CN112455055B - Method for improving interlayer adhesion - Google Patents

Method for improving interlayer adhesion Download PDF

Info

Publication number
CN112455055B
CN112455055B CN202011235529.3A CN202011235529A CN112455055B CN 112455055 B CN112455055 B CN 112455055B CN 202011235529 A CN202011235529 A CN 202011235529A CN 112455055 B CN112455055 B CN 112455055B
Authority
CN
China
Prior art keywords
pressure
glue solution
additional layer
connecting piece
vibration exciter
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202011235529.3A
Other languages
Chinese (zh)
Other versions
CN112455055A (en
Inventor
赵树武
荣田
魏乐愚
贺龙
赵东
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Beijing Xinghang Electromechanical Equipment Co Ltd
Original Assignee
Beijing Xinghang Electromechanical Equipment Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Beijing Xinghang Electromechanical Equipment Co Ltd filed Critical Beijing Xinghang Electromechanical Equipment Co Ltd
Priority to CN202011235529.3A priority Critical patent/CN112455055B/en
Publication of CN112455055A publication Critical patent/CN112455055A/en
Application granted granted Critical
Publication of CN112455055B publication Critical patent/CN112455055B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/12Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/10Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00Ancillary operations in connection with laminating processes
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02TCLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO TRANSPORTATION
    • Y02T50/00Aeronautics or air transport
    • Y02T50/40Weight reduction

Landscapes

  • Physics & Mathematics (AREA)
  • Fluid Mechanics (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

The invention discloses a method for improving interlayer bonding, belongs to the technical field of interlayer bonding, and solves the problems that in the prior art, when glue solution is in contact with a substrate and an additional layer, the distribution is uneven, partial bubbles are generated, the bonding effect is seriously influenced, and the like. The method comprises the following steps: step 1, determining the activation time T of glue solution and the maximum pressure P which can be borne by an additional layer; step 2, after the additional layer is bonded to the substrate through glue solution to prepare the composite material, placing the composite material, the force application device and the ultrasonic vibration exciter in a vacuum unit; step 3, adjusting the force application device to the required pressure P; step 4, adjusting the pressure in the vacuum unit to a negative pressure; and 5, setting the working time of the ultrasonic vibration exciter to be T, starting the ultrasonic vibration exciter to work, automatically stopping working after the time T, and finishing glue solution curing. The invention improves the bonding property of the composite material.

