CN112431743A - Compressor heat dissipation economizer based on semiconductor principle - Google Patents
Compressor heat dissipation economizer based on semiconductor principle Download PDFInfo
- Publication number
- CN112431743A CN112431743A CN202011334961.8A CN202011334961A CN112431743A CN 112431743 A CN112431743 A CN 112431743A CN 202011334961 A CN202011334961 A CN 202011334961A CN 112431743 A CN112431743 A CN 112431743A
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- China
- Prior art keywords
- semiconductor
- casing
- rotating wheel
- outside
- compressor
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Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04B—POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS
- F04B39/00—Component parts, details, or accessories, of pumps or pumping systems specially adapted for elastic fluids, not otherwise provided for in, or of interest apart from, groups F04B25/00 - F04B37/00
- F04B39/06—Cooling; Heating; Prevention of freezing
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04B—POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS
- F04B39/00—Component parts, details, or accessories, of pumps or pumping systems specially adapted for elastic fluids, not otherwise provided for in, or of interest apart from, groups F04B25/00 - F04B37/00
- F04B39/06—Cooling; Heating; Prevention of freezing
- F04B39/066—Cooling by ventilation
Abstract
The invention relates to the technical field of semiconductors and discloses a compressor heat dissipation energy-saving device based on a semiconductor principle, which comprises a shell, wherein the surface of the shell is provided with a starting opening, the interior of the shell is movably connected with a first rotating wheel, the exterior of the first rotating wheel is fixedly connected with an arc plate, the interior of the shell is movably connected with a second rotating wheel, and the interior of the shell is fixedly connected with a sliding rail; through the start-up mouth, runner one, the arc board, runner two, a slide rail, the slider, the impact bar, the connecting rod, the gyro wheel, spring one, the package board, the snap ring, semiconductor coil, the semiconductor electro-magnet, the impeller, photosensitive assembly, under the interact between the determine module, can make heat abstractor accomplish miniaturization and low energy consumption, can also improve the work efficiency of compressor simultaneously, make the noise that compressor work produced more little like this, user's use experience has been improved, win better market feedback, the compressor use price/performance ratio has been improved.
Description
Technical Field
The invention relates to the technical field of semiconductors, in particular to a compressor heat dissipation energy-saving device based on a semiconductor principle.
Background
Metals with better conductivity, such as gold, silver, copper, iron, tin, aluminum and the like, are called conductors, materials between the conductors and insulators can be simply called semiconductors, compared with the conductors and the insulators, the discovery of semiconductor materials is the latest, semiconductors refer to materials with conductivity between the conductors and the insulators at normal temperature, and the semiconductors are applied to the fields of integrated circuits, consumer electronics, communication systems, photovoltaic power generation, illumination, high-power supply conversion and the like, for example, diodes are devices made of semiconductors, the existing semiconductor materials have the advantages of light weight, miniaturization, low energy consumption and energy conservation, a large amount of heat can be generated when a compressor is commonly used by people during working, if the heat cannot be dissipated into the air in time, the performance of the compressor can be influenced and the energy consumption is increased, and meanwhile, the working efficiency of the compressor can also be reduced, the existing fan heat dissipation scheme adopts a common conductor coil to work, so that not only is the energy consumption large in practical use, but also the practical heat dissipation effect does not meet the use requirement, and meanwhile, the noise generated in work is also large.
Therefore, in order to solve these problems, a heat dissipation and energy saving device for a compressor based on the semiconductor principle is needed.
Disclosure of Invention
Technical problem to be solved
Aiming at the defects of the prior art, the invention provides a compressor heat dissipation energy-saving device based on a semiconductor principle, which has the advantages of high practicability, energy conservation, small volume and low noise, and solves the problems that the existing compressor commonly used by people can generate a large amount of heat during working, the performance of the compressor is affected and the energy consumption is increased if the heat cannot be dissipated into the air in time, and the working efficiency of the compressor can be reduced.
