CN112480863B - Preparation method of organic silicon pouring sealant - Google Patents
Preparation method of organic silicon pouring sealant Download PDFInfo
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- CN112480863B CN112480863B CN202011414428.2A CN202011414428A CN112480863B CN 112480863 B CN112480863 B CN 112480863B CN 202011414428 A CN202011414428 A CN 202011414428A CN 112480863 B CN112480863 B CN 112480863B
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
- C09J183/04—Polysiloxanes
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/42—Block-or graft-polymers containing polysiloxane sequences
- C08G77/452—Block-or graft-polymers containing polysiloxane sequences containing nitrogen-containing sequences
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2227—Oxides; Hydroxides of metals of aluminium
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
- C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
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- Organic Chemistry (AREA)
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- Sealing Material Composition (AREA)
Abstract
The invention discloses a preparation method of an organic silicon pouring sealant, which comprises the following steps: kneading 100 parts of vinyl silicone oil, 20-50 parts of polydopamine modified MQ silicone resin, 20-40 parts of aluminum oxide and 10-30 parts of white carbon black in a kneader at 80-120 ℃ for 2-5 h; taking 100 parts of pouring sealant base stock, 1 multiplied by 10 ‑6 To 8X 10 ‑6 Uniformly dispersing part of the platinum catalyst in a high-speed dispersion machine for later use; 100 parts of pouring sealant base material, 5 to 15 parts of hydrogen-containing silicone oil and 0.01 to 0.1 part of inhibitor are taken to be uniformly dispersed in a high-speed dispersion machine for later use; and (2) mixing the components A and B of the pouring sealant according to the mass ratio of 1:1 to 1:2, encapsulating electronic components after uniformly mixing, and vulcanizing for 20 to 30 hours at the temperature of between 50 and 100 ℃. The dopamine modified organic silicon resin is introduced into the formula of the pouring sealant, so that the problem of compatibility between polydopamine and organic silicon can be effectively solved; the bonding force of the organic silicon pouring sealant and an electronic component can be obviously improved only by introducing a small amount of dopamine into the organic silicon pouring sealant.
Description
Technical Field
The invention relates to the technical field of electronic pouring sealants, in particular to a preparation method of an organic silicon pouring sealant.
Background
The electronic pouring sealant mainly comprises epoxy resins, polyurethanes, organic silicon and the like. The epoxy resin pouring sealant has good adhesive property and insulating property and low price, but has the defects of brittleness, poor aging resistance, poor moisture resistance and the like after being cured. The polyurethane pouring sealant has the advantages of excellent impact property, good adhesive property, good toughness, complex synthesis process and poor high temperature resistance. The organic silicon pouring sealant has excellent ageing resistance, weather resistance, high and low temperature resistance (-60-260 ℃), dielectric property and insulating property, is moisture-proof and flame-retardant, but has weak adhesion.
The organic silicon pouring sealant is mainly divided into an addition type pouring sealant and a condensation type pouring sealant, the addition type pouring sealant has stable performance after vulcanization, no by-product is generated, but the adhesion is poor; after the condensed pouring sealant is vulcanized, although the adhesion is improved, the reaction process releases small molecular compounds.
Disclosure of Invention
The invention aims to provide a preparation method of an organic silicon pouring sealant, which solves one or more of the problems in the prior art.
On one hand, the invention provides a preparation method of an organic silicon pouring sealant, which comprises the following steps:
preparing a pouring sealant base material: kneading 100 parts of vinyl silicone oil, 20-50 parts of polydopamine modified MQ silicone resin, 20-40 parts of aluminum oxide and 10-30 parts of white carbon black in a kneader at 80-120 ℃ for 2-5 hours;
preparing a pouring sealant A component: taking 100 parts of pouring sealant base stock, 1 multiplied by 10 -6 To 8X 10 -6 Uniformly dispersing the platinum catalyst in parts in a high-speed dispersion machine for later use;
preparing a pouring sealant B component: 100 parts of pouring sealant base material, 5 to 15 parts of hydrogen-containing silicone oil and 0.01 to 0.1 part of inhibitor are taken to be uniformly dispersed in a high-speed dispersion machine for later use;
preparing a pouring sealant: and (2) mixing the components A and B of the pouring sealant according to the mass ratio of 1:1 to 1:2, after being mixed evenly, the electronic components are encapsulated and vulcanized for 20 to 30 hours at the temperature of between 50 and 100 ℃.