Description

Method for improving interlayer adhesion
Technical Field
The invention belongs to the technical field of interlayer bonding, and particularly relates to a method for improving interlayer bonding.
Background
Along with the flying speed of the product is accelerated gradually, the phenomenon of pneumatic heating is very serious in the flying process, the temperature of the surface of the shell is very high (when the flying speed is 5M, the heating temperature of the gas on the outer surface can reach thousands of degrees), and extremely adverse effects can be generated on internal equipment and the self structure. The thermal insulation material layer is utilized to change the surface thermophysical characteristics of the product, thereby ensuring that structural catastrophic failure does not occur due to pneumatic overheating in the flight process and simultaneously protecting the internal equipment of the product from failure due to high temperature.
The heat insulation effect and quality of the heat insulation material layer are directly related to the process control of the implementation process and depend on the adhesive force and the bonding force of the heat insulation material layer to materials such as titanium alloy and the like. The heat insulation material layer is bonded on the bulkhead through the glue solution during bonding, the contact degree of the glue solution and the bulkhead during bonding directly influences the service life of the heat insulation layer, the consumption and cost of the glue solution material, the stress of the glue solution, the bonding strength of the glue solution and the like, and in the bonding process at the present stage, the glue solution is not uniformly distributed when contacting with the bulkhead through external forces such as manpower and machinery or modes such as vacuumizing and extrusion, so that partial bubbles can be generated, and the bonding effect is seriously influenced.
Disclosure of Invention
In view of the above analysis, the present invention aims to provide a method for improving interlayer adhesion, so as to solve the problems in the prior art that when a glue solution contacts a substrate and an additional layer, the distribution is not uniform, partial bubbles are generated, and the adhesion effect is seriously affected.
The purpose of the invention is mainly realized by the following technical scheme:
a method of improving interlayer adhesion, the method comprising the steps of:
step 1, determining the activation time T of glue solution and the maximum pressure P which can be borne by an additional layer;
step 2, bonding the additional layer to the substrate through glue solution to prepare a composite material, and then placing the composite material in a vacuum unit;
step 3, adjusting a force application device in the vacuum unit to enable the force application device to apply pressure on the additional layer to reach required pressure P;
step 4, adjusting the pressure in the vacuum unit to negative pressure;
and 5, setting the working time of the ultrasonic vibration exciter in the vacuum unit to be T, starting the ultrasonic vibration exciter, automatically stopping working after the T time, and finishing the glue solution curing.
In one possible design, step 2, the composite material is prepared before the substrates are assembled into a product, and the vacuum unit is a vacuum box.
In one possible design, step 2, the additional layers are bonded after the substrates are assembled into the product, and the vacuum unit is a vacuum bag that envelopes the entire product.
In one possible design, the required pressure P in step 3 is 65% to 75% P.
In a possible design, the vibration exciter further comprises a vibration exciter box, the ultrasonic vibration exciter is placed in the vibration exciter box, a first connecting piece is arranged on the vibration exciter box, and the force application device is connected with the vibration exciter box through the first connecting piece.
In one possible design, the force application device comprises a support plate, a support frame and a pressure adjustment unit;
the supporting frame is connected with one side of the supporting plate, the other side of the supporting plate is a working side, and the working side is attached to the additional layer; more than 1 pressure sensor is arranged on the working side of the supporting plate;
the supporting frame comprises a base and a second connecting piece, the base is connected with the supporting plate, and the second connecting piece is arranged in the center of the base;
two ends of the pressure adjusting unit are respectively connected with the first connecting piece and the second connecting piece.
In one possible design, the pressure adjusting unit is a screw, and a rotating handle is arranged on the screw;
two ends of the screw rod are respectively in threaded connection with the first connecting piece and the second connecting piece, and the length of the screw rod is adjusted by rotating the rotating handle.
In a possible design, the two ends of the screw rod are also respectively provided with a first locking handle and a second locking handle for locking the screw rod.
In one possible design, the support plate shape matches the shape of the additional layer.
In one possible design, the base and the support plate are detachably connected.
Compared with the prior art, the invention can at least realize one of the following technical effects:
1) the original static liquid can flow by utilizing ultrasonic waves, and the generation mechanism of the flow is ultrasonic cavitation and acoustic streaming. The invention provides a method for improving interlayer bonding by utilizing the mechanism, which promotes the glue solution between an additional layer and a substrate to generate micro-flow through an ultrasonic vibration exciter and applies certain pressure through a force application device, assists in removing residual bubbles in the glue solution and promotes the glue solution to be reasonably and uniformly distributed, so that the additional layer, the glue solution and the substrate are fully attached, and the method for improving the bonding effect can effectively remove bubbles in the bonding glue solution, improve the bonding effect and has simple and convenient operation process.
2) The pressure P applied to the additional layer is controlled to be 65-75% P, so that the bubble extrusion rate can be improved, the uniformity of glue solution in the composite material can be improved, and the damage of the additional layer caused by overlarge pressure can be prevented.
3) In order to improve the discharge rate of bubbles in the glue solution and improve the discharge effect of the bubbles, the invention is also provided with a vacuum unit, and a negative pressure environment is formed outside the force application device, the ultrasonic vibration exciter and the composite material.
