CN112485116A - Device and method for testing buffer performance of buffer layer of high-voltage cable - Google Patents

Device and method for testing buffer performance of buffer layer of high-voltage cable Download PDF

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CN112485116A
CN112485116A CN202011331977.3A CN202011331977A CN112485116A CN 112485116 A CN112485116 A CN 112485116A CN 202011331977 A CN202011331977 A CN 202011331977A CN 112485116 A CN112485116 A CN 112485116A
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buffer
sample
testing
supporting rod
tray
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CN112485116B (en
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刘若溪
刘宏亮
陈平
任志刚
李华春
车瑶
侯宇程
王帅
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State Grid Corp of China SGCC
State Grid Beijing Electric Power Co Ltd
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State Grid Beijing Electric Power Co Ltd
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    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N3/00Investigating strength properties of solid materials by application of mechanical stress
    • G01N3/08Investigating strength properties of solid materials by application of mechanical stress by applying steady tensile or compressive forces
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N3/00Investigating strength properties of solid materials by application of mechanical stress
    • G01N3/02Details
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N3/00Investigating strength properties of solid materials by application of mechanical stress
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Abstract

The invention discloses a device and a method for testing the buffer performance of a buffer layer of a high-voltage cable. Wherein, the method comprises the following steps: acquiring a plurality of scale variable quantities after a metal sliding rod in the testing device moves on a first supporting rod when weights with different weights are added to a tray in the testing device; determining a plurality of deformation parameters of a specified buffer sample based on the plurality of scale variations; determining a buffering performance level of the specified buffered sample according to the deformation parameters. The invention solves the technical problem that no scheme for testing the buffer performance of the buffer layer of the cable exists in the related technology.

Description

Device and method for testing buffer performance of buffer layer of high-voltage cable
Technical Field
The invention relates to the field of cable manufacturing, in particular to a device and a method for testing the buffer performance of a buffer layer of a high-voltage cable.
Background
The buffer performance of the high-voltage cable buffer layer is of great importance in the aspect of guaranteeing safe and reliable operation of the cable, and the high-voltage cable buffer layer plays a role in protecting the insulation of the high-voltage cable from being damaged by external force. The cable inevitably bends during transportation, laying and operation, which causes the corrugated aluminum sheath to be pressed inwards; meanwhile, along with the change of the external temperature and the change of the current-carrying capacity of the conductor, the phenomenon of expansion with heat and contraction with cold can occur inside the cable, so that a certain pressure exists between the aluminum sheath and the insulation. The buffer function of the buffer layer is that the buffer layer bears the pressure and generates micro deformation at the same time, so that the cable insulation is not damaged. Generally, the smaller the deformation of the buffer layer is, the better the buffer performance of the buffer layer is; the larger the deformation of the buffer layer, the worse the buffer performance. At present, however, the manufacturing and testing standards of cables and accessories at home and abroad have no relevant regulations on the buffer performance of the buffer layer, and no corresponding method is used for testing and comparing, so that cable and accessory manufacturers cannot clearly determine the manufacturing requirements of the buffer performance of the buffer layer, and cable application units cannot evaluate and accept the buffer performance of the buffer layer.
In view of the above problems, no effective solution has been proposed.
Disclosure of Invention
The embodiment of the invention provides a device and a method for testing the buffer performance of a buffer layer of a high-voltage cable, wherein the method comprises the steps of obtaining a plurality of scale variable quantities after a metal sliding rod in testing equipment moves on a first supporting rod when weights with different weights are added to a tray in the testing equipment; determining a plurality of deformation parameters of the specified buffer sample based on the plurality of scale variations; determining a buffering performance level of the specified buffered sample according to the deformation parameters. At least to solve the technical problem that no scheme for testing the buffer performance of the buffer layer of the cable exists in the related art.
