CN112483341B - Hall thruster heat conduction support and Hall thruster comprising same - Google Patents
Hall thruster heat conduction support and Hall thruster comprising same Download PDFInfo
- Publication number
- CN112483341B CN112483341B CN202011345120.7A CN202011345120A CN112483341B CN 112483341 B CN112483341 B CN 112483341B CN 202011345120 A CN202011345120 A CN 202011345120A CN 112483341 B CN112483341 B CN 112483341B
- Authority
- CN
- China
- Prior art keywords
- hall thruster
- heat
- cylinders
- cylinder
- bottom plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F03—MACHINES OR ENGINES FOR LIQUIDS; WIND, SPRING, OR WEIGHT MOTORS; PRODUCING MECHANICAL POWER OR A REACTIVE PROPULSIVE THRUST, NOT OTHERWISE PROVIDED FOR
- F03H—PRODUCING A REACTIVE PROPULSIVE THRUST, NOT OTHERWISE PROVIDED FOR
- F03H1/00—Using plasma to produce a reactive propulsive thrust
- F03H1/0087—Electro-dynamic thrusters, e.g. pulsed plasma thrusters
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Combustion & Propulsion (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Plasma Technology (AREA)
Abstract
Hall thruster heat conduction support and contain hall thruster of this support relates to hall thruster's heat radiation structure. The invention aims to solve the problem that the existing high-specific-impulse high-power Hall thruster is poor in thermal stability. The heat-conducting support of the Hall thruster comprises two cylinders which are identical in length and are coaxially arranged in an internally-externally nested manner, the same ends of the two cylinders are connected through a bottom plate, a plurality of through holes are formed in the bottom plate, a plurality of gaps with one ends open and the other ends closed are formed in the cylinder walls of the two cylinders, the plurality of gaps are uniformly distributed along the circumferential direction of the cylinder, the directions of the gaps are identical to the axial direction of the cylinder, and the open ends of the gaps are communicated with the open ends of the cylinders. According to the invention, most of wall surface deposition heat flow is conducted to an external component with stronger heat dissipation capability of the Hall thruster, so that the heat deposition of the internal magnetic circuit of the Hall thruster is reduced, the integral heat dissipation capability of the Hall thruster is enhanced, and the integral heat stability of the Hall thruster is finally improved.
Description
Technical Field
The invention belongs to a Hall thruster, and particularly relates to a ceramic heat dissipation structure of the Hall thruster.
Background
As one of electric propulsion devices which have been applied in an on-track manner, a hall thruster of which the operational thermal stability is a core problem which is currently receiving a great deal of attention. In the process that ions in the discharge channel of the Hall thruster are ejected out in the accelerated motion of the electric field and generate thrust, partial ions can generate interaction with the wall surface of the discharge channel, namely, the ions are sputtered onto the wall surface to generate energy loss. The energy lost is mainly deposited on the outlet section of the wall surface of the discharge channel in the form of heat energy, and the wall surface heat deposition power can reach 20-30% of the total power. Meanwhile, with the improvement of the requirement of a high-power and high-specific-impulse space mission, the Hall thruster is required to work under higher discharge voltage and power density, so that the problem of thermal deposition on the wall surface of the Hall thruster is aggravated, the overall heat dissipation capacity is reduced, and the overall thermal stability of the Hall thruster is poor.
Disclosure of Invention
The invention provides a heat-conducting support of a Hall thruster and the Hall thruster comprising the same, aiming at solving the problem of poor thermal stability of the existing Hall thruster with high specific impulse and high power.
Hall thruster heat conduction support, including two drums that length is the same and coaxial inside and outside nested setting, the same end of two drums passes through the bottom plate and links to each other, is equipped with a plurality of through-holes on the bottom plate, has all opened many one end openings and other end confined gaps on the section of thick bamboo wall of two drums, and many gaps are evenly arranged along place drum circumference, and the gap trend is the same with place drum axial, and the open end in gap link up with the open end of place drum.
The open end of above-mentioned two drums is equipped with the export section, and the export section includes two short drums that two length are the same and coaxial inside and outside nested setting, and two short drums are coaxial, and the one end of export section links to each other with the open end of two drums, and the distance between two short drums is greater than the distance between two drums, and the both ends of export section are link up in the gap.
The Hall thruster comprises the Hall thruster heat-conducting support, and the Hall thruster heat-conducting support is coated outside the discharging channel of the Hall thruster.
The invention has the beneficial effects that:
aiming at the problem of thermal stability of the high-specific-impulse high-power Hall thruster, the invention provides a thermal structure design scheme of a Hall thruster heat conduction support to optimize the internal heat conduction process of the Hall thruster, transfer most of wall surface deposited heat flow to an external component with stronger heat dissipation capacity of the Hall thruster, reduce the heat deposition of an internal magnetic circuit of the Hall thruster, enhance the overall heat dissipation capacity of the Hall thruster and finally improve the overall thermal stability of the Hall thruster.
