CN112505923B

CN112505923B - Mainboard and head-mounted equipment

Info

Publication number: CN112505923B
Application number: CN202011273360.0A
Authority: CN
Inventors: 周伟; 王云鹏; 蔡洪侦
Original assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Current assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Priority date: 2020-11-13
Filing date: 2020-11-13
Publication date: 2023-03-21
Anticipated expiration: 2040-11-13
Also published as: CN112505923A

Abstract

The embodiment of the application provides a mainboard and head mounted device, and head mounted device includes: a housing assembly; and the host computer, accept in the casing subassembly, the host computer includes: a main frame; at least one device mounted on the mainframe; and a main board installed on the main frame, the main board including: a main body plate; at least one flexible board, each flexible board can be bent; and at least one auxiliary board, each auxiliary board is connected with the main body board through a soft board; the main body plate is fixed at a target position on the main frame, the at least one flexible plate is bent towards the main frame so that the at least one secondary plate is fixed at the target position on the main frame, and the at least one device is electrically connected with the at least one secondary plate. The head-mounted device of this application embodiment is the mainboard design for the rigid-flex board, extends the soft board on the mainboard and connects the subplate again, and the subplate is bent and is fixed in predetermined position, is favorable to reducing the complexity and the equipment degree of difficulty that are connected used flexible circuit board in peripheral device and mainboard.

Description

Mainboard and head-mounted equipment

Technical Field

The application relates to the technical field of human-computer interaction, in particular to a mainboard and a head-mounted device.

Background

In the existing head-mounted equipment such as AR (augmented Reality)/VR (Virtual Reality), the stacking layout of some mainboards is designed into a whole form, devices needing to be connected with the mainboards on the periphery need to be connected with the mainboards by adopting long and complex flexible circuit boards to turn back for multiple times to be connected with the mainboards, the assembly of the mainboards is simpler, but the difficulty in the assembly of the flexible circuit boards is obviously increased, when a single flexible circuit board cannot be directly connected, the switching of the flexible circuit boards needs to be increased, the transmission impedance is increased, and the reliability of connection is also obviously reduced. And the split is polylith during some mainboard layouts, and then communicates each other to board/zero insertion force connector through flexible circuit board + board, and in this kind of scheme, the board of connecting between each mainboard just can occupy the mainboard space at both ends in a large number to board/zero insertion force connector, not only can increase complete machine volume increase weight, still can increase the impedance, also reduces and connects the reliability.

Disclosure of Invention

The embodiment of the application provides a mainboard and head-mounted equipment, and the mainboard is convenient for be connected with peripheral devices in an assembling manner.

The embodiment of the application provides a main board, including:

a main body plate;

at least one flexible board, each flexible board can be bent; and

and each auxiliary plate is connected with the main body plate through one soft plate.

The embodiment of the application provides a head-mounted device, includes:

a housing assembly; and

the host computer, accept in the casing subassembly, the host computer includes:

a main frame;

at least one device mounted on the mainframe; and

a main board installed on the main chassis, the main board including:

a main body plate;

at least one flexible board, each flexible board can be bent; and

at least one auxiliary plate, each auxiliary plate is connected with the main body plate through one soft plate;

the main body plate is fixed at a target position on the main frame, the at least one flexible plate is bent towards the main frame so that the at least one secondary plate is fixed at the target position on the main frame, and the at least one device is electrically connected with the at least one secondary plate.

The head-mounted device of this application embodiment is the mainboard design for the rigid-flex board, extends the soft board on the mainboard and connects the subplate again, and the subplate is bent and is fixed in predetermined position, is favorable to reducing the complexity and the equipment degree of difficulty that are connected used flexible circuit board in peripheral device and mainboard.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings used in the description of the embodiments will be briefly described below. It is obvious that the drawings in the following description are only some embodiments of the application, and that for a person skilled in the art, other drawings can be derived from them without inventive effort.

For a more complete understanding of the present application and its advantages, reference is now made to the following descriptions taken in conjunction with the accompanying drawings, wherein like reference numerals represent like parts in the following description.

Fig. 1 is a schematic structural diagram of a head-mounted device according to an embodiment of the present application.

Fig. 2 is an exploded schematic view of a head-mounted device according to an embodiment of the present disclosure.

Fig. 3 is a schematic partial structural diagram of the interior of a head-mounted device according to an embodiment of the present application.

Fig. 4 is a schematic diagram of a part of an internal structure of a head-mounted device in one direction according to an embodiment of the present application.

Fig. 5 is a schematic view of a part of the internal structure of the head-mounted device in another direction according to the embodiment of the present application.

Fig. 6 is a schematic structural diagram of the motherboard provided in the embodiment of the present application when the motherboard is flattened.

Fig. 7 is a schematic structural view of the main plate provided in the embodiment of the present application when being bent.

Fig. 8 is a schematic structural diagram of connection between the first fisheye camera and the fourth flexible circuit board provided in the embodiment of the present application.

Fig. 9 is a schematic structural diagram of connection between the second fisheye camera and the fifth flexible circuit board according to the embodiment of the application.

Fig. 10 is a schematic structural diagram of a fourth flexible circuit board provided in an embodiment of the present application in a flattened state.

Fig. 11 is an exploded view of a partial structure of a head-mounted device according to an embodiment of the present disclosure.

Fig. 12 is a schematic structural view of a first temple assembly provided in accordance with an embodiment of the present application in one orientation.

Fig. 13 is an exploded view of a first temple assembly provided in accordance with an embodiment of the present application.

Fig. 14 is a schematic structural view of a first temple assembly provided in an embodiment of the present application in another orientation.

Fig. 15 is a flowchart of an assembly method of a head-mounted device according to an embodiment of the present application.

Fig. 16 is a schematic view illustrating an assembly of a sixth flexible circuit board and a first temple housing according to an embodiment of the present application.

Fig. 17 is a schematic structural diagram of a sixth flexible circuit board according to an embodiment of the present application.

Fig. 18 is a cross-sectional view of a first temple housing provided in accordance with an embodiment of the present application when folded.

Fig. 19 is a cross-sectional view of a first temple shell according to an embodiment of the present application as deployed.

Fig. 20 is a schematic structural view of a second temple assembly provided in accordance with an embodiment of the present application.

Fig. 21 is a schematic view of a portion of a second temple assembly housing according to an embodiment of the present application in one orientation.

Fig. 22 is a schematic view of a portion of a second temple assembly housing according to an embodiment of the present application in another orientation.

Fig. 23 is a schematic structural diagram of a seventh flexible circuit board according to an embodiment of the present application.

Fig. 24 is a schematic partial structural diagram of a head-mounted device according to an embodiment of the present application.

Detailed Description

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. It is to be understood that the embodiments described are only a few embodiments of the present application and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without inventive step, are within the scope of the present application.

Referring to fig. 1 and fig. 2, fig. 1 is a schematic structural diagram of a head-mounted device according to an embodiment of the present disclosure, and fig. 2 is an exploded schematic diagram of the head-mounted device according to the embodiment of the present disclosure. In this embodiment, the head-mounted device 1 may include a housing assembly 10, a support assembly 20 connected to opposite ends of the housing assembly 10, a host 30 housed in the housing assembly 10, and a nose pad assembly 40 mounted on the housing assembly 10. The shell assembly 10, the support assembly 20 and the nose pad assembly 40 can form a frame to facilitate the head-mounted device 1 to be worn on the head of the user, and the weight of the head-mounted device 1 borne by the head of the user is distributed at the support assembly 20 and the nose pad assembly 40.

The head-mounted device 1 may be VR (Virtual Reality) glasses, AR (Augmented Reality) glasses, smart glasses, or the like. In the embodiments of the present application, AR glasses are described as an example.

In the example of AR glasses, the head mounted device 1 may be configured to communicate data to and receive data from an external processing device through a signal connection, which may be a wired connection, a wireless connection, or a combination thereof.

However, in other cases, the head mounted device 1 may be used as a stand-alone device, i.e. data processing is performed in the head mounted device 1 itself. The signal connection may be configured to carry any kind of data, such as image data (e.g., still images and/or full motion video, which may include 2D and 3D images), audio, multimedia, voice, and/or any other type of data. The external processing device may be, for example, a gaming console, a personal computer, a tablet computer, a smart phone, or other type of processing device. The signal connection may be, for example, a Universal Serial Bus (USB) connection, a Wi-Fi connection, a bluetooth or Bluetooth Low Energy (BLE) connection, an ethernet connection, a cable connection, a DSL connection, a cellular connection (e.g., 3G, LTE/4G, or 5G), or the like, or combinations thereof. Additionally, the external processing device may communicate with one or more other external processing devices via a network, which may be or include, for example, a Local Area Network (LAN), a Wide Area Network (WAN), an intranet, a Metropolitan Area Network (MAN), the global internet, or a combination thereof.

