CN112415654A - Grating array coupling packaging structure - Google Patents
Grating array coupling packaging structure Download PDFInfo
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- CN112415654A CN112415654A CN202011319532.3A CN202011319532A CN112415654A CN 112415654 A CN112415654 A CN 112415654A CN 202011319532 A CN202011319532 A CN 202011319532A CN 112415654 A CN112415654 A CN 112415654A
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- 238000010168 coupling process Methods 0.000 title claims abstract description 101
- 238000005859 coupling reaction Methods 0.000 title claims abstract description 101
- 238000004806 packaging method and process Methods 0.000 title abstract description 18
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
- G02B6/12007—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind forming wavelength selective elements, e.g. multiplexer, demultiplexer
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
- G02B6/12007—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind forming wavelength selective elements, e.g. multiplexer, demultiplexer
- G02B6/12009—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind forming wavelength selective elements, e.g. multiplexer, demultiplexer comprising arrayed waveguide grating [AWG] devices, i.e. with a phased array of waveguides
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
- G02B2006/12083—Constructional arrangements
- G02B2006/12107—Grating
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
- G02B2006/12133—Functions
- G02B2006/12147—Coupler
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Optical Couplings Of Light Guides (AREA)
Abstract
The embodiment of the invention provides a grating array coupling packaging structure, which comprises: the optical integrated circuit comprises an optical substrate, a first optical fiber and a photonic integrated chip; wherein the first optical fiber is received on the optical substrate; the first optical fiber is used for transmitting optical signals and comprises an optical outlet for outputting the optical signals; the photonic integrated chip comprises a grating coupling element and a waveguide element; a light reflecting surface is formed on the optical substrate at the light outlet close to the first optical fiber; an included angle between the normal of the light reflection surface and the transmission direction of the optical signal is an acute angle; the light reflecting surface is used for reflecting the optical signal output from the light outlet into the grating coupling element; the grating coupling element transmits the reflected optical signal to the waveguide element; the mode field of the grating coupling element matches the mode field of the reflected optical signal.
Description
Technical Field
The invention relates to the field of semiconductor packaging, in particular to a grating array coupling packaging structure.
Background
The silicon photonic technology is based on silicon materials, utilizes the existing CMOS technology to develop and integrate optical devices, and plays an extremely critical role in many fields such as optical communication, data centers, super computing, biology, national defense, AR/VR technology, intelligent automobiles, unmanned aerial vehicles and the like. Countries such as the united states of america have been invested and accumulated in the field of silicon photonics for over a decade and have formed industrial advantages. LightCounting predicts that silicon-only photonics in the product market in the field of optical communications will reach over 10 billion dollars in five years. The market for silicon photonics will far exceed this figure within one and two decades in the future.
The current silicon photonic technology is mature day by day, the advantages of high integration level, small size, low power consumption, photoelectric integration and the like are attracted attention, the future silicon photonic technology is possible to replace the current free space coupling technology, and the silicon photonic technology has the capability of solving long-term technical evolution (high speed and high integration level) and cost contradiction.
However, in the packaging process of the silicon photonic device or module, the problems of complex coupling structure, large coupling loss, complex packaging process, poor stability, high cost and the like exist.
Disclosure of Invention
Accordingly, the present invention is directed to a grating array coupling package structure that solves at least one of the problems set forth in the background art.
In order to achieve the purpose, the technical scheme of the invention is realized as follows:
the embodiment of the invention provides a grating array coupling packaging structure, which comprises: the optical integrated circuit comprises an optical substrate, a first optical fiber and a photonic integrated chip; wherein the content of the first and second substances,
the first optical fiber is accommodated on the optical substrate; the first optical fiber is used for transmitting optical signals and comprises an optical outlet for outputting the optical signals;
the photonic integrated chip comprises a grating coupling element and a waveguide element;
a light reflecting surface is formed on the optical substrate at the light outlet close to the first optical fiber; an included angle between the normal of the light reflection surface and the transmission direction of the optical signal is an acute angle; the light reflecting surface is used for reflecting the optical signal output from the light outlet into the grating coupling element;
the grating coupling element transmits the reflected optical signal to the waveguide element; the mode field of the grating coupling element matches the mode field of the reflected optical signal.
In the above aspect, the optical substrate includes an antireflection film formed on the light reflection surface.
In the above solution, the grating array coupling package structure further includes: and the medium is positioned between the light outlet of the first optical fiber and the light reflecting surface of the optical substrate and comprises air or ultraviolet glue.
