CN112416100A - Heat dissipation mechanism for computer host - Google Patents
Heat dissipation mechanism for computer host Download PDFInfo
- Publication number
- CN112416100A CN112416100A CN202011411963.2A CN202011411963A CN112416100A CN 112416100 A CN112416100 A CN 112416100A CN 202011411963 A CN202011411963 A CN 202011411963A CN 112416100 A CN112416100 A CN 112416100A
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- Prior art keywords
- shell
- circulating
- heat
- heat dissipation
- dissipation mechanism
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/18—Packaging or power distribution
- G06F1/183—Internal mounting support structures, e.g. for printed circuit boards, internal connecting means
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
- G06F2200/20—Indexing scheme relating to G06F1/20
- G06F2200/201—Cooling arrangements using cooling fluid
Abstract
The invention discloses a heat dissipation mechanism for a computer host, which comprises a shell, wherein the left side and the right side of the inside of the shell are respectively and vertically provided with a side frame, the outside of the left side and the right side of the shell is respectively provided with an air cooling device, the inside of the shell is horizontally and equidistantly provided with six integrated circuit board frames from top to bottom, the integrated circuit board frames are fixed through the left side frame and the right side frame, the inside of the shell is provided with a water cooling device, the water cooling device comprises a quick circulation device and six water-cooling heat conduction assemblies, the inside of the quick circulation device is also provided with an auxiliary refrigeration device, the middle part of the front end of the shell is provided with an auxiliary ventilation assembly, the device can continuously dissipate heat of the integrated circuit inside the computer host through the cooperation of the inner water cooling device and the auxiliary refrigeration device, the outer air cooling device can lead out, effectively control the indoor temperature environment.
Description
Technical Field
The invention relates to the computer heat dissipation industry, in particular to a heat dissipation mechanism for a computer host.
Background
The computer is commonly called as computer, is a modern electronic computing machine for high-speed computation, can perform numerical computation and logic computation, and also has the function of storage and memory. The computer is a modern intelligent electronic device which can run according to a program and automatically process mass data at a high speed, and consists of a hardware system and a software system, and a computer without any software is called a bare computer. The computer can be divided into five types, namely a super computer, an industrial control computer, a network computer, a personal computer and an embedded computer, more advanced computers comprise a biological computer, a photon computer, a quantum computer and the like, and a computer host is the most important component of the computer.
The inside heat abstractor that all is provided with of current large-scale computer host computer if the inside high temperature of computer host computer, can influence integrated circuit's operation, lead to the system operation unstable, reduce life, current computer host computer heat abstractor radiating effect is unsatisfactory, consequently, needs to develop a more mature heat dissipation mechanism for the computer host computer urgently.
Disclosure of Invention
The present invention is directed to a heat dissipation mechanism for a computer host, so as to solve the problems in the background art.
In order to achieve the purpose, the invention provides the following technical scheme:
a heat dissipation mechanism for a computer host comprises a shell, wherein a side frame is vertically arranged on the left side and the right side inside the shell respectively, an air cooling device is arranged on the outer portion of the left side and the right side of the shell respectively, six integrated circuit board frames are arranged in the shell from top to bottom at equal intervals, the integrated circuit board frames are fixed through the side frames on the left side and the right side, an integrated circuit board is electrically arranged on the integrated circuit board frames, a terminal port connected with the integrated circuit board is further arranged on the back of the shell, a water cooling device is arranged in the shell and comprises a quick circulation device and six water-cooling heat conduction assemblies, the water-cooling heat conduction assemblies are matched with the integrated circuit board frames for use, heat conduction silicone grease is further coated at the joints of the water-cooling heat conduction assemblies and the integrated circuit board frames, and the water-cooling heat conduction assemblies can perform water-cooling, cooperate outside air cooling device, more effectual derive inside heat the inside supplementary refrigerating plant that still installs of quick cycle device, supplementary refrigerating plant can accelerate the inside cooling rate of quick cycle device shell front end mid-mounting has supplementary subassembly of taking a breath, installs the PLC logic controller who is used for controlling this dress inside electrical equipment at this device inside electrical property the inside wireless transmitting module that is provided with of PLC logic controller is equipped with the wireless receiving module that the cooperation was used inside all the other electrical installation of device, and the control of PLC logic controller to device electrical equipment is accomplished to wireless transmitting module cooperation wireless receiving module.