Drawings
FIG. 1 is a three-dimensional view of a heat-conducting support of a Hall thruster according to the present invention;
FIG. 2 is a front view of a heat-conducting support of the Hall thruster according to the present invention;
FIG. 3 is a view taken along line A-A of FIG. 2;
FIG. 4 is a schematic position diagram of a Hall thruster heat-conducting bracket installed on the Hall thruster according to the present invention;
fig. 5 is a schematic diagram of a heat flow direction of the hall thruster after the hall thruster uses a heat-conducting bracket.
Detailed Description
The first embodiment is as follows: specifically describing the embodiment with reference to fig. 1 to 3, the hall thruster heat-conducting support according to the embodiment includes two cylinders which have the same length and are coaxially arranged in an inner-outer nested manner, and the lengths of the two cylinders are both 70 mm. The same ends of the two cylinders are connected through a bottom plate, the bottom plate is annular, and a plurality of through holes which are evenly distributed along the circumferential direction of the bottom plate are formed in the bottom plate.
Specifically, the outer diameter of the cylinder positioned on the inner side is the same as the inner diameter of the bottom plate, one end of the cylinder is connected with the inner ring of the bottom plate, the inner diameter of the cylinder positioned on the outer side is the same as the outer diameter of the bottom plate, and one end of the cylinder is connected with the outer ring of the bottom plate.
Considering that high-energy particles of the Hall thruster mainly sputter the outlet part (10mm) of the discharge channel, the thickness of the outlet position of the discharge channel is increased, namely the outlet part expands outwards in the radial direction, the open ends of the two cylinders are provided with outlet sections, each outlet section comprises two short cylinders which are the same in length and are coaxially arranged in an internally-externally nested manner, the two short cylinders are coaxial, one end of each outlet section is connected with the open ends of the two cylinders, the distance between the two short cylinders is greater than the distance between the two cylinders, and gaps penetrate through the two ends of the outlet sections. And the deformation design can be carried out outwards in practical application by matching with the long service life requirement of the discharge channel.
The integral material of the heat conducting support of the Hall thruster is aluminum. The heat conductivity coefficient of the ceramic is much higher than that of BN ceramic, close contact between the Hall thruster heat-conducting support and the ceramic can be guaranteed, and energy generated by impact of high-energy particles at the front end (about 10mm) of a ceramic discharge channel can be effectively conducted to an external magnetic circuit through the Hall thruster heat-conducting support.
Meanwhile, considering that the linear expansion coefficient (4.80 μm/(m + ° c)) of BN ceramic is greatly different from the expansion coefficient (24.0 μm/(m + ° c)) of aluminum, in order to prevent the ceramic discharge channel from being broken due to stress caused by different expansion coefficients, a plurality of gaps with one end being open and the other end being closed are formed in the cylinder walls of the two cylinders, the plurality of gaps are uniformly distributed along the circumferential direction of the cylinder, the trend of the gaps is the same as that of the cylinder, and the open ends of the gaps are communicated with the open ends of the cylinder. The part between the gap is a rack structure, the concentrated stress between the bracket and the ceramic is reduced by utilizing the elastic deformation of each rack, the surface between the bracket and the ceramic is always kept to be tightly attached, the heat conduction resistance between the bracket and the ceramic is reduced, and the direct heat transfer of the ceramic to the heat conduction bracket is increased.
The thickness of both cylinders is 2mm and the thickness of the bottom plate is 4 mm. In practical application, the thickness of the cylinder wall of the cylinder can be adjusted in sections according to the structural design requirement of the magnetic circuit.
The thermal conductivity of aluminum is 210W/(m + K), while the thermal conductivity of BN ceramic is 20W/(m + K), which is expected to achieve efficient heat flow transfer through aluminum heat-conducting mounts. The Ansys simulation result shows that the heat-conducting bracket has high heat flux density and can effectively guide the heat flux on the inner ceramic to an external magnetic circuit. Meanwhile, simulation results show that under the same input conditions, the aluminum heat conduction bracket enables the temperature of the inner magnetic circuit component to be reduced by 30-50 ℃.
The high-voltage krypton working medium Hall thruster HKT-110 adopting the Hall thruster heat-conducting support in the embodiment has the advantages that the experimental results show that the structure in the embodiment effectively reduces the heat deposition of an inner magnetic circuit, improves the working thermal stability of the Hall thruster, and improves the upper power limit of stable working of the Hall thruster.