In the above solution, the optical substrate has a V-shaped groove; the first optical fiber is accommodated in the V-groove.
In the above solution, the grating array coupling package structure further includes: a second optical fiber; the first optical fiber is accommodated in a first area of the optical substrate; the optical substrate further comprises a second region contiguous with the first region;
the second optical fiber is accommodated in the second region; the second optical fiber is in contact with the first optical fiber to transmit the optical signal to the first optical fiber.
In the above aspect, the core diameter of the first optical fiber is less than 100 μm.
In the above solution, an included angle between the sidewall of the V-shaped groove and a normal of the bottom surface of the optical substrate is 54.74 °.
In the above scheme, the optical substrate further includes a glue guiding groove located between the V-shaped groove and the light reflecting surface; the depth of the glue guide groove is greater than that of the V-shaped groove;
the glue guide groove is used for guiding adhesive so as to fix the first optical fiber on the optical substrate.
In the above solution, a surface of the first optical fiber, which is far away from the optical substrate, is in contact with a surface of the photonic integrated chip on which the grating coupling element is disposed; the method comprises the following steps:
and the surface of the first optical fiber, which is far away from the optical substrate, and the surface of the photonic integrated chip, which is provided with the grating coupling element, are mounted in an active alignment mode.
The embodiment of the invention provides a grating array coupling packaging structure, which comprises: the optical integrated circuit comprises an optical substrate, a first optical fiber and a photonic integrated chip; wherein the first optical fiber is received on the optical substrate; the first optical fiber is used for transmitting optical signals and comprises an optical outlet for outputting the optical signals; the photonic integrated chip comprises a grating coupling element and a waveguide element; a light reflecting surface is formed on the optical substrate at the light outlet close to the first optical fiber; an included angle between the normal of the light reflection surface and the transmission direction of the optical signal is an acute angle; the light reflecting surface is used for reflecting the optical signal output from the light outlet into the grating coupling element; the grating coupling element transmits the reflected optical signal to the waveguide element; the mode field of the grating coupling element matches the mode field of the reflected optical signal. In the embodiment of the invention, the optical signal output from the first optical fiber can be reflected by the light reflecting surface to enter the grating coupling element, so that the mode field of the optical signal entering the grating coupling element after being reflected by the light reflecting surface is matched with the mode field of the grating coupling element. Therefore, the device has the advantages of low coupling loss, high reliability, simpler packaging process and high integration level.
Drawings
Fig. 1 is a cross-sectional view of a grating array coupling package structure according to an embodiment of the present invention;
fig. 2 is a top view of a grating array assembly in a grating array coupled package structure according to an embodiment of the present invention;
fig. 3 is a cross-sectional view of a grating array assembly in a grating array coupling package structure according to an embodiment of the present invention, taken along the direction of the dotted line a-a' in fig. 2;
fig. 4 is a cross-sectional view of a grating array assembly in a grating array coupling package structure according to an embodiment of the present invention, taken along the direction of the dotted line B-B' in fig. 2;
FIG. 5 is an enlarged view of a grating array coupled package structure provided in accordance with an embodiment of the present invention, taken along the dashed line in FIG. 1;
fig. 6a to 6d are schematic cross-sectional views of device structures of a grating array coupling package provided in the preparation process according to an embodiment of the present invention.
Description of reference numerals:
100-a grating array assembly; 10-an optical substrate; 11-a first region; 12-a second region; a 111-V groove;
112-glue guiding groove; 113-a light reflecting surface;
21-a first optical fiber; 22-a second optical fiber;
30-a reflection increasing film;
40-glue;
50-a photonic integrated chip; 51-a bottom silicon layer; 52-buried oxide layer; 53-top silicon layer; 60-grating coupling element.
Detailed Description
Exemplary embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings. While exemplary embodiments of the invention are shown in the drawings, it should be understood that the invention may be embodied in various forms and should not be limited to the specific embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art.
In the following description, numerous specific details are set forth in order to provide a more thorough understanding of the present invention. It will be apparent, however, to one skilled in the art, that the present invention may be practiced without one or more of these specific details. In other instances, well-known features have not been described in order to avoid obscuring the present invention; that is, not all features of an actual embodiment are described herein, and well-known functions and structures are not described in detail.
In the drawings, the size of layers, regions, elements, and relative sizes may be exaggerated for clarity. Like reference numerals refer to like elements throughout.
