CN112435854A - Novel surface-packaged capacitor and manufacturing method thereof - Google Patents

Novel surface-packaged capacitor and manufacturing method thereof Download PDF

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Publication number
CN112435854A
CN112435854A CN202011413345.1A CN202011413345A CN112435854A CN 112435854 A CN112435854 A CN 112435854A CN 202011413345 A CN202011413345 A CN 202011413345A CN 112435854 A CN112435854 A CN 112435854A
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CN
China
Prior art keywords
anode
cathode
connecting groove
terminal
capacitor
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Pending
Application number
CN202011413345.1A
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Chinese (zh)
Inventor
宁连才
黄建耀
杨凯
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State Run Factory 4326 of China Zhenhua Group Xinyun Electronic Comp and Dev Co Ltd
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State Run Factory 4326 of China Zhenhua Group Xinyun Electronic Comp and Dev Co Ltd
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Application filed by State Run Factory 4326 of China Zhenhua Group Xinyun Electronic Comp and Dev Co Ltd filed Critical State Run Factory 4326 of China Zhenhua Group Xinyun Electronic Comp and Dev Co Ltd
Priority to CN202011413345.1A priority Critical patent/CN112435854A/en
Publication of CN112435854A publication Critical patent/CN112435854A/en
Priority to PCT/CN2021/133847 priority patent/WO2022116927A1/en
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/228—Terminals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
    • H01G2/14—Protection against electric or thermal overload
    • H01G2/16—Protection against electric or thermal overload with fusing elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/224—Housing; Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/38—Multiple capacitors, i.e. structural combinations of fixed capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/40—Structural combinations of fixed capacitors with other electric elements, the structure mainly consisting of a capacitor, e.g. RC combinations

Abstract

The application provides a novel surface packaging capacitor and a manufacturing method thereof, comprising the following steps: the capacitor comprises a first capacitor core, an electronic component, a first substrate, an anode bottom surface terminal, a cathode bottom surface terminal, a first anode leading-out end and a first cathode leading-out end. In this application embodiment, can make the inside route of forming all the way of novel surface package condenser through set up first anode connecting groove and first cathode connecting groove on first base plate for form two way parallelly connected equivalent resistance between novel surface package condenser's the internal component and the bottom surface terminal, and then reduced novel surface package condenser's ESR value, in addition, through an electronic components of inside series connection, the holistic voltage of novel surface package condenser has been improved, perhaps, add functional circuit (electronic components) on the basis of original single core structure, the reliability of novel surface package condenser has been improved.

Description

Novel surface-packaged capacitor and manufacturing method thereof
Technical Field
The application relates to the field of capacitors, in particular to a novel surface packaging capacitor and a manufacturing method of the novel surface packaging capacitor.
Background
The prior surface-packaged capacitor is of a single-core structure, and the terminal leading-out mainly depends on a cathode leading-out terminal and an anode leading-out terminal to lead the inside out to a bottom surface terminal. The mode has small connection area and single lead-out path, so that the surface packaging capacitor is unstable in connection and high in use risk, and the mode also enables the ESR (Equivalent Series Resistance) value of the surface packaging capacitor with the single-core structure to be larger.
Disclosure of Invention
An object of the embodiment of the present application is to provide a novel surface mount capacitor and a method for manufacturing the same, so as to solve the problem that "the surface mount capacitor with a single-core structure is unstable in connection, and has a high risk of use and a large ESR value".
The invention is realized by the following steps:
in a first aspect, the embodiment of the application provides a novel surface-mount capacitor, which comprises a first capacitor core, a second capacitor core and a third capacitor core, wherein the first capacitor core comprises a first anode lead wire, a first anode element and a first cathode element arranged on the outer layer of the first anode element, and the first anode lead wire is connected with the first anode element; an electronic component, one end of which is connected with the first cathode element; the first substrate is arranged at the bottoms of the first capacitor core and the electronic component and is provided with a first anode connecting groove and a first cathode connecting groove; a conductor is arranged in the first anode connecting groove and the first cathode connecting groove; the anode bottom terminal is arranged at the bottom of the first substrate and is connected with a side notch of the first anode connecting groove; one end of the conductor arranged in the first anode connecting groove is connected with the first anode leading-out wire, and the other end of the conductor arranged in the first anode connecting groove is connected with the upper surface of the anode bottom surface terminal; the cathode bottom terminal is arranged at the bottom of the first substrate and is connected with a side notch of the first cathode connecting groove; one end of the conductor arranged in the first cathode connecting groove is connected with the other end of the electronic component, and the other end of the conductor arranged in the first cathode connecting groove is connected with the upper surface of the cathode bottom terminal; a first anode lead-out terminal connected to the first anode lead-out wire and the anode bottom surface terminal; and the first cathode leading-out end is connected with the other end of the electronic component and the cathode bottom surface terminal.
In this application embodiment, can make the inside route of forming all the way of novel surface package condenser through set up first anode connecting groove and first cathode connecting groove on first base plate for form two way parallelly connected equivalent resistance between novel surface package condenser's the internal component and the bottom surface terminal, and then reduced novel surface package condenser's ESR value, in addition, through an electronic components of inside series connection, the holistic voltage of novel surface package condenser has been improved, perhaps, add functional circuit (electronic components) on the basis of original single core structure, the reliability of novel surface package condenser has been improved.
With reference to the technical solution provided by the first aspect, in some possible implementation manners, the electronic component is a second capacitor core, the second capacitor core includes a second anode lead-out wire, a second anode element, and a second cathode element disposed on an outer layer of the second anode element, and the second anode lead-out wire is connected to the second anode element; the second anode lead wire is connected with the first cathode element; correspondingly, one end of the electric conductor of the first cathode connecting groove is connected with the second cathode element.
The embodiment of the application provides a novel surface packaging capacitor who contains two electric capacity cores, has improved whole novel surface packaging capacitor's voltage through two electric capacity cores of establishing ties inside novel surface packaging capacitor, and then has improved the stability and the reliability of product, and through fluting on first base plate, has reduced the ESR value of the novel surface packaging capacitor who contains two electric capacity cores. In addition, the mode of connecting two capacitor cores in series is adopted, when one capacitor core is damaged, if the capacitor core is short-circuited, the other capacitor core connected in series can be used, the condition that the single-core failure causes the failure of the whole novel surface packaging capacitor is avoided, and the reliability of the novel surface packaging capacitor is improved.
With reference to the technical solution provided by the first aspect, in some possible implementation manners, the number of the electronic components is multiple, the electronic components are connected in series, a second anode outgoing line of a first electronic component of the electronic components is connected to the first cathode element, and one end of the conductor of the first cathode connection groove is connected to the second cathode element of a last electronic component of the electronic components.
With reference to the technical solution provided by the first aspect, in some possible implementation manners, the electronic component is a fuse; one end of the fuse is connected with the first cathode element; one end of the conductor of the first cathode connecting groove is connected with the other end of the fuse.
In the embodiment of the application, a fuse is connected in series inside the novel surface-mount capacitor, so that when the current of the novel surface-mount capacitor abnormally rises to a certain height, the fuse is fused to cut off the current, and the external circuit applied by a user is protected.
With reference to the technical solution provided by the first aspect, in some possible implementation manners, the electronic component includes: a second capacitor core and a fuse; the second capacitor core is connected with the fuse in series.
With reference to the technical solution provided by the first aspect, in some possible implementation manners, the electronic component is a diode, and an anode of the diode is connected to the first cathode element; one end of the conductor of the first cathode connecting groove is connected with the cathode of the diode.
In the embodiment of the application, the diode is connected in series in the novel surface-mount capacitor, and the forward conduction and cut-off prevention characteristics of the diode are further utilized, so that the reliability and the safety of the novel surface-mount capacitor are improved when the novel surface-mount capacitor is impacted by reverse voltage in an external circuit applied by a user.
With reference to the technical solution provided by the first aspect, in some possible implementation manners, a pad is disposed on the top of the substrate, and one end of the electronic component is connected to the first cathode element through the pad.
With reference to the technical solution provided by the first aspect, in some possible implementation manners, the novel surface-mount capacitor further includes a third capacitor core; the third capacitor core comprises a third anode lead-out wire, a third anode element and a third cathode element arranged on the outer layer of the third anode element, and the third anode lead-out wire is connected with the third anode element; the third capacitor core is arranged on the first substrate, and the third anode outgoing line is connected with the first anode outgoing end; the third cathode element is connected with the first cathode lead-out end; one end of the electric conductor arranged in the first anode connecting groove is also connected with the third anode outgoing line; one end of the conductor provided in the first cathode connection groove is further connected to the third cathode element.
With reference to the technical solution provided by the first aspect, in some possible implementation manners, the novel surface-mount capacitor further includes a third capacitor core; the third capacitor core comprises a third anode lead-out wire, a third anode element and a third cathode element arranged on the outer layer of the third anode element, and the third anode lead-out wire is connected with the third anode element; the third capacitor core is arranged above the first capacitor core; the third anode outgoing line is connected with the first anode outgoing end; the third cathode element is connected to the first cathode lead.
With reference to the technical solution provided by the first aspect, in some possible implementation manners, the novel surface-mount capacitor further includes: the fourth capacitor core, the second substrate, a second anode leading-out end and a second cathode leading-out end; the fourth capacitor core comprises a fourth anode lead-out wire, a fourth anode element and a fourth cathode element arranged on the outer layer of the fourth anode element, and the fourth anode lead-out wire is connected with the fourth anode element; the second substrate is arranged on one side, away from the first substrate, of the anode bottom surface terminal and the cathode bottom surface terminal; the fourth capacitor core is arranged on the other side of the second substrate; the second substrate is provided with a second anode connecting groove and a second cathode connecting groove; electric conductors are arranged in the second anode connecting groove and the second cathode connecting groove; one end of the conductor arranged in the second anode connecting groove is connected with the fourth anode outgoing line, and the other end of the conductor arranged in the second anode connecting groove is connected with the lower surface of the anode bottom surface terminal; one end of the conductor arranged in the second cathode connecting groove is connected with one end of the fourth cathode element, and the other end of the conductor arranged in the cathode connecting groove is connected with the lower surface of the cathode bottom surface terminal; a second anode lead-out terminal connected to the fourth anode lead-out wire and the anode bottom surface terminal; and a second cathode lead connected to the fourth cathode element and the cathode bottom surface terminal.
In a second aspect, an embodiment of the present application further provides a novel surface-mount capacitor, including: the first capacitor core comprises a first anode lead wire, a first anode element and a first cathode element arranged on the outer layer of the first anode element, wherein the first anode lead wire is connected with the first anode element; an electronic component, one end of which is connected with the first cathode element; the first capacitor core and the electronic component are filled with packaging materials to form a shell; the first substrate is arranged at the bottoms of the first capacitor core and the electronic component; an anode lead-out terminal connected with the first anode lead-out wire; the cathode leading-out end is connected with the other end of the electronic component; an anode lead-out cover; the anode leading-out cover comprises a first cover plate and a first side plate which is perpendicular to the first cover plate; the first cover plate is connected with the anode leading-out end; when the first cover plate is connected with the anode leading-out end, the first side plate is arranged on the side wall of the shell; a cathode lead-out cover; the cathode leading-out cover comprises a second cover plate and a second side plate which is perpendicular to the second cover plate; the second cover plate is connected with the cathode leading-out end; and when the second cover plate is connected with the cathode leading-out end, the second side plate is arranged on the side wall of the shell.
