CN112428055A - Polishing and grinding equipment for monocrystalline silicon production and manufacturing and use method thereof - Google Patents
Polishing and grinding equipment for monocrystalline silicon production and manufacturing and use method thereof Download PDFInfo
- Publication number
- CN112428055A CN112428055A CN202011290028.5A CN202011290028A CN112428055A CN 112428055 A CN112428055 A CN 112428055A CN 202011290028 A CN202011290028 A CN 202011290028A CN 112428055 A CN112428055 A CN 112428055A
- Authority
- CN
- China
- Prior art keywords
- monocrystalline silicon
- polishing
- grinding
- protective box
- water
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
- B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
- B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
- B24B55/04—Protective covers for the grinding wheel
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
- B24B55/06—Dust extraction equipment on grinding or polishing machines
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
The invention discloses polishing and grinding equipment for monocrystalline silicon production and manufacturing and a using method thereof, and the equipment comprises a monocrystalline silicon polishing machine body, wherein the top of the monocrystalline silicon polishing machine body is provided with a cylinder, the middle part of the monocrystalline silicon polishing machine body is provided with a workbench, the top end of the workbench is fixedly provided with a protective box, and the output end of the cylinder extends to the inner end of the protective box and is fixedly provided with a grinding mechanism; the invention has the beneficial effects that: according to the polishing and grinding equipment for monocrystalline silicon production and manufacturing, the grinding process is carried out in the protective box through the protective box, monocrystalline silicon dust generated during grinding is effectively prevented from floating out, the water dripping head capable of being adjusted randomly is arranged at the inner end of the protective box, and water dripped by the water dripping head can be uniformly dripped on the surface of a monocrystalline silicon wafer, so that the monocrystalline silicon dust generated during grinding is cleaned and discharged through the water drainage pipe, the quantity of silicon dust in a working environment is effectively reduced, and the working environment is improved.
Description
Technical Field
The invention relates to equipment for monocrystalline silicon production and manufacturing, in particular to polishing and grinding equipment for monocrystalline silicon production and manufacturing and a using method thereof.
Background
The silicon single crystal is a form of the silicon single crystal, when the melted silicon single crystal is solidified, silicon atoms are arranged into a plurality of crystal nuclei in a diamond lattice mode, if the crystal nuclei grow into crystal grains with the same crystal face orientation, the crystal grains are combined in parallel to crystallize into the silicon single crystal, the polishing and grinding equipment for producing the silicon single crystal is equipment for grinding a silicon single crystal wafer, the common polishing and grinding equipment for producing the silicon single crystal is usually used for directly grinding in a working environment, silicon dust generated during grinding is easy to float in the air, the dust is easy to be inhaled by workers to cause diseases such as silicosis and the like, and certain potential safety hazards exist.
Disclosure of Invention
The invention aims to provide polishing and grinding equipment for monocrystalline silicon production and manufacturing and a using method thereof, and aims to solve the problem that silicon dust generated by polishing and grinding equipment for monocrystalline silicon production and manufacturing in the background art is easily sucked into a human body by workers.
In order to achieve the purpose, the invention provides the following technical scheme: the utility model provides a monocrystalline silicon manufacturing is with polishing equipment of polishing, includes monocrystalline silicon burnishing machine body, the top of monocrystalline silicon burnishing machine body is provided with the cylinder, the middle part of monocrystalline silicon burnishing machine body is provided with the workstation, the top fixed mounting of workstation has the protective housing, the output of cylinder extends to the inner fixed mounting of protective housing has grinding machanism, the top fixed mounting of protective housing outer wall has the inlet tube, the one end of inlet tube extends to the inner fixed mounting of protective housing has the connecting pipe, the one end fixedly connected with universal pipe of connecting pipe, the bottom fixed mounting of universal pipe has the head of dripping, the bottom of protective housing outer wall is provided with the drain pipe.
As a preferable technical scheme of the invention, a box door is rotatably arranged at the opening of the protective box.
As a preferable technical scheme of the invention, the inner end of the box door is fixedly provided with an observation window.
As a preferable technical scheme of the invention, the polishing mechanism comprises an installation seat, the top end of the installation seat is fixedly connected with the output end of the air cylinder, the bottom of the inner end of the installation seat is fixedly provided with a motor, the output end of the motor is fixedly provided with a fixed seat, and the bottom end of the fixed seat is fixedly provided with a grinding disc.
As a preferable technical scheme of the invention, the bottom of the inner end of the water dripping head is provided with a plurality of sub-runners.
As a preferred technical scheme of the invention, the inner cavities of the water inlet pipe, the connecting pipe, the universal pipe and the water dripping head are communicated.
As a preferable technical scheme of the invention, one end of the drain pipe extends to the bottom of the inner cavity of the protective box.