The housing assembly 10 of the head mounted device 1 may mount display assemblies, optics, sensors, processors, and the like. In the example of AR glasses, the display component is designed to overlay an image on the user's view of their real-world environment, for example, by projecting light into the user's eyes. The head mounted device 1 may also include an ambient light sensor, and may also include electronic circuitry to control at least some of the above-described components and perform associated data processing functions. The electronic circuitry may include, for example, one or more processors and one or more memories.

Referring to fig. 2, in the present embodiment, the housing assembly 10 may include a first housing 11, a second housing 12 located inside the first housing 11 and engaged with the first housing 11 by fastening, a mask 13 covering the outside of the first housing 11, and a decoration 14 surrounding an outer surface of the first housing 11 not covered by the mask 13. An accommodating space is formed between the first casing 11 and the second casing 12, and the host 30 is accommodated in the accommodating space between the first casing 11 and the second casing 12 of the casing assembly 10.

In the embodiment of the application, the inner side is the side close to the head of the user when the head-mounted device 1 is worn on the head of the user; the outer side is the side of the head mounted device 1 away from the user's head when worn on the user's head.

Referring to fig. 3, fig. 3 is a schematic view of a partial structure inside a head-mounted device according to an embodiment of the present application. In this embodiment, the support assembly 20 includes a first temple 210 and a second temple 220, the first temple 210 and the second temple 220 are respectively connected to the sides of both sides of the case assembly 10, and the first temple 210 and the second temple 220 allow the head-mounted device 1 to be worn on both ears of a user. Specifically, the first temple 210 and the second temple 220 are respectively connected to the sides of the first casing 11 on both sides. It should be understood that a connection structure may also be provided on the second casing 12 or other components of the casing assembly 10 such that the first and

second temples

210 and 220 are connected with the sides of both sides of the second casing 12 or other components of the casing assembly 10, respectively.

Referring to fig. 4 to 7, fig. 4 is a schematic view of a partial internal structure of a head-mounted device provided in an embodiment of the present application in one direction, fig. 5 is a schematic view of a partial internal structure of a head-mounted device provided in an embodiment of the present application in another direction, fig. 6 is a schematic view of a main board provided in an embodiment of the present application in a flat state, and fig. 7 is a schematic view of a main board provided in an embodiment of the present application in a bent state. In this embodiment, the host 30 may include a main chassis 100, at least one device mounted on the main chassis 100, and a main board 300. The main board 300 includes a main body board 310, at least one flexible board 320, and at least one sub-board 330. Each flexible board 320 can be bent, and each secondary board 330 is connected with the main body board 310 through a flexible board 320.

In the embodiments of the present application, the devices include but are not limited to: the device comprises an optical machine, a fisheye camera, a fan, a photosensitive sensor, an inertia measurement unit and the like. The main body board 310 and the at least one sub board 330 may be a PCB (printed circuit board), and the at least one flexible board 320 may be an FPC (flexible circuit board).

The main body plate 310 is fixed to a target position on the main frame 100, the at least one flexible plate 320 is bent toward the main frame 100 to fix the at least one sub-plate 330 to the target position on the main frame 100, and the at least one device is electrically connected to the at least one sub-plate 330.

It should be understood that one device may be electrically connected to one sub-board 330, multiple devices may be electrically connected to one sub-board 330, or other suitable corresponding connection relationships may also be used, and the embodiments of the present application are not limited thereto.

In the embodiment of the application, the main board is designed into the rigid-flex board, the flexible board is extended from the main board and then connected with the auxiliary board, and the auxiliary board is bent and fixed at a preset position, so that the complexity and the assembly difficulty of the flexible circuit board used for connecting the peripheral devices and the main board can be reduced.

In some embodiments, as shown in fig. 4 and 5, the body plate 310 is fixed above the main frame 100.

Referring to fig. 5, in some embodiments, at least one device includes a distance sensor, a re-starter, and a fan, the distance sensor, the re-starter, and the fan are located at a middle portion of the main chassis 100, and the distance sensor, the re-starter, and the fan are electrically connected to the main body panel 310 through the first flexible circuit board 400. Specifically, the first flexible circuit board 400 is electrically connected to the front surface of the main body board 310 through a connector, which may be a board-to-board connector or a zero insertion force connector.

In some embodiments, one end of the first flexible circuit board 400 is connected to the left side of the front surface of the main body plate 310, then extends to the inner side of the main body plate 310 along the inner side of the main body plate 310, then bends down to the middle of the main chassis 100, and then bends to the right and is connected to the distance sensor, the re-starter, and the fan, respectively.

In the embodiment of the application, the left side is the side close to the left hand of the user when the head-mounted device 1 is worn on the head of the user; the right side is the side of the head mounted device 1 that is close to the user's right hand when worn on the user's head.

Referring to fig. 5, in some embodiments, the at least one device includes a first optical machine 500 and a second optical machine 600, the first optical machine 500 and the second optical machine 600 are respectively fixed on the left side and the right side of the main frame 100, and the first optical machine 500 and the second optical machine 600 are respectively electrically connected to the main body board 310 through a second flexible circuit board 700 and a third flexible circuit board 800. Specifically, the second flexible circuit board 700 and the third flexible circuit board 800 are electrically connected to the front surface of the main body board 310 through a connector, which may be a board-to-board connector or a zero insertion force connector.

In some embodiments, one end of the second flexible circuit board 700 is connected to the left side of the front surface of the main body plate 310, extends inward along the main body plate 310 to the inner side of the main body plate 310, and is then bent downward to the middle of the main chassis 100 to be connected to the first optical machine 500. One end of the third flexible circuit board 800 is connected to the right side of the front surface of the main body plate 310, extends to the inner side of the main body plate 310 along the inner side of the main body plate 310, and is bent downward to the middle of the main frame 100 to be connected to the second optical unit 600.

Referring to fig. 4-7, in some embodiments, the main body plate 310 includes a main body portion 311, a first branch portion 312 and a second branch portion 313, the first branch portion 312 is connected to a left corner of the inner side of the main body portion 311, and the second branch portion 313 is connected to a right corner of the inner side of the main body portion 311. The second flexible circuit board 700 and the third flexible circuit board 800 are connected to the first branch portion 312 and the second branch portion 313, respectively. By optimizing the makeup mode of the mainboard, the area can be reduced, and the cost is reduced.

Referring to fig. 6 and 7, in some embodiments, the at least one flexible board 320 includes a first flexible board 321 and a second flexible board 322, the at least one secondary board 330 includes a first secondary board 331 and a second secondary board 332, and the first secondary board 331 and the second secondary board 332 are respectively connected to the inner side edge of the main body board 310 at intervals through the first flexible board 321 and the second flexible board 322.

Preferably, the first sub-panel 331 is connected to the left corner inside the first branch portion 312 through the first soft panel 321, and the second sub-panel 332 is connected to the right corner inside the second branch portion 313 through the second soft panel 322. By optimizing the makeup mode of the mainboard, the area can be reduced, and the cost can be reduced.

Referring to fig. 5, 8 and 9, fig. 8 is a schematic structural diagram of a connection between a first fisheye camera and a fourth flexible circuit board according to an embodiment of the present disclosure, and fig. 9 is a schematic structural diagram of a connection between a second fisheye camera and a fifth flexible circuit board according to an embodiment of the present disclosure. In this embodiment, the first and second

soft plates

321 and 322 are bent toward the main frame 100 to fix the first and

second sub-plates

331 and 332 at target positions inside the main frame 100. At least one device includes first fisheye camera 900 and second fisheye camera 1000, and first fisheye camera 900 and second fisheye camera 1000 are fixed respectively in the left end and the right-hand member of main frame 100, and first fisheye camera 900 is connected with first subplate 331 through fourth flexible circuit board 1100 electricity, and second fisheye camera 1000 is connected with second subplate 332 electricity through fifth flexible circuit board 1200. Specifically, the fourth flexible circuit board 1100 is electrically connected to the front surface of the first sub-board 331 through a connector, which may be a board-to-board connector or a zero insertion force connector; the fifth flexible circuit board 1200 is electrically connected to the front surface of the second sub-board 332 through a connector, which may be a board-to-board connector or a zero insertion force connector.

