CN112479713A - Ceramic ring for laser cutting machine and preparation process thereof - Google Patents
Ceramic ring for laser cutting machine and preparation process thereof Download PDFInfo
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- CN112479713A CN112479713A CN202011267518.3A CN202011267518A CN112479713A CN 112479713 A CN112479713 A CN 112479713A CN 202011267518 A CN202011267518 A CN 202011267518A CN 112479713 A CN112479713 A CN 112479713A
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- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/515—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics
- C04B35/56—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on carbides or oxycarbides
- C04B35/565—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on carbides or oxycarbides based on silicon carbide
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- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/622—Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
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- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/622—Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/64—Burning or sintering processes
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
- B23K2103/52—Ceramics
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- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/65—Aspects relating to heat treatments of ceramic bodies such as green ceramics or pre-sintered ceramics, e.g. burning, sintering or melting processes
- C04B2235/656—Aspects relating to heat treatments of ceramic bodies such as green ceramics or pre-sintered ceramics, e.g. burning, sintering or melting processes characterised by specific heating conditions during heat treatment
- C04B2235/6567—Treatment time
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Abstract
The invention discloses a ceramic ring for a laser cutting machine and a preparation process thereof, and the ceramic ring comprises a ceramic ring body, wherein a through hole is formed in the middle of the ceramic ring body, a metal ring is bonded on one surface of the ceramic ring body by conductive silver adhesive, an internal thread structure is arranged at the position, inserted into the ceramic ring body, of the metal ring, a copper needle is inserted into the ceramic ring body, a jack is arranged on the ceramic ring body corresponding to the copper needle, and the copper needle is connected with the metal ring.
Description
Technical Field
The invention relates to the technical field of laser cutting machines, in particular to a ceramic ring for a laser cutting machine and a preparation process thereof.
Background
The nozzle part of the laser cutting head is provided with a ceramic ring which can collect electric signals at the position of the conduction nozzle and is used for ensuring the cutting stability of the laser cutting head, and the structure comprises: ceramic body, metal ring and copper needle. Any part of the electric signals is easy to cause instability, even the electric signals disappear, normal cutting is affected, equipment is stopped lightly, and the laser head can collide with a workpiece to cause economic loss.
The ceramic ring is very important in the laser cutting head, the existing ceramic ring is high in production cost, poor in high temperature resistance and deformation prevention effect, and unstable in signal transmission. Accordingly, those skilled in the art have provided a ceramic ring for a laser cutting machine and a process for preparing the same to solve the problems set forth in the background art.
Disclosure of Invention
The invention aims to provide a ceramic ring for a laser cutting machine and a preparation process thereof, so as to solve the problems in the background technology.
In order to achieve the purpose, the invention provides the following technical scheme:
the ceramic ring for the laser cutting machine comprises a ceramic ring body, wherein a metal ring is bonded on one surface of the ceramic ring body by adopting conductive silver adhesive, a copper needle is inserted into the ceramic ring body, and the copper needle is connected with the metal ring.
As a further scheme of the invention: the middle part of the ceramic ring body is provided with a through hole.
As a still further scheme of the invention: the inner part of the metal ring inserted into the ceramic ring body is provided with an internal thread structure.
As a still further scheme of the invention: the ceramic ring body is provided with jacks corresponding to the copper needles.
The preparation process of the ceramic ring for the laser cutting machine comprises the following steps:
1) weighing raw materials, 98% of submicron SiC powder with the average particle size of 0.6umSiC powder, the weight portion of 350g-400g, 20g-35g of phenolic resin, 35g-50g of HT resin, 3ml-5ml of oleic acid, 4g-6g of sintering aid, 700g-900g of polyurethane ball, 100ml-200ml of ethanol and 200ml-300ml of distilled water, wherein the PH of the distilled water is more than 10;
2) preparing slurry, namely putting submicron SiC powder, distilled water, ethanol and polyurethane balls which are weighed according to the proportion into a hard plastic tank, adding phenolic resin, performing wet ball milling for 1-2 h, then adding HT resin, and continuing ball milling for 0.5-1 h to obtain stable slurry;
3) spraying and granulating, namely feeding while stirring by using a magnetic stirrer, atomizing the slurry by using a bottom spraying type pressure nozzle, mixing the atomized slurry with hot air in a mixed flow manner, and drying to form granular powder;
4) pressing and molding a steel film, namely weighing 40-60 g of SiC powder subjected to spray granulation in the step 3), putting the SiC powder into a ceramic ring metal mold which is lubricated in advance, putting the ceramic ring metal mold on a press to be pressed after being uniformly knocked and compacted, wherein the applied pressure is 16t, so that the ceramic ring metal mold is compactly molded, and taking out and demolding the ceramic ring metal mold;
5) pressureless sintering, introducing inert gas argon into the furnace, sintering the product under the protection of the argon, controlling the temperature range at 2100-2200 ℃, and finishing the sintering;
6) grinding, namely processing the SiC ceramic ring by adopting an ultrasonic vibration grinding method;
7) drilling, namely drilling the SiC ceramic ring by using a diamond drill according to the diameter of the metal ring 2;
8) grinding, finishing finish machining by polishing on a polishing machine, cleaning by using cooling working fluid during polishing, wherein the cooling liquid not only plays a role of flushing chipped powder, but also can reduce the temperature of a grinding area, improve the grinding quality and reduce the thermal decomposition of a bonding agent around grinding particles;
9) detecting, namely detecting the processed SiC ceramic ring;
10) and assembling a finished product, namely bonding the processed SiC ceramic ring with the metal ring conductive silver adhesive, and inserting the gold-plated copper needle into the jack of the SiC ceramic ring to complete the assembly of the SiC ceramic ring.
Compared with the prior art, the invention has the beneficial effects that:
the ceramic ring has the advantages of simple structure, low production and processing cost, high temperature resistance, deformation prevention effect, stable signal transmission guarantee, high surface smoothness, smooth air flow and good cutting effect.
Drawings
Fig. 1 is a schematic structural diagram of a ceramic ring for a laser cutting machine and a preparation process thereof.
In the figure: 1-ceramic ring body, 2-metal ring, 3-copper needle.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Example one
Referring to fig. 1, in an embodiment of the present invention, a ceramic ring for a laser cutting machine includes a ceramic ring body 1, a through hole is formed in a middle portion of the ceramic ring body 1, a metal ring 2 is bonded to one surface of the ceramic ring body 1 by using conductive silver paste, an internal thread structure is disposed at an inner portion of the ceramic ring body 1 where the metal ring 2 is inserted, a copper pin 3 is inserted into the ceramic ring body 1, and the ceramic ring body 1 is provided with a socket corresponding to the copper pin 3, and the copper pin 3 is connected to the metal ring 2.
The preparation process of the ceramic ring for the laser cutting machine comprises the following steps:
1) weighing raw materials, wherein 98% of submicron SiC powder has the average particle size of 0.6umSiC powder, the weight portion is 350g, the weight portion is 20g of phenolic resin, the weight portion is 35g of HT resin, the weight portion is 3ml of oleic acid, the weight portion is 4g of sintering aid, the weight portion is 700g of polyurethane balls, the weight portion is 100ml of ethanol, and the weight portion is 200ml of distilled water, wherein the PH value of the distilled water is more than 10;
2) preparing slurry, namely putting submicron SiC powder, distilled water, ethanol and polyurethane balls which are weighed according to the proportion into a hard plastic tank, adding phenolic resin, performing wet ball milling for 1 hour, then adding HT resin, and continuing ball milling for 0.5 hour to obtain stable slurry;
3) spraying and granulating, namely feeding while stirring by using a magnetic stirrer, atomizing the slurry by using a bottom spraying type pressure nozzle, mixing the atomized slurry with hot air in a mixed flow manner, and drying to form granular powder;
4) pressing and molding a steel film, namely weighing 40g of SiC powder subjected to spray granulation in the step 3), putting the SiC powder into a ceramic ring metal mold which is lubricated in advance, putting the ceramic ring metal mold on a press to be pressed after being evenly knocked and compacted, wherein the applied pressure is 16t, so that the ceramic ring metal mold is compactly molded, and taking out and demolding the ceramic ring metal mold;
5) pressureless sintering, introducing inert gas argon into the furnace, sintering the product under the protection of the argon, controlling the temperature range at 2100-2200 ℃, and finishing the sintering;
6) grinding, namely processing the SiC ceramic ring by adopting an ultrasonic vibration grinding method;
7) drilling, namely drilling the SiC ceramic ring by using a diamond drill according to the diameter of the metal ring 2;
8) grinding, finishing finish machining by polishing on a polishing machine, cleaning by using cooling working fluid during polishing, wherein the cooling liquid not only plays a role of flushing chipped powder, but also can reduce the temperature of a grinding area, improve the grinding quality and reduce the thermal decomposition of a bonding agent around grinding particles;
9) detecting, namely detecting the processed SiC ceramic ring;
10) and assembling a finished product, namely bonding the processed SiC ceramic ring with the metal ring conductive silver adhesive, and inserting the gold-plated copper needle into the jack of the SiC ceramic ring to complete the assembly of the SiC ceramic ring.
Example two
The preparation process of the ceramic ring for the laser cutting machine comprises the following steps:
1) weighing raw materials, 98% of submicron SiC powder with the average particle size of 0.6umSiC powder, the weight portion of 400g, 35g of phenolic resin, 50g of HT resin, 5ml of oleic acid, 6g of sintering aid, 900g of polyurethane balls, 200ml of ethanol and 300ml of distilled water, wherein the PH of the distilled water is more than 10;
2) preparing slurry, namely putting submicron SiC powder, distilled water, ethanol and polyurethane balls which are weighed according to the proportion into a hard plastic tank, adding phenolic resin, performing wet ball milling for 2 hours, then adding HT resin, and continuing ball milling for 1 hour to obtain stable slurry;
3) spraying and granulating, namely feeding while stirring by using a magnetic stirrer, atomizing the slurry by using a bottom spraying type pressure nozzle, mixing the atomized slurry with hot air in a mixed flow manner, and drying to form granular powder;
4) pressing and molding a steel film, namely weighing 60g of SiC powder subjected to spray granulation in the step 3), putting the SiC powder into a ceramic ring metal mold which is lubricated in advance, putting the ceramic ring metal mold on a press to be pressed after being evenly knocked and compacted, wherein the applied pressure is 16t, so that the ceramic ring metal mold is compactly molded, and taking out and demolding the ceramic ring metal mold;
5) pressureless sintering, introducing inert gas argon into the furnace, sintering the product under the protection of the argon, controlling the temperature range at 2100-2200 ℃, and finishing the sintering;
6) grinding, namely processing the SiC ceramic ring by adopting an ultrasonic vibration grinding method;
7) drilling, namely drilling the SiC ceramic ring by using a diamond drill according to the diameter of the metal ring 2;
8) grinding, finishing finish machining by polishing on a polishing machine, cleaning by using cooling working fluid during polishing, wherein the cooling liquid not only plays a role of flushing chipped powder, but also can reduce the temperature of a grinding area, improve the grinding quality and reduce the thermal decomposition of a bonding agent around grinding particles;
9) detecting, namely detecting the processed SiC ceramic ring;
10) and assembling a finished product, namely bonding the processed SiC ceramic ring with the metal ring conductive silver adhesive, and inserting the gold-plated copper needle into the jack of the SiC ceramic ring to complete the assembly of the SiC ceramic ring.
EXAMPLE III
The preparation process of the ceramic ring for the laser cutting machine comprises the following steps:
1) weighing raw materials, 98% of submicron SiC powder with the average particle size of 0.6umSiC powder, the weight parts of 375g, 30g of phenolic resin, 40g of HT resin, 4ml of oleic acid, 5g of sintering aid, 800g of polyurethane balls, 150ml of ethanol and 2500ml of distilled water, wherein the PH of the distilled water is more than 10;
2) preparing slurry, namely putting submicron SiC powder, distilled water, ethanol and polyurethane balls which are weighed according to the proportion into a hard plastic tank, adding phenolic resin, performing wet ball milling for 1.5h, then adding HT resin, and continuing ball milling for 0.8h to obtain stable slurry;
3) spraying and granulating, namely feeding while stirring by using a magnetic stirrer, atomizing the slurry by using a bottom spraying type pressure nozzle, mixing the atomized slurry with hot air in a mixed flow manner, and drying to form granular powder;
4) pressing and molding a steel film, namely weighing 50g of SiC powder subjected to spray granulation in the step 3), putting the SiC powder into a ceramic ring metal mold which is lubricated in advance, putting the ceramic ring metal mold on a press to be pressed after being evenly knocked and compacted, wherein the applied pressure is 16t, so that the ceramic ring metal mold is compactly molded, and taking out and demolding the ceramic ring metal mold;
5) pressureless sintering, introducing inert gas argon into the furnace, sintering the product under the protection of the argon, controlling the temperature range at 2100-2200 ℃, and finishing the sintering;
6) grinding, namely processing the SiC ceramic ring by adopting an ultrasonic vibration grinding method;
7) drilling, namely drilling the SiC ceramic ring by using a diamond drill according to the diameter of the metal ring 2;
8) grinding, finishing finish machining by polishing on a polishing machine, cleaning by using cooling working fluid during polishing, wherein the cooling liquid not only plays a role of flushing chipped powder, but also can reduce the temperature of a grinding area, improve the grinding quality and reduce the thermal decomposition of a bonding agent around grinding particles;
9) detecting, namely detecting the processed SiC ceramic ring;
10) and assembling a finished product, namely bonding the processed SiC ceramic ring with the metal ring conductive silver adhesive, and inserting the gold-plated copper needle into the jack of the SiC ceramic ring to complete the assembly of the SiC ceramic ring.
The working principle of the invention is as follows:
the ceramic ring has the advantages of simple structure, low production and processing cost, high temperature resistance, deformation prevention effect, stable signal transmission guarantee, high surface smoothness, smooth air flow and good cutting effect.
The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be considered to be within the technical scope of the present invention, and the technical solutions and the inventive concepts thereof according to the present invention should be equivalent or changed within the scope of the present invention.
Claims (5)
1. The ceramic ring for the laser cutting machine comprises a ceramic ring body (1) and is characterized in that a metal ring (2) is bonded to one surface of the ceramic ring body (1) through conductive silver adhesive, a copper needle (3) is inserted into the ceramic ring body (1), and the copper needle (3) is connected with the metal ring (2).
2. The ceramic ring for the laser cutting machine according to claim 1, wherein a through hole is formed in the middle of the ceramic ring body (1).
3. The ceramic ring for the laser cutting machine according to claim 1, wherein the metal ring (2) is provided with an internal thread structure at the inner part inserted into the ceramic ring body (1).
4. The ceramic ring for the laser cutting machine according to claim 1, wherein the ceramic ring body (1) is provided with a jack corresponding to the copper needle (3).
5. A process for preparing a ceramic ring for a laser cutting machine according to any one of claims 1 to 4,
1) weighing raw materials, 98% of submicron SiC powder with the average particle size of 0.6umSiC powder, the weight portion of 350g-400g, 20g-35g of phenolic resin, 35g-50g of HT resin, 3ml-5ml of oleic acid, 4g-6g of sintering aid, 700g-900g of polyurethane ball, 100ml-200ml of ethanol and 200ml-300ml of distilled water, wherein the PH of the distilled water is more than 10;
2) preparing slurry, namely putting submicron SiC powder, distilled water, ethanol and polyurethane balls which are weighed according to the proportion into a hard plastic tank, adding phenolic resin, performing wet ball milling for 1-2 h, then adding HT resin, and continuing ball milling for 0.5-1 h to obtain stable slurry;
3) spraying and granulating, namely feeding while stirring by using a magnetic stirrer, atomizing the slurry by using a bottom spraying type pressure nozzle, mixing the atomized slurry with hot air in a mixed flow manner, and drying to form granular powder;
4) pressing and molding a steel film, namely weighing 40-60 g of SiC powder subjected to spray granulation in the step 3), putting the SiC powder into a ceramic ring metal mold which is lubricated in advance, putting the ceramic ring metal mold on a press to be pressed after being uniformly knocked and compacted, wherein the applied pressure is 16t, so that the ceramic ring metal mold is compactly molded, and taking out and demolding the ceramic ring metal mold;
5) pressureless sintering, introducing inert gas argon into the furnace, sintering the product under the protection of the argon, controlling the temperature range at 2100-2200 ℃, and finishing the sintering;
6) grinding, namely processing the SiC ceramic ring by adopting an ultrasonic vibration grinding method;
7) drilling, namely drilling the SiC ceramic ring by using a diamond drill according to the diameter of the metal ring 2;
8) grinding, finishing finish machining by polishing on a polishing machine, cleaning by using cooling working fluid during polishing, wherein the cooling liquid not only plays a role of flushing chipped powder, but also can reduce the temperature of a grinding area, improve the grinding quality and reduce the thermal decomposition of a bonding agent around grinding particles;
9) detecting, namely detecting the processed SiC ceramic ring;
10) and assembling a finished product, namely bonding the processed SiC ceramic ring with the metal ring conductive silver adhesive, and inserting the gold-plated copper needle into the jack of the SiC ceramic ring to complete the assembly of the SiC ceramic ring.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011267518.3A CN112479713A (en) | 2020-11-13 | 2020-11-13 | Ceramic ring for laser cutting machine and preparation process thereof |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202011267518.3A CN112479713A (en) | 2020-11-13 | 2020-11-13 | Ceramic ring for laser cutting machine and preparation process thereof |
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| CN112479713A true CN112479713A (en) | 2021-03-12 |
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101169188A (en) * | 2007-12-04 | 2008-04-30 | 上海德宝密封件有限公司 | Silicon carbide ceramic seal ring |
| CN102101218A (en) * | 2009-12-22 | 2011-06-22 | 深圳市大族激光科技股份有限公司 | Insulating ring, manufacturing method and laser cutter using insulating ring |
| CN209647888U (en) * | 2018-12-13 | 2019-11-19 | 广东天丰精密技术有限公司 | A kind of laser nozzle attachment device |
-
2020
- 2020-11-13 CN CN202011267518.3A patent/CN112479713A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101169188A (en) * | 2007-12-04 | 2008-04-30 | 上海德宝密封件有限公司 | Silicon carbide ceramic seal ring |
| CN102101218A (en) * | 2009-12-22 | 2011-06-22 | 深圳市大族激光科技股份有限公司 | Insulating ring, manufacturing method and laser cutter using insulating ring |
| CN209647888U (en) * | 2018-12-13 | 2019-11-19 | 广东天丰精密技术有限公司 | A kind of laser nozzle attachment device |
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Application publication date: 20210312 |