(II) technical scheme
In order to realize the purposes of high practicability, energy conservation, small volume and low noise, the invention provides the following technical scheme: the utility model provides a compressor heat dissipation economizer based on semiconductor principle, which comprises a housing, the start-up mouth has been seted up on the surface of casing, the inside swing joint of casing has runner one, the outside fixedly connected with arc board of runner one, the inside swing joint of casing has runner two, the inside fixedly connected with slide rail of casing, the inboard swing joint of slide rail has the slider, the outside fixedly connected with impact bar of slider, the outside swing joint of slider has the connecting rod, the outside swing joint of connecting rod has the gyro wheel, the outside fixedly connected with spring one of slider, the outside fixedly connected with collection dress board of slider, the outside fixedly connected with snap ring of collection dress board, the inboard fixedly connected with semiconductor coil of snap ring, the inboard swing joint of snap ring has the semiconductor electromagnet, the outside fixedly connected with impeller of semiconductor electromagnet, the inside swing joint of casing has photosensitive assembly, the inside swing joint of casing.
Preferably, the surface of the casing is provided with light inlet grooves, the number of the light inlet grooves is not less than fifteen, all the light inlet grooves are uniformly distributed on the surface of the casing, the surface of the casing is provided with an outlet, and the first rotating wheel and the second rotating wheel correspond in position and are matched in specification.
Preferably, the slide rail corresponds to the slide block in position and is matched with the slide block in specification, the two ends of the connecting rod are movably connected with the roller, the roller corresponds to the arc plate in position and is matched with the arc plate in specification, and the roller corresponds to the rotating wheel II in position and is matched with the rotating wheel II in specification.
Preferably, the both ends of spring one are fixed connection respectively in the outside of slider and the inboard of slider, and the corresponding and specification phase-match in position of collection dress board and start mouthful, and the corresponding and specification phase-match in position of snap ring and start mouthful, eight are no less than to the quantity of snap ring, and all snap ring evenly distributed are in the outside of collection dress board, and the corresponding and specification phase-match in position of semiconductor coil and semiconductor electromagnet.
Preferably, photosensitive assembly mainly comprises photo resistance, safety cover, light trap, and safety cover fixed connection is in the inside of casing, and the light trap is seted up on the surface of safety cover, and photo resistance fixed connection is in the inside of safety cover, and the light trap is corresponding and the specification phase-match with photo resistance's position, and the light trap is corresponding and the specification phase-match with the position of striking rod.
Preferably, the detection assembly mainly comprises a closed cover, a collision rod, a contact and a spring II, the closed cover is fixedly connected in the casing, the collision rod is movably connected to the outside of the closed cover, the contact is fixedly connected to the inside of the closed cover, two ends of the spring II are respectively fixedly connected to the outside of the collision rod and the inside of the closed cover, the collision rod is corresponding to the position of the collision rod and matched with the specification, and the collision rod is corresponding to the position of the contact and matched with the specification.
Preferably, the semiconductor coil and the semiconductor electromagnet are electrically connected with an external power supply, the contact, the photoresistor, the external power supply and the driving power supply are electrically connected with the control center, and the first rotating wheel is electrically connected with the driving power supply.
(III) advantageous effects
Compared with the prior art, the invention provides a compressor heat dissipation energy-saving device based on a semiconductor principle, which has the following beneficial effects:
1. this compressor heat dissipation economizer based on semiconductor principle, through the interact between integrated board, snap ring, semiconductor coil, semiconductor electro-magnet, the impeller under, can be so that the produced heat of during operation of compressor can be through semiconductor coil, semiconductor electro-magnet, the impeller between quick discharge the heat under mutually supporting, guarantee that the compressor is in best operating condition all the time, and then improved the practicality of compressor, adopt the consumption of the also very big reduction electric energy of semiconductor material.
2. This compressor heat dissipation economizer based on semiconductor principle, through the start-up mouth, runner one, the arc board, runner two, the slide rail, the slider, the impact bar, the connecting rod, the gyro wheel, spring one, the integrated board, the snap ring, semiconductor coil, the semiconductor electro-magnet, the impeller, photosensitive assembly, under the interact between the determine module, can make heat abstractor accomplish miniaturization and low energy consumption, can also improve the work efficiency of compressor simultaneously, make the noise that compressor work produced littleer like this, the use experience of user has been improved, win better market feedback, the compressor use price/performance ratio has been improved.
Drawings
FIG. 1 is a schematic view of the present invention with a partial cross-sectional view of the inside thereof;
FIG. 2 is a schematic view of the structure of FIG. 1 at A according to the present invention;
FIG. 3 is a schematic view of the structure of FIG. 1 at B according to the present invention;
FIG. 4 is a schematic view of the structure of FIG. 1 at C according to the present invention;
FIG. 5 is a schematic view of the structure of FIG. 1 at D in accordance with the present invention;
FIG. 6 is a schematic view of the structure of FIG. 1 at E according to the present invention;
FIG. 7 is a schematic view of the structure at F in FIG. 1 according to the present invention.
In the figure: 1. a housing; 2. a priming port; 3. a first rotating wheel; 4. an arc plate; 5. a second rotating wheel; 6. a slide rail; 7. a slider; 8. a striker bar; 9. a connecting rod; 10. a roller; 11. a first spring; 12. a package board; 13. a snap ring; 14. a semiconductor coil; 15. a semiconductor electromagnet; 16. an impeller; 17. a photosensitive element; 18. and a detection component.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1-7, a heat dissipation and energy saving device of a compressor based on semiconductor principle comprises a casing 1, a starting opening 2 is formed on the surface of the casing 1, a first rotating wheel 3 is movably connected inside the casing 1, an arc plate 4 is fixedly connected outside the first rotating wheel 3, a second rotating wheel 5 is movably connected inside the casing 1, a light inlet groove is formed on the surface of the casing 1, the number of the light inlet grooves is not less than fifteen, all the light inlet grooves are uniformly distributed on the surface of the casing 1, an outlet is formed on the surface of the casing 1, the first rotating wheel 3 and the second rotating wheel 5 are in corresponding positions and are matched in specification, a sliding rail 6 is fixedly connected inside the casing 1, a sliding block 7 is movably connected inside the sliding rail 6, an impact rod 8 is fixedly connected outside the sliding block 7, a connecting rod 9 is movably connected outside the sliding block 7, a roller 10 is movably connected outside the connecting rod 9, the sliding rail, the two ends of the connecting rod 9 are movably connected with idler wheels 10, the idler wheels 10 correspond to the arc plates 4 in position and are matched in specification, and the idler wheels 10 correspond to the second rotating wheels 5 in position and are matched in specification.
The outer portion of the sliding block 7 is fixedly connected with a first spring 11, the outer portion of the sliding block 7 is fixedly connected with an assembly plate 12, the outer portion of the assembly plate 12 is fixedly connected with a clamping ring 13, the inner side of the clamping ring 13 is fixedly connected with a semiconductor coil 14, the inner side of the clamping ring 13 is movably connected with a semiconductor electromagnet 15, two ends of the first spring 11 are respectively fixedly connected to the outer portion of the sliding block 7 and the inner side of the sliding block 7, the assembly plate 12 corresponds to the starting port 2 in position and is matched with the starting port 2 in specification, the clamping ring 13 corresponds to the starting port 2 in position and is matched with the starting port in specification, the number of the clamping rings 13 is not less than eight, all the clamping rings 13 are uniformly distributed on the outer portion of the assembly plate 12, the semiconductor coil 14 corresponds to the semiconductor electromagnet 15 in position and are matched with the, Under the interact between the impeller 16, can be so that the produced heat of the during operation of compressor can pass through semiconductor coil 14, semiconductor electromagnet 15, quick discharge the heat under the mutually supporting between the impeller 16, guarantee that the compressor is in the best operating condition all the time, and then the practicality of compressor has been improved, adopt the consumption of the also very big reduction electric energy of semiconductor material, the inside swing joint of casing 1 has photosensitive assembly 17, photosensitive assembly 17 mainly by the photo resistance, the safety cover, the light trap is constituteed, safety cover fixed connection is in the inside of casing 1, the light trap is seted up on the surface of safety cover, photo resistance fixed connection is in the inside of safety cover, the light trap is corresponding and the specification phase-match with the position of photo resistance, the light trap is corresponding and the specification phase-match with the position of striking pole 8.
The inside swing joint of casing 1 has detection assembly 18, detection assembly 18 mainly comprises enclosure, collision pole, contact, spring two, the enclosure is fixed connection in the inside of casing 1, collision pole swing joint is in the outside of enclosure, contact fixed connection is in the inside of enclosure, the both ends of spring two are fixed connection respectively in the outside of collision pole and the inside of enclosure, the position of collision pole and striking pole 8 is corresponding and the specification phase-match, the position of collision pole and contact is corresponding and the specification phase-match, semiconductor coil 14, semiconductor electro-magnet 15 all are connected with external power electricity, the contact, photo resistance, external power, drive power all are connected with the control hub electricity, runner one 3 is connected with drive power electricity, through start mouth 2, runner one 3, arc plate 4, runner two 5, slide rail 6, slider 7, striking pole 8, connecting rod 9, gyro wheel 10, Under the interact between spring 11, collection dress board 12, snap ring 13, semiconductor coil 14, semiconductor electro-magnet 15, impeller 16, photosensitive assembly 17, the determine module 18, can make heat abstractor accomplish miniaturization and low energy consumption, can also improve the work efficiency of compressor simultaneously, make the noise that compressor work produced more little like this, improved user's use and experienced, win better market feedback, improved the compressor and used the price/performance ratio.
The device starts to be started, a user controls a driving power supply to drive a first rotating wheel 3 to rotate through a control center, the first rotating wheel 3 rotates to drive a second rotating wheel 5 to rotate, the second rotating wheel 5 rotates to drive a roller 10 to rotate, the first rotating wheel 3 rotates to drive an arc plate 4 to rotate, the arc plate 4 rotates to drive the roller 10 to rotate, the roller 10 rotates to drive a connecting rod 9 to swing, the connecting rod 9 swings to drive a sliding block 7 to slide, the sliding block 7 slides to drive a striking rod 8 to move, the sliding block 7 slides to drive a collecting plate 12 to move, the collecting plate 12 moves to drive a clamping ring 13, a semiconductor coil 14, a semiconductor electromagnet 15 and an impeller 16 to move, the impeller 16 moves to the outside of a machine shell 1 through a starting opening 2, and when the striking rod 8 moves until light irradiating the surface of a photosensitive resistor through a light hole is shielded, the resistance of the photosensitive resistor changes and the current in the photosensitive resistor changes, and then the control, The semiconductor electromagnet 15 is electrified, an electromagnetic field is generated around the electrified semiconductor coil 14, the semiconductor electromagnet 15 is electrified to rotate under the action of ampere force in the electromagnetic field generated by the semiconductor coil 14, the semiconductor electromagnet 15 rotates to drive the impeller 16 to rotate, and the impeller 16 rotates to convey hot air generated by the compressor to the outside.
After heat dissipation is finished, a user controls the driving power supply to drive the first rotating wheel 3 to rotate and controls the external power supply to stop energizing the semiconductor coil 14 and the semiconductor electromagnet 15 through the control center, similarly, the semiconductor coil 14 loses electricity, the semiconductor electromagnet 15 loses electricity and stops rotating, the sliding block 7 slides on the inner side of the sliding rail 6 under the action of the restoring force of the first spring 11, the container plate 12 moves to drive the snap ring 13, the semiconductor coil 14, the semiconductor electromagnet 15 and the impeller 16 to move, the impeller 16 moves into the shell 1 through the starting opening 2, when the impact rod 8 moves until the impact rod contacts with the impact rod and drives the impact rod to slide under the action of the closed cover, the impact rod slides until the impact rod contacts with the contact, and then the control center controls the driving power supply to stop driving the first.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (7)
1. The utility model provides a compressor heat dissipation economizer based on semiconductor principle, includes casing (1), its characterized in that: the surface of the casing (1) is provided with a starting opening (2), the inside of the casing (1) is movably connected with a first rotating wheel (3), the outside of the first rotating wheel (3) is fixedly connected with an arc plate (4), the inside of the casing (1) is movably connected with a second rotating wheel (5), the inside of the casing (1) is fixedly connected with a sliding rail (6), the inner side of the sliding rail (6) is movably connected with a sliding block (7), the outside of the sliding block (7) is fixedly connected with an impact rod (8), the outside of the sliding block (7) is movably connected with a connecting rod (9), the outside of the connecting rod (9) is movably connected with a roller (10), the outside of the sliding block (7) is fixedly connected with a first spring (11), the outside of the sliding block (7) is fixedly connected with a container plate (12), the outside of the container plate (12) is fixedly connected with, the inner side of the clamping ring (13) is movably connected with a semiconductor electromagnet (15), the outer part of the semiconductor electromagnet (15) is fixedly connected with an impeller (16), the inner part of the machine shell (1) is movably connected with a photosensitive assembly (17), and the inner part of the machine shell (1) is movably connected with a detection assembly (18).
