CN112430380A - Epoxy resin and glass fiber composite material composition and high-frequency copper-clad plate manufactured by same - Google Patents

Epoxy resin and glass fiber composite material composition and high-frequency copper-clad plate manufactured by same Download PDF

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Publication number
CN112430380A
CN112430380A CN202011316708.XA CN202011316708A CN112430380A CN 112430380 A CN112430380 A CN 112430380A CN 202011316708 A CN202011316708 A CN 202011316708A CN 112430380 A CN112430380 A CN 112430380A
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epoxy resin
glass fiber
fiber composite
copper foil
composite material
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CN202011316708.XA
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Chinese (zh)
Inventor
包晓剑
顾鑫
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Jiangsu Roda Electron Material Co ltd
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Jiangsu Roda Electron Material Co ltd
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Priority to CN202011316708.XA priority Critical patent/CN112430380A/en
Publication of CN112430380A publication Critical patent/CN112430380A/en
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/02—Fibres or whiskers
    • C08K7/04—Fibres or whiskers inorganic
    • C08K7/14—Glass
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/14—Layered products comprising a layer of metal next to a fibrous or filamentary layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
    • B32B5/02—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by structural features of a fibrous or filamentary layer
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J3/00—Processes of treating or compounding macromolecular substances
    • C08J3/20—Compounding polymers with additives, e.g. colouring
    • C08J3/205—Compounding polymers with additives, e.g. colouring in the presence of a continuous liquid phase
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2250/00—Layers arrangement
    • B32B2250/40—Symmetrical or sandwich layers, e.g. ABA, ABCBA, ABCCBA
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2255/00—Coating on the layer surface
    • B32B2255/06—Coating on the layer surface on metal layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2255/00—Coating on the layer surface
    • B32B2255/26—Polymeric coating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
    • B32B2260/02—Composition of the impregnated, bonded or embedded layer
    • B32B2260/021—Fibrous or filamentary layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
    • B32B2260/04—Impregnation, embedding, or binder material
    • B32B2260/046—Synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
    • B32B2262/10—Inorganic fibres
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
    • B32B2262/10—Inorganic fibres
    • B32B2262/101—Glass fibres
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2363/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins

Abstract

The invention discloses an epoxy resin and glass fiber composite material composition and a high-frequency copper-clad plate manufactured by the same, which comprises the following steps: s101, preparing epoxy resin, a glass fiber composite material, copper foil and electronic-grade glass cloth; s102, mixing epoxy resin emulsion; s103, selecting a combination of glass fiber composite materials; s104, mixing the epoxy resin emulsion and the glass fiber composite material to obtain the epoxy resin composition. The epoxy resin and glass fiber composite material composition and the high-frequency copper-clad plate manufactured by the composition are uniformly stirred by adopting an ultrasonic oscillator and a conventional stirring rod, so that the composition is prepared, the mixing degree is higher, the high-frequency copper-clad plate manufactured by the composition with the higher mixing degree has high volume concentration and low dielectric loss, and the transmission stability is improved; by controlling the laminating pressure to be about 12MPa, the thickness of the manufactured high-frequency copper-clad plate is small, and the transmission rate reaches the highest.

Description

Epoxy resin and glass fiber composite material composition and high-frequency copper-clad plate manufactured by same
Technical Field
The invention relates to the technical field of high-frequency copper-clad plates, in particular to an epoxy resin and glass fiber composite material composition and a high-frequency copper-clad plate manufactured by the same.
Background
The epoxy resin is a generic name of a polymer having two or more epoxy groups in a molecule. It is a polycondensation product of epichlorohydrin and bisphenol A or a polyol. Because of the chemical activity of the epoxy group, a plurality of compounds containing active hydrogen can be used for ring opening, curing and crosslinking to generate a network structure, so that the epoxy group is a thermosetting resin; the glass fiber composite material is light and hard, non-conductive, stable in performance and high in mechanical strength; based on the advantages of the epoxy resin and glass fiber composite material in performance, the epoxy resin and glass fiber composite material are combined, and a copper foil and an electronic grade glass cloth are matched to produce a high-frequency copper-clad plate with excellent performance.
Disclosure of Invention
The invention aims to provide an epoxy resin and glass fiber composite material composition and a high-frequency copper-clad plate manufactured by the same, which have the advantages of small dielectric loss, high transmission rate and high transmission stability, and solve the problems of large dielectric loss, low transmission rate and low stability of the high-frequency copper-clad plate in the background art.
In order to achieve the purpose, the invention provides the following technical scheme: an epoxy resin and glass fiber composite composition comprising the steps of:
s101, preparing materials including epoxy resin, a glass fiber composite material, copper foil and electronic-grade glass cloth;
s102, mixing epoxy resin emulsion;
s103, selecting a combination of glass fiber composite materials;
s104, mixing the epoxy resin emulsion and the glass fiber composite material to obtain the epoxy resin composition.
Preferably, the epoxy resin is one or any combination of several of structural adhesive, high-temperature-resistant adhesive and conductive adhesive.
Preferably, the glass fiber composite material is one or a combination of glass fiber reinforced composite plastic, carbon fiber reinforced composite plastic and boron fiber reinforced composite plastic.
Preferably, the glass fiber composite material is melted at high temperature, poured into a ceramic vessel for standby, added with the epoxy resin emulsion, and fully mixed after stirring.
Preferably, the epoxy resin emulsion and the glass fiber composite material solution are subjected to oscillation treatment by an ultrasonic oscillator in the mixing process, so that the effect of full mixing is achieved, and the epoxy resin composition is not layered.
The invention provides another technical scheme that: a high-frequency copper clad laminate made of an epoxy resin and glass fiber composite material composition comprises a first copper foil, a dipped fabric and a second copper foil, wherein the dipped fabric is made of epoxy resin composition dipped glass cloth through drying, baking and sintering; the first copper foil and the second copper foil are prepared by coating an epoxy resin composition on one surface of the copper foil, drying, baking and sintering.
Preferably, the manufactured copper foil and the impregnated cloth are laminated into the high-frequency copper clad laminate according to the mode of the copper foil, the impregnated cloth and the copper foil, and one side face of the copper foil coated with the mixed solution of the epoxy resin emulsion and the glass fiber composite material is the impregnated cloth.
Preferably, the dipped fabric is prepared by processing the epoxy resin composition through three processes of drying, baking and sintering of the glass fabric, wherein the temperature of the drying process is controlled to be between 70 and 110 ℃, the temperature of the baking process is controlled to be between 160 and 210 ℃, and the temperature of the sintering process is controlled to be between 320 and 450 ℃.
Preferably, the prepared copper foil and the dipped cloth to be used are pressed into the high-frequency copper-clad plate in a vacuum environment in a mode of copper foil, dipped cloth and copper foil.
Preferably, the pressure of the copper foil + the treated fabric + the copper foil is 12MPa, and an epoxy resin film is coated between the copper foil and the treated fabric.
Compared with the prior art, the invention has the beneficial effects that: according to the epoxy resin and glass fiber composite material composition and the high-frequency copper-clad plate manufactured by using the same, when the epoxy resin emulsion and glass fiber composite material composition is prepared, the composition is uniformly stirred in a mode of matching an ultrasonic oscillator with a conventional stirring rod, the mixing degree is higher, the high-frequency copper-clad plate manufactured by using the composition with the higher mixing degree is high in volume concentration and low in dielectric loss, and the transmission stability is improved; by controlling the laminating pressure to be about 11MPa, the thickness of the manufactured high-frequency copper-clad plate is small, and the transmission rate reaches the highest.
Drawings
FIG. 1 is a manufacturing flow diagram of the present invention;
FIG. 2 is a thickness graph of a high frequency copper clad laminate according to the first to fifth embodiments of the present invention;
FIG. 3 is a graph showing the quantity and concentration curves of a high-frequency copper-clad plate manufactured according to the first embodiment to the fifth embodiment of the invention;
FIG. 4 is a dielectric constant curve diagram of a high-frequency copper-clad plate manufactured according to the first embodiment to the fifth embodiment of the present invention;
FIG. 5 is a dielectric loss curve chart of a high-frequency copper-clad plate manufactured according to the first embodiment to the fifth embodiment of the invention;
fig. 6 is a transmission rate curve diagram of a high-frequency copper-clad plate manufactured according to embodiments one to five of the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1, a composite material composition of epoxy resin and glass fiber includes the following steps:
s101, preparing materials including epoxy resin, a glass fiber composite material, copper foil and electronic-grade glass cloth;
s102, mixing epoxy resin emulsion;
s103, selecting a combination of glass fiber composite materials;
s104, mixing the epoxy resin emulsion and the glass fiber composite material to obtain the epoxy resin composition.
Wherein: the epoxy resin is one or any combination of a plurality of structural adhesive, high temperature resistant adhesive and conductive adhesive.
Wherein: the glass fiber composite material is one or a combination of glass fiber reinforced composite plastic, carbon fiber reinforced composite plastic and boron fiber reinforced composite plastic.
Wherein: melting the glass fiber composite material at high temperature, pouring the melted glass fiber composite material into a ceramic vessel for later use, adding the epoxy resin emulsion, and fully mixing after stirring.
Wherein: the epoxy resin emulsion and the glass fiber composite material solution are subjected to oscillation treatment by an ultrasonic oscillator in the mixing process, so that the effect of full mixing is achieved, and the epoxy resin composition is not layered.
The invention provides another technical scheme that: a high-frequency copper clad laminate made of an epoxy resin and glass fiber composite material composition comprises a first copper foil, a dipped fabric and a second copper foil, wherein the dipped fabric is made of epoxy resin composition dipped glass cloth through drying, baking and sintering; the first copper foil and the second copper foil are prepared by coating an epoxy resin composition on one surface of the copper foil, drying, baking and sintering.
Wherein: and laminating the prepared copper foil and the impregnated cloth into a high-frequency copper-clad plate according to the mode of the copper foil, the impregnated cloth and the copper foil, wherein the side surface of the copper foil coated with the mixed solution of the epoxy resin emulsion and the glass fiber composite material is the impregnated cloth.
Wherein: the dipped fabric is prepared by processing an epoxy resin composition through three processes of drying, baking and sintering of glass fabric, wherein the temperature of the drying process is controlled to be between 70 and 110 ℃, the temperature of the baking process is controlled to be between 160 and 210 ℃, and the temperature of the sintering process is controlled to be between 320 and 450 ℃.
Wherein: and (3) pressing the prepared copper foil and the dipped cloth to be used into the high-frequency copper-clad plate at the lower layer in a vacuum environment according to the mode of the copper foil, the dipped cloth and the copper foil.
Wherein: the pressure when the copper foil, the impregnated cloth and the copper foil are laminated is 12MPa, and an epoxy resin film is coated between the copper foil and the impregnated cloth.
The first embodiment is as follows: the invention provides an epoxy resin and glass fiber composite material composition and a high-frequency copper-clad plate manufactured by the same, wherein the preparation process of the high-frequency copper-clad plate is as follows:
the first step is as follows: mixing the epoxy resin emulsion and the glass fiber composite material to prepare a composition, and uniformly stirring by adopting a conventional stirring rod stirring mode;
the second step is that: preparing a prepreg with the thickness of 0.08mm and the dielectric constant of 6.2 by adopting the composition and 0.042mm electronic-grade glass cloth;
the third step: the composition and the copper foil are sequentially subjected to drying, baking and sintering processes, the sintering temperature is controlled to be 320-360 ℃, and the baking time is controlled to be 10-20 minutes;
the fourth step: and laminating the prepared copper foil to be used and the impregnated cloth into the high-frequency copper clad laminate according to the mode of the copper foil, the impregnated cloth and the copper foil, wherein the pressure is controlled to be 11MPa during lamination.
Example two: the invention provides an epoxy resin and glass fiber composite material composition and a high-frequency copper-clad plate manufactured by the same, wherein the preparation process of the high-frequency copper-clad plate is as follows:
the first step is as follows: mixing the epoxy resin emulsion and the glass fiber composite material to prepare a composition, and uniformly stirring by adopting a conventional stirring rod stirring mode;
the second step is that: preparing a prepreg with the thickness of 0.08mm and the dielectric constant of 6.2 by adopting the composition and 0.046mm electronic-grade glass cloth;
the third step: the composition and the copper foil are sequentially subjected to drying, baking and sintering processes, the sintering temperature is controlled to be 320-360 ℃, and the baking time is controlled to be 10-20 minutes;
the fourth step: and laminating the prepared copper foil to be used and the impregnated cloth into the high-frequency copper clad laminate according to the mode of the copper foil, the impregnated cloth and the copper foil, wherein the pressure is controlled to be 12MPa during lamination.
Example three: the invention provides an epoxy resin and glass fiber composite material composition and a high-frequency copper-clad plate manufactured by the same, wherein the preparation process of the high-frequency copper-clad plate is as follows:
the first step is as follows: mixing the epoxy resin emulsion and the glass fiber composite material to prepare a composition, and uniformly stirring by adopting an ultrasonic oscillator and a conventional stirring rod;
the second step is that: preparing a prepreg with the thickness of 0.08mm and the dielectric constant of 6.2 by adopting the composition and 0.042mm electronic-grade glass cloth;
the third step: the composition and the copper foil are sequentially subjected to drying, baking and sintering processes, the sintering temperature is controlled to be 320-360 ℃, and the baking time is controlled to be 10-20 minutes;
the fourth step: and laminating the prepared copper foil to be used and the impregnated cloth into the high-frequency copper clad laminate according to the mode of the copper foil, the impregnated cloth and the copper foil, wherein the pressure is controlled to be 12MPa during lamination.
Example four: the invention provides an epoxy resin and glass fiber composite material composition and a high-frequency copper-clad plate manufactured by the same, wherein the preparation process of the high-frequency copper-clad plate is as follows:
the first step is as follows: mixing the epoxy resin emulsion and the glass fiber composite material to prepare a composition, and uniformly stirring by adopting an ultrasonic oscillator and a conventional stirring rod;
the second step is that: preparing a prepreg with the thickness of 0.08mm and the dielectric constant of 6.2 by adopting the composition and 0.046mm electronic-grade glass cloth;
the third step: the composition and the copper foil are sequentially subjected to drying, baking and sintering processes, the sintering temperature is controlled to be 320-360 ℃, and the baking time is controlled to be 10-20 minutes;
the fourth step: and laminating the prepared copper foil to be used and the impregnated cloth into the high-frequency copper clad laminate according to the mode of the copper foil, the impregnated cloth and the copper foil, wherein the pressure is controlled to be 11MPa during lamination.
Example five: the invention provides an epoxy resin and glass fiber composite material composition and a high-frequency copper-clad plate manufactured by the same, wherein the preparation process of the high-frequency copper-clad plate is as follows:
the first step is as follows: mixing the epoxy resin emulsion and the glass fiber composite material to prepare a composition, and uniformly stirring by adopting a conventional stirring rod stirring mode;
the second step is that: preparing a prepreg with the thickness of 0.08mm and the dielectric constant of 6.2 by adopting the composition and 0.042mm electronic-grade glass cloth;
the third step: the composition and the copper foil are sequentially subjected to drying, baking and sintering processes, the sintering temperature is controlled to be 320-360 ℃, and the baking time is controlled to be 10-20 minutes;
the fourth step: and laminating the prepared copper foil to be used and the impregnated cloth into the high-frequency copper clad laminate according to the mode of the copper foil, the impregnated cloth and the copper foil, wherein the pressure is controlled between 12MPa during lamination.
Example six: the invention provides an epoxy resin and glass fiber composite material composition and a high-frequency copper-clad plate manufactured by the same, wherein the preparation process of the high-frequency copper-clad plate is as follows:
the first step is as follows: mixing the epoxy resin emulsion and the glass fiber composite material to prepare a composition, and uniformly stirring by adopting a conventional stirring rod stirring mode;
the second step is that: preparing a prepreg with the thickness of 0.08mm and the dielectric constant of 6.2 by adopting the composition and 0.042mm electronic-grade glass cloth;
the third step: the composition and the copper foil are sequentially subjected to drying, baking and sintering processes, the sintering temperature is controlled to be 320-360 ℃, and the baking time is controlled to be 10-20 minutes;
the fourth step: and laminating the prepared copper foil to be used and the impregnated cloth into the high-frequency copper clad laminate according to the mode of the copper foil, the impregnated cloth and the copper foil, wherein the pressure is controlled to be 14MPa during lamination.
Example seven: the invention provides an epoxy resin and glass fiber composite material composition and a high-frequency copper-clad plate manufactured by the same, wherein the preparation process of the high-frequency copper-clad plate is as follows:
the first step is as follows: mixing the epoxy resin emulsion and the glass fiber composite material to prepare a composition, and uniformly stirring by adopting an ultrasonic oscillator and a conventional stirring rod;
the second step is that: preparing a prepreg with the thickness of 0.08mm and the dielectric constant of 6.2 by adopting the composition and 0.042mm electronic-grade glass cloth;
the third step: the composition and the copper foil are sequentially subjected to drying, baking and sintering processes, the sintering temperature is controlled to be 320-360 ℃, and the baking time is controlled to be 10-20 minutes;
the fourth step: and laminating the prepared copper foil to be used and the impregnated cloth into the high-frequency copper clad laminate according to the mode of the copper foil, the impregnated cloth and the copper foil, wherein the pressure is controlled to be 14MPa during lamination.
The following table shows the performance tests of the high-frequency copper-clad plates in the first to seventh embodiments
Figure DEST_PATH_IMAGE002
Referring to fig. 2-6, it can be seen from the comparison of the first to fifth embodiments that when the epoxy resin emulsion and the glass fiber composite material are fully mixed by the ultrasonic oscillator and the conventional stirring rod, the concentration of the manufactured high-frequency copper-clad plate is significantly high, and the dielectric loss is significantly reduced, while the epoxy resin emulsion and the glass fiber composite material are mixed by the conventional stirring method, the mixing degree is not high, the concentration of the manufactured high-frequency copper-clad plate is significantly low, and the dielectric loss is significantly large; it can be seen from the comparison between the third embodiment and the fourth embodiment that, while the epoxy resin emulsion and the glass fiber composite material are fully mixed by adopting the mode of mixing the ultrasonic oscillator and the conventional stirring rod, the thickness of the electronic grade glass cloth adopted by the fourth embodiment is higher than that of the third embodiment, and the electronic grade glass cloth has higher stability, so that the dielectric constant is high, the dielectric loss is small, and the three phases of the third embodiment are formed by adopting a larger layer pressing method with a larger pressure than that of the fourth embodiment, the thickness is low, and the transmission rate is obviously higher than that of the fourth embodiment; comparing the third embodiment with the seventh embodiment, when a larger laminating pressure is adopted, the thickness of the manufactured high-frequency copper clad laminate is smaller, but due to excessive extrusion and the fact that the internal structures of the treated sheet and the copper foil are damaged locally, although the treated sheet and the copper foil are fused, the performance of the manufactured high-frequency copper clad laminate is greatly reduced due to the damage of the internal structures.
In conclusion, when the composition of the epoxy resin emulsion and the glass fiber composite material is prepared, the composition of the epoxy resin emulsion and the glass fiber composite material is uniformly stirred by adopting an ultrasonic oscillator and a conventional stirring rod, so that the mixing degree is higher, and the high-frequency copper-clad plate prepared from the composition with the higher mixing degree has high volume concentration and small dielectric loss and improves the transmission stability; by controlling the laminating pressure to be about 12MPa, the manufactured high-frequency copper-clad plate has small thickness and highest transmission rate on the basis of ensuring that the performance is not influenced.
The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be considered to be within the technical scope of the present invention, and the technical solutions and the inventive concepts thereof according to the present invention should be equivalent or changed within the scope of the present invention.

