CN112469201A - Method for manufacturing copper-clad lining plate - Google Patents
Method for manufacturing copper-clad lining plate Download PDFInfo
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- CN112469201A CN112469201A CN202011326747.8A CN202011326747A CN112469201A CN 112469201 A CN112469201 A CN 112469201A CN 202011326747 A CN202011326747 A CN 202011326747A CN 112469201 A CN112469201 A CN 112469201A
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- Prior art keywords
- copper
- etching
- cleaning
- temperature
- drying
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 49
- 238000000034 method Methods 0.000 title claims abstract description 36
- 238000005530 etching Methods 0.000 claims abstract description 175
- 238000004140 cleaning Methods 0.000 claims abstract description 109
- 239000000919 ceramic Substances 0.000 claims abstract description 72
- 239000010949 copper Substances 0.000 claims abstract description 68
- 239000002002 slurry Substances 0.000 claims abstract description 66
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 62
- 229910052802 copper Inorganic materials 0.000 claims abstract description 62
- 238000005520 cutting process Methods 0.000 claims abstract description 31
- 238000005245 sintering Methods 0.000 claims abstract description 31
- 238000007639 printing Methods 0.000 claims abstract description 19
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 81
- 238000001035 drying Methods 0.000 claims description 77
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims description 62
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims description 34
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 claims description 32
- 238000007650 screen-printing Methods 0.000 claims description 30
- 239000000654 additive Substances 0.000 claims description 24
- 230000000996 additive effect Effects 0.000 claims description 24
- 239000008367 deionised water Substances 0.000 claims description 21
- 229910021641 deionized water Inorganic materials 0.000 claims description 21
- 238000005406 washing Methods 0.000 claims description 19
- 239000000835 fiber Substances 0.000 claims description 18
- 239000002994 raw material Substances 0.000 claims description 18
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 claims description 16
- 235000011114 ammonium hydroxide Nutrition 0.000 claims description 16
- 238000003698 laser cutting Methods 0.000 claims description 13
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 claims description 12
- 238000002791 soaking Methods 0.000 claims description 9
- PIGFYZPCRLYGLF-UHFFFAOYSA-N Aluminum nitride Chemical compound [Al]#N PIGFYZPCRLYGLF-UHFFFAOYSA-N 0.000 claims description 6
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 claims description 6
- 229910017604 nitric acid Inorganic materials 0.000 claims description 6
- 229910001220 stainless steel Inorganic materials 0.000 claims description 6
- 239000010935 stainless steel Substances 0.000 claims description 6
- 239000000243 solution Substances 0.000 description 116
- 150000001412 amines Chemical class 0.000 description 10
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 10
- 150000007942 carboxylates Chemical class 0.000 description 10
- 150000003839 salts Chemical class 0.000 description 10
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 5
- QAOWNCQODCNURD-UHFFFAOYSA-L Sulfate Chemical compound [O-]S([O-])(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-L 0.000 description 5
- 150000001298 alcohols Chemical class 0.000 description 5
- 239000004094 surface-active agent Substances 0.000 description 5
- 239000002253 acid Substances 0.000 description 4
- 238000012545 processing Methods 0.000 description 4
- 238000005452 bending Methods 0.000 description 3
- 239000003814 drug Substances 0.000 description 3
- 238000009413 insulation Methods 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 230000006978 adaptation Effects 0.000 description 2
- 238000007664 blowing Methods 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000010998 test method Methods 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 239000003929 acidic solution Substances 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- 239000012670 alkaline solution Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000003153 chemical reaction reagent Substances 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000011056 performance test Methods 0.000 description 1
- 238000005554 pickling Methods 0.000 description 1
- 229910052573 porcelain Inorganic materials 0.000 description 1
- 239000002893 slag Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/068—Apparatus for etching printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/227—Drying of printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/26—Cleaning or polishing of the conductive pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/0323—Working metal substrate or core, e.g. by etching, deforming
Abstract
The invention discloses a method for manufacturing a copper-clad lining plate, which comprises the following steps: s1, cleaning the ceramic chip and the copper sheet; s2, printing the paste; s3, sintering; s4, etching copper; s5, cutting; s6, cleaning; and S7, etching the slurry. The copper-clad lining board manufacturing method optimizes the sequence of the process steps and optimizes the process condition parameters of the steps, so that the obtained copper-clad lining board has excellent performance indexes and good comprehensive use performance; the solution concentration selectivity is increased; the production efficiency of the copper-clad lining plate can be greatly improved.
Description
Technical Field
The invention belongs to the technical field of copper-clad liner plates, and particularly relates to a manufacturing method of a copper-clad liner plate.
Background
The copper-clad lining board has excellent heat conducting property, high insulating property, large current carrying capacity, excellent soldering resistance and high adhesion strength, and can etch various circuit patterns like a PCB. The copper-clad ceramic substrate is applied to the fields of power electronics, high-power modules, aerospace and the like. For example, Insulated Gate Bipolar Transistors (IGBTs), typically have a voltage operating environment of several hundred to over kilovolts.
The copper-clad lining plate has very large actual usage amount, and the whole-page operation is mostly adopted in the production and manufacturing process. Therefore, the cut must be made to the customer's desired size before shipment. Because the product is applied to a high-pressure environment, the requirement on appearance quality after cutting is very high. At present, the main stream cutting process in the industry is 'laser cutting'. However, in the laser processing, a large amount of heat energy is generated, and foreign matter remains in the vicinity of the kerf after cooling, and the foreign matter is a conductor, which eventually causes a series of reliability problems.
At present, the method for processing the exception after cutting comprises the following steps: firstly, physical treatment and air blowing; and secondly, chemical treatment, namely cleaning by using a low-concentration acid solution. However, the above two methods still cannot completely solve the problem of the residual cutting.