It will be understood that when an element or layer is referred to as being "on" … …, "adjacent to … …," "connected to" or "coupled to" other elements or layers, it can be directly on, adjacent to, connected to or coupled to the other elements or layers or intervening elements or layers may be present. In contrast, when an element is referred to as being "directly on … …," "directly adjacent to … …," "directly connected to" or "directly coupled to" other elements or layers, there are no intervening elements or layers present. It will be understood that, although the terms first, second, third, etc. may be used to describe various elements, components, regions, layers and/or sections, these elements, components, regions, layers and/or sections should not be limited by these terms. These terms are only used to distinguish one element, component, region, layer or section from another element, component, region, layer or section. Thus, a first element, component, region, layer or section discussed below could be termed a second element, component, region, layer or section without departing from the teachings of the present invention. And the discussion of a second element, component, region, layer or section does not necessarily imply that a first element, component, region, layer or section is present in the invention.
Spatial relationship terms such as "under … …", "under … …", "below", "under … …", "above … …", "above", and the like, may be used herein for ease of description to describe the relationship of one element or feature to another element or feature as illustrated in the figures. It will be understood that the spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if the device in the figures is turned over, then elements or features described as "below" or "beneath" other elements or features would then be oriented "above" the other elements or features. Thus, the exemplary terms "below … …" and "below … …" can encompass both an orientation of up and down. The device may be otherwise oriented (rotated 90 degrees or at other orientations) and the spatial descriptors used herein interpreted accordingly.
The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms "comprises" and/or "comprising," when used in this specification, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof. As used herein, the term "and/or" includes any and all combinations of the associated listed items.
In the following description, for the purposes of explanation, numerous specific details are set forth in order to provide a thorough understanding of the present invention. The following detailed description of the preferred embodiments of the invention, however, the invention is capable of other embodiments in addition to those detailed.
The embodiment of the invention provides a grating array coupling packaging structure, which comprises: the optical integrated circuit comprises an optical substrate, a first optical fiber and a photonic integrated chip; wherein the first optical fiber is received on the optical substrate; the first optical fiber is used for transmitting optical signals and comprises an optical outlet for outputting the optical signals; the photonic integrated chip comprises a grating coupling element and a waveguide element; a light reflecting surface is formed on the optical substrate at the light outlet close to the first optical fiber; an included angle between the normal of the light reflection surface and the transmission direction of the optical signal is an acute angle; the light reflecting surface is used for reflecting the optical signal output from the light outlet into the grating coupling element; the grating coupling element transmits the reflected optical signal to the waveguide element; the mode field of the grating coupling element matches the mode field of the reflected optical signal.
Please refer to fig. 1-3 in detail.
As shown, the grating array coupling package structure includes an optical substrate 10; the optical substrate 10 comprises a first region 11.
In some embodiments, the optical substrate 10 may be a silicon substrate. It should be understood that the silicon substrate is only a low-level, feasible embodiment in the embodiment of the present invention, and is not limited to the application, and the optical substrate may also be a substrate made of other materials.
A first optical fiber 21 located on the first region 11; the first optical fiber 21 is used for transmitting optical signals.
Specifically, as shown in fig. 4, the optical substrate 10 has a V-groove 111 on the first region 11; the first optical fiber 21 is accommodated in the V-groove 111; the V-grooves 111 correspond to the first optical fibers 21 one to one. Therefore, the whole packaging height of the provided grating array coupling packaging structure is reduced, the assembly structure is compact, the modularization integration is easy, and the production cost is reduced.
The angle between the sidewall of the V-groove 111 and the normal of the bottom surface of the optical substrate 10 is 54.74 °.
The number of the V-shaped grooves 111 is greater than or equal to 1.
Here, when the number of the V-grooves 111 is equal to 1, single-channel grating coupling packaging can be realized; when the number of the V-shaped grooves 111 is more than 1, array grating coupling packaging can be achieved.
In some embodiments, the first optical fiber 21 is a bare fiber.
The optical substrate 10 is provided with a light reflecting surface 113 at a light outlet close to the first optical fiber 21; the normal of the light reflecting surface 113 forms an acute angle with the transmission direction of the optical signal.
The optical substrate 10 further comprises a reflection increasing film 30 formed on the light reflecting surface 113; the reflection increasing film 30 is beneficial to increasing the reflectivity of light rays in different media and improving the coupling efficiency.
Here, the reflection increasing film 30 may include a dielectric reflection increasing film or a metal reflection increasing film.