4) The force application devices are arranged in 1 or more than one number, so that a plurality of groups of composite materials can be processed at the same time, and the processing efficiency of the composite materials is improved.
5) The base and the supporting plate are detachably connected, so that the device is suitable for additional layers with different shapes, and the applicability of the device is improved. The shape of the supporting plate is matched with that of the heat insulating material layer, the supporting plate can be replaced independently, and the shape of the supporting plate can be designed into a corresponding conformal structure according to the specific conditions of the additional layer.
6) The screw rod is the hard material screw rod of threaded structure, and the sleeve that sets up on the base and vibration exciter put the box all is provided with the internal thread, and the screw rod can with first connecting piece and second connecting piece threaded connection, and the adjustment screw rod length is rotated to the rotatory handle of accessible, and first locking handle, second locking handle can be in the screw rod adjustment suitable back with locking from top to bottom, guarantee that the screw rod is stable to guarantee that exerted pressure is stable.
Additional features and advantages of the invention will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by the practice of the invention. The objectives and other advantages of the invention will be realized and attained by the structure particularly pointed out in the written description and drawings.
Drawings
The drawings are only for purposes of illustrating particular embodiments and are not to be construed as limiting the invention, wherein like reference numerals are used to designate like parts throughout.
FIG. 1 is a schematic view of the apparatus of the present invention;
FIG. 2 is another schematic view of the apparatus of the present invention;
FIG. 3 is a schematic view of a pressure sensor arrangement;
fig. 4 is a schematic view of a detachable structure.
Reference numerals:
1-a support plate; 2-a pressure sensor; 3-a base; 4-a first connector; 5-a first locking handle; 6-rotating the handle; 7-a second locking handle; 8-a second connector; 9-a vacuum pump; 10-a vibration exciter box; 11-an ultrasonic vibration exciter; 12-a screw; 13-vacuum unit-14-vacuum-pumping port; 15-vacuum line; 16-matrix, 17-glue solution; 18-an additional layer.
Detailed Description
A method of improving interlayer adhesion is described in further detail below with reference to specific examples, which are provided for purposes of comparison and explanation only, and the present invention is not limited to these examples.
It will be understood that, although the terms first, second, third, etc. may be used herein to describe various elements, components, regions, layers and/or sections, these elements, components, regions, layers and/or sections should not be limited by these terms. These terms are only used to distinguish one element, component, region, layer or section from another region, layer or section. Thus, a first element, component, region, layer or section discussed below could be termed a second element, component, region, layer or section without departing from the teachings of the present invention.
Spatially relative terms such as "below," "beneath," "above," "over," and the like may be used herein for ease of description to describe one element or feature's relationship to another element or feature as illustrated in the figures. It will be understood that the spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, when the device in the figures is turned over, elements described as "below" or "beneath" other elements or features would then be oriented "above" the other elements or features. Thus, the exemplary term "below" can encompass both an orientation of above and below. The device may be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.
The additional layer 18 is bonded to the substrate 16 by the glue 17 to form a composite material, and the additional layer 18 may be a heat insulating material layer and the substrate 16 may be a bulkhead, for example. In the prior art, during the bonding process, the glue solution 17 may be unevenly distributed when contacting the additional layer 18 and the substrate 16, and partial bubbles are generated, which seriously affects the bonding effect. In order to solve the above problems, the present invention provides a method of improving interlayer adhesion.
A method of improving interlayer adhesion, the method comprising the steps of:
step 1, determining the activation time T of glue solution and the maximum pressure P which can be borne by an additional layer;
step 2, after the additional layer is bonded to the substrate through glue solution to prepare the composite material, placing the composite material in a vacuum unit;
step 3, adjusting a force application device in the vacuum unit to enable the force application device to apply pressure on the additional layer to reach required pressure P;
step 4, adjusting the pressure in the vacuum unit to negative pressure;
and 5, setting the working time of the ultrasonic vibration exciter in the vacuum unit to be T, starting the ultrasonic vibration exciter, transmitting ultrasonic waves to the composite material through the force application device, automatically stopping working after the time of T, and finishing glue solution curing.
The vacuum unit 13 in step 2 is a vacuum box or a vacuum bag. The composite material is prepared prior to assembly of the substrate 16 into a product and is treated with a vacuum box, the inner walls of which provide support for the composite material. When the substrate 16 is assembled into a product and the additional layer 18 is applied, the entire product is enveloped by a vacuum bag that provides structural support for the product into which the substrate 16 is assembled. The product with enough tightness for the cabin body of the product can be directly vacuumized to form a negative pressure environment.
The device for improving interlayer adhesion further comprises a vibration exciter box 10, the ultrasonic vibration exciter 11 is placed in the vibration exciter box 10, a first connecting piece 4 is arranged on the vibration exciter box 10, and the force application device is connected with the vibration exciter box 10 through the first connecting piece 4. The force application device comprises a support plate 1, a support frame and a pressure adjusting unit; the supporting frame is connected with one side of the supporting plate 1, the other side of the supporting plate 1 is a working side, and the working side is attached to the additional layer 18; more than 1 pressure sensors 2 are arranged on the working side of the supporting plate 1; the supporting frame comprises a base 3 and a second connecting piece 8, the base 3 is connected with the supporting plate 1, and the second connecting piece 8 is arranged at the center of the base 3; the two ends of the pressure regulating unit are respectively connected with the first connecting piece 4 and the second connecting piece 8.