However, the currently used copper-clad lining board manufacturing method has the following problems:
firstly, air blowing:
1) only surface dust can be removed, and slag near the cutting joint has no treatment effect;
second, low concentration acid pickling solution treatment
1) The ceramic chip and the acid solution can react to reduce the strength of the ceramic chip of the copper-clad liner plate;
2) the concentration selectivity of the liquid medicine is low;
3) the treatment time is long, and the production efficiency is low;
based on the situation, the invention provides a manufacturing method of a copper-clad lining plate, which can effectively solve the problems.
Disclosure of Invention
The invention aims to provide a method for manufacturing a copper-clad lining plate. The copper-clad lining board manufacturing method optimizes the sequence of the process steps and optimizes the process condition parameters of the steps, so that the obtained copper-clad lining board has excellent performance indexes and good comprehensive use performance; the solution concentration selectivity is increased; the production efficiency of the copper-clad lining plate can be greatly improved.
In order to solve the technical problems, the technical scheme provided by the invention is as follows:
a method for manufacturing a copper-clad lining plate comprises the following steps:
s1, cleaning the ceramic chip and the copper sheet:
cleaning the surface of the ceramic chip, and then drying at the drying temperature of 80 +/-5 ℃; cleaning the surface of the copper sheet, and then drying at the drying temperature of 80 +/-5 ℃;
s2, printing the paste:
respectively printing slurry layers on two surfaces of the ceramic chip processed in the step S1, wherein the printing mode is silk-screen printing, and then drying at the drying temperature of 100 +/-10 ℃;
s3, sintering:
covering a copper sheet on each of the two slurry layer surfaces of the ceramic chip processed in the step S2, and then sintering in a sintering furnace;
s4, copper etching:
then, etching the copper by using an etching solution to completely etch the part of the copper sheet to be etched; then, cleaning the etching solution on the surface by using pure water, wherein the temperature of the pure water is room temperature during cleaning; then drying at the drying temperature of 85 +/-5 ℃;
s5, cutting:
then cutting the fiber into the required shape and size by using a fiber laser cutting machine;
s6, cleaning:
then, adopting NaOH solution to carry out surface cleaning; then washing away the NaOH solution on the surface by using pure water, wherein the washing time is 30-90 s, and the temperature of the pure water is room temperature during washing; then drying at the drying temperature of 80 ℃;
s7, etching the slurry:
then, carrying out copper etching by adopting a slurry etching solution, and completely etching the part of the slurry layer to be etched until the surface of the ceramic chip is seen; then, cleaning the slurry etching solution on the surface by using pure water, wherein the temperature of the pure water is 75 +/-5 ℃ during cleaning; then drying at the drying temperature of 85 +/-5 ℃;
the copper-clad liner plate manufacturing method optimizes the sequence of process steps and preferably selects process condition parameters of each step (the control of the process condition parameters is the key for obtaining the copper-clad liner plate with good comprehensive performance, and the good comprehensive performance of the obtained copper-clad liner plate can be ensured only if the process condition parameters are controlled in a proper range), so that the bending strength of the obtained copper-clad liner plate is more than or equal to 450 MPa; the temperature impact times are more than 100; the insulation withstand voltage is more than 7 kV; the comprehensive performance index is excellent.
The copper-clad lining board manufacturing method optimizes the sequence of the process steps and optimizes the process condition parameters of the steps, so that the obtained copper-clad lining board has excellent performance indexes and good comprehensive use performance; the solution concentration selectivity is increased; the production efficiency of the copper-clad lining plate can be greatly improved.
Preferably, in step S1, the ceramic tile is an aluminum nitride (AlN) tile with a thickness of 1 mm; the cleaning of the surface of the ceramic chip is to soak the ceramic chip in 9-11.5 wt% of dilute nitric acid for 100-140 min, then carry out three-section countercurrent cleaning by using pure water, wherein the cleaning time of each section is 30s, and the temperature of the pure water is room temperature during cleaning.
Preferably, in step S1, the copper sheet is an oxygen-free copper sheet with a thickness of 0.3 mm; the copper sheet surface is cleaned by soaking in 4.5-5.5 wt% of dilute sulfuric acid for 2-4 min, and then three-section countercurrent cleaning is carried out by pure water, wherein the total time of the three-section countercurrent cleaning is more than 60s, and the temperature of the pure water is room temperature during cleaning.
Preferably, in step S2, the slurry used in the slurry layer includes the following raw materials in parts by weight: 55-67 parts of Cu, 30-37 parts of Ag and 15-18 parts of Ti;
the screen printing plate adopted by the screen printing is a stainless steel screen printing plate;
the temperature is controlled to be 20 +/-10 ℃ during screen printing, and the humidity is controlled to be less than or equal to 60% RH;
after drying, the thickness of the slurry layers on the two sides of the ceramic chip is 26 +/-6 mu m.
Preferably, in step S3, the sintering temperature is controlled to 880-900 ℃, the vacuum degree in the furnace is controlled to ≦ 5 × 10-2Pa, and the sintering time is 35-45 min.
Preferably, in step S4, the etching solution includes the following raw materials in parts by weight: 7-8 parts of hydrochloric acid and 3-5 parts of sulfuric acid;
the etching temperature is controlled to be 35 +/-5 ℃, and the etching time is 30 +/-10 min.
Preferably, in step S5, when the fiber laser cutting machine is used for cutting, the cutting depth is controlled to be 30-50%, the laser mode is QCW, the laser power is 150W, the scribing speed is controlled to be 80mm/S, the laser frequency is 12KHz, the duty ratio is 10%, and the laser energy is 80%.
