CN213814144U - Head-mounted device - Google Patents

Head-mounted device Download PDF

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Publication number
CN213814144U
CN213814144U CN202022635332.0U CN202022635332U CN213814144U CN 213814144 U CN213814144 U CN 213814144U CN 202022635332 U CN202022635332 U CN 202022635332U CN 213814144 U CN213814144 U CN 213814144U
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China
Prior art keywords
housing
head
mounting
frame
main body
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CN202022635332.0U
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Chinese (zh)
Inventor
王江新
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Guangdong Oppo Mobile Telecommunications Corp Ltd
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Guangdong Oppo Mobile Telecommunications Corp Ltd
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Priority to CN202022635332.0U priority Critical patent/CN213814144U/en
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Abstract

The application provides a head-mounted device, relates to smart machine technical field. In the head-mounted equipment, the rack comprises a rack main body, and the rack main body is provided with an accommodating groove in the middle of the first surface; the heat dissipation plate is arranged on the first surface and is opposite to the accommodating groove; the main board assembly is arranged on the heat dissipation plate, and in the main board assembly, the first main board is arranged on one side, close to the rack main body, of the heat dissipation plate and is positioned in the accommodating groove; the second mainboard is arranged on one side of the heat dissipation plate, which is far away from the frame main body, and is electrically connected with the first mainboard. The frame design in this application is structure as an organic whole, and the integrated into one piece is convenient for add man-hour, and whole frame can be stacked first mainboard and second mainboard and place, utilizes the heating panel to arrange in between first mainboard and the second mainboard in addition, dispels the heat to first mainboard and second mainboard, has played the effect of protection, has improved the host computer integrated level, can improve space utilization.

Description

Head-mounted device
Technical Field
The application relates to the technical field of intelligent equipment, in particular to head-mounted equipment.
Background
Virtual Reality (VR) and Augmented Reality (AR) technologies can bring users a visual experience comparable to a real scene, and are currently popular research fields. To enable users to better experience VR and AR technology, VR and AR are typically displayed using a head-mounted device.
At present, the integration level of a head-mounted equipment host is not high enough, so that the space utilization rate is low.
SUMMERY OF THE UTILITY MODEL
One aspect of the present application provides a head-mounted device, including:
the rack comprises a rack main body, wherein the rack main body is provided with a first surface and a second surface which are arranged oppositely, and a third surface and a fourth surface which are arranged oppositely, the third surface is connected with the first surface and the second surface, the fourth surface is connected with the first surface and the second surface, and the rack main body is provided with an accommodating groove in the middle of the first surface;
the heat dissipation plate is arranged on the first surface of the rack and is opposite to the accommodating groove; and
a motherboard assembly disposed on the heat dissipation plate, the motherboard assembly including:
the first main board is arranged on one side, close to the rack main body, of the heat dissipation plate and is positioned in the accommodating groove; and
the second mainboard is arranged on one side, far away from the rack main body, of the heat dissipation plate and is electrically connected with the first mainboard.
The frame design in this application is structure as an organic whole, and the integrated into one piece is convenient for add man-hour, and whole frame can be stacked first mainboard and second mainboard and place, utilizes the heating panel to arrange in between first mainboard and the second mainboard in addition, dispels the heat to first mainboard and second mainboard, has played the effect of protection, has improved the host computer integrated level, can improve space utilization.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the embodiments will be briefly described below. It is obvious that the drawings in the following description are only some embodiments of the application, and that for a person skilled in the art, other drawings can be derived from them without inventive effort.
Fig. 1 discloses a schematic structural diagram of a head-mounted device according to an embodiment of the present application;
FIG. 2 discloses an exploded view of the embodiment of the head mounted device shown in FIG. 1;
FIG. 3 discloses an exploded view of the housing assembly of the embodiment of FIG. 2 of the present application;
FIG. 4 is a schematic view of the first housing of the embodiment of FIG. 3;
FIG. 5 is a structural diagram illustrating another perspective of the first housing of the embodiment of FIG. 4 of the present application;
FIG. 6 is a structural diagram illustrating another perspective of the first housing of the embodiment of FIG. 4 of the present application;
FIGS. 7 and 8 respectively disclose a schematic structural view of the first housing from a further perspective in the embodiment of FIG. 4 of the present application;
FIG. 9 is a schematic view of a second housing according to the embodiment of FIG. 3;
FIG. 10 is a structural diagram illustrating another perspective of the second housing of the embodiment of FIG. 9;
FIG. 11 is a schematic structural diagram illustrating a further perspective view of the second housing of the embodiment of FIG. 9;
fig. 12 is a schematic view illustrating a structure of a first housing and a second housing being fastened together according to an embodiment of the present disclosure;
FIG. 13 is a schematic view of the embodiment of the decoration shown in FIG. 3;
FIGS. 14 and 15 respectively disclose the structural schematic diagrams of the support assembly in the embodiment of FIG. 2 of the present application;
FIG. 16 is a schematic diagram of a portion of a head-mounted device according to the embodiment of FIG. 2;
FIG. 17 is an exploded view of the opto-mechanical assembly of the embodiment of FIG. 2 of the present application;
FIG. 18 is a schematic diagram of the rack of the embodiment of FIG. 17;
FIG. 19 is a schematic view of the rack of the embodiment of FIG. 17 from another perspective;
FIGS. 20 and 21 respectively disclose exploded views of the nose pad assembly of the embodiment of FIG. 2 of the present application from different perspectives;
FIG. 22 is a schematic view of a motherboard assembly according to the embodiment of FIG. 2;
FIG. 23 is a schematic view of a portion of the motherboard assembly of the embodiment shown in FIG. 22 according to the present application;
FIG. 24 is a structural diagram illustrating another perspective view of the motherboard assembly shown in the embodiment of FIG. 22 according to the present application;
FIG. 25 is a schematic diagram of a camera module according to the embodiment of FIG. 2;
FIG. 26 discloses an exploded view of the heat sink assembly of the embodiment of FIG. 2 of the present application;
fig. 27 and 28 respectively disclose the structure of the heat dissipation plate in the embodiment of fig. 26 of the present application;
fig. 29 discloses a schematic structural diagram of a head-mounted device according to another embodiment of the present application;
FIG. 30 is a schematic view of the embodiment of the present application showing the configuration of the vision adjusting glasses of FIG. 29;
FIG. 31 is a schematic view of the eyewear unit of the embodiment of FIG. 30 of the present application;
FIG. 32 is a schematic view of a headset according to another embodiment of the present application;
FIG. 33 is a schematic view of an alternative embodiment of the head-mounted device of the embodiment of FIG. 32 according to the present application;
FIG. 34 is a schematic view of another embodiment of the head-mounted device of the embodiment of FIG. 32 according to the present application;
FIG. 35 is a block diagram of the host unit shown in FIG. 34 according to an embodiment of the present invention.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. It should be apparent that the described embodiments are only some of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
Reference herein to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the application. The appearances of the phrase in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. It is explicitly and implicitly understood by one skilled in the art that the embodiments described herein can be combined with other embodiments.
It is noted that the terms "first", "second", etc. are used herein for descriptive purposes only and are not to be construed as indicating or implying relative importance or implying any number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the described features.
Referring to fig. 1 and fig. 2, fig. 1 discloses a schematic structural diagram of a head-mounted device in an embodiment of the present application, and fig. 2 discloses an exploded schematic diagram of the head-mounted device 100 in the embodiment of fig. 1 of the present application. The head-mounted device 100 may include a housing assembly 10, a support assembly 20 coupled to opposite ends of the housing assembly 10, a host 30a housed in the housing assembly 10, and a nose pad assembly 40 mounted on the housing assembly 10. The housing assembly 10, the support assembly 20 and the nose pad assembly 40 can form a frame to facilitate the head-mounted device 100 to be worn on the head of the user, and to distribute the weight of the head-mounted device 100 borne by the head of the user at the support assembly 20 and the nose pad assembly 40.
The host 30a may include an optical-mechanical assembly 30, a motherboard assembly 50, a camera assembly 60, a heat sink assembly 70, and the like. Since the housing assembly 10 is used for accommodating and protecting the host 30a, the housing assembly 10 can be also referred to as a host housing or a protection housing. The housing assembly 10 and the host 30a received therein may constitute a host assembly 10 a. The head-mounted device 100 may be VR (Virtual Reality) glasses, AR (Augmented Reality) glasses, or the like. In the embodiments of the present application, AR glasses are described as an example.
In the example of AR glasses, the head mounted device 100 may be configured to communicate data to and receive data from an external processing device through a signal connection, which may be a wired connection, a wireless connection, or a combination thereof.
However, in other cases, the head mounted device 100 may be used as a stand-alone device, i.e., data processing is performed on the head mounted device 100 itself. The signal connection may be configured to carry any kind of data, such as image data (e.g., still images and/or full motion video, which may include 2D and 3D images), audio, multimedia, voice, and/or any other type of data. The external processing device may be, for example, a gaming console, a personal computer, a tablet computer, a smart phone, or other type of processing device. The signal connection may be, for example, a Universal Serial Bus (USB) connection, a Wi-Fi connection, a bluetooth or Bluetooth Low Energy (BLE) connection, an ethernet connection, a cable connection, a DSL connection, a cellular connection (e.g., 3G, LTE/4G or 5G), etc., or a combination thereof. Additionally, the external processing device may communicate with one or more other external processing devices via a network, which may be or include, for example, a Local Area Network (LAN), a Wide Area Network (WAN), an intranet, a Metropolitan Area Network (MAN), the global internet, or a combination thereof.
The housing assembly 10 of the head-mounted device 100 may mount display assemblies, optics, sensors, processors, and the like. In the example of AR glasses, the display component is designed to overlay an image on the user's view of their real-world environment, for example, by projecting light into the user's eyes. The head-mounted device 100 may also include an ambient light sensor, and may also include electronic circuitry to control at least some of the above-described components and perform associated data processing functions. The electronic circuitry may include, for example, one or more processors and one or more memories.
Referring to fig. 2 and 3, fig. 3 is an exploded view of the housing assembly 10 of the embodiment of fig. 2. The housing assembly 10 may include a first housing 11, a second housing 12 coupled to the first housing 11 by a snap-fit connection, a mask 13 covering a side of the first housing 11 away from the second housing 12, and a decoration 14 surrounding an outer surface of the first housing 11 not covered by the mask 13.
It will be understood that the terms "central," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," "circumferential," and the like herein, when used in the context of the present application, are intended to refer to the orientation or positional relationship illustrated in the drawings, and are used merely for convenience and to simplify the description and do not indicate or imply that the device or element so referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore should not be considered as limiting the present application.
In addition, the names of the "first casing", "second casing", "housing", "main casing", and "protection casing" may be interchanged, and for example, the "first casing" may also be referred to as "second casing".
Referring to fig. 3, 4 and 5, fig. 4 discloses a schematic structural diagram of the first housing 11 in the embodiment shown in fig. 3 of the present application, and fig. 5 discloses a schematic structural diagram of the first housing 11 in another view angle in the embodiment shown in fig. 4 of the present application. The material of the first housing 11 may be a hard material. The first casing 11 may include a first casing main body 111, a mounting frame 112 disposed at one side of the first casing main body 111, and connecting arms 113 connected to the first casing main body 111 and disposed at both sides of the first casing main body 111 and both sides of the mounting frame 112, respectively.
The first case body 111 may be a plate-shaped structure. The first housing body 111 covers the mask 13 on the side away from the second housing 12. The surface of the first housing body 111 on the side facing the mask 13 may be a curved surface or a flat surface, but may have other shapes. The middle portion of the first casing main body 111 is provided with a first through hole 1111 penetrating the first casing main body 111. In an embodiment, the number of the first through holes 1111 may be three, i.e., the first through holes 1111a, 1111b, 1111 c. The first through holes 1111a, 1111b, 1111c are sequentially arranged side by side. In an embodiment, the number of the first through holes 1111 may be adjusted according to actual situations. For example, the number of the first through holes 1111 may be one, two, or four, which is not limited herein.
The first housing body 111 is provided with a surrounding frame 1112 on a side surface on which the mask 13 is provided. The enclosure 1112 may be enclosed around the first through-hole 1111, e.g., the first through- holes 1111a, 1111b, 1111 c. The shape of the surrounding frame 1112 surrounding the surface of the first housing main body 111 may be a trapezoid, but may also be other shapes, such as a circle, a square, a polygon, and so on, and is not described again. The surrounding frame 1112 may be provided to divide a side surface of the first housing body 111 covering the mask 13 into three regions to be engaged with the mask 13. In one embodiment, the frame 1112 protrudes from the surface of the first housing body 111 to a side away from the second housing 12. It is understood that the surrounding frame 1112 forms a groove with the surface of the first casing main body 111, so the surrounding frame 1112 may be replaced by a groove recessed from the surface of the first casing main body 111. In one embodiment, enclosure 1112 may also be omitted.
The first housing body 111 has a first through hole 1111, for example, first through holes 1111a, 1111b, 1111c, and second through holes 1113 formed through the first housing body 111. In one embodiment, the number of the second through holes 1113 may be two, and the second through holes 1113a and 1113b are respectively provided. The second through holes 1113a and 1113b are respectively located at both sides of the first through hole 1111. In an embodiment, the number of the second through holes 1113 can be adjusted according to actual conditions. For example, the number of the second through holes 1113 may be one, three, or four, which is not limited. In one embodiment, the second via 1113a or 1113b may be omitted.
