CN112428634A - Aluminum-based bimetal composite plate and preparation method thereof - Google Patents
Aluminum-based bimetal composite plate and preparation method thereof Download PDFInfo
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- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 title claims abstract description 97
- 229910052782 aluminium Inorganic materials 0.000 title claims abstract description 97
- 239000002131 composite material Substances 0.000 title claims abstract description 93
- 238000002360 preparation method Methods 0.000 title abstract description 14
- 239000010410 layer Substances 0.000 claims abstract description 78
- 239000010949 copper Substances 0.000 claims abstract description 35
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 32
- 229910052802 copper Inorganic materials 0.000 claims abstract description 32
- 238000005260 corrosion Methods 0.000 claims abstract description 20
- 230000007797 corrosion Effects 0.000 claims abstract description 19
- 238000005098 hot rolling Methods 0.000 claims abstract description 18
- 239000002994 raw material Substances 0.000 claims abstract description 14
- 238000010438 heat treatment Methods 0.000 claims abstract description 13
- 238000007747 plating Methods 0.000 claims abstract description 10
- 239000011241 protective layer Substances 0.000 claims abstract description 10
- 230000001681 protective effect Effects 0.000 claims abstract description 9
- 239000012298 atmosphere Substances 0.000 claims abstract description 8
- 238000005507 spraying Methods 0.000 claims abstract description 5
- 238000013329 compounding Methods 0.000 claims abstract description 4
- 229910052751 metal Inorganic materials 0.000 claims description 18
- 239000002184 metal Substances 0.000 claims description 18
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 15
- 238000000034 method Methods 0.000 claims description 14
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 11
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims description 10
- 239000004411 aluminium Substances 0.000 claims description 10
- 229910052709 silver Inorganic materials 0.000 claims description 10
- 239000004332 silver Substances 0.000 claims description 10
- 229910052725 zinc Inorganic materials 0.000 claims description 10
- 239000011701 zinc Substances 0.000 claims description 10
- 229910052759 nickel Inorganic materials 0.000 claims description 7
- 230000009467 reduction Effects 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 claims description 2
- 238000000576 coating method Methods 0.000 abstract description 12
- 239000011248 coating agent Substances 0.000 abstract description 10
- 238000005096 rolling process Methods 0.000 description 11
- 238000012360 testing method Methods 0.000 description 11
- 230000000052 comparative effect Effects 0.000 description 9
- 238000009713 electroplating Methods 0.000 description 9
- 239000007864 aqueous solution Substances 0.000 description 8
- 239000000463 material Substances 0.000 description 8
- 239000000243 solution Substances 0.000 description 8
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 6
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 6
- SQGYOTSLMSWVJD-UHFFFAOYSA-N silver(1+) nitrate Chemical group [Ag+].[O-]N(=O)=O SQGYOTSLMSWVJD-UHFFFAOYSA-N 0.000 description 6
- -1 polytetrafluoroethylene Polymers 0.000 description 5
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 5
- 239000004810 polytetrafluoroethylene Substances 0.000 description 5
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 4
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 4
- 239000002585 base Substances 0.000 description 3
- 239000002905 metal composite material Substances 0.000 description 3
- LGQLOGILCSXPEA-UHFFFAOYSA-L nickel sulfate Chemical compound [Ni+2].[O-]S([O-])(=O)=O LGQLOGILCSXPEA-UHFFFAOYSA-L 0.000 description 3
- 229910000363 nickel(II) sulfate Inorganic materials 0.000 description 3
- 229910052757 nitrogen Inorganic materials 0.000 description 3
- 229910001961 silver nitrate Inorganic materials 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 238000004381 surface treatment Methods 0.000 description 3
- 238000010998 test method Methods 0.000 description 3
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- 230000009471 action Effects 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- 150000002815 nickel Chemical class 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- GGCZERPQGJTIQP-UHFFFAOYSA-N sodium;9,10-dioxoanthracene-2-sulfonic acid Chemical compound [Na+].C1=CC=C2C(=O)C3=CC(S(=O)(=O)O)=CC=C3C(=O)C2=C1 GGCZERPQGJTIQP-UHFFFAOYSA-N 0.000 description 2
- UONOETXJSWQNOL-UHFFFAOYSA-N tungsten carbide Chemical compound [W+]#[C-] UONOETXJSWQNOL-UHFFFAOYSA-N 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 150000003751 zinc Chemical class 0.000 description 2
