CN215951350U - High-performance heat dissipation device - Google Patents
High-performance heat dissipation device Download PDFInfo
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- CN215951350U CN215951350U CN202122619215.XU CN202122619215U CN215951350U CN 215951350 U CN215951350 U CN 215951350U CN 202122619215 U CN202122619215 U CN 202122619215U CN 215951350 U CN215951350 U CN 215951350U
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- heat
- radiator body
- housing
- heat sink
- radiating fins
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Abstract
A high-effect heat dissipation device belongs to the technical field of radiators for laser lighting lamps. The heat radiator comprises a heat radiator body, a fan and a housing, wherein the upper surface of the heat radiator body is installed in contact with a heat source, the heat radiator body is embedded with a phase-change heat pipe on the upper surface, heat radiating fins are arranged on the lower surface of the heat radiator body, the fan is installed on the lower surface of the heat radiator body and located on the rear side of the heat radiating fins, the housing forms an opening towards the heat radiator body, the housing is arranged below the heat radiator body, the opening of the housing is installed in a matched mode with the heat radiator body, the fan and the heat radiating fins are contained in a housing cavity of the housing, and a plurality of heat radiating through holes are formed in the side wall of the housing towards the front side of the heat radiating fins. The advantages are that: the heat dissipation area is large, the heat transfer speed is high, the structure is simple, and the heat dissipation effect is good.
Description
Technical Field
The utility model belongs to the technical field of radiators for laser lighting lamps, and particularly relates to a high-efficiency heat dissipation device.
Background
The laser (semiconductor laser diode) light source has the advantages of energy concentration, long irradiation distance and the like, can obtain a point light source with ultrahigh brightness, and can be used for designing a semiconductor laser illuminating lamp with concentrated light beams for the fields of automobile illumination, maritime search, field searchlighting and the like. However, with the prior art, the electro-optic conversion efficiency of the semiconductor laser illumination lamp is only about 40% to 50%, that is, not all electric energy can be converted into light energy, but most of the electric energy is still converted into heat energy. When the LED lamp is used, the light source is packaged in the shell with a small size, energy is concentrated, and if heat accumulated in the moment cannot be led out in time, the temperature of the chip is increased, and the service life and the reliability of the lamp are directly influenced.
In view of the above-mentioned prior art, there is a need for an improved structure of a heat sink for a semiconductor laser lamp, and for this reason, the applicant has made an advantageous design, and the technical solutions to be described below have been made in this context.
SUMMERY OF THE UTILITY MODEL
The utility model aims to provide a high-efficiency heat dissipation device to solve the problem that the conventional semiconductor laser lighting lamp is poor in heat dissipation.
The utility model aims to achieve the purpose, and the high-efficiency heat dissipation device is characterized by comprising a heat radiator body, a fan and a housing, wherein the upper surface of the heat radiator body is installed in contact with a heat source, the upper surface of the heat radiator body is embedded with a phase-change heat pipe, the lower surface of the heat radiator body is provided with heat dissipation fins, the fan is installed on the lower surface of the heat radiator body and is positioned at the rear side of the heat dissipation fins, the housing forms an opening towards the heat radiator body, the housing is arranged below the heat radiator body, the opening of the housing is matched with the heat radiator body, the fan and the heat dissipation fins are accommodated in a housing cavity of the housing, and the side wall of the housing, which faces the front side of the heat dissipation fins, is provided with a plurality of heat dissipation through holes.
In a specific embodiment of the present invention, the number of the phase-change heat pipes is multiple, one end of each phase-change heat pipe converges at the rear end of the upper surface of the heat sink body, and the other end extends towards the front end of the upper surface of the heat sink body and symmetrically diverges left and right.
In another specific embodiment of the present invention, the phase change heat pipe is fixedly mounted to the heat sink body by a heat conductive sealant.
In another specific embodiment of the present invention, the cover is formed with folded edges around the opening, cover fixing holes are distributed at intervals on the folded edges, the radiator body is provided with body fixing holes at the peripheral edge corresponding to the cover fixing holes, and the cover and the radiator body are fixedly mounted by screws passing through the cover fixing holes and the body fixing holes.
In another embodiment of the present invention, the heat sink body is a heat sink body.
In yet another specific embodiment of the present invention, the phase-change heat pipe is a phase-change heat conducting copper pipe.
The utility model embeds the phase-change heat pipe on the upper surface of the radiator body, and arranges the radiating fins and the fan on the lower surface, because of adopting the structure, compared with the prior art, the utility model has the advantages that: the heat dissipation area is large, the heat transfer speed is high, the structure is simple, and the heat dissipation effect is good.
Drawings
Fig. 1 is a schematic view of the overall structure of the present invention.
In the figure: 1. the heat radiator comprises a heat radiator body, 11 phase change heat pipes, 12 heat radiating fins and 13 body fixing holes; 2. a fan; 3. the heat dissipation structure comprises a shell, 31, an opening, 32, a heat dissipation through hole, 33, a folded edge and 331, and a shell fixing hole.
Detailed Description
The following detailed description of the embodiments of the present invention will be described with reference to the accompanying drawings, but the description of the embodiments is not intended to limit the technical solutions, and any changes in form and not essential to the inventive concept should be regarded as the protection scope of the present invention.