The second embodiment is as follows: the present embodiment is specifically described with reference to fig. 4 and 5, and the present embodiment is a hall thruster including the hall thruster heat-conducting bracket described in the first embodiment, and the hall thruster heat-conducting bracket 7 is coated outside the hall thruster discharge channel 6. The distance between the cylinder positioned on the inner side and the inner magnetic screen 4 in the Hall thruster heat conduction support 7 is 1.5mm, the surface of the inner magnetic screen 4 opposite to the cylinder positioned on the inner side is subjected to electroplating treatment, and the heat radiation power of the Hall thruster heat conduction support to the inner magnetic screen 4 is reduced by reducing the surface radiation coefficient of the inner magnetic screen.
The aluminum Hall thruster heat-conducting support 7 is additionally arranged on the outer side of a ceramic discharge channel 6 of a traditional Hall thruster, heat flow generated on the discharge channel 6 is guided, heat flow on inner ceramic is guided to an external magnetic circuit (comprising an outer magnetic screen 8, an outer magnetic pole 9 and an outer magnet exciting coil 10), heat radiation of the discharge channel 6 to an internal magnetic circuit (comprising an inner iron core 1, an inner magnet exciting coil 2, an inner magnetic pole 3, an inner magnetic screen 4 and an additional magnet exciting coil 5) with poor heat dissipation capacity is reduced, and heat dissipation is performed by using an open external magnetic circuit and other external heat structures; and to ensure that the temperature of the soleplate 11 meets the engineering requirements, the heat flow of the ceramic discharge channel 6 is prevented from being conducted to the soleplate 11. However, since the internal space of the hall thruster is limited, considering that the outlet section of the discharge channel 6 (the discharge channel inner ceramic 6-1 and the discharge channel outer ceramic 6-2) is a serious sputtering region, as shown in fig. 4, the thickness of the inner section of the discharge channel 6 is reduced to 6mm, and the outlet section is kept unchanged at 8 mm.
The specific heat flow conduction path is shown in fig. 5, the main heat flow on the hall thruster comes from sputtering heat flow deposition of the plasma beam on the ceramic wall surface, and is mainly and intensively deposited at the outlet position of the discharge channel. Meanwhile, a small part of the heat flow deposited on the ceramic is conducted to the bottom through itself, but the heat conductivity coefficient of aluminum is much higher than that of the BN ceramic, so most of the heat flow is conducted to the aluminum heat-conducting bracket and then to the bottom of the thruster. The heat flow conducted out through the heat conduction support is mainly concentrated on a mounting contact surface part between the heat flow and the bottom plate 11 of the thruster, then the heat flow is conducted to the periphery of the bottom plate 11 through the contact surface, and then effective heat dissipation is conducted through the heat dissipation support arranged on the outer side of the bottom plate.
The hall thruster heat-conducting support and the hall thruster comprising the same according to the two embodiments are not limited to the specific structures described in the above embodiments, and the features described in the above embodiments may be reasonably adjusted in size and configuration.
Claims (9)
1. The Hall thruster heat conduction bracket is characterized by comprising two cylinders which have the same length and are coaxially nested inside and outside, wherein the same ends of the two cylinders are connected through a bottom plate, a plurality of through holes are arranged on the bottom plate,
the cylinder walls of the two cylinders are respectively provided with a plurality of gaps with one end opened and the other end closed, the plurality of gaps are uniformly distributed along the circumferential direction of the cylinder, the directions of the gaps are the same as the axial direction of the cylinder, and the opening ends of the gaps are communicated with the opening end of the cylinder;
the part between the gaps is the rack, and the concentrated stress between the Hall thruster heat-conducting support and the ceramic is reduced by utilizing the elastic deformation of each rack;
the two cylinders and the bottom plate are made of aluminum.
2. The Hall thruster heat-conducting bracket according to claim 1,
the opening ends of the two cylinders are provided with outlet sections, the outlet sections comprise two short cylinders which have the same length and are coaxially nested inside and outside, the two short cylinders are coaxial,
one end of the outlet section is connected with the open ends of the two cylinders, the distance between the two short cylinders is larger than that between the two cylinders, and the gap penetrates through the two ends of the outlet section.
3. The Hall thruster heat-conducting support according to claim 1 or 2, wherein the thickness of each of the two cylinders is 2 mm.
4. The Hall thruster heat-conducting support according to claim 1 or 2, wherein the thickness of the base plate is 4 mm.
5. The Hall thruster heat-conducting bracket according to claim 1 or 2, wherein the base plate is annular,
the outer diameter of the cylinder positioned at the inner side is the same as the inner diameter of the bottom plate, one end of the cylinder is connected with the inner ring of the bottom plate,
the inner diameter of the cylinder positioned at the outer side is the same as the outer diameter of the bottom plate, and one end of the cylinder is connected with the outer ring of the bottom plate.
6. The Hall thruster heat-conducting bracket according to claim 1 or 2, wherein the length of each of the two cylinders is 70 mm.