The invention relates to polishing and grinding equipment for monocrystalline silicon production and manufacturing, which comprises the following steps:
s1: opening a box door to fix the monocrystalline silicon piece in the protective box, and controlling the output end of the air cylinder to extend out to enable the grinding piece to be in contact with the monocrystalline silicon piece after the box door is closed;
s2: then, the motor can be started to polish, and the output end of the motor can drive the grinding plate to rotate through the fixed seat, so that the monocrystalline silicon wafer is polished;
s3: through inlet tube injected water, water drips from the water dropper through connecting pipe and universal pipe, and the bottom of water dropper inner is provided with a plurality of subchannel, makes the even drippage of water on monocrystalline silicon piece's surface, clears up the monocrystalline silicon dust that produces when will polishing, discharges through the drain pipe at last.
Compared with the prior art, the invention has the beneficial effects that: according to the polishing and grinding equipment for monocrystalline silicon production and manufacturing, the grinding process is carried out in the protective box through the protective box, monocrystalline silicon dust generated during grinding is effectively prevented from floating out, the water dripping head capable of being adjusted randomly is arranged at the inner end of the protective box, and water dripped by the water dripping head can be uniformly dripped on the surface of a monocrystalline silicon wafer, so that the monocrystalline silicon dust generated during grinding is cleaned and discharged through the water drainage pipe, the quantity of silicon dust in a working environment is effectively reduced, and the working environment is improved.
Drawings
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is a schematic cross-sectional view of the protective case of the present invention;
fig. 3 is an enlarged schematic view of a portion a of fig. 2.
In the figure: 1. a monocrystalline silicon polishing machine body; 2. a cylinder; 3. a work table; 4. a protective box; 5. a polishing mechanism; 51. a mounting seat; 52. a motor; 53. a fixed seat; 54. grinding; 6. a water inlet pipe; 7. a connecting pipe; 8. a universal tube; 9. a water dripping head; 901. a shunt channel; 10. a drain pipe; 11. a box door; 12. and (4) an observation window.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1-3, the invention provides a polishing and grinding device for monocrystalline silicon production and manufacturing, comprising a monocrystalline silicon polishing machine body 1, a cylinder 2 is arranged on the top of the monocrystalline silicon polishing machine body 1, a worktable 3 is arranged in the middle of the monocrystalline silicon polishing machine body 1, a protective box 4 is fixedly arranged on the top end of the worktable 3, the protective box 4 is cylindrical, a grinding mechanism 5 is fixedly arranged at the output end of the cylinder 2 and extends to the inner end of the protective box 4, the grinding mechanism 5 is used for grinding and polishing monocrystalline silicon wafers, a water inlet pipe 6 is fixedly arranged on the top of the outer wall of the protective box 4, a connecting pipe 7 is fixedly arranged at one end of the water inlet pipe 6 and extends to the inner end of the protective box 4, a universal pipe 8 is fixedly connected with one end of the connecting pipe 7, a water dripping head 9 is fixedly arranged at the bottom end of the universal pipe 8, water can drip onto the monocrystalline, the position and the direction of the water dripping head 9 can be adjusted at will through the universal pipe 8, the bottom of the outer wall of the protective box 4 is provided with a drain pipe 10, and waste water in the protective box 4 can be discharged through the drain pipe 10.
Preferably, the box door 11 is rotatably installed at an opening of the protection box 4, loading and unloading can be performed by opening the box door 11, an observation window 12 is fixedly installed at the inner end of the box door 11, polishing conditions in the protection box 4 can be observed through the observation window 12, the polishing mechanism 5 comprises an installation seat 51, the top end of the installation seat 51 is fixedly connected with the output end of the air cylinder 2, a motor 52 is fixedly installed at the bottom of the inner end of the installation seat 51, a fixed seat 53 is fixedly installed at the output end of the motor 52, the fixed seat 53 is used for installing a polishing disc 54, the bottom end of the fixed seat 53 is fixedly installed with the polishing disc 54, the output end of the motor 52 can drive the polishing disc 54 to rotate through the fixed seat 53, so as to polish the monocrystalline silicon wafer, a plurality of sub-channels 901 are arranged at the bottom of the inner end of the water dripping head 9, so, one end of the drain pipe 10 extends to the bottom of the inner cavity of the protection box 4 so that the waste water in the protection box 4 can be discharged.
The invention relates to polishing and grinding equipment for monocrystalline silicon production and manufacturing, which comprises the following steps:
s1: opening the box door 11 to fix the monocrystalline silicon piece in the protective box 4, and controlling the output end of the cylinder 2 to extend to enable the grinding piece 54 to be in contact with the monocrystalline silicon piece after the box door 11 is closed;
s2: then, the motor 52 can be started to polish, and the output end of the motor 52 can drive the grinding plate 54 to rotate through the fixed seat 53, so that the monocrystalline silicon wafer is polished;
s3: through the injection water of inlet tube 6, water drips from the head of dripping 9 through connecting pipe 7 and universal pipe 8, and the bottom that the head of dripping 9 is inner is provided with a plurality of subchannel 901, makes the even drippage of water on monocrystalline silicon piece's surface, clears up the monocrystalline silicon dust that produces when will polishing, discharges through drain pipe 10 at last.
