bent, a sealed cavity is formed, and the display module is arranged in the sealed cavity. The display module is packaged through the flexible substrate, the packaging process is simple, and the packaging effect is enhanced. Besides, the thickness of the flexible substrate is smaller than that of the conventional film packaging layer, so that the thickness of the display panel provided by the invention is reduced.
On the basis of the above embodiment, the embodiment of the present invention further provides an electronic device, as shown in fig. 11, where the electronic device includes the display panel provided in any one of the above embodiments, and the working principle of the electronic device is the same as that of the display panel and is not repeated herein. The electronic device includes, but is not limited to, a mobile phone, a tablet computer, a digital camera and the like.
In combination with the specific structure of the display panel, it is known that in the present embodiment, the first sub-flexible substrate and the second sub-flexible substrate in the display panel may be an integral structure or a split structure. The method for manufacturing the display panel provided by the embodiment of the invention is described by taking the structure that the first sub-flexible substrate and the second sub-flexible substrate are integrated as an example. As shown in fig. 12 and 13, the method for manufacturing the display panel includes the steps of:
s111, providing a rigid substrate 121;
in this embodiment, the rigidity may be basically a glass substrate or the like.
S112, a flexible substrate 122 is formed on one surface of the rigid substrate 121.
The flexible substrate 122 includes a first sub-flexible substrate 122a and a second sub-flexible substrate 122b, and the second sub-flexible substrate 122a includes a first wrapping portion.
Specifically, the embodiment of the invention further provides a specific mode for forming the flexible substrate on one side surface of the rigid substrate, for example: and forming a first sub-flexible substrate and a second sub-flexible substrate which are integrally connected on one side surface of the rigid substrate.
In addition, as can be seen from fig. 12, in this embodiment, a first light emitting layer 124 may be formed on a side surface of the first sub-flexible substrate away from the rigid substrate, and a first array layer 125 may be formed on a side surface of the second sub-flexible substrate away from the rigid substrate. Of course, in combination with the structural embodiment of the display panel, in this embodiment, the display module may be further disposed on a surface of any one of the first sub-flexible substrate or the second sub-flexible substrate.
S113, arranging a display module to be packaged on the surface of one side of the first sub-flexible substrate, which is far away from the rigid substrate;
S114, bending the first wrapping part of the second sub-flexible substrate, so that the first wrapping part wraps at least one side edge of the first sub-flexible substrate far away from the second sub-flexible substrate after being bent, and a sealing cavity 123 is formed;
S115, etching or laser to separate the rigid substrate from the flexible substrate.
The display panel prepared through the steps is packaged through the flexible substrate, the packaging process is simple, and besides, the thickness of the flexible substrate is smaller than that of the conventional film packaging layer, so that the thickness of the display panel provided by the invention is reduced.
Further, in order to improve the sealability of the display panel, the manufacturing method of the display panel provided by the invention further comprises the following steps: and filling sealant to one side of the first sub flexible substrate close to the first wrapping part.
Therefore, the first sub-flexible substrate and the second sub-flexible substrate are sealed through the sealant, and the sealing performance between the first sub-flexible substrate and the second sub-flexible substrate is improved.
In the present specification, each embodiment is described in a progressive manner, and each embodiment is mainly described in a different point from other embodiments, and identical and similar parts between the embodiments are all enough to refer to each other. For the device disclosed in the embodiment, since it corresponds to the method disclosed in the embodiment, the description is relatively simple, and the relevant points refer to the description of the method section.
The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (12)
1. A display panel, comprising:
The flexible substrate comprises a first sub-flexible substrate and a second sub-flexible substrate, wherein the second sub-flexible substrate comprises a first wrapping part, and the first wrapping part wraps at least the edge part of the first sub-flexible substrate after being bent to form a sealed cavity; a first support column which is arranged along a first direction perpendicular to the second sub-flexible substrate is arranged between the edge part of the first sub-flexible substrate and the second sub-flexible substrate;
The sealant is positioned between the first wrapping part and the first support column, and at least covers the edge part of the first sub-flexible substrate or the first support column along the first direction;
the display module is arranged in the sealed cavity;
The display module comprises a first binding area and a second support column, wherein the first binding area is positioned at one side of the first support column close to the display area and between the first support column and the second support column; a second binding area is arranged on one side, far away from the second sub-flexible substrate, of the first sub-flexible substrate, one end of a first wiring extending along the side wall of the wrapping part is electrically connected with the first binding area, and the other end of the first wiring is electrically connected with the second binding area;
Or (b)
The display module comprises a third binding area and a third support column, wherein the third binding area is positioned at one side of the first support column close to the display area and between the first support column and the third support column; a flexible circuit board is arranged on one side, away from the first sub-flexible substrate, of the second sub-flexible substrate, and sealing glue is arranged between the third support column and the first support column; and a through hole penetrating through the second sub-flexible substrate and the sealing adhesive is formed between the first support column and the third support column, and the through hole is filled with conductive adhesive so that the flexible circuit board is electrically connected with the third binding region.
2. The display panel of claim 1, wherein the display panel comprises,
A first structure is arranged on one side of the first sub-flexible substrate close to the first wrapping part,
Correspondingly, a second structure is arranged on one side, close to the first sub-flexible substrate, of the first wrapping part, and the first structure is in sealing connection with the second structure.
3. The display panel of claim 2, further comprising a retaining wall,
The retaining wall is arranged between the first structure and the second structure, is arranged along the first direction, one side of the retaining wall is in contact with the first structure, and the other side of the retaining wall is in contact with the second structure;
Correspondingly, the sealant is arranged between the retaining wall and the first wrapping part.