The fourth flexible circuit board 1100 includes a first connection section 1110, a first extension section 1120, a second extension section 1130, and a second connection section 1140 that are sequentially bent and connected, the first connection section 1110 is electrically connected to the first fisheye camera 900, the first extension section 1120 is attached to an inner side surface of the first fisheye camera 900, the second extension section 1130 is attached to a left side surface of the first optical engine 500, and the second connection section 1140 is electrically connected to the first sub-board 331.

The fourth flexible circuit board 1100 is connected to the first fisheye camera 900 through the first connection section 1110 and bent to the inner side surface of the first fisheye camera 900, then attached to the inner side surface of the first fisheye camera 900 through the first extension section 1120, extended and bent to the left side surface of the first optical machine 500, attached to the left side surface of the first optical machine 500 through the second extension section 1130, extended and bent to the inner side surface of the first optical machine 500, and then electrically connected to the first sub-board 331 through the second connection section 1140.

In this embodiment, the fourth flexible circuit board 1100 has successfully avoided the heat dissipation air duct 1300 through the above-mentioned line of buckling, avoids sheltering from the heat dissipation air duct 1300, has also avoided the set screw in the lower left corner of the first optical engine 500 and the set screw of the mainboard 300, and the equipment of the fourth flexible circuit board 1100 of being convenient for can not influence the heat dispersion of the head-mounted device 1 in addition.

Referring to fig. 10, fig. 10 is a schematic structural diagram of a fourth flexible circuit board in a flattened state according to an embodiment of the present application. In this embodiment, the fourth flexible circuit board 1100 is composed of a first portion 1150 and a second portion 1160 which are bent at a right angle, the first portion 1150 is bent to form a first connecting section 1110 and a first extending section 1120, and the second portion 1160 is bent to form a second extending section 1130 and a second connecting section 1140. Therefore, only one flexible circuit board bent at a right angle is processed and then bent to obtain the fourth flexible circuit board 1100, and the fourth flexible circuit board is simple to process and low in cost.

Symmetrically, the fifth flexible circuit board 1200 includes a third connection segment 1210, a third extension segment 1220, a fourth extension segment 1230 and a fourth connection segment 1240 that are sequentially bent and connected, the third connection segment 1210 is electrically connected to the second fisheye camera 1000, the third extension segment 1220 is attached to the inner side surface of the second fisheye camera 1000, the fourth extension segment 1230 is attached to the right side surface of the second optical engine 600, and the fourth connection segment 1240 is electrically connected to the second sub-board 332.

Referring to fig. 6 and 7, in some embodiments, the at least one soft plate 320 includes a third soft plate 323, the at least one secondary plate 330 includes a third secondary plate 333, the third secondary plate 333 is connected to the outer side of the main body plate 310 through the third soft plate 323, and specifically, the third secondary plate 333 is connected to the left side of the outer side of the main body plate 310 through the third soft plate 323.

Preferably, the third sub plate 333 is connected to the left corner of the outside of the main body 311 by the third soft plate 323. By optimizing the makeup mode of the mainboard, the area can be reduced, and the cost can be reduced.

Referring to fig. 4 and 11-14, fig. 11 is an exploded view of a portion of a structure of a head-mounted device according to an embodiment of the present disclosure, fig. 12 is a schematic view of a structure of a first temple assembly according to an embodiment of the present disclosure in one direction, fig. 13 is an exploded view of the first temple assembly according to an embodiment of the present disclosure, and fig. 14 is a schematic view of a structure of the first temple assembly according to an embodiment of the present disclosure in another direction. In the embodiment of the present application, the third soft plate 323 is bent toward the main frame 100 to fix the third sub-plate 333 at a target position outside the main frame 100. First temple arm 210 is configured as a first temple arm assembly 1600, first temple arm assembly 1600 including a first temple arm housing 1610, an interface 1400, and a sixth flexible circuit board 1500. The front end of first temple housing 1610 is connected to the side of housing assembly 10, and in particular, the front end of first temple housing 1610 is connected to the left side of first housing 11 such that headset 1 can be worn at the user's ear through first temple housing 1610, and the rear end of first temple housing 1610 is provided with opening 1611. The interface 1400 is secured within the first temple housing 1610 and is positioned at the opening 1611 of the first temple housing 1610. The sixth flexible circuit board 1500 includes a first front portion 1510 and a first rear portion 1520, the first front portion 1510 is located outside the first temple housing 1610, a front end of the first front portion 1510 is electrically connected to the main board 300 through a connector, and in particular, a front end of the first front portion 1510 is electrically connected to the third sub-board 333 through a connector, the first rear portion 1520 is fixedly mounted in the first temple housing 1610, and a rear end of the first rear portion 1520 is connected to the interface 1400.

In the present embodiment, the front end of the first temple housing 1610 is the end of the first temple housing 1610 that is closer to the housing assembly 10, and the rear end of the first temple housing 1610 is the end of the first temple housing 1610 that is farther from the housing assembly 10. The front/front end of the sixth flexible circuit board 1500 is a portion/end close to the main board 300, and the rear/rear end of the sixth flexible circuit board 1500 is a portion/end far from the main board 300.

Preferably, the interface 1400 is a Type-C interface. It should be understood that interface 1400 may be other types of interfaces as well.

In the embodiment, the first rear portion 1520 of the sixth flexible circuit board 1500 is mounted in the first temple housing 1610, the first front portion 1510 of the sixth flexible circuit board 1500 is electrically connected to the main board 300 through a connector, so as to connect the wires of the first temple assembly 1600 to the main board 300, the rear end of the first rear portion 1520 of the sixth flexible circuit board 1500 is connected to the interface 1400, and the connector of the data wire can be inserted into the opening 1611 of the first temple housing 1610 to be electrically connected to the interface 1400, so that the connection of the terminal device to the wires of the first temple assembly 1600 can be realized, and the terminal device can then provide signal and power connection to the main board 300 through the interface 1400 and the sixth flexible circuit board 1500.

The terminal device includes, but is not limited to, a mobile or fixed terminal such as a mobile phone, a tablet computer, a notebook computer, a handheld computer, and the like.

The head mounted device 1 of the embodiment of the application establishes the connection circuit between the main board 300 and the terminal device through the sixth flexible circuit board 1500, so that the weight of the head mounted device 1 can be reduced, and the user wears the head mounted device and is good in use portability. And the first rear portion 1520 of the sixth flexible circuit board 1500 is mounted in the first temple housing 1610, the front portion 1510 of the sixth flexible circuit board 1500 can be protected by the visor 13, the connection circuit is not easily broken, and thus, the life span is long and the reliability of the connection is good.

Referring to fig. 11-14, in some embodiments, first temple housing 1610 includes a first temple inner housing 1611 and a first temple outer housing 1612, and first temple inner housing 1611 is assembled with and fixedly attached to first temple outer housing 1612 to form first temple housing 1610.

In the embodiment of the present application, the first temple housing 1610 is formed by fixedly splicing the two housings of the first temple inner housing 1611 and the first temple outer housing 1612, so that the rear portion 1520 of the sixth flexible circuit board 1500 is fixedly mounted in the first temple housing 1610, and when the sixth flexible circuit board 1500 is fixedly connected to the first temple housing 1610 to form the first temple assembly 1600, the rear portion 1520 is fixedly mounted in the first temple inner housing 1611, and the first temple outer housing 1612 is fixedly spliced with the first temple inner housing 1611, so that the rear portion 1520 of the sixth flexible circuit board 1500 is fixedly mounted in the first temple inner housing 1610, and the assembly of the temple is simple.

In the illustrated embodiment, first temple inner housing 1611 is the housing proximate to the side of the user's head when first temple housing 1610 is worn on the user's ear, and first temple outer housing 1612 is the housing facing away from the side of the user's head when first temple housing 1610 is worn on the user's ear.

It should be appreciated that when the sixth flexible circuit board 1500 is mounted and attached to the first temple housing 1610 to form the first temple assembly 1600, the rear portion 1520 may also be fixedly mounted within the first temple housing 1612 and then the first temple inner housing 1611 may be fixedly attached to the first temple housing 1612 in a split manner to fixedly mount the rear portion 1520 of the sixth flexible circuit board 1500 within the first temple housing 1610.

