CN112483989A - Lighting module with heat exchange device with closed cell metal foam - Google Patents

Lighting module with heat exchange device with closed cell metal foam Download PDF

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Publication number
CN112483989A
CN112483989A CN202010940157.8A CN202010940157A CN112483989A CN 112483989 A CN112483989 A CN 112483989A CN 202010940157 A CN202010940157 A CN 202010940157A CN 112483989 A CN112483989 A CN 112483989A
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CN
China
Prior art keywords
metal
lighting module
metal plate
heat exchange
metal foam
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202010940157.8A
Other languages
Chinese (zh)
Inventor
亚历山大·诺伊施塔特
弗兰克·欧斯特
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ford Global Technologies LLC
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Ford Global Technologies LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ford Global Technologies LLC filed Critical Ford Global Technologies LLC
Publication of CN112483989A publication Critical patent/CN112483989A/en
Pending legal-status Critical Current

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
    • F21S41/10—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source
    • F21S41/14—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source characterised by the type of light source
    • F21S41/141—Light emitting diodes [LED]
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
    • F21S41/10—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source
    • F21S41/14—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source characterised by the type of light source
    • F21S41/141—Light emitting diodes [LED]
    • F21S41/143—Light emitting diodes [LED] the main emission direction of the LED being parallel to the optical axis of the illuminating device
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
    • F21S41/10—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source
    • F21S41/14—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source characterised by the type of light source
    • F21S41/141—Light emitting diodes [LED]
    • F21S41/147—Light emitting diodes [LED] the main emission direction of the LED being angled to the optical axis of the illuminating device
    • F21S41/148—Light emitting diodes [LED] the main emission direction of the LED being angled to the optical axis of the illuminating device the main emission direction of the LED being perpendicular to the optical axis
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
    • F21S41/10—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source
    • F21S41/19—Attachment of light sources or lamp holders
    • F21S41/192—Details of lamp holders, terminals or connectors
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
    • F21S41/20—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by refractors, transparent cover plates, light guides or filters
    • F21S41/25—Projection lenses
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
    • F21S41/20—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by refractors, transparent cover plates, light guides or filters
    • F21S41/25—Projection lenses
    • F21S41/255—Lenses with a front view of circular or truncated circular outline
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
    • F21S41/30—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by reflectors
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
    • F21S41/30—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by reflectors
    • F21S41/32—Optical layout thereof
    • F21S41/321—Optical layout thereof the reflector being a surface of revolution or a planar surface, e.g. truncated
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
    • F21S41/30—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by reflectors
    • F21S41/39—Attachment thereof
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S45/00—Arrangements within vehicle lighting devices specially adapted for vehicle exteriors, for purposes other than emission or distribution of light
    • F21S45/40—Cooling of lighting devices
    • F21S45/47—Passive cooling, e.g. using fins, thermal conductive elements or openings
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
    • F21V29/503—Cooling arrangements characterised by the adaptation for cooling of specific components of light sources
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
    • F21V29/89—Metals
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21W—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO USES OR APPLICATIONS OF LIGHTING DEVICES OR SYSTEMS
    • F21W2107/00—Use or application of lighting devices on or in particular types of vehicles
    • F21W2107/10—Use or application of lighting devices on or in particular types of vehicles for land vehicles
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Abstract

The invention describes a lighting module (20) with a heat exchange device (19) for cooling at least one semiconductor light source (5), the heat exchange device (19) comprising at least one metal plate (1) with an upper side (4) and a lower side (7), wherein a closed-cell metal foam (2) which is metallurgically connected to the metal plate (1) is arranged on the lower side (7) and the at least one semiconductor light source (5) is arranged on the upper side (4) such that the light source is in direct thermal contact with the metal plate (1).