- JIAARYAFYJHUJI-UHFFFAOYSA-L zinc dichloride Chemical compound [Cl-].[Cl-].[Zn+2] JIAARYAFYJHUJI-UHFFFAOYSA-L 0.000 description 2
- ONDPHDOFVYQSGI-UHFFFAOYSA-N zinc nitrate Chemical compound [Zn+2].[O-][N+]([O-])=O.[O-][N+]([O-])=O ONDPHDOFVYQSGI-UHFFFAOYSA-N 0.000 description 2
- NWONKYPBYAMBJT-UHFFFAOYSA-L zinc sulfate Chemical compound [Zn+2].[O-]S([O-])(=O)=O NWONKYPBYAMBJT-UHFFFAOYSA-L 0.000 description 2
- 229910000368 zinc sulfate Inorganic materials 0.000 description 2
- 229960001763 zinc sulfate Drugs 0.000 description 2
- 229910018563 CuAl2 Inorganic materials 0.000 description 1
- 229910021586 Nickel(II) chloride Inorganic materials 0.000 description 1
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- MQRWBMAEBQOWAF-UHFFFAOYSA-N acetic acid;nickel Chemical compound [Ni].CC(O)=O.CC(O)=O MQRWBMAEBQOWAF-UHFFFAOYSA-N 0.000 description 1
- ZOIORXHNWRGPMV-UHFFFAOYSA-N acetic acid;zinc Chemical compound [Zn].CC(O)=O.CC(O)=O ZOIORXHNWRGPMV-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000002390 adhesive tape Substances 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000013043 chemical agent Substances 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000009749 continuous casting Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000005272 metallurgy Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229940078494 nickel acetate Drugs 0.000 description 1
- QMMRZOWCJAIUJA-UHFFFAOYSA-L nickel dichloride Chemical compound Cl[Ni]Cl QMMRZOWCJAIUJA-UHFFFAOYSA-L 0.000 description 1
- KBJMLQFLOWQJNF-UHFFFAOYSA-N nickel(ii) nitrate Chemical compound [Ni+2].[O-][N+]([O-])=O.[O-][N+]([O-])=O KBJMLQFLOWQJNF-UHFFFAOYSA-N 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 238000005215 recombination Methods 0.000 description 1
- 230000006798 recombination Effects 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 238000005070 sampling Methods 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
- 230000002195 synergetic effect Effects 0.000 description 1
- 238000009864 tensile test Methods 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- 239000004246 zinc acetate Substances 0.000 description 1
- 239000011592 zinc chloride Substances 0.000 description 1
- 235000005074 zinc chloride Nutrition 0.000 description 1
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
- B32B15/012—Layered products comprising a layer of metal all layers being exclusively metallic one layer being formed of an iron alloy or steel, another layer being formed of aluminium or an aluminium alloy
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/06—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/0012—Mechanical treatment, e.g. roughening, deforming, stretching
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/16—Drying; Softening; Cleaning
- B32B38/162—Cleaning
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2255/00—Coating on the layer surface
- B32B2255/06—Coating on the layer surface on metal layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2255/00—Coating on the layer surface
- B32B2255/20—Inorganic coating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2255/00—Coating on the layer surface
- B32B2255/26—Polymeric coating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/50—Properties of the layers or laminate having particular mechanical properties
- B32B2307/554—Wear resistance
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/70—Other properties
- B32B2307/714—Inert, i.e. inert to chemical degradation, corrosion
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Fluid Mechanics (AREA)
- Laminated Bodies (AREA)
Abstract
The invention provides an aluminum-based bimetal composite plate and a preparation method thereof. The aluminum-based bimetal composite board consists of a copper layer, an intermediate layer and an aluminum layer which are sequentially connected, wherein the surface of the aluminum layer is provided with a corrosion-resistant protective layer. The preparation method of the aluminum-based bimetal composite plate comprises the following steps: s1, plating the raw material of the copper layer to obtain a first composite board with a plating surface; s2, under a protective atmosphere, after the raw material of the aluminum layer is attached to the coating surface, hot rolling and compounding are carried out to obtain a second composite board; s3, carrying out heat treatment on the second composite board under a protective atmosphere to obtain a third composite board, wherein the third composite board is provided with a copper layer outer surface and an aluminum layer outer surface; and S4, spraying the outer surface of the aluminum layer to form the corrosion-resistant protective layer, so as to obtain the aluminum-based bimetal composite board.
Description
Technical Field
The invention belongs to the technical field of metal composite plates, and particularly relates to an aluminum-based bimetal composite plate and a preparation method thereof.
Background
The composite material formed by combining two or more than two materials has physical, chemical, mechanical properties and price different from those of a single material, has the advantages which are not possessed by a plurality of single materials, and can be widely applied to various fields. The aluminum-based composite board is a common layered composite material, particularly a composite board formed by aluminum and copper, has the advantages of good electric conductivity and heat conductivity and attractive appearance of copper, light weight, corrosion resistance, low price and the like of aluminum, and is favored by the fields of electronics, electric power, electric appliances, metallurgy, machinery, automobiles, articles for daily use and the like.
The common preparation methods of the metal composite plate include a rolling composite method and a continuous casting composite method. The action mechanism of rolling compounding is as follows: when two or more layers of metal with clean surfaces are subjected to strong pressure of a rolling mill, the surface metal layer can crack, the inner layer of the metal layer is clean and activated, and the metal layer is exposed and forms planar primary combination under the action of the strong pressure; in the subsequent heat treatment process, metallurgical bonding is realized among atoms through diffusion, and the bonding surface is continuously enlarged, so that the composite material with stable bonding is formed. The rolling composite method is suitable for producing metal composite plates because of the advantages of high production efficiency, wide processing range and the like.
The aluminum-based composite board industrially prepared at present has a single structure; the corrosion resistance is required to be further improved so as to adapt to the application in different fields; meanwhile, the bonding strength between the composite boards is also to be improved.
Disclosure of Invention
The present invention is directed to solving at least one of the above problems in the prior art. Therefore, the invention provides an aluminum-based bimetal composite plate.
The invention also provides a preparation method of the aluminum-based bimetal composite plate.
The utility model provides an aluminium base bimetal composite board, comprises copper layer, intermediate level, the aluminium lamination that links to each other in proper order, keep away from on the aluminium lamination the one side in intermediate level is provided with corrosion-resistant protective layer.
According to an embodiment of the present invention, the thickness of the copper layer is 0.2 to 3 mm.
According to an embodiment of the present invention, the thickness of the intermediate layer is 4 to 8 μm.
According to an embodiment of the present invention, the thickness of the aluminum layer is 0.2 to 3 mm.
According to an embodiment of the present invention, the intermediate layer is a metal layer, and the material of the intermediate layer is one of zinc, nickel and silver.
The intermediate layer functions to increase the bonding strength between the copper layer and the aluminum layer.
A preparation method of an aluminum-based bimetal composite plate comprises the following steps:
s1, plating the raw material of the copper layer to obtain a first composite board with a plating surface;
s2, under a protective atmosphere, after the raw material of the aluminum layer is attached to the plating surface, hot rolling and compounding are carried out to obtain a second composite board;
s3, carrying out heat treatment on the second composite board under a protective atmosphere to obtain a third composite board, wherein the third composite board is provided with a copper layer outer surface and an aluminum layer outer surface;
and S4, spraying the outer surface of the aluminum layer to form the corrosion-resistant protective layer, so as to obtain the aluminum-based bimetal composite board.
According to one embodiment of the invention, the raw material of the copper layer is a copper substrate/tape.
According to one embodiment of the invention, the raw material of the aluminium layer is an aluminium substrate/strip.
According to one embodiment of the present invention, the plating is performed by using zinc, nickel or silver as an anode and using an aqueous solution of the corresponding zinc salt, nickel salt or silver salt as a plating solution.
According to one embodiment of the invention, the zinc, nickel or silver metal is > 99% pure.
According to an embodiment of the present invention, the zinc salt is one of zinc sulfate, zinc nitrate, zinc chloride, and zinc acetate.
According to an embodiment of the present invention, the nickel salt is one of nickel sulfate, nickel nitrate, nickel acetate, and nickel chloride.
According to one embodiment of the invention, the silver salt is silver nitrate.
Because the oxide film of metal zinc is fragile, and ductility is poor than copper, therefore metal zinc coating is favorable to aluminium and copper direct recombination, promotes aluminium base bimetal composite sheet's bonding strength, and low price.
The silver coating can improve the conductivity of the aluminum-based bimetal composite plate because the silver has excellent conductivity.
Because the ductility of silver is better, when the intermediate level material is silver, need promote copper raw and other materials and/or aluminium raw and other materials roughness to promote aluminium base bimetal composite panel's bonding strength.
When the intermediate layer is made of metallic nickel, the comprehensive performance of the aluminum-based bimetal composite board can be improved, and the aluminum-based bimetal composite board has better bonding strength, mechanical property and processing property.
According to an embodiment of the present invention, the method further includes performing a surface treatment on the aluminum substrate/strip before step S2.
According to one embodiment of the present invention, the surface treatment includes oil removal, oxide layer removal and mechanical polishing.
According to one embodiment of the present invention, the oil removing operation is: and cleaning the surface of the aluminum layer raw material by using acetone.
According to one embodiment of the invention, the purpose of the oil removal is: removing organic impurities on the surface of the aluminum layer raw material.
According to one embodiment of the invention, the operation of removing the oxide layer is: the surface of the aluminum layer raw material was cleaned with a 1M aqueous solution of sodium hydroxide.
According to one embodiment of the present invention, the purpose of the oxide removal layer is: and removing the aluminum oxide film on the surface of the aluminum layer raw material to obtain a clean surface and improve the hot rolling composite effect.
According to one embodiment of the invention, the purpose of the mechanical grinding process is: the roughness of the surface of the aluminum layer raw material is 45-55 mu m, and the hot rolling composite effect is improved.
According to an embodiment of the present invention, the method further includes, before the step S2, preheating the first composite sheet and the surface-treated aluminum layer raw material after the surface treatment.
According to one embodiment of the invention, the preheating is carried out under a protective gas at a preheating temperature of 350 ℃.
According to one embodiment of the present invention, the number of hot rolling passes in the hot rolling pass of step S2 is 1 to 3.
According to an embodiment of the present invention, in the hot rolling and hot rolling composition of step S2, the single rolling reduction is 50 to 70%.
According to one embodiment of the present invention, the hot rolling and hot rolling in step S2 are carried out at a rolling temperature of 330 to 370 ℃.
According to one embodiment of the present invention, the hot rolling and hot rolling in step S2 are performed at a working speed of 6 to 10 m/min.
According to an embodiment of the present invention, the heat treatment in step S3 is performed at 350-450 ℃ for 3-8 hours.
According to an embodiment of the present invention, the heat treatment of step S3 is to eliminate the internal stress accumulated in step S2.
According to an embodiment of the present invention, the heat treatment in step S3 may further increase mutual diffusion of atoms in the copper layer, the aluminum layer, and the intermediate layer, so as to improve the bonding strength of the aluminum-based bimetal composite plate.
According to one embodiment of the present invention, the heat treatment in step S3 may cause a large amount of precipitation of metal mesophase and decrease the workability such as bending property of the material when the temperature is more than 450 ℃ and the time is more than 8 hours.
According to an embodiment of the present invention, the heat treatment of step S3 can obtain Cu9Al4、Cu4Al、Cu3Al2And CuAl2And (4) equaling the interface phase.
According to an embodiment of the present invention, the corrosion-resistant protective layer in step S4 is made of one of tungsten carbide and teflon coating.
According to an embodiment of the present invention, the thickness of the corrosion-resistant protective layer in step S4 is 0.1-0.3 mm.
According to one embodiment of the invention, the polytetrafluoroethylene can resist a high temperature of 250 ℃, can resist strong acid, strong alkali, water and various organic solvents, and has good corrosion resistance.
According to one embodiment of the present invention, the tungsten carbide is inert to common chemical agents such as water, sulfuric acid, hydrochloric acid, etc., and has excellent wear resistance and corrosion resistance.
According to one embodiment of the present invention, the protective atmosphere is one or more of nitrogen and inert gas.
Compared with the prior art, the invention has at least the following beneficial effects:
(1) according to the invention, the metal intermediate layer is introduced into the aluminum-based bimetal composite plate, so that the comprehensive performance of the aluminum-based bimetal composite plate can be improved: firstly, the bonding strength of the composite board can be improved by the three metal intermediate layers; in addition, when the metal zinc is used as the intermediate layer, the cost can be reduced at the same time; when silver and nickel are used as the intermediate layer, the processing performance of the composite board can be improved;
(2) in the preparation method of the aluminum-based bimetal composite plate, the introduction of the metal intermediate layer and the heat treatment generate a synergistic effect, so that the bonding strength of the aluminum-based bimetal composite plate is up to 30N/mm;
(3) the invention carries out anti-corrosion coating treatment on the surface of the aluminum layer, so that the aluminum-based bimetal composite board has excellent wear resistance and corrosion resistance, and the application field is expanded;
(4) the preparation method of the aluminum-based bimetal composite plate is simple and has wide application range.
