CN112490158B - Chip back-mounted splicing equipment and splicing method - Google Patents
Chip back-mounted splicing equipment and splicing method Download PDFInfo
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- CN112490158B CN112490158B CN202011381239.XA CN202011381239A CN112490158B CN 112490158 B CN112490158 B CN 112490158B CN 202011381239 A CN202011381239 A CN 202011381239A CN 112490158 B CN112490158 B CN 112490158B
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- 238000001179 sorption measurement Methods 0.000 claims abstract description 86
- 230000000007 visual effect Effects 0.000 claims description 28
- 238000005259 measurement Methods 0.000 claims description 22
- 239000000758 substrate Substances 0.000 claims description 10
- 238000010438 heat treatment Methods 0.000 claims description 4
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67294—Apparatus for monitoring, sorting or marking using identification means, e.g. labels on substrates or labels on containers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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Abstract
The application relates to the technical field of chip assembly equipment, in particular to chip back-mounting and splicing equipment and a splicing method. The chip back-mounting splicing equipment comprises a workbench, and a leveling unit, a splicing unit, an identification unit and a base plate which are positioned on the workbench. The base plate is connected with the leveling unit, and the leveling unit can support the base plate and adjust the levelness of the base plate. The assembling unit comprises an adsorption device, the base plate is provided with a through hole, the adsorption device can pass through the base plate through the through hole to adsorb and fix the back of the chip, the adsorption device descends to place the chip on the base plate to enable the chip to be assembled with the base plate, and the assembling unit can drive the chip to move so as to compensate the position deviation between the chip and the base plate. The identification unit can assist the leveling unit to finish leveling of the base plate and assist the assembly unit to finish compensation of deviation between the base plate and the chip; therefore, the splicing of the chip and the base plate is efficiently and accurately completed, and the surface of the chip is not polluted.
Description
Technical Field
The application relates to the technical field of chip assembly equipment, in particular to chip back-mounting and splicing equipment and a splicing method.
Background
The splicing of multiple chips is widely applied to the fields of aviation, aerospace, measurement and the like, but due to the limitation of the processing size of the photoetching maximum chip, the multiple chips and a base plate are required to be spliced; but the existing splicing equipment cannot meet the requirements of large-area base plates and multi-chip splicing, the splicing precision is poor, and the front face of the chip can be polluted in the splicing process.
Disclosure of Invention
The invention aims to provide a chip back-mounted splicing device and a splicing method, so as to realize the splicing of chips and a base plate, ensure the splicing precision and prevent the chips from being polluted.
The invention provides chip back-mounting splicing equipment which comprises a workbench, and a leveling unit, a splicing unit, an identification unit and a base plate which are arranged on the workbench; the base plate is connected with the leveling unit, and the leveling unit is used for adjusting the levelness of the base plate; the assembling unit is positioned below the base plate and comprises an adsorption device; the substrate is provided with a through hole, the adsorption device can move to the through hole, and the adsorption device can pass through the substrate through the through hole; the adsorption device is used for adsorbing the back surface of the chip and placing the chip on the assembly surface of the base plate; the identification unit is used for detecting levelness of the base plate and assembly deviation of the chip and the base plate.
Further, the leveling unit comprises a lifting device; the driving end of the lifting device is connected with the base plate so as to drive the base plate to lift; the number of the lifting devices is multiple, and the lifting devices are distributed at intervals along the circumferential direction of the base plate.
Further, the leveling unit further comprises a universal adjusting device; the number of the universal adjusting devices is multiple, and the universal adjusting devices are in one-to-one correspondence with the lifting devices; the base plate is connected with the corresponding lifting device through the universal adjusting device.
Further, the splicing unit comprises a first driving mechanism, wherein the first driving mechanism comprises a first driving device, a second driving device and a third driving device; the driving end of the first driving device is connected with the second driving device, and the first driving device can drive the second driving device to move along a first direction; the driving end of the second driving device is connected with the third driving device, the second driving device can drive the third driving device to move along a second direction perpendicular to the first direction, and the driving end of the third driving device is connected with the adsorption device; the first driving device and the second driving device are used for moving the adsorption device to the position below the through hole; the third driving device is used for driving the adsorption device to lift so that the adsorption device passes through the base plate through the through hole.