The first housing main body 111 is provided with a first wiring groove 1114 on a side surface covering the face mask 13 to give way to a Circuit wiring such as a Flexible Printed Circuit Board (FPC). The first wiring groove 1114 is communicated with the second through hole 1113, and extends to the edge of the first housing body 111 far from the side of the mounting frame 112. The circuit trace may extend from the first trace channel 1114 into the second via 1113. In one embodiment, the first routing groove 1114 is recessed from a surface of the first housing body 111. In an embodiment, the number of first routing channels 1114 may be two, such as first routing channels 1114a, 1114 b. The first routing grooves 1114a and 1114b are respectively located at two sides of the first through hole 1111. The first wiring groove 1114a communicates with the second through hole 1113 a. The first wiring groove 1114b communicates with the second through hole 1113 b. In one embodiment, the first routing channel 1114 may be omitted. In an embodiment, the first routing channel 1114a or 1114b can be omitted.
The first housing body 111 has third through holes 1115 formed on both sides of the first through hole 1111 and penetrating the first housing body 111. In one embodiment, the number of third through holes 1115 may be two, namely third through holes 1115a, 1115 b. The third through holes 1115a, 1115b are respectively located at two sides of the first through hole 1111, and the third through holes 1115a, 1115b can be symmetrically arranged. In an embodiment, the number of the third through holes 1115 may be adjusted according to actual conditions, and is not limited.
The names of the "first through hole", the "second through hole", the "third through hole", the "through hole" and the like can be mutually converted, for example, the "first through hole" can also be called as the "second through hole".
In one embodiment, the second via 1113a is disposed between the first via 1111 and the third via 1115 a. The third through hole 1115a is provided at a position of the first housing main body 111 near the connection arm 113. The second through hole 1113b is disposed between the first through hole 1111 and the third through hole 1115 b. The third through hole 1115b is provided at a position of the first housing main body 111 near the connection arm 113.
The first casing main body 111 is provided with a ledge 1116 at both side edges where the connecting arm 113 is provided and at one side edge where the mounting frame 112 is provided. The protruding edge 1116 is bent from the edge of the first housing body 111 toward one side of the second housing 12. The first housing body 111 is not provided with the ledge 1116 at the edge connected to the mounting frame 112. That is, the ledge 1116 is broken at the edge where the first housing body 111 is connected to the mounting frame 112.
Referring to fig. 6, fig. 6 is a schematic structural diagram of the first housing 11 in another view according to the embodiment shown in fig. 4 of the present application. The first casing main body 111 is provided with a connector 1117 at a side facing the second casing 12 to be connected with the main body 30 a. In one embodiment, the connection 1117 may include a first snap structure 1117a connected to the main body 30a and a boss 1117b connected to the second housing 12.
In the description of the present application, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "communicating" are to be construed broadly, e.g., as meaning fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms herein can be understood in a specific context to one of ordinary skill in the art.
The first snap structure 1117a is disposed on a surface of the first housing body 111 near the second housing 12 and around the first through hole 1111. The first buckle structure 1117a may be multiple. For example, the first catch structure 1117a may be disposed at an edge of the first casing body 111 on a side away from the mounting frame 13. For example, the first snap structure 1117a may be disposed on a side of the first through hole 1111 adjacent to the second through hole 1113 a. For example, the first snap structure 1117a may be disposed on a side of the first through hole 1111 adjacent to the second through hole 1113 b.
In one embodiment, the first snap structure 1117a may comprise a plate-shaped structure disposed on the first housing body 111 and a bump disposed on the plate-shaped structure.
The boss 1117b is disposed on a side of the first housing body 111 close to the second housing 12. The boss 1117b may be specifically disposed at an edge of the first case body 111. Such as the boss 1117b, is located at the edge of the first housing body 111 where the connecting arm 113 is provided. Such as the convex pillar 1117b, is located at the edge of the first case body 111 where the mounting frame 112 is provided. In one embodiment, the post 1117b may have a threaded hole therein for screwing a screw.
Referring to fig. 5 and 6, the number of the mounting frames 112 may include two, namely, a first mounting frame 1121 and a second mounting frame 1122. The first and second mounting frames 1121, 1122 are symmetrically and spaced apart from each other. The gap between the first mounting frame 1121 and the second mounting frame 1122 can give way to a human body, such as the bridge of the nose, so as to facilitate wearing of the head-mounted device 100.
The mounting frame 112, for example, the first mounting frame 1121 and the second mounting frame 1122 may include a mounting frame body 1123 extending from an edge of the first case body 111 to one side. The surface of the mounting frame body 1123 on the side away from the second casing 12 is covered with a face mask 13. The edge of the mounting frame body 1123 is provided with a ledge 1124. The protruding edge 1124 is bent from the edge of the mounting frame body 1123 to one side of the second housing 12. The mounting frame 112 is not provided with the protruding edge 1124 at the edge connected with the first case body 111. That is, the protruding edge 1124 is broken at the edge where the mounting frame 112 is connected to the first housing body 111, and both ends where the protruding edge 1124 is broken are respectively connected to both ends where the protruding edge 1116 is broken. That is, the protruding edge 1116 and the protruding edge 1124 form a complete protruding edge surrounding the first housing body 111 and the mounting frame 112.
The mounting frame body 1123 has a mounting hole 1125 formed through the mounting frame body 1123 at the middle thereof. Light may pass through the visor 13 and then through the mounting hole 1125. The edge of the mounting frame body 1123 at the mounting hole 1125 is provided with a first abutment ledge 1126. The first abutting convex edge 1126 is bent from the edge of the mounting frame main body 1123 at the mounting hole 1125 toward the second housing 12. In an embodiment, the mounting frame main body 1123 is further provided with a reinforcing rib 1127 connected to the first abutting convex edge 1126 to reinforce the stability of the first abutting convex edge 1126 and improve the strength of the first abutting convex edge 1126. Of course, the stability and the bending resistance of the mounting frame body 1123 are also improved. In one embodiment, the first abutment ledge 1126 may be omitted.
The mounting frame body 1123 is provided with a connecting member 1128 at a side facing the second housing 12 to be connected with the second housing 12. In one embodiment, the connector 1128 may include a second snap feature 1128a and a post 1128b coupled to the second housing 12.
The second snap structure 1128a may be provided at an edge of the mounting frame body 1123. For example, the second snap feature 1128a may be disposed on or against the ledge 1124. The number of the second snap structures 1128a may be plural. In one embodiment, the second snap feature 1128a may comprise a plate feature disposed on the ledge 1124 or the mounting frame body 1123 and a protrusion disposed on the plate feature.
The boss 1128b is disposed on a side of the mounting frame body 1123 adjacent to the second housing 12. The boss 1128b may be particularly disposed at an edge of the mounting frame body 1123. For example, the protruding columns 1128b may be disposed at an edge of the mounting frame body 1123 of the first mounting frame 1121, which is away from the second mounting frame 1122. For example, the protruding columns 1128b may be disposed at an edge of the mounting frame body 1123 of the second mounting frame 1122 away from the first mounting frame 1121. For example, the boss 1128b may be provided at a position where the mounting frame body 1123 is connected with the first case body 111. In one embodiment, the post 1128b may have a threaded hole therein for receiving a screw.
It is understood that the number of the mounting frames 112 may also be one, that is, the mounting frame main body 1123 of the first mounting frame 1121 is connected with the mounting frame main body 1123 of the second mounting frame 1122 to form a whole.
Referring to fig. 7 and fig. 8, a schematic structural diagram of the first housing 11 from another perspective in the embodiment shown in fig. 4 of the present application is respectively disclosed. The number of connecting arms 113 may include two, a first connecting arm 1131 and a second connecting arm 1132. The first connecting arm 1131 is located at a side of the second through hole 1113a away from the first through hole 1111. The second connection arm 1132 is located at a side of the second through hole 1113b far from the first through hole 1111.
The connecting arm 113, for example, the first connecting arm 1131 and the second connecting arm 1132 may include a first side plate 1133 connected to an edge of the first casing body 111 on the side away from the mounting frame 112, a second side plate 1134 disposed opposite to the first side plate 1133 and connected to the ledge 1116, a third side plate 1135 connecting the first side plate 1133 and the second side plate 1134, and a connecting rib 1136 connecting the first side plate 1133 and the second side plate 1134 and disposed opposite to the third side plate 1135. The first side plate 1133, the second side plate 1134, and the third side plate 1135 enclose a receiving channel 1137 with an opening on one side. The opening of the receiving channel 1137 of the first connecting arm 1131 is disposed toward a side away from the second connecting arm 1132, and the opening of the receiving channel 1137 of the second connecting arm 1132 is disposed toward a side away from the first connecting arm 1131. That is, the third side plate 1135 is disposed on one side of the first side plate 1133 and the second side plate 1134 close to the first casing main body 111. It is understood that the third side plate 1135 can also be disposed on a side of the first side plate 1133 and the second side plate 1134 away from the first casing main body 111, that is, the opening of the receiving channel 1137 of the first connecting arm 1131 is disposed toward a side close to the second connecting arm 1132, and the opening of the receiving channel 1137 of the second connecting arm 1132 is disposed toward a side close to the first connecting arm 1131. The opening orientation of the receiving channel 1137 may not be limited.
The names of the first side plate, the second side plate, the third side plate, the side plate and the like can be mutually converted, for example, the first side plate can also be called as the second side plate.
The ledge 1116 and the first, second and third side plates 1133, 1134, 1135 enclose a heat dissipation channel 1138. The connecting ribs 1136 are disposed at ends of the first side plate 1133 and the second side plate 1134 away from the first casing main body 111, and are connected to the first side plate 1133 and the second side plate 1134, respectively. The first side plate 1133, the second side plate 1134, and the third side plate 1135 enclose a through hole 1139 with the connecting rib 1136 at an end away from the first casing main body 111. The through hole 1139 communicates with the receiving channel 1137.
A second routing groove 1140 communicated with the receiving channel 1137 is disposed on a side of the first side plate 1133 away from the second side plate 1134, so as to give way to a circuit trace, such as an FPC. The second routing channel 1140 may be in communication with the first routing channel 1114. Such that the circuit traces extend from the housing channel 1137 and into the interior of the housing assembly 10 through the second trace channel 1140, the first trace channel 1114, and the second via 1113. For example, the second routing channel 1140 of the first connecting arm 1131 can communicate with the first routing channel 1114 a. So that the circuit traces extend from the receiving channel 1137 of the first connecting arm 1131 and enter the interior of the housing assembly 10 through the second trace groove 1140, the first trace groove 1114a and the second through hole 1113 a. For example, the second routing groove 1140 of the second connecting arm 1132 may communicate with the first routing groove 1114 b. Such that the circuit traces extend from the receiving channel 1137 of the second connecting arm 1132 and enter the interior of the housing assembly 10 through the second trace groove 1140, the first trace groove 1114b, and the second through hole 1113 b. It is understood that the second routing groove 1140 of the first connecting arm 1131 and the second routing groove 1140 of the second connecting arm 1132 can communicate with the same first routing groove 1114, so that the circuit traces extending from the receiving channel 1137 of the first connecting arm 1131 and the circuit traces extending from the receiving channel 1137 of the second connecting arm 1132 enter the interior of the housing assembly 10 through the same second through hole 1113.
A recess 1141 is formed on a side of the first side plate 1133 away from the second side plate 1134 to give way to the second housing 12. The recessed portion 1141 may be recessed. The recess 1141 extends toward the first housing body 111. The first side plate 1133 is provided with a connecting hole 1142 in the recess 1141 to fix the second housing 12.
The first side plate 1133 has a pivot hole 1143 penetrating through the first side plate 1133 at one end of the connecting rib 1136, so that the connecting arm 113 is pivotally connected to the supporting component 20, and the first housing 11 is connected to the supporting component 20. The pivot holes 1143 communicate with the receiving channel 1137. It is understood that the pivot holes 1143 may be disposed on the second side plate 1134.
The third panel 1135 may be provided with a mounting 1144 within the receiving channel 1137 for connection with the support assembly 20. In the extending direction of the connecting arm 113, the third side plate 1135 is shorter than the lengths of the first side plate 1133 and the second side plate 1134, so that the through hole 1139 extends toward the first casing main body 111 side. So that the support member 20 is bent.
The connecting rib 1136 is used to reinforce the fixed connection between the first side plate 1133 and the second side plate 1134. The tie-bars 1136 may also be used to limit the rotation of the support assembly 20. For example, the connecting rib 1136 on the first connecting arm 1131 prevents the support member 20 from moving away from the second connecting arm 1132 within a certain rotation angle. For example, the connecting rib 1136 on the second connecting arm 1132 prevents the support member 20 from moving away from the first connecting arm 1131 within a certain rotation angle.
The second housing 12 is used to form an accommodating space by being fastened with the first housing 11, so as to accommodate the host 30a, such as the optical-mechanical assembly 30, the motherboard assembly 50, the camera assembly 60, and the heat dissipation assembly 70. Referring to fig. 9 and 10, fig. 9 discloses a schematic structural view of the second housing 12 in the embodiment shown in fig. 3 of the present application, and fig. 10 discloses a schematic structural view of the second housing 12 in another view of the embodiment shown in fig. 9 of the present application. The material of the second housing 12 may be a hard material, and for example, the same material as the first housing 11 may be used. The second housing 12 may include a second housing body 121, a mounting frame 122 disposed at one side of the second housing body 121, and mounting arms 123 connected to the second housing body 121 and disposed at both sides of the second housing body 121 and both sides of the mounting frame 122, respectively.