Referring to fig. 11 to 14, in some embodiments, a first rotation shaft 1613 is disposed at a front end of the first temple housing 1610, a first connection frame 110 is disposed at a side of the housing assembly 10, specifically, the first connection frame 110 is disposed at a side of the first housing 11, and the first rotation shaft 1613 at the front end of the first temple housing 1610 is rotatably connected to the first connection frame 110. Thus, first temple housing 1610 may not only be clipped to a user's ear to facilitate the user wearing headset 1, but may also be rotated on housing assembly 10 to fold up for the user carrying headset 1.

It should be understood that the first temple housing 1610 may be rotatably connected to the housing assembly 10 in other manners as long as the function that the first temple housing 1610 can be rotated on the housing assembly 10 to be folded is ensured, and the embodiment of the present application is not limited thereto.

It should be understood that first temple housing 1610 may also be fixedly connected to housing assembly 10, and that first temple housing 1610 need only be capable of being clipped to a user's ear for the user to wear headset 1, and that headset 1 is placed in a stationary location and used when desired by the user wearing headset 1 through first temple housing 1610.

Referring to fig. 11 to 14, in some embodiments, the first temple housing 1610 defines a first channel 1617 at the first rotation axis 1613, the first front portion 1510 is connected to the first rear portion 1520 at an outlet of the first channel 1617, that is, the first temple housing 1610 defines a channel through which the sixth flexible circuit board 1500 can pass, so that the first rear portion 1520 of the sixth flexible circuit board 1500 can be disposed inside the first temple housing 1610 for routing, and the first front portion 1510 of the sixth flexible circuit board 1500 is located outside the first temple housing 1610, so as to be connected to the main board 300. The first connecting frame 110 is formed with a first through hole 111 capable of communicating with the first channel 1617, and the first front portion 1510 passes through the first through hole 111 and is connected to the motherboard 300.

In the embodiment of the present application, the first channel 1617 through which the sixth flexible circuit board 1500 can pass is disposed at the first rotating shaft 1613 at the front end of the first temple housing 1610, and the first connecting frame 110 is provided with the first via 111 communicating with the first channel 1617, the first front portion 1510 of the sixth flexible circuit board 1500 passes through the first via 111 to be connected with the main board 300, so that the sixth flexible circuit board 1500 can be routed inside the first temple housing 1610 and on the housing assembly 10, so that the whole head-mounted device 1 is compact and beautiful, the first rear portion 1520 of the sixth flexible circuit board 1500 can be protected by the first temple housing 1610, the first front portion 1510 of the sixth flexible circuit board 1500 can be protected by the face mask 13, the sixth flexible circuit board 1500 cannot expose out of the shell of the head-mounted device 1, and the connecting circuit is not easily damaged, thereby having a long service life and good reliability of connection.

Referring to fig. 3, 4, 11 and 14, in some embodiments, the front end of the first front portion 1510 is electrically connected to the main board 300 through a board-to-board connector, the front end of the first front portion 1510 is provided with a first male terminal 1511 of the board-to-board connector, the main board 300 is provided with a first female terminal 340 of the board-to-board connector, and specifically, the third sub-board 333 of the main board 300 is provided with the first female terminal 340 of the board-to-board connector, and the first male terminal 1511 is connected to the first female terminal 340 in a snap-fit manner. Therefore, when the sixth flexible circuit board 1500 of the first temple assembly 1600 is connected to the main board 300, it is only necessary to engage the first male terminal 1511 at the front end of the first front portion 1510 with the first female terminal 340 on the main board 300, which can further improve the ease of assembling the head-mounted device 1.

It should be understood that the positions of the male and female terminals of the board-to-board connector on the first front portion 1510 and the third sub-board 333 of the main board 300 can be interchanged, that is, the female terminal of the board-to-board connector is disposed at the front end of the first front portion 1510, the male terminal of the board-to-board connector is disposed on the third sub-board 333 of the main board 300, and the male terminal and the female terminal are snap-connected to electrically connect the sixth flexible circuit board 1500 of the first temple assembly 1600 with the main board 300.

It should be understood that the front end of the first front portion 1510 and the motherboard 300 may be electrically connected through other connectors, such as a zero insertion force connector, a zero insertion force connector may be disposed on the motherboard 300, and when the sixth flexible circuit board 1500 is connected to the motherboard 300, the sixth flexible circuit board 1500 may be installed in the zero insertion force connector.

Referring to fig. 15, fig. 15 is a flowchart of an assembly method of a head-mounted device according to an embodiment of the present application. In the embodiment of the present application, as shown in fig. 3, 4, 11, and 14, the method for assembling the head-mounted device includes the following steps:

in step 001, a first temple housing 1610, an interface 1400 and a sixth flexible circuit board 1500 are provided, the rear end of the first temple housing 1610 being provided with an opening 1611, the sixth flexible circuit board 1500 comprising a first front portion 1510 and a first rear portion 1520.

In step 002, the interface 1400 is secured within the first temple housing 1610 and positioned at the opening 1611 of the first temple housing 1610, the first rear portion 1520 is fixedly mounted within the first temple housing 1610 with the first front portion 1510 positioned outside of the first temple housing 1610, and the rear end of the first rear portion 1520 is connected to the interface 1400 to form the first temple assembly 1600.

The first rear portion 1520 of the sixth flexible circuit board 1500 is disposed within the first temple housing 1610 for routing and the first front portion 1510 of the sixth flexible circuit board 1500 is located outside of the first temple housing 1610 for enabling connection with the main board 300. The interface 1400 is located at the opening 1611 of the first temple housing 1610 to facilitate insertion of a connector of a data cable into the opening 1611 of the first temple housing 1610 for electrical connection with the interface 1400.

In step 003, a housing assembly 10 is provided, the housing assembly 10 containing the motherboard 300 therein.

In step 004, the front end of the first front portion 1510 is electrically connected to the main board 300 through a connector, and the front end of the first temple housing 1610 is connected to the side of the housing assembly 10 to complete the installation of the first temple assembly 1600.

Specifically, the front end of the first front portion 1510 and the third sub-plate 333 of the main board 300 are electrically connected by a connector.

According to the method for assembling the headset of the embodiment of the application, the first rear part 1520 of the sixth flexible circuit board 1500 is fixedly mounted in the first temple housing 1610 to form the first temple assembly 1600, then the first front part 1510 of the sixth flexible circuit board 1500 is electrically connected with the main board 300 through the connector, and then the first temple housing 1610 is connected with the housing assembly 10 to complete the assembly of the first temple assembly 1600, so that the assembly is simple and convenient, and the production efficiency is high.

Referring to fig. 12 and 13, in some embodiments, in step 001, a first temple housing 1610 is provided, which includes a first temple inner housing 1611 and a first temple outer housing 1612, wherein the first temple inner housing 1611 can be assembled with the first temple outer housing 1612 and fixedly connected to form the first temple housing 1610.

Referring to fig. 16, fig. 16 is a schematic view illustrating an assembly of a sixth flexible circuit board and a first temple shell according to an embodiment of the present application. In step 002, fixedly mounting the first rear portion 1520 within the first temple housing 1610 includes the steps of: the first rear portion 1520 is fixedly mounted within the first temple inner housing 1611 and the first temple outer housing 1612 is engaged with and fixedly attached to the first temple inner housing 1611.

Optionally, the manner in which the first rear portion 1520 is fixedly mounted within the first temple housing 1610 includes, but is not limited to: screw fixation, clamping fixation, bonding or welding and the like.

Optionally, the manner in which first temple outer casing 1612 is fixedly attached to first temple inner casing 1611 includes, but is not limited to: screw fixation, clamping fixation, bonding or welding and the like.

In the embodiment of the present application, when the sixth flexible circuit board 1500 is mounted and connected to the first temple housing 1610 to form the first temple assembly 1600, the first rear portion 1520 may be first fixedly mounted in the first temple inner housing 1611, and then the first temple outer housing 1612 is fixed to the first temple inner housing 1611 in an assembled manner, so that the first rear portion 1520 of the sixth flexible circuit board 1500 may be conveniently fixedly mounted in the first temple housing 1610, and the ease of assembling the headset 1 is further improved.

It should be appreciated that when the sixth flexible circuit board 1500 is mounted within the first temple housing 1610 to form the first temple assembly 1600, the first rear portion 1520 may also be fixedly mounted within the first temple housing 1612 and then the first temple inner housing 1611 may be fixedly attached to the first temple housing 1612 in a split manner to fixedly mount the first rear portion 1520 of the sixth flexible circuit board 1500 within the first temple housing 1610.

Referring to fig. 11-14, in some embodiments, in step 001, a first temple housing 1610 is provided, which includes a first rotating shaft 1613 disposed at a front end thereof, and the first temple housing 1610 defines a first channel 1617 at the first rotating shaft 1613, which is in communication with a first inner cavity 1616 of the first temple housing 1610.

In step 003, the housing assembly 10 is provided to include a first connecting frame 110 disposed at a side thereof, and the first connecting frame 110 is provided with a first via hole 111.

In step 004, electrically connecting the front end of the first front portion 1510 with the main board 300 through the connector includes the steps of: the first front portion 1510 is connected to the main board 300 through the first via hole 111.

In step 004, connecting the front end of the first temple housing 1610 with the side of the housing assembly 10 comprises the steps of: the first rotary shaft 1613 is rotatably connected to the first link frame 110, and the first passage 1617 is communicated with the first via hole 111.

In the embodiment of the present application, the first channel 1617 through which the sixth flexible circuit board 1500 can pass is disposed at the rotating shaft 3030 at the front end of the temple housing 3000, the connecting frame 1100 is provided with the first via 111 communicating with the first channel 1617, the first front portion 1510 of the sixth flexible circuit board 1500 passes through the first via 111 to be connected with the main board 300, so that the sixth flexible circuit board 1500 can be routed inside the first temple housing 1610 and on the housing assembly 10, the whole head-mounted device 1 is compact and beautiful, the first rear portion 1520 of the sixth flexible circuit board 1500 can be protected by the first temple housing 1610, the first front portion 1510 of the sixth flexible circuit board 1500 can be protected by the face mask 13, the sixth flexible circuit board 1500 does not expose the housing of the head-mounted device 1, the connecting circuit is not easily damaged, and thus the connecting circuit has a long service life and good reliability. Furthermore, the first rotating shaft 1613 of the front end of the first temple housing 1610 is rotatably connected to the first connecting frame 110, and the first temple housing 1610 can be not only held at the ear of the user to facilitate the user to wear the head-mounted device 1, but also rotated on the main frame 100 to be folded up, thereby facilitating the user to carry the head-mounted device 1.

Referring to fig. 3, 4, 11 and 14, in some embodiments, in step 001, a sixth flexible circuit board 1500 is provided that includes a first male terminal 1511 of a board-to-board connector disposed at a front end of the first front portion 1510. In step 003, the main board 300 is provided with a first female terminal 340 of a board-to-board connector, and specifically, the third sub-board 333 of the main board 300 is provided with the first female terminal 340 of the board-to-board connector. In step 004, electrically connecting the front end of the first front portion 1510 with the main board 300 through the connector includes the steps of: the first male terminal 1511 of the board-to-board connector at the front end of the first front portion 1510 is snap-fit connected to the first female terminal 340 of the board-to-board connector on the main board 300.

In the embodiment of the present application, when the sixth flexible circuit board 1500 of the first temple assembly 1600 is connected to the main board 300, only the first male terminal 1511 at the front end of the first front portion 1510 needs to be buckled to the first female terminal 340 on the main board 300, so that the convenience of assembling the head-mounted device 1 can be further improved.

Referring to fig. 3, 4 and 11, in some embodiments, the first front portion 1510 extends on an outer side surface of the first housing 11, a front end of the first front portion 1510 passes through the first housing 11 at a position on the first housing 11 opposite to the main board 300 and is electrically connected to the main board 300, specifically, an opening is provided on the first housing 11 at a position opposite to the third sub-board 333 of the main board 300, and a front end of the first front portion 1510 passes through the opening and is electrically connected to the third sub-board 333 of the main board 300.

In this application embodiment, the sixth flexible circuit board of head-mounted device has directly saved the switching platelet from interface connection to mainboard, simple structure, and the sixth flexible circuit board of being convenient for assemble, sixth flexible circuit board occupy spectacle frame both sides space very seldom, has saved the structure and has piled up the space, can avoid the inboard heat dissipation wind channel of casing subassembly moreover, and heat dissipation wind channel does not receive flexible circuit board's influence completely.

Referring to fig. 17, fig. 17 is a schematic structural diagram of a sixth flexible circuit board according to an embodiment of the present application. In some embodiments, as shown in fig. 3, 4 and 11, the first front portion 1510 includes a fifth connecting segment 1512, a first bending segment 1513 and a sixth connecting segment 1514 connected in series, where the fifth connecting segment 1512 is located in the middle of the outside of the first housing 11 and electrically connected to the main board 300, specifically, the fifth connecting segment 1512 is located in the middle of the outside of the first housing 11 and electrically connected to the third sub-board 333 of the main board 300, the first bending segment 1513 bypasses the first through hole 910 on the first housing 11 opposite to the first fisheye camera 900, the sixth connecting segment 1514 is located on the side of the housing assembly 10 and connected to the front end of the first rear portion 1520, and specifically, the sixth connecting segment 1514 is located on the side of the first housing 11 and connected to the front end of the first rear portion 1520.

In this embodiment, the first front portion 1510 bypasses the first through hole 910 of the first housing 11 opposite to the first fisheye camera 900 from the side of the housing assembly 10, and then goes to the middle of the outside of the housing assembly 10 to be electrically connected to the motherboard 300, thereby facilitating the assembly of the sixth flexible circuit board 1500.

In some embodiments, as shown in fig. 3, 4, 11, and 17, the first bending section 1513 includes a first sub-section 1515, a second sub-section 1516, and a third sub-section 1517 sequentially connected in series, the second sub-section 1516 is located at the top of the first housing 11, the first sub-section 1515 is bent downward to connect with the fifth connecting section 1512, and the third sub-section 1517 is bent downward to connect with the sixth connecting section 1514.

Referring to fig. 3, 4 and 11, in some embodiments, the first housing 11 is provided with a first wire groove 120 on an outer side thereof, and at least a portion of the first front portion 1510 is fixedly mounted in the first wire groove 120. Therefore, after the first temple assembly 1600 is assembled with the first housing 11, at least a portion of the first front portion 1510 can be fixedly embedded in the first wire chase 120, so that the headset 1 is compact, the first front portion 1510 can be fixedly protected in the first wire chase 120 and is not affected by dragging, the connection between the first front portion 1510 and the main board 300 is stable and reliable, the service life of the connection circuit of the headset 1 can be further prolonged, and the reliability of the electrical connection can be improved.

Referring to fig. 18 and 19, fig. 18 is a sectional view of a folded first temple housing according to an embodiment of the present application, and fig. 19 is a sectional view of an unfolded first temple housing according to an embodiment of the present application. In some embodiments, sixth connection 1514 is straightened when first pivot 1613 is rotated on first attachment frame 110 to fold first temple housing 1610. Sixth connection section 1514 is bent when first pivot 1613 is rotated on first link 110 to unfold first temple housing 1610.

In this embodiment, the sixth connecting segment 1514 can be bent redundantly, and the sixth flexible circuit board 1500 is not easily broken or snapped when the first temple housing 1610 is folded or unfolded.

In some embodiments, the sixth connection section 1514 of the sixth flexible circuit board 1500 is a multi-layer structure, and thus is more flexible, has a smaller minimum radius of bending, and can be bent multiple times without breaking. The number of layers of other portions of the sixth flexible circuit board 1500 is less than that of the sixth connecting section 1514, so that the processing difficulty and cost can be reduced.

In some embodiments, as shown in fig. 4, 13-16, and 19, the sixth connecting segment 1514 includes a fourth sub-segment 1518 and a fifth sub-segment 1519 connected in series, and in particular, the fourth sub-segment 1518 is connected to the third sub-segment 1517, and the fifth sub-segment 1519 is connected to the front end of the first rear portion 1520. The fourth sub-segment 1518 and the fifth sub-segment 1519 are straightened when the first pivot 1613 is rotated on the first attachment frame 110 to fold the first temple housing 1610. The fourth sub-segment 1518 is bent into an S-shape opposite the fifth sub-segment 1519 when the first pivot 1613 is rotated on the first link frame 110 to deploy the first temple housing 1610.

In this embodiment, the fifth sub-segment 1519 may have a dislocation phenomenon in the middle of each layer due to the thickness during the bending process, and the dislocation length between each layer is compensated by reversely bending the fourth sub-segment 1518 and the fifth sub-segment 1519.