Further, the first driving mechanism further comprises a rotary driving device; the adsorption device is connected with the third driving device through the rotary driving device, and the rotary driving device is used for driving the adsorption device to rotate around the vertical direction.
Further, the identification unit comprises a second driving mechanism and a visual identification system; the driving mechanism is arranged on the workbench, the visual recognition system is positioned above the base plate, the visual recognition system is connected with the driving end of the second driving mechanism, and the second driving mechanism can drive the visual recognition system to move.
Further, the second driving mechanism is a triaxial linear sliding table.
Further, the number of the through holes is multiple, and the through holes are distributed on the base plate at intervals.
Further, a heating element is arranged on the adsorption device.
The invention also provides a chip back-mounting splicing method, which comprises the following steps:
step 100, mounting a base plate on a leveling unit, identifying levelness of the base plate through an identification unit, and leveling the base plate through the leveling unit;
200, moving an adsorption device of the assembling unit to a through hole of the base plate, wherein the adsorption device passes through the base plate; placing a chip on the adsorption device to adsorb and fix the back of the chip;
step 300, identifying and calculating deviation of the marking points of the chip and the marking points of the base plate through an identification unit;
step 400, the adsorption device drives the chip to move so as to compensate the deviation between the chip and the base plate;
step 500, the adsorption device drives the chip to descend to the assembly plane of the base plate, and the chip and the base plate are assembled;
step 600, performing deviation measurement on the assembly between the chip and the base plate through the identification unit;
if the deviation measurement is qualified, assembling the next chip and the base plate;
and if the deviation measurement is not qualified, driving the chip to move through the adsorption device until the deviation measurement result is qualified.
Compared with the prior art, the invention has the beneficial effects that:
the invention provides chip back-mounted splicing equipment which comprises a workbench, and a leveling unit, an splicing unit, an identification unit and a base plate which are arranged on the workbench. The base plate is connected with the leveling unit, and the leveling unit can support the base plate and adjust the levelness of the base plate at the same time, so that the base plate is horizontal when assembled with the chip. The recognition unit can mark a plurality of positions of the base plate so as to measure and compare the heights of the positions, the levelness of the base plate is adjusted through the leveling unit, the heights of the positions of the base plate are the same, and therefore the leveling unit is assisted by the recognition unit to finish leveling of the base plate. The assembling unit is positioned below the base plate and comprises an adsorption device; the through hole is arranged at the assembling position of the base plate, and the adsorption device of the assembling unit can move to the lower part of the through hole and ascend to pass through the base plate through the through hole. The chip can be placed on the adsorption device, the back of the chip is adsorbed and fixed through the adsorption device, and then the adsorption device descends to place the chip on the base plate so as to assemble the chip and the base plate. When assembling unit assembles chip and base plate, accessible identification unit measures the deviation between the concatenation position of chip and base plate, then compensates the deviation through assembling the unit to make the deviation between the concatenation position of chip and base plate reach acceptable scope, thereby assemble unit completion chip and base plate through identification unit assistance, accomplish the concatenation of chip and base plate high-efficiently accurately, and adsorb fixed setting through adsorption equipment to the chip back, make the chip lie in the in-process of base plate concatenation, the surface of chip can not be polluted.
The invention also provides a chip back-mounting splicing method, which comprises the following steps:
firstly, mounting a base plate on a leveling unit, identifying levelness of the base plate through an identification unit, and leveling the base plate through the leveling unit; next, the adsorption device of the assembling unit moves to the through hole of the base plate, and the adsorption device passes through the base plate; placing the chip on an adsorption device to adsorb and fix the back of the chip; next, identifying and calculating deviation of the marking points of the chip and the marking points of the base plate through an identification unit; next, the adsorption device drives the chip to move so as to compensate the deviation between the chip and the base plate; next, the adsorption device drives the chip to descend to an assembling plane of the base plate, the chip and the base plate are assembled, and next, deviation measurement is carried out on the assembly between the chip and the base plate through the identification unit; if the deviation measurement is qualified, assembling the next chip and the base plate; if the deviation measurement is not qualified, the chip is driven to move by the adsorption device until the deviation measurement result is qualified. Therefore, the assembly of the base plate and the chip is efficiently and accurately completed, and the chip is not polluted.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings that are needed in the description of the embodiments or the prior art will be briefly described, and it is obvious that the drawings in the description below are some embodiments of the present invention, and other drawings can be obtained according to the drawings without inventive effort for a person skilled in the art.