In a third aspect, an embodiment of the present application further provides a novel surface-mount capacitor, including: the first capacitor core comprises a first anode lead wire, a first anode element and a first cathode element arranged on the outer layer of the first anode element, wherein the first anode lead wire is connected with the first anode element; the second capacitor core comprises a second anode lead wire, a second anode element and a second cathode element arranged on the outer layer of the second anode element, and the second anode lead wire is connected with the second anode element; the substrate is arranged at the bottoms of the first capacitor core and the second capacitor core and is provided with an anode connecting groove and a cathode connecting groove; electric conductors are arranged in the anode connecting groove and the cathode connecting groove; the anode bottom terminal is arranged at the bottom of the substrate and is connected with a side notch of the anode connecting groove; one end of the conductor arranged in the anode connecting groove is connected with the first anode leading-out wire and the second anode leading-out wire respectively, and the other end of the conductor arranged in the anode connecting groove is connected with the upper surface of the anode bottom surface terminal; the cathode bottom terminal is arranged at the bottom of the substrate and is connected with a side notch of the cathode connecting groove; one end of the conductor arranged in the cathode connecting groove is respectively connected with the first cathode element and the second cathode element, and the other end of the conductor arranged in the cathode connecting groove is connected with the upper surface of the cathode bottom surface terminal; an anode lead-out terminal connected to the first anode lead-out wire, the second anode lead-out wire, and the anode bottom surface terminal; and a cathode lead terminal connected to the first cathode element, the second cathode element, and the cathode bottom surface terminal.
In the embodiment of the application, can make the inside route of forming all the way of novel surface packaging capacitor through seting up first anode connecting groove and second cathode connecting groove on first base plate, make form two parallelly connected equivalent resistance between novel surface packaging capacitor's internal component and the bottom surface terminal, and then reduced novel surface packaging capacitor's ESR value, in addition, through the parallelly connected electric capacity core of inside, the ESR value of novel surface packaging capacitor that can further reduce, and, adopt parallelly connected mode, damage when one of them electric capacity core, if lead to the back that opens circuit, can use another parallelly connected electric capacity core, avoid appearing the condition that single core became invalid and lead to whole novel surface packaging capacitor to become invalid, novel surface packaging capacitor's reliability has been improved.
With reference to the technical solution provided by the third aspect, in some possible implementation manners, the novel surface-mount capacitor further includes a third capacitor core; the third capacitor core comprises a third anode lead-out wire, a third anode element and a third cathode element arranged on the outer layer of the third anode element, and the third anode lead-out wire is connected with the third anode element; the third capacitor core is arranged above the first capacitor core or the second capacitor core, and the third anode outgoing line is connected with the anode outgoing end; the third cathode element is connected with the cathode lead-out terminal.
In a fourth aspect, an embodiment of the present application further provides a novel surface-mount capacitor, including: the first capacitor core comprises a first anode lead wire, a first anode element and a first cathode element arranged on the outer layer of the first anode element, wherein the first anode lead wire is connected with the first anode element; the second capacitor core comprises a second anode lead wire, a second anode element and a second cathode element arranged on the outer layer of the second anode element, and the second anode lead wire is connected with the second anode element; the first capacitor core and the second capacitor core are filled with packaging materials to form a shell; the substrate is arranged at the bottoms of the first capacitor core and the second capacitor core; an anode lead-out terminal connected to the first anode lead-out wire and the second anode lead-out wire; a cathode lead terminal connected to the first cathode element and the second cathode element terminal; an anode lead-out cover; the anode leading-out cover comprises a first cover plate and a first side plate which is perpendicular to the first cover plate; the first cover plate is connected with the anode leading-out end; when the first cover plate is connected with the anode leading-out end, the first side plate is arranged on the side wall of the shell; a cathode lead-out cover; the cathode leading-out cover comprises a second cover plate and a second side plate which is perpendicular to the second cover plate; the second cover plate is connected with the cathode leading-out end; and when the second cover plate is connected with the cathode leading-out end, the first side plate is arranged on the side wall of the shell.
In a fifth aspect, an embodiment of the present application further provides a novel surface-mount capacitor, including: the first capacitor core comprises a first anode lead wire, a first anode element and a first cathode element arranged on the outer layer of the first anode element, wherein the first anode lead wire is connected with the first anode element; the second capacitor core comprises a second anode lead wire, a second anode element and a second cathode element arranged on the outer layer of the second anode element, and the second anode lead wire is connected with the second anode element; a interlayer plate including a first substrate, a second substrate, and an anode bottom surface terminal and a cathode bottom surface terminal disposed between the first substrate and the second substrate; the first capacitor core is arranged on the first substrate, and the second capacitor core is arranged on the second substrate; the first substrate is provided with a first anode connecting groove and a first cathode connecting groove, the second substrate is provided with a second anode connecting groove and a second cathode connecting groove, the first anode connecting groove, the first cathode connecting groove, the second anode connecting groove and the second cathode connecting groove are all provided with electric conductors, one end of the electric conductor arranged in the first anode connecting groove is connected with the first anode outgoing line, and the other end of the electric conductor arranged in the first anode connecting groove is connected with the first surface of the anode bottom surface terminal; one end of the conductor arranged in the first cathode connecting groove is connected with the first cathode element, and the other end of the conductor arranged in the first cathode connecting groove is connected with the first surface of the cathode bottom terminal; one end of the conductor arranged in the second anode connecting groove is connected with the second anode outgoing line, and the other end of the conductor arranged in the second anode connecting groove is connected with the second surface of the anode bottom surface terminal; one end of the conductor arranged in the second cathode connecting groove is connected with the second cathode element, and the other end of the conductor arranged in the second cathode connecting groove is connected with the second surface of the cathode bottom surface terminal; a first anode lead-out terminal connected to the first anode lead-out wire and the anode bottom surface terminal; a first cathode lead connected to the first cathode element and the cathode bottom surface terminal; a second anode lead-out terminal connected to the second anode lead-out wire and the anode bottom surface terminal; and a second cathode lead connected to the second cathode element and the cathode bottom surface terminal.
With reference to the technical solution provided by the fifth aspect, in some possible implementations, the novel surface mount capacitor further includes a third capacitor core, where the third capacitor core includes a third anode outgoing line, a third anode element, and a third cathode element disposed on an outer layer of the third anode element, and the third anode outgoing line is connected to the third anode element; the third capacitor core is arranged on the first substrate; the third anode outgoing line is connected with the first anode outgoing end; the third cathode element is connected to the cathode bottom surface terminal; one end of the conductor arranged in the first anode connecting groove is also connected with the third anode outgoing line, and one end of the conductor arranged in the first cathode connecting groove is also connected with the third cathode element.
With reference to the technical solution provided by the fifth aspect, in some possible implementation manners, the first capacitor core and the second capacitor core are filled with an encapsulation material to form a housing; the novel surface-packaged capacitor also comprises an anode leading-out cover; the anode leading-out cover comprises a cover plate and a side plate which is perpendicular to the cover plate; the cover plate is connected with the anode bottom surface terminal; and when the cover plate is connected with the anode bottom surface terminal, the side plate is arranged on the side wall of the shell.
With reference to the technical solution provided by the fifth aspect, in some possible implementations, the number of the side plates is the same as the number of the side walls of the housing.
With reference to the technical solution provided by the fifth aspect, in some possible implementation manners, the first capacitor core and the second capacitor core are filled with an encapsulation material to form a housing; the novel surface-packaged capacitor also comprises a cathode leading-out cover; the cathode leading-out cover comprises a cover plate and a side plate which is perpendicular to the cover plate; the cover plate is connected with the cathode bottom surface terminal; and when the cover plate is connected with the cathode bottom surface terminal, the side plate is arranged on the side wall of the shell.
With reference to the technical solution provided by the fifth aspect, in some possible implementations, the number of the side plates is the same as the number of the side walls of the housing.
In a sixth aspect, an embodiment of the present application provides a novel surface-mount capacitor, including: the first capacitor core comprises a first anode lead wire, a first anode element and a first cathode element arranged on the outer layer of the first anode element, wherein the first anode lead wire is connected with the first anode element; the second capacitor core comprises a second anode lead wire, a second anode element and a second cathode element arranged on the outer layer of the second anode element, and the second anode lead wire is connected with the second anode element; the first cathode element is connected with the second cathode element; the substrate is arranged at the bottoms of the first capacitor core and the second capacitor core, and a first anode connecting groove, a second anode connecting groove and a cathode connecting groove are formed in the substrate; the first anode connecting groove, the second anode connecting groove and the cathode connecting groove are internally provided with electric conductors; the first anode bottom surface terminal is arranged on the first side of the bottom of the substrate and is connected with a side notch of the first anode connecting groove; one end of the conductor arranged in the first anode connecting groove is connected with the first anode leading-out wire, and the other end of the conductor arranged in the first anode connecting groove is connected with the upper surface of the first anode bottom surface terminal; the second anode bottom surface terminal is arranged on the second side of the bottom of the substrate and is connected with a side notch of the second anode connecting groove; wherein the first side and the second side are opposite sides; one end of the conductor arranged in the second anode connecting groove is connected with the second anode outgoing line, and the other end of the conductor arranged in the second anode connecting groove is connected with the upper surface of the second anode bottom surface terminal; the cathode bottom terminal is arranged in the middle of the bottom of the substrate and is connected with a side notch of the cathode connecting groove; one end of the conductor arranged in the cathode connecting groove is connected with the connecting end of the first cathode element and the second cathode element, and the other end of the conductor arranged in the cathode connecting groove is connected with the upper surface of the cathode bottom surface terminal; a first anode lead-out terminal connected to the first anode lead-out wire and the first anode bottom surface terminal; and a second anode lead-out terminal connected to the second anode lead-out wire and the second anode bottom surface terminal.
In a seventh aspect, an embodiment of the present application provides a novel surface-mount capacitor, including: the capacitor core comprises a first anode lead wire, a second anode lead wire, an anode element and a cathode element arranged on the outer layer of the anode element, wherein the first anode lead wire is connected with the first end of the anode element, and the second anode lead wire is connected with the second end of the anode element; wherein the first end and the second end are opposite ends; the substrate is arranged at the bottom of the capacitor core, and a first anode connecting groove, a second anode connecting groove and a cathode connecting groove are formed in the substrate; the first anode connecting groove, the second anode connecting groove and the cathode connecting groove are internally provided with electric conductors; the first anode bottom surface terminal is arranged on the first side of the bottom of the substrate and is connected with a side notch of the first anode connecting groove; one end of the conductor arranged in the first anode connecting groove is connected with the first anode leading-out wire, and the other end of the conductor arranged in the first anode connecting groove is connected with the upper surface of the first anode bottom surface terminal; the second anode bottom surface terminal is arranged on the second side of the bottom of the substrate and is connected with a side notch of the second anode connecting groove; wherein the first side and the second side are opposite sides; one end of the conductor arranged in the second anode connecting groove is connected with the second anode outgoing line, and the other end of the conductor arranged in the second anode connecting groove is connected with the upper surface of the second anode bottom surface terminal; the cathode bottom terminal is arranged in the middle of the bottom of the substrate and is connected with a side notch of the cathode connecting groove; one end of the conductor arranged in the cathode connecting groove is connected with the cathode element, and the other end of the conductor arranged in the cathode connecting groove is connected with the upper surface of the cathode bottom surface terminal; a first anode lead-out terminal connected to the first anode lead-out wire and the first anode bottom surface terminal; and a second anode lead-out terminal connected to the second anode lead-out wire and the second anode bottom surface terminal.
