CN112420319A - Three-dimensional suspended inductor and manufacturing method thereof - Google Patents
Three-dimensional suspended inductor and manufacturing method thereof Download PDFInfo
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- CN112420319A CN112420319A CN202011244459.8A CN202011244459A CN112420319A CN 112420319 A CN112420319 A CN 112420319A CN 202011244459 A CN202011244459 A CN 202011244459A CN 112420319 A CN112420319 A CN 112420319A
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 20
- 239000000919 ceramic Substances 0.000 claims abstract description 85
- 239000004020 conductor Substances 0.000 claims abstract description 32
- 239000000758 substrate Substances 0.000 claims abstract description 12
- 239000000463 material Substances 0.000 claims description 12
- 229920002120 photoresistant polymer Polymers 0.000 claims description 5
- 238000000034 method Methods 0.000 claims description 3
- 239000002245 particle Substances 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 238000005530 etching Methods 0.000 claims description 2
- 238000007731 hot pressing Methods 0.000 claims description 2
- 239000011800 void material Substances 0.000 claims description 2
- 238000005516 engineering process Methods 0.000 description 14
- 238000012986 modification Methods 0.000 description 4
- 230000004048 modification Effects 0.000 description 4
- 230000014509 gene expression Effects 0.000 description 3
- 239000011162 core material Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 238000004220 aggregation Methods 0.000 description 1
- 230000002776 aggregation Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000001939 inductive effect Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 230000008093 supporting effect Effects 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
- H01F17/0033—Printed inductances with the coil helically wound around a magnetic core
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
- H01F17/0013—Printed inductances with stacked layers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/2804—Printed windings
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
- H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
- H01F41/041—Printed circuit coils
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
- H01F17/0013—Printed inductances with stacked layers
- H01F2017/002—Details of via holes for interconnecting the layers
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Abstract
The invention provides a three-dimensional suspended inductor and a manufacturing method thereof. The inductor of the invention forms the spiral inductance channel in the multilayer substrate, and then fills the conductive material to be integrally formed, and each part of the conductive material has no connection point and has uniform thickness. The gas outlet is arranged in the first ceramic substrate, so that the conductive material can be conveniently filled, and the gas outlet filled with the conductive material can be used as an external connection point, so that flexible access of different inductors is realized. Furthermore, the sacrificial plates are arranged on the first ceramic plate and the second ceramic plate to form the three-dimensional suspended inductor, the three-dimensional suspended inductor is convenient and quick, and the first ceramic plate and the second ceramic plate are supported by the aid of the plurality of conductive blind holes.
Description
Technical Field
The invention relates to the field of semiconductor device manufacturing, in particular to a three-dimensional suspended inductor and a manufacturing method thereof.
Background
Inductive passive devices are indispensable functional components in integrated circuits. In the fabrication of semiconductor devices, the three-dimensional inductor is usually fabricated by forming a first portion on a substrate, then forming a second portion, a third portion, and so on (in a build-up manner), and finally combining these portions into a spiral inductor structure. The manufacturing method is complex and high in cost, and current aggregation is generated at the joint positions of a plurality of parts of the spiral inductor, so that the stability of inductance signals is not facilitated.
Disclosure of Invention
Based on solving the above problems, the present invention provides a method for manufacturing a three-dimensional suspended inductor, which comprises the following steps:
(1) providing a first ceramic plate, a sacrificial plate, a second ceramic plate; the upper surface of the first ceramic plate is provided with a plurality of first grooves which are arranged in parallel, and an inlet section and an outlet section which are connected with the plurality of first grooves, and the plurality of first grooves are respectively provided with a first end and a second end; the sacrificial plate is provided with a plurality of first through holes corresponding to the first ends and a plurality of second through holes corresponding to the second ends; the lower surface of the second ceramic plate is provided with a plurality of second grooves which are arranged in parallel, and the plurality of second grooves are respectively provided with a third end and a fourth end, wherein the third end corresponds to the plurality of first through holes, and the fourth end corresponds to the plurality of second through holes;
(2) hot pressing the first ceramic plate, the sacrificial plate, and the second ceramic plate together to form a stacked substrate structure, wherein first ends of the plurality of first grooves communicate with third ends of the plurality of second grooves through the plurality of first through holes, and second ends of the plurality of first grooves communicate with fourth ends of the plurality of second grooves through the plurality of second through holes, such that the plurality of first grooves and the plurality of second grooves and the plurality of first through holes and the plurality of second through holes communicate to form a spiral channel, and head and tail sections of the spiral channel connect the inlet section and the outlet section, respectively;
(3) filling the spiral channel with a conductive material from the inlet section, wherein the conductive material fills the spiral channel and excess conductive material flows out through the outlet section; forming a spiral inductor structure via curing the conductive material, the spiral inductor structure including a first connection portion at a head end and a second connection portion at a tail end;
(4) forming a plurality of conductive blind holes in the stacked substrate, the plurality of conductive blind holes extending through the first ceramic plate and the sacrificial plate and extending to an upper surface of the second ceramic plate, a first conductive blind hole of the plurality of conductive blind holes electrically connecting the first connection portion, a second conductive blind hole of the plurality of conductive blind holes electrically connecting the second connection portion;
(5) and removing the sacrificial plate to enable the spiral inductance structure to be suspended and exposed at the position of the sacrificial plate, wherein an air gap is formed between the first ceramic plate and the second ceramic plate.
