CN112484002A - LED lamp heat abstractor - Google Patents

LED lamp heat abstractor Download PDF

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Publication number
CN112484002A
CN112484002A CN202011363227.4A CN202011363227A CN112484002A CN 112484002 A CN112484002 A CN 112484002A CN 202011363227 A CN202011363227 A CN 202011363227A CN 112484002 A CN112484002 A CN 112484002A
Authority
CN
China
Prior art keywords
led lamp
heat
heat dissipation
substrate
chip microcomputer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202011363227.4A
Other languages
Chinese (zh)
Inventor
吴香辉
李仁�
刘山
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Jiangxi Ruisheng Photoelectric Technology Co ltd
Original Assignee
Jiangxi Ruisheng Photoelectric Technology Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jiangxi Ruisheng Photoelectric Technology Co ltd filed Critical Jiangxi Ruisheng Photoelectric Technology Co ltd
Priority to CN202011363227.4A priority Critical patent/CN112484002A/en
Publication of CN112484002A publication Critical patent/CN112484002A/en
Pending legal-status Critical Current

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
    • F21V29/503—Cooling arrangements characterised by the adaptation for cooling of specific components of light sources
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/003—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V25/00—Safety devices structurally associated with lighting devices
    • F21V25/10—Safety devices structurally associated with lighting devices coming into action when lighting device is overloaded, e.g. thermal switch
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/56—Cooling arrangements using liquid coolants
    • F21V29/58—Cooling arrangements using liquid coolants characterised by the coolants
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/60—Cooling arrangements characterised by the use of a forced flow of gas, e.g. air
    • F21V29/61—Cooling arrangements characterised by the use of a forced flow of gas, e.g. air characterised by control arrangements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/60—Cooling arrangements characterised by the use of a forced flow of gas, e.g. air
    • F21V29/67—Cooling arrangements characterised by the use of a forced flow of gas, e.g. air characterised by the arrangement of fans
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
    • F21V29/87—Organic material, e.g. filled polymer composites; Thermo-conductive additives or coatings therefor
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
    • F21V29/89—Metals
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V31/00—Gas-tight or water-tight arrangements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Abstract

The invention relates to an LED lamp heat dissipation device which comprises a substrate, wherein a plurality of LED lamps are arranged on one surface of the substrate according to a rule, a heat dissipation mechanism is arranged on one surface of the substrate away from the LED lamps, the heat dissipation mechanism comprises a support and a plurality of heat dissipation fans fixed in the support, a heat dissipation channel communicated with the outside is arranged between the substrate and the support, and an air outlet of each heat dissipation fan faces the substrate. The support is internally provided with a single chip microcomputer which is respectively electrically connected with the cooling fan and the LED lamp, and the single chip microcomputer controls the LED lamp and the cooling fan to be turned on or turned off simultaneously. When the single chip microcomputer controls the LED lamp to be powered on, the heat dissipation fan is also started, and the heat on the substrate can be dissipated to the outside through the heat dissipation channel by the airflow generated by the rotation of the heat dissipation fan, so that the phenomenon of short circuit on the substrate is avoided, and the service life of the LED lamp is prolonged.