In one embodiment, the pressure adjusting unit is a screw 12, and the screw 12 is provided with a rotating handle 6; two ends of the screw 12 are respectively in threaded connection with the first connecting piece 4 and the second connecting piece 8, and the length of the screw 12 is adjusted by rotating the rotating handle 6. And a first locking handle 5 and a second locking handle 7 are respectively arranged at two ends of the screw rod and used for locking the screw rod 12. The support plate 1 is shape matched to the additional layer 18. The base 3 is detachably connected with the supporting plate 1.
The pressure adjusting device in step 3 is a screw 12, the length of the screw 12 is adjusted by using a rotary handle 6, a pressure value P transmitted by the pressure sensor 2 is observed, and when the pressure value P is about 65-75% P, the first locking handle 5 and the second locking handle 7 are fixed. The pressure intensity is controlled to be 65-75% P, so that the bubble extrusion rate can be improved, the uniformity of the glue solution 17 can be improved, and the damage of the additional layer 18 caused by overlarge pressure can be prevented. Preferably P is controlled at 70% P.
Specifically, the device for implementing the method for improving interlayer adhesion may be: the device for improving interlayer adhesion comprises a force application device and an ultrasonic vibration exciter 11; the ultrasonic vibration exciter 11 is connected with the force application device; the ultrasonic vibration exciter 11 is used for releasing vibration waves to promote interlayer adhesion; the force application device is used for applying pressure to the outermost layer. Interlayer bonding is the bonding between an additional layer and a substrate.
The original static liquid can flow by utilizing ultrasonic waves, and the generation mechanism of the flow is ultrasonic cavitation and acoustic streaming. The device for improving the interlayer bonding is provided by utilizing the mechanism, and is characterized in that the ultrasonic vibration exciter 11 is used for promoting the glue solution 17 between the additional layer 18 and the substrate 16 to generate micro-flow and applying a certain pressure through the force application device, so that the residual bubbles in the glue solution 17 are removed in an auxiliary manner, the glue solution 17 is promoted to be reasonably and uniformly distributed, the additional layer 18, the glue solution 17 and the substrate 16 are fully attached, the bonding effect is improved by the method for improving the bonding effect, and the operation process is simple and convenient. The power range of the ultrasonic vibration exciter is 0.5-10 kw. The removal rate of bubbles of the interlayer glue solution is more than 30%, the bonding area of the glue solution, the additional layer and the substrate is increased, and the interlayer bonding performance is improved.
In order to increase the discharge rate of the bubbles in the glue solution 17 and improve the bubble discharge effect, a vacuum unit 13 may be further provided to form a negative pressure environment outside the force application device, the ultrasonic vibration exciter 11 and the composite material. The vacuum pump 9 is connected with a vacuum pumping port 14 on the vacuum unit 13 through a vacuum pipeline 15, the vacuum pump 9 can monitor the pressure in the vacuum unit 13 in real time, and the pumping speed and the pumping time of the vacuum pump 9 are set according to the negative pressure to be achieved.
Specifically, in one embodiment, the additional layer 18 is bonded before the substrate 16 is assembled into the product (i.e., the composite material is prepared and then the product is assembled from the composite material), in this case, the vacuum unit 13 may be a vacuum box, the force applying device, the ultrasonic exciter 11 and the composite material are all placed in the vacuum box, and the vacuum box is evacuated by the vacuum pump 9 to form a negative pressure environment.
In another embodiment, the substrate 16 is already assembled into a product (large products cannot be placed in a vacuum chamber) and then a layer of thermal insulation material is bonded to the interior of the product chamber. At this time, the whole bonded product can be enveloped by a vacuum bag, isolated from the external environment and kept in a plurality of pore channels for extracting internal gas.
For some products with good air-tight effect and vacuum extraction condition, the outer surface of the substrate 16 can be directly isolated from the external environment to form negative pressure atmosphere.
The device for improving interlayer adhesion further comprises a vibration exciter box 10, an ultrasonic vibration exciter 11 is placed in the vibration exciter box 10, and the vibration exciter box 10 is connected with a force application device. The vibration exciter box 10 is provided with 1 or more first connecting pieces 4, and the force application device is connected with the vibration exciter box 10 through the first connecting pieces. In order to improve the material processing efficiency, more than 1 force application device is arranged, and each force application device is connected with the vibration exciter box 10.
Further, when the vacuum unit 13 is a vacuum box, the exciter case 10 is fixedly installed at a central portion of the vacuum box in order to improve convenience of adjustment of the force applying device and stability of the force application. When the vacuum unit 13 adopts a vacuum bag, the vibration exciter box 10 is fixed inside the product.
Specifically, the force application device comprises a support plate 1, a support frame and a pressure adjusting unit; the support frame is connected with one side (such as the top surface) of the support plate 1, and the other side (such as the bottom surface) of the support plate 1 is attached with the additional layer 18; as shown in fig. 3, more than 1 pressure sensor 2 is arranged on the joint side of the support plate 1 and the additional layer, and the pressure sensors 2 are uniformly arranged with a proper number of sensors according to the shape and size of the support plate 1, so as to collect pressure values at different contact positions and improve the accuracy of pressure measurement; one end of the pressure adjusting unit is connected with the supporting frame, and the other end of the pressure adjusting unit is connected with the vibration exciter box 10.