As a further scheme of the invention: the air cooling device comprises a wind bin, an exhaust fan, an exhaust pipeline and a plate type heat exchanger, wherein the wind bin is communicated and installed at the top of the shell, the exhaust fan is installed outside the bottom of the shell, the wind bin is connected with the bottom exhaust fan through the exhaust pipeline, sealing rings are arranged at the joints of the exhaust pipeline, the wind bin and the exhaust fan, the plate type heat exchanger is installed on the exhaust pipeline, hot air in the shell is extracted out through the wind bin, the hot air enters the plate type heat exchanger through the exhaust pipeline, the temperature is reduced through the plate type heat exchanger, the exhaust temperature of the bottom exhaust fan is reduced, and the external.
As a further scheme of the invention: the rapid circulating device comprises a liquid storage tank, two first electric pump machines, two first connecting elbows, two circulating pipelines, a second electric pump machine and two second connecting elbows, the liquid storage tank is arranged at the bottom inside the shell, the two first electric pump machines are respectively arranged at the left side and the right side of the liquid storage tank, the two circulating pipelines are vertically inserted into side frames at the two sides, the bottom of each circulating pipeline is communicated with the first electric pump machine through the first connecting elbow, the second electric pump machine is arranged at the middle part of the top of the shell, the top of each circulating pipeline is communicated with the second electric pump machine through the second connecting elbow, the first electric pump machine at the bottom and the second electric pump machine at the top are independently used, when the preliminary liquid feeding is carried out, the second electric pump at the top plays a role in lifting, the circulating cooling liquid in the liquid storage tank at the bottom is lifted, after the lifting is finished, and closing the second electric pump at the top, and opening the first electric pumps at two sides of the bottom to match with the water-cooling heat-conducting components at all layers for circulating water-cooling heat dissipation.
As a further scheme of the invention: the water-cooling heat conduction assembly comprises a heat conduction frame, a liquid inlet valve, a liquid discharge valve and a U-shaped circulating pipe, wherein the U-shaped circulating pipe is installed inside the heat conduction frame, the U-shaped circulating pipe is communicated with a left circulating pipeline through a left liquid inlet valve, the U-shaped circulating pipe is communicated with a right circulating pipeline through a right liquid discharge valve, the liquid inlet valve and the liquid discharge valve are electromagnetic valves, independent on-off control can be realized by matching an internal control device, circulating cooling liquid enters the left circulating pipeline through a pump machine, then enters the U-shaped circulating pipe inside each layer of the heat conduction frame through each liquid inlet valve on the left side, takes away heat, leads the heat to the right circulating pipeline through each liquid discharge valve, and conducts reciprocating circulating cooling.
As a further scheme of the invention: supplementary refrigerating plant includes spacing, three waterproof grillage, three semiconductor refrigeration piece and three fixing base, spacing fixed mounting is at the liquid storage tank top, three waterproof grillage is installed inside the liquid storage tank through spacing equidistance, the semiconductor refrigeration piece sets up inside waterproof grillage, waterproof grillage passes through the bottom fixing base and is connected bottom the liquid storage tank, the long-time back that circulates of recirculated cooling liquid, can have the uniform temperature, influence the radiating effect, the inside semiconductor refrigeration piece of liquid storage tank can accelerate the cooling rate of the inside cooling liquid of liquid storage tank, guarantee whole water cooling plant's recirculated cooling effect.
As a further scheme of the invention: the auxiliary ventilation assembly comprises a door body and a dustproof net rack, the door body is installed in the middle of the front end of the shell, the dustproof net rack is installed in the middle of the door body, and a handle is further installed on the door body.