Claims (10)

1. An epoxy resin and glass fiber composite material composition is characterized by comprising the following steps:
s101, preparing materials including epoxy resin, a glass fiber composite material, copper foil and electronic-grade glass cloth;
s102, mixing epoxy resin emulsion;
s103, selecting a combination of glass fiber composite materials;
s104, mixing the epoxy resin emulsion and the glass fiber composite material to obtain the epoxy resin composition.
2. The composite material composition of epoxy resin and glass fiber as claimed in claim 1, wherein the epoxy resin is one or more of a structural adhesive, a high temperature resistant adhesive and a conductive adhesive.
3. The epoxy resin and glass fiber composite composition as claimed in claim 1, wherein the glass fiber composite is one or more of glass fiber reinforced composite plastic, carbon fiber reinforced composite plastic and boron fiber reinforced composite plastic.
4. The composition of claim 1, wherein the glass fiber composite is melted at a high temperature, poured into a ceramic vessel for use, added with the epoxy resin emulsion, and mixed thoroughly after stirring.
5. The epoxy resin and glass fiber composite composition according to claim 4, wherein the epoxy resin emulsion and the glass fiber composite solution are subjected to oscillation treatment by an ultrasonic oscillator during mixing, so as to achieve sufficient mixing effect and prevent delamination of the epoxy resin composition.
6. The high-frequency copper-clad plate manufactured by the epoxy resin and glass fiber composite material composition according to claim 1 comprises a first copper foil, a dipped cloth and a second copper foil, wherein the dipped cloth is manufactured by drying, baking and sintering the epoxy resin composition dipped glass cloth; the first copper foil and the second copper foil are prepared by coating an epoxy resin composition on one surface of the copper foil, drying, baking and sintering.
7. The high-frequency copper-clad plate made of the epoxy resin and glass fiber composite composition according to claim 6, wherein the manufactured copper foil and the treated fabric are laminated into the high-frequency copper-clad plate in a manner of copper foil + treated fabric + copper foil, and the copper foil is coated with a side-phase treated fabric of a mixed solution of epoxy resin emulsion and glass fiber composite.
8. The high-frequency copper-clad plate manufactured by the epoxy resin and glass fiber composite material composition according to claim 6, wherein the dipped cloth is made of the epoxy resin composition after being dried, baked and sintered by the glass cloth, the temperature of the drying process is controlled to be between 70 and 110 ℃, the temperature of the baking process is controlled to be between 160 and 210 ℃, and the temperature of the sintering process is controlled to be between 320 and 450 ℃.
9. The high-frequency copper-clad plate manufactured by the epoxy resin and glass fiber composite material composition according to claim 6, wherein the prepared copper foil and the treated cloth are laminated into the high-frequency copper-clad plate in a vacuum environment according to the mode of the copper foil, the treated cloth and the copper foil.
10. The high-frequency copper-clad plate made of the epoxy resin and glass fiber composite material composition according to claim 9, wherein the pressure of the copper foil + the treated cloth + the copper foil during lamination is 12MPa, and an epoxy resin film is coated between the copper foil and the treated cloth.
CN202011316708.XA 2020-11-23 2020-11-23 Epoxy resin and glass fiber composite material composition and high-frequency copper-clad plate manufactured by same Pending CN112430380A (en)

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Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107189353A (en) * 2017-06-27 2017-09-22 过春明 A kind of epoxy resin copper-clad plate and preparation method thereof
CN110239164A (en) * 2019-06-13 2019-09-17 重庆德凯实业股份有限公司 Tg copper-clad plate and preparation method thereof in high-fire resistance

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107189353A (en) * 2017-06-27 2017-09-22 过春明 A kind of epoxy resin copper-clad plate and preparation method thereof
CN110239164A (en) * 2019-06-13 2019-09-17 重庆德凯实业股份有限公司 Tg copper-clad plate and preparation method thereof in high-fire resistance

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Application publication date: 20210302