The optical substrate 10 further includes a glue guiding groove 112 located between the V-shaped groove 111 and the light reflecting surface 113; the depth of the glue guide groove 112 is greater than that of the V-shaped groove 111; the glue guide groove 112 is used for guiding the adhesive 40 to fix the first optical fiber 21 on the optical substrate 10.
Specifically, when fixing first optical fiber 21, to leading-in adhesive 40 in the glue guide groove 112, adhesive 40 follows glue guide groove 112 directional flow, through the surface towards the V-shaped groove 111 opening to first optical fiber 21 exert pressure, make first optical fiber 21 with the lateral wall of V-shaped groove 111 is hugged closely, simultaneously with adhesive 40 bonds, prevents that adhesive 40 from permeating to the surface towards the V-shaped groove 111 opening of first optical fiber 21, makes its surface unevenness, when subsequent pastes the dress with photon integrated chip 50, can't laminate well, influences the degree of match of the mode field of grating coupling element 60 and the mode field of the light signal after the reflection.
In some embodiments, the adhesive 40 may be an ultraviolet adhesive. It should be understood that the ultraviolet glue is only used as a next-generation, possible specific implementation manner in the embodiment of the present invention, and is not limited to the present application.
The grating array coupling packaging structure further comprises: a medium located between the light outlet of the first optical fiber 21 and the light reflecting surface 113 of the optical substrate 10, wherein the medium includes air or ultraviolet glue.
In some embodiments, the medium between the light outlet of the first optical fiber 21 and the light reflecting surface 113 of the optical substrate 10 is air. The formula is calculated according to the optical path difference of the optical signal from the light outlet of the first optical fiber 21 to the surface of the grating coupling element 60:
L1≈n1·d1/tanα(1)
in the formula (1), L1 is the optical path length difference between the optical signal from the light exit of the first optical fiber 21 to the surface of the grating coupling element 60, n1 is the refractive index of the medium, d1 is the core diameter of the first optical fiber 21, and α is the angle between the light reflecting surface 113 and the surface of the grating coupling element 60, as shown in fig. 5. When the medium is air, the refractive index n1 of the medium is the smallest, so that the optical path difference L1 between the optical signal from the light outlet of the first optical fiber 21 and the surface of the grating coupling element 60 is the smallest, and the mode field of the reflected optical signal is the best matched with the mode field of the grating coupling element.
In the embodiment of the present invention, the first optical fiber 21 is a small core diameter optical fiber, and the core diameter of the first optical fiber 21 is smaller than 100 μm, which is favorable for reducing the optical path difference of the optical signal from the light outlet of the first optical fiber to the surface of the grating coupling element.
In other embodiments, the medium between the light outlet of the first optical fiber 21 and the light reflecting surface 113 of the optical substrate 10 is ultraviolet glue. When the medium is ultraviolet glue, the grating array coupling structure can realize non-airtight packaging and is insensitive to external water vapor interference.
In an embodiment of the present invention, the grating array coupling package structure further includes: a second optical fiber 22; the first optical fiber 21 is accommodated in the first region 11 of the optical substrate 10; the optical substrate 10 further comprises a second region 12 contiguous to the first region 11; the second optical fiber 22 is accommodated in the second region 12; the second optical fiber 22 is in contact with the first optical fiber 21 to transmit the optical signal to the first optical fiber 21.
The second optical fiber 22 is fixed to the second region 12 by an adhesive.
In some embodiments, the second optical fiber 22 is a coated optical fiber.
A photonic integrated chip 50, the photonic integrated chip 50 including a grating coupling element 60; the grating coupling element 60 is located on the upper surface of the photonic integrated chip 50.
The photonic integrated chip 50 includes a bottom silicon layer 51, a buried oxide layer 52, and a top silicon layer 53. The buried oxide layer 52 is positioned on the bottom silicon layer 51, and the material of the buried oxide layer 52 comprises silicon dioxide; the top silicon layer 53 is located on the buried oxide layer 52.
Here, the grating coupling element 60 is located within the top silicon layer 53.
It should be noted that other elements (not shown in the drawings) such as waveguide elements are also included in the photonic integrated chip 50.
The light reflecting surface 113 reflects the optical signal, and the reflected optical signal is coupled into the grating coupling element 60; the surface of the first optical fiber 21 far away from the optical substrate 10 is in contact with the surface of the photonic integrated chip 50 provided with the grating coupling element 60; the mode field of the grating coupling element 60 matches the mode field of the reflected optical signal.
The surface of the first optical fiber 21 far away from the optical substrate 10 is in contact with the surface of the photonic integrated chip 50 provided with the grating coupling element 60; the method comprises the following steps: the surface of the first optical fiber 21 far away from the optical substrate 10 and the surface of the photonic integrated chip 50 provided with the grating coupling element 60 are mounted in an active alignment manner, so that the center alignment of the reflected optical signal and the grating coupling element is ensured.
As shown in fig. 1, the surface of the first optical fiber 21 away from the optical substrate 10 and the surface of the photonic integrated chip 50 on which the grating coupling element 60 is disposed are mounted by inverting the entire grating array assembly 100 and mounting the grating array assembly on the surface of the photonic integrated chip 50 on which the grating coupling element 60 is disposed.
In some embodiments, the beam waist radius of an optical signal having a wavelength λ that reaches the surface of the grating coupling element 60 is given by the formula:
in the formula (2), w0L1 is the beam waist radius of the light exit end face of the first optical fiber 21, and is the optical path length difference of the optical signal in the formula (1) from the light exit of the first optical fiber 21 to the surface of the grating coupling element 60. In the embodiment of the present invention, the core diameter of the first optical fiber 21 is d1, where d1 is 80 μm, α is 54.74 °, λ is 1.55 μm, and w is010 μm, the medium is filled with air, so n1 is 1, and according to equations (1) and (2), the beam waist radius w (z) of the optical signal reaching the surface of the grating coupling element 60 is 15 μm, which matches the parameters of a conventionally designed grating coupling element.
The embodiment of the invention also provides a preparation method of the grating array coupling packaging structure.
The following describes the manufacturing method of the grating array coupling package structure in detail with reference to specific embodiments.
Fig. 6a to 6d are schematic cross-sectional views of device structures of a grating array coupling package provided in the preparation process according to an embodiment of the present invention.
First, referring to fig. 6a, an optical substrate 10 is provided.
The optical substrate 10 is a silicon substrate.
The optical substrate 10 comprises a first region 11; etching the first area 11 to form a V-shaped groove 111, a glue guide groove 112 and a light reflection surface 113; the glue guide groove 112 is located between the V-shaped groove 111 and the light reflection surface 113.
Specifically, a plurality of dry etching or wet etching processes may be used to etch the surface of the first region 11, so as to form the V-shaped groove 111 and the light reflecting surface 113; and forming a glue guide groove 112 by performing wet etching on the first region 11 in the region between the V-shaped groove 111 and the light reflecting surface 113.
The depth of the glue guide groove 112 is greater than that of the V-shaped groove 111.
The number of the V-shaped grooves 111 is greater than or equal to 1.
The angle between the sidewall of the V-groove 111 and the normal of the bottom surface of the optical substrate 10 is 54.74 °.
An antireflection film 30 is formed on the light reflection surface 113. Specifically, the dielectric antireflection film may be formed by an evaporation process; alternatively, the metal reflection increasing film is formed by a sputtering process.
The optical substrate 10 further comprises a second region 12 adjoining the first region 11.
Next, with reference to fig. 6b, a first optical fiber 21 is placed on said first region 11; the first optical fiber 21 is used for transmitting optical signals.
Specifically, a first optical fiber 21 is placed in the V-groove 111; by introducing the adhesive 40 into the adhesive guide groove 112 and applying pressure to the surface of the first optical fiber 21 facing the opening of the V-shaped groove 111, the first optical fiber 21 is tightly attached to the sidewall of the V-shaped groove 111 and is bonded with the adhesive 40, so that the adhesive 40 is prevented from penetrating into the surface of the first optical fiber 21 facing the opening of the V-shaped groove 111, and the bonding firmness is ensured.
In the embodiment of the present invention, the adhesive 40 may be an ultraviolet adhesive; and curing the ultraviolet glue by an ultraviolet lamp.
The core diameter of the first optical fiber 21 is less than 100 μm.
The light reflecting surface 113 is formed at the light outlet close to the first optical fiber 21; the normal of the light reflecting surface 113 forms an acute angle with the transmission direction of the optical signal.
A medium is formed between the light outlet of the first optical fiber 21 and the light reflecting surface 113 of the optical substrate 10, and the medium includes air or ultraviolet glue.
Next, the method further comprises: a second optical fiber 22 is disposed over the second region 12.
The second optical fiber 22 is fixed to the second region 12 by an adhesive.