Description

LED lamp heat abstractor
Technical Field
The invention relates to the technical field of LED lamps, in particular to an LED lamp heat dissipation device.
Background
The English language of the LED is (light emitting diode), and the LED lamp bead is the English abbreviation of the LED which is called LED for short, which is a popular name. The working principle is as follows: the terminal voltage of the PN junction forms a certain potential barrier, when a forward bias voltage is applied, the potential barrier is lowered, and most carriers in the P region and the N region diffuse to each other. Since electron mobility is much greater than hole mobility, a large number of electrons will diffuse into the P region, constituting an injection of minority carriers into the P region. These electrons recombine with holes in the valence band and the energy obtained upon recombination is released as light energy.
In the prior art, a plurality of LED lamps arranged in a rectangular shape are usually disposed on a substrate, and when the LED lamp is used, the plurality of LED lamps on one substrate work simultaneously, which generates a large amount of heat on the substrate. Along with the increase of the working time, the heat can not be dissipated, the temperature of the substrate is easily increased, the conductive circuit in the substrate is short-circuited, and the service life of the LED lamp is shortened.
Disclosure of Invention
Aiming at the defects in the prior art, the invention aims to provide the LED lamp heat dissipation device, which can quickly dissipate heat accumulated on the substrate when the LED lamp works, so that the heat dissipation effect is improved, and the service life of the LED lamp is prolonged.
The above object of the present invention is achieved by the following technical solutions:
a plurality of LED lamps are arranged on one surface of the substrate according to a rule, a heat dissipation mechanism is arranged on one surface of the substrate, which is far away from the LED lamps, the heat dissipation mechanism comprises a support and a plurality of heat dissipation fans fixed in the support, the substrate is fixed on the support, a heat dissipation channel communicated with the outside is arranged between the substrate and the support, and an air outlet of each heat dissipation fan faces the substrate;
the LED lamp is characterized in that a single chip microcomputer is arranged in the support, the single chip microcomputer is electrically connected with the cooling fan and the LED lamp respectively, and the single chip microcomputer controls the LED lamp and the cooling fan to be turned on or turned off simultaneously.
Through above-mentioned technical scheme, when singlechip control LED lamp circular telegram was lighted, radiator fan also opened together, along with operating time's increase, can be on the base plate accumulated heat capacity. The airflow generated by the rotation of the heat dissipation fan can dissipate the heat on the substrate to the outside through the heat dissipation channel, so that on one hand, the accumulation of the heat on the substrate is effectively avoided, and the temperature on the substrate is not too high; on the other hand, heat is timely dissipated, so that the phenomenon of short circuit on the substrate is avoided, and the service life of the LED lamp is prolonged. When the LED lamp is turned off, the single chip microcomputer can automatically turn off the cooling fan, so that electric energy is saved, and the LED lamp has high economic popularization value.
The present invention in a preferred example may be further configured to: the LED lamp is characterized in that one side, far away from the LED lamp, of the substrate is provided with a heat conduction layer, a cavity is formed in the heat conduction layer, a waterproof film is arranged on the inner wall of the cavity, and distilled water is filled in the cavity.
Through the technical scheme, the heat conducting layer is arranged to absorb heat from the LED lamp, so that the radiating efficiency is improved, and the light emitting effect of the LED lamp is ensured. The heat is conducted in the distilled water in the cavity through the heat conduction layer, and a large amount of heat can be absorbed due to the fact that the specific heat capacity of water is large, and the heat dissipation effect is improved. The arrangement of the waterproof film increases the sealing property in the cavity, avoids the leakage phenomenon of distilled water and improves the practicability.
The present invention in a preferred example may be further configured to: one side of the heat conduction layer, which is far away from the substrate, is fixedly connected with a metal radiating fin in contact with the waterproof film.
Through above-mentioned technical scheme, the heat of conduction distilled water in the cavity can be conducted on the metal fin, cools down the metal fin through radiator fan, has further promoted radiating efficiency.
The present invention in a preferred example may be further configured to: and the metal radiating fins are provided with radiating folds.
Through above-mentioned technical scheme, the area that the heat dissipation fold has increased heat dissipation sheetmetal and outside air contact to the radiating effect has been promoted greatly.
The present invention in a preferred example may be further configured to: the LED lamp temperature detection device is characterized in that a temperature sensor is arranged in the substrate and connected with the single chip microcomputer, the temperature sensor transmits detected data to the single chip microcomputer, the single chip microcomputer analyzes and processes the temperature data, and when the temperature data is higher than a standard value, the single chip microcomputer controls the LED lamp to be turned off.
Through the technical scheme, when the temperature on the substrate is too high, the single chip microcomputer can automatically control the LED lamp to be turned off, so that the further increase of heat is avoided, and the service life of the LED lamp is prolonged.
The present invention in a preferred example may be further configured to: the surface of the LED lamp is wrapped with transparent heat-dissipation silica gel.
Through the technical scheme, the transparent heat dissipation silica gel can protect the LED chip, so that the LED chip is not easily oxidized by the outside air, the light emitting effect of the LED lamp is ensured, and the heat dissipation efficiency of the LED lamp is improved.
In summary, the invention includes at least one of the following beneficial technical effects:
1. when the single chip microcomputer controls the LED lamp to be electrified and lightened, the heat radiation fan is also started, and heat can be accumulated on the substrate along with the increase of working time. The airflow generated by the rotation of the heat dissipation fan can dissipate the heat on the substrate to the outside through the heat dissipation channel, so that on one hand, the accumulation of the heat on the substrate is effectively avoided, and the temperature on the substrate is not too high; on the other hand, heat is timely dissipated, so that the phenomenon of short circuit on the substrate is avoided, and the service life of the LED lamp is prolonged. When the LED lamp is turned off, the single chip microcomputer can automatically turn off the cooling fan, so that electric energy is saved, and the LED lamp has high economic popularization value.
2. The heat conduction layer can absorb heat from the LED lamp, so that the heat dissipation efficiency is improved, and the light emitting effect of the LED lamp is ensured. The heat is conducted in the distilled water in the cavity through the heat conduction layer, and a large amount of heat can be absorbed due to the fact that the specific heat capacity of water is large, and the heat dissipation effect is improved. The arrangement of the waterproof film increases the sealing property in the cavity, avoids the leakage phenomenon of distilled water and improves the practicability.
3. When the temperature on the substrate is too high, the single chip microcomputer can automatically control the LED lamp to be turned off, so that further increase of heat is avoided, and the service life of the LED lamp is prolonged.
Drawings
FIG. 1 is a schematic structural diagram of the present invention.
Reference numerals: 1. a substrate; 11. an LED lamp; 12. a temperature sensor; 13. transparent heat-dissipating silica gel; 2. a heat dissipation mechanism; 21. a support; 22. a heat radiation fan; 3. a heat dissipation channel; 4. a single chip microcomputer; 5. a heat conductive layer; 51. a cavity; 52. a waterproof film; 6. a metal heat sink; 61. and (4) radiating folds.
Detailed Description
The present invention will be described in further detail with reference to the accompanying drawings.
Referring to fig. 1, the LED lamp heat dissipation device disclosed by the present invention includes a substrate 1, a plurality of LED lamps 11 are arranged on one surface of the substrate 1 according to a regular arrangement, a heat dissipation mechanism 2 is arranged on one surface of the substrate 1 away from the LED lamps 11, the heat dissipation mechanism 2 includes a support 21 and a plurality of heat dissipation fans 22 fixed in the support 21, the substrate 1 is fixed on the support 21, a heat dissipation channel 3 communicated with the outside is arranged between the substrate 1 and the support 21, and an air outlet of the heat dissipation fan 22 is arranged toward the substrate 1. The support 21 is internally provided with the single chip microcomputer 4, the single chip microcomputer 4 is respectively electrically connected with the heat radiation fan 22 and the LED lamp 11, and the single chip microcomputer 4 controls the LED lamp 11 and the heat radiation fan 22 to be turned on or turned off simultaneously.
In this embodiment, the surface of the LED lamp 11 is wrapped with a transparent heat-dissipating silica gel 13. Transparent heat dissipation silica gel 13 not only can protect the LED chip, makes it be difficult for by the oxidation of outside air, has guaranteed LED lamp 11's light-emitting effect simultaneously to the radiating efficiency of LED lamp 11 self has been promoted.
One side of the substrate 1, which is far away from the LED lamp 11, is provided with a heat conduction layer 5, a cavity 51 is formed inside the heat conduction layer 5, a waterproof film 52 is arranged on the inner wall of the cavity 51, and the cavity 51 is filled with distilled water. The heat conduction layer 5 can absorb heat from the LED lamp 11 due to the arrangement, so that the heat dissipation efficiency is improved, and the light emitting effect of the LED lamp 11 is ensured. Heat is conducted in the distilled water in the cavity 51 through the heat conduction layer 5, and a large amount of heat can be absorbed due to the fact that the specific heat capacity of the water is large, and the heat dissipation effect is improved. The arrangement of the waterproof film 52 increases the sealing property in the cavity 51, avoids the leakage phenomenon of distilled water and improves the practicability.
Referring to fig. 1, a metal heat sink 6 in contact with the waterproof film 52 is fixedly connected to a surface of the heat conductive layer 5 away from the substrate 1. The heat of the distilled water conducted in the cavity 51 can be conducted on the metal radiating fin 6, and the metal radiating fin 6 is cooled by the radiating fan 22, so that the radiating efficiency is further improved. Further, the metal heat sink 6 is provided with heat dissipation wrinkles 61. The heat dissipation fold 61 increases the contact area of the heat dissipation metal sheet with the outside air, thereby greatly improving the heat dissipation effect.
Referring to fig. 1, a temperature sensor 12 is arranged in a substrate 1, the temperature sensor 12 is connected with a single chip microcomputer 4, the temperature sensor 12 transmits detected data to the single chip microcomputer 4, the single chip microcomputer 4 analyzes and processes the temperature data, and when the temperature data is higher than a standard value, the single chip microcomputer 4 controls an LED lamp 11 to be turned off. When the temperature on the substrate 1 is too high, the singlechip 4 can automatically control the LED lamp 11 to be turned off, so that the further increase of heat is avoided, and the service life of the LED lamp 11 is prolonged.
The implementation principle of the embodiment is as follows: when the singlechip 4 controls the LED lamp 11 to be electrified and lightened, the heat radiation fan 22 is also started, and heat is accumulated on the substrate 1 along with the increase of working time. The airflow generated by the rotation of the heat dissipation fan 22 can dissipate the heat on the substrate 1 to the outside through the heat dissipation channel 3, so that on one hand, the accumulation of the heat on the substrate 1 is effectively avoided, and the temperature on the substrate 1 is not too high; on the other hand, heat is timely dissipated, so that the phenomenon of short circuit on the substrate 1 is avoided, and the service life of the LED lamp 11 is prolonged. When the LED lamp 11 is turned off, the single chip microcomputer 4 can automatically turn off the heat dissipation fan 22, thereby saving electric energy and having a strong economic popularization value.
The embodiments of the present invention are preferred embodiments of the present invention, and the scope of the present invention is not limited by these embodiments, so: all equivalent changes made according to the structure, shape and principle of the invention are covered by the protection scope of the invention.