2. The heat dissipation and energy saving device of the compressor based on the semiconductor principle as claimed in claim 1, wherein: the surface of the casing (1) is provided with light inlet grooves, the number of the light inlet grooves is not less than fifteen, all the light inlet grooves are uniformly distributed on the surface of the casing (1), the surface of the casing (1) is provided with an outlet, and the positions of the first rotating wheel (3) and the second rotating wheel (5) correspond to each other and are matched in specification.
3. The heat dissipation and energy saving device of the compressor based on the semiconductor principle as claimed in claim 1, wherein: the slide rail (6) is corresponding to the slide block (7) in position and is matched with the slide block in specification, the two ends of the connecting rod (9) are movably connected with the roller (10), the roller (10) is corresponding to the arc plate (4) in position and is matched with the arc plate in specification, and the roller (10) is corresponding to the rotating wheel II (5) in position and is matched with the rotating wheel II in specification.
4. The heat dissipation and energy saving device of the compressor based on the semiconductor principle as claimed in claim 1, wherein: the both ends of spring (11) are fixed connection respectively in the outside of slider (7) and the inboard of slider (7), and the corresponding and specification phase-match in position of collection dress board (12) and start-up mouth (2), and corresponding and specification phase-match in position of snap ring (13) and start-up mouth (2), and eight is no less than in the quantity of snap ring (13), and all snap ring (13) evenly distributed are in the outside of collection dress board (12), and the corresponding and specification phase-match in position of semiconductor coil (14) and semiconductor electro-magnet (15).
5. The heat dissipation and energy saving device of the compressor based on the semiconductor principle as claimed in claim 1, wherein: photosensitive assembly (17) mainly comprises photo resistance, safety cover, light trap, and safety cover fixed connection is in the inside of casing (1), and the light trap is seted up on the surface of safety cover, and photo resistance fixed connection is in the inside of safety cover, and the light trap is corresponding and the specification phase-match with photo resistance's position, and the light trap is corresponding and the specification phase-match with the position of striking rod (8).
6. The heat dissipation and energy saving device of the compressor based on the semiconductor principle as claimed in claim 1, wherein: detection component (18) mainly comprise closing cap, collision pole, contact, two springs, and closing cap fixed connection is in the inside of casing (1), and collision pole swing joint is in the outside of closing cap, and contact fixed connection is in the inside of closing cap, and the both ends of spring two are fixed connection respectively in the outside of collision pole and the inside of closing cap, and the position of collision pole and collision pole (8) is corresponding and the specification phase-match, and the position of collision pole and contact is corresponding and the specification phase-match.
7. The heat dissipation and energy saving device of the compressor based on the semiconductor principle as claimed in claim 1, wherein: the semiconductor coil (14) and the semiconductor electromagnet (15) are electrically connected with an external power supply, the contact, the photoresistor, the external power supply and the driving power supply are electrically connected with the control center, and the first rotating wheel (3) is electrically connected with the driving power supply.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011334961.8A CN112431743A (en) | 2020-11-24 | 2020-11-24 | Compressor heat dissipation economizer based on semiconductor principle |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011334961.8A CN112431743A (en) | 2020-11-24 | 2020-11-24 | Compressor heat dissipation economizer based on semiconductor principle |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112431743A true CN112431743A (en) | 2021-03-02 |
Family
ID=74697412
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011334961.8A Withdrawn CN112431743A (en) | 2020-11-24 | 2020-11-24 | Compressor heat dissipation economizer based on semiconductor principle |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112431743A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113513468A (en) * | 2021-04-18 | 2021-10-19 | 江苏气老板节能技术有限公司 | Small-size energy-conserving formula air compressor machine |
-
2020
- 2020-11-24 CN CN202011334961.8A patent/CN112431743A/en not_active Withdrawn
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113513468A (en) * | 2021-04-18 | 2021-10-19 | 江苏气老板节能技术有限公司 | Small-size energy-conserving formula air compressor machine |
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Application publication date: 20210302 |
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| WW01 | Invention patent application withdrawn after publication |