Specifically, the support frame includes base 3 and second connecting piece 8, and base 3 is connected with backup pad 1, and second connecting piece 8 sets up the central point at base 3 and puts. The pressure regulating unit is connected to the second connection member 8 and the first connection member 4, respectively.
Base 3 includes lateral wall and roof, and 3 longitudinal sections of base are "door" shape structure, and the lateral wall setting improves backup pad 1 atress homogeneity in the position that is close to backup pad 1 edge to provide even pressure for combined material. Illustratively, the base 3 may be hollow cubic or hollow cylindrical.
In order to adapt the device to additional layers 18 of different shapes and improve the applicability of the device, the base 3 is detachably connected with the supporting plate 1. The shape of the attaching side of the support plate 1 and the additional layer is matched with the shape of the additional layer 18 (such as an insulation material layer), the support plate 1 can be replaced independently, and the shape of the support plate 1 can be designed into a corresponding conformal structure or a conformal structure according to the specific situation of the additional layer 18.
In particular, the base 3 and the support plate 1 are detachably connected. Illustratively, the detachable structure is a snap connection, as shown in fig. 4, a bayonet joint is arranged below the base 3, the lower part of the bayonet joint is convexly arranged, in order to reduce the abrasion of the bayonet joint, further, the edge of the convex part is arranged in an arc shape, and the bottom of the bayonet joint is arranged in a fillet; more than 2 clamping joints are arranged, and jacks are arranged at the positions, corresponding to the clamping joints, of the supporting plate 1; be provided with the elastic component on the inside lateral wall of jack, the elastic component is including blocking pearl and spring, blocks pearl and spring coupling, and when joint inserts the jack, to the jack outside extrusion card pearl, after joint inserts the jack, the spring extrudees the card pearl to the jack inboard, blocks the top that the pearl just is in protruding position, prevents that the joint from deviating from.
In one embodiment, the pressure adjusting unit is a screw 12, both ends of the screw 12 are provided with threads, the second connecting piece 8 and the first connecting piece 4 are sleeves provided with internal threads, the screw 12 is provided with a rotating handle 6, a first locking handle 5 and a second locking handle 7, the rotating handle 6 is arranged in the middle of the screw 12, and the first locking handle 5 and the second locking handle 7 are respectively arranged at both ends of the screw 12; one end of a screw 12 is in threaded connection with a sleeve (a second connecting piece 8) on the base 3, the other end of the screw is in threaded connection with a sleeve (a first connecting piece 4) at the upper end of the vibration exciter box 10, and the screw 12 is rotated to adjust the height of the screw 12, so that the pressure applied to the additional layer is adjusted; after the required pressure is adjusted, the two ends of the screw 12 are respectively locked on the screw 12 through the first locking handle 5 and the second locking handle 7.
In another embodiment, in order to improve the efficiency and accuracy of pressure regulation, the pressure regulation unit is a linear electric cylinder which converts the rotary motion of a servo motor into linear motion, and the linear motion speed and position can be accurately controlled, so that the pressure applied to the additional layer by the pressure regulation unit can be accurately regulated.
Example 1
A method of improving interlayer adhesion using the apparatus of example 1, comprising the steps of:
step 1, determining that the activation time of the glue solution 17 is 50min, and the maximum pressure born by the heat-insulating material layer is 0.5 MPa;
step 2, after the heat insulation material is bonded to the bulkhead through glue solution 17 to prepare a composite material, the composite material, a force application device and an ultrasonic vibration exciter 11 are placed in a vacuum bag;
step 3, adjusting the rotating handle 6 according to the readings of the pressure sensor, and fixing the first locking handle 5 and the second locking handle 7 when the readings of the pressure sensor 2 are 0.35 MPa;
step 4, adjusting the pressure in the vacuum unit 13 to negative pressure;
and 5, setting the working time of the ultrasonic vibration exciter 11 to be 50min, starting the ultrasonic vibration exciter 11 to work, automatically stopping the work after 50min, and finishing curing the glue solution 17.
Example 2
An apparatus for improving interlayer adhesion is provided, and is used for realizing a method for improving interlayer adhesion, as shown in fig. 1 and fig. 2, and comprises an ultrasonic exciter 11, an exciter box 10, a force application device and a vacuum bag.
Ultrasonic vibration exciter 11 is placed in vibration exciter box 10, and vibration exciter box 10 respectively sets up a sleeve from top to bottom, and force applying device is provided with 2, and is connected with vibration exciter box 10 through two sleeves from top to bottom respectively, and 2 coaxial setting of force applying device. The vacuum bag is connected to a vacuum pump 9 via a vacuum hole.
The force application device comprises a support plate 1, a support frame and a screw 12, wherein a rotating handle 6, a first locking handle 5 and a second locking handle 7 are arranged on the screw 12.
Example 3
The present embodiment provides an apparatus for improving interlayer adhesion, which is used for implementing a method for improving interlayer adhesion, and the structure of the apparatus is substantially the same as that of the apparatus for improving interlayer adhesion provided in embodiment 1, the apparatus in this embodiment may be vertically placed or horizontally placed, with the difference that the vacuum unit 13 in this embodiment is a vacuum box, and the force application device is provided with 4.
The vibration exciter box 10 is provided with a sleeve at the upper, lower, left and right sides respectively, and the screw 12 of 4 force application devices is connected with four sleeves respectively. The vibration exciter box 10 is fixedly arranged at the center of the vacuum box.
The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any changes or substitutions that can be easily conceived by those skilled in the art within the technical scope of the present invention are included in the scope of the present invention.