In an eighth aspect, an embodiment of the present application provides a method for manufacturing a novel surface-mount capacitor, including: providing a substrate; an anode connecting groove and a cathode connecting groove are formed in the substrate; filling an electric conductor into the anode connecting groove and the cathode connecting groove; bonding a first capacitor core and an electronic component to the substrate so that the conductor in the anode connecting groove is connected with the anode bottom terminal and the anode lead-out wire of the first capacitor core, and the conductor in the cathode connecting groove is connected with the cathode bottom terminal and one end of the electronic component; the other end of the electronic component is connected with the cathode element of the first capacitor core; and carrying out packaging test.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are required to be used in the embodiments of the present application will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present application and therefore should not be considered as limiting the scope, and that those skilled in the art can also obtain other related drawings based on the drawings without inventive efforts.
Fig. 1 is a schematic structural diagram of a surface mount capacitor in the prior art.
Fig. 2 is a schematic structural diagram of a first novel surface-mount capacitor provided in an embodiment of the present application.
Fig. 3 is a schematic structural diagram of a second novel surface-mount capacitor provided in an embodiment of the present application.
Fig. 4 is a schematic structural diagram of a third novel surface-mount capacitor provided in an embodiment of the present application.
Fig. 5 is a schematic structural diagram of a fourth novel surface-mount capacitor provided in an embodiment of the present application.
Fig. 6 is a schematic structural diagram of a fifth novel surface-mount capacitor provided in an embodiment of the present application.
Fig. 7 is a schematic structural diagram of a sixth novel surface-mount capacitor provided in an embodiment of the present application.
Fig. 8 is a schematic structural diagram of a seventh novel surface mount capacitor provided in an embodiment of the present application.
Fig. 9 is a simplified structural diagram of a seventh novel surface-mount capacitor according to an embodiment of the present disclosure.
Fig. 10 is a schematic structural diagram of an eighth novel surface-mount capacitor provided in an embodiment of the present application.
Fig. 11 is a schematic structural diagram of a ninth novel surface-mount capacitor provided in an embodiment of the present application.
Fig. 12 is a schematic structural diagram of a tenth novel surface-mount capacitor provided in an embodiment of the present application.
Fig. 13 is a schematic structural diagram of an eleventh novel surface-mount capacitor provided in an embodiment of the present application.
Fig. 14 is a schematic structural diagram of a twelfth novel surface-mount capacitor provided in an embodiment of the present application.
Fig. 15 is a simplified structural diagram of a twelfth novel surface-mount capacitor according to an embodiment of the present disclosure.
Fig. 16 is a schematic structural diagram of a thirteenth novel surface-mount capacitor provided in an embodiment of the present application.
Fig. 17 is a schematic structural diagram of a fourteenth novel surface-mount capacitor provided in an embodiment of the present application.
Fig. 18 is a schematic structural diagram of a fifteenth novel surface-mount capacitor provided in an embodiment of the present application.
Fig. 19 is a schematic structural diagram of a sixteenth novel surface-mount capacitor provided in an embodiment of the present application.
Fig. 20 is a schematic structural diagram of a seventeenth novel surface-mount capacitor provided in an embodiment of the present application.
Icon:
100-surface package capacitor; 1-an anode element; 2-a cathode element; 20-a dielectric layer; 21-a cathode layer; a 22-carbon layer; 23-a silver layer; 24-cathode silver paste; 3-anode leading-out end; 4-cathode leading-out terminal; 5-anode lead-out wire; 6-anode bottom terminal; 7-cathode bottom terminal; 8-a substrate; 9-packaging material; 10-anode connecting groove; 11-cathode connecting grooves; 12-an insulator;
100A-New surface-packaged capacitor; 1 a-a first capacitor core; 11 a-a first anode lead-out line; 12 a-a first anode element; 13 a-a first cathode element; 2 a-electronic components; 21 a-a second anode lead; 22 a-a second anode element; 23 a-a second cathode element; 3 a-a first substrate; 31 a-a first anode connection slot; 32 a-first cathode connecting groove; 4 a-anode backplane terminal; 5 a-cathode bottom terminal; 6 a-a first anode lead-out; 7 a-a first cathode lead-out; 8 a-pad; 9 a-a third capacitive core; 10 a-a fourth capacitive core; 101 a-a fourth anode lead-out line; 102 a-a fourth anode element; 103 a-a fourth cathode element; 110 a-a second substrate; 120 a-a second anode lead-out; 130 a-a second cathode lead;
100B-New surface-packaged capacitors; 1 b-a first capacitor core; 2 b-a second capacitive core; 3 b-a third capacitor core;
100C-New surface-packaged capacitors; 1 c-a first capacitor core; 11c — a first anode lead; 12 c-a first anode element; 13 c-a first cathode element; 2 c-a second capacitive core; 21 c-a second anode lead; 22 c-a second anode element; 23 c-a second cathode element; 3 c-a interlayer plate; 31 c-a first substrate; 32 c-a second substrate; 33 c-anode bottom terminal; 34 c-cathode bottom terminal; 4 c-a first anode lead-out; 5 c-a first cathode lead-out; 6 c-a second anode lead-out terminal; 7 c-a second cathode lead-out; 8 c-a third capacitor core;
100D-New surface-packaged capacitors; 1 d-a first capacitor core; 11 d-first anode lead; 12 d-a first anode element; 13 d-a first cathode element; 2 d-electronic components; 21 d-a second anode lead; 22 d-a second anode element; 23 d-a second cathode element; 3 d-a substrate; 4 d-first anode bottom terminal; 5 d-a second anode bottom terminal; 6 d-cathode bottom terminal; 7 d-first anode lead-out terminal; 8 d-a second anode leading-out terminal;
100E-New surface-packaged capacitors; 1 e-capacitor core; 11e a first anode lead; 12 e-a second anode lead-out line; 13 e-an anode element; 14 e-a cathode element; 2 e-a substrate; 3 e-first anode bottom surface terminal; 4 e-a second anode bottom surface terminal; 5 e-cathode bottom terminal; 6 e-a first anode lead-out terminal; 7 e-second anode lead-out.
Detailed Description
The technical solutions in the embodiments of the present application will be described below with reference to the drawings in the embodiments of the present application.
The current surface packaged capacitor is mostly of a single-core structure, and the terminal leading-out mainly depends on a cathode leading-out end and an anode leading-out end to lead out the inside to a bottom surface terminal. As shown in fig. 1, the prior art discloses a surface mount capacitor comprising a capacitor core (including an anode element, a cathode element disposed outside the anode element, and an anode lead connected to the anode element), an anode lead, a cathode lead, an anode bottom terminal, a cathode bottom terminal, and a substrate. The surface-packaged capacitor leads the anode out to the anode bottom terminal through the anode connecting wire and the anode leading-out end; the cathode is led out to the cathode bottom surface terminal through the cathode lead-out terminal. As can be seen from the figure, the connection area of the surface packaging capacitor is small, so that the surface packaging capacitor is not stable in connection and high in use risk, and the ESR value of the surface packaging capacitor with the single-core structure is large. In view of the above problems, the present inventors have studied and researched to provide the following embodiments to solve the above problems.
Firstly, the novel surface-mount capacitor that this application embodiment provided can make the inside route of forming all the way of novel surface-mount capacitor through fluting the base plate for form two way parallelly connected equivalent resistance between novel surface-mount capacitor's internal component and the bottom surface terminal, and then reduced novel surface-mount capacitor's ESR value, improved novel surface-mount capacitor's reliability.
Next, how to open the slot on the substrate when the novel surface-mount capacitor is a single core will be described.
Referring to fig. 2, an embodiment of the present invention provides a novel surface-mount capacitor 100, including: the capacitor core (the capacitor core comprises an anode element 1, a cathode element 2 arranged on the outer layer of the anode element and an anode lead-out wire 5 connected with the anode element), an anode lead-out end 3, a cathode lead-out end 4, an anode bottom surface terminal 6, a cathode bottom surface terminal 7 and a substrate 8.
A dielectric layer 20 is disposed between the anode element 1 and the cathode element 2, and the cathode element 2 includes a cathode layer 21, a carbon layer 22, and a silver layer 23, which are sequentially disposed, that is, the dielectric layer 20, the cathode layer 21, the carbon layer 22, and the silver layer 23 are sequentially disposed outside the anode element 1. The silver layer 23 is connected to a cathode silver paste 24. The cathode layer 21 of the cathode element 2 comprises one or more of manganese dioxide, polypyrrole, polythiophene, polyaniline, polyphenylpropylamine and their respective derivatives. That is, the cathode layer 21 may comprise only one component, such as the cathode layer 21 comprising only manganese dioxide, only polythiophene; cathode layer 21 may also comprise two components, e.g. cathode layer 21 comprises polyaniline and polyaniline derivatives; cathode layer 21 may also include three components including, for example, manganese dioxide, polyaniline, and polyphenylpropylamine. Correspondingly, the cathode layer 21 may also comprise four, five or six components. The present application is not limited thereto.
The density of the cathode layer 21 was in the range of 5.0 g/cm-3～14.0g·cm-3. When the density of the cathode layer 21 was controlled to 5.0 g/cm-3～14.0g·cm-3In between, the ESR value reduction effect is particularly remarkable.
Wherein the anode lead-out wire 5 is connected to the anode element 1. The exterior of the anode lead-out wire 5, the anode element 1 and the cathode element 2 is filled with an encapsulating material 9. The sealing material 9 may be, but not limited to, a plastic sealing resin or a phenol resin. Specifically, the plastic package resin may also be an epoxy plastic package resin.
The substrate 8 is disposed at the bottom of the anode element 1 and the cathode element 2. In the embodiment of the present application, the substrate 8 is provided with an anode connecting groove 10 and a cathode connecting groove 11; an electric conductor is arranged in the anode connecting groove 10 and the cathode connecting groove 11. The conductive body may be, but is not limited to, a conductive silver paste, a conductive ink, and the like. The conductor may also be a conductive paste having adhesiveness, such as Au (elemental gold), Pd (elemental palladium), Ni (elemental nickel), or the like.
An anode bottom terminal 6 disposed at the bottom of the substrate 8 and connected to one side of the anode connecting groove 10; one end of the conductor provided in the anode connecting groove 10 is connected to the anode lead wire 5, and the other end of the conductor provided in the anode connecting groove 10 is connected to the upper surface of the anode bottom surface terminal 6. As shown in fig. 2, the conductor in the anode connecting groove 10 is deposited between the anode lead wire 5 and the upper surface of the anode bottom surface terminal 6. That is, in an actual manufacturing process, when the anode element 1 is fixed to the substrate 8 provided with the anode connecting grooves 10, a conductive body is injected into the anode connecting grooves 10, so that the conductive body in the anode connecting grooves 10 is accumulated to be connected to the anode lead-out wires 5.
A cathode bottom terminal 7 disposed at the bottom of the substrate 8 and connected to one side notch of the cathode connecting groove 11; one end of the conductor provided in the cathode connecting groove 11 is connected to the cathode element 2 (in the drawing, connected to the cathode element 2 through the cathode silver paste 24), and the other end of the conductor provided in the cathode connecting groove 11 is connected to the upper surface of the cathode bottom surface terminal 7. As shown in fig. 2, the conductor in the cathode connecting groove 11 is deposited between the cathode silver paste 24 and the upper surface of the cathode bottom surface terminal 7. That is, in an actual manufacturing process, when the cathode element 2 is fixed to the substrate 8 provided with the cathode connecting grooves 11, a conductor is injected into the cathode connecting grooves 11, so that the conductor in the cathode connecting grooves 11 is accumulated to be connected to the cathode silver paste 24.
The anode lead terminal 3 is connected to an anode lead wire 5 and an anode bottom surface terminal 6. That is, the external connection is formed through the anode tap 3.
Cathode lead 4 is connected to cathode element 2 and cathode bottom terminal 7. That is, the external connection is formed through the cathode lead 4. Specifically, the cathode lead 4 is connected to the cathode element 2 through a cathode silver paste 24.
In the embodiment of the present application, the anode lead 3 and the cathode lead 4 are plated layers, and in particular, the plated layers may be formed by electroplating or chemical plating. When the plating layer is formed by electroless plating, the plating layer is composed of an inner plating layer formed by electroless plating of Ni/P (elemental nickel/elemental phosphorus) and an outer plating layer formed by electroless plating of Au (elemental gold) or Sn (elemental tin). In order to reduce the manufacturing cost of the novel surface-mount capacitor 100, the plating layer may be formed by dipping or paste plating.
Optionally, in order to effectively ensure the short circuit between the conductive body inside the anode connecting groove 10 and the cathode element 2, an insulator 12 is further provided between the conductive body of the anode connecting groove 10 and the cathode element 2. The insulator may be ceramic, rubber, etc., and the present application is not limited thereto.
In other embodiments, in order to ensure that the electrical conductor in the anode connecting groove 10 can effectively communicate with the anode lead-out wire 5 and the anode bottom terminal 6, and in order to ensure that the electrical conductor in the cathode connecting groove 11 can effectively communicate with the cathode element 2 and the cathode bottom terminal 7, the deformation is not easily generated, and optionally, the other side notch of the anode connecting groove 10 extends to be connected with the anode lead-out wire 5. The other side notch of the cathode connecting groove 11 extends to be connected with the cathode element 2 (the other side notch of the cathode connecting groove 11 extends to the cathode silver paste 24 to be connected with the cathode element 2). Alternatively, the number of the anode connecting grooves 10 formed on the base plate 8 may also be at least two, and correspondingly, the number of the cathode connecting grooves 11 formed on the base plate 8 may also be at least two. The present application is not limited thereto.
In summary, in the embodiment of the present application, by providing the anode connecting groove 10 and the cathode connecting groove 11 on the substrate 8, the anode element 1 can be conducted to the anode bottom terminal 6 through the electrical conductor in the anode connecting groove 10, the cathode element 2 can be conducted to the cathode bottom terminal 7 through the electrical conductor in the cathode connecting groove 11, so that two parallel equivalent resistances are formed between the anode element 1 and the anode bottom terminal 6 (one is an internal circuit formed by the electrical conductor in the anode connecting groove 10 connecting the anode element 1 and the anode bottom terminal 6, the other is an external circuit formed by the anode terminal 3), two parallel equivalent resistances are formed between the cathode element 2 and the cathode bottom terminal 7 (one is an internal circuit formed by the electrical conductor in the cathode connecting groove 11 connecting the cathode element 2 and the cathode bottom terminal 7, and the other is an external circuit formed by the cathode terminal 4), and then the ESR value of the novel surface mount capacitor 100 is reduced, and the reliability of the novel surface mount capacitor 100 is improved.
The above is a description of how to open the slot on the substrate when the novel surface-mount capacitor is a single core. The novel surface-packaged capacitor provided by the embodiment of the application comprises at least two capacitor cores or one capacitor core and at least one electronic component. The internal components can be connected in series, parallel and three-terminal non-polar connection modes.
First, a connection mode of a capacitor core and at least one electronic component connected in series inside the surface-mount capacitor will be described. For convenience of understanding, the schematic diagrams in the following embodiments are simplified schematic diagrams, and the following schematic diagrams mainly show a connection relationship between internal components, and other internal structures may refer to a complete structure shown in fig. 2.
Referring to fig. 3, an embodiment of the present invention provides a novel surface-mount capacitor 100A, including: a first capacitor element 1a, an electronic component 2a, a first substrate 3a, an anode bottom plate terminal 4a, a cathode bottom surface terminal 5a, a first anode lead-out terminal 6a, and a first cathode lead-out terminal 7 a.
The first condenser core 1a includes a first anode lead 11a, a first anode element 12a, and a first cathode element 13a disposed on the outer layer of the first anode element 12 a; the first anode lead wire 11a is connected to the first anode element 12 a.
One end of the electronic component 2a is connected to the first cathode element 13 a.
The first substrate 3a is disposed at the bottom of the first condenser core 1a and the electronic component 2 a. The first substrate 3a is provided with a first anode connecting groove 31a and a first cathode connecting groove 32 a; a conductive body is provided in the first anode connecting groove 31a and the first cathode connecting groove 32 a. For the description of the conductive body, reference may be made to the description of the foregoing embodiments, and in order to avoid redundancy, the description will not be repeated in the following embodiments.
An anode bottom surface terminal 4a is disposed at the bottom of the first substrate 3a and connected to one side notch of the first anode connecting groove 31 a; one end of the conductor provided in the first anode connecting groove 31a is connected to the first anode lead wire 11a, and the other end of the conductor provided in the first anode connecting groove 31a is connected to the upper surface of the anode bottom surface terminal 4 a. The cathode bottom terminal 5a is disposed at the bottom of the first substrate 3a and connected to one side notch of the first cathode connecting groove 32 a; one end of the conductor provided in the first cathode connecting groove 32a is connected to the other end of the electronic component 2a, and the other end of the conductor provided in the first cathode connecting groove 32a is connected to the upper surface of the cathode bottom terminal 5 a.
The first anode lead 6a is connected to the first anode lead 11a and the anode bottom surface terminal 4 a. The first cathode lead 7a is connected to the other end of the electronic component 2a and the cathode bottom terminal 5 a.
In this embodiment, through set up first anode connection groove 31a and first cathode connection groove 32a on first base plate 3a and can make the inside route of forming all the way of novel surface package condenser 100A, make to form two parallelly connected equivalent resistance of way between novel surface package condenser 100A's the internal component and the bottom surface terminal, and then reduced novel surface package condenser 100A's ESR value, in addition, through an electronic components 2a of inside series connection, the holistic voltage of novel surface package condenser 100A has been improved, or, add functional circuit (electronic components) on the basis of original single core structure, novel surface package condenser 100A's reliability has been improved.
Referring to fig. 4, as a first embodiment, the electronic component 2a is a second capacitor core. That is, the novel surface-mount capacitor 100A provided by the embodiment of the present application is connected in series with the first capacitor core 1a and the second capacitor core. The second capacitor element includes a second anode lead wire 21a, a second anode member 22a, and a second cathode member 23a disposed on the outer layer of the second anode member 22 a. The second anode lead wire 21a is connected to the second anode element 22 a. One end of the second anode lead wire 21a is connected to the first cathode element 13 a. The second cathode element 23a is connected to the first cathode lead 7a through cathode silver paste. And one end of the conductor provided at the first cathode connecting groove 32a is also connected to the second cathode element 23 a.
That is, this application embodiment provides a novel surface mount capacitor 100A that contains two electric capacity cores, has improved whole novel surface mount capacitor 100A's voltage through two electric capacity cores of establishing ties inside novel surface mount capacitor 100A, and then has improved the stability and the reliability of product, and through fluting on first base plate 3a, has reduced the ESR value that contains two electric capacity cores novel surface mount capacitor 100A. In addition, the mode of connecting two capacitor cores in series is adopted, when one capacitor core is damaged, if the capacitor core is short-circuited, the other capacitor core connected in series can be used, the condition that the single-core failure causes the failure of the whole novel surface packaging capacitor is avoided, and the reliability of the novel surface packaging capacitor is improved.
Alternatively, the number of the second capacitor cores may be plural, the plural second capacitor cores are connected in series, the second anode lead-out line of the first one of the plural second capacitor cores is connected to the first cathode element, and one end of the conductor of the first cathode connecting groove is connected to the second cathode element of the last one of the plural second capacitor cores. For example, referring to fig. 5, the novel surface mount capacitor provided by the embodiment of the present application may include four capacitor cores, that is, a first capacitor core 1a and three second capacitor cores 2a (three second capacitor cores are three electronic components 2 a). It should be noted that fig. 5 is only shown to embody the novel surface-mount capacitor 100A including four capacitor cores, and the specific connection manner and internal structure thereof may refer to the structure shown in fig. 3. Of course, in other embodiments, the novel surface mount capacitor 100A may be connected in series with more or less capacitor cores, for example, the number of the capacitor cores connected in series inside the novel surface mount capacitor 100A may be 3 or 5, and the application is not limited thereto.
In a second embodiment, the electronic component 2a is a fuse. One end of the fuse is connected to the first cathode element 13 a. One end of the conductor of the first cathode connection groove 32a is connected to the other end of the fuse.
The fuse may be a current fuse (e.g., a patch fuse); a thermal fuse (RP resistance type fuse) and a self-recovery fuse, but the present application is not limited thereto. It should be noted that, when the circuit of the surface mount capacitor 100A is in a failure or abnormal state during use, the current may rise continuously, and the rising current may damage the surface mount capacitor 100A, and may burn the circuit or even cause a fire. Therefore, in the embodiment of the present application, a fuse is connected in series inside the surface mount capacitor 100A, so that when the current of the surface mount capacitor 100A abnormally rises to a certain height, the fuse is blown to cut off the current, thereby protecting the external circuit applied by the user.
As a third embodiment, the electronic component 2a may be a diode. The anode of the diode is connected to the first cathode element 13a, and one end of the conductor of the first cathode connection groove 32a is connected to the cathode of the diode. In the embodiment of the present application, a diode is connected in series inside the novel surface-mount capacitor 100A, and then the forward conduction and the cut-off prevention of the diode are utilized, so as to improve the reliability and the safety of the novel surface-mount capacitor 100A when the external circuit applied by a user is subjected to reverse voltage impact.
It can be understood that the number of the electronic components 2a provided in the embodiment of the present application may be multiple, and the electronic components 2a may also be of different types, for example, in an embodiment, the electronic component 2a of the novel surface-mount capacitor 100A may include a second capacitor core and a fuse. The second capacitor core is connected in series with the fuse. When the electronic component 2a includes the second capacitor core and the fuse connected in series, the second anode lead of the second capacitor core may be connected to the first cathode element 13a, or one end of the fuse may be connected to the first cathode element 13a, which is not limited in this application. For another example, in another embodiment, the electronic component 2a of the surface mount capacitor 100A may include a second capacitor core and a diode. When the electronic component 2a includes the second capacitor core and the diode connected in series, the second anode lead of the second capacitor core may be connected to the first cathode element, or the anode of the diode may be connected to the first cathode element 13a, which is also not limited in the present application. Of course, in other embodiments, the electronic component 2a of the novel surface-mount capacitor 100A may also include the second capacitor core, the fuse, and the diode. The second capacitor core, the fuse and the diode are connected in series.
In the following description of the series connection between the devices, please refer to fig. 3, in the embodiment of the present application, a pad 8a is further disposed on the top of the first substrate 3a, the first capacitor core 1a and the electronic component 2a are disposed on the pad 8a, and one end of the electronic component 2a is connected to the first cathode element 13a through the pad 8 a.
Of course, in other embodiments, the electronic component 2a and the first cathode element 13a may be directly connected through a conductive body (e.g., a conductive silver paste), and the application is not limited thereto.
Based on the same inventive concept, the present application provides a novel surface mount capacitor 100A further including a third capacitor core connected in parallel. That is, when a capacitor core and at least one electronic component are connected in series inside the surface mount capacitor 100A, on this basis, a capacitor core may be further connected in parallel.
The third capacitor core comprises a third anode lead wire, a third anode element and a third cathode element arranged on the outer layer of the third anode element, and the third anode lead wire is connected with the third anode element.
Referring to fig. 6, as a first embodiment of connecting the third capacitor cores in parallel, a third capacitor core 9a is disposed on the first substrate, and a third anode lead is connected to the first anode terminal. The third cathode element is connected with the first cathode lead-out terminal. One end of the conductor arranged in the first anode connecting groove is also connected with a third anode outgoing line; one end of the conductor arranged at the first cathode connecting groove is also connected with the third cathode element. That is, in the surface mount capacitor 100A of the present invention shown in fig. 6, the third capacitor core 9a is disposed on the first substrate, and the third capacitor core 9a is connected in parallel to the first capacitor core 1a and the electronic component 2 a.
As a second embodiment of connecting the third capacitor cores in parallel, referring to fig. 7, the third capacitor core 9a is disposed above the first capacitor core 1 a; the third anode lead-out wire is connected with the first anode lead-out end. The third cathode element is connected with the first cathode lead-out terminal. That is, in the surface mount capacitor 100A of fig. 7, the third capacitor core 9a is disposed above the first capacitor core, and the third capacitor core 9a is connected in parallel to the first capacitor core 1a and the electronic component 2 a.
Of course, in other embodiments, the third capacitor cores 9a may also be disposed above the electronic component 2a, and correspondingly, the number of the third capacitor cores 9a may also be two or more, for example, when the number of the third capacitor cores 9a is two, two third capacitor cores 9a are connected in series, wherein the third anode lead of the first third capacitor core 9a is connected to the first anode lead, and the third cathode element of the second third capacitor core 9a is connected to the first cathode lead. For another example, when the number of the third capacitor cores 9a is three, the three capacitor cores are connected in series, wherein the third anode lead of the first third capacitor core 9a is connected to the first anode lead, and the third cathode element 9a of the third capacitor core is connected to the first cathode lead.
Referring to fig. 8, based on the same inventive concept, the novel surface-mount capacitor 100A provided in the embodiment of the present application further includes: a fourth condenser core 10a, a second substrate 110a, a second anode terminal 120a, and a second cathode terminal 130 a.
Wherein the fourth condenser core 10a includes a fourth anode lead wire 101a, a fourth anode element 102a, and a fourth cathode element 103a disposed at an outer layer of the fourth anode element, the fourth anode lead wire 101a being connected to the fourth anode element 102 a.
The second substrate 110a is provided on a side of the anode bottom surface terminal 4a and the cathode bottom surface terminal 5a away from the first substrate 3 a. The fourth condenser core 10a is disposed on the other side of the second substrate 110 a. The second substrate 110a is provided with a second anode connecting groove and a second cathode connecting groove; electric conductors are arranged in the second anode connecting groove and the second cathode connecting groove; one end of the conductor provided in the second anode connecting groove is connected to the fourth anode lead wire 101a, and the other end of the conductor provided in the second anode connecting groove is connected to the lower surface of the anode bottom terminal 4 a; one end of the conductor provided in the second cathode connecting groove is connected to one end of the fourth cathode element 103a, and the other end of the conductor provided in the cathode connecting groove is connected to the lower surface of the cathode bottom terminal 5 a. The second anode lead 120a is connected to the fourth anode lead 101a and the anode bottom surface terminal 4 a; second cathode lead 130a is connected to fourth cathode element 103a and cathode bottom surface terminal 5 a.
For ease of understanding, reference may be made to the simplified diagram provided in fig. 9. That is, the fourth condenser core 10a is divided by a partition plate from the first condenser core 1a and the entirety of the electronic component 2 a. The interlayer plate is composed of a first substrate, a second substrate, an anode bottom terminal and a cathode bottom terminal. That is, the anode bottom surface terminal and the cathode bottom surface terminal are arranged between the first substrate and the second substrate, the anode leading-out ends on the two sides are connected to the anode bottom surface terminal, the cathode leading-out ends on the two sides are connected to the cathode bottom surface terminal, and the upper part and the lower part of circuits are led out through the anode bottom surface terminal and the cathode bottom surface terminal.
Optionally, on the basis that the novel surface-mount capacitor is internally connected in series between a capacitor core and at least one electronic component, the embodiment of the present application further improves the structure of the novel surface-mount capacitor 100A, and replaces the anode bottom surface terminal with the anode leading-out cover and replaces the cathode bottom surface terminal with the cathode leading-out cover.
Specifically, this novel surface mount capacitor includes: the capacitor comprises a first capacitor core, an electronic component, a first substrate, an anode leading-out end, a cathode leading-out end, an anode leading-out cover and a cathode leading-out cover.
The first capacitor core includes a first anode lead, a first anode element, and a first cathode element disposed on an outer layer of the first anode element. The first anode lead line is connected to the first anode element. One end of the electronic component is connected with the first cathode element, and the first capacitor core and the electronic component are filled with packaging materials to form a shell. The first substrate is arranged at the bottoms of the first capacitor core and the electronic component; the anode leading-out end is connected with the first anode leading-out wire; and the cathode leading-out end is connected with the other end of the electronic component. It should be noted that the connection relationship has been described in the foregoing embodiments, and is not described herein for the sake of avoiding redundancy.
The anode leading-out cover comprises a first cover plate and a first side plate which is perpendicular to the first cover plate; the first cover plate is connected with the anode leading-out end; and when the first cover plate is connected with the anode leading-out end, the first side plate is arranged on the side wall of the shell. A cathode lead-out cover; the cathode leading-out cover comprises a second cover plate and a second side plate which is vertical to the second cover plate; the second cover plate is connected with the cathode leading-out end; and when the second cover plate is connected with the cathode leading-out end, the first side plate is arranged on the side wall of the shell.
Optionally, in order to facilitate the use of the novel surface-mount capacitor, the number of the first side plates covered by the anode lead-out cover may be the same as the number of the side walls of the case, that is, when the package case is a rectangular case, the package case includes four side walls, and then the number of the first side plates is also four, so that the four first side plates covered by the anode lead-out cover can be welded as the anode bottom surface terminal. Correspondingly, the quantity that covers the second curb plate can be the same with the quantity of casing lateral wall is drawn forth to the negative pole, also, when the encapsulation casing is the casing of cuboid, it includes four lateral walls, then the quantity of second curb plate also is four, and then makes four second curb plates of negative pole drawing forth lid all can regard as negative pole bottom surface terminal to realize the welding. As shown in fig. 10, the anode lead-out cover and the cathode lead-out cover are respectively located at two ends of the housing, four first side plates of the anode lead-out cover can be used as anode bottom terminals to realize welding, and four second side plates of the cathode lead-out cover can be used as cathode bottom terminals to realize welding. That is, the novel surface-mount capacitor can be soldered using the first side plate and the second side plate on any side wall.
Next, a connection method of connecting two capacitor cores in parallel inside the surface mount capacitor will be described.
The embodiment of the present application provides a novel surface-mount capacitor 100B, including: the capacitor comprises a first capacitor core, a second capacitor core, a substrate, an anode bottom surface terminal, a cathode bottom surface terminal, an anode leading-out end and a cathode leading-out end.
The first capacitor core comprises a first anode lead wire, a first anode element and a first cathode element arranged on the outer layer of the first anode element, and the first anode lead wire is connected with the first anode element. The second capacitor core comprises a second anode lead-out wire, a second anode element and a second cathode element arranged on the outer layer of the second anode element, and the second anode lead-out wire is connected with the second anode element. The substrate is arranged at the bottom of the first capacitor core and the second capacitor core, and an anode connecting groove and a cathode connecting groove are formed in the substrate; and the anode connecting groove and the cathode connecting groove are internally provided with electric conductors. The anode bottom terminal is arranged at the bottom of the substrate and is connected with a notch at one side of the anode connecting groove; one end of the conductor arranged in the anode connecting groove is respectively connected with the first anode leading-out wire and the second anode leading-out wire, and the other end of the conductor arranged in the anode connecting groove is connected with the upper surface of the anode bottom surface terminal. The cathode bottom terminal is arranged at the bottom of the substrate and is connected with a notch at one side of the cathode connecting groove; one end of the conductor arranged in the cathode connecting groove is respectively connected with the first cathode element and the second cathode element, and the other end of the conductor arranged in the cathode connecting groove is connected with the upper surface of the cathode bottom surface terminal. The anode leading-out end is connected with the first anode leading-out wire, the second anode leading-out wire and the anode bottom surface terminal. The cathode leading-out end is connected with the first cathode element, the second cathode element and the cathode bottom surface terminal.
For ease of understanding, referring to fig. 11, the novel surface-mount capacitor 100B includes a first capacitor core 1B and a second capacitor core 2B. The first condenser core 1b and the second condenser core 2b are both disposed on the substrate and connected in parallel. It should be noted that fig. 11 is only a simplified schematic diagram of the novel surface-mount capacitor 100B, and is intended to show the position relationship of the first capacitor core 1B and the second capacitor core 2B inside the novel surface-mount capacitor 100B, and the structure of a single core may refer to fig. 2, which is not described in detail herein.
In this embodiment, a path can be formed inside the novel surface-mount capacitor 100B by forming the first anode connecting groove and the second cathode connecting groove on the first substrate, so that two parallel equivalent resistances are formed between the internal element of the novel surface-mount capacitor 100B and the bottom surface terminal, and further the ESR value of the novel surface-mount capacitor 100B is reduced, in addition, a capacitor core is connected in parallel through the inside, the ESR value of the novel surface-mount capacitor 100B can be further reduced, and a parallel connection mode is adopted, when one of the capacitor cores is damaged, if a circuit is broken, another parallel capacitor core can be used, the condition that a single-core failure causes the failure of the whole novel surface-mount capacitor is avoided, and the reliability of the novel surface-mount capacitor 100B is improved.
Optionally, referring to fig. 12, the novel surface-mount capacitor 100B further includes a third capacitor core 3B. The third condenser core 3b includes a third anode lead wire, a third anode element, and a third cathode element provided on an outer layer of the third anode element, the third anode lead wire being connected to the third anode element.
The third capacitor core 3b is arranged above the second capacitor core 2b, and the third anode lead-out wire is connected with the anode lead-out end; the third cathode element is connected to the cathode lead-out terminal.
It is understood that in other embodiments, a third capacitor core may be disposed over the first capacitor core, with a third anode lead connected to the anode lead; the third cathode element is connected to the cathode lead-out terminal. Accordingly, the number of the third capacitor cores may also be two, for example, referring to fig. 13, the novel surface-mount capacitor 100B includes four capacitor cores, that is, the novel surface-mount capacitor 100B includes a first capacitor core 1B and a second capacitor core 2B disposed on a substrate, and two third capacitor cores 3B disposed above the first capacitor core 1B and the second capacitor core 2B, respectively. Correspondingly, in other embodiments, more capacitor cores may be connected in parallel to the substrate, for example, three capacitor cores may be connected in parallel to the substrate, and the number of the capacitor cores disposed on the substrate may also be three. The present application is not limited to this.