Description

Lighting module with heat exchange device with closed cell metal foam
Technical Field
The invention relates to a lighting module having a heat exchange device for cooling at least one semiconductor light source. The invention also relates to a headlight for a vehicle and to a vehicle.
Background
With regard to headlamps for motor vehicles, there is a current trend to replace halogen headlamps with lighting modules, in which the reflected LED light is used for illumination in the headlamps. Lighting modules are generally more cost and weight than halogen headlamps, but are more energy efficient. Therefore, cost and weight optimization is extremely important for the continued use of LEDs. The decisive cost and weight components associated with lighting modules are caused by the necessary lighting modules, which usually contain at least one heat exchange device, a printed circuit board and a plurality of LEDs. Most of the weight of the lighting module falls on the heat exchanging device. The type and material used for the heat exchange device is the primary weight factor that contributes to the device.
Heat exchange devices comprising metal foam are described, for example, in documents US 2014/0145107 a1, US 6,761,211B 2 and US 9,103,605B 2. A method for producing a metal foam composite body is described in DE 102015118787 a 1.
Disclosure of Invention
Against the above background, it is an object of the present invention to provide an improved lighting module having a heat exchange device for cooling at least one semiconductor light source, and which in particular has improved weight and cost efficiency.
This object is achieved by a lighting module according to claim 1, a headlamp according to claim 8 and a vehicle according to claim 10. The dependent claims contain further advantageous developments of the invention.
The lighting module according to the invention comprises a heat exchanging arrangement for cooling the at least one semiconductor light source. The heat exchange device comprises at least one metal plate having an upper side and a lower side. On the underside of the metal sheet, a closed-cell metal foam is arranged, which is metallurgically connected to the metal sheet. In other words, the metal foam and the metal plate are thus designed as a single piece and are connected to each other by a metal working process. With closed cells are meant, in connection with the present invention, mutually closed cells arranged inside the metal foam, i.e. they are not hydrodynamically connected to each other. The at least one semiconductor light source is arranged on the upper side such that the at least one semiconductor light source is in direct thermal contact with the metal plate.
An advantage of the lighting module according to the invention is that it has a lower weight than existing conventional lighting modules. Furthermore, in particular the closed cell design of the heat exchange device means that a simple and thus cost-effective production is possible. Heat exchange devices with metal foam, in particular for cooling semiconductor light sources (for example in particular LEDs), have not been used until now because of the relatively high production costs and assembly costs associated with vehicle lighting. Heat exchange devices for cooling semiconductor light sources are usually manufactured by die casting or extrusion, or thermoplastic heat exchange devices are used. In contrast, metal foams, in particular closed-cell metal foams, have a very low density and good thermal conductivity, while having a lower material cost and a lower weight. Furthermore, due to their low production costs, they can be easily combined with products suitable for large-scale production.
The mounting, in particular the attachment, of the semiconductor light source is preferably carried out in such a way that heat can be transferred between the metal plate and the semiconductor light source. The metal plate is preferably designed such that at least one semiconductor light source and/or at least one printed circuit board and/or at least one reflector element and/or at least one lens can be attached to the upper side of the metal plate. For this purpose, means for attaching at least one of the above-mentioned components may be provided, in particular on top of the metal plate.
In another variant, the metal plate and/or the metal foam comprise aluminum and/or an aluminum alloy. Additionally or alternatively, the metal plate and/or the metal foam may comprise titanium and/or a titanium alloy. The advantage of using the above-mentioned metals is that the heat exchange device has a light weight and a high thermal conductivity when in use.
Furthermore, the metal foam may comprise a plurality of cuts or grooves. Preferably, the metal foam comprises a side facing away from the metal plate, wherein preferably a plurality of cut-outs is provided on the side facing away from the metal plate. The metal foam may also comprise a side facing away from the metal plate, wherein the side of the metal foam facing away from the metal plate is metallurgically joined to the metal plate.
The advantage of the cuts or grooves in the metal foam is that they improve the heat exchange between the metal foam and the environment, so that, in addition to heat conduction, heat can be dissipated from the heat exchange device by convection or heat flow.
In another variation, the top of the metal plate comprises a surface having a surface normal. In this case, the metal plate preferably projects beyond the metal foam in at least one direction perpendicular to the surface normal. An advantage of this design is that both the upper side and the part of the metal plate extending beyond the lower side of the metal foam can be used for mounting the heat exchange device.
Furthermore, the at least one reflector element and/or the at least one lens may be arranged (preferably fixed) on top of the metal plate. The reflector element and/or the lens may protrude beyond the at least one semiconductor light source. A reflector element is understood here to mean a component which reflects light and/or heat radiation, for example a metal plate. The reflector element may be curved in a concave manner towards the at least one semiconductor light source. By means of the reflector element or the lens, light emitted by the at least one semiconductor light source can be reflected or focused, for example. At the same time, thermal radiation can be emitted from the at least one semiconductor light source by means of the reflector element or the lens.
In a further variant, the second metal plate can be arranged on the side of the metal foam facing away from the first metal plate. Like the first metal sheet, the second metal sheet is preferably also metallurgically joined to the metal foam. In this way, the arrangement of the sandwich structure is achieved. An advantage of the design with at least two metal plates, which enclose or approach the metal foam from at least two sides, is that the assembly of the heat exchange device is simplified, especially when two metal plates can be used for connecting two components to be cooled and for attaching the heat exchange device in or on the other component.
The lighting module according to the invention may be used for street lighting, mobile lights or any type of headlamp, among others.
The headlamp for a vehicle (e.g. a motor vehicle) according to the invention comprises at least one lighting module according to the invention described previously. Preferably, the at least one LED and/or the at least one printed circuit board are provided (preferably fixed) on at least one metal plate of the heat exchanging device. For example, the headlamp may be a front headlamp of a motor vehicle. The headlight according to the invention has the features and advantages already described in connection with the lighting module according to the invention.
The vehicle according to the invention comprises at least one headlamp as described previously. This has the aforementioned advantages. The vehicle may for example be a motor vehicle, in particular a passenger car, truck, motorcycle, moped, bus or car or a boat.
The heat exchange device may be manufactured by a powder metallurgy process in the following manner. The metal powder and the hydride are applied to at least one metal plate. The at least one metal plate with the metal powder disposed thereon and the hydride are heated to at least one fixed temperature, for example in a blast furnace. The temperature is set such that at this temperature the metal powder and the hydride react with each other and foam, or form a foam, and the foam forms a metallurgical bond with the at least one metal sheet. Thus, according to the invention, a direct metallurgical connection is formed between the at least one metal sheet and the closed foam by means of high temperatures. The metal powder and the hydride may also be disposed between at least two metal plates.
Alternatively or additionally, the underside or side of the metal foam facing away from the at least one metal sheet (e.g. the first metal sheet) may be configured by a base body or negative mold. In other words, a plurality of recesses can be formed by the base body or negative mould on the underside or side of the metal foam facing away from the metal sheet. In a further variant, the through-openings can also be created in the metal foam by means of suitable molds. An advantage of this structure is that, especially when used in combination with a sandwich structure, a combination of heat flow through the metal foam and a closed cell design is possible. For example, a graphite matrix may be used as the matrix.
The metal powder used may comprise aluminium and/or titanium and/or aluminium alloys and/or titanium alloys. For example, titanium dihydride can be used as the hydride.
For example, as a sandwich structure, closed cell metal foam can be much less expensive than open cell metal foam by using the preferred powder metallurgy process. Traditionally, open-cell metal foams are sintered or cast from prefabricated plastic or salt molds. Both conventionally used process sets have more manufacturing steps and higher costs than the described metal foaming method. Furthermore, unlike open-cell foams, closed-cell metal foams do not require subsequent plating, bonding, or other joining techniques.
In summary, the invention has the following advantages: the number of process steps for manufacturing the heat exchange device is reduced. This reduces the manufacturing costs and at the same time also the costs of the heat exchanging device and the lighting module. Furthermore, components that require cooling, such as the at least one semiconductor light source and/or the at least one printed circuit board, may be directly attached to at least one of the metal plates without any other components. Thus, the reflector, the lens and the semiconductor light source can be directly and economically efficiently mounted on the metal plate of the heat exchanging device. The direct connection between the metal foam and the metal plate produced by the powder metallurgy process improves the thermal conductivity between the metal foam and the metal plate. Weight reduction is also possible. By adjusting the density of the foam and the materials used, the thermal conductivity can also be matched to the specific requirements of the intended application.
The invention will be described in more detail below on the basis of exemplary embodiments and with reference to the accompanying drawings. While the invention has been illustrated and described in more detail by means of preferred exemplary embodiments, the invention is not limited by the disclosed examples and other variants may be derived therefrom by those skilled in the art without departing from the scope of protection of the invention.
