CN112445362B - Method for generating random grid pattern of conductive film and application thereof - Google Patents
Method for generating random grid pattern of conductive film and application thereof Download PDFInfo
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/0412—Digitisers structurally integrated in a display
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
- H01B5/14—Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
Abstract
The invention discloses a method for generating a random grid pattern of a conductive film, wherein the random grid pattern comprises a plurality of mutually adjacent random polygons, and the method comprises the following steps: acquiring information of a central point of a regular polygon in a grid pattern; obtaining the coordinates of the central point of the random polygon; obtaining each vertex of each random polygon; a random mesh pattern is generated with the vertices. The random grid pattern generated by the method effectively eliminates the Moire interference fringes, and meanwhile, the method is simple in calculation and can generate random grid patterns with any size. The invention also discloses a manufacturing method of the conducting film with the random grid pattern, which comprises the steps of firstly generating the required random grid pattern by adopting the generating method of the random grid pattern of the conducting film, and then stamping the random grid pattern on a base material to obtain the conducting film with the random grid pattern. The invention also discloses a conductive film with random grid patterns, which is manufactured by adopting the manufacturing method of the conductive film with random grid patterns.
Description
Technical Field
The invention relates to the technical field of conductive films, in particular to a generation method and application of a random grid pattern of a conductive film.
Background
With the development trend of wide use of touch screens and ultrathin and portable touch screens, the existing mainstream transparent conductive materials or structures mainly comprise three types, namely, a silk screen type, a film layer type and a metal grid type, wherein the metal grid material is most widely applied to touch screen products because of the comprehensive requirements of high light transmission, low haze, excellent conductivity and the like, and particularly, the flexible metal conductive film is well applied. The metal grid is also called a micro-grid or a grid, is a micro-metal grid manufactured on a PET film by adopting the technologies of etching, imprinting, magnetron sputtering and the like, and has excellent light transmittance and electric conduction efficiency. Common metal grid patterns are in regular shapes such as rectangles, diamonds and honeycombs, but for periodic arrangement, the grid patterns can easily cause visible molar interference fringes to influence the visual effect. In order to overcome the difficulty, Moire interference fringes are eliminated by breaking the periodic arrangement rule of grids or/and the regular shape of patterns. Although the conventional random grid can solve the problem of moire fringes, the method for acquiring the random grid pattern is complex, and meanwhile, severe snowflake fringes are caused to influence the viewing angle effect.
The foregoing description is provided for general background information and is not admitted to be prior art.
Disclosure of Invention
The invention aims to provide a method for generating a random grid pattern of a conductive film with simple calculation and application thereof.
The invention provides a method for generating a random grid pattern of a conductive film, wherein the random grid pattern comprises a plurality of mutually adjacent random polygons, and the method comprises the following steps:
providing a regular grid pattern with a plurality of regular polygons arranged in an array manner, wherein the regular polygons are mutually adjacent to each other, and the coordinates of the center point of each regular polygon are obtained;
presetting random disturbance on the central point coordinates of each regular polygon to obtain the central point coordinates of the random polygons;
obtaining each vertex of each random polygon, selecting a central point of any random polygon as a center, obtaining a perpendicular bisector between the selected central point and the central point of each adjacent random polygon, and taking the intersection point of two adjacent perpendicular bisectors as the vertex of the random polygon;
a random mesh pattern is generated using the vertices.
In one embodiment, in the step of obtaining coordinates of a center point of the random polygon: and adding random disturbance to the x-axis direction coordinates and the y-axis direction coordinates of each central point in the regular polygonal grid pattern by setting a random factor and calling a random number generation function, and further calculating the x-axis direction coordinates and the y-axis direction coordinates of each central point of the random grid pattern.
In one embodiment, in the step of obtaining the coordinates of the center point of the random polygon, the coordinate values of the center point of the random mesh pattern in the x-axis direction and the y-axis direction are calculated in the following manner:
Q n (x)＝P n (x)+R*Dx*rand(0，1)，
Q n (y)＝P n (y)+R*Dy*rand(0，1)；
wherein Q is n (x)、Q n (y) is the center point P of the corresponding regular polygon n X, y coordinate values, P, of a center point in the random grid pattern after random perturbation n (x)、P n (y) each represents P n X, y coordinate values of (1), P n M, m is the number of the regular polygons, Dx and Dy are random factors in x and y directions, rand (0, 1) is a random number between 0 and 1, and R is the average value of the distances between all adjacent central points in the random mesh pattern.
In one embodiment, Dx is 0.8-1.5, Dy is 0.8-1.5, and R is 50-500 um.
In one embodiment, R is 150-300 um.
In one embodiment, the method comprises:
obtaining the required random grid pattern by adopting the generation method of the random grid pattern of the conductive film;
preparing a mold having the pattern according to the random grid pattern;
providing a base material, wherein the base material comprises a transparent substrate and a curing glue layer coated on the transparent substrate;
imprinting the mold on the substrate;
demolding after curing;
forming a random grid pattern groove on the substrate;
filling a conductive material in the random grid pattern groove, and forming a conductive layer after curing;
a conductive film having a random grid pattern is obtained.
The invention also provides a conductive film with random mesh patterns, which is manufactured by the manufacturing method, and comprises a transparent substrate, a curing adhesive layer and a conductive layer, wherein the curing adhesive layer is arranged on the transparent substrate, the curing adhesive layer is provided with a random mesh pattern groove, the conductive layer is embedded in the random mesh pattern groove, the random mesh pattern comprises a plurality of random polygons which are mutually adjacent, the vertexes of the random polygons, the central points of the random polygons and the central points of the random polygons which are adjacent to the random polygons have a preset relation, and the central points of the random polygons and the central points of a plurality of regular polygons which are arranged in an array have a random corresponding relation.
In one embodiment, the random correspondence is formed in a manner as follows: and respectively adding random disturbance to the x-axis direction coordinates and the y-axis direction coordinates of each central point in the regular polygonal grid pattern by setting a random factor and calling a random number generation function.
In one embodiment, the random correspondence relationship is:
Q n (x)＝P n (x)+R*Dx*rand(0，1)，
Q n (y)＝P n (y)+R*Dy*rand(0，1)；
wherein Q is n (x)、Q n (y) is the center point P of the corresponding regular polygon n X, y coordinate values, P, of a center point in the random grid pattern after random perturbation n (x)、P n (y) each represents P n X, y coordinate values of (1), P n M, m is the number of the regular polygons, Dx and Dy are random factors in x and y directions, rand (0, 1) is a random number between 0 and 1, and R is the average value of the distances between all adjacent central points in the random mesh pattern.
In one embodiment, the predetermined relationship is: and the vertex of the random polygon is the intersection point of the perpendicular bisector and the adjacent perpendicular bisector between the central point of the random polygon and the central point of the random polygon adjacent to the random polygon.
The method for generating the random grid pattern of the conductive film obtains each vertex of the random polygon through the central point of the random polygon and the central point of the random polygon adjacent to the random polygon, thereby generating the random grid pattern by using the vertices, effectively eliminating Moire interference fringes, ensuring the visual angle effect, and simultaneously, the method has simple calculation and can generate the random grid pattern with any pattern size.
Drawings
FIG. 1 is a flow chart illustrating steps of a method for generating a random grid pattern according to an embodiment of the present invention;
FIG. 2 is a schematic diagram of a regular grid pattern provided by an embodiment of the present invention;
FIG. 3 is a schematic diagram of a random grid pattern formed after the random perturbation of FIG. 2;
FIG. 4 is a flowchart illustrating steps in a method for forming a conductive film with a random grid pattern according to an embodiment of the present invention;
fig. 5 is a schematic structural diagram of a conductive film with a random grid pattern according to an embodiment of the invention.
Detailed Description
The following detailed description of embodiments of the present invention is provided in connection with the accompanying drawings and examples. The following examples are intended to illustrate the invention but are not intended to limit the scope of the invention.
Referring to fig. 1 to fig. 3, in the method for generating a random mesh pattern of a conductive film according to an embodiment of the present invention, the random mesh pattern includes a plurality of mutually adjacent random polygons. The method comprises the following steps:
s11: providing a regular grid pattern with a plurality of regular polygons arranged in an array manner, wherein the regular polygons are mutually adjacent to each other, and the coordinates of the center point of each regular polygon are obtained;
s12: presetting random disturbance on the coordinates of the central point of each regular polygon to obtain the coordinates of the central point of each random polygon;
s13: obtaining each vertex of each random polygon, wherein the vertex is obtained through the central point of the random polygon and the central point of the random polygon adjacent to the random polygon;
s14: a random mesh pattern is generated with the vertices.
In the present embodiment, the regular polygon is a regular hexagon, and the random polygon is an irregular hexagon.
In step S11, the center point of each regular polygon and the adjacent regular polygon of each regular polygon in the mesh pattern are determined. Determining the position of the center point of the regular polygon is obtained using the geometric features of the regular polygon. Such as a regular hexagon, with the intersection of the diagonals being the center point.
In step S11, the specific steps of obtaining the coordinates of the center point of the regular polygon are: according to the arrangement rule of the regular polygons, taking the central point of one regular polygon as a center, and numbering the central points of a plurality of regular polygons adjacent to the regular polygon in a clockwise or anticlockwise mode; by analogy, numbering the central points of all regular polygons in the regular polygon mesh pattern, respectively P 1 、P 2 、P 3 ......P n . With P 1 Generating a two-dimensional coordinate system for the origin, and calculating to obtain two-dimensional coordinates of the central point of each regular polygon, such as P, according to the distance d between adjacent central points 1 (x)、P 1 (y) are each P 1 X, y coordinate values of (1), P 2 (x)、P 2 (y) are each P 2 X, y coordinate values of (1), P 3 (x)、P 3 (y) are each P 3 X, y coordinate values of (1), P n (x)、P n (y) are each P n X and y coordinate values of (1).
In the regular polygon mesh pattern, the center point (e.g. P) of three adjacent regular polygons is selected 1 、P 2 And P 3 ) The relationship between three adjacent central points is: p 2 (x)＝P 1 (x)，
P 3 (y)＝P 3 (y)+d/2。
In this way, the central points of the three regular polygons are selected for calculation each time, and the two-dimensional coordinates of the central points of the regular polygons are obtained.
In step S12, random perturbations are added to the x-axis direction coordinates and the y-axis direction coordinates of each center point in the regular polygonal mesh pattern by setting a random factor and calling a random number generation function, respectively, and the x-axis direction coordinates and the y-axis direction coordinates of each center point in the random mesh pattern are further calculated.
In the step of obtaining the coordinates of the center point of the random polygon, the coordinate values of the center point of the random grid pattern in the x-axis direction and the y-axis direction are calculated in the following manner:
Q n (x)＝P n (x)+R*Dx*rand(0，1)，
Q n (y)＝P n (y)+R*Dy*rand(0，1)；
wherein Q is n (x)、Q n (y) is the center point P of the corresponding regular polygon n X, y coordinate values, P, of a center point in the random grid pattern after random perturbation n (x)、P n (y) each represents P n X, y coordinate values of (1), P n M, m is the number of regular polygons, Dx and Dy are random factors in x and y directions, rand (0, 1) is a random number between 0 and 1, and R is the average value of the distances between all adjacent central points in the random mesh pattern.
In this embodiment, Dx is 0.8-1.5, Dy is 0.8-1.5; r is 50-500 um. Preferably, R is 150-300 um.
In step S13, a center point of any random polygon is selected as a center, a perpendicular bisector between the selected center point and a center point of each adjacent random polygon is obtained, and an intersection point of two adjacent perpendicular bisectors is taken as a vertex of the random polygon.
In other embodiments, the intersection point of two adjacent vertical lines is taken as the vertex of the random polygon through the vertical line between the selected central point and the central point of each adjacent random polygon.
In step S14, after the vertex information of the random polygon is obtained, a logical relationship between the vertices of the random mesh and the curved segments of the mesh pattern is established according to the random mesh arrangement rule and the geometric configuration of the conductive film, the coordinate information of each vertex is converted into the coordinate information of the turning point of the curved segment, and then the random mesh pattern of the conductive film is generated by setting parameters such as line width and line type and by means of drawing software. And finally, outputting the pattern as a vector format file for the next preparation and production of the non-angle transparent shielding random grid material or product.
Referring to fig. 4, an embodiment of the present invention further provides a method for manufacturing a conductive film with a random grid pattern, the method including:
s21: preparing the required random grid pattern by adopting the generation method of the random grid pattern of the conductive film;
s22: preparing a mold having the pattern according to a random grid pattern;
s23: providing a base material, wherein the base material comprises a transparent substrate and a curing glue layer coated on the transparent substrate;
s24: imprinting a mold on a substrate;
s25: demolding after curing, and forming a random grid pattern groove on the base material;
s26: filling a conductive material in the random grid pattern groove, and forming a conductive layer after curing;
s27: a conductive film having a random grid pattern is obtained.
In other embodiments, after step S26, before step S27, a separation step is provided. The separation step comprises the following specific steps: and separating the cured conductive layer from the substrate.
In this embodiment, the grooves of the random grid pattern have a depth of 3-10um and a width of 3-10 um.
Referring to fig. 5, the present invention further provides a conductive film with a random grid pattern, which includes a transparent substrate 4, a cured adhesive layer 5 and a conductive layer 6. The curing glue layer 5 is arranged on the transparent substrate 4, the curing glue layer 5 is provided with a random grid pattern groove 51, and the conducting layer 6 is embedded in the random grid pattern groove 51. The random mesh pattern includes a plurality of random polygons abutting each other. The vertex of the random polygon has a preset relationship with the central point of the random polygon and the central point of the random polygon adjacent to the random polygon; the central point of each random polygon has a random corresponding relation with the central points of the regular polygons arranged in the array.
In this embodiment, the conductive film having the random mesh pattern is manufactured by the above-described method for manufacturing a conductive film having a random mesh pattern.
In the present embodiment, the random mesh pattern groove 51 has a depth of 3-10um and a width of 3-10 um.
The random correspondence is formed in the following manner: and respectively adding random disturbance to the x-axis direction coordinates and the y-axis direction coordinates of each central point in the regular polygonal grid pattern by setting a random factor and calling a random number generation function.
Specifically, the random correspondence relationship is:
Q n (x)＝P n (x)+R*Dx*rand(0，1)，
Q n (y)＝P n (y)+R*Dy*rand(0，1)；
wherein Q is n (x)、Q n (y) is the center point P of the corresponding regular polygon n X, y coordinate values, P, of a center point in the random grid pattern after random perturbation n (x)、P n (y) each represents P n X, y coordinate values of (1), P n And representing the central point of each regular polygon in the regular polygon grid pattern, wherein n is 1.. m, m is the number of the regular polygons, Dx and Dy are random factors in x and y directions, rand (0, 1) is a random number between 0 and 1, and R is the average value of the distances between all adjacent central points in the random grid pattern.
The preset relation is as follows: the vertex of the random polygon is the intersection point of the perpendicular bisector and the adjacent perpendicular bisector between the central point of the random polygon and the central point of the random polygon adjacent to the random polygon.
In the drawings, the size and relative sizes of layers and regions may be exaggerated for clarity. It will be understood that when an element such as a layer, region or substrate is referred to as being "formed on," "disposed on" or "located on" another element, it can be directly on the other element or intervening elements may also be present. In contrast, when an element is referred to as being "directly formed on" or "directly disposed on" another element, there are no intervening elements present.
In this document, the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer", "vertical", "horizontal", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for the purpose of clarity and convenience of description of the technical solutions, and thus, should not be construed as limiting the present invention.
As used herein, the meaning of "a plurality" or "a plurality" is two or more unless otherwise specified.
As used herein, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, including not only those elements listed, but also other elements not expressly listed.
The above description is only for the specific embodiments of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present invention, and all the changes or substitutions should be covered within the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the appended claims.
Claims (10)
1. A method of generating a random mesh pattern of a conductive film, the random mesh pattern comprising a plurality of mutually adjoining random polygons, the method comprising:
providing a regular grid pattern with a plurality of regular polygons arranged in an array manner, wherein the regular polygons are mutually adjacent to each other, and the coordinates of the center point of each regular polygon are obtained;
presetting random disturbance on the coordinates of the central point of each regular polygon to obtain the coordinates of the central point of a random polygon;
obtaining each vertex of each random polygon, selecting a central point of any random polygon as a center, obtaining a perpendicular bisector between the selected central point and the central point of each adjacent random polygon, and taking the intersection point of two adjacent perpendicular bisectors as the vertex of the random polygon;
a random mesh pattern is generated using the vertices.
2. The method for generating a random mesh pattern of a conductive film according to claim 1, wherein in the step of obtaining coordinates of the center point of the random polygon: and adding random disturbance to the x-axis direction coordinates and the y-axis direction coordinates of each central point in the regular polygonal grid pattern by setting a random factor and calling a random number generation function, and further calculating the x-axis direction coordinates and the y-axis direction coordinates of each central point of the random grid pattern.
3. The method for generating a random mesh pattern of a conductive film according to claim 1, wherein in the step of obtaining coordinates of center points of the random polygons, coordinate values of x-axis direction and y-axis direction of each center point of the random mesh pattern are calculated in a manner that:
Q n (x)＝P n (x)+R*Dx*rand(0，1)，
Q n (y)＝P n (y)+R*Dy*rand(0，1)；
wherein Q is n (x)、Q n (y) is the center point P of the corresponding regular polygon n X, y coordinate values, P, of a center point in the random grid pattern after random perturbation n (x)、P n (y) each represents P n X, y coordinate values of (1), P n M, m is the number of the regular polygons, Dx and Dy are random factors in x and y directions, rand (0, 1) is a random number between 0 and 1, and R is the average value of the distances between all adjacent central points in the random mesh pattern.
4. The method for forming a random grid pattern of a conductive film according to claim 3, wherein Dx is 0.8 to 1.5, Dy is 0.8 to 1.5, and R is 50 to 500. mu.m.
5. The method for forming a random grid pattern of a conductive film according to claim 4, wherein R is 150-300 μm.
6. A method for manufacturing a conductive film with a random grid pattern is characterized by comprising the following steps:
obtaining a desired random mesh pattern by using the method for generating a random mesh pattern of a conductive film according to any one of claims 1 to 5;
preparing a mold having the pattern according to the random grid pattern;
providing a base material, wherein the base material comprises a transparent substrate and a curing glue layer coated on the transparent substrate;
imprinting the mold on the substrate;
demolding after curing;
forming a random grid pattern groove on the substrate;
filling a conductive material in the random grid pattern groove, and forming a conductive layer after curing;
a conductive film having a random grid pattern is obtained.
7. A conductive film with a random mesh pattern is manufactured by the manufacturing method of claim 6, and is characterized in that the conductive film with the random mesh pattern comprises a transparent substrate, a curing adhesive layer and a conductive layer, wherein the curing adhesive layer is arranged on the transparent substrate, the curing adhesive layer is provided with a random mesh pattern groove, the conductive layer is embedded in the random mesh pattern groove, the random mesh pattern comprises a plurality of mutually adjacent random polygons, the vertexes of the random polygons, the central points of the random polygons and the central points of the random polygons adjacent to the random polygons have preset relations, and the central points of the random polygons and the central points of the regular polygons arranged in an array have random corresponding relations.
8. The conductive film having a random grid pattern according to claim 7, wherein the random correspondence is formed in a manner that: and respectively adding random disturbance to the x-axis direction coordinates and the y-axis direction coordinates of each central point in the regular polygonal grid pattern by setting a random factor and calling a random number generation function.
9. The conductive film having a random grid pattern according to claim 8, wherein the random correspondence relationship is:
Q n (x)＝P n (x)+R*Dx*rand(0，1)，
Q n (y)＝P n (y)+R*Dy*rand(0，1)；
wherein Q is n (x)、Q n (y) is the center point P of the corresponding regular polygon n X, y coordinate values, P, of a center point in the random grid pattern after random perturbation n (x)、P n (y) each represents P n X, y coordinate values of (2), P n M, m is the number of the regular polygons, Dx and Dy are random factors in x and y directions, rand (0, 1) is a random number between 0 and 1, and R is the average value of the distances between all adjacent central points in the random mesh pattern.
10. The conductive film having a random grid pattern according to claim 7, wherein the predetermined relationship is: and the vertex of the random polygon is the intersection point of the perpendicular bisector and the adjacent perpendicular bisector between the central point of the random polygon and the central point of the random polygon adjacent to the random polygon.
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| TW201721377A (en) * | 2015-12-04 | 2017-06-16 | 介面光電股份有限公司 | Sensing metal mesh of touch panel and manufactureing method thereof |
| JP2017151801A (en) * | 2016-02-25 | 2017-08-31 | 三菱製紙株式会社 | Laminate of light transmissive conductive material |
| CN109659091A (en) * | 2017-10-12 | 2019-04-19 | 苏州维业达触控科技有限公司 | Design method, the preparation method of conductive film, conductive film and the display device of random grid |
| CN207851334U (en) * | 2018-02-08 | 2018-09-11 | 浙江锦辉光电材料有限公司 | The optical film being made of unit grid central point |
| CN109360251A (en) * | 2018-09-06 | 2019-02-19 | 秦皇岛波盾电子有限公司 | A kind of non-angular Transparent shielding random grid pattern generation method |
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| WO2021042522A1 (en) | 2021-03-11 |
| CN112445362A (en) | 2021-03-05 |
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