Claims (6)

1. The utility model provides a LED lamp heat abstractor which characterized in that: the LED lamp structure comprises a substrate (1), wherein a plurality of LED lamps (11) are arranged on one surface of the substrate (1) according to a rule, a heat dissipation mechanism (2) is arranged on one surface, away from the LED lamps (11), of the substrate (1), the heat dissipation mechanism (2) comprises a support (21) and a plurality of heat dissipation fans (22) fixed in the support (21), a heat dissipation channel (3) communicated with the outside is arranged between the substrate (1) and the support (21), and an air outlet of each heat dissipation fan (22) faces the substrate (1);
the LED lamp is characterized in that a single chip microcomputer (4) is arranged in the support (21), the single chip microcomputer (4) is electrically connected with the heat dissipation fan (22) and the LED lamp (11) respectively, and the single chip microcomputer (4) controls the LED lamp (11) and the heat dissipation fan (22) to be turned on or turned off simultaneously.
2. The heat sink of claim 1, wherein: one side, far away from LED lamp (11), of base plate (1) is provided with heat-conducting layer (5), cavity (51) have been seted up to the inside of heat-conducting layer (5), the inner wall of cavity (51) is provided with waterproof film (52), cavity (51) intussuseption is filled with distilled water.
3. The heat sink of claim 2, wherein: one surface of the heat conduction layer (5) far away from the substrate (1) is fixedly connected with a metal radiating fin (6) contacted with the waterproof film (52).
4. The heat sink of claim 3, wherein: and the metal radiating fins (6) are provided with radiating folds (61).
5. The heat sink of claim 1, wherein: be provided with temperature sensor (12) in base plate (1), temperature sensor (12) with singlechip (4) are connected, temperature sensor (12) with the data transmission who detects arrive in singlechip (4), singlechip (4) carry out analysis processes to temperature data, work as when temperature data is higher than the standard value, singlechip (4) control LED lamp (11) are closed.
6. The heat sink of claim 1, wherein: the surface of the LED lamp (11) is wrapped with transparent heat-dissipation silica gel (13).
CN202011363227.4A 2020-11-27 2020-11-27 LED lamp heat abstractor Pending CN112484002A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202011363227.4A CN112484002A (en) 2020-11-27 2020-11-27 LED lamp heat abstractor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202011363227.4A CN112484002A (en) 2020-11-27 2020-11-27 LED lamp heat abstractor

