CN112447637A - Heating pipeline and semiconductor manufacturing equipment - Google Patents

Heating pipeline and semiconductor manufacturing equipment Download PDF

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Publication number
CN112447637A
CN112447637A CN201910798122.2A CN201910798122A CN112447637A CN 112447637 A CN112447637 A CN 112447637A CN 201910798122 A CN201910798122 A CN 201910798122A CN 112447637 A CN112447637 A CN 112447637A
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China
Prior art keywords
heating
tube
inner tube
pipe
heating structure
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CN201910798122.2A
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Chinese (zh)
Inventor
王怀庆
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Changxin Memory Technologies Inc
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Changxin Memory Technologies Inc
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Priority to CN201910798122.2A priority Critical patent/CN112447637A/en
Publication of CN112447637A publication Critical patent/CN112447637A/en
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids

Abstract

The present invention relates to a heating pipe and a semiconductor manufacturing apparatus, the heating pipe including: the heating structure comprises an inner pipe and a heating structure wrapping the outer wall of the inner pipe; the heating structure is used for heating the inner tube after being electrified, and the heating structure is carbon fiber braided wires. The invention can effectively heat the inner pipe, improve the maintenance efficiency and save the production cost.

Description

Heating pipeline and semiconductor manufacturing equipment
Technical Field
The invention relates to the technical field of semiconductors, in particular to a heating pipeline and semiconductor manufacturing equipment.
Background
In a semiconductor manufacturing process, a semiconductor thin film deposition process is a key production technique. In semiconductor thin film deposition processes, a conduit is used to introduce the gaseous precursor into the reaction chamber, and a high temperature inside the conduit is maintained during the introduction. The addition of a heating device outside the pipe is a common means in the semiconductor thin film deposition process.
The heating device is arranged outside the pipeline and is formed by connecting a plurality of heating blocks. Firstly, when the pipeline is maintained, the pipeline is cleaned by using acid liquor, so that the heating device needs to be removed, the pipeline is immersed in the acid liquor, and after the pipeline is cleaned, the heating device is installed, and a large amount of maintenance time is occupied in the maintenance process; secondly, in order to promote the heating effect of pipeline, still can be at the outside cladding heat preservation cotton of heating device, and the heating process, the adhesion can be melted on the heating block to the heat preservation cotton because of the influence of heating block temperature, and this heat preservation cotton that needs change the heat preservation cotton of adhesion on the heating block often and get rid of the heating block, and this maintenance process is very loaded down with trivial details, has caused the waste of a large amount of manpowers and material resources.
Therefore, there is a need for a heating pipeline, which can effectively heat the gaseous precursor in the pipeline, and at the same time, improve the maintenance efficiency and save the production cost.
Disclosure of Invention
The invention solves the technical problem of improving the maintenance efficiency while ensuring that the heating pipeline is effectively heated.
In order to solve the above technical problem, the present invention provides a heating duct, including: the heating structure comprises an inner pipe and a heating structure wrapping the outer wall of the inner pipe; the heating structure is used for heating the inner tube after being electrified, and the heating structure is carbon fiber braided wires.
In one embodiment, the diameter of the carbon fiber braided wire is 20mm-40 mm.
In one embodiment, the arrangement mode of the carbon fiber braided wires is a staggered full-braided arrangement.
In one embodiment, the carbon fiber braided wires are distributed on the outer wall of the inner pipe in a grid shape, and the area of each grid is 1mm2-25mm2
In one embodiment, the carbon fiber braided wire is arranged in a manner of being uniformly wound around the outer wall of the inner pipe in a spiral manner.
In one embodiment, the interval between adjacent carbon fiber braided wires in the extending direction of the inner pipe is 1mm-5 mm.
In one embodiment, the material of the inner tube comprises glass fiber reinforced plastic, stainless steel, polytetrafluoroethylene, or silica.
In one embodiment, the heating duct further comprises: the insulating tube coats the outer wall of the inner tube, and the insulating tube is located between the inner tube and the heating structure.
In one embodiment, the material of the insulating tube comprises quartz, asbestos, mica, glass, ceramic, or polytetrafluoroethylene.
In one embodiment, the heating duct further comprises: the functional tube coats the heating structure, and the heating structure is positioned between the inner tube and the functional tube; the functional pipe comprises at least one of a heat preservation pipe, a heat reflection pipe or an outer pipe.
In one embodiment, the material of the outer tube comprises glass fiber reinforced plastic, stainless steel, polytetrafluoroethylene or silicon dioxide; preferably, the material of the outer tube is the same as the material of the inner tube.
The invention also provides semiconductor manufacturing equipment comprising the heating pipeline.
Compared with the prior art, the technical scheme provided by the invention has the following advantages:
the heating pipeline provided by the embodiment of the invention comprises: the heating structure comprises an inner pipe and a heating structure wrapping the outer wall of the inner pipe; the heating structure is used for heating the inner tube after being electrified, and the heating structure is carbon fiber braided wires. Therefore, the corrosion resistance of the carbon fiber braided wire is utilized, the carbon fiber braided wire is used for coating the inner tube and is used for heating the inner tube after being electrified, the acid liquor is prevented from corroding the heating structure when the heating pipeline is maintained, the maintenance efficiency is improved, and the production cost is saved.
In addition, when the carbon fiber braided wires are arranged in a staggered full-braided mode, the carbon fiber braided wires are distributed on the outer wall of the inner pipe in a latticed mode, and the area of each grid is 1mm2-25mm2. Therefore, the carbon fiber braided wire is ensured to have proper arrangement density. When the heating is carried out, the influence of grid gaps on the heating uniformity of the inner tube is small, the inner tube is prevented from having temperature cold spots, the heating uniformity of the inner tube is good, the gas precursor in the pipeline is prevented from being denatured due to temperature reduction, and the production yield of semiconductors is ensured.
In addition, when the carbon fiber braided wires are arranged in a manner of spirally and uniformly winding around the outer wall of the inner pipe, the interval between the adjacent carbon fiber braided wires is 1mm-5mm in the extending direction of the inner pipe. Therefore, the carbon fiber braided wire is ensured to have proper arrangement density. When the heating is carried out, the gaps between the adjacent carbon fiber braided wires are small, so that the influence on the heating uniformity of the inner tube is small, the temperature cold spots of the inner tube are avoided, the heating uniformity of the inner tube is good, the denaturation of a gaseous precursor in the pipeline due to temperature reduction is avoided, and the production yield of semiconductors is ensured.
In addition, the material of the inner tube includes glass fiber reinforced plastic, stainless steel, polytetrafluoroethylene, or silica. The materials are all materials with better corrosion resistance, so that the materials with better corrosion resistance are used as the materials of the inner tube, so that when the inner tube is cleaned and maintained by introducing acid liquor, the acid liquor is prevented from corroding the inner tube, and the service life of the inner tube is prolonged.
In addition, the material of the insulating tube includes quartz, asbestos, mica, glass, ceramic, or polytetrafluoroethylene. Above-mentioned material is the better material of insulating nature, so, use the material of the better material of insulating nature as the material of insulating tube for when heating structure heats the inner tube, avoid heating structure and inner tube direct contact and lead to the electric current to flow to the inner tube, moreover, if the inner tube leads to self to produce the heat because the electric current flows in, can exert an influence to the heating temperature of inner tube and influence the nature of gas in the inner tube, and then influence the semiconductor production yield, influence the life of inner tube simultaneously.
In addition, the functional tube covers the heating structure, the heating structure is located between the inner tube and the functional tube, the functional tube is an outer tube, and the material of the outer tube comprises glass fiber reinforced plastic, stainless steel, polytetrafluoroethylene or silicon dioxide. At the outer cladding outer tube of heating structure for inner tube, heating structure and outer tube constitute integrative sealed tube, and the material of inner tube and outer tube all has anticorrosive effect, so, sealed integrative pipe not only guarantees better heating effect, avoids the gas emergence degeneration in the inner tube, dismantles the convenience when maintaining moreover, and interior outer pipe all uses anti-corrosion material, can directly put into the acidizing fluid with the heating pipeline and wash, improves maintenance efficiency, saves the maintenance cost.
Drawings
One or more embodiments are illustrated by way of example in the accompanying drawings, which correspond to the figures in which like reference numerals refer to similar elements and which are not to scale unless otherwise specified.
Fig. 1 is a schematic half-sectional view of a heating pipe according to a first embodiment of the present invention;
FIG. 2 is a schematic view of a half-section of a heating conduit according to a second embodiment of the present invention;
fig. 3 is a schematic half-sectional view of a semiconductor manufacturing apparatus according to a third embodiment of the present invention.
Detailed Description
As can be seen from the background art, there is a need to provide a heating pipeline, which can effectively heat the pipeline and improve the maintenance efficiency.
It will be understood that, as used herein, the terms "first," "second," and the like may be used herein to describe various elements, but these elements are not limited by these terms. These terms are only used to distinguish one element from another. For example, a first number may be termed a second number, and, similarly, a second number may be termed a first number, without departing from the scope of the present invention. The first number and the second number are both numbers, but they are not the same number.
In order to solve the problems, the invention provides a heating pipeline, which uses carbon fiber braided wires as a heating structure to coat the outer wall of an inner pipe, and is used for heating the inner pipe after being electrified. Due to the corrosion resistance of the carbon fiber braided wire, the heating structure is prevented from being corroded by acid liquor when the heating pipeline is maintained, the structure of the heating pipeline is simplified, the maintenance efficiency is improved, and the production cost is saved.
In order to make the objects, technical solutions and advantages of the present invention more apparent, embodiments of the present invention will be described in detail below with reference to the accompanying drawings. However, it will be appreciated by those of ordinary skill in the art that in various embodiments of the invention, numerous technical details are set forth in order to provide a better understanding of the present application. However, the technical solution claimed in the present application can be implemented without these technical details and various changes and modifications based on the following embodiments.
Fig. 1 is a schematic half-sectional view of a heating pipe according to a first embodiment of the present invention.
Referring to fig. 1, the present embodiment provides a heating duct including: an inner pipe 101 and an insulating pipe 102 covering the outer wall of the inner pipe 101; the heating structure 103, the heating structure 103 wraps the insulating tube 102, and the insulating tube 102 is located between the inner tube 101 and the heating structure 103; the functional tube 104, the functional tube 104 wraps the heating structure 103, the heating structure 103 locates between insulating tube 102 and functional tube 104; the heating structure 103 is used for heating the inner tube 101 after being electrified, and the heating structure 103 is carbon fiber braided wires.
The heating duct provided in the present embodiment will be described in detail below with reference to the accompanying drawings.
In this embodiment, the inner tube 101 functions to carry and transport gas. During transportation, part of the material in the gas may remain in the inner tube 101. Therefore, when the inner tube 101 is maintained, an acid solution is introduced into the inner tube 101 to clean the inner tube 101 to remove residual substances, and it is necessary to make the inner tube 101 of a relatively good material for corrosion resistance. The heating structure 103 is required to heat the inner tube 101 to ensure the temperature inside the inner tube 101 and prevent gas from being denatured, and it is also required that the material of the inner tube 101 has high temperature resistance.
In this embodiment, to meet the above requirements, the material of the inner tube 101 may be metal, such as stainless steel; may be a non-metal such as glass reinforced plastic, polytetrafluoroethylene or silica.
In this embodiment, the insulating tube 102 functions to isolate the current. If the insulating tube 102 is removed, the inner tube 101 directly contacts the heating structure 103, and when the material of the inner tube 101 is a conductive material, such as stainless steel, a loop is formed with the heating structure 103, and when the heating structure 103 is energized, current is generated on the inner tube 101, which causes the inner tube 101 to generate heat, and the generated heat causes temperature change, which easily causes adverse effects on the gas carried by the inner tube 101. Therefore, the insulating tube 102 is provided on the outer wall of the inner tube 101, and the insulating tube 102 completely covers the outer wall of the inner tube 101, thereby isolating the inner tube 101 from the heating structure 103 without affecting the heating of the inner tube 101 by the heating structure 103.
In this embodiment, the material of the insulating tube 102 may be quartz, asbestos, mica, glass, ceramic, or teflon to meet the above requirements.
It is noted that in other embodiments, the insulating tube 102 may be an insulating coating applied to the outer wall of the inner tube 101. By using the insulating coating, when the heating structure 103 heats the inner tube 101, the heat transfer speed is high, the thickness of the insulating coating is almost negligible, the diameter of the heating pipeline is effectively reduced, and the space occupied by the heating pipeline in production is saved.
In the present embodiment, the heating structure 103 is a carbon fiber woven yarn, and functions to heat the inner tube 101. Since the residual substances in the inner tube 101 need to be removed during maintenance of the heating pipeline, the acid may corrode the heating structure 103 and damage the heating structure 103 during the cleaning process of the inner tube 101 by passing the acid. Therefore, the heating structure 103 needs to have better electrical conductivity and heat resistance and better corrosion resistance, and the carbon fiber braided filament is composed of high-strength and high-modulus fiber monofilaments with carbon content of more than 90%, has the characteristics of high temperature resistance, friction resistance, electrical conductivity, heat conduction and corrosion resistance, avoids the acid liquor from corroding the heating structure 103 when the heating pipeline is maintained, simplifies the structure of the heating pipeline, improves the maintenance efficiency and saves the production cost.
In the present embodiment, one carbon fiber woven filament is composed of 3000-6000 carbon fiber monofilaments, for example, 4000, 4500, 5000, or 5500 carbon fiber monofilaments.
In this embodiment, one carbon fiber braided filament has a diameter of 20mm to 40mm, for example a diameter of 24mm, 28mm, 33mm or 36 mm.
In this embodiment, the carbon fiber braided wire is arranged in a manner of being uniformly wound spirally around the outer wall of the inner tube.
In this embodiment, the spacing between adjacent carbon fibre braided filaments in the direction along which the inner tube 101 extends may be between 1mm and 5mm, for example 2mm or 4 mm. Because the interval of adjacent carbon fiber woven wires is less, when the heating structure 103 is used for heating the inner tube 101, the winding density of the carbon fiber woven wires meets the requirement of heating temperature, cold spots cannot appear at the gap position, and the gas in the inner tube 101 is prevented from generating denaturation, so that the production yield of semiconductors is improved.
In this embodiment, the functional pipe 104 is an outer pipe, and functions to insulate heat and prevent corrosion. When the heating pipeline is maintained, residual substances of the inner pipe 101 need to be removed, the inner pipe 101 is cleaned by using acid liquor, and the heating pipeline can be directly immersed into the acid liquor for cleaning in order to improve the cleaning efficiency. Therefore, the functional pipe 104 is arranged on the heating structure 103, and the heating structure 103 is completely coated by the functional pipe 104, so that heat loss is prevented, the functional pipe 104 has better corrosion resistance, and the cleaning efficiency during maintenance of the heating pipeline can be improved.
In this embodiment, to achieve the above-mentioned effect, the material of the functional tube 104 may be metal, such as stainless steel; may be non-metal such as glass reinforced plastic, polytetrafluoroethylene, silica.
In this embodiment, since the functional tube 104 covers the heating structure 103, the inner tube 101, the insulating tube 102, the heating structure 103 and the functional tube 104 are also made to form a sealed integrated tube, so that the heating pipe becomes a sealed integrated tube, which not only ensures a better heating effect for the gas in the pipe, and avoids the gas from being denatured due to temperature reduction, but also is convenient to disassemble during maintenance, the inner tube and the outer tube are made of anti-corrosion materials, and the heating pipe can be directly put into acid liquor for cleaning, thereby improving the maintenance efficiency and saving the maintenance cost.
It is noted that in other embodiments, functional tube 104 is a thermal insulating tube, which serves as a thermal insulator. If the functional tube 104 is removed, a part of heat generated by the heating structure 103 after being powered on is dissipated in the air, so that the temperature for heating the inner tube 101 is not easy to control, and energy is wasted. Therefore, the functional tube 104 is disposed on the heating structure 103, and the functional tube 104 completely covers the heating structure 103, so as to prevent heat dissipation and help control the temperature of the heating structure 103 when heating the inner tube 101. To meet the above requirements, the material of the functional tube 104 may be calcium silicate, asbestos, diatomaceous earth, perlite, glass fiber, or composite silicate.
It is noted that in other embodiments, functional pipe 104 is an insulated pipe made of a lightweight insulating material, such as foam concrete. By using the light heat-insulating material, the weight of the heating pipeline is reduced and the efficiency of installing and disassembling the heating pipeline is improved on the basis of ensuring the heat-insulating effect of the functional pipe 104.
It should be noted that in other embodiments, the functional tube 104 is a heat reflection tube, and plays a role of reflecting heat and preventing heat from dissipating. To achieve the above-mentioned effect, the material of the functional tube 104 may be aluminum.
It is noted that in other embodiments, the functional tube 104 may be a combination of at least two of a thermal insulating tube, a heat reflecting tube, and an outer tube.
In the prior art, a plurality of heating blocks are generally used for heating an inner tube, gaps exist between the heating blocks, the heating blocks cannot ensure that the temperature of the gaps reaches a preset temperature, so that cold spots exist at the gaps, and the cold spots cause the denaturation of gas in the inner tube, thereby affecting the yield of semiconductor production; in addition, in order to ensure the heating effect of the heating block, the surface of the heating block is coated with heat insulation cotton, the heat insulation cotton can be melted under high temperature, so that the pipeline maintenance is very inconvenient, the heat insulation cotton which is melted at a certain point is removed frequently and needs to be replaced, and a large amount of manpower and material resources are wasted.
According to the heating pipeline provided by the embodiment, firstly, the carbon fiber braided wires which are uniformly wound and distributed in a spiral mode are used as the heating structure to coat the inner pipe, the characteristics of good heating effect and corrosion resistance of the carbon fiber braided wires are utilized, the pipeline cleaning efficiency during pipeline maintenance is improved, the production cost is saved, the pipeline is prevented from generating cold spots in the heating process by setting the proper density of the carbon fiber braided wires which are uniformly wound in a spiral mode, the condition that a gaseous precursor in the pipeline is not denatured due to temperature reduction is ensured, and the production yield of semiconductors is improved; secondly, an insulating tube is arranged between the heating structure and the inner tube, so that the heating structure is prevented from being in direct contact with the inner tube, and further, when the heating structure heats the inner tube, the current in the heating structure cannot enter the inner tube, the inner tube is prevented from generating heat due to the current, the property of a gaseous precursor in a pipeline is prevented from being influenced, and the inner tube is prevented from shortening the service life due to the current; and thirdly, the surface of the heating structure is coated with the corrosion-resistant outer pipe, so that the whole heating pipeline becomes a sealed integral pipe, thus not only preventing heat loss and ensuring the heating effect of the whole heating pipeline, but also being convenient to disassemble when maintaining the pipeline, directly immersing the heating pipeline into acid liquor for cleaning, improving the maintenance efficiency, avoiding frequently replacing the heat insulation structure and saving the maintenance cost.
A second embodiment of the present invention provides a heating pipeline, which is different from the first embodiment in that the arrangement manner of the carbon fiber braided wires of the heating structure is a staggered full braiding. The following detailed description will be made with reference to the accompanying drawings, and it should be noted that the same or corresponding features as those of the first embodiment can be referred to the corresponding description of the first embodiment, and will not be described below in detail.
Fig. 2 is a schematic half-sectional view of a heating pipe according to a second embodiment of the present invention.
Referring to fig. 2, the present embodiment provides a heating duct including: an inner pipe 201 and an insulating pipe 202 covering the outer wall of the inner pipe 201; the heating structure 203, the heating structure 203 wraps the insulating tube 202, and the insulating tube 202 is positioned between the inner tube 201 and the heating structure 203; the functional tube 204, the functional tube 204 coats the heating structure 203, the heating structure 203 locates between insulating tube 202 and functional tube 204; the heating structure 203 is used for heating the inner tube 201 after being electrified, and the heating structure 203 is carbon fiber braided wires.
The heating duct provided in the present embodiment will be described in detail below with reference to the accompanying drawings.
In this embodiment, the arrangement of the carbon fiber knitting filaments in the heating structure 203 is a staggered full knitting. The full weaving is that at least two bundles of carbon fiber weaving filaments are mutually staggered or hooked to be woven to form strip-shaped or block-shaped woven fabrics. The carbon fiber braided wires are arranged in a staggered full-braiding mode, and are distributed on the outer wall of the insulating tube 202 in a grid shape; the carbon fiber braided wire forms a latticed structure on the outer wall of the insulating tube 202, the inner tube 201 is uniformly heated by wrapping the insulating tube 202, and the temperature is easy to control.
In this embodiment, the area of the individual cells in the heating structure 203 may be 1mm2-25mm2E.g. 4mm in area2、9mm2Or 16mm2. Due to the appropriate area of the grid of the fiber weaving silkIn, when using heating structure 203 to heat inner tube 201, the effect influence of the region in the net to even heating can be ignored, and the net density of arranging of carbon fiber woven wire satisfies the heating temperature requirement, guarantees that the cold spot can not appear in the net inside, prevents that the inside gas of inner tube 201 from taking place the degeneration, improves the semiconductor production yield.
The heating pipeline that this embodiment provided adopts the carbon fiber woven wire that the staggered form was woven entirely and is arranged as heating structure cladding inner tube, through setting up the area that the mesh was woven entirely to the staggered form of suitable carbon fiber woven wire, has avoided pipeline cold spot in the heating process to appear, has guaranteed that gaseous precursor can not take place the degeneration because of the temperature reduction in the pipeline, and then has improved the semiconductor production yield.
A third embodiment of the present invention provides a semiconductor manufacturing apparatus, including the above-described heating conduit; the method can also comprise the following steps: a power supply device for supplying power to the heating structure; the temperature measuring device is used for measuring the temperature of the inner pipe; and the control device is used for adjusting the voltage of the power supply device for supplying power to the heating structure based on the temperature measured by the temperature measuring device.
Fig. 3 is a schematic half-sectional view of a semiconductor manufacturing apparatus according to a third embodiment of the present invention.
Specifically, referring to fig. 3, the present embodiment provides a semiconductor manufacturing apparatus including: a power supply device 301, a temperature measuring device 302, a control device 303 and a heating pipeline 304; the heating pipe 304 further includes an inner pipe 3041, a heating structure 3042, a functional pipe 3043, and an insulating pipe 3044.
The semiconductor manufacturing apparatus provided in the present embodiment will be described in detail below with reference to the accompanying drawings.
In the present embodiment, the power supply device 301 is connected to the heating structure 3042 by a wire, and the power supply device 301 supplies power to the heating structure 3042; the heating structure 3042 is energized to heat the inner tube 3041; an insulating tube 3044 is positioned between the heating structure 3042 and the inner tube 3041; the temperature measuring device 302 is located on the outer wall of the functional tube 3043, and the temperature sensing end thereof contacts the inner tube 3041 to measure the temperature of the inner tube 3041 in real time; the control device 303 is connected to the power supply device 301 by a wire, and the control device 303 adjusts the heating temperature of the heating structure 3042 by adjusting the output voltage of the power supply device 301.
In this embodiment, the temperature measuring device 302 is a thermocouple, a temperature measuring hole is formed in a wall of the functional pipe 3043, the temperature measuring hole is a through hole, the outer surface of the inner pipe 3041 is exposed, and a temperature measuring end of the temperature measuring device 302 is in contact with the inner pipe 3041 through the temperature measuring hole.
In this embodiment, a set screw (not shown) is used to fix the temperature measuring device 302 on the outer wall of the functional pipe 3043.
It is noted that in other embodiments, the temperature measuring device 302 may be a contact type temperature measuring device or a wireless temperature measuring device, and the temperature measuring device 302 may be disposed at other positions besides the wall of the functional pipe 3043, such as the input end or the output end of the heating pipe 304.
In this embodiment, the power supply unit 301 is located at the gas input end of the heating conduit 304.
It is noted that in other embodiments, the power supply device 301 may be disposed at a location other than the gas input end of the heating conduit 304, such as the gas output end of the heating conduit 304.
In this embodiment, the control device 303 is located at the gas input of the heating conduit 304.
It is noted that in other embodiments, the control device 303 may be disposed at a location other than the gas input of the heating conduit 304, such as the gas output of the heating conduit 304.
The semiconductor manufacturing equipment provided by the embodiment can supply power to the heating structure in the heating pipeline during the deposition and manufacturing of the semiconductor film, measure the temperature of the inner pipe in the heating pipeline in real time, control the heating temperature of the heating structure to the inner pipe in time, ensure the real-time temperature of the inner pipe in the heating pipeline, avoid the denaturation of a gaseous precursor due to the temperature change, and improve the production yield of the semiconductor; and the heating pipeline is a sealed integrated pipe, the structure is simple, the maintenance is easy, and the production cost is reduced.
It will be understood by those of ordinary skill in the art that the foregoing embodiments are specific examples for carrying out the invention, and that various changes in form and details may be made therein without departing from the spirit and scope of the invention in practice. Various changes and modifications may be effected therein by one skilled in the art without departing from the spirit and scope of the invention as defined in the appended claims.

Claims (14)

1. A heating conduit, comprising:
the heating structure comprises an inner pipe and a heating structure wrapping the outer wall of the inner pipe;
the heating structure is used for heating the inner tube after being electrified, and the heating structure is carbon fiber braided wires.
2. A heating conduit according to any one of claim 1, wherein the carbon fibre braided filaments have a diameter of 20mm to 40 mm.
3. A heating conduit according to claim 1 or 2, wherein the arrangement of the carbon fibre braided filaments is a staggered full braid arrangement.
4. The heating pipeline according to claim 3, wherein the carbon fiber braided wires are distributed in a grid shape on the outer wall of the inner pipe, and the area of each grid is 1mm2-25mm2
5. A heating conduit according to claim 1 or 2, wherein the carbon fibre braided filaments are arranged in a manner to be uniformly wound helically around the outer wall of the inner tube.
6. A heating tube according to claim 5, wherein the spacing between adjacent carbon fibre braided filaments in the direction of extension of the inner tube is in the range 1mm to 5 mm.
7. A heating conduit according to claim 1, wherein the material of the inner tube comprises glass reinforced plastic, stainless steel, polytetrafluoroethylene or silica.
8. A heating tunnel according to claim 1, further comprising: the insulating tube coats the outer wall of the inner tube, and the insulating tube is located between the inner tube and the heating structure.
9. A heated conduit according to claim 8, wherein the material of the insulating tube comprises quartz, asbestos, mica, glass, ceramic or polytetrafluoroethylene.
10. A heating tunnel according to claim 1, further comprising: the functional tube coats the heating structure, and the heating structure is positioned between the inner tube and the functional tube; the functional pipe comprises at least one of a heat preservation pipe, a heat reflection pipe or an outer pipe.
11. A heating conduit according to claim 10, wherein the material of the outer tube comprises glass reinforced plastic, stainless steel, polytetrafluoroethylene or silica; preferably, the material of the outer tube is the same as the material of the inner tube.
12. A semiconductor manufacturing apparatus, comprising: the heating conduit of any one of claims 1-10.
13. The semiconductor manufacturing apparatus according to claim 12, further comprising: a power supply device for supplying power to the heating structure.
14. The semiconductor manufacturing apparatus according to claim 13, further comprising: the temperature measuring device is used for measuring the temperature of the inner pipe; and the control device is used for adjusting the voltage of the power supply device for supplying power to the heating structure based on the temperature measured by the temperature measuring device.
CN201910798122.2A 2019-08-27 2019-08-27 Heating pipeline and semiconductor manufacturing equipment Pending CN112447637A (en)

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CN102147147A (en) * 2010-02-08 2011-08-10 清华大学 Heating guide pipe
CN102147148A (en) * 2010-02-08 2011-08-10 清华大学 Fluid heater and using method thereof
TW201137292A (en) * 2010-04-27 2011-11-01 Hon Hai Prec Ind Co Ltd Heater for heating fluid liquid or gas and method for using the same
CN203549252U (en) * 2013-11-12 2014-04-16 辽宁丽天新材料有限公司 Liquid heat preservation pipeline
CN104964428A (en) * 2015-07-02 2015-10-07 黄其杰 Combined water heater carbon fiber electric heater
CN205897512U (en) * 2016-06-24 2017-01-18 广东今泉节能设备有限公司 Heating member device to liquid heating
CN106439360A (en) * 2016-09-14 2017-02-22 成都昶艾电子科技有限公司 High-temperature heating pipe and preparation method thereof
CN109936884A (en) * 2017-12-18 2019-06-25 特贝国际 PFA pipe heater with flexible heating device
CN208074409U (en) * 2018-02-09 2018-11-09 湖州长宜建设有限公司 A kind of corrosion-resistanting insulation pipe
CN208567098U (en) * 2018-02-13 2019-03-01 苏州捷迪纳米科技有限公司 Face electric heater
CN208952390U (en) * 2018-06-19 2019-06-07 宁波万泓科技有限公司 A kind of liquid heating pipe
CN208835029U (en) * 2018-11-13 2019-05-07 长鑫存储技术有限公司 Semiconductor manufacturing apparatus with pipeline heating function

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