Preferably, in step S6, the concentration of the NaOH solution is 18 to 22 wt%, the cleaning temperature is normal temperature, and the cleaning time is 2 to 3 min;
preferably, in step S7, the slurry etching solution includes the following raw materials in parts by weight: 15-20 parts of hydrogen peroxide, 4.3-5.7 parts of etching additive and 25-30 parts of ammonia water;
the content of TC-ET-A in the etching additive is 20mL/L, TC-ET-B, the content of TC-ET-B in the etching additive is 25mL/L, TC-ET-C, the content of TC-ET-B in the etching additive is 5mL/L, and the balance is deionized water;
etching temperature is controlled to be 20 +/-5 ℃, etching time is controlled to be: 40 plus or minus 10 min.
Preferably, the content of the hydrogen peroxide in the etching solution A (TC-ET-A) is 5V/V% -40V/V%;
the content of ammonia water in the etching solution A (TC-ET-A) is 0.5V/V% -5V/V%;
the etching solution A (TC-ET-A) has a structure containing 0.1-1 wt% of carboxyl and salt (carboxylate) thereof;
the content of the surfactant sulfate in the etching solution A (TC-ET-A) is 0.01-0.05 wt%;
the rest of the etching solution A (TC-ET-A) is deionized water.
Preferably, the etching solution B (TC-ET-B) contains organic amine with the content of 3 to 8 weight percent;
the content of alcohols in the etching solution B (TC-ET-B) is 2 wtV-5 wt%;
the content of sulfuric acid in the etching solution B (TC-ET-B) is 2V/V% -8V/V%;
the hydrogen peroxide content in the etching solution B (TC-ET-B) is 3V/V% -6V/V%;
the rest of the etching solution B (TC-ET-B) is deionized water.
Preferably, the structure of the etching solution C (TC-ET-C) contains 14W/V% -20W/V% of carboxyl and salts (carboxylate) thereof, 3V/V% -5V/V of ammonia water, 5W/V% -8W/V% of alcohol, 6W/V% -10W/V% of organic amine and the balance of deionized water.
The invention also provides a copper-clad liner plate manufactured by the manufacturing method of the copper-clad liner plate.
Compared with the prior art, the invention has the following advantages and beneficial effects:
the copper-clad liner plate manufacturing method optimizes the sequence of process steps and preferably selects process condition parameters of each step (the control of the process condition parameters is the key for obtaining the copper-clad liner plate with good comprehensive performance, and the good comprehensive performance of the obtained copper-clad liner plate can be ensured only if the process condition parameters are controlled in a proper range), so that the bending strength of the obtained copper-clad liner plate is more than or equal to 450 MPa; the temperature impact times are more than 100; the insulation withstand voltage is more than 7 kV; the comprehensive performance index is excellent.
The copper-clad lining plate manufacturing method of the invention has no porcelain concern, so that acidic and alkaline solutions can be selected; the solution concentration selectivity is increased; the production efficiency of the copper-clad lining plate can be greatly improved.
The copper-clad lining plate prepared by the copper-clad lining plate manufacturing method can improve a process window, the selectivity of the solution type for subsequent treatment is increased, the reaction between a NaOH solution and an AlN ceramic chip is strong, and the old technical liquid medicine is directly contacted with the surface of the ceramic chip, so that only an acid washing solution can be selected;
the solution concentration selectivity of the copper-clad liner plate manufacturing method is increased, and the copper-clad liner plate manufacturing method effectively protects the surface of the ceramic chip, so that the high-concentration solution is selected for treatment, and the strength of the ceramic chip is not obviously influenced;
the manufacturing method of the copper-clad lining plate can greatly improve the production efficiency, improve the process window, select high-concentration liquid medicine and obviously reduce the cleaning treatment time, thereby improving the production efficiency of products.
Detailed Description
In order that those skilled in the art will better understand the technical solutions of the present invention, the following description of the preferred embodiments of the present invention is provided in connection with specific examples, which should not be construed as limiting the present patent.
The test methods or test methods described in the following examples are conventional methods unless otherwise specified; the reagents and materials, unless otherwise indicated, are conventionally obtained commercially or prepared by conventional methods.
Example 1:
a method for manufacturing a copper-clad lining plate comprises the following steps:
s1, cleaning the ceramic chip and the copper sheet:
cleaning the surface of the ceramic chip, and then drying at the drying temperature of 80 +/-5 ℃; cleaning the surface of the copper sheet, and then drying at the drying temperature of 80 +/-5 ℃;
s2, printing the paste:
respectively printing slurry layers on two surfaces of the ceramic chip processed in the step S1, wherein the printing mode is silk-screen printing, and then drying at the drying temperature of 100 +/-10 ℃;
s3, sintering:
covering a copper sheet on each of the two slurry layer surfaces of the ceramic chip processed in the step S2, and then sintering in a sintering furnace;
s4, copper etching:
then, etching the copper by using an etching solution to completely etch the part of the copper sheet to be etched; then, cleaning the etching solution on the surface by using pure water, wherein the temperature of the pure water is room temperature during cleaning; then drying at the drying temperature of 85 +/-5 ℃;
s5, cutting:
then cutting the fiber into the required shape and size by using a fiber laser cutting machine;
s6, cleaning:
then, adopting NaOH solution to carry out surface cleaning; then washing away the NaOH solution on the surface by using pure water, wherein the washing time is 30-90 s, and the temperature of the pure water is room temperature during washing; then drying at the drying temperature of 80 ℃;
s7, etching the slurry:
then, carrying out copper etching by adopting a slurry etching solution, and completely etching the part of the slurry layer to be etched until the surface of the ceramic chip is seen; then, cleaning the slurry etching solution on the surface by using pure water, wherein the temperature of the pure water is 75 +/-5 ℃ during cleaning; then drying at the drying temperature of 85 +/-5 ℃;
preferably, in step S1, the ceramic tile is an aluminum nitride (AlN) tile with a thickness of 1 mm; the cleaning of the surface of the ceramic chip is to soak the ceramic chip in 9-11.5 wt% of dilute nitric acid for 100-140 min, then carry out three-section countercurrent cleaning by using pure water, wherein the cleaning time of each section is 30s, and the temperature of the pure water is room temperature during cleaning.