In the following description, any concept related to the directionality (or the directional nature) of up, down, left, right, front, and rear is intended to facilitate understanding by the public, and thus should not be construed as particularly limiting the technical solution provided by the present invention, with respect to the position state in which the drawings are being described.
Referring to fig. 1, the present invention relates to a high performance heat dissipation device, which includes a heat sink body 1, a fan 2 and a housing 3. The upper surface of the radiator body 1 is installed in contact with a heat source, the phase-change heat pipe 11 is embedded in the upper surface of the radiator body 1, and the radiating fins 12 are arranged on the lower surface of the radiator body. The phase-change heat pipes 11 are made of phase-change heat conduction copper pipes and are provided with a plurality of phase-change heat pipes, one end of each phase-change heat pipe 11 is gathered at the rear end of the upper surface of the radiator body 1, and the other end of each phase-change heat pipe 11 extends towards the front end of the upper surface of the radiator body 1 and symmetrically diverges left and right, and is similar to a tree diagram and used for rapid heat transfer. The phase change heat pipe 11 is fixedly installed with the radiator body 1 through heat conduction sealant, and the heat conduction sealant has a heat dissipation function.
The heat dissipation fins 12 are arranged perpendicular to the heat sink body 1 to enlarge the heat dissipation area. The fan 2 is arranged on the lower surface of the radiator body 1 and is positioned at the rear side of the radiating fins 12, the cover 3 forms an opening 31 towards the radiator body 1, the cover 3 is arranged below the radiator body 1, the opening 31 is matched with the radiator body 1, the fan 2 and the radiating fins 12 are accommodated in a shell cavity of the cover 3, the side wall of the cover 3 facing the front side of the radiating fins 12 is provided with a plurality of radiating through holes 32, therefore, the wind direction of the fan 2 can be ensured, and the heat on the radiator body 1 and the radiating fins 12 can be quickly led out by means of strong convection generated by the fan 2 to dissipate heat. The utility model can provide good heat dissipation guarantee for the semiconductor laser lighting lamp.
The radiator comprises a radiator body 1, a cover 3 and a radiator body 1, wherein folded edges 33 are formed on the periphery of an opening 31 of the cover 3, cover fixing holes 331 are distributed on the folded edges 33 at intervals, body fixing holes 13 are formed in the periphery of the radiator body 1 and correspond to the cover fixing holes 331, and the cover 3 and the radiator body 1 penetrate through the cover fixing holes 331 and the body fixing holes 13 through screws to realize fixed installation.
Claims (6)
1. A high-performance heat dissipation device is characterized in that: comprises a radiator body (1), a fan (2) and a housing (3), the upper surface of the radiator body (1) is installed in contact with a heat source, the upper surface of the radiator body (1) is embedded with a phase-change heat pipe (11), radiating fins (12) are arranged on the lower surface of the radiator body (1), the fan (2) is arranged on the lower surface of the radiator body (1) and is positioned at the rear side of the radiating fins (12), the cover (3) forms an opening (31) towards the radiator body (1), the cover (3) is arranged below the radiator body (1), the opening (31) is installed with the radiator body (1) in a matching way, the fan (2) and the radiating fins (12) are accommodated in the shell cavity of the shell (3), and the side wall of the shell (3) facing the front side of the radiating fins (12) is provided with a plurality of radiating through holes (32).
2. The high performance heat sink according to claim 1, wherein the number of the phase change heat pipes (11) is plural, one end of each phase change heat pipe (11) converges at the rear end of the upper surface of the heat sink body (1), and the other end extends towards the front end of the upper surface of the heat sink body (1) and symmetrically diverges left and right.
3. The high performance heat sink as claimed in claim 2, wherein the phase change heat pipe (11) is fixedly mounted to the heat sink body (1) by a heat conductive sealant.
4. The high-efficiency heat sink according to claim 1, wherein the housing (3) has a folded edge (33) formed around the opening (31), the folded edge (33) has housing fixing holes (331) spaced apart from each other, the heat sink body (1) has body fixing holes (13) formed around the periphery thereof and corresponding to the housing fixing holes (331), and the housing (3) and the heat sink body (1) are fixedly mounted by screws passing through the housing fixing holes (331) and the body fixing holes (13).
5. The high performance heat sink as claimed in claim 1, wherein the heat dissipating fins (12) are disposed perpendicular to the heat sink body (1).
6. The high performance heat sink according to claim 1, wherein the phase-change heat pipe (11) is a phase-change heat conducting copper pipe.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122619215.XU CN215951350U (en) | 2021-10-29 | 2021-10-29 | High-performance heat dissipation device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122619215.XU CN215951350U (en) | 2021-10-29 | 2021-10-29 | High-performance heat dissipation device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215951350U true CN215951350U (en) | 2022-03-04 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202122619215.XU Active CN215951350U (en) | 2021-10-29 | 2021-10-29 | High-performance heat dissipation device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN215951350U (en) |
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2021
- 2021-10-29 CN CN202122619215.XU patent/CN215951350U/en active Active
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