Drawings
Fig. 1 is a schematic structural view of the aluminum-based bimetal composite plate obtained in example 1.
Description of the figure numbers:
1. a copper layer; 2. an intermediate layer; 3. an aluminum layer; 4. and (4) a corrosion-resistant protective layer.
Detailed Description
The following are specific examples of the present invention, and the technical solutions of the present invention will be further described with reference to the examples, but the present invention is not limited to the examples.
Example 1
The embodiment prepares the aluminum-based bimetal composite plate, and the specific preparation method comprises the following steps:
s1, preparing 2M zinc sulfate aqueous solution, and adjusting the pH value to 6 by concentrated sulfuric acid to obtain the electroplating solution.
S2, using metal zinc with the purity of more than 99.9 percent as an anode and an oxygen-free copper plate with the thickness of 5mm as a cathode, and electroplating the oxygen-free copper in the electroplating solution obtained in the step S1 to obtain a first composite plate with a zinc coating of 8 mu m.
S3, sequentially washing an aluminum strip with the thickness of 2mm by using acetone and 1M of sodium hydroxide aqueous solution to remove oil stains and oxide layers on the surface; and mechanically ground to obtain an aluminum strip having a surface roughness of about 50 μm.
S4, respectively carrying out preheating treatment on the aluminum strip obtained in the step S3 and the first composite board obtained in the step S2 under the protection of nitrogen, wherein the preheating temperature is 350 ℃.
S5, under the protection of nitrogen, attaching the preheated aluminum strip to the zinc coating of the first composite plate, and then carrying out hot rolling to obtain a second composite plate; wherein the rolling temperature is 370 ℃, the rolling speed is 8m/min, the rolling times are 2 times, and the single rolling reduction is 50%.
S6, carrying out heat treatment on the second composite board under a protective atmosphere to obtain a third composite board with an aluminum surface and a copper surface; wherein the temperature of the heat treatment is 400 ℃ and the time is 6 h.
And S7, carrying out polytetrafluoroethylene spraying on the aluminum surface of the third composite plate, wherein the spraying thickness is 0.1mm, and thus obtaining the aluminum-based bimetal composite plate.
The schematic structure of the aluminum-based bimetal composite plate obtained in this example is shown in fig. 1, 1 is a copper layer, 2 is an intermediate layer, 3 is an aluminum layer, and 4 is a corrosion-resistant protective layer.
Example 2
The embodiment prepares the aluminum-based bimetal composite plate, and the specific preparation method is different from the embodiment 1 in that:
s1, preparing a 2M nickel sulfate aqueous solution, and adjusting the pH value of the nickel sulfate aqueous solution to 6 by using concentrated sulfuric acid to obtain the electroplating solution.
S2, using metal nickel with the purity of more than 99.9 percent as an anode, and using oxygen-free copper with the thickness of 3mm as a cathode, and electroplating the oxygen-free copper in the electroplating solution obtained in the step S1 to obtain a first composite plate with a nickel coating of 5 mu m.
Example 3
The embodiment prepares the aluminum-based bimetal composite plate, and the specific preparation method is different from the embodiment 1 in that:
s1, preparing a 2M silver nitrate aqueous solution, and adjusting the pH value of the silver nitrate aqueous solution to 4 by using concentrated nitric acid to obtain the electroplating solution.
S2, using metal silver with the purity of more than 99.9 percent as an anode, and using oxygen-free copper with the thickness of 3mm as a cathode, and electroplating the oxygen-free copper in the electroplating solution obtained in the step S1 to obtain a first composite plate with a silver coating of 5 mu m.
Comparative example 1
The embodiment provides a comparative aluminum-based bimetallic composite plate, and the specific preparation method is different from that of the embodiment 1 in that:
and step S1-S2 is not carried out, namely, the oxygen-free copper strip is not electroplated.
Test example
The test examples tested the aluminum-based bimetallic composite panels obtained in examples 1-3 and comparative example 1. The specific test content and test method are as follows:
and (3) testing the bonding strength: the aluminum-based bimetal composite plates obtained in examples 1 to 3 and comparative example 1 are peeled by a method disclosed in the national standard document 'test method for peeling strength of adhesive tape' with the number of GB/T2792-2014, so as to test the bonding strength of the sample. The sampling direction of the peeling test was the rolling direction, and the peeled sample was peeled at 90 ° on a BLD-200N electron peeling tester. The test results are shown in table 1.