According to an aspect of the embodiments of the present invention, there is provided an apparatus for testing buffering performance of a buffer layer of a high voltage cable, including: a chassis; a first supporting rod is arranged on the chassis, and scale information is arranged on the first supporting rod; one end of the metal sliding rod is arranged on the first supporting rod, and the other end of the metal sliding rod is provided with a tray, wherein the metal sliding rod is arranged at one end of the first supporting rod and can slide on the first supporting rod; the sample bearing structure is arranged on the chassis, is used for bearing the buffer sample to be tested and is contacted with the bottom of the tray; when the weight is placed in the tray, the weight drives the tray to apply external force to the metal sliding rod, so that the metal sliding rod moves along the scale direction of the first supporting rod, and the tray downwards extrudes the buffer sample to be detected in the sample bearing mechanism.
Optionally, the sample carrier structure comprises: a first test board and a second test board; wherein, the first test board is arranged below the tray; the second test board is fixed on the chassis, arranged below the first test board and used for bearing the buffer sample to be tested.
Optionally, the sample carrier structure further comprises: and one end of the second supporting rod is arranged on the chassis, and the other end of the second supporting rod is connected with the bottom of the second testing board and used for fixing the second testing board.
Optionally, the other end of the second supporting rod is connected to a central position of the second testing board.
Optionally, the first test board and the second test board are identical in size and shape.
Optionally, the number of the metal slide bars and the number of the sample bearing structures are both multiple, and the number of the metal slide bars and the number of the sample bearing structures are in one-to-one correspondence.
Optionally, a plurality of metal sliding rods are arranged at different scale positions of the first supporting rod, and the connecting directions of the plurality of metal sliding rods and the corresponding trays are different.
According to another aspect of the embodiments of the present invention, there is provided a method for measuring the buffer performance of a buffer layer of a high voltage cable according to a test apparatus, including: acquiring a plurality of scale variable quantities after a metal sliding rod in the testing equipment moves on a first supporting rod when weights with different weights are added to a tray in the testing equipment; determining a plurality of deformation parameters of the specified buffer sample based on the plurality of scale variations; determining a buffering performance level of the specified buffering sample according to the plurality of deformation parameters.
Optionally, after determining the plurality of deformation parameters of the specified buffer sample based on the plurality of scale changes, the method further includes: determining a first pressure value born by the appointed buffer sample when weights with different weights are added according to the plurality of deformation parameters; generating a first curve function for representing the deformation trend of the specified buffer sample according to the plurality of first pressure values and the deformation parameter; and displaying the curve corresponding to the first curve function.
Optionally, determining the buffering performance level of the specified buffered sample according to the deformation parameters includes: acquiring deformation parameters of other buffer samples when weights with different weights are added to the tray; determining a second pressure value born by the appointed buffer sample when weights with different weights are added according to the deformation parameters of other buffer samples; generating a second curve function for representing the deformation trend of other buffer samples according to the plurality of second pressure values and the deformation parameters; and determining linear independent variables in the first curve function and the second curve function, and determining the buffering performance grade of the specified buffering sample based on the value of the linear independent variable corresponding to the specified buffering sample.
In the embodiment of the invention, a device and a method for testing the buffering performance of a buffer layer sample are provided, and a plurality of scale variable quantities after a metal sliding rod in testing equipment moves on a first supporting rod when weights with different weights are added to a tray in the testing equipment are obtained; determining a plurality of deformation parameters of the specified buffer sample based on the plurality of scale variations; and determining the buffer performance grade of the appointed buffer sample according to the deformation parameters, thereby solving the technical problem that no scheme for testing the buffer performance of the buffer layer of the cable exists in the related technology.
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The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this application, illustrate embodiment(s) of the invention and together with the description serve to explain the invention without limiting the invention. In the drawings:
FIG. 1 is a schematic diagram of an apparatus for measuring the buffering capacity of a buffered sample to be tested according to an embodiment of the present invention;
FIG. 2 is a schematic diagram of an alternative apparatus for measuring buffer performance of buffered samples under test according to an embodiment of the present invention;
FIG. 3 is a diagram illustrating an alternative method for measuring the buffering performance of buffered samples under test according to an embodiment of the present invention;
FIG. 4 is a schematic diagram of a fitted curve corresponding to a factory 1 buffer layer according to an embodiment of the invention;
FIG. 5 is a schematic diagram of a fitted curve corresponding to a factory 2 buffer layer according to an embodiment of the invention;
FIG. 6 is a schematic diagram of a fitted curve corresponding to a factory 3 buffer layer according to an embodiment of the invention;
FIG. 7 is a schematic diagram of a fitted curve corresponding to a factory 4 buffer layer according to an embodiment of the invention;
FIG. 8 is a schematic diagram of a fitted curve corresponding to a factory 5 buffer layer according to an embodiment of the invention;
Detailed Description
In order to make the technical solutions of the present invention better understood, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that the terms "first," "second," and the like in the description and claims of the present invention and in the drawings described above are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used is interchangeable under appropriate circumstances such that the embodiments of the invention described herein are capable of operation in sequences other than those illustrated or described herein. Furthermore, the terms "comprises," "comprising," and "having," and any variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, system, article, or apparatus that comprises a list of steps or elements is not necessarily limited to those steps or elements expressly listed, but may include other steps or elements not expressly listed or inherent to such process, method, article, or apparatus.
Fig. 1 is a structural view of an apparatus for testing buffer performance of a buffer layer of a high voltage cable according to an embodiment of the present application, and as shown in fig. one, the apparatus for testing buffer performance of a buffer layer of a high voltage cable includes: the chassis 1 is used for supporting a device for testing the performance of a buffer layer of the high-voltage cable; the first supporting rod 2 is arranged on the chassis 1 and is vertical to the chassis 1, and meanwhile, scale information is arranged, so that the moving distance of the metal sliding rod 3 can be conveniently measured; a metal sliding rod 3, one end of which is disposed on the first supporting rod 2, and the other end of the metal sliding rod 3 is disposed with a tray 4, wherein the metal sliding rod 3 disposed at one end of the first supporting rod 2 is slidable on the first supporting rod 2, and the slidable function of the metal sliding rod 3 can be realized by the following structure: one end of the metal sliding rod 3 is provided with a metal ring structure 9, the first supporting rod 2 penetrates through the metal ring structure 9 and is not in direct contact with the metal ring structure 9, a gap between the metal ring structure 9 and the first supporting rod 2 is small enough, the other end of the metal sliding rod 3 is connected with the tray 4, and the tray 4 is used for placing weights.
The connection mode of the metal sliding rod 3, the tray 4 and the metal ring structure 9 can be a connection mode which can ensure fastening connection, such as welding or bolt connection.
When a weight is placed in the tray 4, the weight drives the tray 4 to apply external force to the metal slide rod 3, so that the metal slide rod 3 moves along the scale direction of the first supporting rod 2, namely the direction vertical to the base 1, and the tray 4 downwards extrudes a buffer sample 7 to be tested in the sample bearing mechanisms (5, 6);
and the sample bearing structures (5, 6) are arranged on the chassis 1, are used for bearing the buffer sample 7 to be tested, and are contacted with the bottom of the tray 4. The sample carrier structure (5, 6) comprises: a first test board 5 and a second test board 6; wherein the first test board 5 is arranged below the tray 4; the second test board 6 is fixed on the chassis 4 and disposed below the first test board 5 for carrying the buffer sample 7 to be tested.
According to another aspect of the embodiments of the present invention, the apparatus further comprises:
one end of the second supporting rod 8 is arranged on the chassis 1 and is vertical to the chassis 1, and the other end of the second supporting rod is connected with the bottom of the second testing board 6 and used for fixing the second testing board 6. The other end of the second supporting rod 8 is connected to the center of the second testing board 6. The first test plate 5 and the second test plate 6 are identical in size and shape.
According to another aspect of the embodiments of the present invention, the apparatus further comprises: the number of metal slide bars 3 and sample support structures (5, 6) is plural, and the number of metal slide bars 3 and sample support structures (5, 6) is one-to-one. For example, as shown in fig. 2, a metal slide bar 3 ', a tray 4', a sample bearing structure (5 ', 6'), a second support bar 8 ', a metal ring structure 9', and a metal slide bar 3 ', a tray 4', a sample bearing structure (5 ', 6'), a second support bar 8 ', and a metal ring structure 9' are provided on the chassis 1.
Optionally, the plurality of metal slide bars 3 are disposed at different scale positions of the first support bar 2, and the connection directions of the plurality of metal slide bars 3 and the respective corresponding tray 4 are different, the connection direction refers to a direction from the end of the metal slide bar 3 connected with the first support bar 2 to the end connected with the tray 4, and an included angle formed by the projections of any two metal slide bars on the base is not equal to 0 degree
To facilitate understanding of the above embodiments, the following describes the workflow of the above test apparatus for buffering samples with reference to a specific example:
1) determining the overall mass m of the balance tray (tray 4), the dynamic test plate (i.e. the first test plate 5), the metal slide bar 30(g);
2) Determining the initial thickness l of the buffer layer to be tested (i.e. the buffer layer sample 7 to be tested)0(mm);
Without adding a buffer layer, measuring the scale value t at the metal mark post0
Adding a buffer layer to be tested between the two test boards, and measuring the scale value t of the metal marker post1
Putting weights into the balance tray, and gradually increasing the mass m of the weights1~mn-1(g) Sequentially measuring scale values t under different weight masses2~tn(n>5);
After the test is finished, removing the weights in the tray, and taking out a buffer layer sample to be tested (a buffer layer sample 7 to be tested);
the initial mass is known as m0And the initial deformation amount Δ t0=l0-(t1-t0) Then F is0=(m0×9.8)/1000(N),Δt1=t1-t2By analogy, Fn-1=(mn-1×9.8)/1000(N),Δtn-1=tn-1-tn
In accordance with an embodiment of the present invention, there is provided an embodiment of a method for testing the buffer performance of a buffer layer of a high voltage cable, where the steps illustrated in the flowchart of the figure may be performed in a computer system, such as a set of computer executable instructions, and where the logical order is illustrated in the flowchart, in some cases the steps illustrated or described may be performed in an order different than that illustrated herein.
Fig. 3 is a method for testing the buffering performance of a buffer layer of a high-voltage cable according to an embodiment of the invention, as shown in fig. 3, the method comprises the following steps:
step S102, acquiring a plurality of scale variable quantities after a metal sliding rod in the test equipment moves on a first supporting rod when weights with different weights are added to a tray in the test equipment; the scale variable quantity is used for representing the deformation degree of the sample to be detected.
Step S104, determining a plurality of deformation parameters of the appointed buffering sample based on the plurality of scale variable quantities, wherein the deformation parameters refer to the deformation degree of the buffering sample to be detected, specifically, the deformation parameters are the compression quantity of the buffering sample to be detected in the direction perpendicular to the base, and the scale variable quantities are the variable quantities of the deformation parameters, namely, the variable quantities of the compression quantity of the buffering sample to be detected in the direction perpendicular to the base.
As shown in table 1, the summary table is a summary table of the deformation degrees and corresponding pressures of different materials obtained from the buffer materials to be tested of 5 different manufacturers (manufacturer 1-manufacturer 5), and the overall masses of the weight, the balance tray (tray 4), the dynamic test plate (first test plate 5), the metal slide rod 3, and the metal ring structure 9.
TABLE 1
Figure BDA0002796068580000061
According to the fact that deformation of the materials with good buffering performance is relatively small when the materials bear the same pressure, the buffering performance of the buffering materials of manufacturers 5 and 2 is relatively good, and the buffering performance of the buffering material of manufacturer 1 is relatively poor.
And step S106, determining the buffering performance grade of the appointed buffering sample according to the plurality of deformation parameters.
