CN112497016A - Section polishing machine for wafer processing - Google Patents

Section polishing machine for wafer processing Download PDF

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Publication number
CN112497016A
CN112497016A CN202011306334.3A CN202011306334A CN112497016A CN 112497016 A CN112497016 A CN 112497016A CN 202011306334 A CN202011306334 A CN 202011306334A CN 112497016 A CN112497016 A CN 112497016A
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CN
China
Prior art keywords
polishing
piece
block
roof
telescopic rod
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
CN202011306334.3A
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Chinese (zh)
Inventor
赵震
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Linzhang Aohuang Network Technology Co ltd
Original Assignee
Linzhang Aohuang Network Technology Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Linzhang Aohuang Network Technology Co ltd filed Critical Linzhang Aohuang Network Technology Co ltd
Priority to CN202011306334.3A priority Critical patent/CN112497016A/en
Publication of CN112497016A publication Critical patent/CN112497016A/en
Withdrawn legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B29/00—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents
    • B24B29/02—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents designed for particular workpieces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B1/00—Cleaning by methods involving the use of tools
    • B08B1/10—Cleaning by methods involving the use of tools characterised by the type of cleaning tool
    • B08B1/16—Rigid blades, e.g. scrapers; Flexible blades, e.g. wipers
    • B08B1/165—Scrapers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B1/00—Cleaning by methods involving the use of tools
    • B08B1/30—Cleaning by methods involving the use of tools by movement of cleaning members over a surface
    • B08B1/32—Cleaning by methods involving the use of tools by movement of cleaning members over a surface using rotary cleaning members
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B29/00—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents
    • B24B29/005—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents using brushes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/04—Headstocks; Working-spindles; Features relating thereto
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/06—Work supports, e.g. adjustable steadies
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B47/00—Drives or gearings; Equipment therefor
    • B24B47/10—Drives or gearings; Equipment therefor for rotating or reciprocating working-spindles carrying grinding wheels or workpieces
    • B24B47/14—Drives or gearings; Equipment therefor for rotating or reciprocating working-spindles carrying grinding wheels or workpieces by liquid or gas pressure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
    • B24B55/06—Dust extraction equipment on grinding or polishing machines
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
    • B24B55/12—Devices for exhausting mist of oil or coolant; Devices for collecting or recovering materials resulting from grinding or polishing, e.g. of precious metals, precious stones, diamonds or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
    • B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
    • B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
    • B24B9/065—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of thin, brittle parts, e.g. semiconductors, wafers

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)

Abstract

The invention discloses a section polishing machine for wafer processing, which structurally comprises a workbench, a polishing seat, a top plate and a button, wherein the bottom of the polishing seat is fixedly embedded on the upper surface of the workbench, the top plate is arranged right above the workbench, and the button is fixedly embedded on the upper surface of the top plate, and the section polishing machine has the beneficial effects that: the wafer after will cutting is placed on the polishing seat, it drives the screw rod and rotates to rotate the commentaries on classics piece, make the polishing sword polish the wafer tangent plane, start the air extractor and upwards inhale to the storage cylinder inside with the burr that rejects the unloading in the polishing process, and the baffle is closed when the air extractor stop work, avoid the burr to fall out and influence the environment near burnishing machine, start the air extractor and drive the bull stick and rotate, make the bull stick drive the polishing piece and rotate, make the brush rub with the wafer surface and reject the burr of wafer tangent plane and polish and grind the level, the scraper blade of slope simultaneously shovels the burr after will cutting off, be convenient for inhale the isolation intracavity with the burr and avoid the polishing piece to throw away the burr and lead to the burr to splash everywhere.

Description

Section polishing machine for wafer processing
Technical Field
The invention relates to the field of wafer coating, in particular to a section polishing machine for wafer processing.
Background
The wafer refers to a silicon wafer used for manufacturing a silicon semiconductor circuit, and the processing process comprises the steps of adding polycrystalline silicon sol into crystals to form a cylindrical silicon crystal bar, then grinding and cutting to form a wafer, and finally polishing to enable the cutting surface of the wafer to be smooth.
At present, when a wafer and a surface are polished, a polishing sheet continuously rubs against the surface, so that burrs generated in a cutting process are cut off and ground flat, the cut burrs driven by a polishing knife fly out along the moving direction of the polishing knife, and the environment near the polishing machine is polluted due to the splashing of the burrs.
Disclosure of Invention
The invention provides a section polishing machine for wafer processing, which aims to solve the technical problem that when a wafer and a surface are polished, a polishing sheet continuously rubs against the section, so that burrs generated in the cutting process are cut off and ground flat, and the cut burrs driven by a polishing knife fly out along the moving direction of the polishing knife, so that the environment near the polishing machine is polluted due to the splashing of the burrs.
The invention is realized by the following technical scheme: the utility model provides a tangent plane burnishing machine for wafer processing, its structure includes workstation, polishing seat, roof, button, polishing seat bottom inlays admittedly in the workstation upper surface, the roof is installed directly over the workstation, the button inlays admittedly in the roof upper surface, the roof includes bracing piece, commentaries on classics piece, screw rod, polisher, the bracing piece top is through welded connection in roof lower surface, and the bracing piece bottom inlays admittedly in the workstation upper surface, commentaries on classics piece is installed directly over the roof center, the screw rod passes through the bolt perpendicularly and runs through in roof center, and the screw rod top welds mutually with commentaries on classics piece, polisher top inlays admittedly in the roof lower surface, the bracing piece has four, and length is the shortest distance between roof bottom to the polishing seat upper surface after the polisher extension.
Furthermore, the polisher comprises a telescopic rod, a tension spring and a polishing knife, the telescopic rod is connected to the bottom of the interior of the polisher through a movable clamping block, the tension spring is connected between the top of the telescopic rod and the upper inner wall of the polisher through welding, the upper surface of the polishing knife is fixedly embedded into the bottom end of the telescopic rod, the polisher is hollow, and the tension force of the tension spring is greater than the gravity of the telescopic rod.
Furthermore, the telescopic link includes baffle, air exhauster, filter screen, storage cylinder, through-hole, the baffle passes through welded connection in telescopic link inner wall, the air exhauster inlays admittedly in the baffle lower surface, the filter screen inlays admittedly in the telescopic link inner wall and is located under the air exhauster, the storage cylinder inlays the bottom in locating the telescopic link, and storage cylinder upper surface and filter screen lower surface weld mutually, through-hole and storage cylinder bottom are the integrated structure, the rotation of air exhauster passes through the electric control, and the inside fretwork of storage cylinder to the axostylus axostyle of baffle runs through inside the storage cylinder perpendicularly.
Further say, the through-hole includes location axle, baffle, ejector pad, the location axle passes through bolted connection in the through-hole inner wall, the baffle is nested in the location off-axial side through movable block, the ejector pad inlays locates the baffle lower surface, the terminal tilt up of baffle, and inside fretwork that makes progress to the baffle has two.
Furthermore, the polishing knife comprises an isolation cavity, a rotating rod and a polishing block, the isolation cavity is connected to the inside of the polishing knife through a gap, the rotating rod and the isolation cavity are located on the same axis, the polishing block is connected to the tail end of the rotating rod through welding, the upper surface of the isolation cavity is arc-shaped, the number of the polishing blocks is eight, and the bottoms of the polishing blocks and the lower surface of the polishing knife are located on the same horizontal plane.
Further say, the polishing piece includes scraper blade, fixed block, stopper, brush, the scraper blade is the integral structure with the polishing piece left and right sides, the fixed block inlays admittedly inside the polishing piece, the stopper both ends are respectively through welding between scraper blade inboard and fixed block surface, the welding of brush top is in the fixed block bottom, the scraper blade is from top to bottom leaned out, and the brush periphery is the rubber material and inside is the metal packing material.
Further say, the stopper comprises fixed plate, connecting block, commentaries on classics piece, gag lever post, the fixed plate right-hand member is installed in the gag lever post left side, the connecting block right surface inlays in the fixed plate left end, the commentaries on classics piece passes through bolted connection between fixed plate and storage cylinder, the connecting block cross-section is isosceles trapezoid, and the gag lever post right-hand member perk that makes progress.
Advantageous effects
Compared with the prior art, the section polishing machine for wafer processing has the following advantages:
1. the invention has the beneficial effects that: the cut wafer is placed on the polishing seat, the rotating block is rotated to drive the screw rod to rotate, the polishing knife is used for polishing the section of the wafer, the air pump is started to upwards suck burrs, which are removed in the polishing process, into the storage barrel, and the baffle is closed when the air pump stops working, so that the burrs are prevented from falling out to influence the environment near the polishing machine.
2. The invention has the beneficial effects that: the starting air extractor drives the rotating rod to rotate, the rotating rod drives the polishing block to rotate, the hairbrush and the surface of the wafer are subjected to friction, burrs of a wafer tangent plane are removed and polished and ground flat, meanwhile, the inclined scraper blade shovels the cut burrs, and the burrs are conveniently sucked into the isolation cavity to be prevented from being thrown out of the burrs by the polishing block to cause the burrs to splash everywhere.
Drawings
Other features, objects and advantages of the invention will become more apparent upon reading of the detailed description of non-limiting embodiments with reference to the following drawings:
FIG. 1 is a schematic structural diagram of a section polishing machine for wafer processing according to the present invention.
Fig. 2 is a front enlarged structural schematic view of the top plate of the present invention.
FIG. 3 is an enlarged view of the inside of the polishing apparatus of the present invention.
Fig. 4 is an enlarged structural view of the inside of the telescopic rod of the present invention.
FIG. 5 is a schematic diagram of an enlarged front view of a through hole according to the present invention.
Fig. 6 is an enlarged internal view of the polishing blade of the present invention.
FIG. 7 is an enlarged internal view of the polishing block of the present invention.
Fig. 8 is a front view of the stopper according to the present invention.
In the figure: the polishing device comprises a workbench 1, a polishing seat 2, a top plate 3, a button 4, a support rod 31, a rotating block 32, a screw 33, a polisher 34, an expansion rod 341, a tension spring 342, a polishing knife 343, a partition plate a1, an air extractor a2, a filter screen a3, a storage cylinder a4, a through hole a5, a positioning shaft a51, a baffle a52, a push block a53, an isolation cavity b1, a rotating rod b2, a polishing block b3, a scraper b31, a fixed block b32, a limiter b33, a brush b34, a fixed plate z1, a connecting block z2, a rotating block z3 and a limiting rod z 4.
Detailed Description
In order to make the technical means, the original characteristics, the achieved purposes and the effects of the invention easy to understand, the following description and the accompanying drawings further illustrate the preferred embodiments of the invention.
Please refer to fig. 1-8:
example 1:
the invention provides a tangent plane polishing machine for wafer processing, which structurally comprises a workbench 1, a polishing seat 2, a top plate 3 and a button 4, wherein the bottom of the polishing seat 2 is embedded and fixed on the upper surface of the workbench 1, the top plate 3 is arranged right above the workbench 1, the button 4 is embedded and fixed on the upper surface of the top plate 3, the top plate 3 comprises a support rod 31, a rotating block 32, a screw 33 and a polisher 34, the top end of the support rod 31 is connected to the lower surface of the top plate 3 through welding, the bottom of the support rod 31 is embedded and fixed on the upper surface of the workbench 1, the rotating block 32 is arranged right above the center of the top plate 3, the screw 33 vertically penetrates through the center of the top plate 3 through a bolt, the top of the screw 33 is welded with the rotating block 32, the top of the polisher 34 is embedded and fixed on the lower surface of the top plate 3, the number of the support rods 31 is four, and the length of the polisher, the wafer after the inter-cutting is placed on the surface of the polishing seat 2 for section polishing.
In the figure, the polisher 34 includes a telescopic rod 341, a tension spring 342, and a polishing blade 343, the telescopic rod 341 is connected to the inner bottom of the polisher 34 through a movable snap, the tension spring 342 is connected between the top of the telescopic rod 341 and the upper inner wall of the polisher 34 through welding, the upper surface of the polishing blade 343 is embedded and fixed at the bottom end of the telescopic rod 341, the polisher 34 is hollow, and the tension force of the tension spring 342 is greater than the gravity of the telescopic rod 341, which is beneficial for pulling up the telescopic rod 341 and the polishing blade 343 through the tension force of the tension spring 342 after the polishing blade 343 polishes the wafer.
In the figure, the expansion link 341 includes a partition a1, an air extractor a2, a filter screen a3, a storage cylinder a4, and a through hole a5, the partition a1 is connected to the inner wall of the expansion link 341 by welding, the air extractor a2 is embedded in the lower surface of the partition a1, the filter screen a3 is embedded in the inner wall of the expansion link 341 and is located right below the air extractor a2, the storage cylinder a4 is embedded in the inner bottom of the expansion link 341, the upper surface of the storage cylinder a4 is welded to the lower surface of the filter screen a3, the through hole a5 is integrated with the bottom of the storage cylinder a4, the rotation of the air extractor a2 is electrically controlled, the storage cylinder a4 is hollowed, and the shaft of the partition a1 vertically penetrates through the storage cylinder a4, which is beneficial for sucking cut burrs generated during polishing into the storage cylinder a4, and preventing the burrs from splashing around.
In the drawing, through-hole a5 includes location axle a51, baffle a52, ejector pad a53, location axle a51 passes through bolted connection in through-hole a5 inner wall, baffle a52 nests in the location axle a51 outside through the activity block, ejector pad a53 inlays and locates baffle a52 lower surface, baffle a52 end tilt up, and the inside fretwork that makes progress of z53 to baffle a52 has two, in the burr entering storage cylinder a4 after the benefit of rejecting, and avoid the burr to fall out downwards through b 52.
The specific principle of the embodiment is as follows: the cut wafer is placed on a polishing seat 2, a rotating block 32 at the top of a rotating top plate 3 drives a screw 33 to rotate, the screw 33 drives an expansion rod 341 inside a polisher 34 to expand and contract, so that a polishing knife 343 at the bottom of the expansion rod 341 polishes the section of the wafer, meanwhile, an air extractor a2 is started through a button 4, the air extractor a2 generates upward suction to suck burrs which are removed during polishing, the burrs penetrate through a through hole a5 through a baffle a52 and enter a storage cylinder a4 for storage, a filter screen a3 at the top of the storage cylinder a4 prevents the burrs from contacting with the air extractor a2, and the baffle a52 is closed around a positioning shaft a51 under the action of gravity when the air extractor a2 stops working, so that the burrs are prevented from falling out to influence the environment near the polishing machine.
Example 2:
in the figure, the polisher 34 includes a telescopic rod 341, a tension spring 342, and a polishing blade 343, the telescopic rod 341 is connected to the inner bottom of the polisher 34 through a movable snap, the tension spring 342 is connected between the top of the telescopic rod 341 and the upper inner wall of the polisher 34 through welding, the upper surface of the polishing blade 343 is embedded and fixed at the bottom end of the telescopic rod 341, the polisher 34 is hollow, and the tension force of the tension spring 342 is greater than the gravity of the telescopic rod 341, which is beneficial for pulling up the telescopic rod 341 and the polishing blade 343 through the tension force of the tension spring 342 after the polishing blade 343 polishes the wafer.
In the figure, the expansion link 341 includes a partition a1, an air extractor a2, a filter screen a3, a storage cylinder a4, and a through hole a5, the partition a1 is connected to the inner wall of the expansion link 341 by welding, the air extractor a2 is embedded in the lower surface of the partition a1, the filter screen a3 is embedded in the inner wall of the expansion link 341 and is located right below the air extractor a2, the storage cylinder a4 is embedded in the inner bottom of the expansion link 341, the upper surface of the storage cylinder a4 is welded to the lower surface of the filter screen a3, the through hole a5 is integrated with the bottom of the storage cylinder a4, the rotation of the air extractor a2 is electrically controlled, the storage cylinder a4 is hollowed, and the shaft of the partition a1 vertically penetrates through the storage cylinder a4, which is beneficial for sucking cut burrs generated during polishing into the storage cylinder a4, and preventing the burrs from splashing around.
In the figure, the polishing blade 343 includes an isolation cavity b1, a rotating rod b2, and a polishing block b3, the isolation cavity b1 is connected inside the polishing blade 343 through a gap, the rotating rod b2 and the isolation cavity b1 are located on the same axis, the polishing block b3 is connected to the tail end of the rotating rod b2 through welding, the upper surface of the isolation cavity b1 is arc-shaped, eight polishing blocks b3 are provided, and the bottom of the polishing block b3 and the lower surface of the polishing blade 343 are located on the same horizontal plane, so that the rotating rod b2 drives the polishing block b3 to rotate, so that the polishing block b3 polishes the cut surface of the wafer.
In the figure, polishing block b3 includes scraper blade b31, fixed block b32, stopper b33, brush b34, scraper blade b31 and polishing block b3 left and right sides are integrated structure, fixed block b32 inlays admittedly in polishing block b3 inside, stopper b33 both ends are respectively through welding between scraper blade b31 inboard and fixed block b32 surface, brush b34 top welding is in fixed block b32 bottom, scraper blade b31 leans out from top to bottom, and brush b34 periphery is the rubber material and inside is the metal filling material, and brush b34 is rejected and grinds the burr on the wafer section with the friction of wafer section when being favorable to polishing block b3 to remove.
In the drawing, the stopper b33 comprises a fixed plate z1, a connecting block z2, a rotating block z3 and a limiting rod z4, the right end of the fixed plate z1 is installed on the left side of the limiting rod z4, the right surface of the connecting block z2 is embedded and fixed at the left end of the fixed plate z1, the rotating block z3 is connected between the fixed plate z1 and the storage cylinder a4 through bolts, the section of the connecting block z2 is in an isosceles trapezoid shape, the right end of the limiting rod z4 is tilted upwards, the scraper b31 is supported through the fixed plate z1 and the limiting rod z4, and the scraper b31 is kept tilted so as to scoop up cut burrs.
The specific principle of the embodiment is as follows: the air extractor a2 is started through the button 4, the air extractor a2 drives the rotating rod b2 to rotate, the polishing block b3 welded at the tail end of the rotating rod b2 rotates, at the moment, a brush b34 at the bottom of the polishing block b3 rubs with the surface of a wafer to remove burrs on the section of the wafer and polish and grind the section of the wafer flat, meanwhile, the scraper b31 keeps inclined under the support of the fixed plate z1 and the limiting rod z4 on the scraper b31, the scraper b31 shovels the cut burrs, the burrs are conveniently sucked into the isolation cavity b1, and the burrs are prevented from being thrown out by the polishing block b3 to cause the splashing of the burrs through the isolation barrier of the isolation cavity b 1.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.

Claims (7)

1. The utility model provides a tangent plane burnishing machine for wafer processing, its structure includes workstation (1), polishing seat (2), roof (3), button (4), the bottom of polishing seat (2) is inlayed and is fixed in workstation (1) upper surface, roof (3) are installed directly over workstation (1), button (4) are inlayed and are fixed in roof (3) upper surface, its characterized in that:
roof (3) include bracing piece (31), commentaries on classics piece (32), screw rod (33), polisher (34), bracing piece (31) top is through welded connection in roof (3) lower surface, and bracing piece (31) bottom inlays admittedly in workstation (1) upper surface, change piece (32) and install directly over roof (3) center, screw rod (33) run through perpendicularly in roof (3) center through the bolt, and screw rod (33) top welds mutually with commentaries on classics piece (32), polisher (34) top is inlayed admittedly in roof (3) lower surface.
2. The cutting and polishing machine as claimed in claim 1, wherein: the polisher (34) comprises a telescopic rod (341), a tension spring (342) and a polishing knife (343), the telescopic rod (341) is connected to the inner bottom of the polisher (34) through a movable clamping manner, the tension spring (342) is connected between the top of the telescopic rod (341) and the upper inner wall of the polisher (34) through welding, and the upper surface of the polishing knife (343) is fixedly embedded at the bottom end of the telescopic rod (341).
3. The cutting and polishing machine as claimed in claim 2, wherein: the telescopic rod (341) comprises a partition plate (a1), an air extractor (a2), a filter screen (a3), a storage cylinder (a4) and a through hole (a5), wherein the partition plate (a1) is connected to the inner wall of the telescopic rod (341) through welding, the air extractor (a2) is fixedly embedded on the lower surface of the partition plate (a1), the filter screen (a3) is fixedly embedded on the inner wall of the telescopic rod (341) and is positioned right below the air extractor (a2), the storage cylinder (a4) is embedded at the inner bottom of the telescopic rod (341), the upper surface of the storage cylinder (a4) is welded with the lower surface of the filter screen (a3), and the bottom of the through hole (a5) and the storage cylinder (a4) is of an integrated structure.
4. The cutting and polishing machine as claimed in claim 3, wherein: the through hole (a5) comprises a positioning shaft (a51), a baffle (a52) and a push block (a53), the positioning shaft (a51) is connected to the inner wall of the through hole (a5) through a bolt, the baffle (a52) is nested outside the positioning shaft (a51) through movable clamping, and the push block (a53) is embedded on the lower surface of the baffle (a 52).
5. The cutting and polishing machine as claimed in claim 2, wherein: the polishing knife (343) comprises an isolation cavity (b1), a rotating rod (b2) and a polishing block (b3), wherein the isolation cavity (b1) is connected to the inside of the polishing knife (343) through a gap, the rotating rod (b2) and the isolation cavity (b1) are located on the same axis, and the polishing block (b3) is connected to the tail end of the rotating rod (b2) through welding.
6. The cutting and polishing machine as claimed in claim 5, wherein: polishing piece (b3) includes scraper blade (b31), fixed block (b32), stopper (b33), brush (b34), scraper blade (b31) and polishing piece (b3) left and right sides structure as an organic whole, fixed block (b32) are embedded and are fixed inside polishing piece (b3), stopper (b33) both ends are respectively through welding between scraper blade (b31) inboard and fixed block (b32) surface, brush (b34) top welding is in fixed block (b32) bottom.
7. The cutting and polishing machine as claimed in claim 6, wherein: stopper (b33) comprises fixed plate (z1), connecting block (z2), commentaries on classics piece (z3), gag lever post (z4), the gag lever post left side is installed at gag lever post (z4) to fixed plate (z1) right-hand member, connecting block (z2) right surface is embedded and is fixed in fixed plate (z1) left end, commentaries on classics piece (z3) passes through bolted connection between fixed plate (z1) and storage cylinder (a 4).
CN202011306334.3A 2020-11-20 2020-11-20 Section polishing machine for wafer processing Withdrawn CN112497016A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202011306334.3A CN112497016A (en) 2020-11-20 2020-11-20 Section polishing machine for wafer processing

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202011306334.3A CN112497016A (en) 2020-11-20 2020-11-20 Section polishing machine for wafer processing

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CN112497016A true CN112497016A (en) 2021-03-16

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CN202011306334.3A Withdrawn CN112497016A (en) 2020-11-20 2020-11-20 Section polishing machine for wafer processing

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DE3734127A1 (en) * 1987-10-09 1989-04-20 Festo Kg Machine for machining workpieces
KR20050097369A (en) * 2004-04-02 2005-10-07 신건서 Grinder having a dust collecting structure
CN205799262U (en) * 2016-06-30 2016-12-14 刘苗粉 A kind of high efficiency abrasive grinding tool
CN108247484A (en) * 2018-01-17 2018-07-06 遂昌县睿鼎科技服务有限公司 It is a kind of that timber is facilitated to clamp fixed surface grinding device
CN108481150A (en) * 2018-05-31 2018-09-04 王宜淞 A kind of sander
CN208289224U (en) * 2018-03-30 2018-12-28 安徽姜尚工艺品股份有限公司 A kind of dust-extraction unit for laser engraving machine
CN210209828U (en) * 2019-07-06 2020-03-31 温州市宏盛达实业有限公司 Leather product grinding device for leather shoe processing
CN211193376U (en) * 2019-11-25 2020-08-07 上海赤坤实业有限公司 A plank burring equipment for in wood system furniture processing

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3734127A1 (en) * 1987-10-09 1989-04-20 Festo Kg Machine for machining workpieces
KR20050097369A (en) * 2004-04-02 2005-10-07 신건서 Grinder having a dust collecting structure
CN205799262U (en) * 2016-06-30 2016-12-14 刘苗粉 A kind of high efficiency abrasive grinding tool
CN108247484A (en) * 2018-01-17 2018-07-06 遂昌县睿鼎科技服务有限公司 It is a kind of that timber is facilitated to clamp fixed surface grinding device
CN208289224U (en) * 2018-03-30 2018-12-28 安徽姜尚工艺品股份有限公司 A kind of dust-extraction unit for laser engraving machine
CN108481150A (en) * 2018-05-31 2018-09-04 王宜淞 A kind of sander
CN210209828U (en) * 2019-07-06 2020-03-31 温州市宏盛达实业有限公司 Leather product grinding device for leather shoe processing
CN211193376U (en) * 2019-11-25 2020-08-07 上海赤坤实业有限公司 A plank burring equipment for in wood system furniture processing

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Application publication date: 20210316