Table 1 bond strength results for aluminum-based bimetallic composite panels.
| Group of | Example 1 | Example 2 | Example 3 | Comparative example 1 |
| Bonding Strength (N/mm) | 30 | 26 | 24 | 18 |
The results shown in table 1 show that the bonding strength of the aluminum-based bimetal composite plate is effectively improved by introducing the metal intermediate layer between the copper layer and the aluminum layer.
Tensile property: the tensile properties of the aluminum-based bimetal composite plates obtained in examples 1-3 and comparative example 1 are tested by a method disclosed in a national standard document 'metallic material tensile test room temperature test method' with the number of GB/T228-. The test results are shown in table 2.
Table 2 tensile properties results for aluminum-based bimetallic composite panels.
| Group of | Example 1 | Example 2 | Example 3 | Comparative example 1 |
| Tensile strength (MPa) | 220 | 226 | 231 | 233 |
The results shown in table 2 show that the metal intermediate layer is introduced between the copper layer and the aluminum layer, so that the tensile strength of the aluminum-based bimetal composite plate is not obviously reduced while the bonding strength of the aluminum-based bimetal composite plate is improved, and the good machining performance of the aluminum-based bimetal composite plate is ensured.
Corrosion resistance: the polytetrafluoroethylene coatings of the aluminum-based bimetal composite plates obtained in the embodiments 1 to 3 and the comparative example 1 of the invention are subjected to corrosion resistance test by a method disclosed in a national standard document 'middle salt spray test standard' with the number of GBT 2423.17-93.
The test result shows that: the polytetrafluoroethylene coatings of the aluminum-based bimetal composite plates obtained in the embodiments 1-3 and the comparative example 1 are kept complete, and the phenomena of breakage or peeling are not generated.
The polytetrafluoroethylene coating is firmly combined with the aluminum-based bimetallic composite plate, so that the corrosion resistance of the aluminum-based bimetallic composite plate can be effectively improved.
In conclusion, the aluminum-based bimetal composite board provided by the invention has excellent corrosion resistance, and excellent interlayer bonding strength and tensile strength.
The present invention has been described in detail with reference to the embodiments, but the present invention is not limited to the embodiments described above, and various changes can be made within the knowledge of those skilled in the art without departing from the gist of the present invention.
Claims (10)
1. The aluminum-based bimetal composite board is characterized by comprising a copper layer, an intermediate layer and an aluminum layer which are sequentially connected, wherein a corrosion-resistant protective layer is arranged on one surface of the intermediate layer, which is far away from the aluminum layer.
2. The aluminum-based bimetal composite plate of claim 1, wherein the copper layer has a thickness of 0.2 to 3 mm.
3. The aluminum-based bimetallic composite panel as in claim 1, wherein the intermediate layer has a thickness of 4 to 8 μm.
4. The aluminum-based bimetallic composite panel as in claim 1, wherein the aluminum layer has a thickness of 0.2 to 3 mm.
5. The aluminum-based bimetal composite plate according to claim 1, wherein the intermediate layer is a metal layer made of zinc, nickel or silver.
6. The method for preparing an aluminium-based bimetallic composite panel according to any one of claims 1 to 5, characterized in that it comprises the following steps:
s1, plating the raw material of the copper layer to obtain a first composite board with a plating surface;
s2, under a protective atmosphere, after the raw material of the aluminum layer is attached to the plating surface, hot rolling and compounding are carried out to obtain a second composite board;
s3, carrying out heat treatment on the second composite board under a protective atmosphere to obtain a third composite board, wherein the third composite board is provided with a copper layer outer surface and an aluminum layer outer surface;
and S4, spraying the outer surface of the aluminum layer to form the corrosion-resistant protective layer, so as to obtain the aluminum-based bimetal composite board.
7. The production method according to claim 6, wherein in step S2, the number of hot-rolling passes is 1 to 3.
8. The method according to claim 6, wherein in step S2, the hot rolling composite has a single pass reduction of 50 to 70%.
9. The method according to claim 6, wherein the hot rolling temperature of the hot rolling composite in step S2 is 330-370 ℃.
10. The method according to claim 6, wherein in step S3, the heat treatment temperature is 350-450 ℃ and the time is 3-8 h.
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