The second case body 121 may have a plate-shaped structure. The second case body 121 is disposed opposite to the first case 11, for example, the first case body 111. The middle of the second case body 121 is provided with a first through hole 1211 penetrating the second case body 121. The first through hole 1211 communicates with the accommodating space.
The second housing body 121 has second through holes 1212 penetrating through the second housing body 121 at two sides of the first through hole 1211. The second through hole 1212 communicates with the receiving space. In one embodiment, the number of the second through holes 1212 may be two, i.e., the second through holes 1212a and 1212b, respectively. The second through holes 1212a and 1212b are respectively located at both sides of the first through hole 1211. In an embodiment, the number of the second through holes 1212 may be adjusted according to actual conditions. For example, the number of the second through holes 1212 may be one, three, or four, which is not limited. In one embodiment, the second through holes 1212a and 1212b may be omitted.
The second case body 121 is provided at the peripheral edge with a sidewall 1213. The side wall 1213 extends from the edge of the second housing body 121 toward the first housing 11, for example, the first housing body 111, so as to abut against the ledge 1116 and the edge of the first housing body 111. The second case body 121 is not provided with the side wall 1213 at the edge connected to the fitting frame 122. That is, the side wall 1213 is broken at the edge where the second case body 121 is connected to the fitting frame 122.
In one embodiment, the sidewalls 1213 may include a sidewall 1213a disposed at one side edge of the second case body 121 away from the assembly frame 122, a sidewall 1213b disposed at one side edge of the second case body 121 near the assembly frame 122, a sidewall 1213c connecting one end of the sidewall 1213a with one end of the sidewall 1213b, and a sidewall 1213d connecting the other end of the sidewall 1213a with the other end of the sidewall 1213 b. The side wall 1213b is broken at the edge where the second case body 121 is connected to the fitting frame 122. In one embodiment, the side wall 1213b may be omitted.
The side wall 1213, for example, the side walls 1213a, 1213b, 1213d are provided with heat dissipation holes 1214 that penetrate the side wall 1213. The heat dissipating holes 1214 on the side wall 1213c are communicated with the heat dissipating channel 1138 near the first connecting arm 1131. The louvers 1214 of the side wall 1213d communicate with the heat dissipating channel 1138 adjacent the second connecting arm 1132.
The side wall 1213a is adapted to abut against an edge of the first casing 11, for example, the first casing main body 11 on the side away from the mounting frame 112. A notch 1215 is provided at a position of the sidewall 1213a opposite to the first through hole 1111 of the first housing 11 to give way to the host 30 a. Notch 1215 extends inwardly from the edge of sidewall 1213 a.
Side wall 1213a may be adapted to abut a first side plate 1133 of first connecting arm 1131 and to abut a first side plate 1133 of second connecting arm 1132. The outer surfaces of side walls 1213a are flush with the outer surfaces of first side plate 1133 of first coupling arm 1131 and with the outer surfaces of first side plate 1133 of second coupling arm 1132. To enhance the appearance of the head-mounted device 100. The side wall 1213a is provided with a third wiring groove 1216 for communicating the first wiring groove 1114 and the second wiring groove 1140 of the connecting arm 113.
The names of the first wiring groove, the second wiring groove, the third wiring groove, the wiring groove and the like can be mutually converted, for example, the first wiring groove can also be called as a second wiring groove.
Third routing channel 1216 may be two, third routing channel 1216a and third routing channel 1216b, respectively. The third routing groove 1216a is used to communicate the first routing groove 1114a with the second routing groove 1140 of the first connecting arm 1131. The third routing channel 1216b is used to communicate the first routing channel 1114b with the second routing channel 1140 of the second connecting arm 1132. In an embodiment, third routing channel 1216 may be omitted.
The side wall 1213b is adapted to abut against a ledge 1116 provided at an edge of the first housing 11, for example, the first housing main body 111 on one side of the mounting frame 112. The side wall 1213b is provided with a through hole 1217 that penetrates the side wall 1213b and fits the nose pad assembly 40.
The side wall 1213c is adapted to abut against a protruding edge 1116 provided on the first housing 11, for example, the first housing body 111 near one side edge of the first connecting arm 1131. The side wall 1213c is provided with a stopper plate 1218 on a side facing the side wall 1213d for cooperation with the host 30a such as the heat sink assembly 70. In one embodiment, the stop plate 1218 may be omitted.
The side wall 1213d is adapted to abut against a protruding edge 1116 provided on the first housing 11, for example, the first housing main body 111 near one side edge of the second connection arm 1132. The side wall 1213d is provided with a stopper plate 1219 on a side facing the side wall 1213c for engagement with the host computer 30a such as the radiator module 70. In one embodiment, the restriction plate 1219 may be omitted.
The second housing body 121 is provided with a connection piece 1220 for connection with a connection piece 1117 such as a stud 1117b at a side toward the first housing 11 such as the first housing body 111. The connection member 1220 may be particularly disposed at an edge of the second case body 121. Such as the connecting member 1220, is located at the edge of the second housing body 121 where the mounting arm 123 is located. For example, the connecting member 1220 is located at an edge of the second case body 121 where the fitting frame 122 is provided. The connecting member 1220 is disposed opposite to the connecting member 1117 such as the convex pillar 1117 b. In one embodiment, the connecting member 1220 may be a convex pillar. The connecting member 1220 may be a boss with a threaded hole, so as to facilitate the connection between the connecting member 1220 and the connecting member 1117, such as the boss 1117b, by using a screw.
Referring to fig. 9 and 11, fig. 11 is a schematic structural diagram of the second housing 12 according to the embodiment shown in fig. 9. The mounting frame 122 is used for being buckled with the first housing 11, such as the mounting frame 112, to mount the optical-mechanical assembly 30. The number of the assembly frames 122 is two, which are a first assembly frame 1221 and a second assembly frame 1222, respectively. The first assembly frame 1221 and the second assembly frame 1222 are symmetrically and spaced apart from each other. The gap between the first and second mounting frames 1221 and 1222 may give way to a human body, such as a nose bridge, to facilitate wearing of the head-mounted device 100.
The mounting frame 122, for example, the first mounting frame 1221 and the second mounting frame 1222, may include a mounting frame body 1223 provided to extend from an edge of the second case body 121 to one side. The assembly frame main part 1223 is to first casing 11 side bending setting to with the butt of installation frame main part 1123, and form an edge, be convenient for install ray apparatus subassembly 30, also be convenient for keep away from first casing 11 side-mounting vision control glasses at assembly frame 122.
The edge of the mounting frame body 1223 is provided with a side wall 1224 to abut against the flange 1124 of the mounting frame 112. The side wall 1224 is extended from an edge of the assembly frame body 1223 toward one side of the first housing 11. The fitting frame 122 is not provided with the side wall 1224 at the edge connected with the second case body 121. That is, the side wall 1224 is broken at the edge where the fitting frame 122 is connected to the second case body 121, and both ends where the side wall 1224 is broken are respectively connected to both ends where the side wall 1213 is broken. That is, the side wall 1224 and the side wall 1213 form a complete side wall enclosing the second housing body 121 and the mounting frame 122.
The mount frame main body 1223 of the first mount frame 1221 is disposed opposite to the mount frame main body 1123 of the first mount frame 1121. The mounting frame body 1223 of the second mounting frame 1222 is disposed opposite to the mounting frame body 1123 of the second mounting frame 1122. The side wall 1224 of the first mounting frame 1221 abuts against the protruding edge 1124 of the first mounting frame 1121. The side walls 1224 of the second mounting frame 1222 abut the ledge 1124 of the second mounting frame 1122.
The middle portion of the assembly frame body 1223 is provided with an assembly hole 1225 penetrating the assembly frame body 1223 and disposed opposite to the mounting frame 112, for example, the mounting hole 1125. The fitting frame body 1223 is provided with a second abutting convex edge 1226 at the edge of the fitting hole 1225. The second abutting convex edge 1226 is bent from the edge of the fitting frame body 1223 at the fitting hole 1225 toward the side of the first housing 11.
The fitting frame body 1223 is provided with a connecting member 1227 at a side facing the first housing 11 to be connected with the first housing 11 such as the connecting member 1128. In an embodiment, the connection 1227 may include a third snap structure 1227a connected to the first housing 11, e.g., the second snap structure 1128a, and a post 1227b connected to the first housing 11, e.g., the post 1128 b.
A third snap structure 1227a may be provided at an edge of the mounting frame body 1223 to be snap-coupled with a connection member 1128, such as the second snap structure 1128 a. For example, the third snap structures 1227a may be disposed on the side walls 1224 or on the mounting frame body 1223 against the side walls 1224.
The third snap structure 1227a may be plural. In one embodiment, the third snap structure 1227a may include a hook structure disposed on the sidewall 1224 to snap connect with the second snap structure 1128 a. It is understood that the second and third snap structures 1128a and 1227a in the present application are not limited to hooks, bumps, slots, grooves, through holes, etc. So long as the two structures of the second snap structure 1128a and the third snap structure 1227a can be snapped together.
The boss 1227b is disposed at a side of the assembly frame body 1223 close to the first housing 11 to be disposed opposite to the connection member 1128, e.g., the boss 1128 b. The boss 1227b may be particularly disposed at an edge of the assembly frame body 1223. For example, the boss 1227b may be disposed at an edge of the assembly frame body 1223 of the first assembly frame 1221, which is distant from the second assembly frame 1222. For example, the boss 1227b may be disposed at an edge of the fitting frame body 1223 of the second fitting frame 1222, which is away from the first fitting frame 1221. For example, the boss 1227b may be disposed at a position where the fitting frame body 1223 is connected with the second case body 121. In one embodiment, the post 1227b may have a threaded hole therein for connecting with a connector 1128, such as post 1128b, using a screw.
In one embodiment, the mounting frame body 1223 is provided with a mounting portion 1228 at a side facing the first housing 11. The mounting portion 1228 is located at an edge where the assembly frame body 1223 is connected to the second case body 121. The mounting portion 1228 may include a groove and a first magnetic member clamped in the groove. The groove may be formed by inward recess of the assembly frame body 1223, or may be formed by surrounding a protrusion extending from the assembly frame body 1223 to one side of the first housing 11. The first magnetic member may be a magnet. The first magnetic member may be plural. The plurality of first magnetic members may be arranged side by side at intervals. The magnetic poles of two adjacent first magnetic members facing the first housing 11 are different. In an embodiment, the groove may be omitted, and the first magnetic member may be fixed on the assembly frame body 1223 by gluing, clamping, screwing, or the like.
It is to be understood that the number of the assembly frames 122 may be one, that is, the assembly frame body 1223 of the first assembly frame 1221 is connected with the assembly frame body 1223 of the second assembly frame 1222 to form a whole. The arrangement of the plurality of first magnetic members may not be limited, and the arrangement may be a matrix arrangement or a disordered arrangement.
Referring to fig. 9, 10 and 11, the number of the mounting arms 123 is two, namely, a first mounting arm 1231 and a second mounting arm 1232. The first fitting arm 1231 is disposed on the second housing body 121 on a side close to the first connecting arm 1131, and is fixedly connected to the first connecting arm 1131. The second assembling arm 1232 is disposed on the side of the second casing main body 121 close to the second connecting arm 1132, and is fixedly connected to the second connecting arm 1132.
The mounting arm 123, such as the first and second mounting arms 1231, 1232, may include an embedding portion 1233 that is embedded within a recess 1141 in the connecting arm 113. The embedding portion 1233 is provided extending from the edge of the sidewall 1213 a. That is, the embedding portion 1233 may be a portion of the sidewall 1213a, the sidewall 1213a may have a crescent shape as a whole, and the outer surface thereof may be streamline or smooth, for example, to enhance the aesthetic appearance of the product.
In one embodiment, the insertion portion 1233 is provided with a perforation 1234 penetrating the insertion portion 1233. Such that when the insert 1233 is disposed in the recess 1141, the perforations 1234, 1139 communicate to facilitate the fastening of the first housing 11 and the second housing 12 together by screws passing through the perforations 1234, 1139 in sequence. In one embodiment, the insertion portion 1233 may not have the through hole 1139, and may have a plug-in post or the like that is engaged with the through hole 1139 to extend into the through hole 1139 for plug-in fixation. It is understood that the mounting arm 123 and the connecting arm 113 are not limited to the engagement of the embedding portion 1233 and the recess 1141, and other structures can be used to connect the two.
When the first housing 11 and the second housing 12 are assembled, referring to fig. 3, 5 and 9, the inserting portion 1233 of the first mounting arm 1231 is inserted into the recess 1141 of the first connecting arm 1131, and the inserting portion 1233 of the second mounting arm 1232 is inserted into the recess 1141 of the second connecting arm 1132. Two structures of the connecting member 1128, such as the second snap structure 1128a, of the first mounting frame 1121 and the connecting member 1227, such as the third snap structure 1227a, of the first mounting frame 1221 are snap-coupled to each other, and two structures of the connecting member 1128, such as the second snap structure 1128a, of the second mounting frame 1122 and the connecting member 1227, such as the third snap structure 1227a, of the second mounting frame 1222 are snap-coupled to each other. The first mounting arm 1231 is fixedly coupled to the first connecting arm 1131 by screws sequentially passing through the through hole 1234 of the first mounting arm 1231 and the through hole 1139 of the first connecting arm 1131. The first mounting arm 1231 is fixedly coupled to the first connecting arm 1131 by screws sequentially passing through the through hole 1234 of the second mounting arm 1232 and the through hole 1139 of the second connecting arm 1132. At this time, the heat dissipating holes 1214 on the side walls 1213c communicate with the first connecting arms 1131 to form heat dissipating channels 1138. The heat dissipating holes 1214 of the side wall 1213d communicate with the second connecting arms 1132 to form heat dissipating channels 1138.