In some embodiments, the polydopamine modified MQ silicone resin is prepared by:
dissolving liquid MQ silicon resin into a mixed solution of ethanol and toluene, wherein the mass ratio of the ethanol to the toluene is 2:1, the concentration of the mixed solution is 10 to 30g/mL;
adding the solution and a silane coupling agent into a polydopamine aqueous solution, wherein the mass ratio of the liquid MQ silicon resin to the polydopamine to the silane coupling agent is 30: (1-5): (1-3), adding hydrochloric acid to adjust the pH value to be 3-5, heating to 40-70 ℃ under the protection of nitrogen, and reacting for 2-5 h;
and after the reaction is finished, evaporating the solvent under reduced pressure to obtain the polydopamine modified MQ silicon resin.
In some embodiments, the aqueous solution of polydopamine is prepared by:
preparing 0.1-30 mg/mL dopamine-trihydroxymethyl aminomethane-hydrochloric acid buffer solution, and standing in air for 10-60 min to obtain polydopamine aqueous solution with rich hydroxyl and amino on the surface.
In some embodiments, the MQ silicone resin is prepared by:
adding 100 parts by weight of tetraethoxysilane, 70-100 parts by weight of dimethyl hexasiloxane and 1-3 parts by weight of hydrochloric acid into a container, slowly dropwise adding 10-15 parts by weight of deionized water, controlling the reaction temperature to react for 20-40 min at 15-25 ℃, continuously heating to 78 ℃, carrying out reflux reaction for 1-3 h, and carrying out reduced pressure evaporation to remove the solvent after the reaction is finished to obtain the liquid MQ silicon resin.
In some embodiments, the silane coupling agent is one or more of Si69, KH550, KH560, KH570, vinyltriethoxysilane, vinyltrimethoxysilane.
In some embodiments, the silane coupling agent is one or more of 2-methyl-3-butyn-2-ol, 3-methyl-1-hexyn-3-ol, 1-ethynylcyclohexanol, methyltris (methylbutynoxy) silane, phenyltri (methylbutynoxy) silane, vinyltri (methylbutynoxy) silane, polyvinyl polysiloxane.
In some embodiments, the alumina has a particle size of 1 to 5 μm.
In some embodiments, the silica has a particle size of 500 to 800nm.
In some embodiments, the vinyl silicone oil has a viscosity of 1000 to 6000 mPa-s, wherein the vinyl content is 2% to 6%.
In some embodiments, the hydrogen-containing silicone oil has a viscosity of 800 to 2500 mPa-s.
In another aspect, the invention provides a water-soluble glass fiber surface treating agent obtained by the preparation method.
Compared with the prior art, the invention has the following advantages:
1. the dopamine modified organic silicon resin is introduced into the pouring sealant formula, so that the problem of compatibility between polydopamine and organic silicon can be effectively solved;
2. the surface treatment of electronic components is not needed, and the process is simpler;
3. the adhesive force between the organic silicon pouring sealant and electronic components can be obviously improved only by introducing a small amount of dopamine into the organic silicon pouring sealant.
Detailed Description
The present invention will be further described with reference to the following examples. The following examples are only for illustrating the performance of the present invention more clearly and are not limited to the following examples.