Fig. 1 is a schematic structural diagram of a chip back-mounted splicing device according to an embodiment of the present invention;
fig. 2 is a schematic structural diagram of a leveling unit according to an embodiment of the present invention;
fig. 3 is a schematic structural diagram of an assembly unit according to an embodiment of the present invention;
fig. 4 is a flowchart of a method for splicing back-loading chips according to an embodiment of the present invention.
Reference numerals:
1-recognition unit, 11-visual recognition system, 2-leveling unit, 21-elevating gear, 3-assembly unit, 31-first drive device, 32-second drive device, 33-third drive device, 34-rotation drive device, 35-adsorption device, 4-base plate, 5-chip, 6-workstation, a-first direction, b-second direction.
Detailed Description
The following description of the embodiments of the present invention will be made apparent and fully in view of the accompanying drawings, in which some, but not all embodiments of the invention are shown.
The components of the embodiments of the present invention generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations. Thus, the following detailed description of the embodiments of the invention, as presented in the figures, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention.
All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
In the description of the present invention, it should be noted that the directions or positional relationships indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. are based on the directions or positional relationships shown in the drawings, are merely for convenience of describing the present invention and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present invention will be understood in specific cases by those of ordinary skill in the art.
The following describes a chip backside splice apparatus and a splice method according to some embodiments of the present application with reference to fig. 1 to 4.
The application provides chip back-mounted splicing equipment, which comprises a workbench 6, and a leveling unit 2, a splicing unit 3, an identification unit 1 and a base plate 4 which are arranged on the workbench 6, as shown in figures 1 to 3.
As shown in fig. 1 and 2, the base plate 4 is mounted on the leveling unit 2 along the horizontal direction, and the leveling unit 2 can support the base plate 4 and adjust the levelness of the base plate 4 at the same time, so that the base plate 4 is horizontal when assembled with the chip 5. Preferably, the leveling unit 2 includes a plurality of lifting devices 21 and a plurality of universal adjusting devices, the plurality of lifting devices 21 are fixedly installed on the workbench 6, and driving ends of the plurality of lifting devices 21 can do telescopic movement along the vertical direction; the driving end of each lifting device 21 is correspondingly provided with a universal adjusting device, and a plurality of lifting devices 21 are connected with the lower plate surface of the base plate 4 through the universal adjusting devices; the lifting devices 21 are distributed at intervals along the circumferential direction of the base plate 4, each lifting device 21 can independently act to drive the base plate 4 to move, the heights of all the base plate 4 are adjusted, the heights of all the base plate 4 are the same, the base plate 4 is horizontal, and leveling of the base plate 4 is completed. Preferably, the number of the lifting devices 21 is four, the base plate 4 is square, the four lifting devices 21 are respectively arranged at four vertex angles of the base plate 4, and the heights of the four vertex angles of the base plate 4 are respectively adjusted through the four lifting devices 21, so that the four vertex angles of the base plate 4 are at the same height, and the base plate 4 can be adjusted to be horizontal. In this embodiment, the driving end of the lifting device 21 is connected with the base plate 4 through the universal adjusting device, so that in the process of leveling the base plate 4, the connection of the base plate 4 and the driving end of each lifting device 21 can automatically adjust the angle of the connection part of the base plate 4 and the lifting device 21 according to the lifting condition and the stress condition of different positions of the base plate 4, and damage to the base plate 4 caused by rigid connection of the base plate 4 and the lifting device 21 is avoided.