Claims (9)

1. A method of improving interlayer adhesion, comprising the steps of:
step 1, determining the activation time T of glue solution and the maximum pressure P which can be borne by an additional layer;
step 2, after the additional layer is bonded to the substrate through glue solution to prepare the composite material, placing the composite material in a vacuum unit;
step 3, adjusting a force application device in the vacuum unit to enable the pressure of the force application device on the additional layer to reach the required pressure P;
the force application device comprises a supporting plate, a supporting frame and a pressure adjusting unit;
the support frame is connected with one side of the support plate, the other side of the support plate is a working side, and the working side is attached to the additional layer; more than 1 pressure sensor is arranged on the working side of the supporting plate; the pressure adjusting unit is adjusted to enable the pressure applying device to apply pressure to the additional layer to reach a required pressure P, and the pressure sensor shows the pressure;
the supporting frame comprises a base and a second connecting piece, the base is connected with the supporting plate, and the second connecting piece is arranged at the center of the base;
two ends of the pressure adjusting unit are respectively connected with the first connecting piece and the second connecting piece;
step 4, adjusting the pressure in the vacuum unit to a negative pressure; the vacuum unit is used for improving the discharge rate of bubbles in the glue solution;
step 5, setting the working time of an ultrasonic vibration exciter in the vacuum unit to be T, starting the ultrasonic vibration exciter, automatically stopping working after the T time, and finishing glue solution curing;
the ultrasonic vibration exciter promotes the glue solution between the additional layer and the substrate to generate micro-flow and applies pressure through the force application device, so as to assist in removing residual bubbles in the glue solution and promote the uniform distribution of the glue solution.
2. The method of claim 1, wherein in step 2, the composite material is prepared before the substrates are assembled into the product, and the vacuum unit is a vacuum box.
3. The method of claim 1, wherein in step 2, the additional layers are bonded after the substrates are assembled into the product, and the vacuum unit is a vacuum bag which envelopes the entire product.
4. The method of improving interlayer adhesion according to claim 1, wherein the required pressure P in step 3 is 65% to 75% P.
5. The method for improving interlayer bonding according to any one of claims 1 to 4, wherein the ultrasonic exciter is placed in an exciter case, a first connecting piece is arranged on the exciter case, and the force application device is connected with the exciter case through the first connecting piece.
6. The method for improving interlayer bonding according to claim 1, wherein the pressure adjusting unit is a screw provided with a rotary handle;
two ends of the screw are respectively in threaded connection with the first connecting piece and the second connecting piece, and the length of the screw is adjusted by rotating the rotating handle.
7. The method for improving interlayer adhesion according to claim 6, wherein the screw is further provided at both ends thereof with a first locking handle and a second locking handle, respectively, for locking the screw.
8. The method of improving interlayer bonding of claim 1, wherein said support plate shape matches said additional layer shape.
9. The method of improving interlayer adhesion of claim 1, wherein the base is removably attached to the support plate.
CN202011235529.3A 2020-11-06 2020-11-06 Method for improving interlayer adhesion Active CN112455055B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202011235529.3A CN112455055B (en) 2020-11-06 2020-11-06 Method for improving interlayer adhesion