Publications (1)

Publication Number Publication Date
CN112484002A true CN112484002A (en) 2021-03-12

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN202011363227.4A Pending CN112484002A (en) 2020-11-27 2020-11-27 LED lamp heat abstractor

Country Status (1)

Country Link
CN (1) CN112484002A (en)

Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWM342473U (en) * 2007-12-20 2008-10-11 Hai Huang A high-wattage LED light with forced air cooling fan
CN203431523U (en) * 2013-09-17 2014-02-12 潍坊永明光电有限公司 Multifunctional led searchlight
CN104501015A (en) * 2014-12-24 2015-04-08 东莞市闻誉实业有限公司 Led illuminating lamp
CN105042387A (en) * 2015-08-27 2015-11-11 刘海兵 Lamp with LED lamp wick
CN205782757U (en) * 2016-05-25 2016-12-07 东莞市兆合智能照明有限公司 A kind of LED of 360 degree of printing opacities
CN206222000U (en) * 2016-11-04 2017-06-06 东莞市兆合智能照明有限公司 A kind of LED
CN207350199U (en) * 2017-05-31 2018-05-11 温州冲亚电子科技有限公司 A kind of light-focusing type LED lamp of automobile of perfect heat-dissipating
CN207350256U (en) * 2017-09-25 2018-05-11 中山市宇阳森泰照明科技有限公司 A kind of LED light shell of high efficiency and heat radiation
CN108518661A (en) * 2018-04-28 2018-09-11 安徽世林照明股份有限公司 A kind of auxiliary high-power LED lamp cooling device
CN109404808A (en) * 2018-10-22 2019-03-01 合肥先杰新能源科技有限公司 A kind of LED lamp of optoelectronic integration
CN210266951U (en) * 2019-09-30 2020-04-07 福建鼎坤电子科技有限公司 High-efficient radiating integral court lamp

Patent Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWM342473U (en) * 2007-12-20 2008-10-11 Hai Huang A high-wattage LED light with forced air cooling fan
CN203431523U (en) * 2013-09-17 2014-02-12 潍坊永明光电有限公司 Multifunctional led searchlight
CN104501015A (en) * 2014-12-24 2015-04-08 东莞市闻誉实业有限公司 Led illuminating lamp
CN105042387A (en) * 2015-08-27 2015-11-11 刘海兵 Lamp with LED lamp wick
CN205782757U (en) * 2016-05-25 2016-12-07 东莞市兆合智能照明有限公司 A kind of LED of 360 degree of printing opacities
CN206222000U (en) * 2016-11-04 2017-06-06 东莞市兆合智能照明有限公司 A kind of LED
CN207350199U (en) * 2017-05-31 2018-05-11 温州冲亚电子科技有限公司 A kind of light-focusing type LED lamp of automobile of perfect heat-dissipating
CN207350256U (en) * 2017-09-25 2018-05-11 中山市宇阳森泰照明科技有限公司 A kind of LED light shell of high efficiency and heat radiation
CN108518661A (en) * 2018-04-28 2018-09-11 安徽世林照明股份有限公司 A kind of auxiliary high-power LED lamp cooling device
CN109404808A (en) * 2018-10-22 2019-03-01 合肥先杰新能源科技有限公司 A kind of LED lamp of optoelectronic integration
CN210266951U (en) * 2019-09-30 2020-04-07 福建鼎坤电子科技有限公司 High-efficient radiating integral court lamp

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Application publication date: 20210312