The method for determining the buffering performance level of the buffering sample specifically comprises the following steps:
determining a first pressure value born by the appointed buffer sample when weights with different weights are added according to a plurality of deformation parameters;
generating a first curve function for representing the deformation trend of the specified buffer sample according to the plurality of first pressure values and the deformation parameter; and displaying the curve corresponding to the first curve function.
In another method for testing the performance of the buffer layer of the high-voltage cable, the method comprises the following steps:
optionally, determining the buffering performance level of the specified buffered sample according to the deformation parameters includes: acquiring deformation parameters of other buffer samples when weights with different weights are added to the tray; determining a second pressure value born by the appointed buffer sample when weights with different weights are added according to the deformation parameters of other buffer samples; generating a second curve function for representing the deformation trend of other buffer samples according to the plurality of second pressure values and the deformation parameters; and determining linear independent variables in the first curve function and the second curve function, and determining the buffering performance grade of the specified buffering sample based on the value of the linear independent variable corresponding to the specified buffering sample. The line-independent variables refer to parameters of the fitting function and these parameters are only relevant to the specified buffered sample itself.
Through the steps, the buffer performance of the buffer layer of the high-voltage cable can be measured, and meanwhile, the buffer performance of the buffer layer can be simply and easily tested and compared by a cable production party and a cable using party.
According to the method, the materials to be tested of 5 different manufacturers (manufacturer 1 to manufacturer 5) are selected, and the obtained fitting curve chart is shown in fig. 4-8. The functions of these 5 fitted curves can all be written as F ═ aebΔtAnd c, wherein F represents the pressure born by the material to be tested, delta t represents the deformation of the material to be tested, and a, b and c are parameters of a fitting function and are constants. The parameters of the fitting function for different manufacturers are as follows:
Figure BDA0002796068580000071
comparing the values of a × b, and combining the analysis results of the summary table, it is known that the value of a × b can well reflect the quality of the buffer performance of the buffer layer, so that a reasonable value of a × b can be selected to define the buffer performance of the buffer layer during the standard customization, that is, a threshold value of a × b is set, and only the buffer material to be tested which is greater than the threshold value is a qualified buffer material.
The above-mentioned serial numbers of the embodiments of the present invention are merely for description and do not represent the merits of the embodiments.
In the above embodiments of the present invention, the descriptions of the respective embodiments have respective emphasis, and for parts that are not described in detail in a certain embodiment, reference may be made to related descriptions of other embodiments.
In the embodiments provided in the present application, it should be understood that the disclosed technology can be implemented in other ways. The above-described embodiments of the apparatus are merely illustrative, and for example, the division of the units may be a logical division, and in actual implementation, there may be another division, for example, multiple units or components may be combined or integrated into another system, or some features may be omitted, or not executed. In addition, the shown or discussed mutual coupling or direct coupling or communication connection may be an indirect coupling or communication connection through some interfaces, units or modules, and may be in an electrical or other form.
The units described as separate parts may or may not be physically separate, and parts displayed as units may or may not be physical units, may be located in one place, or may be distributed on a plurality of units. Some or all of the units can be selected according to actual needs to achieve the purpose of the solution of the embodiment.
In addition, functional units in the embodiments of the present invention may be integrated into one processing unit, or each unit may exist alone physically, or two or more units are integrated into one unit. The integrated unit can be realized in a form of hardware, and can also be realized in a form of a software functional unit.
The integrated unit, if implemented in the form of a software functional unit and sold or used as a stand-alone product, may be stored in a computer readable storage medium. Based on such understanding, the technical solution of the present invention may be embodied in the form of a software product, which is stored in a storage medium and includes instructions for causing a computer device (which may be a personal computer, a server, or a network device) to execute all or part of the steps of the method according to the embodiments of the present invention. And the aforementioned storage medium includes: a U-disk, a Read-Only Memory (ROM), a Random Access Memory (RAM), a removable hard disk, a magnetic or optical disk, and other various media capable of storing program codes.