As a further scheme of the invention: and an insulating base is arranged at the bottom of the shell.
Compared with the prior art, the invention has the beneficial effects that: this device reasonable in design can last water-cooling circulation heat dissipation to the inside integrated circuit of host computer through supplementary refrigerating plant of inside water cooling plant cooperation, and outside air cooling device can derive inside heat, carries out reasonable cooling to the gas of deriving simultaneously, and effective control room temperature environment has improved the not enough of current device, has higher practicality and market prospect, is fit for using widely on a large scale.
Drawings
Fig. 1 is a schematic diagram of an external structure of a heat dissipation mechanism for a computer host.
Fig. 2 is a schematic diagram of an internal structure of a heat dissipation mechanism for a computer host.
Fig. 3 is a partial schematic view of a heat dissipation mechanism for a computer host at a.
Fig. 4 is a schematic structural diagram of a water-cooling heat-conducting component in a heat dissipation mechanism for a computer host.
In the figure: 1-shell, 2-air cooling device, 3-side frame, 4-integrated circuit board frame, 5-water cooling device, 6-rapid circulating device, 7-water cooling heat conducting component, 8-auxiliary refrigerating device, 9-auxiliary ventilation component, 10-insulating base, 201-air cabin, 202-exhaust fan, 203-exhaust pipeline, 204-plate heat exchanger, 205-sealing ring, 601-liquid storage tank, 602-first electric pump machine, 603-first connecting elbow, 604-circulating pipeline, 605-second electric pump machine, 606-second connecting elbow, 701-heat conducting frame, 702-liquid inlet valve, 703-liquid outlet valve, 704-U type circulating pipe, 801-limiting frame, 802-waterproof, 803-semiconductor refrigerating sheet, 804-a fixed seat, 901-a door body, 902-a dustproof net rack and 903-a handle.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Reference will now be made in detail to embodiments of the present patent, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are exemplary only for the purpose of explaining the present patent and are not to be construed as limiting the present patent.
In the description of this patent, it is to be understood that the terms "center," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like are used in the orientations and positional relationships indicated in the drawings for the convenience of describing the patent and for the simplicity of description, and are not intended to indicate or imply that the referenced devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and are not to be considered limiting of the patent. In the description of this patent, it is noted that unless otherwise specifically stated or limited, the terms "mounted," "connected," and "disposed" are to be construed broadly and can include, for example, fixedly connected, disposed, detachably connected, disposed, or integrally connected and disposed. The specific meaning of the above terms in this patent may be understood by those of ordinary skill in the art as appropriate.
The first embodiment is as follows:
referring to fig. 1 to 4, in the embodiment of the present invention, a heat dissipation mechanism for a computer host includes a housing 1, a side frame 2 is vertically installed on each of left and right sides inside the housing 1, an air cooling device 2 is installed outside each of left and right sides of the housing 1, six ic board frames 4 are horizontally installed inside the housing 1 from top to bottom at equal intervals, the ic board frames 4 are fixed by the side frames 2 on the left and right sides, an ic board is electrically installed on the ic board frames 4, a terminal port (not shown in the figure) connected to the ic board is further provided on the back of the housing 1, a water cooling device 5 is installed inside the housing 1, the water cooling device 5 includes a fast circulation device 6 and six water-cooling heat conduction assemblies 7, the water-cooling heat conduction assemblies 7 are used in cooperation with the ic board frames 4, the connection part of the water-cooling heat-conducting component 7 and the integrated circuit board frame 4 is also coated with heat-conducting silicone grease, the water-cooling heat-conducting component 7 can carry out water-cooling heat dissipation on a plurality of integrated circuit board frames inside, the water-cooling heat-conducting component 7 is matched with the outside air cooling device 2 to more effectively lead out the internal heat, the inside of the rapid circulating device 6 is also provided with an auxiliary refrigerating device 8, the auxiliary refrigerating device 8 can accelerate the internal cooling speed of the rapid circulating device 6, the middle part of the front end of the shell 1 is provided with an auxiliary air exchange component 9, the inside of the device is electrically provided with a PLC logic controller (not shown in the figure) for controlling the internal electrical equipment of the device, the inside of the PLC logic controller is provided with a wireless transmitting module, the inside of the other electrical devices in the device is provided with a wireless receiving module which is matched with the wireless receiving, in the scheme, other electrical components are connected with a power supply matched with the electrical components through a lead, and a proper control device is selected according to actual conditions so as to meet control requirements.
Example two:
in this embodiment, the air cooling device 2 includes a wind bin 201, an exhaust fan 202, an exhaust duct 203 and a plate heat exchanger 204, the wind bin 201 is installed at the top of the housing 1 in a communicating manner, the exhaust fan 202 is installed at the outer side of the bottom of the housing 1, the wind bin 201 is connected with the bottom exhaust fan 202 through the exhaust duct 203, sealing rings 205 are arranged at the joints of the exhaust duct 203, the wind bin 201 and the exhaust fan 202, the plate heat exchanger 204 is installed on the exhaust duct 203, the exhaust fan 202 extracts hot air inside the housing 1 through the wind bin 201, the hot air enters the plate heat exchanger 204 through the exhaust duct 203, and is cooled through the plate heat exchanger, so that the exhaust temperature of the bottom exhaust fan 202 is reduced; the rapid circulating device 6 comprises a liquid storage tank 601, two first electric pumps 601, two first connecting elbows 603, two circulating pipelines 604, a second electric pump 605 and two second connecting elbows 606, wherein the liquid storage tank 601 is arranged at the bottom inside the shell 1, the two first electric pumps 601 are respectively arranged at the left side and the right side of the liquid storage tank 601, the two circulating pipelines 604 are vertically inserted into the side frames 3 at the two sides, the bottom of the circulating pipeline 604 is communicated with the first electric pump 605 through the first connecting elbow 603, the second electric pump 605 is arranged at the middle part of the top of the shell 1, the top of the circulating pipeline 604 is communicated with the second electric pump 605 through the second connecting elbow 606, the bottom first electric pump 602 and the top second electric pump 605 are independently used, when primary liquid feeding is carried out, the top second electric pump 605 plays a lifting role to lift the circulating cooling liquid inside the liquid storage tank 601 at the bottom, after lifting is finished, the second electric pump 605 at the top is closed, and the first electric pumps 602 at two sides of the bottom are opened to cooperate with the water-cooling heat-conducting components 7 at each layer for circulating water-cooling heat dissipation; the water-cooling heat conduction assembly 7 comprises a heat conduction frame 701, a liquid inlet valve 702, a liquid discharge valve 703 and a U-shaped circulation pipe 704, wherein the U-shaped circulation pipe 704 is installed inside the heat conduction frame 701, the U-shaped circulation pipe 704 is communicated with a left circulation pipeline 604 through the left liquid inlet valve 702, the U-shaped circulation pipe 704 is communicated with a right circulation pipeline 604 through the right liquid discharge valve 703, the liquid inlet valve 702 and the liquid discharge valve 703 are both electromagnetic valves, and can be independently controlled by being matched with an internal control device, circulating cooling liquid enters the left circulation pipeline 604 through a pump, then enters the U-shaped circulation pipe 704 inside each layer of heat conduction frame 701 through each liquid inlet valve 702 on the left side, takes heat away, is led out to the right circulation pipeline 604 through each liquid discharge valve 703, and performs reciprocating circulating cooling on each.
Example three:
in this embodiment, the auxiliary refrigeration device 8 includes a limiting frame 801, three waterproof plate frames 802, three semiconductor refrigeration sheets 803 and three fixing seats 804, the limiting frame 801 is fixedly installed at the top of the liquid storage tank 601, the three waterproof plate frames 802 are equidistantly installed inside the liquid storage tank 601 through the limiting frame 801, the semiconductor refrigeration sheets 803 are arranged inside the waterproof plate frames 802, the waterproof plate frames 802 are connected with the bottom of the liquid storage tank 601 through the bottom fixing seats 804, after circulating cooling liquid circulates for a long time, a certain temperature is achieved, the heat dissipation effect is affected, the semiconductor refrigeration sheets 603 inside the liquid storage tank 601 can accelerate the cooling speed of the cooling liquid inside the liquid storage tank 601, and the circulating cooling effect of the integral water cooling device 5 is ensured; the auxiliary ventilation assembly 9 comprises a door body 901 and a dustproof net rack 902, the door body 901 is installed in the middle of the front end of the shell 1, the dustproof net rack 902 is installed in the middle of the door body 901, a handle 903 is further installed on the door body 901, and an insulating base 10 is arranged at the bottom of the shell 1.
The working principle of the invention is as follows: the integrated circuit board is electrically installed on the integrated circuit board frame 4, a terminal port (not shown in the figure) connected with the integrated circuit board is further arranged at the back of the shell 1, the water-cooling heat-conducting component 7 is matched with the integrated circuit board frame 4 for use, heat-conducting silicone grease is further coated at the joint of the water-cooling heat-conducting component 7 and the integrated circuit board frame 4, the water-cooling heat-conducting component 7 can carry out water-cooling heat dissipation on a plurality of internal integrated circuit board frames and is matched with the outside air cooling device 2 to more effectively lead out internal heat, the bottom first electric pump machine 602 and the top second electric pump machine 605 are independently used, when primary liquid feeding is carried out, the top second electric pump machine 605 plays a lifting role to lift the circulating cooling liquid in the bottom liquid storage tank 601, after lifting is finished, the top second electric pump machine 605 is closed, the first electric pump machines 602 at two sides of the bottom are opened and are matched with each layer of water-, the liquid inlet valves 702 and the liquid outlet valves 703 are electromagnetic valves, and can be independently switched and controlled by matching with an internal control device, circulating cooling liquid enters the left circulating pipeline 604 through a pump, then enters the U-shaped circulating pipeline 704 in each layer of heat conducting frame 701 through each liquid inlet valve 702 on the left, takes heat away, is guided out to the right circulating pipeline 604 through each liquid outlet valve 703, and carries out reciprocating circulating cooling on each layer of integrated circuits, and after circulating cooling liquid circulates for a long time, the circulating cooling liquid has a certain temperature and influences the heat dissipation effect, and the semiconductor refrigeration sheets 603 in the liquid storage tank 601 can accelerate the cooling speed of the cooling liquid in the liquid storage tank 601, so that the circulating cooling effect of the whole water cooling device 5 is ensured; exhaust fan 202 takes out the inside steam of shell 1 through wind storehouse 201, and steam passes through exhaust duct 203 and gets into plate heat exchanger 204 in, cools down through plate heat exchanger, reduces bottom exhaust fan 202 exhaust temperature, effectively reduces outside ambient temperature.
Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.
Claims (7)
1. A heat dissipation mechanism for a computer host comprises a shell (1) and is characterized in that, the left side and the right side of the inside of the shell (1) are respectively and vertically provided with a side frame (2), the air cooling devices (2) are respectively arranged outside the left side and the right side of the shell (1), six integrated circuit board frames (4) are horizontally arranged in the shell (1) from top to bottom at equal intervals, the integrated circuit board frame (4) is fixed by the left and right side frames (2), a water cooling device (5) is arranged in the shell (1), the water cooling device (5) comprises a rapid circulating device (6) and six water-cooling heat-conducting components (7), an auxiliary refrigerating device (8) is also arranged in the rapid circulating device (6), and an auxiliary air exchange assembly (9) is arranged in the middle of the front end of the shell (1).
2. The heat dissipation mechanism for the host computer of claim 1, wherein the air cooling device (2) comprises a wind bin (201), a suction fan (202), an exhaust duct (203) and a plate heat exchanger (204);
the wind bin (201) is communicated and installed at the top of the shell (1), the exhaust fan (202) is installed at the outer side of the bottom of the shell (1), the wind bin (201) is connected with the bottom exhaust fan (202) through an exhaust pipeline (203), sealing rings (205) are arranged at the joints of the exhaust pipeline (203), the wind bin (201) and the exhaust fan (202), and the plate-type heat exchanger (204) is installed on the exhaust pipeline (203).
3. The heat dissipation mechanism for the host computer according to claim 2, wherein the rapid circulation device (6) comprises a liquid storage tank (601), two first electric pumps (601), two first connecting elbows (603), two circulation pipes (604), a second electric pump (605), and two second connecting elbows (606);
the liquid storage tank (601) is arranged at the bottom inside the shell (1), the two first electric pump machines (601) are respectively arranged at the left side and the right side of the liquid storage tank (601), the two circulating pipelines (604) are vertically inserted into the side frames (3) at the two sides, the bottom of each circulating pipeline (604) is communicated with the first electric pump machine (605) through a first connecting elbow (603), the second electric pump machine (605) is arranged at the middle part of the top of the shell (1), and the top of each circulating pipeline (604) is communicated with the second electric pump machine (605) through a second connecting elbow (606).
4. The heat dissipation mechanism for the host computer of claim 3, wherein the water-cooling heat conduction assembly (7) comprises a heat conduction frame (701), a liquid inlet valve (702), a liquid outlet valve (703) and a U-shaped circulation pipe (704);
the U-shaped circulating pipe (704) is installed inside the heat conducting frame (701), the U-shaped circulating pipe (704) is communicated with the left circulating pipeline (604) through the left liquid inlet valve (702), and the U-shaped circulating pipe (704) is communicated with the right circulating pipeline (604) through the right liquid outlet valve (703).
5. The heat dissipation mechanism for the host computer of claim 4, wherein the auxiliary refrigeration device (8) comprises a limit frame (801), three waterproof plate frames (802), three semiconductor refrigeration sheets (803) and three fixing seats (804);
spacing (801) fixed mounting is at liquid reserve tank (601) top, and three waterproof grillage (802) are installed inside liquid reserve tank (601) through spacing (801) equidistance, and semiconductor refrigeration piece (803) set up inside waterproof grillage (802), and waterproof grillage (802) are connected bottom liquid reserve tank (601) through bottom fixing base (804).
6. The heat dissipation mechanism for the host computer of claim 5, wherein the auxiliary ventilation assembly (9) comprises a door body (901) and a dustproof net rack (902);
the door body (901) is arranged in the middle of the front end of the shell (1), the dustproof net rack (902) is arranged in the middle of the door body (901), and the door body (901) is also provided with a handle (903).
7. The heat dissipating mechanism for a computer main body according to claim 6, wherein an insulating base (10) is provided at the bottom of the case (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011411963.2A CN112416100A (en) | 2020-12-03 | 2020-12-03 | Heat dissipation mechanism for computer host |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011411963.2A CN112416100A (en) | 2020-12-03 | 2020-12-03 | Heat dissipation mechanism for computer host |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112416100A true CN112416100A (en) | 2021-02-26 |
Family
ID=74830436
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011411963.2A Withdrawn CN112416100A (en) | 2020-12-03 | 2020-12-03 | Heat dissipation mechanism for computer host |
Country Status (1)
| Country | Link |
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| CN (1) | CN112416100A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112965581A (en) * | 2021-03-08 | 2021-06-15 | 山东商智伙伴网络科技有限公司 | Server stability auxiliary device for software back-end big data operation |
-
2020
- 2020-12-03 CN CN202011411963.2A patent/CN112416100A/en not_active Withdrawn
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112965581A (en) * | 2021-03-08 | 2021-06-15 | 山东商智伙伴网络科技有限公司 | Server stability auxiliary device for software back-end big data operation |
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Application publication date: 20210226 |
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