Wherein the material of the sacrificial plate is a photoresist material, and removing the sacrificial plate in step (5) comprises removing the photoresist material with an etching solution.
The first ceramic plate is provided with a plurality of first grooves, and the first ceramic plate is provided with a gas outlet hole inside.
Wherein, in step (3), the gas outlet holes are simultaneously filled with the conductive material, which is exposed at the lower surface of the first ceramic plate.
The number of the conductive blind holes is at least 6, and the plurality of conductive blind holes surround the spiral inductor structure.
The invention also provides a three-dimensional suspended inductor which is formed by the manufacturing method of the three-dimensional suspended inductor, and the manufacturing method specifically comprises the following steps:
a spiral inductor structure including a first connection portion, a second connection portion, a plurality of first horizontal portions, a plurality of second horizontal portions, and a plurality of vertical connection portions connecting the plurality of first horizontal plates and the plurality of second horizontal portions; the first horizontal parts and the second horizontal parts are sequentially connected through the vertical connecting parts to form a spiral structure, and the first connecting parts and the second connecting parts are respectively positioned at two ends of the spiral inductance structure and used as terminals;
a first ceramic plate and a second ceramic plate, the first ceramic plate and the second ceramic plate having a void gap therebetween; the upper surface of the first ceramic plate is provided with a plurality of first grooves which are arranged in parallel, and an inlet section and an outlet section which are connected with the plurality of first grooves, and the plurality of first grooves are respectively provided with a first end and a second end; the lower surface of the second ceramic plate is provided with a plurality of second grooves which are arranged in parallel, the plurality of second grooves are respectively provided with a third end and a fourth end, and the third end and the fourth end correspond to the plurality of vertical connecting parts one to one; wherein the plurality of first horizontal portions are formed in the plurality of first grooves, the plurality of second horizontal portions are formed in the plurality of second grooves, the first connecting portions are formed in the inlet section, the second connecting portions are formed in the outlet section, and the plurality of vertical connecting portions are located in the air gap;
the plurality of conductive blind holes penetrate through the first ceramic plate and extend to the upper surface of the second ceramic plate through the air gap, first conductive blind holes in the plurality of conductive blind holes are electrically connected with the first connecting portion, and second conductive blind holes in the plurality of conductive blind holes are electrically connected with the second connecting portion.
The first ceramic plate is provided with a plurality of first grooves, the first ceramic plate is provided with a plurality of air outlets, the air outlets are communicated with one of the plurality of first grooves and filled with a conductive material, and the conductive material is exposed out of the lower surface of the first ceramic plate.
Wherein the conductive material is conductive ink or a resin material with conductive particles, and the like.
The number of the conductive blind holes is at least 6, and the plurality of conductive blind holes surround the spiral inductor structure.
The conductive blind holes are formed in four corners of the first ceramic plate and the second ceramic plate.
The inductor of the invention forms the spiral inductance channel in the multilayer substrate, and then fills the conductive material to be integrally formed, and each part of the conductive material has no connection point and has uniform thickness. The gas outlet is arranged in the first ceramic substrate, so that the conductive material can be conveniently filled, and the gas outlet filled with the conductive material can be used as an external connection point, so that flexible access of different inductors is realized.
Furthermore, the sacrificial plates are arranged on the first ceramic plate and the second ceramic plate to form the three-dimensional suspended inductor, the three-dimensional suspended inductor is convenient and quick, and the first ceramic plate and the second ceramic plate are supported by the aid of the plurality of conductive blind holes.
Drawings
Fig. 1-7 are schematic flow diagrams of a method of fabricating a three-dimensional flying inductor of the present invention; wherein fig. 5b is a perspective view of the three-dimensional flying inductor in fig. 5a, and fig. 6b is a perspective view of the three-dimensional flying inductor in fig. 6 a.