Optionally, on the basis that two capacitor cores are connected in parallel inside the novel surface-mount capacitor, the structure of the novel surface-mount capacitor 100B is further improved in the embodiment of the present application, and the anode lead-out cover is used to replace the anode bottom terminal, and the cathode lead-out cover is used to replace the cathode bottom terminal.
Specifically, this novel surface mount capacitor includes: the capacitor comprises a first capacitor core, a second capacitor core, a substrate, an anode leading-out end, a cathode leading-out end, an anode leading-out cover and a cathode leading-out cover.
The first capacitor core comprises a first anode lead wire, a first anode element and a first cathode element arranged on the outer layer of the first anode element, and the first anode lead wire is connected with the first anode element. The second capacitor core comprises a second anode lead-out wire, a second anode element and a second cathode element arranged on the outer layer of the second anode element, and the second anode lead-out wire is connected with the second anode element; and the first capacitor core and the second capacitor core are filled with packaging materials to form a shell. The substrate is arranged at the bottom of the first capacitor core and the second capacitor core. The anode leading-out end is connected with the first anode leading-out wire and the second anode leading-out wire. The cathode lead-out terminal is connected to the first cathode element and the second cathode element terminal. The anode leading-out cover comprises a first cover plate and a first side plate which is perpendicular to the first cover plate; the first cover plate is connected with the anode leading-out end; and when the first cover plate is connected with the anode leading-out end, the first side plate is arranged on the side wall of the shell. The cathode leading-out cover comprises a second cover plate and a second side plate which is vertical to the second cover plate; the second cover plate is connected with the cathode leading-out end; and when the second cover plate is connected with the cathode leading-out end, the first side plate is arranged on the side wall of the shell. It should be noted that, reference may be made to fig. 10 for the anode leading-out cover and the cathode leading-out cover, which are not described in detail in this application.
In the embodiment of the application, the parallel connection mode between the two capacitor cores in the novel surface-packaged capacitor can also be realized through a interlayer plate.
Specifically, referring to fig. 14, an embodiment of the present invention provides a novel surface-mount capacitor 100C, including: the capacitor comprises a first capacitor core 1c, a second capacitor core 2c, a interlayer plate 3c, a first anode leading-out end 4c, a first cathode leading-out end 5c, a second anode leading-out end 6c and a second cathode leading-out end 7 c.
Wherein the first capacitor element 1c includes a first anode lead wire 11c, a first anode member 12c, and a first cathode member 13c disposed on an outer layer of the first anode member 12c, the first anode lead wire 11c being connected to the first anode member 12 c. The second condenser core 2c includes a second anode lead wire 21c, a second anode member 22c, and a second cathode member 23c disposed on the outer layer of the second anode member 22c, the second anode lead wire 21c being connected to the second anode member 22 c.
The interlayer sheet 3c includes a first substrate 31c, a second substrate 32c, and an anode bottom surface terminal 33c and a cathode bottom surface terminal 34c provided between the first substrate 31c and the second substrate 32 c. The first condenser core 1c is provided on the first substrate 31c, and the second condenser core 2c is provided on the second substrate 32 c. The first substrate 31c is provided with a first anode connecting groove and a first cathode connecting groove, and the second substrate 32c is provided with a second anode connecting groove and a second cathode connecting groove. Conductors are arranged in the first anode connecting groove, the first cathode connecting groove, the second anode connecting groove and the second cathode connecting groove, one end of the conductor arranged in the first anode connecting groove is connected with the first anode outgoing line 11c, and the other end of the conductor arranged in the first anode connecting groove is connected with the first surface of the anode bottom surface terminal 33 c; one end of the conductor provided in the first cathode connecting groove is connected to the first cathode element 13c, and the other end of the conductor provided in the first cathode connecting groove is connected to the first surface of the cathode bottom surface terminal 34 c; one end of the conductor provided in the second anode connecting groove is connected to the second anode lead wire 21c, and the other end of the conductor provided in the second anode connecting groove is connected to the second surface of the anode bottom terminal 33 c; one end of the conductor provided in the second cathode connecting groove is connected to the second cathode element 23c, and the other end of the conductor provided in the second cathode connecting groove is connected to the second surface of the cathode bottom surface terminal 34 c.
First anode lead terminal 4c is connected to first anode lead 11c and anode bottom surface terminal 33 c.
First cathode lead 5c is connected to first cathode element 13c and cathode bottom terminal 34 c.
The second anode lead terminal 6c is connected to the second anode lead wire 21c and the anode bottom surface terminal 33 c.
Second cathode lead 7c is connected to the second cathode element and cathode bottom surface terminal 34 c.
For ease of understanding, reference may be made to the simplified diagram provided in FIG. 15. The first capacitor core 1c and the second capacitor core 2c are divided by a division plate 3 c. The interlayer plate is composed of a first substrate, a second substrate, an anode bottom terminal and a cathode bottom terminal. The anode bottom surface terminal and the cathode bottom surface terminal are arranged between the first substrate and the second substrate, the anode leading-out ends on two sides are connected to the anode bottom surface terminal, the cathode leading-out ends on two sides are connected to the cathode bottom surface terminal, and the upper circuit and the lower circuit are led out through the anode bottom surface terminal and the cathode bottom surface terminal.
Referring to fig. 16, the surface mount capacitor using the novel surface mount capacitor including the spacer plate optionally further includes a third capacitor core 8 c. The third condenser core 8c includes a third anode lead wire, a third anode element, and a third cathode element provided on an outer layer of the third anode element, the third anode lead wire being connected to the third anode element.
The third capacitor core 8c is provided on the first substrate; the third anode lead-out wire is connected with the first anode lead-out end; the third cathode element is connected with the cathode bottom terminal; one end of the conductor arranged in the first anode connecting groove is also connected with the third anode outgoing line, and one end of the conductor arranged in the first cathode connecting groove is also connected with the third cathode element.
Of course, in other embodiments, the third capacitor core 8C may be disposed on the second substrate, and the number of the corresponding third capacitor cores 8C may also be two, for example, referring to fig. 17, the novel surface-mount capacitor 100C includes four capacitor cores, that is, the novel surface-mount capacitor 100C includes the first capacitor core 1C and the third capacitor core 8C disposed on the first substrate, and the second capacitor core 2C and the third capacitor core 8C disposed on the second substrate. Correspondingly, in other embodiments, more capacitor cores may be connected in parallel to each substrate, for example, three capacitor cores are connected in parallel to the first substrate, and three capacitor cores are connected in parallel to the second substrate. The present application is not limited to this.
Optionally, on the basis that two capacitor cores connected in parallel with a interlayer plate are arranged inside the novel surface-mount capacitor 100C, the structure of the novel surface-mount capacitor 100C is further improved, the anode lead-out cover is adopted to replace the anode bottom surface terminal, and the cathode lead-out cover is adopted to replace the cathode bottom surface terminal.
Specifically, the first capacitor core and the second capacitor core are filled with packaging materials to form a shell. The anode leading-out cover comprises a cover plate and a side plate which is vertical to the cover plate; the cover plate is connected with the anode bottom surface terminal; and when the cover plate is connected with the anode bottom surface terminal, the side plate is arranged on the side wall of the shell.
Correspondingly, the cathode leading-out cover also comprises a cover plate and a side plate which is arranged vertically to the cover plate; the cover plate of the cathode lead-out cover is connected with the cathode bottom terminal; and when the cover plate of the cathode lead-out cover is connected with the cathode bottom terminal, the side plate of the cathode lead-out cover is arranged on the side wall of the shell.
Optionally, in order to facilitate the use of the novel surface-mount capacitor 100C, the number of the anode lead-out cover upper side plates may be the same as the number of the case side walls, that is, when the package case is a rectangular case, the package case includes four side walls, and then the number of the anode lead-out cover side plates is also four, so that the four side plates of the anode lead-out cover can be used as the anode bottom surface terminal to realize welding. Correspondingly, the quantity that the lid was drawn forth to the negative pole can be the same with the quantity of casing lateral wall, also promptly, when the encapsulation casing was the casing of cuboid, it included four lateral walls, and then the quantity that the lid was drawn forth to the negative pole also was four, and then makes four lateral plates that the lid was drawn forth to the negative pole all can regard as negative pole bottom surface terminal to realize the welding. As shown in fig. 18, the anode lead-out cover and the cathode lead-out cover are respectively located at two ends of the housing, four side plates of the anode lead-out cover can be used as anode bottom terminals to realize welding, and four side plates of the cathode lead-out cover can be used as cathode bottom terminals to realize welding. That is, the novel surface-mount capacitor can be soldered using the side plates on any of the side walls.
Finally, a three-terminal non-polar connection mode is adopted between two capacitor cores in the novel surface packaging capacitor.
Referring to fig. 19, in particular, the present embodiment provides a novel surface-mount capacitor 100D, which includes a first capacitor core 1D, a second capacitor core 2D, a substrate 3D, a first anode bottom terminal 4D, a second anode bottom terminal 5D, a cathode bottom terminal 6D, a first anode lead 7D, and a second anode lead 8D.
The first capacity core 1d includes a first anode lead wire 11d, a first anode member 12d, and a first cathode member 13d provided on the outer layer of the first anode member 12d, the first anode lead wire 11d being connected to the first anode member 12 d.
The second capacitor element 2d includes a second anode lead wire 21d, a second anode member 22d, and a second cathode member 23d provided on an outer layer of the second anode member 22d, the second anode lead wire 21d being connected to the second anode member 22 d; first cathode element 13d is connected to second cathode element 23 d.
The substrate 3d is arranged at the bottom of the first capacitor core 1d and the second capacitor core 2d, and a first anode connecting groove, a second anode connecting groove and a cathode connecting groove are formed in the substrate 3 d; and the first anode connecting groove, the second anode connecting groove and the cathode connecting groove are internally provided with electric conductors.
The first anode bottom surface terminal 4d is arranged on the first side of the bottom of the substrate 3d and is connected with a side notch of the first anode connecting groove; one end of the conductor provided in the first anode connecting groove is connected to the first anode lead-out wire 11d, and the other end of the conductor provided in the first anode connecting groove is connected to the upper surface of the first anode bottom surface terminal 4 d.
The second anode bottom surface terminal 5d is disposed at the second side of the bottom of the substrate 3d and connected with one side notch of the second anode connecting groove. Wherein the first side and the second side are opposite sides. One end of the conductor provided in the second anode connecting groove is connected to the second anode lead wire 21d, and the other end of the conductor provided in the second anode connecting groove is connected to the upper surface of the second anode bottom surface terminal 5 d.
The cathode bottom terminal 6d is arranged in the middle of the bottom of the substrate 3d and is connected with a side notch of the cathode connecting groove; one end of the conductor provided in the cathode connecting groove is connected to the connecting end of the first cathode element 13d and the second cathode element 23d, and the other end of the conductor provided in the cathode connecting groove is connected to the upper surface of the cathode bottom surface terminal 6 d.
The first anode lead 7d is connected to the first anode lead 11d and the first anode bottom surface terminal 4 d.
The second anode lead 8d is connected to the second anode lead 21d and the second anode bottom surface terminal 5 d.
The novel surface-packaged capacitor 100D with two nonpolar ends provided in the embodiment of the application can facilitate direct welding of an operator, and prevents the positive and negative poles at the two ends from being welded reversely.
Of course, the novel surface-mount capacitor 100D provided in the embodiment of the present application may also be provided with anode lead-out covers at two ends instead of the anode bottom terminals, and the specific structural description thereof may refer to the foregoing embodiments, which are not limited in this application.
The above-mentioned three-terminal non-polar connection manner is also applicable to a novel surface-mount capacitor with a single-core structure, and specifically, referring to fig. 20, an embodiment of the present application provides a novel surface-mount capacitor 100E, including: a capacitor core 1e, a substrate 2e, a first anode bottom surface terminal 3e, a second anode bottom surface terminal 4e, a cathode bottom surface terminal 5e, a first anode lead-out terminal 6e, and a second anode lead-out terminal 7 e.
Wherein the capacitor element 1e includes a first anode lead wire 11e, a second anode lead wire 12e, an anode element 13e, and a cathode element 14e disposed on the outer layer of the anode element 13 e. The first anode lead wire 11e is connected to a first end of the anode element 13e, and the second anode lead wire 12e is connected to a second end of the anode element 13 e. Wherein the first end and the second end are opposite ends. That is, the first anode lead wire 11e and the second anode lead wire 12e are respectively provided at opposite ends of the anode element 13 e.
The substrate 2e is disposed at the bottom of the condenser core 1 e. The substrate 2e is provided with a first anode connecting groove, a second anode connecting groove and a cathode connecting groove. And the first anode connecting groove, the second anode connecting groove and the cathode connecting groove are internally provided with electric conductors.
The first anode bottom surface terminal 3e is arranged on the first side of the bottom of the substrate 2e and is connected with a side notch of the first anode connecting groove; one end of the conductive body provided in the first anode connecting groove is connected to the first anode lead-out wire 11 e. The other end of the conductor provided in the first anode connecting groove is connected to the upper surface of the first anode bottom surface terminal 3 e.
The second anode bottom surface terminal 4e is disposed at the second side of the bottom of the substrate 2e and is connected with one side notch of the second anode connecting groove. Wherein the first side and the second side are opposite sides. One end of the conductor arranged in the second anode connecting groove is connected with a second anode outgoing line 12 e; the other end of the conductor provided in the second anode connecting groove is connected to the upper surface of the second anode bottom surface terminal 4 e.
The cathode bottom terminal 5e is arranged in the middle of the bottom of the substrate 2e and is connected with a side notch of the cathode connecting groove; one end of the conductor provided in the cathode connecting groove is connected to the cathode element 14e, and the other end of the conductor provided in the cathode connecting groove is connected to the upper surface of the cathode bottom surface terminal 5 e.
The first anode lead terminal 6e is connected to the first anode lead wire 11e and the first anode bottom surface terminal 3 e. The second anode lead 7e is connected to the second anode lead 12e and the second anode bottom surface terminal 4 e.
The novel surface-packaged capacitor 100E with two nonpolar ends provided in the embodiment of the application can facilitate direct welding of an operator, and prevents the positive and negative electrodes at the two ends from being welded reversely.
Based on the same inventive concept, the embodiment of the present application further provides a method for manufacturing a novel surface-mount capacitor, including: providing a substrate; an anode connecting groove and a cathode connecting groove are formed in the substrate; filling an electric conductor into the anode connecting groove and the cathode connecting groove; bonding a first capacitor core and an electronic component to the substrate so that the conductor in the anode connecting groove is connected with the anode bottom terminal and the anode lead-out wire of the first capacitor core, and the conductor in the cathode connecting groove is connected with the cathode bottom terminal and one end of the electronic component; the other end of the electronic component is connected with the cathode element of the first capacitor core; and carrying out packaging test.
The above is a method for manufacturing the novel surface-mount capacitor shown in fig. 3, and the manufacturing methods of the other structures may be referred to each other.
In the description of the present application, it should be noted that the terms "inside", "outside", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings or orientations or positional relationships that the products of the application usually place when using, and are only used for convenience in describing the present application and simplifying the description, but do not indicate or imply that the devices or elements that are referred to must have a specific orientation, be constructed in a specific orientation, and operate, and thus, should not be construed as limiting the present application. Furthermore, the terms "first," "second," "third," "fourth," and the like are used merely to distinguish one description from another, and are not to be construed as indicating or implying relative importance.
It should also be noted that, unless expressly stated or limited otherwise, the terms "disposed" and "connected" are to be construed broadly, e.g., as meaning fixedly connected, detachably connected, or integrally connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present application can be understood in a specific case by those of ordinary skill in the art.
The above description is only an example of the present application and is not intended to limit the scope of the present application, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, improvement and the like made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims (23)

1. A novel surface mount capacitor, comprising:
the first capacitor core comprises a first anode lead wire, a first anode element and a first cathode element arranged on the outer layer of the first anode element, wherein the first anode lead wire is connected with the first anode element;
an electronic component, one end of which is connected with the first cathode element;
the first substrate is arranged at the bottoms of the first capacitor core and the electronic component and is provided with a first anode connecting groove and a first cathode connecting groove; a conductor is arranged in the first anode connecting groove and the first cathode connecting groove;
the anode bottom terminal is arranged at the bottom of the first substrate and is connected with a side notch of the first anode connecting groove; one end of the conductor arranged in the first anode connecting groove is connected with the first anode leading-out wire, and the other end of the conductor arranged in the first anode connecting groove is connected with the upper surface of the anode bottom surface terminal;
the cathode bottom terminal is arranged at the bottom of the first substrate and is connected with a side notch of the first cathode connecting groove; one end of the conductor arranged in the first cathode connecting groove is connected with the other end of the electronic component, and the other end of the conductor arranged in the first cathode connecting groove is connected with the upper surface of the cathode bottom terminal;
a first anode lead-out terminal connected to the first anode lead-out wire and the anode bottom surface terminal;
and the first cathode leading-out end is connected with the other end of the electronic component and the cathode bottom surface terminal.
2. The surface-mount capacitor as claimed in claim 1, wherein the electronic component is a second capacitor core, the second capacitor core includes a second anode lead, a second anode element, and a second cathode element disposed on an outer layer of the second anode element, the second anode lead is connected to the second anode element; the second anode lead wire is connected with the first cathode element;
correspondingly, one end of the electric conductor of the first cathode connecting groove is connected with the second cathode element.
3. The surface-mount capacitor as claimed in claim 2, wherein the number of the electronic components is plural, the plurality of electronic components are connected in series, the second anode lead of a first electronic component of the plurality of electronic components is connected to the first cathode element, and one end of the electrical conductor of the first cathode connecting groove is connected to the second cathode element of a last electronic component of the plurality of electronic components.
4. The novel surface-mount capacitor of claim 1 wherein the electronic component is a fuse; one end of the fuse is connected with the first cathode element; one end of the conductor of the first cathode connecting groove is connected with the other end of the fuse.
5. The novel surface-mount capacitor of claim 1 wherein the electronic component comprises: a second capacitor core and a fuse; the second capacitor core is connected with the fuse in series.
6. The novel surface-mount capacitor as claimed in claim 1, wherein the electronic component is a diode, and the anode of the diode is connected to the first cathode element; one end of the conductor of the first cathode connecting groove is connected with the cathode of the diode.
7. The surface-mount capacitor as claimed in claim 1, wherein a bonding pad is disposed on the top of the substrate, and one end of the electronic component is connected to the first cathode element via the bonding pad.
8. The novel surface mount capacitor of claim 1 further comprising a third capacitive core; the third capacitor core comprises a third anode lead-out wire, a third anode element and a third cathode element arranged on the outer layer of the third anode element, and the third anode lead-out wire is connected with the third anode element;
the third capacitor core is arranged on the first substrate, and the third anode outgoing line is connected with the first anode outgoing end; the third cathode element is connected with the first cathode lead-out end;
one end of the electric conductor arranged in the first anode connecting groove is also connected with the third anode outgoing line; one end of the conductor provided in the first cathode connection groove is further connected to the third cathode element.
9. The novel surface mount capacitor of claim 1 further comprising a third capacitive core; the third capacitor core comprises a third anode lead-out wire, a third anode element and a third cathode element arranged on the outer layer of the third anode element, and the third anode lead-out wire is connected with the third anode element;
the third capacitor core is arranged above the first capacitor core; the third anode outgoing line is connected with the first anode outgoing end; the third cathode element is connected to the first cathode lead.
10. The novel surface mount capacitor of claim 1 further comprising: the fourth capacitor core, the second substrate, a second anode leading-out end and a second cathode leading-out end;
the fourth capacitor core comprises a fourth anode lead-out wire, a fourth anode element and a fourth cathode element arranged on the outer layer of the fourth anode element, and the fourth anode lead-out wire is connected with the fourth anode element;
the second substrate is arranged on one side, away from the first substrate, of the anode bottom surface terminal and the cathode bottom surface terminal; the fourth capacitor core is arranged on the other side of the second substrate; the second substrate is provided with a second anode connecting groove and a second cathode connecting groove; electric conductors are arranged in the second anode connecting groove and the second cathode connecting groove; one end of the conductor arranged in the second anode connecting groove is connected with the fourth anode outgoing line, and the other end of the conductor arranged in the second anode connecting groove is connected with the lower surface of the anode bottom surface terminal; one end of the conductor arranged in the second cathode connecting groove is connected with one end of the fourth cathode element, and the other end of the conductor arranged in the cathode connecting groove is connected with the lower surface of the cathode bottom surface terminal;
a second anode lead-out terminal connected to the fourth anode lead-out wire and the anode bottom surface terminal;
and a second cathode lead connected to the fourth cathode element and the cathode bottom surface terminal.
11. A novel surface mount capacitor, comprising:
the first capacitor core comprises a first anode lead wire, a first anode element and a first cathode element arranged on the outer layer of the first anode element, wherein the first anode lead wire is connected with the first anode element;
an electronic component, one end of which is connected with the first cathode element; the first capacitor core and the electronic component are filled with packaging materials to form a shell;
the first substrate is arranged at the bottoms of the first capacitor core and the electronic component;
an anode lead-out terminal connected with the first anode lead-out wire;
the cathode leading-out end is connected with the other end of the electronic component;
an anode lead-out cover; the anode leading-out cover comprises a first cover plate and a first side plate which is perpendicular to the first cover plate; the first cover plate is connected with the anode leading-out end; when the first cover plate is connected with the anode leading-out end, the first side plate is arranged on the side wall of the shell;
a cathode lead-out cover; the cathode leading-out cover comprises a second cover plate and a second side plate which is perpendicular to the second cover plate; the second cover plate is connected with the cathode leading-out end; and when the second cover plate is connected with the cathode leading-out end, the second side plate is arranged on the side wall of the shell.
12. A novel surface mount capacitor, comprising:
the first capacitor core comprises a first anode lead wire, a first anode element and a first cathode element arranged on the outer layer of the first anode element, wherein the first anode lead wire is connected with the first anode element;
the second capacitor core comprises a second anode lead wire, a second anode element and a second cathode element arranged on the outer layer of the second anode element, and the second anode lead wire is connected with the second anode element;
the substrate is arranged at the bottoms of the first capacitor core and the second capacitor core and is provided with an anode connecting groove and a cathode connecting groove; electric conductors are arranged in the anode connecting groove and the cathode connecting groove;
the anode bottom terminal is arranged at the bottom of the substrate and is connected with a side notch of the anode connecting groove; one end of the conductor arranged in the anode connecting groove is connected with the first anode leading-out wire and the second anode leading-out wire respectively, and the other end of the conductor arranged in the anode connecting groove is connected with the upper surface of the anode bottom surface terminal;
the cathode bottom terminal is arranged at the bottom of the substrate and is connected with a side notch of the cathode connecting groove; one end of the conductor arranged in the cathode connecting groove is respectively connected with the first cathode element and the second cathode element, and the other end of the conductor arranged in the cathode connecting groove is connected with the upper surface of the cathode bottom surface terminal;
an anode lead-out terminal connected to the first anode lead-out wire, the second anode lead-out wire, and the anode bottom surface terminal;
and a cathode lead terminal connected to the first cathode element, the second cathode element, and the cathode bottom surface terminal.
13. The novel surface mount capacitor of claim 12 further comprising a third capacitive core; the third capacitor core comprises a third anode lead-out wire, a third anode element and a third cathode element arranged on the outer layer of the third anode element, and the third anode lead-out wire is connected with the third anode element;
the third capacitor core is arranged above the first capacitor core or the second capacitor core, and the third anode outgoing line is connected with the anode outgoing end; the third cathode element is connected with the cathode lead-out terminal.
14. A novel surface mount capacitor, comprising:
the first capacitor core comprises a first anode lead wire, a first anode element and a first cathode element arranged on the outer layer of the first anode element, wherein the first anode lead wire is connected with the first anode element;
the second capacitor core comprises a second anode lead wire, a second anode element and a second cathode element arranged on the outer layer of the second anode element, and the second anode lead wire is connected with the second anode element; the first capacitor core and the second capacitor core are filled with packaging materials to form a shell;
the substrate is arranged at the bottoms of the first capacitor core and the second capacitor core;
an anode lead-out terminal connected to the first anode lead-out wire and the second anode lead-out wire;
a cathode lead terminal connected to the first cathode element and the second cathode element terminal;
an anode lead-out cover; the anode leading-out cover comprises a first cover plate and a first side plate which is perpendicular to the first cover plate; the first cover plate is connected with the anode leading-out end; when the first cover plate is connected with the anode leading-out end, the first side plate is arranged on the side wall of the shell;
a cathode lead-out cover; the cathode leading-out cover comprises a second cover plate and a second side plate which is perpendicular to the second cover plate; the second cover plate is connected with the cathode leading-out end; and when the second cover plate is connected with the cathode leading-out end, the first side plate is arranged on the side wall of the shell.
15. A novel surface mount capacitor, comprising:
the first capacitor core comprises a first anode lead wire, a first anode element and a first cathode element arranged on the outer layer of the first anode element, wherein the first anode lead wire is connected with the first anode element;
the second capacitor core comprises a second anode lead wire, a second anode element and a second cathode element arranged on the outer layer of the second anode element, and the second anode lead wire is connected with the second anode element;
a interlayer plate including a first substrate, a second substrate, and an anode bottom surface terminal and a cathode bottom surface terminal disposed between the first substrate and the second substrate; the first capacitor core is arranged on the first substrate, and the second capacitor core is arranged on the second substrate; the first substrate is provided with a first anode connecting groove and a first cathode connecting groove, the second substrate is provided with a second anode connecting groove and a second cathode connecting groove, the first anode connecting groove, the first cathode connecting groove, the second anode connecting groove and the second cathode connecting groove are all provided with electric conductors, one end of the electric conductor arranged in the first anode connecting groove is connected with the first anode outgoing line, and the other end of the electric conductor arranged in the first anode connecting groove is connected with the first surface of the anode bottom surface terminal; one end of the conductor arranged in the first cathode connecting groove is connected with the first cathode element, and the other end of the conductor arranged in the first cathode connecting groove is connected with the first surface of the cathode bottom terminal; one end of the conductor arranged in the second anode connecting groove is connected with the second anode outgoing line, and the other end of the conductor arranged in the second anode connecting groove is connected with the second surface of the anode bottom surface terminal; one end of the conductor arranged in the second cathode connecting groove is connected with the second cathode element, and the other end of the conductor arranged in the second cathode connecting groove is connected with the second surface of the cathode bottom surface terminal;
a first anode lead-out terminal connected to the first anode lead-out wire and the anode bottom surface terminal;
a first cathode lead connected to the first cathode element and the cathode bottom surface terminal;
a second anode lead-out terminal connected to the second anode lead-out wire and the anode bottom surface terminal;
and a second cathode lead connected to the second cathode element and the cathode bottom surface terminal.
16. The novel surface mount capacitor of claim 15 further comprising a third capacitive core, the third capacitive core comprising a third anode lead, a third anode element, and a third cathode element disposed on an outer layer of the third anode element, the third anode lead being connected to the third anode element;
the third capacitor core is arranged on the first substrate; the third anode outgoing line is connected with the first anode outgoing end; the third cathode element is connected to the cathode bottom surface terminal; one end of the conductor arranged in the first anode connecting groove is also connected with the third anode outgoing line, and one end of the conductor arranged in the first cathode connecting groove is also connected with the third cathode element.
17. The novel surface-mount capacitor of claim 15 wherein the first and second capacitive cores are externally filled with a potting material to form a housing;
the novel surface-packaged capacitor also comprises an anode leading-out cover; the anode leading-out cover comprises a cover plate and a side plate which is perpendicular to the cover plate; the cover plate is connected with the anode bottom surface terminal; and when the cover plate is connected with the anode bottom surface terminal, the side plate is arranged on the side wall of the shell.
18. The novel surface mount capacitor of claim 17 wherein the number of side plates is the same as the number of side walls of the case.
19. The novel surface-mount capacitor of claim 15 wherein the first and second capacitive cores are externally filled with a potting material to form a housing;
the novel surface-packaged capacitor also comprises a cathode leading-out cover; the cathode leading-out cover comprises a cover plate and a side plate which is perpendicular to the cover plate; the cover plate is connected with the cathode bottom surface terminal; and when the cover plate is connected with the cathode bottom surface terminal, the side plate is arranged on the side wall of the shell.
20. The novel surface mount capacitor of claim 19 wherein the number of side plates is the same as the number of side walls of the case.
21. A novel surface mount capacitor, comprising:
the first capacitor core comprises a first anode lead wire, a first anode element and a first cathode element arranged on the outer layer of the first anode element, wherein the first anode lead wire is connected with the first anode element;
the second capacitor core comprises a second anode lead wire, a second anode element and a second cathode element arranged on the outer layer of the second anode element, and the second anode lead wire is connected with the second anode element; the first cathode element is connected with the second cathode element;
the substrate is arranged at the bottoms of the first capacitor core and the second capacitor core, and a first anode connecting groove, a second anode connecting groove and a cathode connecting groove are formed in the substrate; the first anode connecting groove, the second anode connecting groove and the cathode connecting groove are internally provided with electric conductors;
the first anode bottom surface terminal is arranged on the first side of the bottom of the substrate and is connected with a side notch of the first anode connecting groove; one end of the conductor arranged in the first anode connecting groove is connected with the first anode leading-out wire, and the other end of the conductor arranged in the first anode connecting groove is connected with the upper surface of the first anode bottom surface terminal;
the second anode bottom surface terminal is arranged on the second side of the bottom of the substrate and is connected with a side notch of the second anode connecting groove; wherein the first side and the second side are opposite sides; one end of the conductor arranged in the second anode connecting groove is connected with the second anode outgoing line, and the other end of the conductor arranged in the second anode connecting groove is connected with the upper surface of the second anode bottom surface terminal;
the cathode bottom terminal is arranged in the middle of the bottom of the substrate and is connected with a side notch of the cathode connecting groove; one end of the conductor arranged in the cathode connecting groove is connected with the connecting end of the first cathode element and the second cathode element, and the other end of the conductor arranged in the cathode connecting groove is connected with the upper surface of the cathode bottom surface terminal;
a first anode lead-out terminal connected to the first anode lead-out wire and the first anode bottom surface terminal;
and a second anode lead-out terminal connected to the second anode lead-out wire and the second anode bottom surface terminal.
22. A novel surface mount capacitor, comprising:
the capacitor core comprises a first anode lead wire, a second anode lead wire, an anode element and a cathode element arranged on the outer layer of the anode element, wherein the first anode lead wire is connected with the first end of the anode element, and the second anode lead wire is connected with the second end of the anode element; wherein the first end and the second end are opposite ends;
the substrate is arranged at the bottom of the capacitor core, and a first anode connecting groove, a second anode connecting groove and a cathode connecting groove are formed in the substrate; the first anode connecting groove, the second anode connecting groove and the cathode connecting groove are internally provided with electric conductors;
the first anode bottom surface terminal is arranged on the first side of the bottom of the substrate and is connected with a side notch of the first anode connecting groove; one end of the conductor arranged in the first anode connecting groove is connected with the first anode leading-out wire, and the other end of the conductor arranged in the first anode connecting groove is connected with the upper surface of the first anode bottom surface terminal;
the second anode bottom surface terminal is arranged on the second side of the bottom of the substrate and is connected with a side notch of the second anode connecting groove; wherein the first side and the second side are opposite sides; one end of the conductor arranged in the second anode connecting groove is connected with the second anode outgoing line, and the other end of the conductor arranged in the second anode connecting groove is connected with the upper surface of the second anode bottom surface terminal;
the cathode bottom terminal is arranged in the middle of the bottom of the substrate and is connected with a side notch of the cathode connecting groove; one end of the conductor arranged in the cathode connecting groove is connected with the cathode element, and the other end of the conductor arranged in the cathode connecting groove is connected with the upper surface of the cathode bottom surface terminal;
a first anode lead-out terminal connected to the first anode lead-out wire and the first anode bottom surface terminal;
and a second anode lead-out terminal connected to the second anode lead-out wire and the second anode bottom surface terminal.
23. A manufacturing method of a novel surface packaging capacitor is characterized by comprising the following steps:
providing a substrate;
an anode connecting groove and a cathode connecting groove are formed in the substrate;
filling an electric conductor into the anode connecting groove and the cathode connecting groove;
bonding a first capacitor core and an electronic component to the substrate so that the conductor in the anode connecting groove is connected with the anode bottom terminal and the anode lead-out wire of the first capacitor core, and the conductor in the cathode connecting groove is connected with the cathode bottom terminal and one end of the electronic component; the other end of the electronic component is connected with the cathode element of the first capacitor core;
and carrying out packaging test.
CN202011413345.1A 2020-12-03 2020-12-03 Novel surface-packaged capacitor and manufacturing method thereof Pending CN112435854A (en)

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CN202011413345.1A CN112435854A (en) 2020-12-03 2020-12-03 Novel surface-packaged capacitor and manufacturing method thereof
PCT/CN2021/133847 WO2022116927A1 (en) 2020-12-03 2021-11-29 Novel surface-packaged capacitor and fabrication method for novel surface-packaged capacitor

Applications Claiming Priority (1)

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CN202011413345.1A CN112435854A (en) 2020-12-03 2020-12-03 Novel surface-packaged capacitor and manufacturing method thereof

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022116927A1 (en) * 2020-12-03 2022-06-09 中国振华(集团)新云电子元器件有限责任公司(国营第四三二六厂) Novel surface-packaged capacitor and fabrication method for novel surface-packaged capacitor

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022116927A1 (en) * 2020-12-03 2022-06-09 中国振华(集团)新云电子元器件有限责任公司(国营第四三二六厂) Novel surface-packaged capacitor and fabrication method for novel surface-packaged capacitor

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