Preferably, in step S1, the copper sheet is an oxygen-free copper sheet with a thickness of 0.3 mm; the copper sheet surface is cleaned by soaking in 4.5-5.5 wt% of dilute sulfuric acid for 2-4 min, and then three-section countercurrent cleaning is carried out by pure water, wherein the total time of the three-section countercurrent cleaning is more than 60s, and the temperature of the pure water is room temperature during cleaning.
Preferably, in step S2, the slurry used in the slurry layer includes the following raw materials in parts by weight: 55-67 parts of Cu, 30-37 parts of Ag and 15-18 parts of Ti;
the screen printing plate adopted by the screen printing is a stainless steel screen printing plate;
the temperature is controlled to be 20 +/-10 ℃ during screen printing, and the humidity is controlled to be less than or equal to 60% RH;
after drying, the thickness of the slurry layers on the two sides of the ceramic chip is 26 +/-6 mu m.
Preferably, in step S3, the sintering temperature is controlled to 880-900 ℃, the vacuum degree in the furnace is controlled to ≦ 5 × 10-2Pa, and the sintering time is 35-45 min.
Preferably, in step S4, the etching solution includes the following raw materials in parts by weight: 7-8 parts of hydrochloric acid and 3-5 parts of sulfuric acid;
the etching temperature is controlled to be 35 +/-5 ℃, and the etching time is 30 +/-10 min.
Preferably, in step S5, when the fiber laser cutting machine is used for cutting, the cutting depth is controlled to be 30-50%, the laser mode is QCW, the laser power is 150W, the scribing speed is controlled to be 80mm/S, the laser frequency is 12KHz, the duty ratio is 10%, and the laser energy is 80%.
Preferably, in step S6, the concentration of the NaOH solution is 18 to 22 wt%, the cleaning temperature is normal temperature, and the cleaning time is 2 to 3 min;
preferably, in step S7, the slurry etching solution includes the following raw materials in parts by weight: 15-20 parts of hydrogen peroxide, 4.3-5.7 parts of etching additive and 25-30 parts of ammonia water;
the content of TC-ET-A in the etching additive is 20mL/L, TC-ET-B, the content of TC-ET-B in the etching additive is 25mL/L, TC-ET-C, the content of TC-ET-B in the etching additive is 5mL/L, and the balance is deionized water;
the content of hydrogen peroxide in the etching solution A (TC-ET-A) is 5V/V% -40V/V%;
the content of ammonia water in the etching solution A (TC-ET-A) is 0.5V/V% -5V/V%;
the etching solution A (TC-ET-A) has a structure containing 0.1-1 wt% of carboxyl and salt (carboxylate) thereof;
the content of the surfactant sulfate in the etching solution A (TC-ET-A) is 0.01-0.05 wt%;
the rest of the etching solution A (TC-ET-A) is deionized water.
The etching solution B (TC-ET-B) contains organic amine with the content of 3 to 8 weight percent;
the content of alcohols in the etching solution B (TC-ET-B) is 2 wtV-5 wt%;
the content of sulfuric acid in the etching solution B (TC-ET-B) is 2V/V% -8V/V%;
the hydrogen peroxide content in the etching solution B (TC-ET-B) is 3V/V% -6V/V%;
the rest of the etching solution B (TC-ET-B) is deionized water.
The etching solution C (TC-ET-C) structurally contains 14W/V-20W/V of carboxyl and salts (carboxylate) thereof, 3V/V-5V/V of ammonia water, 5W/V-8W/V of alcohol, 6W/V-10W/V of organic amine and the balance of deionized water.
Etching temperature is controlled to be 20 +/-5 ℃, etching time is controlled to be: 40 plus or minus 10 min.
The invention also provides a copper-clad liner plate manufactured by the manufacturing method of the copper-clad liner plate.
Example 2:
a method for manufacturing a copper-clad lining plate comprises the following steps:
s1, cleaning the ceramic chip and the copper sheet:
cleaning the surface of the ceramic chip, and then drying at the drying temperature of 75 ℃; cleaning the surface of a copper sheet, and then drying at the drying temperature of 75 ℃;
s2, printing the paste:
respectively printing slurry layers on two surfaces of the ceramic chip processed in the step S1, wherein the printing mode is silk-screen printing, and then drying at the drying temperature of 90 ℃;
s3, sintering:
covering a copper sheet on each of the two slurry layer surfaces of the ceramic chip processed in the step S2, and then sintering in a sintering furnace;
s4, copper etching:
then, etching the copper by using an etching solution to completely etch the part of the copper sheet to be etched; then, cleaning the etching solution on the surface by using pure water, wherein the temperature of the pure water is room temperature during cleaning; then drying at the drying temperature of 80 ℃;
s5, cutting:
then cutting the fiber into the required shape and size by using a fiber laser cutting machine;
s6, cleaning:
then, adopting NaOH solution to carry out surface cleaning; then, washing away the NaOH solution on the surface by using pure water, wherein the washing time is 30s, and the temperature of the pure water is room temperature during washing; then drying at the drying temperature of 80 ℃;
s7, etching the slurry:
then, carrying out copper etching by adopting a slurry etching solution, and completely etching the part of the slurry layer to be etched until the surface of the ceramic chip is seen; then, cleaning the slurry etching solution on the surface by using pure water, wherein the temperature of the pure water is 70 ℃ during cleaning; then drying at the drying temperature of 80 ℃;
in this embodiment, in step S1, the specification of the ceramic tile is an aluminum nitride (AlN) tile with a thickness of 1 mm; the surface of the ceramic chip is cleaned by soaking the ceramic chip in 9 wt% dilute nitric acid for 140min, and then three-section countercurrent cleaning is carried out by adopting pure water, wherein the cleaning time of each section is 30s, and the temperature of the pure water is room temperature during cleaning.
In this embodiment, in step S1, the copper sheet is an oxygen-free copper sheet with a thickness of 0.3 mm; the copper sheet surface is cleaned by soaking in 4.5 wt% dilute sulfuric acid for 4min, and then three-stage countercurrent cleaning is carried out by pure water, wherein the total time of the three-stage countercurrent cleaning is more than 60s, and the temperature of the pure water is room temperature during cleaning.
In this embodiment, in step S2, the slurry used in the slurry layer includes the following raw materials in parts by weight: 55 parts of Cu, 30 parts of Ag and 15 parts of Ti;
the screen printing plate adopted by the screen printing is a stainless steel screen printing plate;
the temperature is controlled to be 10 ℃ during silk-screen printing, and the humidity is controlled to be less than or equal to 60% RH;
after drying, the thickness of the slurry layers on the two sides of the ceramic piece is 20 μm.
In this example, in step S3, the sintering temperature was controlled to 880 ℃, the degree of vacuum in the furnace was controlled to ≦ 5 × 10-2Pa, and the sintering time was 45 min.
In this embodiment, in step S4, the etching solution includes the following raw materials in parts by weight: 7 parts of hydrochloric acid and 3 parts of sulfuric acid;
the etching temperature was controlled at 30 ℃ and the etching time was 40 min.
In this embodiment, in step S5, when the fiber laser cutting machine is used for cutting, the cutting depth is controlled to be 30%, the laser mode is QCW, the laser power is 150W, the scribing speed is controlled to be 80mm/S, the laser frequency is 12KHz, the duty ratio is 10%, and the laser energy is 80%.
In this embodiment, in step S6, the concentration of the NaOH solution is 18 wt%, the cleaning temperature is normal temperature, and the cleaning time is 3 min;
in this embodiment, in step S7, the slurry etching solution includes the following raw materials in parts by weight: 15 parts of hydrogen peroxide, 4.3 parts of etching additive and 25 parts of ammonia water;
the content of TC-ET-A in the etching additive is 20mL/L, TC-ET-B, the content of TC-ET-B in the etching additive is 25mL/L, TC-ET-C, the content of TC-ET-B in the etching additive is 5mL/L, and the balance is deionized water;
the content of hydrogen peroxide in the etching solution A (TC-ET-A) is 13.5V/V%;
the content of ammonia water in the etching solution A (TC-ET-A) is 1.65V/V%;
the etching solution A (TC-ET-A) structurally contains carboxyl and salt (carboxylate) thereof with the content of 0.35 wt%;
the content of the surfactant sulfate in the etching solution A (TC-ET-A) is 0.02 wt%;
the rest of the etching solution A (TC-ET-A) is deionized water.
The etching solution B (TC-ET-B) contains organic amine with the content of 4.5 wt%;
the content of alcohols in the etching solution B (TC-ET-B) is 2.8 wt%;
the content of sulfuric acid in the etching solution B (TC-ET-B) is 4V/V%;
the hydrogen peroxide content in the etching solution B (TC-ET-B) is 3.5V/V%;
the rest of the etching solution B (TC-ET-B) is deionized water.
The etching solution C (TC-ET-C) structurally contains 16W/V% of carboxyl and salts (carboxylates) thereof, 3.5V/V of ammonia water, 5.8W/V% of alcohol, 7W/V% of organic amine and the balance of deionized water.
Etching temperature is controlled to be 15 ℃, etching time: and (5) 50 min.
In the embodiment, the copper-clad liner plate is manufactured by the manufacturing method of the copper-clad liner plate.
Example 3:
a method for manufacturing a copper-clad lining plate comprises the following steps:
s1, cleaning the ceramic chip and the copper sheet:
cleaning the surface of the ceramic chip, and then drying at the drying temperature of 85 ℃; cleaning the surface of a copper sheet, and then drying at the drying temperature of 85 ℃;
s2, printing the paste:
respectively printing slurry layers on two surfaces of the ceramic chip processed in the step S1, wherein the printing mode is silk-screen printing, and then drying at the drying temperature of 110 ℃;
s3, sintering:
covering a copper sheet on each of the two slurry layer surfaces of the ceramic chip processed in the step S2, and then sintering in a sintering furnace;
s4, copper etching:
then, etching the copper by using an etching solution to completely etch the part of the copper sheet to be etched; then, cleaning the etching solution on the surface by using pure water, wherein the temperature of the pure water is room temperature during cleaning; then drying at the drying temperature of 90 ℃;
s5, cutting:
then cutting the fiber into the required shape and size by using a fiber laser cutting machine;
s6, cleaning:
then, adopting NaOH solution to carry out surface cleaning; then washing away the NaOH solution on the surface by using pure water, wherein the washing time is 90s, and the temperature of the pure water is room temperature during washing; then drying at the drying temperature of 80 ℃;
s7, etching the slurry:
then, carrying out copper etching by adopting a slurry etching solution, and completely etching the part of the slurry layer to be etched until the surface of the ceramic chip is seen; then, cleaning the slurry etching solution on the surface by using pure water, wherein the temperature of the pure water is 90 ℃ during cleaning; then drying at the drying temperature of 90 ℃;
in this embodiment, in step S1, the specification of the ceramic tile is an aluminum nitride (AlN) tile with a thickness of 1 mm; the surface of the ceramic chip is cleaned by soaking the ceramic chip in 11.5 wt% dilute nitric acid for 100min, and then three-section countercurrent cleaning is carried out by adopting pure water, wherein the cleaning time of each section is 30s, and the temperature of the pure water is room temperature during cleaning.