The drawings are not necessarily to scale, and may be exaggerated or minimized to provide a better overview. Therefore, functional details disclosed herein are not to be interpreted in a limiting sense, but merely as a descriptive basis for providing guidance to those skilled in the art for applying the present invention in various ways.
As used herein, the term "and/or," when used in a series of two or more elements, means that each of the listed items can be used alone or in any combination of two or more of the listed elements. For example, if the combination described comprises components A, B and/or C, the combination can comprise A alone, B alone, C, A and B combination alone, A and C combination, B and C combination, or A, B and C combination.
Drawings
Fig. 1 shows a schematic view, partly in section, of a heat exchange device according to the invention in a perspective view;
fig. 2 shows a schematic view, partly in section, of a further variant of a heat exchange device according to the invention in a perspective view;
fig. 3 shows a schematic view in cross section of another variant of the heat exchange device according to the invention;
fig. 4 shows a schematic view in cross section of another variant of the heat exchange device according to the invention;
fig. 5 shows a schematic view in cross-section of another variant of the heat exchange device according to the invention;
fig. 6 shows a schematic view of a vehicle according to the invention.
Detailed Description
Fig. 1 schematically shows a perspective view, partly in section, of a lighting module 20 according to the invention. The lighting module 20 comprises a heat exchanging device 19 and at least one semiconductor light source 5 (e.g. an LED). The heat exchange device 19 comprises a first metal plate 1, which first metal plate 1 is in particular metallurgically directly connected to a closed-cell metal foam 2. In particular, direct joining of metallurgical connections is preferably produced by a powder metallurgy process. In this way, an integrated heat exchange device is made from the metal plate 1 and the metal foam 2. The metal sheet 1 comprises an upper side 4 having a surface normal 14. The metal foam 2 is arranged on the underside 7 of the metal sheet 1. In the variant shown, the semiconductor light source 5 and the printed circuit board 6 are arranged on the top 4 of the metal plate 1. The semiconductor light source 5 will be cooled by the heat exchanging means 19. In principle, it is also possible to arrange other or more components to be cooled on the upper side 4, in particular fixed on the upper side 4.
In the variant shown, the metal foam 2 has a side 17 facing the metal sheet 1, the metal foam 2 on the side 17 being metallurgically joined to the metal sheet 1, and the metal foam 2 has a side 16 facing away from the metal sheet 1. On the side 16 facing away from the metal sheet 1, grooves 3 or cutouts are provided, which improve the convection and thus the overall heat dissipation by the heat exchange device 19.
In the variant shown in fig. 2, the metal plate 1 projects partially out of the metal foam 2 in a direction 15 perpendicular to the surface normal 14. This results in an improved assembly capability of the lighting module 20, in particular the heat exchanging arrangement 19. Furthermore, in the variant shown in fig. 2, the reflector element 9 is fixed on the upper side 14, for example by means of fixing elements 10 (in particular screws or rivets). The reflector element 9 projects at least partially beyond the at least one semiconductor light source 5 and the printed circuit board 6. The reflector element 9 is curved in a concave manner in the direction of the semiconductor light source 5. In this way, the light emitted by the semiconductor light source 5 can be reflected, in particular in combination with headlamp applications. At the same time, the reflector element 9 helps to cool the semiconductor light source 5.
In the variant shown in fig. 3, in contrast to the variant shown in fig. 2, a lens 8 is provided on the first metal plate 1, instead of a reflector element. The lens 8 projects at least partially beyond the at least one semiconductor light source 5 and the printed circuit board 6.
Fig. 4 and 5 show a further variant of the lighting module 20 according to the invention in a sectional view. In contrast to the above-described variant, the second metal sheet 11 is arranged on a side 16 of the metal foam 2, the side 16 facing away from the first metal sheet 1. Like the first metal sheet 1, the second metal sheet 11 is directly connected (in particular metallurgically connected) to the metal foam 2. In this way a sandwich structure is created which firstly provides improved assembly and inexpensive process and manufacturing options. In the variant shown in fig. 5, through openings 12 are provided in the metal foam 2 in the same way as the grooves 3 in the above-described variant, which are capable of generating convection or heat flow.
Fig. 6 shows a vehicle 21 (e.g. a motor vehicle) according to the invention, which vehicle 21 has at least one headlamp 2 comprising at least one lighting module 20 as described in connection with fig. 1 to 5.
List of reference numerals
1 first metal plate
2 Metal foam
3 grooves
4 upper side
5 semiconductor light source
6 printed circuit board
7 lower side
8 lens
9 Reflector element
10 fixing element
11 second metal plate
12 through opening
14 surface normal
15 direction perpendicular to surface normal
16 side facing away from the metal sheet
17 side facing the metal plate
19 heat exchanger
20 Lighting Module
21 vehicle
22 headlamp