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202011235529.3A CN112455055B (en) 2020-11-06 2020-11-06 Method for improving interlayer adhesion

Publications (2)

Publication Number Publication Date
CN112455055A CN112455055A (en) 2021-03-09
CN112455055B true CN112455055B (en) 2022-09-06

Family

ID=74824997

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202011235529.3A Active CN112455055B (en) 2020-11-06 2020-11-06 Method for improving interlayer adhesion

Country Status (1)

Country Link
CN (1) CN112455055B (en)

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2000000344A1 (en) * 1998-06-30 2000-01-06 Trustees Of Tufts College Multiple-material prototyping by ultrasonic adhesion
CN1775498A (en) * 2005-12-07 2006-05-24 南京航空航天大学 High-energy focusing ultrasonic-high pressure water tank shaping process for laminated plate
US8129220B2 (en) * 2009-08-24 2012-03-06 Hong Kong Polytechnic University Method and system for bonding electrical devices using an electrically conductive adhesive
US10213964B2 (en) * 2015-05-08 2019-02-26 The Boeing Company Methods and apparatus for repairing composite materials
JP7134996B2 (en) * 2017-03-20 2022-09-12 マルチマテリアル-ウェルディング・アクチェンゲゼルシャフト Method for joining objects and object to be joined to member to be joined
CN107274791A (en) * 2017-08-04 2017-10-20 武汉天马微电子有限公司 Apparatus for manufacturing display panel and attaching method
CN211375314U (en) * 2020-03-12 2020-08-28 青岛天仁微纳科技有限责任公司 Device for preventing glue overflow adhesion

Also Published As

Publication number Publication date
CN112455055A (en) 2021-03-09

Similar Documents

Publication Publication Date Title
EP2162275B1 (en) Device and method for processing a fibre compound structure
TWI507093B (en) A composite showerhead electrode assembly for a plasma processing apparatus
US8726965B2 (en) Method for at least partially reworking or replacing a reinforcement element of a fibre composite structure and associated connecting device
CN101151702B (en) Gas shower plate for plasma processing device
US8449786B2 (en) Film adhesive for semiconductor vacuum processing apparatus
CN112455052B (en) Device for improving interlayer adhesion
JP5108215B2 (en) Method and apparatus for positioning columnar structure
EP3181339B1 (en) Bonding device and bonding method
JPH07195391A (en) Hot press
TWI792312B (en) Electrostatic chuck, substrate processing apparatus and substrate processing method
WO2013058052A1 (en) Bonding device and bonding method
JP2014143283A (en) Method of sticking heat transfer sheet
CN112455055B (en) Method for improving interlayer adhesion
US7149070B2 (en) Holding device, in particular for fixing a semiconductor wafer in a plasma etching device, and method for supplying heat to or dissipating heat from a substrate
US11511499B2 (en) Bond fixture for root end laminate or rotor blade
WO2019080520A1 (en) Laminating device
KR101085193B1 (en) Cell or tissue tensile stimulator
CN111987021A (en) Vacuum bonding equipment for SiC wafer
JP6022269B2 (en) Tire vulcanization method
CN110815525B (en) Drying tool and method for gel injection molding large-size ceramic blank
CN113333243B (en) Method for controlling thickness of adhesive film
CN212517134U (en) Vacuum bonding equipment for SiC wafer
US10207468B2 (en) Installation tool and associated method for applying a patch to a surface
CN104300159A (en) Spraying preparation jig for fuel-cell catalyst coatings
CN108789205B (en) Clamp system and method for fixing target assembly

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant