CN112490224A - Light-emitting device and manufacturing method thereof - Google Patents
Light-emitting device and manufacturing method thereof Download PDFInfo
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- CN112490224A CN112490224A CN202011364729.9A CN202011364729A CN112490224A CN 112490224 A CN112490224 A CN 112490224A CN 202011364729 A CN202011364729 A CN 202011364729A CN 112490224 A CN112490224 A CN 112490224A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/505—Wavelength conversion elements characterised by the shape, e.g. plate or foil
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
Abstract
The invention discloses a light-emitting device and a manufacturing method thereof, wherein the light-emitting device comprises a light-emitting element, a substrate, a light conversion layer, a light reflection layer and a light transmission layer; the light reflection layer is laid on one surface of the base body, a partition groove is formed in the light reflection layer, and an inner area and an outer area are respectively arranged on the inner side and the outer side of the partition groove; the light-emitting element is embedded in the inner area and is fixedly connected with the base body; the light conversion layer comprises a first light conversion layer and a second light conversion layer, the first light conversion layer is arranged in the dividing groove, and the second light conversion layer covers the inner area and faces away from the base body; the light transmission layer comprises a first light transmission layer and a second light transmission layer, the first light transmission layer is arranged in the dividing groove and covers the surface of the first light conversion layer, which deviates from the base body, and the second light transmission layer is arranged on the surface of the light reflection layer, which deviates from the base body, and covers the light reflection layer, the first light transmission layer and the second light conversion layer. The provided dividing groove structure limits the shape of the light conversion layer, and can ensure the uniformity and the shape consistency of the light conversion layer.
Description
Technical Field
The invention belongs to the technical field of light emitting diodes, and particularly relates to a light emitting device and a manufacturing method thereof.
Background
The light emitting diode as a new generation lighting tool has great advantages in energy saving and environmental protection compared with other lighting technologies, but has great optimization space in the aspects of technology and manufacturing process.
Patent CN107546301A discloses a light emitting device, which comprises the following steps: s1: arranging light emitting elements on a substrate; s2: covering a layer of fluorescent glue on the upper surfaces of the substrate and the light-emitting element; s3: covering a layer of light reflecting layer on the upper surface of the fluorescent glue between the light emitting elements; s4: covering a circular arc-shaped light transmission layer on the upper surface of the light-emitting element through mould pressing and packaging; s5: and cutting to obtain single light-emitting devices. The light-emitting device obtained by the method has the advantages of simple process and low cost, but poor uniformity of light emission and poor process controllability.
Patent CN109273579A discloses a light emitting device, which comprises the following steps: s1: pasting the whole fluorescent film on the upper surface of the high-temperature film; s2: uniformly sticking the light-emitting elements on the upper surface of the fluorescent film; s3: covering a layer of arc-shaped transparent adhesive around the light-emitting element; s4: cutting along the light-emitting elements to obtain single light-emitting element with the fluorescent film; s5: fixing the light-emitting elements with the fluorescent films on the substrate, and covering a light reflecting layer between the adjacent light-emitting elements; s6: and cutting along the light-emitting elements to obtain single light-emitting devices. The light-emitting device obtained by the method has uniform light emission, but has higher process difficulty and high cost.
Disclosure of Invention
In order to overcome the above disadvantages of the prior art, an object of the present invention is to provide a light emitting device, which aims to solve the problems of difficult manufacturing process and uneven light emission in the prior art.
In order to achieve the purpose, the technical scheme adopted by the invention is as follows:
a light emitting device includes a light emitting element, a base body, a light conversion layer, a light reflection layer, and a light transmission layer;
the light reflection layer is laid on one surface of the base body, a division groove which is connected end to end is formed in one surface of the light reflection layer, which is far away from the base body, and an inner area and an outer area are respectively arranged on the inner side and the outer side of the division groove;
the light-emitting element is embedded in the inner area and is fixedly connected with the base body;
the light conversion layer comprises a first light conversion layer and a second light conversion layer, the first light conversion layer is arranged in the dividing groove, and the second light conversion layer covers one surface of the inner area, which is far away from the base body;
the light transmission layer comprises a first light transmission layer and a second light transmission layer, the first light transmission layer is arranged in the dividing groove and covers one surface, away from the base body, of the first light conversion layer, and the second light transmission layer is arranged on one surface, away from the base body, of the light reflection layer and covers the light reflection layer, the first light transmission layer and the second light conversion layer.
Further, the shape of the dividing groove includes one of a circle, a square and a polygon, wherein the polygon is a regular polygon and a non-regular polygon.
Further, the light-emitting element includes at least one of a face-up, a flip, and a vertical chip.
Further, the groove width dimension of the dividing groove is not more than 0.5 mm.
Further, the upper surface of the first light transmission layer and the upper surface of the light reflection layer are in the same plane.
Further, the light transmission layer is made of light refraction glue, the light reflection layer is made of light reflection glue, and the light conversion layer is made of fluorescent glue.
The invention also discloses a manufacturing method of the light-emitting device, which comprises the following steps:
s1: fixing the light-emitting elements on the upper surface of the substrate in an M x N unit array mode by taking the upper surface of the substrate as a front surface, wherein each unit comprises at least one light-emitting element;
s2: laying a layer of light reflecting glue between the adjacent units to form a layer of light reflecting layer;
s3: on the upper surface of the light reflection layer, taking each unit as a center, manufacturing corresponding end-to-end separation grooves by using laser, wherein the separation grooves surround the corresponding units;
s4: covering a mask on the upper surface of the light reflection layer, only exposing the upper surfaces of the units and the light reflection layer in the area surrounded by the dividing grooves, covering a light conversion layer on the upper surfaces of the mask, the exposed upper surfaces of the units and the exposed upper surfaces of the light reflection layer in the area surrounded by the dividing grooves, and removing the mask;
s5: performing mould pressing packaging by using a mould, and covering a circular arc-shaped light transmission layer on the upper surface of the light conversion layer and the upper surface of the light reflection layer;
s6: and cutting to obtain single light-emitting devices.
Further, in step S1: m is greater than or equal to 1, and N is greater than or equal to 1.
Further, in step S4: the mask is provided with a hole groove corresponding to the cell position.
Further, the shape of the hole groove is matched with the shape of the dividing groove, the inner ring size of the hole groove is larger than that of the dividing groove, and the outer ring size of the hole groove is smaller than that of the dividing groove.
Compared with the prior art, the invention has the beneficial effects that:
according to the light-emitting device and the manufacturing method thereof, the arranged end-to-end dividing groove structures limit the shape of the light conversion layer, and the uniformity and the shape consistency of the light conversion layer can be ensured; meanwhile, in the manufacturing method, the process complexity caused by adopting a surface mounting process is avoided, and in the traditional process flow, the cutting groove structure is formed by laser processing, so that the process smoothness can be ensured without increasing the process complexity; in the process of manufacturing the light-emitting device, when the upper surface of the mask, the upper surface of the exposed unit and the upper surface of the exposed light reflection layer in the area surrounded by the dividing groove are covered with one layer of light conversion layer, redundant fluorescent glue of the light conversion layer flows into the dividing groove, the uniformity and the shape consistency of the light conversion layer on the light-emitting surface of the whole light-emitting device are ensured, and when the mask is deviated relative to the light-emitting element, the deviation degree of the light conversion layer relative to the light-emitting element can be reduced, and the light-emitting uniformity of the light-emitting device is improved.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
Fig. 1 is a structural sectional view of a light-emitting device in embodiment 1 of the present invention;
fig. 2 is a schematic structural diagram of a manufacturing process S1 of a light-emitting device in embodiment 2 of the present invention;
fig. 3 is a schematic structural view of a manufacturing process S2 of a light-emitting device in embodiment 2 of the present invention;
fig. 4 is a schematic structural view of a manufacturing process S3 of a light-emitting device in embodiment 2 of the present invention;
fig. 5 is a schematic structural view of a manufacturing process S4 of a light-emitting device in embodiment 2 of the present invention;
fig. 6 is a structural sectional view of a manufacturing process S4 of a light emitting device in embodiment 2 of the present invention.
Fig. 7 is a flow chart of a method of fabrication of the present invention.
Description of reference numerals:
1-light emitting element, 2-substrate, 3-dividing groove, 4-light reflecting layer, 5-first light conversion layer, 6-second light conversion layer, 7-first light transmission layer, 8-second light transmission layer and 9-mask.
Detailed Description
So that the manner in which the above recited objects, features and advantages of the present invention can be understood in detail, a more particular description of the invention, briefly summarized above, may be had by reference to the embodiments thereof which are illustrated in the appended drawings. It should be noted that the embodiments of the present invention and features of the embodiments may be combined with each other without conflict. In the following description, numerous specific details are set forth to provide a thorough understanding of the present invention, and the described embodiments are merely a subset of the embodiments of the present invention, rather than a complete embodiment. All other embodiments, which can be obtained by a person skilled in the art without any inventive step based on the embodiments of the present invention, are within the scope of the present invention.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention.
Referring to fig. 1 to 7, an embodiment of the present invention provides a light emitting device,
comprises a light emitting element 1, a substrate 2, a light conversion layer, a light reflection layer 4 and a light transmission layer;
the light reflection layer 4 is laid on one surface of the base body 2, a division groove 3 connected end to end is formed in one surface, away from the base body 2, of the light reflection layer 4, and an inner area and an outer area are respectively formed in the inner side and the outer side of the division groove 3;
the light-emitting element 1 is embedded in the inner area and fixedly connected with the base body 2;
the light conversion layer comprises a first light conversion layer 5 and a second light conversion layer 6, the first light conversion layer 5 is arranged in the dividing groove 3, and the second light conversion layer 6 covers the inner area and faces away from the base body 2;
the light transmission layers include a first light transmission layer 7 and a second light transmission layer 8, the first light transmission layer 7 is disposed in the dividing groove 3 and covers a surface of the first light conversion layer 5 facing away from the base body 2, and the second light transmission layer 8 is disposed on a surface of the light reflection layer 4 facing away from the base body 2 and covers the light reflection layer 4, the first light transmission layer 7, and the second light conversion layer 6.
Further, the shape of the dividing groove 3 includes one of a circle, a square and a polygon, wherein the polygon is a regular polygon and a non-regular polygon.
Further, the light emitting element 1 includes at least one of a face-up, a flip, and a vertical chip.
Further, the width dimension of the dividing groove 3 is not more than 0.5 mm.
Further, the upper surface of the first light transmission layer 7 and the upper surface of the light reflection layer 4 are on the same plane.
Further, the light transmission layer is made of light refraction glue, the light reflection layer 4 is made of light reflection glue, and the light conversion layer is made of fluorescent glue.
The invention also discloses a manufacturing method of the light-emitting device, which comprises the following steps:
s1: the light emitting elements are fixed on the upper surface of the substrate in an array of M × N cells, M, N is a natural number, which may be equal or different, for example, as shown in fig. 2, M ═ 2, N ═ 2, 2 × 3, 2 × 4, 6 × 5, and the like, and each of the cells includes one light emitting element;
s2: laying a layer of light reflecting glue between the adjacent units to form a layer of light reflecting layer;
s3: on the upper surface of the light reflection layer, taking each unit as a center, manufacturing corresponding end-to-end separation grooves by using laser, wherein the separation grooves surround the corresponding units;
s4: covering a layer of mask 9 on the upper surface of the light reflection layer, only exposing the upper surfaces of the units and the light reflection layer in the area surrounded by the dividing grooves, spraying fluorescent glue on the upper surfaces of the mask, the exposed upper surfaces of the units and the exposed upper surfaces of the light reflection layer in the area surrounded by the dividing grooves to form a second light conversion layer, wherein the redundant fluorescent glue flows into the dividing grooves to form a first light conversion layer, and removing the mask;
s5: performing mould pressing packaging by using a mould, and covering a circular arc-shaped light transmission layer on the upper surface of the light conversion layer and the upper surface of the light reflection layer;
s6: and cutting to obtain single light-emitting devices.
Further, in step S4: the mask is provided with a hole groove corresponding to the cell position.
Further, the shape of the hole groove is matched with the shape of the dividing groove, the inner ring size of the hole groove is larger than that of the dividing groove, and the outer ring size of the hole groove is smaller than that of the dividing groove.
In summary, compared with the prior art, the method has the following advantages:
1. the end-to-end division groove structure provided by the invention limits the shape of the light conversion layer and can ensure the uniformity and shape consistency of the light conversion layer.
2. In the manufacturing method, the process complexity caused by adopting a surface mounting process is avoided, and in the traditional process flow, the cutting groove structure is formed by laser processing, so that the process smoothness can be ensured without increasing the process complexity.
3. In the process of manufacturing the light-emitting device, when the upper surface of the mask, the upper surface of the exposed unit and the upper surface of the exposed light reflection layer in the area surrounded by the dividing groove are covered with one layer of light conversion layer, redundant fluorescent glue of the light conversion layer flows into the dividing groove, and the uniformity and the shape consistency of the light conversion layer on the light-emitting surface of the whole light-emitting device are ensured.
4. In the process of manufacturing the light-emitting device, when the mask is deviated relative to the light-emitting element, the dividing groove structure can reduce the deviation degree of the light conversion layer relative to the light-emitting element, and the light-emitting uniformity of the light-emitting device is improved.
It should be noted that other contents of the light emitting device and the manufacturing method disclosed in the present invention can be referred to in the prior art, and are not described herein again.
The above description is only a preferred embodiment of the present invention, and is not intended to limit the present invention in any way, so that any modification, equivalent change and modification made to the above embodiment according to the technical spirit of the present invention are within the scope of the technical solution of the present invention.
Claims (10)
1. A light-emitting device is characterized by comprising a light-emitting element, a substrate, a light conversion layer, a light reflection layer and a light transmission layer;
the light reflection layer is laid on one surface of the base body, a division groove which is connected end to end is formed in one surface of the light reflection layer, which is far away from the base body, and an inner area and an outer area are respectively arranged on the inner side and the outer side of the division groove;
the light-emitting element is embedded in the inner area and is fixedly connected with the base body;
the light conversion layer comprises a first light conversion layer and a second light conversion layer, the first light conversion layer is arranged in the dividing groove, and the second light conversion layer covers one surface of the inner area, which is far away from the base body;
the light transmission layer comprises a first light transmission layer and a second light transmission layer, the first light transmission layer is arranged in the dividing groove and covers one surface, away from the base body, of the first light conversion layer, and the second light transmission layer is arranged on one surface, away from the base body, of the light reflection layer and covers the light reflection layer, the first light transmission layer and the second light conversion layer.
2. The light-emitting device according to claim 1, wherein the shape of the dividing groove includes one of a circle, a square and a polygon, wherein the polygon is a regular polygon and a non-regular polygon.
3. The light-emitting device according to claim 1, wherein the light-emitting element comprises at least one of a face-up, a flip, and a vertical chip.
4. The light-emitting device according to claim 1, wherein the dividing groove has a groove width dimension of not more than 0.5 mm.
5. The light-emitting device according to claim 1, wherein an upper surface of the first light transmission layer and an upper surface of the light reflection layer are on the same plane.
6. The light-emitting device according to claim 1, wherein the light-transmitting layer is made of a light-refracting glue, the light-reflecting layer is made of a light-reflecting glue, and the light-converting layer is made of a fluorescent glue.
7. A method of manufacturing a light emitting device according to claim 1, comprising the steps of:
s1: fixing the light-emitting elements on the upper surface of the substrate in an M x N unit array mode by taking the upper surface of the substrate as a front surface, wherein each unit comprises at least one light-emitting element;
s2: laying a layer of light reflecting glue between the adjacent units to form a layer of light reflecting layer;
s3: on the upper surface of the light reflection layer, taking each unit as a center, manufacturing corresponding end-to-end separation grooves by using laser, wherein the separation grooves surround the corresponding units;
s4: covering a mask on the upper surface of the light reflection layer, only exposing the upper surfaces of the units and the light reflection layer in the area surrounded by the dividing grooves, covering a light conversion layer on the upper surfaces of the mask, the exposed upper surfaces of the units and the exposed upper surfaces of the light reflection layer in the area surrounded by the dividing grooves, and removing the mask;
s5: performing mould pressing packaging by using a mould, and covering a circular arc-shaped light transmission layer on the upper surface of the light conversion layer and the upper surface of the light reflection layer;
s6: and cutting to obtain single light-emitting devices.
8. The method for manufacturing a light-emitting device according to claim 7, wherein in step S1: m is greater than or equal to 1, and N is greater than or equal to 1.
9. The method for manufacturing a light-emitting device according to claim 7, wherein in step S4: the mask is provided with a hole groove corresponding to the cell position.
10. The method of manufacturing a light-emitting device according to claim 9, wherein a shape of the hole groove is identical to a shape of the dividing groove, an inner ring size of the hole groove is larger than an inner ring size of the dividing groove, and an outer ring size of the hole groove is smaller than an outer ring size of the dividing groove.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202011364729.9A CN112490224A (en) | 2020-11-27 | 2020-11-27 | Light-emitting device and manufacturing method thereof |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202011364729.9A CN112490224A (en) | 2020-11-27 | 2020-11-27 | Light-emitting device and manufacturing method thereof |
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| CN112490224A true CN112490224A (en) | 2021-03-12 |
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| CN202011364729.9A Pending CN112490224A (en) | 2020-11-27 | 2020-11-27 | Light-emitting device and manufacturing method thereof |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117497668A (en) * | 2024-01-03 | 2024-02-02 | 江西省兆驰光电有限公司 | LED device and preparation method thereof |
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2020
- 2020-11-27 CN CN202011364729.9A patent/CN112490224A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117497668A (en) * | 2024-01-03 | 2024-02-02 | 江西省兆驰光电有限公司 | LED device and preparation method thereof |
| CN117497668B (en) * | 2024-01-03 | 2024-03-19 | 江西省兆驰光电有限公司 | LED device and preparation method thereof |
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