Claims (10)

1. A lighting module (20) having a heat exchanging device (19) for cooling at least one semiconductor light source (5),
it is characterized in that the preparation method is characterized in that,
the heat exchange device (19) comprises at least one metal sheet (1) having an upper side (4) and a lower side (7), wherein a closed cell metal foam (2) metallurgically connected to the metal sheet (1) is arranged at the lower side (7) and the at least one semiconductor light source (5) is arranged at the upper side (4) such that the light source is in direct thermal contact with the metal sheet (1).
2. The lighting module (20) of claim 1,
it is characterized in that the preparation method is characterized in that,
the metal plate (1) and/or the metal foam (2) comprise aluminum and/or an aluminum alloy and/or titanium and/or a titanium alloy.
3. The lighting module (20) according to claim 1 or 2,
it is characterized in that the preparation method is characterized in that,
the metal foam (2) comprises a plurality of grooves (3).
4. The lighting module (20) of claim 3,
it is characterized in that the preparation method is characterized in that,
the metal foam (2) comprises a side (16) facing away from the metal plate (1), wherein a plurality of grooves (3) are provided on the side (16) facing away from the metal plate.
5. The lighting module (20) according to any one of claims 1 to 4,
it is characterized in that the preparation method is characterized in that,
the upper side (4) of the metal sheet (1) comprises a surface having a surface normal (14), and the metal sheet (1) protrudes beyond the metal foam (2) in at least one direction (15) perpendicular to the surface normal (14).
6. The lighting module (20) according to any one of claims 1 to 5,
it is characterized in that the preparation method is characterized in that,
at least one reflector element (9) and/or at least one lens (8) are arranged on the upper side (4) of the metal plate (1).
7. The lighting module (20) according to any one of claims 1 to 6,
it is characterized in that the preparation method is characterized in that,
a second metal plate (11) is arranged on the side (16) of the metal foam (2) facing away from the first metal plate (1).
8. A headlamp (22) for a vehicle (21), comprising a lighting module (20) according to any one of claims 1 to 7.
9. The headlamp (22) according to claim 8,
it is characterized in that the preparation method is characterized in that,
at least one printed circuit board (6) is arranged on the metal plate (1).
10. A vehicle (21) comprising at least one headlamp (22) according to claim 8 or 9.
CN202010940157.8A 2019-09-12 2020-09-09 Lighting module with heat exchange device with closed cell metal foam Pending CN112483989A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102019124583.4A DE102019124583B4 (en) 2019-09-12 2019-09-12 Light module with heat exchange device with closed-cell metal foam
DE102019124583.4 2019-09-12

Publications (1)

Publication Number Publication Date
CN112483989A true CN112483989A (en) 2021-03-12

Family

ID=74686584

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202010940157.8A Pending CN112483989A (en) 2019-09-12 2020-09-09 Lighting module with heat exchange device with closed cell metal foam

Country Status (2)

Country Link
CN (1) CN112483989A (en)
DE (1) DE102019124583B4 (en)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6761211B2 (en) 2000-03-14 2004-07-13 Delphi Technologies, Inc. High-performance heat sink for electronics cooling
DE102004025640A1 (en) * 2004-05-25 2005-12-22 Hella Kgaa Hueck & Co. Motor vehicle headlight, has pump with which cooling medium is induced through conduit, and heat exchanger arranged at illuminant, where drive of pump is not arranged within housing but in proximity to illuminant
FR2961894B1 (en) * 2010-06-24 2013-09-13 Valeo Vision HEAT EXCHANGE DEVICE, IN PARTICULAR FOR A MOTOR VEHICLE
US20140145107A1 (en) 2012-11-28 2014-05-29 Massachusetts Institute Of Technology Heat Exchangers Using Metallic Foams on Fins
DE102015118787A1 (en) * 2015-11-03 2017-05-04 HAVEL metal foam GmbH Method and device for producing metal foam composite bodies and metal foam composite bodies

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DE102019124583B4 (en) 2021-12-16
DE102019124583A1 (en) 2021-03-18

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