Please refer to fig. 12, which discloses a schematic structure diagram of the first housing 11 and the second housing 12 being fastened together according to an embodiment of the present application. After the first housing 11 and the second housing 12 are fastened, the first housing body 111 and the second housing body 121 form a first cavity 11 b. After the mounting frame 112, such as the first mounting frame 1121 and the second mounting frame 1122, is matched with the mounting frame 121, such as the first mounting frame 1211 and the second mounting frame 1222, two second cavities 12b may be formed. The first cavity 11b is communicated with the two second cavities 12b, and the two second cavities 12b can also be communicated to form a cavity.
It is understood that after the first housing 11 and the second housing 12 are fastened, the first housing body 111 and the second housing body 121 can be defined as a first housing 11 a; and the mounting frame 112, e.g., the first and second mounting frames 1121 and 1122, and the mounting frame 121, e.g., the first and second mounting frames 1211 and 1122, may be defined as the second housing 12 b.
The above various names, for example: accommodation space, first cavity, second cavity, first casing, second casing can adjust according to actual conditions, and this application is not limited to the restriction to above-mentioned name, can exchange according to the name of actual conditions isostructure.
In order to reduce the size of the head-mounted device 100 as much as possible and to achieve miniaturization and weight reduction, the face mask 13 is more likely to be directly used as an appearance surface, that is, the face mask 13 is more likely to be provided on a surface of the first housing 11 away from the second housing 12. Referring to fig. 3, the mask 13 may be translucent. The mask 13 may include a first mask portion 131, a second mask portion 132, and a third mask portion 133 positioned between the first mask portion 131 and the second mask portion 132, which are bilaterally symmetrical. The first, second, and third cover portions 131, 132, and 133 may be three independent bodies to correspond to the three regions of the first case body 111 divided by the surrounding frame 1112 and the mounting frames 112 such as the first and second mounting frames 1121 and 1122 in the above-described embodiment.
The first mask portion 131 may be attached to the surface of the first housing main body 111 in the area where the second through hole 1113a and the third through hole 1115a are located and the surface of the first mounting frame 1121 on the side away from the second housing 12.
The second mask portion 132 may be attached to the surface of the first housing body 111 in the area where the second through hole 1113b and the third through hole 1115b are located and the surface of the second mounting frame 1122 on the side away from the second housing 12.
The third cover portion 133 may be attached to a surface of the first housing body 111 inside the enclosure 1112.
It will be appreciated that the face shield 13 may also be spaced from the first housing 11. The names of the first mask part, the second mask part, the third mask part and the mask part can be mutually converted, for example, the first mask part can also be called as a second mask part.
The mask 13 has optical transparency, and at least the positions corresponding to the first through holes 1111, e.g., the first through holes 1111a, 1111b, the third through holes 1115, e.g., the third through holes 1115a, 1115b, and the mounting holes 1125 satisfy the optical transparency, so as to achieve the following properties:
external light can pass through the visor 13 and human eyes cannot see objects inside the housing assembly 10 through the visor 13, the first through-hole 1111, the third through-hole 1115 and the mounting hole 1125 in sequence. For example, the transmittance of the face mask 13 is reduced by processing the face mask 13 to achieve a semitransparent effect, so that human eyes cannot see objects inside the housing assembly 10 through the face mask 13, the first through hole 1111, the third through hole 1115 and the mounting hole 1125 in sequence, but the camera assembly 60 inside the housing assembly 10 can see the outside through the face mask 13, thereby being capable of imaging objects outside and the like. The material of the mask 13 may include plastic or hardware.
The cover area of the mask 13 may be equal to the cover area of the first case body 111 and the mounting frame 112 when viewed from the front of the mask 13. To improve the appearance expression. It is understood that the first mask portion 131, the second mask portion 132 and the third mask portion 133 may be a unitary structure, and in an embodiment, the mask 13 may be provided with a groove at a position corresponding to the surrounding frame 1112 to give way to the surrounding frame 1112.
When the mask 13 and the first housing 11 are assembled, please refer to fig. 3, the first mask portion 131 is attached to the area of the surrounding frame 1112 near the first connecting arm 1131, the second mask portion 132 is attached to the area of the surrounding frame 1112 near the first connecting arm 1131, and the third mask portion 133 is attached to the area of the surrounding frame 1112. Any adjacent two portions of the first, second, and third mask portions 131, 132, and 133 are spaced apart by a surrounding frame 1112. The bezel 1112 is flush with the surfaces of the first, second, and third mask portions 131, 132, and 133.
Referring to FIG. 13, a schematic structural view of the decorative element 14 of the embodiment of FIG. 3 of the present application is disclosed. The decorative member 14 may be used to attach a position where the first case 11 is not attached by the mask 13 while wrapping the edge of the mask 13 and the gap at the connection between the first case 11 and the second case 12 to improve the appearance of the head-mounted device 100 and the overall strength of the case assembly 10.
The decorative member 14 may be made of a hard metal material, which may improve the strength of the head-mounted device 100. The decoration 14 may include a first decoration portion 141, a second decoration portion 142, a third decoration portion 143, and a fourth decoration portion 144. The first decorative portion 141, the third decorative portion 143, the second decorative portion 142, and the fourth decorative portion 144 may be connected in sequence to form a closed loop structure.
The first decorative portion 141 is attached to an edge of the first casing main body 111 on a side away from the mounting frame 112, so as to cover a gap where the first casing main body 111 abuts against the side wall 1213a of the second casing main body 121, the notch 1215, and a surface of the connecting arm 1131, such as a side of the first side plate 1133 of the first connecting arm 1131 and the second connecting arm 1132, on a side away from the second side plate 1134. That is, the first decorative part 141 can cover the pivot hole 1143 and the recess 1141, can cover the pivot shaft in the pivot hole 1143, and can cover the mounting arm 123 in the recess 1141.
The second decorative portion 142 can be attached to the outer side surface of the protruding edge 1124 of the mounting frame 112, the second side plate 1134 of the first connecting arm 1131, and the second side plate 1134 of the second connecting arm 1132.
The third decorative portion 143 may be disposed at an opening of the receiving channel 1137 in the first connecting arm 1131 for covering the receiving channel 1137 of the first connecting arm 1131.
The fourth decorative portion 144 may be disposed at an opening of the receiving channel 1137 in the second connecting arm 1132, so as to cover the receiving channel 1137 of the second connecting arm 1132.
Since the connecting arm 113 is connected to the protruding edge 1116 through the first side plate 1133 and the second side plate 1134, and forms the heat dissipation channel 1138, the connecting arm 113, such as the first connecting arm 1131, is fixed by the first decorative portion 141, the second decorative portion 142, and the third decorative portion 143, which enhances the strength of the first housing main body 111 and the connecting arm 113, such as the first connecting arm 1131, may be unstable. In addition, the first decorative portion 141, the second decorative portion 142, and the fourth decorative portion 144 stabilize the connecting arm 113, for example, the second connecting arm 1132, and reinforce the strength of the first housing main body 111 and the connecting arm 113, for example, the second connecting arm 1132.
The decoration 14 may be enclosed on the outer surface of the first housing 11 to cover the gap between the first housing 11 and the second housing 12, the supporting portion of the first housing 11 connected to the supporting component 20, and the receiving channel 1137 and the second wire slot 1140 disposed on the connecting arm 113, and the edge of the decoration 14 is flush with the surface of the mask 13, which improves the appearance of the head-mounted device 100.
Referring to fig. 14 and 15, a schematic structural diagram of the support assembly 20 of the embodiment of fig. 2 of the present application is respectively disclosed. The support assembly 20 may include two legs, a first leg 21 connected to the connecting arm 113, such as the first connecting arm 1131, and a second leg 22 connected to the connecting arm 113, such as the second connecting arm 1132.
Legs, such as the first leg 21 and the second leg 22, may include a leg body 211 and a pivot joint 212 connecting a pivot end 2111 of the leg body 211 and the connecting arm 113. The supporting leg main body 211 is a strip-shaped structure for abutting against the ear and the head, so as to share the weight of the head-mounted device 100. The leg body 211 may be provided with an electrical connection portion 2112 at an end away from the pivoting end 2111 for connecting with an external device such as a battery, an electronic device for image processing such as a mobile phone, and a computer. It is possible to realize power supply to the head mounted device 100 and to realize processing of image resources required for the head mounted device 100 by an external device such as an electronic device for image processing. By removing the battery, a structure available for image processing, from the head-mounted device 100, the weight of the head-mounted device 100 can be greatly reduced, and miniaturization and weight saving of the head-mounted device 100 can be achieved. Of course, a battery and structures, modules, circuits, etc. for image processing may also be integrated in the head-mounted device 100, in techniques well known to those skilled in the art.
The electrical connection portion 2112 is disposed at the end of the leg body 211, which can reduce the interference of external data lines and wires to the user when using the head-mounted device 100. Of course, the electrical connection portion 2112 may be provided at another portion of the leg main body 211. In one embodiment, the electrical connection portion 2112 may be one of interface terminals such as USB and Type-C, or may be a connection structure that can connect the head-mounted device 100 to an external device, as long as the connection between the head-mounted device 100 and the external device is achieved. It is understood that the electrical connection 2112 may be provided on the first leg 21 and/or the second leg 22.
An FPC2113 is embedded in the leg main body 211. One end of the FPC2113 may be electrically connected to an electronic component in the leg main body 211, for example, a key assembly (may be a virtual key on a touch panel, or may be a sensor that functions as a key), a speaker assembly, an indicator light assembly, or another sensor, or may be electrically connected to the electrical connection portion 2112 in the leg provided with the electrical connection portion 2112. The other end of the FPC2113 extends from the pivot end 2111 and is electrically connected to the host 30a of the head-mounted device 100. That is, electronic components such as a key assembly (also may be a virtual key on the touch screen, and also may be a sensor functioning as a key), a speaker assembly, an indicator light assembly, or other sensors may be disposed in the leg main body 211. Of course, electronic components such as a key assembly (also may be a virtual key on the touch screen, and also may be a sensor corresponding to the key), a speaker assembly, an indicator light assembly, or other sensors may be disposed on the first leg 21 and/or the second leg 22.
Referring to fig. 14, 15 and 16, fig. 16 discloses a partial structural schematic diagram of the head-mounted device 100 according to the embodiment shown in fig. 2. The FPC2113 protrudes out of one end of the leg body 211 and can enter the interior of the housing assembly 10 through the receiving channel 1137, the second routing channel 1140, the third routing channel 1216, the first routing channel 1114, and the second through hole 1113. For example, the FPC2113 in the first leg 21 protrudes out of one end of the leg main body 211, and can enter the inside of the housing assembly 10 through the receiving channel 1137 of the first connecting arm 1131, the second routing channel 1140, the third routing channel 1216a, the first routing channel 1114a, and the second through hole 1113 a. For example, the FPC2113 in the second leg 22 protrudes out of the end of the leg body 211 and can enter the interior of the housing assembly 10 through the receiving channel 1137 of the second connecting arm 1132, the second routing channel 1140, the third routing channel 1216b, the first routing channel 1114b and the second through hole 1113 b.
One or more sound outlet holes 2114 corresponding to the speaker assembly in the leg body 211 may be provided on the leg body 211. The sound outlet hole 2114 of the first leg 21 is provided toward the second leg 22. The sound outlet hole 2114 in the second leg 22 is provided toward the first leg 21 side. When the user wears the head mounted device 100, the sound outlet hole 2114 is close to the ear of the user, so that the user can conveniently hear the sound played by the speaker assembly provided in the head mounted device 100.
The pivot joint 212 is used to pivotally connect the leg body 211 to the connecting arm 113, such as the first connecting arm 1131 and the second connecting arm 1132. In one embodiment, the pivot joint 212 may include a first joint (not shown) mounted on a mounting seat 1144 in the connecting arm 113, a second joint (not shown) mounted at the pivot end 2111 of the leg body 211, and a pivot shaft (not shown) extending from the connecting arm 113 through a hole 1143 into the receiving channel 1137 to connect the first joint and the second joint, as will be appreciated by those skilled in the art.
Rotation of the leg is achieved by relative rotation of a first joint and a second joint in the pivot joint 212. While rotating, the connector ribs 1136 position the legs, such as the first leg 21 and the second leg 22, so that the support assembly 20 is wearable. The third side plate 1135 is shorter than the first side plate 1133 and the second side plate 1134, so that the through hole 1139 extends toward the first casing main body 111, and the leg can be bent away from the connecting rib 1136 for being received.
Referring to fig. 17, an exploded view of the opto-mechanical assembly 30 of the embodiment of fig. 2 is disclosed. The opto-mechanical assembly 30 may include a housing 31, an opto-mechanical 32 mounted on the housing 31, a lens assembly 35 and a beam splitter 34 mounted on the housing 31 and disposed opposite the opto-mechanical 32, and a reflector 35 mounted on the housing 31 and disposed opposite the beam splitter 34.
Referring to fig. 17 and 18, fig. 18 discloses a schematic structural diagram of the rack 31 in the embodiment shown in fig. 17. The frame 31 can be formed by processing hardware with high thermal conductivity, has the functions of conducting heat of the heat source of the host 30a of the head-mounted device 100 and heat homogenizing, can save the structures designed for heat dissipation, such as a heat pipe, a graphite layer, a copper foil layer and the like for conducting heat, further reduces the space and the cost, reduces the difficulty of assembly, and realizes the miniaturization and the light weight of the head-mounted device 100. Of course, the frame 31 may be made of other hard materials.