7. The Hall thruster comprising the Hall thruster heat-conducting support according to claim 2, wherein the Hall thruster heat-conducting support (7) is coated outside the Hall thruster discharging channel (6).
8. The Hall thruster according to claim 7, wherein the distance between the cylinder located at the inner side in the Hall thruster heat-conducting bracket (7) and the inner magnetic screen (4) is 1.5 mm.
9. The Hall thruster according to claim 8, wherein the surface of the inner magnetic shield (4) opposite to the inner cylinder is plated.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011345120.7A CN112483341B (en) | 2020-11-25 | 2020-11-25 | Hall thruster heat conduction support and Hall thruster comprising same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011345120.7A CN112483341B (en) | 2020-11-25 | 2020-11-25 | Hall thruster heat conduction support and Hall thruster comprising same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN112483341A CN112483341A (en) | 2021-03-12 |
| CN112483341B true CN112483341B (en) | 2022-06-14 |
Family
ID=74934990
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011345120.7A Active CN112483341B (en) | 2020-11-25 | 2020-11-25 | Hall thruster heat conduction support and Hall thruster comprising same |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112483341B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113266542B (en) * | 2021-06-29 | 2022-05-17 | 哈尔滨工业大学 | Hall thruster magnetic circuit heat radiation structure |
| WO2023038611A1 (en) * | 2021-09-13 | 2023-03-16 | Частное Акционерное Общество "Фэд" | Stationary ion/plasma engine |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2950114B1 (en) * | 2009-09-17 | 2012-07-06 | Snecma | HALL EFFECT ENGINE WITH COOLING OF THE INTERNAL CERAMIC |
| CN103790794B (en) * | 2014-03-03 | 2016-06-01 | 哈尔滨工业大学 | Multistage cusped magnetic field plasma thruster heat loss through radiation device |
| CN104632565B (en) * | 2014-12-22 | 2017-10-13 | 兰州空间技术物理研究所 | A kind of hall thruster magnetic structure |
| CN105889006B (en) * | 2016-05-03 | 2018-10-30 | 哈尔滨工业大学 | A kind of hall thruster ceramic heat-dissipating holder |
| CN106050592B (en) * | 2016-07-27 | 2018-09-07 | 哈尔滨工业大学 | Hall thruster cooling stand |
| CN106321389A (en) * | 2016-09-19 | 2017-01-11 | 哈尔滨工业大学 | Hollowed-out magnetic shield structure for hall thruster |
| CN107218187B (en) * | 2017-06-12 | 2019-07-09 | 北京航空航天大学 | A kind of anode water-cooling structure of magnetic plasma propeller |
| CN109779863B (en) * | 2019-01-31 | 2020-06-23 | 哈尔滨工业大学 | Hall thruster mounting bracket |
-
2020
- 2020-11-25 CN CN202011345120.7A patent/CN112483341B/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| CN112483341A (en) | 2021-03-12 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN112483341B (en) | Hall thruster heat conduction support and Hall thruster comprising same | |
| CN110067712B (en) | Magnetic plasma thruster inducing axial magnetic field | |
| US4405436A (en) | Sputtering apparatus | |
| US8701384B2 (en) | Hall effect thruster with cooling of the internal ceramic | |
| KR20140057376A (en) | Cooling ring for physical vapor deposition chamber target | |
| CN114658623A (en) | Integrated magnetic screen anode structure for low-power Hall thruster | |
| CN111682679B (en) | Double-rotor single-stator disc type motor | |
| CN102936718A (en) | Multi-structure coupling magnetic field adaptability type rotating arc ion plating device | |
| US11346330B1 (en) | Additively manufactured components for electric propulsion thrusters | |
| CN105228331A (en) | Electrostatic ion accelerator arrangement | |
| CN116904953A (en) | Vapor deposition equipment | |
| CN104928632A (en) | Cathode arc source | |
| GB2110719A (en) | Sputtering apparatus | |
| CN1245534C (en) | Non-magentic shielding type ferromagnetic target as sputter cathode | |
| JP5934427B2 (en) | Sputtering equipment | |
| US11990808B2 (en) | Motor cooling system, motor stator and disc motor | |
| CN114607576B (en) | Mixed wall surface Hall thruster | |
| CN204779785U (en) | Cathode arc source | |
| CN111593313A (en) | Core structure of coating machine | |
| JP2000319780A (en) | Sputtering cathode and magnetron type sputtering device equipped with the same | |
| CN220079173U (en) | Special arc device for graphite material by DLC coating process | |
| CN108342707B (en) | Curved surface particle source | |
| CN213936110U (en) | Ion source water cooling structure and ion source | |
| KR100951007B1 (en) | Magnetron sputtering apparatus | |
| CN216688304U (en) | Arc source base of magnetron sputtering coating machine |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |