CN112416178B - Touch module and touch display screen - Google Patents
Touch module and touch display screen Download PDFInfo
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- CN112416178B CN112416178B CN202011403238.0A CN202011403238A CN112416178B CN 112416178 B CN112416178 B CN 112416178B CN 202011403238 A CN202011403238 A CN 202011403238A CN 112416178 B CN112416178 B CN 112416178B
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/0416—Control or interface arrangements specially adapted for digitisers
- G06F3/04164—Connections between sensors and controllers, e.g. routing lines between electrodes and connection pads
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/0416—Control or interface arrangements specially adapted for digitisers
- G06F3/0418—Control or interface arrangements specially adapted for digitisers for error correction or compensation, e.g. based on parallax, calibration or alignment
- G06F3/04186—Touch location disambiguation
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
- G06F3/0445—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using two or more layers of sensing electrodes, e.g. using two layers of electrodes separated by a dielectric layer
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- General Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Computer Networks & Wireless Communication (AREA)
- Position Input By Displaying (AREA)
Abstract
The embodiment of the application provides a touch module and a touch display screen, and relates to the technical field of display. The metal wiring structure of the position, which is easy to corrode, in the touch function layer is provided with the metal protective layer according to different designs of the touch display screen, so that the metal wiring structure is protected, the touch function of the touch module is prevented from being corroded by water vapor or corrosive gas and the like, and the phenomenon of poor touch function of the touch display screen after thinning is improved. When all the metal wiring structures in the touch functional layer are provided with the metal protective layer, normal display of the touch display screen can be ensured.
Description
Technical Field
The application relates to the technical field of display, in particular to a touch module and a touch display screen.
Background
Good touch control function is a basic requirement of consumers on various consumer electronic products (such as smart phones, tablet computers and the like). With the trend of light and thin consumer electronics, when a touch module is integrated with a display panel (for example, using an on-cell structure), the integrated touch display screen needs to be thinned as much as possible.
It is noted that the information disclosed in this background section is only for enhancement of understanding of the general background of the application and should not be taken as an acknowledgement or any form of suggestion that this information constitutes prior art already known to a person skilled in the art.
Disclosure of Invention
In order to overcome the technical problems mentioned in the background, embodiments of the present application provide a touch module and a touch display screen.
In a first aspect of the present application, a touch module is provided, which includes a touch function layer, the touch function layer includes a plurality of metal routing structures, at least one of the metal routing structures is provided with a metal protection layer at least covering a surface of the metal routing structure for protecting the metal routing structure.
The touch module can set the metal protective layer at least covering one surface of the metal wiring structure to at least one metal wiring structure at the position, which is easy to be corroded, in the touch function layer according to different designs of the touch display screen, and protect the metal wiring structure, so that the touch function of the touch module is prevented from being influenced by the corrosion of water vapor or corrosive gas (such as halogen) and the like, and the phenomenon of poor touch function of the touch display screen after thinning is improved.
In one possible embodiment of the present application, the touch module further includes a buffer layer and an insulating layer, and the plurality of metal trace structures include a plurality of first metal traces located on the first metal layer and a plurality of second metal traces located on the second metal layer;
the first metal layer is positioned on one side of the buffer layer;
the insulating layer is positioned on one side of the first metal layer far away from the buffer layer;
the second metal layer is located on one side, far away from the first metal layer, of the insulating layer.
In one possible embodiment of the present application, the metal protection layer includes a first metal protection layer and a second metal protection layer;
the surface of the first metal wire, which is not in contact with the buffer layer, is covered with a first metal protection layer; and/or
And a second metal protective layer covers the surface of the second metal wire, which is not in contact with the insulating layer.
In one possible embodiment of the present application, the first metal protection layer and the second metal protection layer are made of at least one of Ti, Mo, or ITO.
In one possible embodiment of the present application, the metal protection layer includes a third metal protection layer and a fourth metal protection layer;
the first metal routing comprises a first routing layer, a second routing layer and a third routing layer, the first routing layer is positioned on one side of the buffer layer, the second routing layer is positioned on one side, away from the buffer layer, of the first routing layer, the third routing layer covers the surface, not in contact with the first routing layer, of the second routing layer, and the part, covered on the side face of the second routing layer, of the third routing layer serves as a third metal protection layer; and/or
The second metal wiring comprises a fourth wiring layer, a fifth wiring layer and a sixth wiring layer, the fourth wiring layer is located on one side of the insulating layer, the fifth wiring layer is located on one side of the insulating layer, the fourth wiring layer is far away from one side of the insulating layer, the sixth wiring layer covers the surface, not contacted with the fourth wiring layer, of the fifth wiring layer, and the portion, on the side face of the fifth wiring layer, of the sixth wiring layer covers the fourth metal protective layer.
In one possible embodiment of the present application, an orthographic projection of the second routing layer on the buffer layer is included in an orthographic projection of the third routing layer on the buffer layer, and an orthographic projection of the third routing layer on the buffer layer is included in an orthographic projection of the first routing layer on the buffer layer;
the orthographic projection of the fifth routing layer on the insulating layer is contained in the orthographic projection of the sixth routing layer on the insulating layer, and the orthographic projection of the sixth routing layer on the insulating layer is contained in the orthographic projection of the fourth routing layer on the insulating layer.
In one possible embodiment of the present application, the first metal trace and the second metal trace are both stacked metal structures, and each stacked metal structure includes a first metal film layer, a second metal film layer, and a third metal film layer stacked and disposed along a direction perpendicular to the buffer layer, where the metal activity of the second metal film layer is stronger than the metal activity of the first metal film layer and the metal activity of the second metal film layer.
In one possible embodiment of the present disclosure, the second metal film layer is made of Al, and the first metal film layer and the third metal film layer are made of Ti or Mo.
In one possible embodiment of the present application, the touch function layer includes a touch area and a non-touch area, and the plurality of metal routing structures include at least one of the following:
a touch pattern located in the touch area;
the touch lead is positioned in the touch area and the non-touch area and is connected with the touch electrode in the touch pattern; and
and the bonding pad is positioned in the non-touch area and connected with the touch lead.
In a second aspect of the present application, a touch display screen is further provided, where the touch display screen includes the touch module of the first aspect.
Compared with the prior art, the touch module and the touch display screen provided by the embodiment of the application are provided. The touch control display screen can be designed according to different designs, the metal wiring structure at the position, which is easy to corrode in the touch control function layer, is provided with the metal protective layer at least covering one surface of the metal wiring structure, the metal wiring structure is protected, the phenomenon that the touch control function of the touch control module is influenced by the corrosion of water vapor or corrosive gas and the like of the metal wiring structure is avoided, and the phenomenon of poor touch control function of the touch control display screen after the touch control display screen is thinned is improved.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are required to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present application and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained from the drawings without inventive effort.
FIG. 1 is a schematic diagram of a partial film structure of a touch display screen;
FIG. 2 is a schematic diagram of a partial film structure of another touch display screen;
fig. 3 is a schematic view illustrating a film structure of a touch module according to an embodiment of the present disclosure;
fig. 4 is a schematic view of a metal routing structure of a touch functional layer according to an embodiment of the present disclosure;
fig. 5 is a second schematic view illustrating a film structure of a touch module according to an embodiment of the present disclosure;
fig. 6 is a third schematic view illustrating a film structure of a touch module according to an embodiment of the present disclosure;
FIG. 7 is a process diagram of a first metal film layer process according to a first embodiment of the present disclosure;
FIG. 8 is a process diagram of a second metal film layer process according to a first embodiment of the present disclosure;
fig. 9 is a schematic structural diagram of a first metal trace provided in a second implementation manner of the embodiment of the present application;
fig. 10 is a schematic structural diagram of a second metal trace provided in the second implementation manner of the embodiment of the present application;
FIG. 11 is a process diagram of a first metal film layer process according to a second embodiment of the present disclosure;
FIG. 12 is a process diagram of a second metal film layer process according to a second embodiment of the present disclosure;
FIG. 13 is a second process diagram of a first metal film layer process provided in the second embodiment of the present application;
FIG. 14 is a second process diagram of a second metal film layer process provided in the second embodiment of the present application;
fig. 15 is a schematic view of a partial film structure of a touch display screen according to an embodiment of the present disclosure.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are some embodiments of the present application, but not all embodiments. The components of the embodiments of the present application, as generally described and illustrated in the figures herein, could be arranged and designed in a wide variety of different configurations.
Thus, the following detailed description of the embodiments of the present application, presented in the accompanying drawings, is not intended to limit the scope of the claimed application, but is merely representative of selected embodiments of the application. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.
In the description of the present application, it should be noted that the terms "upper", "lower", and the like refer to orientations or positional relationships based on orientations or positional relationships shown in the drawings or orientations or positional relationships that the products of the application usually place when using, are only used for convenience of description and simplification of description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be constructed in a specific orientation, and be operated, and thus should not be construed as limiting the present application. Furthermore, the terms "first," "second," "third," "fourth," and the like are used merely to distinguish one description from another, and are not to be construed as indicating or implying relative importance.
It should be noted that, in case of conflict, different features in the embodiments of the present application may be combined with each other.
Referring to fig. 1, fig. 1 shows a schematic diagram of a partial film structure of a conventional touch display screen 1 ', where the touch display screen 1' may include a display panel 20 ', a touch module 10', a polarizer 30 ', and a cover plate 40'. The touch module 10 'is disposed on the display panel 20', the polarizer 30 'is disposed on a side of the touch module 10' away from the display panel 20 ', and the cover plate 40' is disposed on a side of the polarizer 30 'away from the display panel 20', wherein an optical adhesive (not shown) may be disposed between the cover plate 40 'and the polarizer 30' and between the touch module 10 'and the polarizer 30'.
The touch module 10 'may include a buffer layer (buffer) 11', a first metal routing layer 12 ', an insulating layer (insulator) 13', a second metal routing layer 14 ', and a passivation layer (passivation) 15'. A buffer layer 11 ' is disposed on the display panel 20 ', and the buffer layer 11 ' may be an organic material (e.g., OC) or an inorganic material (e.g., SiN) x 、SiO x Or SiN x O y ) The preparation method is finished. The first metal wiring layer 12 ' is located on a side of the buffer layer 11 ' away from the display panel 20 '. An insulating layer 13 ' covers the first metal wiring layer 12 ', and the insulating layer 13 ' may be made of an organic material or an inorganic material (e.g., SiN) x 、SiO x Or SiN x O y ) And (4) preparing. The second metal wiring layer 14 ' is located on a side of the insulating layer 13 ' away from the display panel 20 '. The passivation layer 15 ' covers the second metal routing layer 14 ', and the passivation layer 15 ' may be made of an organic material.
With the thin design of the touch display screen structure, the film layer material in the touch display screen structure is organized and the film layer is thinned, so that the blocking effect on the water vapor in the environment and the corrosive gas (such as halogen) in the film layer (such as the polarizer 30 ') is reduced, and the water vapor and the corrosive gas can erode the metal wiring layer in the touch module 10 ', thereby possibly causing poor touch function of the touch module 10 '.
In order to solve the above technical problem, one possible solution is as follows.
Referring to fig. 2, compared to fig. 1, a protection layer 50 'is added between the passivation layer 15' and the polarizer 30 ', and the above structure can prevent water vapor and corrosive gas from entering the touch module 10' by adding the protection layer 50 ', so as to improve the poor touch function caused by the corrosion of the metal routing layer in the touch module 10'.
However, the inventors found that although the above structure can improve the touch function defect caused by the corrosion of the metal wiring layer in the touch module 10', the following disadvantages exist: firstly, in order to prevent water vapor and corrosive gases from entering the touch module 10 ', the protective layer 50' is generally set to be thicker, which increases the thickness of the touch display screen, which is contrary to the trend of thinning the touch display screen, and reduces the market competitiveness of the product; secondly, the transmittance of light is reduced by adding the protective layer 50 ', and the same display effect can be achieved by increasing the power of the display panel 20' under the condition that the display brightness is not changed, so that the display power consumption of the touch display screen is increased.
In order to solve the technical problem that the touch display screen has poor touch function after being thinned, the inventor creatively designs the following technical scheme. Specific implementations of the present application will be described in detail below with reference to the accompanying drawings.
Referring to fig. 3 and 4, fig. 3 is a schematic diagram illustrating a film structure of a touch module according to an embodiment of the present disclosure, and fig. 4 is a schematic diagram illustrating metal traces of a touch functional layer. The touch module 10 may include a touch function layer 100, the touch function layer 100 may include a plurality of metal routing structures 110, and at least one metal routing structure 110 is disposed on a metal protection layer 120 covering at least one surface of the metal routing structure 110 for protecting the metal routing structure 110.
The touch functional layer 100 may include a touch Area 101 and a non-touch Area 102, wherein the touch Area 101 corresponds to an effective display Area (Active Area, AA) of the display panel, and the plurality of metal routing structures 110 may include a touch pattern formed by intersecting first touch electrodes and second touch electrodes and located in the touch Area 101, touch leads 1103 located in the touch Area 101 and the non-touch Area 102 and connected to the touch electrodes in the touch pattern, and pads 1104 located in the non-touch Area 102 and connected to the touch leads 1103.
Referring to fig. 3 again, the touch module 10 may further include a buffer layer 11 and an insulating layer 13, and the metal trace structures 110 may include a plurality of first metal traces 1101 located on a first metal layer and a plurality of second metal traces 1102 located on a second metal layer.
In the embodiment of the present application, the first metal layer is located on the buffer layer 11, the insulating layer 13 is located on a side of the first metal layer away from the buffer layer 13, and the second metal layer is located on a side of the insulating layer 13 away from the first metal layer. As such, the insulating layer 13 is located between the first metal layer and the second metal layer for isolating the first metal layer from the second metal layer. The touch module 10 may further include a passivation layer 15, where the passivation layer 15 is located on a side of the second metal layer away from the insulating layer 13, and the passivation layer 15 is used to protect the second metal layer.
In the embodiment of the present application, the touch lead 1103 and the pad 1104 may be formed by the first metal trace 1101 located on the first metal layer, the second metal trace 1102 located on the second metal layer, or both the first metal trace 1101 and the second metal trace 1102. The touch lead 1103 in the touch area 101 may be routed from the side of the touch area 101, or may be routed through a gap area (dummy area) between the touch electrodes in the touch area 101.
In the embodiment of the application, the plurality of first metal traces 1101 located in the first metal layer and the plurality of second metal traces 1102 located in the second metal layer form a touch pattern in the touch area 101 of the touch function layer 100.
Referring to fig. 3 again, in an implementation manner of the embodiment of the present application, the touch pattern 111 may be formed on the second metal layer. The second metal layer may include a first touch electrode formed by a plurality of second metal traces 1102 continuously extending along a direction, and a second touch electrode formed by a plurality of second metal traces 1102 bridged by a first metal trace 1101 in the second metal layer, wherein the first metal trace 1101 bridges the second metal trace 1102 through a via of the insulating layer 13. It is understood that, referring to fig. 5, the touch pattern 111 may also be formed on the first metal layer. The first metal layer may include a first touch electrode formed by a plurality of first metal traces 1101 continuously extending along a direction, and a second touch electrode formed by a plurality of first metal traces 1101 bridged by a second metal trace 1102 in the first metal layer, wherein the second metal trace 1102 bridges the first metal traces 1101 through a through hole of the insulating layer 13.
Referring to fig. 6, in another implementation manner of the embodiment of the present application, the touch pattern 111 may include a first touch electrode respectively composed of a plurality of first metal traces 1101 located in a first metal layer, and a second touch electrode composed of a plurality of second metal traces 1102 located in a second metal layer.
In this embodiment, the metal trace structure 110 may further include a metal trace (not shown) connected to a metal layer in the array substrate of the display panel for transmitting a signal in the display panel, and when the metal trace for transmitting the signal in the display panel is corroded by water vapor or corrosive gas, a display function may be abnormal. For this reason, in this embodiment, the metal trace structure 110 to be protected may further include metal traces for signal transmission of the display panel. Specifically, the metal trace for transmitting the signal of the display panel may be the first metal trace 1101 located on the first metal layer, may also be the second metal trace 1102 located on the second metal layer, and may also be a combination of the first metal trace 1101 located on the first metal layer and the second metal trace 1102 located on the second metal layer.
In some touch display screen structures, the side of the touch display screen is vulnerable to water vapor intrusion, and therefore, the metal routing structure 110 (for example, the touch lead 1113, the pad 1114 or the metal routing for transmitting signals in the display panel) located at the periphery of the touch module 10 may be provided with the metal protection layer 120 by using the technical solution provided by the embodiment of the present application, so as to avoid adverse effects on touch and display caused by side water vapor intrusion, specifically, the metal protection layer may be provided at least on the surface of the metal routing structure 110 close to the edge of the touch module 10, so as to block side water vapor intrusion. In some flexible touch display screen structures, a film layer corresponding to a bending region of the touch display screen may have a slight gap after being used for a long time, which may cause a metal routing structure corresponding to the bending region of the touch module 10 to be easily eroded by water vapor and corrosive gas, and a metal protection layer 120 may be disposed on the metal routing structure corresponding to the bending region of the touch module 10, so as to prevent the metal routing structure of the bending region from being eroded to cause poor touch and/or display.
Above-mentioned structure, can be according to the different designs of touch-control display screen, walk line structure 110 to the metal of the easy corruption position department in the touch-control functional layer 100 and set up metal protective layer 120, walk line structure 110 with the metal and protect, in order to avoid the metal of being protected to walk line structure 110 by erosion such as steam or corrosive gas, in order to improve the phenomenon that touch-control function is bad after the touch-control display screen is thin type, when the metal that sets up the metal layer is walked line structure 110 for the metal of transmission display signal, can also ensure touch-control display screen's normal display simultaneously.
In the design of the touch module 10, the metal routing structure 110 has a good electrical conductivity and needs a good corrosion resistance, and for this reason, the metal routing structure 110 in the embodiment of the present application may adopt a stacked metal structure, where the stacked metal structure includes a first metal film layer, a second metal film layer, and a third metal film layer stacked in a direction perpendicular to the buffer layer 11, the second metal film layer in the stacked metal structure is mainly used for conducting an electrical signal, and the first metal film layer and the third metal film layer are used for protecting the second metal film layer, that is, in the stacked metal structure, the metal activity of the second metal film layer is stronger than that of the first metal film layer and that of the third metal film layer. Optionally, the material of the second metal film layer may be Al, the material of the first metal film layer and the material of the second metal film layer may be Ti or Mo, that is, the metal routing structure 110 may be a laminated structure of TiAlTi or MoAlMo, and for convenience of description, the metal routing structure 110 is described as a laminated structure of TiAlTi.
The inventor also finds that, in the fabrication of the metal trace structure 110, the first metal trace 1101 is taken as an example for illustration. Firstly, a first metal layer comprising a first metal film layer (Ti metal film layer), a second metal film layer (Al metal film layer) and a third metal film layer (Ti metal film layer) is sequentially manufactured on a buffer layer 12; then, the first metal trace 1101 is etched on the first metal layer by photolithography. In the manufacturing method, the Al metal film layer is exposed on the side surface formed by etching the first metal trace 1101, and water vapor or corrosive gas is liable to corrode the exposed Al metal film layer, so that the Al metal film layer expands or cracks are generated, and when the etched first metal trace is a trace related to a touch function (for example, a touch electrode, a touch lead 1103 or a pad 1104), the touch function of the touch module is abnormal.
For this reason, the following two metal protection layer 120 structures are provided in the embodiment of the present application for protecting the metal routing structure 110.
Referring to fig. 3 again, in the first embodiment of the present disclosure, the metal protection layer 120 may include a first metal protection layer 121 and a second metal protection layer 122. The first metal protection layer 121 is located on a surface of the first metal trace 1011 not contacting the buffer layer 11, and the second metal protection layer 122 is located on a surface of the second metal trace 1012 not contacting the insulating layer 13.
In this embodiment, the first metal trace 1101 in the first metal layer may be completely provided with the first metal protection layer 121, or may be partially provided with the first metal protection layer 121; similarly, the second metal trace 1102 located in the second metal layer may be entirely provided with the second metal protection layer 122, or may be partially provided with the second metal protection layer 122. Further, a first metal protection layer 121 may be disposed on the first metal trace 1101 in the first metal layer, and a second metal protection layer 122 is not disposed on the second metal trace 1102 in the second metal layer; or the first metal wire 1101 in the first metal layer is not provided with the first metal protection layer 121, and the second metal wire 1102 in the second metal layer is provided with the second metal protection layer 122.
The specific arrangement of the first metal protection layer 121 and the second metal protection layer 122 can be adjusted according to the design of the touch display screen film, so that the metal routing structure 110 at the position of the touch module 10, which is easily corroded by water vapor or corrosive gas, can be protected by the metal protection layer.
Referring to fig. 7, in this embodiment, a first metal protection layer 121 wrapping the first metal trace 1101 may be formed on the surface of the first metal trace 1101 to be protected, and the specific forming manner is as follows.
Firstly, a first metal layer 12 including a first metal film layer (Ti metal film layer), a second metal film layer (Al metal film layer) and a third metal film layer (Ti metal film layer) is sequentially formed on the buffer layer 11, then the first metal layer 12 is etched to form a first metal wire 1101, finally, a first metal protection layer 121 may be formed on the surface of the first metal wire 1101 to be protected in an evaporation mode, and the first metal protection layer 121 formed after evaporation is located on the surface of the first metal wire 1101, which is not in contact with the buffer layer 11.
Referring to fig. 8, similarly, a second metal passivation layer 122 is formed on the second metal trace 1102 to be protected, and the forming method is described as follows.
First, a first metal layer (Ti metal film layer), a second metal layer (Al metal film layer) and a second metal layer 14 of a third metal film layer (Ti metal film layer) are sequentially formed on the insulating layer 13, then, the second metal layer 14 is etched to form a second metal wire 1102, finally, a second metal protection layer 122 may also be formed on the surface of the second metal wire 1102 to be protected by evaporation, and the second metal protection layer 122 formed after evaporation is located on the surface of the second metal wire 1102, which is not in contact with the insulating layer 13. In this embodiment, the material of the first metal protection layer and the second metal protection layer may include, but is not limited to, Ti, Mo, or ITO.
In this embodiment, the orthogonal projection of the first metal trace 1101 on the buffer layer 11 is included in the orthogonal projection of the first metal protection layer 121 on the buffer layer 11. The orthogonal projection of the second metal trace 1102 on the insulating layer 13 is included in the orthogonal projection of the second metal protection layer 1102 on the insulating layer 13.
Preferably, in the present embodiment, the first metal protection layer 121 may be disposed on all the first metal traces 1101 in the first metal layer 12, and the second metal protection layer 122 may be disposed on all the second metal traces 1102 in the second metal layer 14, and the first metal protection layer 121 and the second metal protection layer 122 are disposed in such a manner that the metal trace structures 110 at any position in the touch module 10 are not corroded, so as to ensure that the touch function of the touch module 10 is normal, and at the same time, the display signal transmission of the display panel is normal. In addition, the thickness of the touch module 10 is not increased by the thinness of the metal protection layer 120 deposited by vapor deposition in the above structure, so that the thickness of the touch display screen is not increased basically.
In a second implementation manner of the embodiment of the present application, the metal protection layer 120 may include a third metal protection layer 123 and a fourth metal protection layer 124. Referring to fig. 9 and 10, the first metal trace 1101 may include a first routing layer 11011, a second routing layer 11012 and a third routing layer 11013, and the second metal trace 1102 may include a fourth routing layer 11021, a fifth routing layer 11022 and a sixth routing layer 11023.
The first wiring layer 11011 is located on the buffer layer 11, the second wiring layer 11012 is located on a side of the first wiring layer 11011 away from the buffer layer 11, the third wiring layer 11013 covers a surface of the second wiring layer 11012 not contacting with the first wiring layer 11011, and a portion of the third wiring layer 11013 covering a side surface of the second wiring layer 11012 serves as a third metal protection layer 123. The fourth wiring layer 11021 is located on the insulating layer 13, the fifth wiring layer 11022 is located on a side of the fourth wiring layer 11021 away from the insulating layer 13, the sixth wiring layer 11023 covers a surface of the fifth wiring layer 11022 not contacting with the fourth wiring layer 11021, and a portion of the sixth wiring layer 11023 covering a side surface of the fifth wiring layer 11022 serves as a fourth metal protection layer 124. In this embodiment, the first routing layer 11011 may correspond to a first metal film layer of the first metal trace 1101, the second routing layer 11012 may correspond to a second metal film layer of the first metal trace 1101, and the third routing layer 11013 may correspond to a third metal film layer of the first metal trace 1101; the fourth wiring layer 11021 may correspond to the first metal film layer of the second metal trace 1102, the fifth wiring layer 11022 may correspond to the second metal film layer of the second metal trace 1102, and the sixth metal film layer 11023 may correspond to the third metal film layer of the second metal trace 1102.
In this embodiment, the first metal trace 1101 in the first metal layer may be completely provided with the third metal protection layer 123, or may be partially provided with the third metal protection layer 123; similarly, the second metal trace 1102 in the second metal layer 14 may be completely provided with the fourth metal protection layer 124, or may be partially provided with the fourth metal protection layer 124. Further, a third metal protection layer 123 may be disposed on the first metal trace 1101 in the first metal layer 12, and the fourth metal protection layer 124 is not disposed on the second metal trace 1102 in the second metal layer 14; or the third metal protection layer 123 is not disposed on the first metal routing 1101 in the first metal layer 12, and the fourth metal protection layer 124 is disposed on the second metal routing 1102 in the second metal layer 14.
The specific arrangement of the third metal protection layer 123 and the fourth metal protection layer 124 can be adjusted according to the design of the touch display screen film layer, so that the metal routing structure 110 at the position of the touch module 10 that is easily corroded by water vapor or corrosive gas is protected by the metal protection layer.
In this embodiment, the third metal protection layer 123 and the fourth metal protection layer 124 can be formed in the following two ways.
Referring to fig. 11, a first method for fabricating the third metal passivation layer 123 may be: first, a first wiring layer 11011 (e.g., a Ti metal film layer) and a second wiring layer 11012 (e.g., an Al metal film layer) are sequentially formed on the buffer layer 11; then, etching the Ti metal film layer and the Al metal film layer to form a wiring pattern; finally, a third wiring layer 11013 is formed on the surface of the wiring pattern, and a portion of the third wiring layer 11013 covering the side surface of the second wiring layer is used as a third metal protection layer 123. In this embodiment, the overall structure is formed as a three-layer structure, that is, a part of the third wiring layer 11013 can be used as the third metal protection layer 123. Similarly, referring to fig. 12, the manner of fabricating the fourth metal passivation layer 124 may be: first, a fourth wiring layer 11021 (e.g., Ti metal layer) and a fifth wiring layer 11022 (e.g., Al metal layer) are sequentially formed on the insulating layer 13; then, etching the formed Ti metal layer and the Al metal layer to form a wiring pattern; finally, a sixth wiring layer 11023 is formed on the surface of the wiring pattern, and a portion of the sixth wiring layer 11023 covering the side surface of the fifth wiring layer is used as the fourth metal protection layer 124. In this embodiment mode, the entire structure is formed as a three-layer structure, that is, a part of the sixth metal layer 11023 can be used as the fourth metal cap layer 124. In the above process, the third metal film layer 11013 and the sixth metal film layer 11023 may be formed by evaporation. The third metal film layer 11013 and the sixth metal film layer 11023 may be made of at least one of Ti, Mo, and ITO.
When the third metal protection layer 123 and the fourth metal protection layer 124 are fabricated in the first manner, orthographic projections of the first wiring layer 11011 and the second wiring layer 11012 on the buffer layer 11 are included in orthographic projections of the third wiring layer 11013 on the buffer layer 11. The orthogonal projection of the fourth wiring layer 11021 and the fifth wiring layer 11022 on the insulating layer 13 is included in the orthogonal projection of the sixth wiring layer 11023 on the insulating layer 13.
Referring to fig. 13, a second method for fabricating the third metal passivation layer may be: first, a first wiring layer 11011 (e.g., a Ti metal film layer), a second wiring layer 11012 (e.g., an Al metal film layer), and a third wiring layer 11013 (e.g., a Ti metal film layer) are sequentially formed on the buffer layer 11; then, etching the formed three layers of metal to form a first metal wire; then, etching the first metal wire by using an etching process (for example, dry etching or wet etching), so that the metal layer on the etched side of the first metal wire is etched to different degrees; finally, because the etching speed of the Al metal film layer is higher than that of the Ti metal film layer, the Al metal film layer is sunken relative to the Ti metal film layers on the upper side and the lower side, and the Ti metal film layer on the side far away from the buffer layer 11 is sunken to wrap the Al metal film layer. The Ti metal film layer covering the Al metal film layer in a collapsing manner serves as the third metal protection layer 123, that is, the portion of the third wiring layer 11013 in the first metal wiring layer covering the second wiring layer 11012 in a collapsing manner serves as the third metal protection layer 123. Similarly, referring to fig. 14, the manner of fabricating the fourth metal passivation layer 124 may be: first, a fourth wiring layer 11021 (e.g., Ti metal film layer), a fifth wiring layer 11022 (e.g., Al metal film layer), and a sixth wiring layer 11023 (e.g., Ti metal film layer) are sequentially formed on the insulating layer 13; then, etching the formed three layers of metal to form a second metal wire; then, etching the second metal wire by using an etching process (such as dry etching or wet etching), so that the metal layer on the etched side of the second metal wire is etched to different degrees; finally, because the etching speed of the Al metal film layer is higher than that of the Ti metal film layer, the Al metal film layer is sunken relative to the Ti metal film layers on the upper side and the lower side, and the Ti metal film layer on the side far away from the insulating layer 13 is sunken to wrap the Al metal film layer. The Ti metal film layer covering the Al metal film layer in a collapsed state serves as the fourth metal protection layer 124, that is, the portion of the sixth wiring layer 11023 of the second metal wiring layer covering the fifth wiring layer 11022 in a collapsed state serves as the fourth metal protection layer 124.
When the third metal passivation layer 123 and the fourth metal passivation layer 124 are fabricated in the second manner, an orthogonal projection of the second wiring layer 11012 on the buffer layer 11 is included in an orthogonal projection of the third wiring layer 11013 on the buffer layer 11, and an orthogonal projection of the third wiring layer 11013 on the buffer layer 11 is included in an orthogonal projection of the first wiring layer 11011 on the buffer layer 11. The orthographic projection of the fifth wiring layer 11022 on the insulating layer 13 is contained in the orthographic projection of the sixth wiring layer 11023 on the insulating layer 13, and the orthographic projection of the sixth wiring layer 11023 on the insulating layer 13 is contained in the orthographic projection of the fourth wiring layer 11021 on the insulating layer 13.
Preferably, in this embodiment, all the first metal traces 1101 in the first metal layer 12 are provided with the third metal protection layer 123, and all the second metal traces 11021 in the second metal layer 14 are provided with the fourth metal protection layer 124. The third metal passivation layer 123 and the fourth metal passivation layer 124 are disposed in such a manner that the metal trace structure 110 at any position in the touch module 10 is not corroded, so as to ensure normal touch function of the touch module 10 and ensure normal transmission of display signals of the display panel. In addition, the metal protection layer 200 is manufactured based on the original structure of the metal routing structure, so that the thickness of the touch module 10 and the thickness of the touch display screen are not increased.
It is understood that in other embodiments of the present application, the first metal trace 1101 and the second metal trace 1102 may also be fabricated into the metal protection layer 120 in different manners. For example, the first metal trace 1101 may adopt the first implementation to fabricate the metal protection layer 120, and the second metal trace 1102 may adopt the second implementation to fabricate the metal protection layer 120; or, the first metal routing 1102 may adopt the second implementation manner to fabricate the metal protection layer 120, and the second metal routing 1102 may adopt the first implementation manner to fabricate the metal protection layer 120.
Referring to fig. 15, an embodiment of the present invention further provides a touch display screen 1, where the touch display screen 1 includes the touch module 10, and the touch display screen 1 may further include a display panel 20, a polarizer 30, and a cover plate 40. The touch module 10 is located on the display panel 20, the polarizer 30 is located on a side of the touch module 10 away from the display panel 20, and the cover plate 40 is located on a side of the polarizer 30 away from the display panel 20. The metal routing structure 110 at a position, which is easily corroded, in the touch module 10 is provided with the metal protection layer 120, so that the metal routing structure 110 is protected, the metal routing structure 110 to be protected can be prevented from being corroded by water vapor or corrosive gas and the like, and the phenomenon of poor touch or abnormal display of the touch display screen 1 can be improved.
The touch module and the touch display screen that this application embodiment provided can be according to the different designs of touch display screen, and the metal that easily receives corrosion position department in the touch-control functional layer walks line structure and sets up the metal protection layer, walks line structure with the metal and protects to avoid protected metal structure to be corroded by steam or corrosive gas etc. influences the touch-control function of touch module, improves the phenomenon that touch function is bad after the touch display screen slimming. When all the metal wiring structures in the touch functional layer are provided with the metal protective layer, normal display of the touch display screen can be ensured.
The above description is only a preferred embodiment of the present application and is not intended to limit the present application, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present application shall be included in the protection scope of the present application.
Claims (6)
1. A touch module is characterized by comprising a touch functional layer, wherein the touch functional layer comprises a plurality of metal routing structures, and at least one metal routing structure is provided with a metal protection layer which at least covers one surface of the metal routing structure and is used for protecting the metal routing structure;
the touch module further comprises a buffer layer and an insulating layer, and the plurality of metal routing structures comprise a plurality of first metal routing positioned on the first metal layer and a plurality of second metal routing positioned on the second metal layer;
the first metal layer is positioned on one side of the buffer layer;
the insulating layer is positioned on one side of the first metal layer far away from the buffer layer;
the second metal layer is positioned on one side of the insulating layer far away from the first metal layer;
the metal protection layer comprises a third metal protection layer and a fourth metal protection layer;
the first metal routing comprises a first routing layer, a second routing layer and a third routing layer, the first routing layer is positioned on one side of the buffer layer, the second routing layer is positioned on one side of the first routing layer far away from the buffer layer, the third routing layer covers the surface of the second routing layer, which is not in contact with the first routing layer, the part of the third routing layer covering the side surface of the second routing layer is used as the third metal protection layer, wherein the third metal protection layer is a portion of the third routing layer covering the side of the second routing layer when the third routing layer is formed on the routing pattern formed by the first routing layer and the second routing layer, or the third metal protection layer is formed by etching the first metal wiring exposed on the side face of the second wiring layer and collapsing the third wiring layer relative to the extending part of the second wiring layer; and
the second metal routing comprises a fourth routing layer, a fifth routing layer and a sixth routing layer, the fourth routing layer is positioned on one side of the insulating layer, the fifth routing layer is positioned on one side, far away from the insulating layer, of the fourth routing layer, the sixth routing layer covers the surface, not in contact with the fourth routing layer, of the fifth routing layer, and the part, covered on the side face of the fifth routing layer, of the sixth routing layer is used as the fourth metal protection layer, wherein the part, covered on the side face of the fifth routing layer, of the sixth routing layer is covered by the sixth routing layer when the sixth routing layer is formed on a routing pattern formed by the fourth routing layer and the fifth routing layer; or the fourth metal protection layer is formed by etching the second metal routing exposed on the side surface of the fifth routing layer and collapsing the sixth routing layer relative to the extended part of the fifth routing layer.
2. The touch module of claim 1, wherein:
the orthographic projection of the second routing layer on the buffer layer is contained in the orthographic projection of the third routing layer on the buffer layer, and the orthographic projection of the third routing layer on the buffer layer is contained in the orthographic projection of the first routing layer on the buffer layer;
the orthographic projection of the fifth routing layer on the insulating layer is contained in the orthographic projection of the sixth routing layer on the insulating layer, and the orthographic projection of the sixth routing layer on the insulating layer is contained in the orthographic projection of the fourth routing layer on the insulating layer.
3. The touch module of any one of claims 1-2, wherein the first metal trace and the second metal trace are stacked metal structures, and the stacked metal structures include a first metal film layer, a second metal film layer, and a third metal film layer stacked in a direction perpendicular to the buffer layer, wherein the metal activity of the second metal film layer is stronger than the metal activity of the first metal film layer and the metal activity of the second metal film layer.
4. The touch module of claim 3, wherein the second metal film layer is made of Al, and the first metal film layer and the third metal film layer are made of Ti or Mo.
5. The touch module of claim 3, wherein the touch functional layer comprises a touch area and a non-touch area, and the plurality of metal trace structures comprise at least one of the following:
a touch pattern located in the touch area;
the touch lead is positioned in the touch area and the non-touch area and is connected with the touch electrode in the touch pattern; and
and the bonding pad is positioned in the non-touch area and connected with the touch lead.
6. A touch display screen, comprising the touch module of any one of claims 1-5.
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| CN113178456B (en) * | 2021-04-27 | 2022-09-23 | 昆山国显光电有限公司 | Display module, display panel and manufacturing method of display module |
| CN113270457A (en) * | 2021-05-13 | 2021-08-17 | 京东方晶芯科技有限公司 | Display panel, preparation method thereof, display device and splicing display device |
| CN113363304B (en) * | 2021-06-03 | 2022-09-13 | 武汉天马微电子有限公司 | Display panel and display device |
| CN113471219A (en) * | 2021-06-30 | 2021-10-01 | 云谷（固安）科技有限公司 | Metal wiring of semiconductor device and preparation method thereof |
| CN113725231B (en) * | 2021-08-20 | 2024-06-21 | 京东方科技集团股份有限公司 | Display panel, preparation method thereof, mask plate and display device |
| CN114153340A (en) * | 2021-12-29 | 2022-03-08 | 芜湖长信科技股份有限公司 | Touch screen wiring structure |
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