The frame 31 is installed in an accommodating space formed by the first housing 11 and the second housing 12. Since the chassis 31 may be used to mount the opto-engine 32, the chassis 31 may also be referred to as an opto-engine mount.
The chassis 31 may include a chassis body 311. The housing body 311 has a first face 3111, a second face 3112 disposed opposite the first face 3111, a third face 3113 connecting the first face 3111 and the second face 3112, and a fourth face 3114 connecting the first face 3111 and the second face 3112 and disposed opposite the third face 3113. The surface of the frame body 311 facing the side wall 1213a (i.e. the first surface 3111) is provided with a receiving groove 312 at a middle portion thereof for matching with the nose pad assembly 40 and the main board assembly 50. The bottom of the receiving groove 312 is formed with through holes 3121, 3122 penetrating through the rack body 311. The through hole 3121 is disposed opposite to the through hole 1217. The through hole 3122 may be used to fix the nose pad assembly 40, and may also be used to realize ventilation, thereby improving the heat dissipation capability of the frame 31. Receiving slot 312 extends toward side wall 1213a near the slot wall of first housing 11 (i.e., the slot wall of receiving slot 312 on the side of third surface 3113) to form mounting plate 3123 that can extend into recess 1215. The mounting plate 3123 is provided with through holes 3123a, 3123b penetrating the mounting plate 3123 and communicating with the receiving groove 312. Wherein the through holes 3123a, 3123b are disposed opposite to the first through hole 1111. The edge of the mounting plate 3123 is provided with a fourth snap structure 3123c, which may be a groove, that snap-connects with a connecting member 1117, such as the first snap structure 1117 a.
It is understood that the first and fourth snap structures 1117a and 3123c are not limited to hooks, bumps, slots, grooves, through holes, etc. So long as the two structures of the first snap structure 1117a and the fourth snap structure 3123c can be snapped together. The receiving groove 312 has an opening 3124 near an edge of a groove wall of the second housing 12 (i.e., a groove wall of the receiving groove 312 on the side of the fourth surface 3114) to give way to the motherboard assembly 50.
Referring to fig. 17, 18 and 19, fig. 19 discloses a structural schematic diagram of another view of the rack 31 in the embodiment shown in fig. 17. The chassis main body 311 has chassis mounting holes 313 and 314 for mounting the optical chassis 32 and the lens assembly 33 on a surface (i.e., the first surface 3111) facing the side wall 1213a and on both sides of the accommodating groove 312. The opto-mechanical mounting holes 313, 314 extend through the first face 3111 and the second face 3112 of the housing 31. The housing main body 311 is provided with support plates 315 such as first support plates 3151, 3152 and second support plates 3153, 3154 in order in the arrangement direction of the optical machine mounting holes 313, 314 on the surface (i.e., the second surface 3112) on the side away from the side wall 1213a to cooperate with the spectroscope 34 and the reflecting mirror 35. The first support plates 3151 and 3152 are disposed on two sides of the optical engine mounting hole 313, and the second support plates 3153 and 3154 are disposed on two sides of the optical engine mounting hole 314. And a receiving groove 312 is formed between the first supporting plate 3152 and the second supporting plate 3153.
Referring to fig. 18 and 19, the supporting plate 315, such as the first supporting plates 3151 and 3152 and the second supporting plates 3153 and 3154, may be triangular. Wherein the support plate 315 has a first side 3155, a second side 3156, and a third side 3157 that are connected to one another. The first side 3155 is connected to the housing main body 311, and the second side 3156 of the supporting plate 315 faces the second housing 12 and is inclined to the third side 3157 side to form an acute angle with the third side 3157. It is understood that the support plate 315 may have other shapes as long as it can support the beam splitter 34 and the reflecting mirror 35.
The housing main body 311 is provided with a reinforcing rib 3158 which connects the housing main body 311 and stabilizes the support plate 315 to reinforce the stability of the support plate 315. Wherein, the reinforcing rib 3158 connected with the support plate 315, such as the first support plates 3151, 3152, is disposed at a side of the support plate 315, such as the first support plates 3151, 3152, away from the light engine mounting hole 313. Reinforcing ribs 3158 connected to the support plates such as the second support plates 3153, 3154 are provided on the side of the support plate 315 such as the second support plates 3153, 3154 away from the carriage mounting hole 314.
In one embodiment, a coupling hole 3159 may be provided to the reinforcing rib 3158 near the edge of the housing main body 311 in the arrangement direction of the mounting holes 313 and 314 of the optical machine, so that the first housing 11, the housing 31, and the second housing 12 are fixed together by screws sequentially passing through the protrusion 1117b, the coupling hole 3159, and the coupling member 1220. Of course, the frame body 311 may also be provided with a connection hole to enhance the stability of the connection of the first housing 11, the frame 31 and the second housing 12.
In the arrangement direction of the optical machine mounting holes 313 and 314, the frame main body 311 is provided with a pair of offset grooves 316, such as a first offset groove 3161 and a second offset groove 3162, at two opposite side edges thereof for matching with the heat sink assembly 70. The groove walls of the receding groove 316, such as the first receding groove 3161 and the second receding groove 3162, which are close to the first housing 11 (i.e., the groove walls of the receding groove 316, such as the first receding groove 3161 and the second receding groove 3162, on the third surface 3113 side) are provided with a through hole 3163 and a connecting hole 3164, which are communicated with the receding groove 316. So that the first housing 11, the chassis 31 and the second housing 12 are fixed together by screws sequentially passing through the boss 1117b, the coupling hole 3164 and the coupling member 1220.
The receding groove 316, such as the first receding groove 3161 and the second receding groove 3162, is not provided with a groove wall on a side away from the receiving groove 312, and is not provided with a groove wall opposite to the through hole 3163, so that the heat dissipation assembly 70 is mounted at the receding groove 316, such as the first receding groove 3161 and the second receding groove 3162.
A surface of the rack body 311 near one side of the second housing 12 (i.e., the fourth surface 3114) is provided with a limiting structure 317 for arranging circuit traces of the heat sink assembly 70. The limiting structure 317 may include a limiting plate 3171 and a hook 3172 disposed to be offset from or opposite to the limiting plate 3171 and forming a limiting space with the limiting plate 3171.
Referring to fig. 17, 18 and 19, the number of the optical machines 32 is two, and the two optical machines are respectively installed at the optical machine installation holes 313 and 314. For example, the optical engine 32 is mounted on a surface (i.e., the first surface 3111) of the side wall 1213a of the housing main body 311, a spring may be provided between the optical engine 32 and the housing main body 311, the spring may be used to adjust a distance between the optical engine 32 and the housing main body 311, and the optical engine 32 may be fixed to the housing main body 311 by a screw. Through the cooperation of spring and screw, ray apparatus 32 is fixed on support main part 311 to can freely adjust in six dimensions, and through the regulation to ray apparatus 32, can make the image carry out the binocular fusion about, realize the optics purpose.
The lens assemblies 33 are also two and are respectively mounted in the carriage mounting holes 313 and 314. To focus or diffuse the image from the light engine 32.
The beam splitter 34 is also two, one of which is mounted on the second edge 3156 of the first support plates 3151, 3152, and the other of which is mounted on the second edge 3156 of the second support plates 3153, 3154. So that the beam splitter 34 installed on the first support plates 3151, 3152 is disposed opposite to the optical machine 32 installed at the optical machine installation hole 313, and the beam splitter 34 installed on the second support plates 3153, 3154 is disposed opposite to the optical machine 32 installed at the optical machine installation hole 314, so that the optical machine 32 emits an image beam to be projected on the beam splitter 34. The reflecting mirror 35 is also two, one being mounted on the third side 3157 of the first supporting plate 3151, 3152 and the other being mounted on the third side 3157 of the second supporting plate 3153, 3154. So that the beam splitter 34 and the reflecting mirror 35 mounted on the first support plates 3151, 3152 are oppositely disposed, and the beam splitter 34 and the reflecting mirror 35 mounted on the second support plates 3153, 3154 are oppositely disposed. Such that the beam splitter 34 reflects the image beam to the mirror 35 in a certain proportion, and the mirror 35 emits the image beam to the side of the beam splitter 34, and couples the image beam with the view of the real world environment transmitted from the mirror 35 and propagated to the side of the beam splitter 34, and then transmits through the beam splitter 34 to the human eye. A reality augmentation technique is implemented to overlay an image over a view of a real-world environment.
When the opto-mechanical assembly 30 is assembled with the housing assembly 10. The opto-mechanical assembly 30 is placed in the housing assembly 10 such that one beam splitter 34 is positioned at the assembly hole 1225 of the first assembly frame 1221 and abuts against the second abutment ledge 1226. So that the other beam splitter 34 is positioned at the fitting hole 1225 of the second fitting frame 1222 and abuts against the second abutting convex edge 1226. Such that one beam splitter 34 is positioned at the mounting hole 1125 of the first mounting frame 1121 and abuts against the first abutting convex edge 1126. So that the other beam splitter 34 is located at the mounting hole 1125 of the second mounting frame 1122 and abuts against the first abutting convex edge 1126. The first housing 11, the chassis 31, and the second housing 12 are fixed together by screws sequentially passing through the boss 1117b, the connection hole 3159, and the connection member 1220. The first housing 11, the chassis 31, and the second housing 12 are fixed together by screws sequentially passing through the boss 1117b, the connection hole 3164, and the connection member 1220.
Here, the light splitter 34 and the reflector 35 may be fixed by or sealed by adhesive bonding between the support plate 315, the first abutment flange 1126, and the second abutment flange 1226, respectively.
Referring to fig. 20 and 21, exploded views of the nose pad assembly 40 of the embodiment of fig. 2 from different perspectives are respectively disclosed. The nose pad assembly 40 may include a mounting seat 41 mounted in the frame body 311, such as the receiving groove 312, and a nose pad 42 disposed outside the casing assembly 10 and extending into the casing assembly 10 to be connected to the mounting seat 41.
The mounting seat 41 may include a mounting seat body 41 that can be disposed in the accommodating groove 312 and fixedly connected to the frame body 311. The mount body 41 has a through hole 412. The through hole 412 is disposed opposite to the through hole 3121 of the chassis main body 311 and the through hole 1217 of the second casing main body 121, so that the nose pad 42 sequentially passes through the through holes 1217, 3121 and extends into the through hole 412 of the mount main body 41. The mounting seat body 41 is provided with a clamping piece 413 capable of clamping with the nose support 42 in the through hole 412, and the clamping piece 413 can comprise a plate-shaped structure and a bump formed on the plate-shaped structure. The mount main body 41 is opened with a coupling hole 414 penetrating the mount main body 41, and the coupling hole 414 is disposed opposite to the through hole 3122 of the housing main body 311 so as to be fixed by a screw. A connection column 415 is provided on the side of the mounting seat body 41 abutting against the bottom of the accommodation groove 312. The connecting column 415 can be placed in the through hole 3122 to achieve the positioning function of the mounting seat 41. Support posts 416 are provided on the side of the mount body 41 opposite the attachment posts 415 for mating with the motherboard assembly 50. Support post 416 may have threaded holes for screws to be inserted.
The nose pad 42 may include a support 421 and an abutment 422. Wherein the supporting member 421 can be erected on both sides of the bridge of the nose of the human body to support the head-mounted device 100. The supporting member 421 may include a clamping portion 4211 capable of being disposed in the through hole 412 and clamped with the clamping member 413, and a supporting portion 4212 connected with the clamping portion 4211. The latch portion 4211 is provided with a groove 4213 to facilitate engagement with the protrusion of the latch 413. The support portion 4212 may include two plate-shaped structures connected with the snap portion 4211. The two plate-like structures are bent away from each other at an end away from the support portion 4212 so that the two plate-like structures are respectively erected on both sides of the bridge of the nose to support the weight of the head-mounted device 100. The plate-like structure may have elasticity to adjust the degree of bending according to the shape of the nose bridge and the weight of the head-mounted device 100. The supporting portion 4212, for example, one end of the plate-shaped structure away from the clamping portion 4211 is provided with a pivot hole 4214, so as to facilitate installation of the abutting member 422.
The abutment 422 may include an abutment 4221 and a pivot 4222. The abutment 4221 may be made of an elastic material so as to increase the contact area of the abutment 422 with the bridge of the nose by deformation. The pivoting portion 4222 is disposed in the pivoting hole 4214 and pivotally connected to the supporting member 421. Facilitating the rotation of the abutment 422 with respect to the support 421, the position of the abutment 422 has been adjusted so as to be comfortable for the user to wear.
It is understood that the mounting base 41 may be integral with the frame 31, and the nose pad 42 is fixed to the frame 31. In one embodiment, the mounting base 41 may be omitted. In one embodiment, the mounting seat 41 can be omitted, and the nose pad 42 can be directly connected to the second housing 12.
Referring to fig. 22, 23 and 24, fig. 22 discloses a schematic structural diagram of the motherboard assembly 50 in the embodiment shown in fig. 2 of the present application, fig. 23 discloses a schematic structural diagram of a portion of the motherboard assembly 50 in the embodiment shown in fig. 22 of the present application, and fig. 24 discloses a schematic structural diagram of the motherboard assembly 50 in another view of the embodiment shown in fig. 22 of the present application. The main board assembly 50 may include a first main board 51 disposed in the receiving groove 312, a second main board 52 stacked on the first main board 51, and a main board FPC53 connecting the first main board 51 and the second main board 52.