Detailed Description
The present technology will be described with reference to the accompanying drawings in an embodiment, which relates to a three-dimensional flying inductor and a method of manufacturing the same.
It will be understood that the present technology may be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the technology to those skilled in the art. Indeed, the technology is intended to cover alternatives, modifications and equivalents of these embodiments, which are included within the scope and spirit of the technology as defined by the appended claims. Furthermore, in the following detailed description of the present technology, numerous specific details are set forth in order to provide a thorough understanding of the present technology. It will be apparent, however, to one skilled in the art that the present technology may be practiced without these specific details.
The terms "top" and "bottom", "upper" and "lower" and "vertical" and "horizontal" and their various forms as used herein are for purposes of illustration and description only and are not intended to limit the description of the technology as the referenced items may be interchanged in position and orientation. Also, as used herein, the terms "substantially" and/or "about" mean that the specified dimensions or parameters may vary within acceptable manufacturing tolerances for a given application.
The inductor and the method for manufacturing the same according to the present invention will be described with reference to fig. 1 to 7, and the inductor according to the present invention includes a first ceramic plate 10, a sacrificial plate 17 and a second ceramic plate 20 as shown in fig. 1 to 3, and the first ceramic plate 10 and the second ceramic plate 20 may be conventional heat-dissipating ceramic materials such as alumina ceramic and aluminum nitride ceramic. Wherein the first ceramic plate 10 and the second ceramic plate 20 have the same structure and thickness and are symmetrically disposed with respect to the sacrificial plate 17.
The upper surface of the first ceramic plate 10 has a plurality of first grooves 11 arranged in parallel, and an inlet section 14 and an outlet section 15 connecting the plurality of first grooves 11, the plurality of first grooves 11 having first ends 12 (i.e., head ends) and second ends 13 (i.e., tail ends), respectively. The plurality of first grooves 11 have a non-right angle with a side length direction (first direction) of the first ceramic plate 10, and the plurality of first grooves 11 are uniformly arranged with the same pitch. The first ceramic plate 10 further has an air outlet 16 therein, and the air outlet 16 is communicated with one of the first grooves 11. The air outlet 16 extends through the first ceramic plate 10 and is used to ensure the convenience of subsequent filling with conductive material.
The sacrificial plate 17 has a plurality of first through holes 18 therein corresponding to the first end 12 and a plurality of second through holes 19 therein corresponding to the second end 13. The material of the sacrificial plate 17 may be a photoresist material to facilitate subsequent removal of the sacrificial plate 17.
The lower surface of the second ceramic plate 20 has a plurality of second grooves 21 arranged in parallel, and the plurality of second grooves 21 respectively have a third end 22 (i.e., a head end) and a fourth end 23 (i.e., a tail end), wherein the third end 22 corresponds to the plurality of first through holes 18, and the fourth end 23 corresponds to the plurality of second through holes 19. Wherein, the plurality of first grooves 11 and the plurality of second grooves 22 are arranged crosswise in vertical projection to ensure the formation of the subsequent spiral channel.
Referring to fig. 4, the first ceramic plate 10, the sacrificial plate 17, and the second ceramic plate 20 are hot-pressed together to form a stacked substrate structure. Wherein the first ends 12 of the plurality of first grooves 11 communicate with the third ends 22 of the plurality of second grooves 21 through the plurality of first through holes 18, the second ends 13 of the plurality of first grooves 11 communicate with the fourth ends 23 of the plurality of second grooves 21 through the plurality of second through holes 19, so that the plurality of first grooves 11, the plurality of second grooves 28, the plurality of first through holes and the plurality of second through holes communicate to form a spiral channel, and the head and tail sections of the spiral channel are respectively connected with the inlet section 14 and the outlet section 15.
Next, see fig. 5a and 5b, where fig. 5b is a schematic diagram of a three-dimensional flying inductor structure. The inlet section 14 is filled with an electrically conductive material which fills the spiral channel and excess electrically conductive material flows out through the outlet section 15. During filling, the air outlet holes 16 discharge air from the interior of the spiral channel, so that the filling is complete. And then heating and curing the conductive material to form a spiral inductor structure, wherein the spiral inductor structure is formed in a conformal manner with the spiral channel. The spiral inductor structure includes a plurality of first horizontal portions 31, a plurality of second horizontal portions 33, and a vertical connection portion 32 connecting the plurality of first horizontal plates 31 and the plurality of second horizontal portions 33. The spiral inductor structure includes a first connection portion 34 at the head end and a second connection portion 35 at the tail end at both ends. Wherein the magnetic core material 23 extends along the axis of the spiral inductor structure.