In this embodiment, in step S1, the copper sheet is an oxygen-free copper sheet with a thickness of 0.3 mm; the copper sheet surface is cleaned by soaking in 5.5 wt% dilute sulfuric acid for 2min, and then three-stage countercurrent cleaning is carried out by pure water, wherein the total time of the three-stage countercurrent cleaning is more than 60s, and the temperature of the pure water is room temperature during cleaning.
In this embodiment, in step S2, the slurry used in the slurry layer includes the following raw materials in parts by weight: 67 parts of Cu, 37 parts of Ag and 18 parts of Ti;
the screen printing plate adopted by the screen printing is a stainless steel screen printing plate;
the temperature is controlled to be 30 ℃ during screen printing, and the humidity is controlled to be less than or equal to 60% RH;
after drying, the thickness of the slurry layers on the two sides of the ceramic chip is 32 μm.
In this example, in step S3, the sintering temperature was controlled to 900 ℃, the degree of vacuum in the furnace was controlled to ≦ 5 × 10-2Pa, and the sintering time was 35 min.
In this embodiment, in step S4, the etching solution includes the following raw materials in parts by weight: 8 parts of hydrochloric acid and 5 parts of sulfuric acid;
the etching temperature was controlled at 40 ℃ and the etching time was 20 min.
In this embodiment, in step S5, when the fiber laser cutting machine is used for cutting, the cutting depth is controlled to be 50%, the laser mode is QCW, the laser power is 150W, the scribing speed is controlled to be 80mm/S, the laser frequency is 12KHz, the duty ratio is 10%, and the laser energy is 80%.
In this embodiment, in step S6, the concentration of the NaOH solution is 22 wt%, the cleaning temperature is normal temperature, and the cleaning time is 2 min;
in this embodiment, in step S7, the slurry etching solution includes the following raw materials in parts by weight: 15-20 parts of hydrogen peroxide, 4.3-5.7 parts of etching additive and 25-30 parts of ammonia water;
the content of TC-ET-A in the etching additive is 20mL/L, TC-ET-B, the content of TC-ET-B in the etching additive is 25mL/L, TC-ET-C, the content of TC-ET-B in the etching additive is 5mL/L, and the balance is deionized water;
the content of hydrogen peroxide in the etching solution A (TC-ET-A) is 36.5V/V%;
the content of ammonia water in the etching solution A (TC-ET-A) is 4.4V/V%;
the etching solution A (TC-ET-A) structurally contains carboxyl and salt (carboxylate) thereof with the content of 0.77 wt%;
the content of the surfactant sulfate in the etching solution A (TC-ET-A) is 0.045 wt%;
the rest of the etching solution A (TC-ET-A) is deionized water.
The etching solution B (TC-ET-B) contains organic amine with the content of 6.8 wt%;
the content of alcohols in the etching solution B (TC-ET-B) is 4 wt%;
the content of sulfuric acid in the etching solution B (TC-ET-B) is 7V/V%;
the hydrogen peroxide content in the etching solution B (TC-ET-B) is 5.5V/V%;
the rest of the etching solution B (TC-ET-B) is deionized water.
The etching solution C (TC-ET-C) structurally contains 18W/V% of carboxyl and salts (carboxylate) thereof, 4.5V/V of ammonia water, 7.2W/V% of alcohol, 9W/V% of organic amine and the balance of deionized water.
In the embodiment, the copper-clad liner plate is manufactured by the manufacturing method of the copper-clad liner plate.
Example 4:
a method for manufacturing a copper-clad lining plate comprises the following steps:
s1, cleaning the ceramic chip and the copper sheet:
cleaning the surface of the ceramic chip, and then drying at the drying temperature of 80 ℃; cleaning the surface of a copper sheet, and then drying at the drying temperature of 80 ℃;
s2, printing the paste:
respectively printing slurry layers on two surfaces of the ceramic chip processed in the step S1, wherein the printing mode is silk-screen printing, and then drying at the drying temperature of 100 ℃;
s3, sintering:
covering a copper sheet on each of the two slurry layer surfaces of the ceramic chip processed in the step S2, and then sintering in a sintering furnace;
s4, copper etching:
then, etching the copper by using an etching solution to completely etch the part of the copper sheet to be etched; then, cleaning the etching solution on the surface by using pure water, wherein the temperature of the pure water is room temperature during cleaning; then drying at the drying temperature of 85 ℃;
s5, cutting:
then cutting the fiber into the required shape and size by using a fiber laser cutting machine;
s6, cleaning:
then, adopting NaOH solution to carry out surface cleaning; then washing away the NaOH solution on the surface by using pure water, wherein the washing time is 30-90 s, and the temperature of the pure water is room temperature during washing; then drying at the drying temperature of 80 ℃;
s7, etching the slurry:
then, carrying out copper etching by adopting a slurry etching solution, and completely etching the part of the slurry layer to be etched until the surface of the ceramic chip is seen; then, cleaning the slurry etching solution on the surface by using pure water, wherein the temperature of the pure water is 75 ℃ during cleaning; then drying at the drying temperature of 85 ℃;
in this embodiment, in step S1, the specification of the ceramic tile is an aluminum nitride (AlN) tile with a thickness of 1 mm; the surface of the ceramic chip is cleaned by soaking the ceramic chip in 10.2 wt% dilute nitric acid for 120min, and then three-section countercurrent cleaning is carried out by adopting pure water, wherein the cleaning time of each section is 30s, and the temperature of the pure water is room temperature during cleaning.
In this embodiment, in step S1, the copper sheet is an oxygen-free copper sheet with a thickness of 0.3 mm; the copper sheet surface is cleaned by soaking in 5 wt% dilute sulfuric acid for 3min, and then three-stage countercurrent cleaning is carried out by pure water, wherein the total time of the three-stage countercurrent cleaning is more than 60s, and the temperature of the pure water is room temperature during cleaning.
In this embodiment, in step S2, the slurry used in the slurry layer includes the following raw materials in parts by weight: 61 parts of Cu, 33.5 parts of Ag and 16.5 parts of Ti;
the screen printing plate adopted by the screen printing is a stainless steel screen printing plate;
the temperature is controlled to be 20 ℃ and the humidity is controlled to be less than or equal to 60 percent RH during the silk-screen printing;
after drying, the thickness of the slurry layers on the two sides of the ceramic chip is 26 μm.
In this example, in step S3, the sintering temperature was controlled to 890 ℃, the degree of vacuum in the furnace was controlled to ≦ 5X 10-2Pa, and the sintering time was 40 min.
In this embodiment, in step S4, the etching solution includes the following raw materials in parts by weight: 7.5 parts of hydrochloric acid and 4 parts of sulfuric acid;
the etching temperature was controlled at 35 ℃ and the etching time was 30 min.
In this embodiment, in step S5, when the fiber laser cutting machine is used for cutting, the cutting depth is controlled to be 40%, the laser mode is QCW, the laser power is 150W, the scribing speed is controlled to be 80mm/S, the laser frequency is 12KHz, the duty ratio is 10%, and the laser energy is 80%.
In this embodiment, in step S6, the concentration of the NaOH solution is 20 wt%, the cleaning temperature is normal temperature, and the cleaning time is 2.5 min;
in this embodiment, in step S7, the slurry etching solution includes the following raw materials in parts by weight: 15-20 parts of hydrogen peroxide, 4.3-5.7 parts of etching additive and 25-30 parts of ammonia water;
the content of TC-ET-A in the etching additive is 20mL/L, TC-ET-B, the content of TC-ET-B in the etching additive is 25mL/L, TC-ET-C, the content of TC-ET-B in the etching additive is 5mL/L, and the balance is deionized water;
the content of hydrogen peroxide in the etching solution A (TC-ET-A) is 23V/V%;
the content of ammonia water in the etching solution A (TC-ET-A) is 3V/V%;
the etching solution A (TC-ET-A) structurally contains carboxyl and salt (carboxylate) thereof with the content of 0.6 wt%;
the content of the surfactant sulfate in the etching solution A (TC-ET-A) is 0.03 wt%;
the rest of the etching solution A (TC-ET-A) is deionized water.
The etching solution B (TC-ET-B) contains organic amine with the content of 5.5 wt%;
the content of alcohols in the etching solution B (TC-ET-B) is 3.5 wt%;
the content of sulfuric acid in the etching solution B (TC-ET-B) is 5V/V%;
the content of hydrogen peroxide in the etching solution B (TC-ET-B) is 4.5V/V%;
the rest of the etching solution B (TC-ET-B) is deionized water.
The etching solution C (TC-ET-C) structurally contains 17W/V% of carboxyl and salts (carboxylate) thereof, 4V/V of ammonia water, 6.5W/V% of alcohol, 8W/V% of organic amine and the balance of deionized water.
In the embodiment, the copper-clad liner plate is manufactured by the manufacturing method of the copper-clad liner plate.
The following performance tests were performed on the copper-clad laminates manufactured by the copper-clad laminate manufacturing methods described in embodiments 2 to 4 of the present invention, and the test results are shown in table 1:
in table 1, after the slurry etching, that is, in the method for manufacturing a copper-clad backing plate according to embodiment 4 of the present invention, the sequence of steps S5, S6, and S7 is changed to S7, S5, and S6, the other steps are completely the same as those in embodiment 4 of the present invention, the manufactured copper-clad backing plate is processed by using different types of solutions, and the strength of the processed ceramic chip is compared with that of the ceramic chip before processing;
before etching, the copper-clad lining board prepared by the copper-clad lining board manufacturing method in embodiment 4 of the invention is processed by different solution types, and the strength of the processed ceramic chip is compared with that of the ceramic chip before processing.
TABLE 1
| Cutting sequence | Type of solution | Time of treatment | Effect of treatment | Ceramic tile strength status |
| After etching of the slurry | 5％HSO4 | 30min | Residual Al | 1 |
| After etching of the slurry | 5％NaoH | 30min | Has no residue | 2 |
| After etching of the slurry | 20％NaoH | 5min | Has no residue | 3 |
| Before etching of slurry | 5％NaoH | 30min | Has no residue | 0 |
| Before etching of slurry | 10％NaoH | 10min | Has no residue | 0 |
| Before etching of slurry | 20％NaoH | 5min | Has no residue | 0 |
Note: the ceramic chip strength state shows that ' 0 ' has no influence, the ceramic chip strength is reduced by less than 1 percent, 1 ' is slightly reduced, the ceramic chip strength is reduced by less than 1-5 percent, 2 ' is reduced, 3 ' is seriously reduced, and the ceramic chip strength is reduced by more than 5 percent.
In addition, tests show that the copper-clad backing plates prepared by the copper-clad backing plate manufacturing methods in the embodiments 2 to 3 of the invention are treated by different solution types, and the strength of the ceramic chip after treatment is compared with that before treatment, and the method has no influence and is the same as the comparative example 4.
The bending strength of the copper-clad liner plate prepared by the copper-clad liner plate manufacturing method in the embodiments 2 to 4 is tested to be not less than 450 MPa; the temperature impact times are more than 100; the insulation withstand voltage is more than 7 kV; the comprehensive performance index is excellent.
The above is only a preferred embodiment of the present invention, and it should be noted that the above preferred embodiment should not be considered as limiting the present invention, and the protection scope of the present invention should be subject to the scope defined by the claims. It will be apparent to those skilled in the art that various modifications and adaptations can be made without departing from the spirit and scope of the invention, and these modifications and adaptations should be considered within the scope of the invention.