The first main board 51 is provided with a through hole 511, the through hole 511 is opposite to the supporting column 416, so that the first main board 51 can be conveniently connected with the supporting column 416 through the through hole 511 by a screw, and the connection between the first main board 51 and the mounting base 41 is realized. The first main board 51 is provided with a first connection end 512 in the containing groove 312 near the opening 3124, and a camera connection end 513 near the first housing 11 side.
The second main board 52 is disposed on a side of the first main board 51 away from the mounting base 41 and disposed on the heat sink assembly 70. The second main board 52 is provided with a through hole 521 for facilitating screwing in a screw to be connected and fixed with the heat dissipation assembly 70, the screw passes through the through hole 521, the heat dissipation assembly 70 and the connecting hole 414 on the mounting base 41 to realize the fixing of the first main board 51, the second main board 52, the heat dissipation assembly 70 and the mounting base 41, the screw passes through the through hole 521, the connecting hole on the heat dissipation assembly 70 and the frame main body 311 to realize the fixing of the first main board 51, the second main board 52 and the frame main body 311.
The second connection end 522 is provided at a position of the second main plate 52 opposite to the opening 3124. The second main board 52 is opposite to the first through hole 1211 at the first FPC 523. The first FPC523 extends toward the second housing 12 and is attached to the frame 31 at a position opposite to the first through hole 1211 (i.e., a position of the fourth surface 3114 opposite to the first through hole 1211). In an embodiment, a distance sensor may be disposed on the first FPC523, so as to control the distance sensor by the motherboard assembly 50, and further, the distance between the distance sensor and the head of the human body is measured through the first through hole 1211 to determine whether to wear the head-mounted device 100.
The second FPC524, 525 is disposed on one side (i.e., the third surface 3113) of the second main board 52 close to the first housing 11, so that the second FPC524 is electrically connected to the FPC2113 on the first supporting leg 21, and the second FPC525 is electrically connected to the FPC2113 on the second supporting leg 22, so that the main board assembly 50 exchanges electrical energy and information with an external device. The second FPCs 524 and 525 extend toward a side close to the first housing 11. The second FPC524 is attached and fixed to a portion of the frame 31 opposite to the second through hole 1113a (i.e., a portion of the third surface 3113 opposite to the second through hole 1113 a). The second FPC525 is attached and fixed to a portion of the frame 31 opposite to the second through hole 1113b (i.e., a portion of the third surface 3113 opposite to the second through hole 1113 b).
The second main board 52 is provided with third FPCs 526, 527 at a position close to one side of the second housing 12 and corresponding to the optical engine 32. So that the third FPCs 526, 527 are electrically connected to one optical device 32, respectively, to control the optical device 32 by the motherboard assembly 50. The third FPC526, 527 extends to a side close to the second housing 12.
The second main board 52 is provided with fourth FPCs 528, 529 at a side close to the second housing 12 (i.e., the side of the second main board 52 at the fourth surface 3114) and at both sides of the third FPCs 526, 527. So as to be connected with the camera and control the camera by the main board assembly 50. In an embodiment, the second main board 52 may further include a connector pressing plate on the fourth FPC528, 529, so that the connection between the fourth FPC528, 529 and the camera is pressed, and connection looseness is avoided. The connector pressing plate can be a hardware pressing plate support and tightly press the connector pressing plate, so that the connector can be protected from loosening if falling or violently shaking is met in the using process, the electrical function is kept normal, and the service life of the whole machine is prolonged.
In one embodiment, the fourth FPC528, 529 extends to a side near the second housing 12 and is fixed to the fourth surface 3114 of the chassis 31.
One end of the motherboard FPC53 is electrically connected to the first connection terminal 512 on the first motherboard 51, and the other end is electrically connected to the second connection terminal 522 on the second motherboard 52.
Please refer to fig. 25, which discloses a schematic structural diagram of the image capturing module 60 according to the embodiment of the present application shown in fig. 2. The camera assembly 60 is mounted on the bracket 31 of the opto-mechanical assembly 30. The camera assembly 60 may include a TOF (Time of flight, TOF) camera 61, an RGB camera 62, and fisheye cameras 63, 64.
The TOF camera 61 may be fixed in the through hole 3123a of the mounting plate 3123, and the TOF camera 61 may include a light emitting module 611 disposed opposite to the first through hole 1111b, a photosensitive receiving module 612 disposed opposite to the first through hole 1111a, and an FPC613 connected to the light emitting module 611 and the photosensitive receiving module 612, respectively, and to the camera connection terminal 513 of the first main board 51. The light emitting module 611 has a front end portion, which may also serve as a front end portion of the TOF camera 61.
When the TOF camera 61 works, the light emitting module 611 is configured to emit a modulated light beam, the light beam is reflected by a target object and then received by the light receiving module 612, and the light receiving module 612 can obtain the flight time of the light beam in space through demodulation, so as to calculate the distance of the corresponding target object. Thus, with the TOF camera 61, the shape and model of the room can be modeled when the user wears the head-mounted device 100 around, for example, the environment of the room; that is, the shape and model of the room in which the user is located can be determined by measuring the distance from each point to the head-mounted device 100 worn by the user, thereby constructing a scene.
The RGB camera 62 may be fixed in the through hole 3123b of the mounting plate 3123. The RGB camera 62 may be used to collect a two-dimensional color image, photograph a color difference of the image, and the like, and the RGB camera 62 may include a camera main body 621 disposed opposite to the first through hole 1111c and an FPC 622 connected to the camera main body 621 and connected to the camera connecting end 513 of the first main board 51. The camera main body 621 has a front end portion, and the front end portion may be a front end portion of the RGB camera 62.
The fisheye camera 63 may include a camera body 631 fixed in the through hole 3163 at the first escape groove 3161 and disposed opposite to the third through hole 1115a, and an FPC632 connected to the camera body 631 and connected to the fourth FPC 528. The camera main body 631 has a front end portion which can also be a front end portion of the fisheye camera 63.
The fisheye camera 64 may include a camera main body 631 fixed in the through hole 3163 at the second escape groove 3162 and disposed opposite to the third through hole 1115a, and an FPC632 connected to the camera main body 631 and connected to the fourth FPC 529. The camera main body 631 has a front end portion which can also be a front end portion of the fisheye camera 63.
In one embodiment, the TOF camera 61 and the RGB camera 62 are disposed adjacent to each other and receive external light through the first through hole 1111, and the fisheye cameras 63 and 64 are disposed on two sides of the TOF camera 61 and the RGB camera 62. The fisheye cameras 63, 64 are mainly used for matching images. Of course, the position arrangement of the cameras is not limited to this, and can be adjusted according to actual needs. In addition, the types of the cameras are not limited to the above, and different types of cameras can be selected according to actual needs.
Adopt different cameras, different arrangement positions for the formation of image principle and effect all can be different. For example, four cameras TOF camera 61, RGB camera 62 and fisheye cameras 63, 64 may complement each other; the fisheye cameras 63, 64 have a large shooting angle, and may be wide-angle cameras, but the resolution may be relatively low. The resolution of the RGB camera 62 can be relatively high, but the shooting angle can be relatively small, and by combining the RGB camera 62 and the fisheye cameras 63 and 64, a relatively clear image with a relatively large shooting angle can be formed.
Referring now to fig. 26, therein is shown an exploded view of the heat sink assembly 70 of the embodiment of the present application shown in fig. 2. The heat dissipation assembly 70 may include a heat dissipation plate 71 sandwiched between the first main plate 51 and the second main plate 52, and an air cooling module 72 disposed in an avoiding groove 316 of the rack 31, such as the first avoiding groove 3161 and the second avoiding groove 3162.
Please refer to fig. 27 and fig. 28, which respectively disclose a schematic structural diagram of the heat dissipation plate 71 in the embodiment shown in fig. 26. The heat dissipation plate 71 may be made of a heat conductive metal or other heat conductive material such as graphite. The heat sink 71 may include a heat sink body 711 covering the first surface 3111 of the frame 31 and a plurality of heat sinks 712 provided on the heat sink body 711. The heat dissipating plate main body 711 is provided with a through hole 7111 penetrating through the heat dissipating plate main body 711, so that the heat dissipating plate main body 711 is fixed on the rack 31 by passing a screw through the through hole 7111, and is fixed to the first main plate 51 and the second main plate 52 by passing the screw through the through hole 7111. A positioning portion 7112 is disposed on a side of the heat dissipation plate main body 711 facing the chassis 31, opposite to the supporting pillar 416, so that the positioning portion 7112 is connected and fixed with the supporting pillar 416, and functions to support the heat dissipation plate main body 711 and the motherboard assembly 50.
The heat sink main body 711 may be abutted against a surface of the carriage 32 facing the side wall 1213a to dissipate heat of the carriage 32. The portion of the heat sink main body 711 opposite to the receiving groove 312 can abut against the first main board 51 to dissipate heat of the first main board 51. The side of the heat sink main body 711 remote from the chassis 31 may abut against the second main board 52 to dissipate heat from the second main board 52. In one embodiment, the first main plate 51 and the second main plate 52 may be fixed together on the heat dissipation plate main body 711. A side of the heat dissipation plate main plate 711 facing the mounting plate 3123 may abut against the TOF camera 61 and the RGB camera 62 so as to dissipate heat from the TOF camera 61 and the RGB camera 62.
A plurality of fins 712 stand side by side on the side of the radiator plate main body 711 facing the side wall 1213a, and are respectively located on both sides of the second main plate 52. Fins 712 are positioned opposite the louvers 1214 on the side walls 1213 a. The heat sink body 711 and the side walls 1213a can form a passage for air to flow through by providing the heat sink 712 in an upright manner. External air is facilitated to enter the housing assembly 10 through the heat dissipating holes 1214 in the side walls 1213a and to flush the heat sink 712 to remove heat.
Referring to fig. 26, the air cooling module 72 can dissipate heat of the host 30a in the housing assembly 10 by generating a flowing air flow in the housing assembly 10. The air cooling module 72 may include two air cooling modules, a first air cooling module 721 and a second air cooling module 722. The first air-cooling module 721 may be disposed in the avoiding groove 316, such as the first avoiding groove 3161. The second air-cooling module 722 may be disposed in the relief groove 316, such as the second relief groove 3162. The air-cooling module 72, such as the first air-cooling module 721 and the second air-cooling module 722, may include a fan mount 723 and a fan 724. The fan mounting base 723 is closer to the accommodating groove 312 than the fan 724 in the arrangement direction of the first and second avoiding grooves 3161 and 3162. The fan 724 of the first air-cooling module 721 is closer to the sidewall 1213c and is opposite to the heat dissipation holes 1214 on the sidewall 1213 c. The fan 724 of the second air-cooling module 722 is closer to the sidewall 1213d and is disposed opposite to the heat dissipation holes 1214 on the sidewall 1213 d.
The blower mount 723 may be a frame structure so as to form a space in which an air current flows. The fan mount 723 abuts the fisheye cameras 63 and 64 toward the first housing 11 to fix the fisheye cameras 63 and 64 in the through hole 3163. For example, the fan mounting base 723 of the first air-cooling module 721 is abutted against the fisheye camera 63 toward the first housing 11, so that the fisheye camera 63 is fixed to the frame 31, and the fisheye camera 63 can be cooled by the air flow in the fan mounting base 723 of the first air-cooling module 721. For example, the fan mounting base 723 of the second air-cooling module 722 abuts against the fisheye camera 64 toward the first housing 11 side, so that the fisheye camera 64 is fixed to the frame 31, and the fisheye camera 64 can be cooled by the air flow in the fan mounting base 723 of the second air-cooling module 722.
The blower 724 may include a blower body 7241 secured to a blower mount 723 and wires 7242 connecting the blower body 7241 to a second motherboard 52, such as a first FPC 523.
The fan body 7241 of the first air-cooling module 721 is closer to the sidewall 1213c, the air outlet of the fan body 7241 is opposite to the heat dissipation holes 1214 on the sidewall 1213c, and the fan body 7241 abuts against the limiting plate 1218 on the sidewall 1213 c. The limiting plate 1218, the fan mounting seat 723 and the frame 31 are matched to realize the mounting and fixing of the fisheye camera 63 and the fan 724. The fan body 7241 of the second air-cooling module 722 is closer to the side wall 1213d, the air outlet of the fan body 7241 is disposed opposite to the heat dissipation holes 1214 on the side wall 1213d, and the fan body 7241 abuts against the stopper plate 1219 on the side wall 1213 d. The limiting plate 1219, the fan mounting seat 723 and the frame 31 are matched to realize the installation and fixation of the fisheye camera 64 and the fan 724.
The wires 7242 are disposed on a side of the chassis 31 facing the second housing 12. In particular, the fixing device can be fixed on the frame 31 through a limiting structure 317.
In an embodiment, in order to better achieve the heat dissipation effect of the head-mounted device 100, graphite heat dissipation fins may be attached to the optical engine assembly 30 (e.g., the optical engine 32), the main board assembly 50 (e.g., the second main board), and the camera assembly 60 (e.g., the light emitting module 611, the photosensitive receiving module 612, the FPC613, the camera body 621, the FPC 622, the camera body 631, the FPC632, the camera body 641, and the FPC642) to improve the heat dissipation effect.
When the heat dissipation assembly 70 is in operation, when the air cooling module 72, such as the first air cooling module 721 and the second air cooling module 722, operates, a negative pressure is generated inside the casing assembly 10, and external air can enter the casing assembly 10 through the heat dissipation holes 1214 on the side walls 1213a and the second through holes 1212 on the second casing body 121. The air flows to the first air-cooling module 721 and the second air-cooling module 722 through the heat dissipation plate 71, the heat generated by the optical-mechanical assembly 30, the main board assembly 50, the TOF camera 61 and the RGB camera 62 is taken away in the process of air circulation, the air then flows to the fan mounting seat 723, the heat of the fisheye cameras 63 and 64 is further taken away at the fan mounting seat 723, and finally the air is discharged into the heat dissipation channel 1138 from the heat dissipation holes 1214 of the side walls 1213c and 1213d under the action of the fan main body 7241.
When the head-mounted device 100 is assembled, a gasket may be provided between portions that are likely to be damaged and come into contact with the head-mounted device, for example, FPC, camera, and main board. The gasket can be clamped between any two parts when being assembled, so that the two parts are prevented from being in hard contact, and a protection effect is achieved. The pad may be made of a compressible or resilient material such as flexible rubber, foam, or the like. In addition, a sealing piece can be arranged at the position needing sealing and waterproofing for sealing and waterproofing.
The names of the "first FPC", "second FPC", "third FPC", "fourth FPC", "main board FPC", and "FPC" may be mutually converted, for example, the "first FPC" may also be referred to as the "second FPC".
In one embodiment, please refer to fig. 29, which discloses a schematic structural diagram of a head-mounted device 100 according to another embodiment of the present application. The head-mounted device 100 may include the housing assembly 10, the support assembly 20, the opto-mechanical assembly 30, the nose pad assembly 40, the main board assembly 50, the camera assembly 60, and the heat sink assembly 70 in the above embodiments. Additionally, vision adjusting glasses 80 may also be included. The vision adjusting glasses 80 may be installed at a side of the second housing 12 away from the first housing 11. Specifically, it may be mounted at the mounting portions 1228 of the mounting frame 122, for example, the first and second mounting frames 1221 and 1222.
Please refer to fig. 30, which discloses a schematic structural diagram of a pair of vision adjusting glasses 80 according to the embodiment of fig. 29. The vision adjusting glasses 80 may include two glasses units 81. One of the eyeglass units 81 is fixedly coupled to the mounting portion 1228 of the mounting frame 122, for example, the first mounting frame 1221. The other eyeglass unit 81 is fixedly coupled to the mounting portion 1228 of the mounting frame 122, for example, the second mounting frame 1222.
Referring to fig. 30 and 31, fig. 31 is a schematic structural diagram of a glasses unit 81 according to the embodiment shown in fig. 30. The eyeglass unit 81 may include an eyeglass lens 811 and an eyeglass frame 812 formed at one side of the eyeglass lens 811 and fixed in connection with the mounting part 1228. Here, the spectacle frame 812 is bent from the edge of the spectacle lens 811 to one side. Since the mount frame body 1223 is bent toward the first housing 11 so as to abut against the mount frame body 1123 and form a corner in the above-described embodiment, when the user wears the head-mounted device 100, the light incident to the human eye cannot vertically pass through the mount frame body 1223. Further, when the eyesight adjusting glasses 80 are attached to the mounting frame body 1123, the light incident to the human eye does not vertically pass through the spectacle lens 811. Therefore, the spectacle frame 812 is bent so that when the head-mounted device 100 is fitted with the visual acuity adjusting spectacles 80, the light incident on the human eye may vertically or nearly vertically transmit through the spectacle lens 811.
The eyeglass frame 812 may be arranged in parallel with a plurality of second magnetic members 8121 that may attract the first magnetic members in the mounting portion 1228 in the extending direction thereof. The second magnetic element 8121 may be a magnet. The magnetic poles of the two adjacent second magnetic members 8121 at the end facing the mounting portion 1228 are different. The vision adjusting glasses 80 adopt a split type installation mode, fully utilizes the morphological characteristics of an optical scheme, minimizes the head-mounted device 100, lightens and lightens the spectacle lenses 811, and does not damage the appearance integrity of the whole head-mounted device 100. When the glasses unit 81 is mounted, the glasses unit 81 is influenced by the attraction and repulsion force of the magnet, and when the glasses unit 81 is close to the corresponding region of the mounting portion 1228, the glasses unit can be automatically attached to the second housing 12 without additional positioning structures such as jacks, bone positions, buckles, even screws and the like. When the eyeglass unit 81 is taken off, the transparent eyeglass lens 811 is directly taken off, and the second magnetic part 8121 of the eyeglass frame 812 and the second housing 12 are separated by a short distance, so that the eyeglass can be completely taken off.
It will be appreciated that the vision adjusting glasses 80 may also be a unitary body. For example, the ophthalmic lenses 811 of the two spectacle units 81 are fixed together by means of the same spectacle frame 812. In one embodiment, in order to better protect the spectacle lens 811, in one spectacle unit 81, a spectacle frame 812 may be provided around the spectacle lens 811. In addition, the arrangement of the second magnetic members 8121 matches the arrangement of the first magnetic members, and the arrangement may be a matrix arrangement or a disordered arrangement.
Referring to fig. 32, a schematic structural diagram of a head-mounted device 200 according to another embodiment of the present application is disclosed. The head-mounted device 200 may be VR glasses, AR glasses, MR (Mix Reality) glasses, or other smart glasses that can be worn on the head, for example. The head-mounted device 200 may be, for example, in the shape of eyeglasses as shown in fig. 1 and 2, having a support assembly 20 and an opto-mechanical assembly 30, a main board assembly 50, and the like. It should be noted that the present disclosure does not limit the shape and/or style of the head mounted device 200, and fig. 1 and 2 are only examples and do not limit the present disclosure.
Referring to fig. 32, the head-mounted device 200 may include: a data acquisition module 91, a data output module 92, a serial interface 93 and an integrated circuit module 94.
The serial interface 93 may be, for example, a USB interface satisfying USB 2.0 specification, USB3.0 specification, and USB3.1 specification, and may include: micro USB interface or USB TYPE-C interface. Further, the serial interface 93 may also be an electrical connection portion 2112 in fig. 15. Even the serial interface 93 may be any other type of serial interface capable of being used for serial data transmission.
The integrated circuit module 94 may include: the data conversion module 941 and the interface module 942, the data conversion module 941 is connected to the data acquisition module 91 and the data output module 92 through the interface module 942, respectively. The integrated circuit module 94 may be disposed on the first main board 51 and/or the second main board 52 in fig. 24.
The data conversion module 941 is configured to serialize and convert data collected from the data collection module 91 through the interface module 942, and output the converted serial data through the serial interface 93, so as to process the converted serial data, for example, transmit the converted serial data to an external device such as an electronic device for processing.
The data conversion module 941 is further configured to convert serial data received through the serial interface 93 to convert the received serial data into interface data matching with an interface protocol of the interface module 942, and transmit the converted interface data to the data output module 92 through the interface module 942, so as to output the converted interface data to a user through the data output module 92.
The Integrated Circuit module 94 may be implemented as an ASIC (Application Specific Integrated Circuit) data integration processing chip, for example, or may also be implemented as an FPGA (Field Programmable Gate Array).
According to the head-mounted device provided by the embodiment of the disclosure, the integrated circuit chip is used in the head-mounted device, data acquisition is performed through the interface module in the integrated circuit chip, and the acquired data and the data received from the host unit are converted in a centralized manner through the data conversion module, so that on one hand, the space and the volume of the head-mounted device can be greatly reduced, and the light and thin head-mounted device is favorably realized; on the other hand, the power consumption of the chip can be reduced, the heat generation of the head-mounted equipment is reduced, and the user experience is improved; in addition, centralized conversion may also reduce overall data processing delays for the head-mounted device.
Please refer to fig. 33, which discloses a schematic structural diagram of another embodiment of the head-mounted device 200 according to the embodiment shown in fig. 32. The integrated circuit module 94 of the head-mounted device 200 may include a plurality of Interface modules 942, for example, the plurality of Interface modules 942 may be an I2C Interface module, an SPI Interface module, an I2S Interface module, a SLIMBus Interface module, and an MIPI (Mobile Industry Processor Interface) Interface module, respectively.
The I2C interface module communicates with the connected modules using the I2C bus, which is a simple, bi-directional two-wire synchronous serial bus, I2C. It requires only two wires to transfer information between devices connected to the bus. The master device is used to initiate the bus to transfer data and to generate a clock to open up the devices that are transferring, when any addressed device is considered a slave device. If the master device is to send data to the slave device, the master device addresses the slave device first, then actively sends the data to the slave device, and finally the master device terminates data transmission; if the master is to receive the slave's data, the slave is first addressed by the master. The master device is responsible for generating the timing clock and terminating the data transfer. Generally, I2C is a control interface for transmitting control signaling.
And the SPI interface module communicates with the connected modules by using an SPI bus. The SPI bus is a high-speed, full-duplex synchronous communication bus. The SPI communication principle is simple and it works in a master-slave mode, which usually has a master and one or more slaves, requiring 4 lines for master data input, master data output, clock signal transmission, and enable signal transmission for master output, respectively. Usually, the SPI interface is also a control interface for transmitting control signaling.
The I2S interface module communicates with connected modules using an I2S bus. The I2S bus is a bus standard established for audio data transmission between digital audio devices (e.g., CD players, digital sound processors, digital television sound systems). The design of independent wire transmission clock and data signal is adopted, and the data and clock signal are separated, so that the distortion caused by time difference is avoided, the cost for purchasing professional equipment for resisting audio jitter is saved for users, and the method is widely applied to various multimedia systems. A standard I2S bus cable is made up of 3 serial conductors: 1 is a Time Division Multiplexing (TDM) data line; 1 is a word selection line; the 1 root is the clock line.
The SLIMBus interface module communicates with connected modules using a SLIMBus bus. The SLIMBus bus is an audio interface specified by the MIPI alliance for connecting a baseband/application processor and an audio chip, typically for transmitting audio data. The two ends of the SLIMbus are composed of an interface device and one to a plurality of functional devices, the interface device and the functional devices are connected by one to a plurality of ports, and the ports can be only input, only output or bidirectional. The SLIMBus bus supports dynamic stop and restart and supports all sampling frequencies.
The MIPI interface module and the connected module adopt MIPI interface specifications for communication. MIPI is an open standard and a specification established by the MIPI alliance for mobile application processors. The purpose is to standardize the interfaces in the mobile phone, such as a camera, a display screen interface, a radio frequency/baseband interface and the like, thereby reducing the complexity of the mobile phone design and increasing the design flexibility. The MIPI multimedia specification is largely divided into three layers, namely an application layer, a protocol layer and a physical layer. The interface is mainly applied to interfaces of equipment such as a camera, a display and the like, and can comprise a camera interface CSI (Camera Serial interface), a display interface DSI (display Serial interface) and the like.
As shown in fig. 33, the head-mounted device 200 may include a plurality of data acquisition modules 91, for example, the plurality of data acquisition modules 91 may be: an audio data acquisition module, a video data acquisition module (e.g., camera assembly 60 shown in fig. 25), an eye tracking module, and a sensory data acquisition module.
The audio data acquisition module may include, for example, a microphone and an audio Codec (Codec). The audio codec audio-encodes the data collected by the microphone.
The video data acquisition module may include, for example, a camera such as a lens of a general camera, an IR (Infrared Ray) lens of an IR camera, and the like.
Eye tracking is a scientific application technology, when the eyes of a person look at different directions, the eyes can slightly change, the changes can generate extractable features, and a computer can extract the features through image capture or scanning, so that the changes of the eyes can be tracked in real time, the state and the demand of a user can be predicted, response is carried out, the purpose of controlling equipment by the eyes is achieved, and for example, the user can turn pages without touching a screen. In principle, eye movement tracking mainly studies the acquisition, modeling and simulation of eyeball movement information, and has wide application. Besides the eye tracker, the equipment for acquiring the eye movement information can also be image acquisition equipment, even a camera on a common computer or a mobile phone, and the eye movement information acquisition equipment can also realize eye tracking under the support of software.
The eye tracking module may include an eye tracker, an image capture device, etc., as described above.
The sensing data acquisition module may include, for example: proximity sensors (Proximity sensors), IMDs (Inertial Measurement units), visible Light sensors (Ambient Light sensors), and the like.
Among them, the proximity sensor (for example, a distance sensor provided on the first FPC 523) is a generic name of a sensor that is intended to detect without touching a detection object, instead of a contact detection method such as a limit switch. The movement information and the presence information of the detection object can be converted into an electric signal. The detection principle of the induction type proximity sensor is to detect a magnetic loss caused by an eddy current generated on a surface of a conductor by the influence of an external magnetic field. An alternating magnetic field is generated in the detection coil, and a change in impedance due to an eddy current generated in the metal body of the detection body is detected. Alternatively, an aluminum detection sensor that detects a frequency-phase component, an all-metal sensor that detects only an impedance change component by a working coil, or the like may be included.
IMD is a device for measuring the three-axis attitude angle (or angular rate) and acceleration of an object. Generally, an IMU includes three single-axis accelerometers and three single-axis gyroscopes, the accelerometers detect acceleration signals of an object in three independent axes of a carrier coordinate system, and the gyroscopes detect angular velocity signals of the carrier relative to a navigation coordinate system, and measure angular velocity and acceleration of the object in three-dimensional space, and then solve the attitude of the object.
The visible light sensor is a device which takes visible light as a detection object and converts the visible light into an output signal. The visible light sensor can sense the regularly measured quantity and convert the regularly measured quantity into a device or a device of a usable output signal.