In this embodiment, the chip back-mounted splicing device completes leveling of the base plate 4 by the auxiliary leveling unit 2 of the identification unit 1. Preferably, as shown in fig. 1, the recognition unit 1 includes a second driving mechanism and a visual recognition system 11, the second driving mechanism is mounted on the workbench 6, the visual recognition system 11 is disposed above the base plate 4, the visual recognition system 11 is connected with a driving end of the second driving mechanism, the visual recognition system 11 can be driven to move in a first direction a and a second direction b along a horizontal direction by the second driving mechanism, and the second driving mechanism can drive the visual recognition system 11 to lift along a vertical direction. Preferably, the second driving mechanism is a three-axis linear sliding table, and the three-axis linear sliding table comprises an X-axis sliding table arranged along a first direction a, a Y-axis sliding table arranged along a second direction b and a Z-axis sliding table arranged along a vertical direction, wherein the Y-axis sliding table is arranged on the X-axis sliding table, so that the Y-axis sliding table can reciprocate along the first direction a on the X-axis sliding table; the Z-axis sliding table is arranged on the Y-axis sliding table, so that the Z-axis sliding table can reciprocate on the Y-axis sliding table along the second direction b, the visual recognition system 11 is connected with the Z-axis sliding table, and the visual recognition system 11 can move on the Z-axis sliding table along the vertical direction, thereby driving the visual recognition system 11 to move along the first direction a and the second direction b of the horizontal direction and along the vertical direction through the three-axis linear sliding table, and further enabling the visual recognition system 11 to move to all positions of the base plate 4.
In the process of leveling the base plate 4 by the vision recognition system 11 auxiliary leveling unit 2, firstly, selecting the position on the base plate 4 as a marking point, and then measuring and comparing the heights of the base plate 4 at a plurality of marking points by the vision recognition system 11; and then the heights of all the base plates 4 are adjusted through a plurality of lifting devices 21 of the leveling unit 2 until the heights of the base plates 4 at the selected marking points are the same, namely, the leveling of the base plates 4 is completed.
In this embodiment, the chip back-mount splicing apparatus completes the splicing of the chip 5 with the base plate 4 by the splicing unit 3. Forming a splicing position of the chip on the base plate 4, and forming a through hole penetrating through the base plate 4 at the splicing position of the chip; preferably, the base plate 4 is provided with a plurality of splicing positions, the splicing positions are distributed on the base plate 4 at intervals, and each splicing position is provided with a through hole correspondingly.
As shown in fig. 1 and 3, the assembling unit 3 is disposed below the base plate 4, and the assembling unit 3 includes an adsorption device 35 and a first driving mechanism for driving the adsorption device 35 to move, where the first driving mechanism can drive the adsorption device 35 to move along a first horizontal direction a and a second horizontal direction b, can drive the adsorption device 35 to move along a vertical direction, and can also drive the adsorption device 35 to rotate around an axis extending along the vertical direction.
Preferably, the first drive mechanism comprises a first drive 31, a second drive 32, a third drive 33 and a rotary drive 34. The first driving device 31 is fixedly arranged on the workbench 6, the second driving device 32 is arranged on the driving end of the first driving device 31, and the second driving device 32 can be driven to move along the first direction a through the first driving device 31; the third driving device 33 is mounted on the driving end of the second driving device 32, and the third driving device 33 can be driven to move along the second direction b through the second driving device 32; the suction device 35 is connected to the drive end of the third drive device 33 by a rotary drive device 34, the suction device 35 can be driven to move in the vertical direction by the third drive device 33, and the suction device 35 can be driven to rotate around an axis extending in the vertical direction by the rotary drive device 34.
The first driving device 31 and the second driving device 32 can drive the adsorption device 35 to move along the first direction a and the second direction b of the horizontal direction, so that the adsorption device 35 moves to the lower part of the through hole corresponding to the splicing position of the base plate 4; the third driving device 33 can drive the adsorption placement to move along the vertical direction, so that the adsorption device 35 can penetrate through the through hole to extend to the upper side of the base plate 4.
The upper end of the adsorption device 35 is provided with an adsorption end, an operator can place the chip 5 at the adsorption end, so that the chip 5 is attached to the adsorption device 35, and the chip 5 is driven to move by the movement of the adsorption device 35. The adsorption device 35 and the chip 5 are driven to rotate by the rotary driving device 34, so that the chip 5 rotates to an angle corresponding to the splicing position, and then the chip 5 is driven to descend by the third driving device 33 again, so that the chip 5 falls on the splicing position of the base plate 4. Preferably, the splicing position of the substrate 4 is coated with an adhesive, and the adsorption device 35 is provided with a heating element, and after the chip 5 is placed on the substrate 4, the heating element can heat the adhesive to bond the chip 5 on the substrate 4 by using the adhesive.
In this embodiment, it is preferable that the driving of the horizontal and vertical movements of the suction means 35 is achieved by one triaxial linear slide as the first driving means 31, the second driving means 32 and the third driving means 33.
In the process of assembling the chip 5 and the base plate 4 through the assembling unit 3, the identifying unit 1 can detect the assembly deviation between the base plate 4 and the chip 5, and then compensate the error between the chip 5 and the splicing position through the assembling unit 3. After the adsorption of the chip 5 by the adsorption device 35 is completed, firstly, the characteristic points on the chip 5 are marked by the visual recognition system 11 to form first mark points, and the characteristic points of the splicing position are marked by the visual recognition system 11 to form second mark points; analyzing and calculating deviation of the first mark point and the second mark point through the visual recognition system 11 to obtain a position error between the chip 5 and the splicing position; then driving the chip 5 to move through a first driving mechanism, for example, enabling the chip 5 to move along a first direction a and a second direction b for a preset distance, or enabling the chip 5 to rotate for a preset angle until the deviation between the splicing positions of the chip 5 and the base plate 4 is qualified; the chip 5 is then driven by the first driving mechanism to descend until the chip 5 falls onto the mounting position of the base plate 4.
After the chip 5 falls on the base plate 4, the position deviation between the splicing positions of the chip 5 and the base plate 4 can be measured again through the visual recognition system 11, and if the deviation measurement is qualified, the next splicing of the chip 5 and the base plate 4 can be performed; if the measurement is not qualified, after the visual recognition system 11 calculates the deviation, the chip 5 is moved by the first driving mechanism to compensate the deviation between the splice positions of the chip 5 and the base plate 4 until the deviation is qualified.
It should be noted that, through the chip back-mounted splicing device of the present application, the large-area base plate 4 and the chip 5 can be spliced, only the workbench 6 has enough floor area, the leveling unit 2 for supporting the base plate 4 can effectively support the base plate 4, the adsorption device 35 in the splicing unit 3 has enough moving range in the horizontal direction, so that the adsorption device 35 can move to each splicing position on the base plate 4, the visual recognition system 11 of the recognition unit 1 also has enough moving range in the horizontal direction, so that the visual system can move to each splicing position of the base plate 4, and the large-area base plate 4 and the multichip 5 can be spliced.
Therefore, the chip 5 and the base plate 4 can be spliced efficiently and accurately by the chip back-mounting splicing equipment, and the back of the chip 5 is fixedly adsorbed by the adsorption device 35 in the splicing process, so that the surface of the chip 5 is not polluted in the splicing process of the base plate 4; meanwhile, the chip back-mounted splicing equipment is simple in structure, low in production and manufacturing cost and convenient to maintain.
The application also provides a chip back-loading splicing method adopting the chip splicing equipment, as shown in fig. 4, comprising the following steps:
step 100, mounting the base plate on a leveling unit, identifying levelness of the base plate through an identification unit, and leveling the base plate through the leveling unit;
step 200, the adsorption device of the assembling unit moves to the through hole of the base plate, and the adsorption device moves upwards to penetrate through the base plate; placing the chip on an adsorption device to adsorb and fix the back of the chip;
step 300, identifying and calculating deviation of the marking points of the chip and the marking points of the base plate through an identification unit;
step 400, the adsorption device drives the chip to move so as to compensate the deviation between the chip and the base plate;
step 500, the adsorption device drives the chip to descend to the assembly plane of the base plate, and the chip and the base plate are assembled;
step 600, performing deviation measurement on the assembly between the chip and the base plate through the identification unit;
if the deviation measurement is qualified, assembling the next chip and the base plate;
if the deviation measurement is not qualified, the chip is driven to move by the adsorption device until the deviation measurement result is qualified.