In the description of the present invention, it is to be understood that the indicated orientations or positional relationships are based on the orientations or positional relationships shown in the drawings and are only for convenience in describing the present invention and simplifying the description, but are not intended to indicate or imply that the indicated devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and are not to be construed as limiting the present invention.
In the present invention, unless otherwise explicitly specified or limited, for example, it may be fixedly attached, detachably attached, or integrated; can be mechanically or electrically connected; the terms may be directly connected or indirectly connected through an intermediate, and may be communication between two elements or interaction relationship between two elements, unless otherwise specifically limited, and the specific meaning of the terms in the present invention will be understood by those skilled in the art according to specific situations.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (8)
1. A polishing and grinding device for monocrystalline silicon production and manufacture comprises a monocrystalline silicon polishing machine body (1), it is characterized in that the top of the monocrystalline silicon polishing machine body (1) is provided with a cylinder (2), the middle part of the monocrystalline silicon polishing machine body (1) is provided with a workbench (3), the top end of the workbench (3) is fixedly provided with a protective box (4), the output end of the cylinder (2) extends to the inner end of the protective box (4) and is fixedly provided with a polishing mechanism (5), a water inlet pipe (6) is fixedly arranged at the top of the outer wall of the protective box (4), one end of the water inlet pipe (6) extends to the inner end of the protective box (4) and is fixedly provided with a connecting pipe (7), the one end fixedly connected with universal pipe (8) of connecting pipe (7), the bottom fixed mounting of universal pipe (8) has water dripping head (9), the bottom of protective housing (4) outer wall is provided with drain pipe (10).
2. The polishing and grinding apparatus for manufacturing single crystal silicon as claimed in claim 1, wherein: and a box door (11) is rotatably arranged at the opening of the protective box (4).
3. The polishing and grinding apparatus for manufacturing single crystal silicon as claimed in claim 2, wherein: an observation window (12) is fixedly arranged at the inner end of the box door (11).
4. The polishing and grinding apparatus for manufacturing single crystal silicon as claimed in claim 2, wherein: grinding machanism (5) are including mount pad (51), the top of mount pad (51) and the output fixed connection of cylinder (2), the bottom fixed mounting of mount pad (51) inner has motor (52), the output fixed mounting of motor (52) has fixing base (53), the bottom fixed mounting of fixing base (53) has abrasive disc (54).
5. The polishing and grinding device for manufacturing single crystal silicon as claimed in claim 4, wherein: the bottom of the inner end of the dripping head (9) is provided with a plurality of sub-runners (901).
6. The polishing and grinding device for manufacturing single crystal silicon as claimed in claim 5, wherein: the inner cavities of the water inlet pipe (6), the connecting pipe (7), the universal pipe (8) and the water dripping head (9) are communicated.
7. The polishing and grinding apparatus for manufacturing single-crystal silicon as claimed in claim 6, wherein: one end of the drain pipe (10) extends to the bottom of the inner cavity of the protective box (4).
8. The use method of the polishing and grinding device for manufacturing single crystal silicon as claimed in claim 7, wherein: the method comprises the following steps:
s1: the box door (11) is opened to fix the monocrystalline silicon piece in the protective box (4), and the output end of the cylinder (2) is controlled to extend out to enable the grinding piece (54) to be in contact with the monocrystalline silicon piece after the box door (11) is closed;
s2: then, a motor (52) can be started to polish, and the output end of the motor (52) can drive a grinding plate (54) to rotate through a fixed seat (53), so that the monocrystalline silicon wafer is polished;
s3: through inlet tube (6) injected water, water drips from water dripping head (9) through connecting pipe (7) and universal pipe (8), and the bottom of water dripping head (9) inner is provided with a plurality of subchannel (901), makes the even drippage of water on monocrystalline silicon piece's surface, clears up the monocrystalline silicon dust that produces when will polish, discharges through drain pipe (10) at last.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011290028.5A CN112428055A (en) | 2020-11-18 | 2020-11-18 | Polishing and grinding equipment for monocrystalline silicon production and manufacturing and use method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011290028.5A CN112428055A (en) | 2020-11-18 | 2020-11-18 | Polishing and grinding equipment for monocrystalline silicon production and manufacturing and use method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112428055A true CN112428055A (en) | 2021-03-02 |
Family
ID=74692812
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011290028.5A Pending CN112428055A (en) | 2020-11-18 | 2020-11-18 | Polishing and grinding equipment for monocrystalline silicon production and manufacturing and use method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112428055A (en) |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20150158137A1 (en) * | 2013-12-10 | 2015-06-11 | Disco Corporation | Grinding apparatus |
| CN206811650U (en) * | 2017-06-06 | 2017-12-29 | 何芬丽 | A kind of sheet material grinding apparatus |
| CN209190485U (en) * | 2018-12-24 | 2019-08-02 | 新余市唐窑建材有限公司 | A kind of production polished bricks surface grinding device |
| CN209851322U (en) * | 2018-10-22 | 2019-12-27 | 安徽康盛非金属材料有限公司 | Nonmetal ore grinding and cutting device |
| CN210024780U (en) * | 2019-06-02 | 2020-02-07 | 苏州龙影丹熙精密五金有限公司 | Polishing equipment for hardware connecting piece production |
| CN210099656U (en) * | 2019-06-10 | 2020-02-21 | 广东启现智能家具有限公司 | Novel stone material burnishing and polishing machine |
| CN110977653A (en) * | 2019-12-23 | 2020-04-10 | 泉州圆创机械技术开发有限公司 | Wafer planarization equipment |
| CN210938552U (en) * | 2019-11-03 | 2020-07-07 | 江苏众象雕塑艺术工程有限公司 | Sculpture is with grinding device with retrieve mechanism |
-
2020
- 2020-11-18 CN CN202011290028.5A patent/CN112428055A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20150158137A1 (en) * | 2013-12-10 | 2015-06-11 | Disco Corporation | Grinding apparatus |
| CN206811650U (en) * | 2017-06-06 | 2017-12-29 | 何芬丽 | A kind of sheet material grinding apparatus |
| CN209851322U (en) * | 2018-10-22 | 2019-12-27 | 安徽康盛非金属材料有限公司 | Nonmetal ore grinding and cutting device |
| CN209190485U (en) * | 2018-12-24 | 2019-08-02 | 新余市唐窑建材有限公司 | A kind of production polished bricks surface grinding device |
| CN210024780U (en) * | 2019-06-02 | 2020-02-07 | 苏州龙影丹熙精密五金有限公司 | Polishing equipment for hardware connecting piece production |
| CN210099656U (en) * | 2019-06-10 | 2020-02-21 | 广东启现智能家具有限公司 | Novel stone material burnishing and polishing machine |
| CN210938552U (en) * | 2019-11-03 | 2020-07-07 | 江苏众象雕塑艺术工程有限公司 | Sculpture is with grinding device with retrieve mechanism |
| CN110977653A (en) * | 2019-12-23 | 2020-04-10 | 泉州圆创机械技术开发有限公司 | Wafer planarization equipment |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN110125753A (en) | A kind of light wear-resistant steel casting edging device and its edging method | |
| CN106378671B (en) | A kind of reduction process of large-sized CdS single-chips | |
| US20120252212A1 (en) | Processing method for wafer having embedded electrodes | |
| CN218169775U (en) | Device for processing surface of silicon carbide wafer | |
| CN113103138A (en) | Semiconductor wafer processing pretreatment equipment | |
| CN211163353U (en) | Wafer grinding device with cleaning function | |
| CN112428055A (en) | Polishing and grinding equipment for monocrystalline silicon production and manufacturing and use method thereof | |
| JP4076416B2 (en) | Quartz crucible and its manufacturing method | |
| CN116728625A (en) | Semiconductor wafer dicing machine | |
| CN218891709U (en) | Cooling chip collecting device of spring grinding device | |
| CN218746735U (en) | Edge grinding device for producing silicon wafers | |
| CN115229672A (en) | Multifunctional grinding pad adjuster and chemical mechanical polishing equipment | |
| CN220762157U (en) | Fixed grinding device of machine part | |
| CN217572217U (en) | Corner polishing equipment for semiconductor silicon wafer production | |
| JP5389433B2 (en) | Grinding wheel | |
| CN220362357U (en) | Fine trimming device for artificial quartz stone | |
| CN215239754U (en) | Outer circle small grinding machine for producing rubber ring frame | |
| CN221560929U (en) | Polishing clamp for preventing silicon wafer from edge breakage and metal pollution in polishing process | |
| CN221088456U (en) | Quartz crucible surface polishing equipment | |
| CN217291906U (en) | Wafer polishing machine capable of reducing temperature | |
| CN220575549U (en) | Numerical control silicon wafer polishing machine | |
| CN218592645U (en) | Polishing deburring equipment of machine parts production usefulness | |
| CN220217879U (en) | Coping equipment | |
| CN220761962U (en) | Slurry pump accessory cleaning device that polishes | |
| CN215700623U (en) | Be applied to valve surface's multi-angle grinding device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20210302 |