Wherein the gas outlet holes 16 are simultaneously filled with the conductive material exposed at the lower surface of the first ceramic plate 10. The air outlet 16 with conductive material is formed as an external connector 36, and the external connector 36 can be used as an access terminal for adjusting inductance value of inductor, which can realize access of different inductors, and is flexible and convenient.
The conductive material is liquid during filling, can flow, and can realize filling of the spiral channel by means of spraying or vacuum suction, and the material can be selected from conductive ink or resin material with conductive particles and the like.
Referring to fig. 6a and 6b, a plurality of conductive blind holes are formed in the stacked substrate to penetrate through the first ceramic plate 10, the sacrificial plate 17 and the second ceramic plate 20, a first conductive blind hole 38 of the plurality of conductive blind holes is electrically connected to the first connection portion 34, and a second conductive blind hole 37 of the plurality of conductive blind holes is electrically connected to the second connection portion 35. The first conductive blind hole 37, the second conductive blind hole 37, and the external connection member 36 can be used as electrodes of an inductor, which can realize three inductors of three different inductance values.
Next, referring to fig. 7, the sacrificial plate 17 is removed, so that the spiral inductor structure is suspended and exposed at the position of the sacrificial plate 17, and an air gap is formed between the first ceramic plate 10 and the second ceramic plate 20. It can be seen that a plurality of vertical connections 32 are exposed within the air gap and a portion of the plurality of conductive blind vias are also exposed within the air gap. These electrically conductive blind holes support two ceramic plates 10, 20 and guarantee that the setting that the three-dimensional inductance structure can be unsettled is between first ceramic plate 10 and second ceramic plate 20, when guaranteeing the heat dissipation, can insert suitable magnetic core, adjust the inductance value of inductance.
In order to ensure the supporting effect, the number of the conductive blind holes is at least 6, and the plurality of conductive blind holes surround the spiral inductor structure, so that better support can be achieved, and heat dissipation can be improved. Said conductive blind holes are located at the four corners of said first 10 and second 20 ceramic plates, in addition to the first 38 and second 37 conductive blind holes.
The plurality of conductive blind holes can also ensure the reliability of bonding among the plurality of ceramic plates, and the function of the conductive blind holes can be a rivet function to prevent the ceramic plates from being layered. In particular, the conductive blind holes are positioned at four corners of the stacked substrate.
The foregoing detailed description of the technology has been presented for purposes of illustration and description. It is not intended to be exhaustive or to limit the technology to the precise form disclosed. Many modifications and variations are possible in light of the above teaching. The described embodiments were chosen in order to best explain the principles of the technology and its practical application to thereby enable others skilled in the art to best utilize the technology in various embodiments and with various modifications as are suited to the particular use contemplated. The scope of the present technology is defined by the appended claims.
The expressions "exemplary embodiment," "example," and the like, as used herein, do not refer to the same embodiment, but are provided to emphasize different particular features. However, the above examples and exemplary embodiments do not preclude their implementation in combination with features of other examples. For example, even in a case where a description of a specific example is not provided in another example, unless otherwise stated or contrary to the description in the other example, the description may be understood as an explanation relating to the other example.
The terminology used in the present invention is for the purpose of illustrating examples only and is not intended to be limiting of the invention. Unless the context clearly dictates otherwise, singular expressions include plural expressions.
While example embodiments have been shown and described, it will be apparent to those skilled in the art that modifications and changes may be made without departing from the scope of the invention as defined by the claims.