The foregoing is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, various modifications and decorations can be made without departing from the principle of the present invention, and these modifications and decorations should also be regarded as the protection scope of the present invention.

Claims (10)

1. An apparatus for testing the buffer performance of a buffer layer of a high-voltage cable, comprising:
a chassis;
a first supporting rod is arranged on the chassis, and scale information is arranged on the first supporting rod;
one end of the metal sliding rod is arranged on the first supporting rod, and the other end of the metal sliding rod is provided with a tray, wherein the metal sliding rod is arranged at one end of the first supporting rod and can slide on the first supporting rod;
the sample bearing structure is arranged on the chassis, is used for bearing a buffer sample to be tested, and is contacted with the bottom of the tray;
when the weight is placed in the tray, the weight drives the tray to apply external force to the metal sliding rod, so that the metal sliding rod moves along the scale direction of the first supporting rod, and the tray downwards extrudes the buffer sample to be tested in the sample bearing mechanism.
2. The testing device of claim 1, wherein the sample support structure comprises:
a first test board and a second test board;
wherein the first test board is disposed below the tray; the second test board is fixed on the chassis, arranged below the first test board and used for bearing the buffer sample to be tested.
3. The test device of claim 2, further comprising:
and one end of the second supporting rod is arranged on the chassis, and the other end of the second supporting rod is connected with the bottom of the second testing board and used for fixing the second testing board.
4. The testing device as claimed in claim 3, wherein the other end of the second supporting rod is connected to the second testing board at a central position thereof.
5. The test device of claim 2, wherein the first test plate and the second test plate are identical in size and shape.
6. The testing device of claim 1, wherein the number of the metal slide bars and the number of the sample-carrying structures are each plural, and the number of the metal slide bars and the number of the sample-carrying structures are in one-to-one correspondence.
7. The testing device as claimed in claim 6, wherein a plurality of metal sliding rods are disposed at different scale positions of the first supporting rod, and the connection directions of the plurality of metal sliding rods and the respective corresponding trays are different.
8. A method for testing the buffer performance of a buffer layer of a high-voltage cable, which is realized by the testing device for the buffer sample of any one of claims 1 to 7, and comprises the following steps:
acquiring a plurality of scale variable quantities after a metal sliding rod in the testing device moves on the first supporting rod when weights with different weights are added to a tray in the testing equipment;
determining a plurality of deformation parameters of a specified buffer sample based on the plurality of scale variations;
determining a buffering performance level of the specified buffered sample according to the deformation parameters.
9. The method of claim 8, wherein after determining the plurality of deformation parameters for the given buffer sample based on the plurality of scale changes, the method further comprises:
determining a first pressure value born by the appointed buffer sample when weights with different weights are added according to the deformation parameters;
generating a first curve function for representing the deformation trend of the specified buffer sample according to the first pressure values and the deformation parameters; and displaying a curve corresponding to the first curve function.
10. The method of claim 9, wherein determining the buffer performance level of the specified buffer sample according to the deformation parameters comprises:
acquiring deformation parameters of other buffer samples when weights with different weights are added to the tray;
determining a second pressure value born by the appointed buffer sample when weights with different weights are added according to the deformation parameters of the other buffer samples;
generating a second curve function for representing deformation trends of the other buffer samples according to the plurality of second pressure values and the deformation parameters;
and determining linear independent variables in the first curve function and the second curve function, and determining the buffering performance grade of the specified buffering sample based on the value of the linear independent variable corresponding to the specified buffering sample.
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计宏伟 等: "《基于高速图像测量技术的缓冲材料缓冲性能的表征》", 《振动与冲击》 *

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112697604A (en) * 2020-12-03 2021-04-23 国网北京市电力公司 Device and method for detecting buffer performance of cable buffer layer
CN112697604B (en) * 2020-12-03 2022-11-29 国网北京市电力公司 Device and method for detecting buffer performance of cable buffer layer

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