Referring to fig. 33, the audio data acquisition module 91 can be connected to the data conversion module 941 through the SLIMBus interface module 942 and the SPI interface module 942. The audio data acquisition module 91 and the SPI interface module 942 can transmit control signals therebetween, and the audio data acquisition module 91 and the SLIMBus interface module 942 can transmit audio data therebetween.
The video data acquisition module 91 may be connected to the data conversion module 941 through the MIPI interface module 942 and the I2C interface module 942. The video data acquisition module 91 and the MIPI interface module 942 can transmit video data, and the video data acquisition module 91 and the I2C interface module 942 can transmit control signals.
The eye tracking module 91 may be connected to the data conversion module 941 through the MIPI interface module 942 and the I2C interface module 942. The eye tracking module 91 and the MIPI interface module 942 may transmit eye tracking data therebetween, and the eye tracking module 91 and the I2C interface module 942 may transmit a control signal therebetween.
The sensing data collection module 91 can be connected to the data conversion module 941 through an I2C interface module 942. The sensing data acquisition module 91 may transmit sensing data and control signals to the I2C interface module 942.
With continued reference to fig. 33, the head-mounted device 200 may also include a plurality of data output modules 92, for example. The plurality of data output modules 92 may include, for example, a display module 92 and an audio data output module 92. The display module 92 may be, for example, the optical-mechanical assembly 30 shown in fig. 2.
The audio data output module 92 may include, for example, a speaker (speaker component in the leg body 211) and/or a headphone interface, and outputs audio data by externally connecting headphones.
The display module 92 may be connected to the data conversion module 941 through the MIPO interface module 942 and the I2C interface module 942. The display module 92 and the MIPO interface module 942 may transmit video data to be displayed, and the display module 92 and the I2C interface module 942 may transmit a control signal.
The audio data output module 92 can be connected to the data conversion module 941 through the I2S interface module 942 and the I2C interface module 942. The audio data output module 92 and the I2S interface module 942 can transmit audio data to be output, and the audio data output module 92 and the I2C interface module 942 can transmit control signals.
The integrated circuit module 94 may further include a clock module 943, which is respectively connected to the data conversion module 941 and each interface module 942 for outputting a clock signal to each module.
In some embodiments, the integrated circuit module 94 may further include: a data compression module 944 and a data decompression module 945.
The data compression module 944 and the data decompression module 945 are respectively connected between the data conversion module 941 and the serial interface 93.
The data compression module 944 is configured to compress serial data to be output before the data conversion module 941 outputs the converted serial data through the serial interface 93, and output the compressed serial data through the serial interface 93.
The data decompression module 945 is configured to decompress the serial data received through the serial interface 93 before the data conversion module 941 receives the serial data through the serial interface 93, and transmit the decompressed serial data to the data conversion module 941 for conversion.
By compressing the data to be transmitted, the transmission bandwidth can be saved, and the transmission rate is improved, so that the real-time performance of the data is further ensured, and the user experience is improved. It should be noted that the present disclosure does not limit the data compression/decompression algorithm used, and the specific algorithm can be selected according to the requirement in practical application.
In some embodiments, the head mounted device 200 may further include: and the power management module 95 is connected to the serial interface 93, and is configured to receive, through the serial interface 93, the electric energy provided by the power supply device connected to the serial interface 93, so as to supply power to the head-mounted device 200.
Referring to fig. 34, a schematic structural diagram of another embodiment of the head-mounted device 200 according to the embodiment of fig. 32 of the present application is disclosed. The head mounted device 200 may further include a host unit 96. The host unit 96 may include: a processing module 961, a serial interface 962, and an integrated circuit module 963.
The processing module 961 is connected to the integrated circuit module 963. The processing module 961 may be, for example, an Application Processor (AP) and is configured to process the received data and return the processed data (video data and/or audio data) to the integrated circuit module 94 through the integrated circuit module 963 for output.
Corresponding to the serial interface 93, the serial interface 962 may also be a USB interface satisfying the USB 2.0 specification, the USB3.0 specification, and the USB3.1 specification, and may include: micro USB interface or USB TYPE-C interface. Serial interface 962 may also be any other type of serial interface capable of serial data transmission. A cable may be connected between serial interface 962 and serial interface 93.
The integrated circuit module 963 may include: a data conversion module 9631 and an interface module 9632. The data conversion module 9631 is connected to the processing module 961 through an interface module 9632. The data conversion module 9631 is configured to convert serial data received through the serial interface 962, convert the received serial data into interface data matching with an interface protocol of the interface module 9632, and transmit the converted interface data to the processing module 961 through the interface module 9632.
The data conversion module 9631 is further configured to serialize the processed data (audio data and/or video data) received from the processing module 961 through the interface module 9632, and output the converted serial data to the serial interface 93 through the serial interface 962.
It will be appreciated by those skilled in the art that the host unit 96 may be a dedicated device configured with the head-mounted device 200, or the host unit 96 may be an electronic device (e.g., a smart phone, a tablet computer, etc.) configured with the integrated circuit module 963. A processor (e.g., a CPU or an AP) in the electronic device may be the processing module 961, and the processor may perform corresponding processing on data received through the integrated circuit module 963 by installing a corresponding application program in the electronic device.
Referring to fig. 35, a schematic structural diagram of the host unit 96 shown in fig. 34 according to the present embodiment is disclosed. The integrated circuit module 963 of the host unit 96 may include a plurality of interface modules 9632, and the plurality of interface modules 9632 may also be an I2C interface module, an SPI interface module, an I2S interface module, a SLIMBus interface module, and a MIPI interface module, respectively.
The data conversion module 9631 may transmit the converted audio data to the processing module 961 through the SLIMBus interface module 9632 and the SPI interface module 9632; the data conversion module 9631 may transmit the converted video data to the processing module 961 through the MIPI interface module 9632 and the I2C interface module 9632; the data conversion module 9631 may transmit the converted eye tracking data to the processing module 961 through the MIPI interface module 9632 and the I2C interface module 9632; the data conversion module 9631 may transmit the converted sensing data to the processing module 961 through the I2C interface module 9632.
The integrated circuit module 963 may further include a clock module 9633 for transmitting a clock signal to the data conversion module 9631 and each interface module 9632.
In some embodiments, the integrated circuit module 963 may further include: a data compression module 9634 and a data decompression module 9635.
The data compression module 9634 and the data decompression module 9635 are respectively connected between the data conversion module 9631 and the serial interface 962.
The data decompression module 9635 is configured to decompress serial data received through the serial interface 962 before the data conversion module 9631 receives the serial data from the serial interface 93 through the serial interface 962, and transmit the decompressed serial data to the data conversion module 9631 for conversion.
The data compression module 9634 is configured to compress serial data to be output before the data conversion module 9631 outputs the converted serial data through the serial interface 962, and output the compressed serial data to the serial interface 93 through the serial interface 962.
It will be understood by those skilled in the art that the compression algorithm used by the data compression module 944 should match the decompression algorithm used by the data decompression module 9635 in the host unit 96 in fig. 33, and the compression algorithm used by the data compression module 9634 in the host unit 96 should match the decompression algorithm used by the data decompression module 945 in fig. 33.
By compressing the data to be transmitted, the transmission bandwidth can be saved, and the transmission rate is improved, so that the real-time performance of the data is further ensured, and the user experience is improved. It should be noted that the present disclosure does not limit the data compression/decompression algorithm used, and the specific algorithm can be selected according to the requirement in practical application.
In some embodiments, the host unit 96 may further include: a power management module 964 and a battery 965. The power management module 964 is respectively connected to the battery 965 and the serial interface 962, and is configured to provide the power provided by the battery 965 to the serial interface 962 through the serial interface 962, so as to supply power to the integrated circuit module 94, the data acquisition module 91, and the data output module 92.
As described above, the host unit 96 may also be implemented as an electronic device.
The foregoing is a preferred embodiment of the present application and it should be noted that modifications and embellishments could be made by those skilled in the art without departing from the principle of the present application and these are considered to be within the scope of the present application.

Claims (18)

1. A head-mounted device, comprising:
the rack comprises a rack main body, wherein the rack main body is provided with a first surface and a second surface which are arranged oppositely, and a third surface and a fourth surface which are arranged oppositely, the third surface is connected with the first surface and the second surface, the fourth surface is connected with the first surface and the second surface, and the rack main body is provided with an accommodating groove in the middle of the first surface;
the heat dissipation plate is arranged on the first surface of the rack and is opposite to the accommodating groove; and
a motherboard assembly disposed on the heat dissipation plate, the motherboard assembly including:
the first main board is arranged on one side, close to the rack main body, of the heat dissipation plate and is positioned in the accommodating groove; and
the second mainboard is arranged on one side, far away from the rack main body, of the heat dissipation plate and is electrically connected with the first mainboard.
2. The head-mounted apparatus according to claim 1, wherein the receiving groove is opened at a groove wall on the fourth surface side.
3. The head-mounted apparatus according to claim 1, wherein a mounting plate is provided on the first surface of the rack main body, the mounting plate being located on a groove wall edge of the accommodating groove on the third surface side.
4. The head mounted device of claim 3, further comprising a TOF camera and an RGB camera fixed on the mounting plate, the TOF camera and the RGB camera electrically connected with the first motherboard.
5. The head-mounted apparatus of claim 4, wherein the heat dissipation plate abuts against the TOF camera and the RGB camera, respectively, to dissipate heat therefrom.
6. The head-mounted apparatus according to claim 1, wherein the rack main body defines two optical-mechanical mounting holes penetrating through the first surface and the second surface, the two optical-mechanical mounting holes are respectively located at two sides of the accommodating groove, and the heat dissipation plate is disposed opposite to the two optical-mechanical mounting holes.
7. The head-mounted device of claim 6, further comprising a bare engine mounted on the first surface of the rack body, wherein the bare engine is mounted at each of the two bare engine mounting holes, the bare engines are respectively located at two sides of the first main board, the bare engine abuts against the heat dissipation plate to dissipate heat of the bare engine, and the bare engine is electrically connected to the second main board.
8. The head-mounted apparatus according to claim 7, wherein a support plate is disposed on the second surface of the frame body, and the support plates are respectively located at two sides of each of the two optical engine mounting holes.
9. The headset of claim 8, wherein the support plate has a first side, a second side and a third side connected in sequence, the support plate is connected to the main frame body at the first side, the second side is located at a side of the support plate close to the fourth surface, the third side is located at a side of the support plate close to the second surface, and the second side is inclined toward the third side.
10. The head-mounted device of claim 9, further comprising:
the spectroscope is arranged opposite to the optical machine and arranged on the second edge of the supporting plate; and
and the reflecting mirror is arranged opposite to the spectroscope and arranged on the first edge of the supporting plate.
11. The head-mounted apparatus according to claim 1, wherein the rack body is provided with a relief groove on the first surface, the relief grooves being respectively located at both ends of the rack body.
12. The headset of claim 11, wherein the recess is formed with a through hole on a wall of the housing body on a side of the third surface, the through hole penetrating through the third surface and communicating with the recess.
13. The head-mounted device of claim 12, further comprising:
the fisheye camera is arranged at the through hole in the abdicating groove and is electrically connected with the second main board.
14. The head-mounted device of claim 13, further comprising:
and the air cooling equipment is arranged in the abdicating groove and is electrically connected with the second main board.
15. The head-mounted apparatus according to claim 14, wherein the rack main body is provided with a limiting structure on the fourth surface, the limiting structure is used for fixing a wire electrically connected between the air-cooling apparatus and the second main board, the limiting structure comprises a limiting plate and a hook which are arranged oppositely or in a staggered manner, and the wire is arranged between the limiting plate and the hook.
16. The head-mounted device of claim 1, further comprising:
a first housing comprising:
a first housing main body; and
the mounting frame is arranged on one side of the first shell body and provided with a mounting hole penetrating through the mounting frame;
a second housing connected with the first housing to form an accommodating space, including:
a second housing main body disposed opposite to the first housing main body; and
the assembling frame is arranged on one side of the second shell and is opposite to the mounting frame, the assembling frame is bent towards one side of the mounting frame and is connected with one side, far away from the first shell body, of the mounting frame, assembling holes are formed in the assembling frame at positions opposite to the mounting holes, and the mounting holes and the assembling holes are communicated with the accommodating space;
wherein, the frame, the heat dissipation plate and the mainboard assembly are arranged in the accommodating space.
17. The head-mounted device of claim 16, further comprising a nose pad assembly, the nose pad assembly comprising:
the mounting seat is mounted in the accommodating groove, and the first main board is arranged between the heat dissipation plate and the mounting seat; and
one end of the nose support extends into the accommodating space and is connected with the mounting seat.
18. The head-mounted device of claim 17, wherein the head-mounted device comprises:
the supporting component is connected with the first shell and the second shell to form a frame, and comprises:
the first support leg is connected with one end of the first shell body; and
and the second supporting leg is connected with the other end of the first shell body.
CN202022635332.0U 2020-11-13 2020-11-13 Head-mounted device Active CN213814144U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202022635332.0U CN213814144U (en) 2020-11-13 2020-11-13 Head-mounted device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202022635332.0U CN213814144U (en) 2020-11-13 2020-11-13 Head-mounted device

Publications (1)

Publication Number Publication Date
CN213814144U true CN213814144U (en) 2021-07-27

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Family Applications (1)

Application Number Title Priority Date Filing Date
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Country Status (1)

Country Link
CN (1) CN213814144U (en)

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