Example 1:
the preparation method of the organic silicon pouring sealant comprises the following steps:
1. preparation of polydopamine: preparing 0.1mg/mL dopamine-trihydroxymethylaminomethane-hydrochloric acid buffer solution, and standing in air for 10min to obtain polydopamine aqueous solution with rich hydroxyl and amino on the surface;
2. preparation of MQ silicone resin: adding 100g of tetraethoxysilane, 70g of dimethyl hexasiloxane and 1g of hydrochloric acid into a 500mL three-necked bottle, slowly dropwise adding 10g of deionized water, controlling the reaction temperature to react at 15 ℃ for 40min, continuously heating to 78 ℃ for reflux reaction for 1h, and evaporating the solvent under reduced pressure after the reaction is finished to obtain liquid MQ silicon resin;
3. poly-dopamine modified MQ silicone resin: dissolving liquid MQ silicon resin in a mixed solution of ethanol/toluene =2/1, wherein the concentration is 10g/mL, adding the mixed solution and a silane coupling agent into a polydopamine aqueous solution, adding hydrochloric acid to adjust the pH value to be 3, and heating to 40 ℃ under the protection of nitrogen to react for 5 hours so as to ensure that hydroxyl on the MQ silicon resin and hydroxyl and amino on the polydopamine fully react. After the reaction is finished, evaporating the solvent under reduced pressure to obtain polydopamine modified MQ silicon resin, wherein the mass of the liquid MQ silicon resin/polydopamine/silane coupling agent is respectively 30g, 1g and 1g;
4. preparing a pouring sealant base material: kneading 100g of vinyl silicone oil, 20g of polydopamine modified MQ silicon resin, 20g of aluminum oxide and 10g of white carbon black in a kneader at 80 ℃ for 5 hours;
5. the pouring sealant A comprises the following components: taking 100g of pouring sealant base material, 1 multiplied by 10 -6 g, dispersing the platinum catalyst uniformly in a high-speed dispersion machine for later use;
6. and (3) pouring sealant B component: taking 100g of pouring sealant base material, 5g of hydrogen-containing silicone oil and 0.01g of ethynyl cyclohexanol for uniform dispersion in a high-speed dispersion machine for later use;
7. preparing a pouring sealant: mixing the components A and B according to the mass ratio of 1:1, encapsulating electronic components after uniformly mixing, and vulcanizing at 50 ℃ for 30 hours.
Example 2:
a preparation method of an organic silicon pouring sealant comprises the following steps:
1. preparation of polydopamine: preparing 30mg/mL dopamine-trihydroxymethyl aminomethane-hydrochloric acid buffer solution, and standing in air for 60min to obtain polydopamine aqueous solution with rich hydroxyl and amino on the surface;
2. preparation of MQ silicone resin: adding 100g of tetraethoxysilane, 100g of dimethyl hexasiloxane and 3g of hydrochloric acid into a 500mL three-necked bottle, slowly and dropwise adding 15g of deionized water, controlling the reaction temperature to react at 25 ℃ for 20min, continuously heating to 78 ℃, carrying out reflux reaction for 3h, and evaporating the solvent under reduced pressure after the reaction is finished to obtain liquid MQ silicon resin;
3. poly-dopamine modified MQ silicone resin: dissolving liquid MQ silicon resin in a mixed solution of ethanol/toluene =2/1, wherein the concentration is 30g/mL, adding the liquid MQ silicon resin and a silane coupling agent into a polydopamine aqueous solution, adding hydrochloric acid to adjust the pH value to be 5, and heating to 70 ℃ under the protection of nitrogen to react for 2 hours, so that hydroxyl on the MQ silicon resin and hydroxyl and amino on the polydopamine fully react. After the reaction is finished, evaporating the solvent under reduced pressure to obtain polydopamine modified MQ silicon resin, wherein the mass of the liquid MQ silicon resin/polydopamine/silane coupling agent is 30g, 5g and 3g respectively;
4. preparing a pouring sealant base material: kneading 100g of vinyl silicone oil, 50g of polydopamine modified MQ silicone resin, 40g of aluminum oxide and 30g of white carbon black in a kneading machine at 120 ℃ for 2 hours;
5. the pouring sealant A comprises the following components: taking 100g of pouring sealant base material, 8 multiplied by 10 -6 g of a platinum catalyst inUniformly dispersing in a high-speed dispersion machine for later use;
6. and (3) pouring sealant B component: taking 100g of pouring sealant base material, 15g of hydrogen-containing silicone oil and 0.1g of ethynyl cyclohexanol, and uniformly dispersing in a high-speed dispersing machine for later use;
7. preparing a pouring sealant: mixing the components A and B according to the mass ratio of 1:2, after mixing evenly, encapsulating electronic components, and vulcanizing at 100 ℃ for 20 hours.
Example 3:
a preparation method of an organic silicon pouring sealant comprises the following steps:
1. preparation of polydopamine: preparing a trihydroxymethyl aminomethane-hydrochloric acid buffer solution of 10mg/mL dopamine, and standing in air for 30min to obtain a polydopamine aqueous solution with a surface rich in hydroxyl and amino;
2. preparation of MQ silicone resin: adding 100g of tetraethoxysilane, 80g of dimethyl hexasiloxane and 2g of hydrochloric acid into a 500mL three-necked bottle, slowly and dropwise adding 12g of deionized water, controlling the reaction temperature to react at 20 ℃ for 30min, continuously heating to 78 ℃ for reflux reaction for 2h, and evaporating the solvent under reduced pressure after the reaction is finished to obtain liquid MQ silicon resin;
3. poly-dopamine modified MQ silicone resin: dissolving liquid MQ silicon resin in a mixed solution of ethanol/toluene =2/1, wherein the concentration is 20g/mL, adding the mixed solution and a silane coupling agent into a polydopamine aqueous solution, adding hydrochloric acid to adjust the pH value to be 4, and heating to 50 ℃ under the protection of nitrogen to react for 3 hours, so that hydroxyl on the MQ silicon resin and hydroxyl and amino on the polydopamine are fully reacted. After the reaction is finished, evaporating the solvent under reduced pressure to obtain polydopamine modified MQ silicon resin, wherein the mass of the liquid MQ silicon resin/polydopamine/silane coupling agent is respectively 30g, 2g and 2g;
4. preparing a pouring sealant base material: kneading 100g of vinyl silicone oil, 30g of polydopamine modified MQ silicon resin, 30g of aluminum oxide and 20g of white carbon black in a kneader at 100 ℃ for 3 hours;
5. the pouring sealant A comprises the following components: 100g of pouring sealant base stock is taken, and the weight is 6 multiplied by 10 -6 g, dispersing the platinum catalyst uniformly in a high-speed dispersion machine for later use;
6. and (3) pouring sealant B component: taking 100g of pouring sealant base material, 10g of hydrogen-containing silicone oil and 0.05g of ethynyl cyclohexanol for uniform dispersion in a high-speed dispersion machine for later use;
7. preparing a pouring sealant: mixing the components A and B according to the mass ratio of 1:1.5, encapsulating electronic components after uniformly mixing, and vulcanizing at 80 ℃ for 25 hours.
Comparative example 1
This comparative example differs from example 1 only in that the MQ resin was not modified with polydopamine.
Comparative example 2
This comparative example differs from example 1 only in that the potting adhesive does not contain dopamine.
The performance test results are shown in table 1:
the test method is as follows: detecting the heat conductivity coefficient [ W/(m.K) ] of the pouring sealant by adopting an ASTMD5470 standard test method for the heat transfer performance of the Chinese heat-conducting electric insulation material; detecting the peel strength of the pouring sealant by adopting a test method of GB/T2792-2014 adhesive tape peel strength; and (4) detecting the dielectric constant by adopting a dielectric property tester.
As can be seen from table 1, the thermal conductivity and dielectric constant of examples 1 to 3 are slightly improved and the peel strength is significantly improved, compared to comparative examples 1 to 2.
Therefore, compared with the prior art, the invention has the following advantages:
1. the dopamine modified organic silicon resin is introduced into the formula of the pouring sealant, so that the problem of compatibility between polydopamine and organic silicon can be effectively solved;
2. the surface treatment of the electronic components is not needed, and the process is simpler;
3. the bonding force of the organic silicon pouring sealant and an electronic component can be obviously improved only by introducing a small amount of dopamine into the organic silicon pouring sealant.
The above description is only a preferred form of the invention, and it should be noted that it is possible for a person skilled in the art to make several variations and modifications without departing from the inventive concept, and these should also be considered as within the scope of the invention.
Claims (9)
1. The preparation method of the organic silicon pouring sealant is characterized by comprising the following steps:
preparing a pouring sealant base material: kneading 100 parts of vinyl silicone oil, 20-50 parts of polydopamine modified MQ silicone resin, 20-40 parts of aluminum oxide and 10-30 parts of white carbon black in a kneader at 80-120 ℃ for 2-5 hours;
preparing a pouring sealant A component: taking 100 parts of pouring sealant base stock, 1 multiplied by 10 -6 To 8X 10 -6 Uniformly dispersing part of the platinum catalyst in a high-speed dispersion machine for later use;
preparing a pouring sealant B component: 100 parts of pouring sealant base material, 5 to 15 parts of hydrogen-containing silicone oil and 0.01 to 0.1 part of inhibitor are taken to be uniformly dispersed in a high-speed dispersion machine for later use;
preparing a pouring sealant: and (2) mixing the components A and B in a mass ratio of 1:1 to 1:2, after mixing evenly, encapsulating electronic components, and vulcanizing at 50-100 ℃ for 20-30 h;
wherein the polydopamine modified MQ silicon resin is prepared by the following steps:
dissolving liquid MQ silicon resin into a mixed solution of ethanol and toluene, wherein the mass ratio of the ethanol to the toluene is 2:1, the concentration of the mixed solution is 10 to 30g/mL;
adding the solution and a silane coupling agent into a polydopamine aqueous solution, wherein the mass ratio of the liquid MQ silicon resin to the polydopamine to the silane coupling agent is 30: (1 to 5): (1 to 3), adding hydrochloric acid to adjust the pH value to be 3 to 5, and heating to 40 to 70 ℃ under the protection of nitrogen to react for 2 to 5 hours;
and after the reaction is finished, evaporating the solvent under reduced pressure to obtain the polydopamine modified MQ silicon resin.
2. The method for preparing the silicone pouring sealant as claimed in claim 1, wherein the aqueous solution of polydopamine is prepared by the following steps:
preparing 0.1-30 mg/mL dopamine-trihydroxymethyl aminomethane-hydrochloric acid buffer solution, and standing in the air for 10-60 min to obtain the aqueous solution of the poly dopamine with rich hydroxyl and amino on the surface.
3. The method for preparing the silicone pouring sealant as claimed in claim 1, wherein the liquid MQ silicone resin is prepared by the following steps:
adding 100 parts by weight of tetraethoxysilane, 70-100 parts by weight of hexamethyldisiloxane and 1-3 parts by weight of hydrochloric acid into a container, slowly dropwise adding 10-15 parts by weight of deionized water, controlling the reaction temperature at 15-25 ℃ to react for 20-40 min, continuously heating to 78 ℃ to perform reflux reaction for 1-3 h, and decompressing and steaming to remove the solvent after the reaction is finished to obtain the liquid MQ silicon resin.
4. The method for preparing the silicone pouring sealant as claimed in claim 1, wherein the silane coupling agent is one or more of Si69, KH550, KH560, KH570, vinyltriethoxysilane, and vinyltrimethoxysilane.
5. The preparation method of the organic silicon pouring sealant as claimed in claim 1, wherein the inhibitor is one or more of 2-methyl-3-butyn-2-ol, 3-methyl-1-hexyn-3-ol, 1-ethynylcyclohexanol, methyltris (methylbutynoxy) silane, phenyltri (methylbutynoxy) silane, vinyltri (methylbutynoxy) silane and polyvinyl polysiloxane.
6. The method for preparing the silicone pouring sealant as claimed in claim 1, wherein the particle size of the aluminum oxide is 1 to 5 μm.
7. The method for preparing the silicone pouring sealant as claimed in claim 1, wherein the particle size of the white carbon black is 500 to 800nm.
8. The method for preparing the silicone pouring sealant as claimed in claim 1, wherein the viscosity of the vinyl silicone oil is 1000 to 6000 mpa.s, and the vinyl content is 2% to 6%.
9. The method for preparing the silicone pouring sealant as claimed in claim 1, wherein the viscosity of the hydrogen-containing silicone oil is 800 to 2500 mpa.s.
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| CN116041965A (en) * | 2022-12-09 | 2023-05-02 | 太湖金张科技股份有限公司 | High impact resistance organic silica gel film |
| CN117567747B (en) * | 2024-01-16 | 2024-04-09 | 深圳先进电子材料国际创新研究院 | Surfactant for underfill, and preparation method and application thereof |
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| CN105505301A (en) * | 2015-12-29 | 2016-04-20 | 江苏创景科技有限公司 | Highly-transparent room temperature deep curing type electronic pouring sealant |
| CN105754543B (en) * | 2016-04-06 | 2018-10-16 | 深圳市欧普特工业材料有限公司 | Include the LED organic silicon potting adhesives and preparation method thereof of function base MQ resins |
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