Claims (10)
1. A method for manufacturing a three-dimensional flying inductor comprises the following steps:
(1) providing a first ceramic plate, a sacrificial plate, a second ceramic plate; the upper surface of the first ceramic plate is provided with a plurality of first grooves which are arranged in parallel, and an inlet section and an outlet section which are connected with the plurality of first grooves, and the plurality of first grooves are respectively provided with a first end and a second end; the sacrificial plate is provided with a plurality of first through holes corresponding to the first ends and a plurality of second through holes corresponding to the second ends; the lower surface of the second ceramic plate is provided with a plurality of second grooves which are arranged in parallel, and the plurality of second grooves are respectively provided with a third end and a fourth end, wherein the third end corresponds to the plurality of first through holes, and the fourth end corresponds to the plurality of second through holes;
(2) hot pressing the first ceramic plate, the sacrificial plate, and the second ceramic plate together to form a stacked substrate structure, wherein first ends of the plurality of first grooves communicate with third ends of the plurality of second grooves through the plurality of first through holes, and second ends of the plurality of first grooves communicate with fourth ends of the plurality of second grooves through the plurality of second through holes, such that the plurality of first grooves and the plurality of second grooves and the plurality of first through holes and the plurality of second through holes communicate to form a spiral channel, and head and tail sections of the spiral channel connect the inlet section and the outlet section, respectively;
(3) filling the spiral channel with a conductive material from the inlet section, wherein the conductive material fills the spiral channel and excess conductive material flows out through the outlet section; forming a spiral inductor structure via curing the conductive material, the spiral inductor structure including a first connection portion at a head end and a second connection portion at a tail end;
(4) forming a plurality of conductive blind holes in the stacked substrate, the plurality of conductive blind holes extending through the first ceramic plate and the sacrificial plate and extending to an upper surface of the second ceramic plate, a first conductive blind hole of the plurality of conductive blind holes electrically connecting the first connection portion, a second conductive blind hole of the plurality of conductive blind holes electrically connecting the second connection portion;
(5) and removing the sacrificial plate to enable the spiral inductance structure to be suspended and exposed at the position of the sacrificial plate, wherein an air gap is formed between the first ceramic plate and the second ceramic plate.
2. The method of manufacturing a three-dimensional flying inductor according to claim 1, wherein: the material of the sacrificial plate is a photoresist material, and removing the sacrificial plate in step (5) includes removing the photoresist material with an etching solution.
3. The method of manufacturing a three-dimensional flying inductor according to claim 1, wherein: the first ceramic plate is also internally provided with an air outlet which is communicated with one of the first grooves.
4. The method of manufacturing a three-dimensional flying inductor according to claim 3, wherein: in step (3), the gas outlet holes are simultaneously filled with the conductive material, and the conductive material is exposed at the lower surface of the first ceramic plate.
5. The method of manufacturing a three-dimensional flying inductor according to claim 1, wherein: the number of the conductive blind holes is at least 6, and the plurality of conductive blind holes surround the spiral inductor structure.
6. A three-dimensional flying inductor formed by the method of manufacturing a three-dimensional flying inductor of claim 1, comprising:
a spiral inductor structure including a first connection portion, a second connection portion, a plurality of first horizontal portions, a plurality of second horizontal portions, and a plurality of vertical connection portions connecting the plurality of first horizontal plates and the plurality of second horizontal portions; the first horizontal parts and the second horizontal parts are sequentially connected through the vertical connecting parts to form a spiral structure, and the first connecting parts and the second connecting parts are respectively positioned at two ends of the spiral inductance structure and used as terminals;
a first ceramic plate and a second ceramic plate, the first ceramic plate and the second ceramic plate having a void gap therebetween; the upper surface of the first ceramic plate is provided with a plurality of first grooves which are arranged in parallel, and an inlet section and an outlet section which are connected with the plurality of first grooves, and the plurality of first grooves are respectively provided with a first end and a second end; the lower surface of the second ceramic plate is provided with a plurality of second grooves which are arranged in parallel, the plurality of second grooves are respectively provided with a third end and a fourth end, and the third end and the fourth end correspond to the plurality of vertical connecting parts one to one; wherein the plurality of first horizontal portions are formed in the plurality of first grooves, the plurality of second horizontal portions are formed in the plurality of second grooves, the first connecting portions are formed in the inlet section, the second connecting portions are formed in the outlet section, and the plurality of vertical connecting portions are located in the air gap;
the plurality of conductive blind holes penetrate through the first ceramic plate and extend to the upper surface of the second ceramic plate through the air gap, first conductive blind holes in the plurality of conductive blind holes are electrically connected with the first connecting portion, and second conductive blind holes in the plurality of conductive blind holes are electrically connected with the second connecting portion.
7. The inductor of claim 6, wherein: still have a gas outlet in the first ceramic plate, the gas outlet intercommunication one of a plurality of first recesses, and the gas outlet is filled by conducting material simultaneously, conducting material is in the lower surface of first ceramic plate exposes.
8. The inductor of claim 7, wherein: the conductive material is conductive ink or a resin material with conductive particles, and the like.
9. The inductor of claim 6, wherein: the number of the conductive blind holes is at least 6, and the plurality of conductive blind holes surround the spiral inductor structure.
10. The inductor of claim 9, wherein: the conductive blind holes are formed in four corners of the first ceramic plate and the second ceramic plate.
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| CN202011244459.8A CN112420319B (en) | 2020-11-10 | 2020-11-10 | Three-dimensional suspended inductor and manufacturing method thereof |
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