4. The display panel of claim 1, wherein the display module comprises a first array layer, a first light emitting layer, and a first touch layer comprising a plurality of touch electrodes,
The first array layer is arranged on one side surface of the first sub-flexible substrate, the first light-emitting layer is arranged on one side, far away from the first sub-flexible substrate, of the first array layer, and the first touch layer is arranged on one side surface, close to the first sub-flexible substrate, of the second sub-flexible substrate.
5. The display panel of claim 1, wherein the first bonding region includes a first bonding sub-portion and a second bonding sub-portion, the first bonding sub-portion is disposed on a side of the second sub-flexible substrate adjacent to the first sub-flexible substrate, the second bonding sub-portion is disposed on a side of the first sub-flexible substrate adjacent to the second sub-flexible substrate, and the first bonding sub-portion and the second bonding sub-portion are electrically connected by a conductive adhesive.
6. The display panel of claim 1, wherein the second bonding area is electrically connected to a flexible circuit board.
7. The display panel of claim 1, wherein the display module further comprises a first inflection region, the first inflection region being located at a side of the third support post adjacent to the display region,
And the first bending area is in a bending structure along a first direction perpendicular to the plane of the first sub-flexible substrate and/or along a second direction parallel to the plane of the first sub-flexible substrate, so that after the first bending area and the bending area are bent, the third binding area is positioned at one side of the first sub-flexible substrate away from the display module.
8. An electronic device comprising the display panel according to any one of claims 1 to 7.
9. A method for manufacturing a display panel, comprising:
providing a rigid substrate;
forming a flexible substrate on one side surface of the rigid substrate, wherein the flexible substrate comprises a first sub-flexible substrate and a second sub-flexible substrate, and the second sub-flexible substrate comprises a first wrapping part;
a display module to be packaged is arranged on the surface of one side of the first sub-flexible substrate, which is far away from the rigid substrate;
bending the first wrapping part of the second sub-flexible substrate, so that the first wrapping part wraps at least one side edge of the first sub-flexible substrate far away from the second sub-flexible substrate after bending to form a sealed cavity;
etching or laser to separate the rigid substrate from the flexible substrate;
a first support column which is arranged along a first direction perpendicular to the second sub-flexible substrate is arranged between the edge part of the first sub-flexible substrate and the second sub-flexible substrate;
The display panel further includes: the sealant is positioned between the first wrapping part and the first support column, and at least covers the edge part of the first sub-flexible substrate or the first support column along the first direction;
The display module comprises a first binding area and a second support column, wherein the first binding area is positioned at one side of the first support column close to the display area and between the first support column and the second support column; a second binding area is arranged on one side, far away from the second sub-flexible substrate, of the first sub-flexible substrate, one end of a first wiring extending along the side wall of the wrapping part is electrically connected with the first binding area, and the other end of the first wiring is electrically connected with the second binding area;
Or (b)
The display module comprises a third binding area and a third support column, wherein the third binding area is positioned at one side of the first support column close to the display area and between the first support column and the third support column; a flexible circuit board is arranged on one side, away from the first sub-flexible substrate, of the second sub-flexible substrate, and sealing glue is arranged between the third support column and the first support column; and a through hole penetrating through the second sub-flexible substrate and the sealing adhesive is formed between the first support column and the third support column, and the through hole is filled with conductive adhesive so that the flexible circuit board is electrically connected with the third binding region.
10. The method of manufacturing a display panel according to claim 9, further comprising:
and filling sealant to one side of the first sub flexible substrate close to the first wrapping part.
11. The method of manufacturing a display panel according to claim 9, wherein forming a flexible substrate on a side surface of the rigid substrate comprises:
And forming a first sub-flexible substrate and a second sub-flexible substrate which are integrally connected on one side surface of the rigid substrate.
12. The method of manufacturing a display panel according to claim 11, wherein a first light emitting layer is formed on a side surface of the first sub-flexible substrate away from the rigid substrate, and a first array layer is formed on a side surface of the second sub-flexible substrate away from the rigid substrate.
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| CN1957485A (en) * | 2004-04-02 | 2007-05-02 | 通用电气公司 | Organic electronic packages having sealed edges and methods of manufacturing such packages |
| CN107170374A (en) * | 2017-06-29 | 2017-09-15 | 武汉天马微电子有限公司 | Flexible display panel and flexible display device |
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| US7259449B2 (en) * | 2004-09-27 | 2007-08-21 | Idc, Llc | Method and system for sealing a substrate |
| KR102313366B1 (en) * | 2015-06-17 | 2021-10-18 | 삼성디스플레이 주식회사 | Flexible display device and the fabrication method thereof |
| DE112016005323T5 (en) * | 2015-11-20 | 2018-09-13 | Idex Asa | Electronic sensor carried on a rigid substrate |
| CN108475692B (en) * | 2015-12-28 | 2022-07-22 | 3M创新有限公司 | Flexible electronic device with fluid chamber design |
| CN107863452A (en) * | 2017-11-02 | 2018-03-30 | 武汉华星光电技术有限公司 | Flexible display apparatus |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1957485A (en) * | 2004-04-02 | 2007-05-02 | 通用电气公司 | Organic electronic packages having sealed edges and methods of manufacturing such packages |
| CN107170374A (en) * | 2017-06-29 | 2017-09-15 | 武汉天马微电子有限公司 | Flexible display panel and flexible display device |
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