In some embodiments, as shown in fig. 20, the first housing 11 is provided with a first groove 130 at a side thereof, and the fourth sub-segment 1518 can be accommodated in the first groove 130 when being bent. Meanwhile, the protruding structure between the first via hole 111 and the first groove 130 on the first housing 11 can bend the fifth sub-segment 1519 and the fourth sub-segment 1518 in opposite directions.

Referring to fig. 6 and 7, in some embodiments, the at least one flexible board 320 includes a fourth flexible board 324, the at least one secondary board 330 includes a fourth secondary board 334, the fourth secondary board 334 is connected to the outer side of the main body board 310 through the fourth flexible board 324, and in particular, the fourth secondary board 334 is connected to the right side of the outer side of the main body board 310 through the fourth flexible board 324.

Preferably, the fourth sub-panel 334 is connected to the right corner of the outer side of the main body portion 311 by the fourth soft panel 324. By optimizing the makeup mode of the mainboard, the area can be reduced, and the cost can be reduced.

Referring to fig. 4 and 20-23, fig. 20 is a schematic structural diagram of a second temple assembly according to an embodiment of the present application, fig. 21 is a schematic structural diagram of a portion of a second temple assembly casing according to an embodiment of the present application in one direction, fig. 22 is a schematic structural diagram of a portion of the second temple assembly casing according to an embodiment of the present application in another direction, and fig. 23 is a schematic structural diagram of a seventh flexible circuit board according to an embodiment of the present application. In the embodiment of the present application, the fourth flexible board 324 is bent toward the main frame 100 to fix the fourth sub-board 334 at a target position outside the main frame 100. Second temple 220 is configured as a second temple assembly 2100, second temple assembly 2100 comprising a second temple housing 2110, a microphone 1700, a speaker 1900, and a seventh flexible circuit board 2000. The front end of the second temple housing 2110 is connected to the side of the housing assembly 10, and in particular, the front end of the second temple housing 2110 is connected to the right side of the first housing 11, so that the head mounted device 1 can be worn on the ear of the user through the second temple housing 2110. Microphone 1700 and speaker 1900 are secured within second temple housing 2110. Seventh flexible circuit board 2000 includes a second front portion 2010 and a second rear portion 2020, second front portion 2010 is located outside second temple housing 2110, a front end of second front portion 2010 is electrically connected to main board 300 through a connector, specifically, a front end of second front portion 2010 is electrically connected to fourth sub-board 334 through a connector, second rear portion 2020 is fixedly mounted in second temple housing 2110, second rear portion 2020 is provided with touch pad 1800, and microphone 1700 and speaker 1900 are connected to second rear portion 2020.

In the embodiment of the present application, the front end of the second temple housing 2110 is an end of the second temple housing 2110 close to the housing assembly 10, and the rear end of the second temple housing 2110 is an end of the second temple housing 2110 far from the housing assembly 10. The front/front end of the seventh flexible circuit board 2000 is a portion/end close to the main board 300, and the rear/rear end of the seventh flexible circuit board 2000 is a portion/end far from the main board 300.

In the embodiment of the application, the microphone, the touch pad and the loudspeaker are arranged in the second glasses leg shell, the microphone, the touch pad and the loudspeaker are electrically connected with the main board through the seventh flexible circuit board, and the structural layout and the circuit layout are simple.

Referring to fig. 21-23, in the present embodiment, the second rear portion 2020 includes a main body sub-portion 2021, a first connector sub-portion 2022, a second connector sub-portion 2023, a first sub-portion 2024, and a second sub-portion 2025. The front end of the main body sub-portion 2021 is connected to the rear end of the second front portion 2010, and the touch pad 1800 is provided on the rear end of the main body sub-portion 2021. The first sub-portion 2024 and the second sub-portion 2025 are connected to two opposite sides of the main sub-portion 2021 by the first sub-portion 2022 and the second sub-portion 2023 being staggered, respectively, the first sub-portion 2022 and the second sub-portion 2023 being bent toward the inner side of the main sub-portion 2021 to make the first sub-portion 2024 and the second sub-portion 2025 staggered and arranged on the inner side of the main sub-portion 2021, the microphone 1700 includes a first microphone 1710 and a second microphone 1720, and the first microphone 1710 and the second microphone 1720 are connected to the outer sides of the first sub-portion 2024 and the second sub-portion 2025, respectively. The speaker 1900 is connected to the outer side surface of the first sub-portion 2024 through the eighth flexible circuit board 2200, and specifically, the outer side surface of the first sub-portion 2024 is provided with a contact spring to connect to the eighth flexible circuit board 2200.

In some embodiments, as shown in fig. 21-23, a microphone holder 2300, a sound cavity cover 2400 positioned outside the speaker 1900, and a speaker holder 2500 are fixedly disposed in the second temple housing 2110. The first and

second connector portions

2022 and 2023 are bent toward the inside of the main body portion 2021 such that the outer side surfaces of the first and

second sub portions

2024 and 2025 are attached to the inner side surface of the microphone holder 2300. The speaker 1900 is fixed to the speaker stand 2500. The touch pad 1800 is attached to the outer side surface of the sound cavity cover plate 2400. Accordingly, the first microphone 1710, the second microphone 1720, the speaker 1900, and the touch pad 1800 can be reliably fixed within the second temple housing 2110.

Referring to fig. 20, in some embodiments, second temple housing 2110 includes a second temple inner housing 2111 and a second temple outer housing 2112, and second temple inner housing 2111 is assembled with second temple outer housing 2112 and fixedly attached to form second temple housing 2110.

In the embodiment of the present application, second temple inner housing 2111 is the housing on the side of the user's head proximate second temple housing 2110 when worn on the user's ear, and second temple outer housing 2112 is the housing on the side of the user's head away from second temple housing 2110 when worn on the user's ear.

Referring to fig. 3, 4, 20 and 24, fig. 24 is a partial schematic structural diagram of a head-mounted device according to an embodiment of the present disclosure. In some embodiments, the front end of the second temple housing 2110 is provided with a second rotation shaft 2113, the side of the housing assembly 10 is provided with a second connection frame 140, in particular, the side of the first housing 11 is provided with the second connection frame 140, and the second rotation shaft 2113 of the front end of the second temple housing 2110 is rotatably connected with the second connection frame 140. Therefore, the second temple housing 2110 may not only be caught on the ear of the user to facilitate the user to wear the headset 1, but also be rotated on the main frame 100 to be folded up, facilitating the user to carry the headset 1.

It should be understood that the second temple housing 2110 can be rotatably connected to the housing assembly 10 by other methods, as long as the function that the second temple housing 2110 can be rotated on the housing assembly 10 to be folded is ensured, and the embodiment of the present application is not limited thereto.

It should be understood that the second temple housing 2110 can also be fixedly connected to the housing assembly 10, and the second temple housing 2110 only needs to be capable of being clipped to the ear of the user to facilitate the user wearing the head mounted device 1, the head mounted device 1 is placed in a fixed place, and when it is desired to use, the user can wear the head mounted device 1 through the second temple housing 2110.

Referring to fig. 3, 4, 20 and 24, in some embodiments, second temple housing 2110 is provided with a second channel 2117 at second rotation shaft 2113, which is communicated with second inner cavity 2116 of second temple housing 2110, and second front portion 2010 is connected to second rear portion 2020 at an outlet of second channel 2117, that is, second temple housing 2110 is provided with a channel through which seventh flexible circuit board 2000 can pass, so that second rear portion 2020 of seventh flexible circuit board 2000 can be disposed inside second temple housing 2110 for routing, and second front portion 2010 of seventh flexible circuit board 2000 is located outside second temple housing 2110 so as to be connected to main board 300. The second connecting frame 140 is provided with a second through hole 141 which can be communicated with the second channel 2117, and the second front portion 2010 passes through the second through hole 141 and is connected with the main board 300.

In the embodiment of the present application, the second channel 2117 through which the seventh flexible circuit board 2000 can pass is disposed at the second rotating shaft 2113 at the front end of the second temple housing 2110, the second connecting frame 140 is provided with the second via 141 communicating with the second channel 2117, the second front portion 2010 of the seventh flexible circuit board 2000 passes through the second via 141 to be connected to the main board 300, so that the seventh flexible circuit board 2000 can be routed in the second temple housing 2110 and on the housing assembly 10, the whole head-mounted device 1 is compact and beautiful, the second rear portion 2020 of the seventh flexible circuit board 2000 can be protected by the second temple housing 2110, the second front portion 2010 of the seventh flexible circuit board 2000 can be protected by the face mask 13, the seventh flexible circuit board 2000 cannot expose out of the shell of the head-mounted device 1, and the connecting circuit is not easily damaged, so that the service life is long and the connection reliability is good.

Referring to fig. 3, 4, 20 and 24, in some embodiments, the front end of the second front portion 2010 is electrically connected to the motherboard 300 through a board-to-board connector, the front end of the second front portion 2010 is provided with a second male terminal 2011 of the board-to-board connector, the motherboard 300 is provided with a second female terminal 350 of the board-to-board connector, specifically, the fourth sub-board 334 of the motherboard 300 is provided with the second female terminal 350 of the board-to-board connector, and the second male terminal 2011 is connected to the second female terminal 350 in a snap-fit manner. Therefore, when the seventh flexible circuit board 2000 of the second temple assembly 2100 is connected to the main board 300, the second male terminal 2011 at the front end of the second front portion 2010 only needs to be engaged with the second female terminal 350 on the main board 300, and the ease of assembling the head-mounted device 1 can be further improved.

It should be understood that the positions of the male and female terminals of the board-to-board connector on the second front portion 2010 and the fourth sub-board 334 of the main board 300 may be interchanged, that is, the front end of the second front portion 2010 is provided with the female terminal of the board-to-board connector, the fourth sub-board 334 of the main board 300 is provided with the male terminal of the board-to-board connector, and the male terminal and the female terminal are snap-connected to electrically connect the seventh flexible circuit board 2000 of the second temple assembly 2100 with the main board 300.

It should be understood that the front end of the second front portion 2010 and the motherboard 300 may be electrically connected through other connectors, such as a zero insertion force connector, a zero insertion force connector may be disposed on the motherboard 300, and when the seventh flexible circuit board 2000 is connected to the motherboard 300, the seventh flexible circuit board 2000 may be installed in the zero insertion force connector.

Referring to fig. 3, 4, and 20-24, in some embodiments, the second front portion 2010 extends on the outer side surface of the first housing 11, the front end of the second front portion 2010 passes through the first housing 11 at a position on the first housing 11 opposite to the main board 300 and is electrically connected to the main board 300, specifically, an opening is disposed on the first housing 11 at a position opposite to the fourth sub-board 3334 of the main board 300, and the front end of the second front portion 2010 passes through the opening and is electrically connected to the fourth sub-board 334 of the main board 300.

In this application embodiment, the line overall arrangement of walking of the seventh flexible circuit board of head-mounted device occupies the structure of second mirror leg casing, spectacle frame and piles up the space very seldom, has avoided wind channel, set screw simultaneously again.

Referring to fig. 3, 4, 20-24, in some embodiments, the second front portion 2010 includes a seventh connecting section 2012, a second bending section 2013 and an eighth connecting section 2014 sequentially connected from front to back, the seventh connecting section 2012 is located at the middle of the outer side of the first housing 11 and electrically connected to the main board 300, specifically, the seventh connecting section 2012 is located at the middle of the outer side of the first housing 11 and electrically connected to the fourth sub-board 334 of the main board 300, the second bending section 2013 bypasses the second through hole 1010 of the first housing 11 opposite to the second fisheye camera 1000, the eighth connecting section 2014 is located at the side of the housing assembly 10 and connected to the front end of the second rear portion 2020, and specifically, the eighth connecting section 2014 is located at the side of the first housing 11 and connected to the front end of the second rear portion 2020.

In this embodiment, the second front portion 2010 bypasses the second through hole 1010 of the first housing 11, which is opposite to the second fisheye camera 1000, from the side of the housing assembly 10, and then goes to the middle of the outer side of the housing assembly 10 to be electrically connected to the motherboard 300, which facilitates the assembly of the seventh flexible circuit board 2000.

In some embodiments, as shown in fig. 3, 4, and 20-24, the second bending section 2013 includes a sixth sub-section 2015, a seventh sub-section 2016 and an eighth sub-section 2017, which are sequentially connected, the seventh sub-section 2016 is located at the top of the first housing 11, the sixth sub-section 2015 is bent downward to connect to the seventh connecting section 2012, and the eighth sub-section 2017 is bent downward to connect to the eighth connecting section 2014.

Referring to fig. 3, 4, and 20-24, in some embodiments, a second slot 150 is disposed on an outer side of the first housing 11, and at least a portion of the second front portion 2010 is fixedly mounted in the second slot 150. Therefore, after the second temple assembly 2100 is assembled with the first housing 11, at least a portion of the second front portion 2010 can be fixedly embedded in the second wire channel 150, so that the whole head-mounted device 1 is compact, the second front portion 2010 can be fixedly protected in the second wire channel 150 and cannot be affected by pulling, the connection between the second front portion 2010 and the main board 300 is stable and reliable, the service life of a connection circuit of the head-mounted device 1 can be further prolonged, and the reliability of electrical connection can be improved.

Referring to fig. 3, 4, 20-24, in some embodiments, eighth coupling segment 2014 is straightened when second shaft 2113 is rotated on second coupling frame 140 to fold second temple housing 2110. When second shaft 2113 rotates on second connection frame 140 to unfold second temple housing 2110, eighth connection segment 2014 is bent.

In this embodiment, the eighth connecting section 2014 can be bent redundantly, and when the second temple housing 2110 is folded or unfolded, the seventh flexible circuit board 2000 is not easily broken or broken.

In some embodiments, the eighth connecting section 2014 of the seventh flexible circuit board 2000 is a multi-layer structure, so that it is more flexible and has a smaller minimum bending radius, and the eighth connecting section 2014 may be bent multiple times without breaking. The number of layers of the other portion of the seventh flexible circuit board 2000 is less than that of the eighth connecting section 2014, which can reduce the processing difficulty and cost.

In some embodiments, as shown in fig. 3, 4, and 20-24, the eighth connecting segment 2014 includes a ninth sub-segment 2018 and a tenth sub-segment 2019 connected in series, specifically, the ninth sub-segment 2018 is connected to the eighth sub-segment 2017, and the tenth sub-segment 2019 is connected to the front end of the second rear portion 2020. As second shaft 2113 rotates on second attachment frame 140 to fold second temple housing 2110, ninth subsection 2018 and tenth subsection 2019 are straightened. When second shaft 2113 rotates on second connecting frame 140 to unfold second temple housing 2110, ninth sub-section 2018 and tenth sub-section 2019 are bent back into an S-shape.

In this embodiment, a dislocation phenomenon may occur in the middle of each layer due to the thickness during the bending process of the tenth subsection 2019, and the dislocation length between each layer is compensated by reversely bending the ninth subsection 2018 and the tenth subsection 2019.

In some embodiments, as shown in fig. 24, the side of the first housing 11 is provided with a second groove 150, and the ninth sub-segment 2018 can be accommodated in the second groove 150 when being bent. Meanwhile, the protruding structure between the second via 141 and the second groove 150 on the first housing 11 can bend the tenth subsection 2019 and the ninth subsection 2018 reversely.

Referring to fig. 4, in some embodiments, at least one device includes a photosensitive sensor and an inertia measurement unit, the photosensitive sensor and the inertia measurement unit are fixed on the middle portion of the main frame 100, the photosensitive sensor and the inertia measurement unit are electrically connected to the main board 300 through a connector by a tenth flexible circuit board 2600, and specifically, a front end of the tenth flexible circuit board 2600 is electrically connected to the fourth sub-board 334 through a connector. Specifically, the tenth flexible circuit board 2600 extends rightward to be electrically connected to the front surface of the fourth sub-board 334 through a connector, which may be a board-to-board connector or a zero insertion force connector.

Referring to fig. 5-7, in some embodiments, the at least one flexible board 320 includes a fifth flexible board 325, the at least one secondary board 330 includes a fifth secondary board 335, the fifth secondary board 335 is connected to the inner side edge of the main body panel 310 by the fifth flexible board 325, and the fifth secondary board 335 is located between the first secondary board 331 and the second secondary board 332. Specifically, the fifth sub-plate 335 is connected to the inner side of the main body portion 311 by the fifth flexible board 325. The fifth flexible board 325 is bent toward the main frame 100 to fix the fifth sub-board 335 at a target position below the main body board 310.

In this embodiment, a fifth sub-board connected with a fifth flexible board extends from the inner side edge of the main board, and the fifth sub-board is bent below the main board, so that the remaining height space on the spectacle frame can be converted into the usable area of the main board, and under the condition that the space of the head-mounted device is limited, the scattered space around the spectacle frame can be utilized to the maximum extent.

In the description of the embodiments of the present application, terms such as "first", "second", "third", and the like are used only for distinguishing between similar objects and are not intended to indicate or imply relative importance or implicitly indicate the number of technical features indicated.

In the description of the embodiments of the present application, it is to be understood that the terms "front", "back", "inside", "outside", "left", "right", "top", "bottom", and the like, indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, are only for convenience in describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, the present invention should not be construed as being limited. In the description of the embodiments of the present application, "a plurality" means two or more unless otherwise specified. In the description of the embodiments of the present application, it should be noted that the terms "mounted," "connected," and "connected" are to be construed broadly and may be, for example, fixedly connected, detachably connected, or integrally connected unless explicitly stated or limited otherwise; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.

The main board and the head-mounted device provided in the embodiments of the present application are described in detail above, and specific examples are applied herein to explain the principles and embodiments of the present application, and the description of the embodiments above is only used to help understand the method and the core idea of the present application; meanwhile, for those skilled in the art, according to the idea of the present application, the specific implementation manner and the application scope may be changed, and in summary, the content of the present specification should not be construed as a limitation to the present application.

Claims

1. The utility model provides a mainboard, its characterized in that is applied to head mounted device, head mounted device includes casing subassembly and host computer, the host computer accept in the casing subassembly, the host computer include main frame, a plurality of device, a plurality of flexible circuit board and the mainboard, the mainboard is installed on the main frame, the mainboard includes:

the main body plate comprises a main body part, a first branch part and a second branch part, wherein the first branch part is connected with the left corner of the inner side of the main body part, and the second branch part is connected with the right corner of the inner side of the main body part;

each soft board can be bent, and the soft boards comprise a first soft board, a second soft board, a third soft board, a fourth soft board and a fifth soft board; and

a plurality of sub-plates, each sub-plate being connected to the main body plate through one of the soft plates, wherein the plurality of sub-plates includes a first sub-plate, a second sub-plate, a third sub-plate, a fourth sub-plate and a fifth sub-plate, the first sub-plate being connected to a left corner of an inner side of the first branch portion through the first soft plate, the second sub-plate being connected to a right corner of an inner side of the second branch portion through the second soft plate, the first sub-plate being spaced apart from the second sub-plate, the third sub-plate being connected to a left corner of an outer side of the main body portion through the third soft plate, the fourth sub-plate being connected to a right corner of an outer side of the main body portion through the fourth soft plate, the third sub-plate being spaced apart from the fourth sub-plate, the fifth sub-plate being connected to an inner side of the main body plate through the fifth soft plate, and the fifth sub-plate being located between the first sub-plate and the second sub-plate;

the main body plate is fixed at a target position on the main body frame, the plurality of soft plates are respectively bent towards the main body frame and bent towards the same side of the main body plate, so that the plurality of auxiliary plates are positioned at the same side of the main body plate and are respectively fixed at preset positions on the main body frame, one of the plurality of devices is electrically connected with one of the auxiliary plates through one of the flexible circuit boards or one of the plurality of devices is electrically connected with the main body plate through one of the flexible circuit boards, wherein the plurality of auxiliary plates are respectively positioned at different positions of the main body plate, so that any two of the plurality of devices are mutually avoided.

2. A major panel in accordance with claim 1, wherein the first and second minor panels are spaced apart by a distance greater than the third and fourth minor panels.

3. A head-mounted device, comprising:

a housing assembly; and

a main frame;

a plurality of devices mounted on the mainframe;

a plurality of flexible circuit boards; and

a main board installed on the main frame, the main board including:

4. The headset of claim 3, wherein the plurality of devices includes a distance sensor, a re-starter, and a fan, at least one of the distance sensor, re-starter, and fan being electrically connected to the body board by a first flexible circuit board.

5. The head-mounted apparatus according to claim 4, wherein the plurality of devices includes a first optical machine and a second optical machine, the first optical machine and the second optical machine being electrically connected to the main body board through a second flexible circuit board and a third flexible circuit board, respectively.

6. The head-mounted apparatus of claim 5, wherein the plurality of devices comprises a first fisheye camera electrically connected to the first sub-board via a fourth flexible circuit board and a second fisheye camera electrically connected to the second sub-board via a fifth flexible circuit board.

7. The head-mounted apparatus according to claim 6, wherein the fourth flexible circuit board comprises a first connection section, a first extension section, a second extension section and a second connection section which are sequentially connected in a bending manner, the first connection section is electrically connected with the first fisheye camera, the first extension section is attached to the inner side surface of the first fisheye camera, the second extension section is attached to the left side surface of the first optical machine, and the second connection section is electrically connected with the first sub-board;

the fifth flexible circuit board comprises a third connecting section, a third extending section, a fourth extending section and a fourth connecting section which are sequentially bent and connected, the third connecting section is electrically connected with the second fisheye camera, the third extending section is attached to the inner side surface of the second fisheye camera, the fourth extending section is attached to the right side surface of the second optical machine, and the fourth connecting section is electrically connected with the second sub-board.

8. The headset of claim 6 or 7, further comprising a first temple assembly, the first temple assembly comprising:

the front end of the first glasses leg shell is connected with one side part of the shell assembly, and the rear end of the first glasses leg shell is provided with an opening;

the interface is fixed in the first glasses leg shell and positioned at the opening of the first glasses leg shell; and

the sixth flexible circuit board comprises a first front part and a first rear part, the first front part is located outside the first glasses leg shell, the front end of the first front part is electrically connected with the third auxiliary board through a connector, the first rear part is fixedly installed in the first glasses leg shell, and the rear end of the first rear part is connected with the interface.

9. The headset of claim 8, wherein the front end of the first front portion is snap-fit connected to the main board via a board-to-board connector.

10. The head-mounted apparatus according to claim 8 or 9, wherein the housing assembly comprises a first housing and a second housing located inside the first housing and connected to the first housing in a matching manner, an accommodating space is provided between the first housing and the second housing, and the host is accommodated in the accommodating space;

the front end of the first glasses leg shell is connected with one side part of the first shell;

the first front portion extends on an outer side of the first housing, and a front end of the first front portion penetrates the first housing at a position on the first housing facing the third sub-board and is electrically connected to the third sub-board.

11. The head-mounted apparatus of claim 10, wherein a rotation shaft is provided at a front end of the first temple housing, a connection frame is provided at a side portion of the first temple housing, and the rotation shaft is rotatably connected to the connection frame;

the rear of the first front portion is straightened when the shaft is rotated on the attachment frame to fold the first temple housing; the rear portion of the first front portion is bent into an S-shape when the rotation shaft rotates on the connection frame to unfold the first temple housing.

12. The headset of claim 8, further comprising a second temple assembly, the second temple assembly comprising:

a second temple housing, a front end of which is connected with the other side of the housing assembly;

a microphone fixed within the second temple housing;

a speaker fixed within the second temple housing; and

the seventh flexible circuit board comprises a second front part and a second rear part, the second front part is located outside the second glasses leg shell, the front end of the second front part is electrically connected with the fourth auxiliary board through a connector, the second rear part is fixedly installed in the second glasses leg shell, a touch pad is arranged on the second rear part, and the microphone and the loudspeaker are connected with the second rear part.

13. The head-mounted apparatus according to claim 12, wherein the second rear portion includes a main body sub-portion, a first connector sub-portion, a second connector sub-portion, a first sub-portion and a second sub-portion, the touch pad is disposed on a rear end of the main body sub-portion, the first sub-portion and the second sub-portion are respectively connected to two opposite sides of the main body sub-portion in a staggered manner through the first connector sub-portion and the second connector sub-portion, and the first connector sub-portion and the second connector sub-portion are bent toward an inner side of the main body sub-portion to enable the first sub-portion and the second sub-portion to be arranged in a staggered manner and side by side inside the main body sub-portion;

the microphone comprises a first microphone and a second microphone, and the first microphone and the second microphone are respectively connected with the outer side surfaces of the first sub-part and the second sub-part;

the speaker is connected to an outer side surface of the first sub-part through an eighth flexible circuit board.

14. The head-mounted apparatus according to claim 12 or 13, wherein the plurality of devices comprise a plurality of photosensitive sensors and inertial measurement units, the plurality of photosensitive sensors and inertial measurement units being electrically connected to the fourth sub-board through a tenth flexible circuit board.