CN112479732A - Screen printing welding method of dielectric device and dielectric device - Google Patents
Screen printing welding method of dielectric device and dielectric device Download PDFInfo
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- CN112479732A CN112479732A CN202011350878.XA CN202011350878A CN112479732A CN 112479732 A CN112479732 A CN 112479732A CN 202011350878 A CN202011350878 A CN 202011350878A CN 112479732 A CN112479732 A CN 112479732A
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- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B37/00—Joining burned ceramic articles with other burned ceramic articles or other articles by heating
- C04B37/003—Joining burned ceramic articles with other burned ceramic articles or other articles by heating by means of an interlayer consisting of a combination of materials selected from glass, or ceramic material with metals, metal oxides or metal salts
- C04B37/006—Joining burned ceramic articles with other burned ceramic articles or other articles by heating by means of an interlayer consisting of a combination of materials selected from glass, or ceramic material with metals, metal oxides or metal salts consisting of metals or metal salts
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M1/00—Inking and printing with a printer's forme
- B41M1/12—Stencil printing; Silk-screen printing
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- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
- C04B2237/02—Aspects relating to interlayers, e.g. used to join ceramic articles with other articles by heating
- C04B2237/12—Metallic interlayers
- C04B2237/125—Metallic interlayers based on noble metals, e.g. silver
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- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
- C04B2237/50—Processing aspects relating to ceramic laminates or to the joining of ceramic articles with other articles by heating
- C04B2237/55—Pre-treatments of a coated or not coated substrate other than oxidation treatment in order to form an active joining layer
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Abstract
The invention provides a silk-screen printing welding method of a dielectric device, which comprises the following steps: respectively coating the non-welding surfaces of the upper dielectric block and the lower dielectric block with first metal conductive slurry and drying; respectively screen-printing second metal conductive paste on the welding surfaces of the upper dielectric block and the lower dielectric block, and respectively screen-printing patterns on the welding surfaces of the upper dielectric block and the lower dielectric block to reserve at least one corresponding coupling ring as a non-printing area; jointing welding surfaces of the upper dielectric block and the lower dielectric block after screen printing, and enabling coupling rings of the upper dielectric block and the lower dielectric block to be mutually overlapped; and carrying out high-temperature sintering, infiltrating and welding on the attached upper dielectric block and the lower dielectric block. Correspondingly, the invention also provides a dielectric device manufactured by the screen printing welding method of the dielectric device. Therefore, the invention can improve the product performance and reliability and improve the production efficiency of the product.
Description
Technical Field
The invention relates to the technical field of wireless communication medium devices, in particular to a screen printing welding method of a medium device and the medium device.
Background
The miniaturization of the 5G communication base station promotes the development of the microwave dielectric ceramic technology, and promotes dielectric devices such as a dielectric filter, a dielectric combiner, a dielectric resonator, a dielectric duplex, a multiplexer and the like to become development hotspots at the present stage. Compared with the traditional metal cavity, the dielectric device has the advantages of high frequency selectivity, good filtering performance, higher quality factor, low insertion loss, low temperature drift coefficient and the like.
The manufacturing process of the existing dielectric device comprises the following steps: spraying silver on the surface of the dielectric block, drying, sintering and infiltrating the silver layer at high temperature, then etching the coupling ring by laser, then overlapping and laminating the coupling rings of two or more dielectric blocks by silver paste, and then sintering and infiltrating and welding at high temperature. The process has the defects that: firstly, an additional laser etching process is added, the surface of the dielectric block can be damaged, and the edge of an etching ring can generate undesirable phenomena such as burrs and the like, so that the insertion loss of a product can be increased; secondly, the process needs to perform laser etching on the product after the metalized silver burning, a silver layer welding point needs to be printed on the product after etching, and silver layer burning infiltration welding is performed again at high temperature, so that the silver burning times are increased, and the glass phase can float upwards due to multiple sintering of the metal slurry layer, thereby increasing the insertion loss and influencing the electrical property of the product.
In view of the above, the prior art is obviously inconvenient and disadvantageous in practical use, and needs to be improved.
Disclosure of Invention
In view of the above-mentioned drawbacks, an object of the present invention is to provide a screen printing soldering method for a dielectric device and a dielectric device, which can improve the product performance and reliability and improve the production efficiency of the product.
In order to achieve the above object, the present invention provides a screen printing soldering method of a dielectric device, the dielectric device including an upper dielectric block and a lower dielectric block, the method comprising:
respectively coating first metal conductive slurry on the non-welding surfaces of the upper dielectric block and the lower dielectric block and drying;
respectively screen-printing second metal conductive paste on the first welding surface of the upper dielectric block and the second welding surface of the lower dielectric block, reserving at least one first coupling ring as a non-printing area on the first welding surface of the upper dielectric block in a screen printing pattern, and reserving at least one corresponding second coupling ring as a non-printing area on the second welding surface of the lower dielectric block in a screen printing pattern;
attaching the first welding surface of the upper dielectric block and the second welding surface of the lower dielectric block after screen printing, and enabling the first coupling ring and the second coupling ring to be mutually overlapped;
and carrying out high-temperature sintering, infiltrating and welding on the attached upper dielectric block and the attached lower dielectric block.
According to the screen printing welding method, the upper dielectric block and the lower dielectric block are both made of microwave dielectric ceramic materials, the dielectric constant of the upper dielectric block is 35-70, and the quality factor of the upper dielectric block is 10000-60000 GHZ.
According to the screen printing welding method, the drying temperature of the first metal conductive paste is 150-250 ℃.
According to the screen printing welding method, the step of respectively coating the non-welding surfaces of the upper dielectric block and the lower dielectric block with the first metal conductive paste and drying further comprises the following steps:
and cleaning the upper medium block and the lower medium block and drying.
According to the screen printing welding method, the shape, the size, the number and the position of the first coupling ring and the second coupling ring correspond.
According to the screen printing welding method, the shape, the size, the number and/or the position of the first coupling ring and the second coupling ring are determined according to the performance requirement of the dielectric device.
According to the screen printing welding method, the first coupling ring and the second coupling ring are in circular ring shapes or square frame shapes; and/or
The printing reagent for screen printing is slurry consisting of conductive metal powder and a glass phase, and the viscosity of the slurry is 5000-9000 mpa & s.
According to the screen printing welding method, at least one first blind hole and one first groove penetrate through a first welding surface of an upper dielectric block, and at least one second blind hole and one second groove correspondingly penetrate through a second welding surface of a lower dielectric block;
the step of respectively screen-printing second metal conductive paste on the first welding surface of the upper dielectric block and the second welding surface of the lower dielectric block further comprises:
reserving the first blind hole and the first groove as non-printing areas on the first welding surface of the upper dielectric block by the screen printing pattern, and reserving the second blind hole and the second groove as non-printing areas on the second welding surface of the lower dielectric block by the screen printing pattern;
the step of attaching the first welding surface of the upper dielectric block and the second welding surface of the lower dielectric block after screen printing further comprises:
so that the first blind hole and the first trench overlap with the second blind hole and the second trench, respectively.
According to the screen printing welding method, the sintering temperature of the attached upper dielectric block and the attached lower dielectric block is 650-950 ℃.
The invention also provides a dielectric device which is prepared by the screen printing welding method of any one dielectric device.
The invention relates to a silk-screen printing welding method of a dielectric device, which comprises the following steps: respectively coating the non-welding surfaces of the upper dielectric block and the lower dielectric block with first metal conductive slurry and drying; respectively screen-printing second metal conductive paste on the welding surfaces of the upper dielectric block and the lower dielectric block, and respectively screen-printing patterns on the welding surfaces of the upper dielectric block and the lower dielectric block to reserve a coupling ring as a non-printing area; bonding the welding surfaces of the upper dielectric block and the lower dielectric block after screen printing, and enabling the coupling ring of the upper dielectric block and the coupling ring of the lower dielectric block to be mutually overlapped; and carrying out high-temperature sintering, infiltrating and welding on the attached upper dielectric block and the lower dielectric block. Firstly, the invention utilizes the screen printing welding technology, can reduce the etching process, and avoid the etching process from damaging the surface of the dielectric block and the edge of the etching ring from generating undesirable phenomena such as burrs and the like, thereby improving the product performance. Secondly, the invention utilizes screen printing welding to realize the one-time sintering and infiltrating technology of the metal slurry layer, and avoids the influence of twice silver sintering in the prior art on the product performance, thereby improving the product performance and reliability. In addition, the invention reduces the manufacturing procedures and improves the production efficiency.
Drawings
FIG. 1 is a flow chart of a screen printing soldering method of a preferred dielectric device of the present invention;
FIG. 2 is a schematic view of the welding of the upper and lower dielectric blocks of the preferred embodiment of the present invention;
figure 3 is a schematic illustration of the bonding surface of a preferred upper dielectric block of the present invention.
Reference numerals
An upper dielectric block 10; a lower dielectric block 20; a first welding surface 11;
a second welding surface 21; a first coupling ring 12; a second coupling ring 22;
a first blind hole 13; a second blind hole 23; a first trench 14;
a second trench 24.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
It should be noted that references in the specification to "one embodiment," "an example embodiment," etc., indicate that the embodiment described may include a particular feature, structure, or characteristic, but every embodiment may not necessarily include the particular feature, structure, or characteristic. Moreover, such phrases are not intended to refer to the same embodiment. Further, when a particular feature, structure, or characteristic is described in connection with an embodiment, it is submitted that it is within the knowledge of one skilled in the art to effect such feature, structure, or characteristic in connection with other embodiments whether or not explicitly described.
Moreover, where certain terms are used throughout the description and following claims to refer to particular components or features, those skilled in the art will understand that manufacturers may refer to a component or feature by different names or terms. This specification and the claims that follow do not intend to distinguish between components or features that differ in name but not function. In the following description and in the claims, the terms "include" and "comprise" are used in an open-ended fashion, and thus should be interpreted to mean "include, but not limited to. In addition, the term "connected" as used herein includes any direct and indirect electrical connection. Indirect electrical connection means include connection by other means.
FIG. 1 is a flow chart of a screen printing soldering method of a preferred dielectric device of the present invention, the method comprising:
step S101, at least one layer of first metal conductive paste is coated on the non-welding surfaces of the upper dielectric block 10 and the lower dielectric block 20 respectively and dried.
As shown in fig. 2 and 3, the dielectric device includes an upper dielectric block 10 and a lower dielectric block 20, and the upper dielectric block 10 and the lower dielectric block 20 correspond in shape and size. In the present embodiment, the upper dielectric block 10 and the lower dielectric block 20 are rectangular structures, but actually, the upper dielectric block 10 and the lower dielectric block 20 of the present invention may also be designed to be square, annular, diamond, conical or any irregular structures according to actual product requirements. The upper dielectric block 10 is provided with a first welding surface 11, and the other surfaces of the outer surface of the upper dielectric block 10 except the first welding surface 11 are non-welding surfaces. The lower dielectric block 20 is provided with a second welding surface 21, and the other surfaces of the outer surface of the lower dielectric block 20 except the second welding surface 21 are non-welding surfaces. Preferably, the dielectric device may be a dielectric filter, a dielectric combiner, a dielectric resonator, a dielectric duplexer, a multiplexer, or the like.
Preferably, the upper dielectric block 10 and the lower dielectric block 20 are both made of microwave dielectric ceramic materials, the dielectric constant of the microwave dielectric ceramic materials is 35-70, and the quality factor Qf of the microwave dielectric ceramic materials is 10000-60000 GHZ.
Preferably, the non-welding surfaces of the upper dielectric block 10 and the lower dielectric block 20 are respectively and completely coated with the first metal conductive paste and then dried, wherein the drying temperature is 150-. The first metal conductive paste is preferably a silver paste.
Preferably, the step S101 further includes, before:
the upper dielectric block 10 and the lower dielectric block 20 are washed and dried.
Namely, two microwave ceramic dielectric blocks are cleaned firstly and dried to be used as an upper dielectric block 10 and a lower dielectric block 20 respectively.
Step S102, at least one layer of second metal conductive paste is respectively screen-printed on the first welding surface 11 of the upper dielectric block 10 and the second welding surface 21 of the lower dielectric block 20, and at least one first coupling ring 12 is reserved on the first welding surface 11 of the upper dielectric block 10 as a non-printing area, that is, after the second metal conductive paste is screen-printed on the first welding surface 11, the first coupling ring 12 is automatically generated in the corresponding non-printing area, so that the process of laser etching the coupling ring can be reduced. Meanwhile, at least one corresponding second coupling ring 22 is reserved on the second welding surface 21 of the lower dielectric block 20 by screen printing patterns and is a non-printing area, namely after second metal conductive paste is screen-printed on the second welding surface 21, the second coupling ring 22 is automatically generated in the corresponding non-printing area, and the process of laser etching the coupling ring can be reduced.
Preferably, the shape, size, number and position of the first coupling loop 12 and the second coupling loop 22 correspond to each other, that is, the shape, size, number and position of the first coupling loop 12 and the second coupling loop 22 are the same, so as to ensure that the first coupling loop 12 and the second coupling loop 22 are overlapped when the first welding surface 11 of the upper dielectric block 10 and the second welding surface 21 of the lower dielectric block 20 are attached.
Preferably, the shape, size, number and/or location of the first coupling loop 12 and the second coupling loop 22 are determined according to the performance requirements of the dielectric device. For example, the shape, size, number and/or location of the first coupling loop 12 and the second coupling loop 22 in the dielectric combiner may be determined by the electromagnetic wave transmission frequency and time delay of the dielectric combiner. As shown in fig. 2, two first coupling rings 12 are disposed on the first bonding surface 11, and two second coupling rings 22 are disposed on the second bonding surface 21, although the number of the first coupling rings 12 and the second coupling rings 22 may be determined according to the performance requirement of the dielectric device, and the specific number is not limited. As shown in fig. 2, the first coupling ring 12 and the second coupling ring 22 have circular ring shapes, but the first coupling ring 12 and the second coupling ring 22 may have other shapes such as square frames.
Preferably, in the step of screen-printing at least one layer of the second metal conductive paste on the first bonding surface 11 of the upper dielectric block 10 and the second bonding surface 21 of the lower dielectric block 20, the printing agent for screen-printing is preferably a paste consisting of conductive metal powder such as silver powder and a glass phase, and has a viscosity of 5000 to 9000mpa · s.
In step S103, the first bonding surface 11 of the screen-printed upper dielectric block 10 and the second bonding surface 21 of the lower dielectric block 20 are bonded such that the first coupling ring 12 and the second coupling ring 22 overlap each other.
Since the upper dielectric block 10 and the lower dielectric block 20 are corresponding in shape and size, and the first coupling ring 12 of the first welding surface 11 on the upper dielectric block 10 is corresponding in shape, size, number and arrangement to the second coupling ring 22 of the second welding surface 21 on the lower dielectric block 20, the first welding surface 11 of the upper dielectric block 10 and the second welding surface 21 of the lower dielectric block 20 can be aligned and attached, and the first coupling ring 12 and the second coupling ring 22 can be ensured to be overlapped with each other.
And step S104, performing high-temperature sintering-penetration welding on the attached upper dielectric block 10 and the attached lower dielectric block 20.
And (3) carrying out high-temperature sintering welding on the upper dielectric block 10 and the lower dielectric block 20 which are attached together, so that the upper dielectric block 10 and the lower dielectric block 20 are welded together, wherein the sintering temperature is preferably 650-950 ℃.
As shown in fig. 2 and 3, preferably, at least one first blind hole 13 and one first groove 14 are formed on the first bonding surface 11 of the upper dielectric block 10, and at least one second blind hole 23 and one second groove 24 are correspondingly formed on the second bonding surface 21 of the lower dielectric block 20. The first blind holes 13 and the first trenches 14 and the second blind holes 23 and the second trenches 24 correspond in shape, size, number and placement.
In this embodiment, the first bonding surface 11 of the upper dielectric block 10 is provided with two first blind holes 13 and one first trench 14, and the second bonding surface 21 of the lower dielectric block 20 is correspondingly provided with two second blind holes 23 and one second trench 24, but the number of the first blind holes 13, the first trenches 14, the second blind holes 23 and the second trenches 24 may be determined according to the performance requirement of the dielectric device, and the specific number is not limited.
In the step S102, the screen printing at least one layer of second metal conductive paste on the first bonding surface 11 of the upper dielectric block 10 and the second bonding surface 21 of the lower dielectric block 20 further includes:
a first blind hole 13 and a first groove 14 are reserved on the first welding surface 11 of the upper dielectric block 10 through a screen printing pattern and are non-printing areas, namely the first blind hole 13 and the first groove 14 are not coated with second metal conductive slurry; the second blind holes 23 and the second trenches 24 are reserved on the second welding surface 21 of the lower dielectric block 20 by the screen printing pattern, and are non-printing areas, i.e. the second blind holes 23 and the second trenches 24 are not coated with the second metal conductive paste.
In the step S102, the step of attaching the first bonding surface 11 of the screen-printed upper dielectric block 10 and the second bonding surface 21 of the lower dielectric block 20 further includes:
so that the first blind hole 13 and the first trench 14 overlap with the second blind hole 23 and the second trench 24, respectively.
Due to the corresponding shapes, sizes, numbers and positions of the first blind holes 13 and the first grooves 14 and the second blind holes 23 and the second grooves 24, the first welding surface 11 of the upper dielectric block 10 and the second welding surface 21 of the lower dielectric block 20 are attached to ensure that the first coupling ring 12 and the second coupling ring 22 are overlapped with each other.
The invention also provides a dielectric device which is manufactured by the screen printing welding method of the dielectric device as shown in the figures 1-3.
The invention reduces the subsequent etching procedure of the metal conducting layer in the prior art, realizes the one-time sintering and infiltrating technology and is beneficial to improving the product performance. The specific advantages include: firstly, the invention utilizes the screen printing welding technology, can reduce the etching process, avoid the etching process from damaging the surface of the dielectric block, and avoid the undesirable phenomena of burrs and the like at the edge of the etching ring, thereby improving the product performance and the quality. Secondly, the invention can realize one-time sintering and infiltration of the metal slurry layer by utilizing screen printing welding, and avoids the influence on the product performance caused by twice sintering silver in the prior art, thereby improving the product quality and reliability.
For a better understanding of the invention, screen-printed soldering of the dielectric combiner is exemplified:
the first step is as follows: and cleaning the two microwave ceramic dielectric blocks, and after drying, coating a first metal conductive slurry on the non-welding surfaces of the two microwave ceramic dielectric blocks except the welding surface to respectively serve as an upper dielectric block 10 and a lower dielectric block 20 of the combiner. The microwave ceramic dielectric block has the following electrical properties: dielectric constant 45.08, quality factor value: 40000GHZ, and the drying temperature is set to 165 ℃.
The second step is as follows: according to the product performance requirement, the shapes of the first coupling ring 12 of the upper dielectric block 10 and the second coupling ring 22 of the lower dielectric block 20 are determined, and the positions and the sizes of the first coupling ring 12 and the second coupling ring 22 are calculated, fig. 2 is a stacking diagram of the upper dielectric block 10 and the lower dielectric block 20 of the combiner, and fig. 3 is a schematic diagram of the welding surface of the upper dielectric block 10 of the combiner, in the embodiment, the sizes of the first coupling ring 12 and the second coupling ring 22 are consistent, and both the sizes are 6.5mm in outer diameter and 5.5mm in inner diameter.
The third step: and screen printing second metal conductive paste on the first welding surface 11 of the upper dielectric block 10, wherein the pattern of the first coupling ring 12, the first blind hole 13 and the first groove 14 is reserved on the screen printing plate as a non-printing area in the printing process, and the non-printing area is not coated with the second metal conductive paste during screen printing. In addition, the second metal conductive paste is screen-printed on the second welding surface 21 of the lower dielectric block 20, and the printing process leaves a pattern of the second coupling ring 22, the second blind holes 23 and the second grooves 24 as a non-printing area on the screen printing plate, and the non-printing area is not coated with the second metal conductive paste during screen printing. That is, the screen printing operation of the first soldering face 11 of the upper dielectric block 10 and the screen printing operation of the second soldering face 21 of the lower dielectric block 20 are identical. The printing reagent is moderate viscosity slurry composed of conductive metal powder and a glass phase, and the viscosity is as follows: 8000mpa · s.
The fourth step: the first welding surface 11 of the upper dielectric block 10 after screen printing and the second welding surface 21 of the lower dielectric block 20 are jointed, and the jointing process ensures that the first coupling ring 12 of the first welding surface 11 of the upper dielectric block 10 and the two second coupling rings 22 of the two second welding surfaces 21 of the lower dielectric block 20 are respectively overlapped.
The fifth step: and (3) carrying out high-temperature sintering and infiltrating welding on the upper dielectric block 10 and the lower dielectric block 20 which are attached together, wherein the sintering and infiltrating temperature is 840 ℃.
In summary, the screen printing soldering method for the dielectric device of the invention comprises the following steps: respectively coating the non-welding surfaces of the upper dielectric block and the lower dielectric block with first metal conductive slurry and drying; respectively screen-printing second metal conductive paste on the welding surfaces of the upper dielectric block and the lower dielectric block, and respectively screen-printing patterns on the welding surfaces of the upper dielectric block and the lower dielectric block to reserve a coupling ring as a non-printing area; bonding the welding surfaces of the upper dielectric block and the lower dielectric block after screen printing, and enabling the coupling ring of the upper dielectric block and the coupling ring of the lower dielectric block to be mutually overlapped; and carrying out high-temperature sintering, infiltrating and welding on the attached upper dielectric block and the lower dielectric block. Firstly, the invention utilizes the screen printing welding technology, can reduce the etching process, and avoid the etching process from damaging the surface of the dielectric block and the edge of the etching ring from generating undesirable phenomena such as burrs and the like, thereby improving the product performance. Secondly, the invention utilizes screen printing welding to realize the one-time sintering and infiltrating technology of the metal slurry layer, and avoids the influence of twice silver sintering in the prior art on the product performance, thereby improving the product performance and reliability. In addition, the invention reduces the manufacturing procedures and improves the production efficiency.
The present invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof, and it should be understood that various changes and modifications can be effected therein by one skilled in the art without departing from the spirit and scope of the invention as defined in the appended claims.
Claims (10)
1. A screen printing welding method of a dielectric device is characterized in that the dielectric device comprises an upper dielectric block and a lower dielectric block, and the method comprises the following steps:
respectively coating first metal conductive slurry on the non-welding surfaces of the upper dielectric block and the lower dielectric block and drying;
respectively screen-printing second metal conductive paste on the first welding surface of the upper dielectric block and the second welding surface of the lower dielectric block, reserving at least one first coupling ring as a non-printing area on the first welding surface of the upper dielectric block in a screen printing pattern, and reserving at least one corresponding second coupling ring as a non-printing area on the second welding surface of the lower dielectric block in a screen printing pattern;
attaching the first welding surface of the upper dielectric block and the second welding surface of the lower dielectric block after screen printing, and enabling the first coupling ring and the second coupling ring to be mutually overlapped;
and carrying out high-temperature sintering, infiltrating and welding on the attached upper dielectric block and the attached lower dielectric block.
2. The screen printing welding method according to claim 1, wherein the upper dielectric block and the lower dielectric block are both made of microwave dielectric ceramic material, and have a dielectric constant of 35 to 70 and a quality factor of 10000 to 60000 GHZ.
3. The screen printing soldering method according to claim 1, wherein the drying temperature of the first metal conductive paste is 150-250 ℃.
4. The screen printing soldering method according to claim 1, wherein the step of respectively coating the non-soldering surfaces of the upper dielectric block and the lower dielectric block with a first metal conductive paste and drying further comprises:
and cleaning the upper medium block and the lower medium block and drying.
5. The screen printing soldering method according to claim 1, wherein the first coupling ring and the second coupling ring correspond in shape, size, number, and position.
6. The screen printing soldering method according to claim 1, wherein the shape, size, number and/or position of the first coupling ring and the second coupling ring are determined according to performance requirements of the dielectric device.
7. The screen printing soldering method according to claim 1, wherein the first coupling ring and the second coupling ring are circular or square in shape; and/or
The printing reagent for screen printing is slurry consisting of conductive metal powder and a glass phase, and the viscosity of the slurry is 5000-9000 mpa & s.
8. The screen printing welding method according to claim 1, wherein at least one first blind hole and one first groove penetrate through a first welding surface of the upper dielectric block, and at least one second blind hole and one second groove penetrate through a second welding surface of the lower dielectric block correspondingly;
the step of respectively screen-printing second metal conductive paste on the first welding surface of the upper dielectric block and the second welding surface of the lower dielectric block further comprises:
reserving the first blind hole and the first groove as non-printing areas on the first welding surface of the upper dielectric block by the screen printing pattern, and reserving the second blind hole and the second groove as non-printing areas on the second welding surface of the lower dielectric block by the screen printing pattern;
the step of attaching the first welding surface of the upper dielectric block and the second welding surface of the lower dielectric block after screen printing further comprises:
so that the first blind hole and the first trench overlap with the second blind hole and the second trench, respectively.
9. The screen printing soldering method according to claim 1, wherein the sintering temperature of the attached upper dielectric block and lower dielectric block is 650-950 ℃.
10. A dielectric device produced by a screen printing soldering method of a dielectric device as claimed in any one of claims 1 to 9.
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| CN1446387A (en) * | 2000-08-28 | 2003-10-01 | 埃普科斯股份有限公司 | Electric component, method for production thereof and it suse |
| CN101340014A (en) * | 2008-08-01 | 2009-01-07 | 苏州艾福电子通讯有限公司 | Ceramic dielectric filter and duplexer having slots |
| CN104112896A (en) * | 2013-04-16 | 2014-10-22 | 深圳光启创新技术有限公司 | Method of manufacturing harmonic oscillator, harmonic oscillator and filter |
| CN104681273A (en) * | 2013-11-28 | 2015-06-03 | 北京有色金属研究总院 | Novel high-voltage ceramic capacitor electrode and preparation method |
| CN107022747A (en) * | 2017-04-05 | 2017-08-08 | 武汉光谷创元电子有限公司 | Microwave-medium part and its manufacture method |
| CN108365308A (en) * | 2018-02-05 | 2018-08-03 | 重庆思睿创瓷电科技有限公司 | Dielectric waveguide filter and its attaching method |
| CN210074112U (en) * | 2019-07-19 | 2020-02-14 | 苏州捷频电子科技有限公司 | Laminated dielectric filter |
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