Claims (10)
1. The manufacturing method of the copper-clad lining plate is characterized by comprising the following steps:
s1, cleaning the ceramic chip and the copper sheet:
cleaning the surface of the ceramic chip, and then drying at the drying temperature of 80 +/-5 ℃; cleaning the surface of the copper sheet, and then drying at the drying temperature of 80 +/-5 ℃;
s2, printing the paste:
respectively printing slurry layers on two surfaces of the ceramic chip processed in the step S1, wherein the printing mode is silk-screen printing, and then drying at the drying temperature of 100 +/-10 ℃;
s3, sintering:
covering a copper sheet on each of the two slurry layer surfaces of the ceramic chip processed in the step S2, and then sintering in a sintering furnace;
s4, copper etching:
then, etching the copper by using an etching solution to completely etch the part of the copper sheet to be etched; then, cleaning the etching solution on the surface by using pure water, wherein the temperature of the pure water is room temperature during cleaning; then drying at the drying temperature of 85 +/-5 ℃;
s5, cutting:
then cutting the fiber into the required shape and size by using a fiber laser cutting machine;
s6, cleaning:
then, adopting NaOH solution to carry out surface cleaning; then washing away the NaOH solution on the surface by using pure water, wherein the washing time is 30-90 s, and the temperature of the pure water is room temperature during washing; then drying at the drying temperature of 80 ℃;
s7, etching the slurry:
then, carrying out copper etching by adopting a slurry etching solution, and completely etching the part of the slurry layer to be etched until the surface of the ceramic chip is seen; then, cleaning the slurry etching solution on the surface by using pure water, wherein the temperature of the pure water is 75 +/-5 ℃ during cleaning; then drying at 85 +/-5 ℃.
2. The method of claim 1, wherein in step S1, the ceramic sheets are aluminum nitride (AlN) sheets with a thickness of 1 mm; the cleaning of the surface of the ceramic chip is to soak the ceramic chip in 9-11.5 wt% of dilute nitric acid for 100-140 min, then carry out three-section countercurrent cleaning by using pure water, wherein the cleaning time of each section is 30s, and the temperature of the pure water is room temperature during cleaning.
3. The copper-clad laminate manufacturing method according to claim 1, wherein in step S1, the specification of the copper sheet is an oxygen-free copper sheet with a thickness of 0.3 mm; the copper sheet surface is cleaned by soaking in 4.5-5.5 wt% of dilute sulfuric acid for 2-4 min, and then three-section countercurrent cleaning is carried out by pure water, wherein the total time of the three-section countercurrent cleaning is more than 60s, and the temperature of the pure water is room temperature during cleaning.
4. The method for manufacturing a copper-clad lining board according to claim 1, wherein in step S2, the paste used in the paste layer comprises the following raw materials in parts by weight: 55-67 parts of Cu, 30-37 parts of Ag and 15-18 parts of Ti;
the screen printing plate adopted by the screen printing is a stainless steel screen printing plate;
the temperature is controlled to be 20 +/-10 ℃ during screen printing, and the humidity is controlled to be less than or equal to 60% RH;
after drying, the thickness of the slurry layers on the two sides of the ceramic chip is 26 +/-6 mu m.
5. The method of claim 1, wherein in step S3, the sintering temperature is controlled to 880 to 900 ℃, the vacuum degree in the furnace is controlled to ≦ 5 × 10 "2 Pa, and the sintering time is 35 to 45 min.
6. The method for manufacturing a copper-clad laminate according to claim 1, wherein in step S4, the etching solution comprises the following raw materials in parts by weight: 7-8 parts of hydrochloric acid and 3-5 parts of sulfuric acid;
the etching temperature is controlled to be 35 +/-5 ℃, and the etching time is 30 +/-10 min.
7. The method for manufacturing a copper-clad lining board according to claim 1, wherein in step S5, when a fiber laser cutting machine is used for cutting, the cutting depth is controlled to be 30-50%, the laser mode is QCW, the laser power is 150W, the scribing speed is controlled to be 80mm/S, the laser frequency is 12KHz, the duty ratio is 10%, and the laser energy is 80%.
8. The method for manufacturing a copper-clad lining board according to claim 1, wherein in step S6, the concentration of the NaOH solution is 18-22 wt%, the cleaning temperature is normal temperature, and the cleaning time is 2-3 min.
9. The method for manufacturing a copper-clad laminate according to claim 1, wherein in step S7, the slurry etching solution comprises the following raw materials in parts by weight: 15-20 parts of hydrogen peroxide, 4.3-5.7 parts of etching additive and 25-30 parts of ammonia water;
the content of TC-ET-A in the etching additive is 20mL/L, TC-ET-B, the content of TC-ET-B in the etching additive is 25mL/L, TC-ET-C, the content of TC-ET-B in the etching additive is 5mL/L, and the balance is deionized water;
etching temperature is controlled to be 20 +/-5 ℃, etching time is controlled to be: 40 plus or minus 10 min.
10. A copper-clad laminate, characterized by being produced by the method for producing a copper-clad laminate according to any one of claims 1 to 6.
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Denomination of invention: A manufacturing method of copper clad liner Effective date of registration: 20220629 Granted publication date: 20211207 Pledgee: Shaoxing shuimuwan District small and micro comprehensive sub branch of Huaxia Bank Co.,Ltd. Pledgor: Shaoxing Dehui semiconductor materials Co.,Ltd.|ZHEJIANG TC CERAMIC ELECTRONIC Co.,Ltd. Registration number: Y2022330001167 |
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Granted publication date: 20211207 Pledgee: Shaoxing shuimuwan District small and micro comprehensive sub branch of Huaxia Bank Co.,Ltd. Pledgor: Shaoxing Dehui semiconductor materials Co.,Ltd.|ZHEJIANG TC CERAMIC ELECTRONIC Co.,Ltd. Registration number: Y2022330001167 |
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