Preferably, the chip back-mounting splicing method comprises the following steps:
step 100, mounting a base plate 4 on a leveling unit 2, moving the base plate 4 to different positions by a visual recognition system 11 of a recognition unit 1, and selecting a plurality of positions on the base plate 4 for marking to form a plurality of marking points; the heights of a plurality of mark points are measured and compared through the visual recognition system 11 to obtain deviation of the levelness of the base plate 4, and then the heights of all parts of the base plate 4 are adjusted through the leveling unit 2 until the deviation of the levelness of the base plate 4 is in a qualified range, so that leveling of the base plate 4 is completed.
Step 200, driving the adsorption device 35 to move through a first driving mechanism of the assembling unit 3, enabling the adsorption device 35 to move below the through hole of the base plate 4, and enabling the adsorption device 35 to ascend until the adsorption device 35 extends out of the base plate 4 by a preset height; the chip 5 to be assembled is placed at the adsorption end of the adsorption device 35, and the chip 5 is adsorbed and fixed through the adsorption device 35.
Step 300, after the adsorption and fixation of the chip 5 are completed by the adsorption device 35, the mobile visual recognition system 11 selects the characteristic points on the chip 5 as first marking points for marking, and selects the characteristic points on the base plate 4 as second marking points for marking; the first mark point and the second mark point are analyzed and the deviation calculated by the visual recognition system 11 to obtain the position deviation between the splice sites of the chip 5 and the substrate 4.
And 400, after the position deviation between the splicing positions of the chip 5 and the base plate 4 is obtained, driving the chip 5 to move through a first driving mechanism so as to compensate the position deviation between the splicing positions of the chip 5 and the base plate 4 until the deviation result is qualified.
And 500, driving the chip 5 to descend by the first driving mechanism, placing the chip 5 on the base plate 4, and assembling the chip 5 and the base plate 4.
Step 600, after the chip 5 is placed on the substrate 4, the first mark point of the chip 5 and the second mark point on the substrate 4 are analyzed and calculated again by using the visual recognition system 11, so as to obtain the deviation between the two.
If the deviation between the chip 5 and the base plate 4 is within an acceptable range, that is, the deviation measurement is qualified, repeating the steps 200 to 500 to assemble the next chip 5 and the base plate 4;
if the deviation between the chip 5 and the base plate 4 exceeds the acceptable range, namely the deviation measurement is not qualified, the chip 5 needs to be moved by the first driving mechanism to compensate the deviation, the deviation measurement is indicated to be qualified, and the next assembly of the chip 5 and the base plate 4 is performed.
Therefore, the chip back-mounting splicing equipment and the chip back-mounting splicing method are adopted, so that multi-chip and large-area splicing can be performed, meanwhile, the splicing precision of the chip 5 and the base plate 4 is ensured, and the surface of the chip 5 is not polluted.
Finally, it should be noted that: the above embodiments are only for illustrating the technical solution of the present invention, and not for limiting the same; although the invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some or all of the technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit of the invention.
Claims (10)
1. The chip back-mounting splicing equipment is characterized by comprising a workbench, and a leveling unit, a splicing unit, an identification unit and a base plate which are arranged on the workbench;
the base plate is connected with the leveling unit, and the leveling unit is used for adjusting the levelness of the base plate;
the assembling unit is positioned below the base plate and comprises an adsorption device;
the substrate is provided with a through hole, the adsorption device can move to the through hole, and the adsorption device can pass through the substrate through the through hole;
the adsorption device is used for adsorbing the back surface of the chip and placing the chip on the assembly surface of the base plate;
the identification unit is used for detecting levelness of the base plate and assembly deviation of the chip and the base plate.
2. The chip back-mounted stitching device according to claim 1, wherein the leveling unit includes a lifting device;
the driving end of the lifting device is connected with the base plate so as to drive the base plate to lift;
the number of the lifting devices is multiple, and the lifting devices are distributed at intervals along the circumferential direction of the base plate.
3. The chip back-mounted stitching device according to claim 2, wherein the leveling unit further comprises a universal adjustment means;
the number of the universal adjusting devices is multiple, and the universal adjusting devices are in one-to-one correspondence with the lifting devices;
the base plate is connected with the corresponding lifting device through the universal adjusting device.
4. The chip back-mount splice device of claim 1, wherein the splice unit includes a first drive mechanism;
the first driving mechanism comprises a first driving device, a second driving device and a third driving device;
the driving end of the first driving device is connected with the second driving device, and the first driving device can drive the second driving device to move along a first direction;
the driving end of the second driving device is connected with the third driving device, the second driving device can drive the third driving device to move along a second direction perpendicular to the first direction, and the driving end of the third driving device is connected with the adsorption device;
the first driving device and the second driving device are used for moving the adsorption device to the position below the through hole;
the third driving device is used for driving the adsorption device to lift so that the adsorption device passes through the base plate through the through hole.
5. The chip back-mounted stitching device according to claim 4, wherein the first drive mechanism further comprises a rotational drive;
the adsorption device is connected with the third driving device through the rotary driving device, and the rotary driving device is used for driving the adsorption device to rotate around the vertical direction.
6. The chip back-mounted stitching device according to claim 1, wherein the identification unit comprises a second drive mechanism and a visual identification system;
the second driving mechanism is arranged on the workbench, the visual recognition system is positioned above the base plate and connected with the driving end of the second driving mechanism, and the second driving mechanism can drive the visual recognition system to move.
7. The chip back-mounted splice device of claim 6, wherein the second drive mechanism is a three-axis linear slide.
8. The die backside splice apparatus of claim 1, wherein the number of through holes is plural, and the plural through holes are spaced apart on the base plate.
9. The chip back-mounted splicing device according to claim 1, wherein the adsorption means is provided with a heating member.
10. The chip back-mounting splicing method is characterized by comprising the following steps of:
step 100, mounting a base plate on a leveling unit, identifying levelness of the base plate through an identification unit, and leveling the base plate through the leveling unit;
step 200, an adsorption device of an assembling unit moves to a through hole of the base plate, and the adsorption device moves upwards to penetrate through the base plate;
placing a chip on the adsorption device to adsorb and fix the back of the chip;
step 300, identifying and calculating deviation of the marking points of the chip and the marking points of the base plate through an identification unit;
step 400, the adsorption device drives the chip to move so as to compensate the deviation between the chip and the base plate;
step 500, the adsorption device drives the chip to descend to the assembly plane of the base plate, and the chip and the base plate are assembled;
step 600, performing deviation measurement on the assembly between the chip and the base plate through the identification unit;
if the deviation measurement is qualified, assembling the next chip and the base plate;
and if the deviation measurement is not qualified, driving the chip to move through the adsorption device until the deviation measurement result is qualified.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202011381239.XA CN112490158B (en) | 2020-11-30 | 2020-11-30 | Chip back-mounted splicing equipment and splicing method |
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| CN202011381239.XA CN112490158B (en) | 2020-11-30 | 2020-11-30 | Chip back-mounted splicing equipment and splicing method |
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| CN112490158B true CN112490158B (en) | 2024-01-26 |
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| CN116038774B (en) * | 2023-03-31 | 2023-07-04 | 无锡卓海科技股份有限公司 | Parallelism adjusting structure and method for wafer carrying platform and mechanical arm |
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| JP2016152393A (en) * | 2015-02-19 | 2016-08-22 | 東レエンジニアリング株式会社 | Mounting device and mounting method |
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| CN111834272A (en) * | 2019-04-18 | 2020-10-27 | 富士电机株式会社 | Assembly jig kit and manufacturing method of semiconductor module |
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| US6472728B2 (en) * | 2001-03-05 | 2002-10-29 | Delphi Technologies, Inc. | Condition sensitive adhesive tape for singulated die transport devices |
| US6827789B2 (en) * | 2002-07-01 | 2004-12-07 | Semigear, Inc. | Isolation chamber arrangement for serial processing of semiconductor wafers for the electronic industry |
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| CN102769997A (en) * | 2011-05-04 | 2012-11-07 | Ips系统股份有限公司 | Apparatus for bonding semiconductor chip |
| JP2016152393A (en) * | 2015-02-19 | 2016-08-22 | 東レエンジニアリング株式会社 | Mounting device and mounting method |
| CN209140085U (en) * | 2018-08-29 | 2019-07-23 | 大族激光科技产业集团股份有限公司 | A kind of vacuum suction levelling device |
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