The second optical fiber 22 is in contact with the first optical fiber 21 to transmit the optical signal to the first optical fiber 21.
Next, referring to fig. 6c, a photonic integrated chip 50 is formed.
The photonic integrated chip 50 includes a bottom silicon layer 51, a buried oxide layer 52, and a top silicon layer 53. The buried oxide layer 52 is located on the bottom silicon layer 51, and the material of the buried oxide layer 52 comprises silicon dioxide. The top silicon layer 53 is located on the buried oxide layer 52.
Forming a grating coupling element 60 on an upper surface of the photonic integrated chip 50; specifically, the grating coupling element 60 is located within the top silicon layer 53.
Next, referring to fig. 6d, the surface of the first optical fiber 21 away from the optical substrate 10 is contacted with the surface of the photonic integrated chip 50 where the grating coupling element 60 is disposed; the mode field of the grating coupling element 60 matches the mode field of the reflected optical signal.
Specifically, the surface of the first optical fiber 21 away from the optical substrate 10 and the surface of the photonic integrated chip 50 on which the grating coupling element 60 is disposed are mounted by active alignment.
The light reflecting surface 113 forms an angle of 54.74 ° with the surface of the photonic integrated chip 50 on which the grating coupling element 60 is disposed.
Thus, the preparation of the grating array coupling packaging structure is basically completed. Some interconnect processes may be involved later and will not be discussed further herein.
It should be noted that the embodiment of the optical fiber array coupling packaging structure provided by the invention and the embodiment of the preparation method of the optical fiber array coupling packaging structure belong to the same concept; the technical features of the technical means described in the embodiments may be arbitrarily combined without conflict. It should be further explained that, in the optical fiber array coupling package structure provided in the embodiments of the present invention, the combination of the technical features thereof can already solve the technical problem to be solved by the present invention; therefore, the optical fiber array coupling package structure provided in the embodiment of the present invention is not limited by the manufacturing method of the optical fiber array coupling package structure provided in the embodiment of the present invention, and any optical fiber array coupling package structure that can be manufactured by the manufacturing method of the optical fiber array coupling package structure provided in the embodiment of the present invention is within the protection scope of the present invention.
The above description is only exemplary of the present invention and should not be taken as limiting the scope of the present invention, and any modifications, equivalents, improvements, etc. that are within the spirit and principle of the present invention should be included in the present invention.
Claims (9)
1. A grating array coupled package structure, comprising: the optical integrated circuit comprises an optical substrate, a first optical fiber and a photonic integrated chip; wherein the content of the first and second substances,
the first optical fiber is accommodated on the optical substrate; the first optical fiber is used for transmitting optical signals and comprises an optical outlet for outputting the optical signals;
the photonic integrated chip comprises a grating coupling element and a waveguide element;
a light reflecting surface is formed on the optical substrate at the light outlet close to the first optical fiber; an included angle between the normal of the light reflection surface and the transmission direction of the optical signal is an acute angle; the light reflecting surface is used for reflecting the optical signal output from the light outlet into the grating coupling element;
the grating coupling element transmits the reflected optical signal to the waveguide element; the mode field of the grating coupling element matches the mode field of the reflected optical signal.
2. The grating array coupling package structure of claim 1,
the optical substrate includes an antireflection film formed on the light reflection surface.
3. The grating array coupling package structure of claim 1, further comprising:
and the medium is positioned between the light outlet of the first optical fiber and the light reflecting surface of the optical substrate and comprises air or ultraviolet glue.
4. The grating array coupling package structure of claim 1,
the optical substrate is provided with a V-shaped groove; the first optical fiber is accommodated in the V-groove.
5. The grating array coupling package structure of claim 1, further comprising: a second optical fiber;
the first optical fiber is accommodated in a first area of the optical substrate; the optical substrate further comprises a second region contiguous with the first region;
the second optical fiber is accommodated in the second region; the second optical fiber is in contact with the first optical fiber to transmit the optical signal to the first optical fiber.
6. The grating array coupling package structure of claim 1,
the core diameter of the first optical fiber is less than 100 μm.
7. The grating array coupling package structure of claim 4,
the included angle between the side wall of the V-shaped groove and the normal of the bottom surface of the optical substrate is 54.74 degrees.
8. The grating array coupling package structure of claim 4,
the optical substrate further comprises a glue guiding groove positioned between the V-shaped groove and the light reflecting surface; the depth of the glue guide groove is greater than that of the V-shaped groove;
the glue guide groove is used for guiding adhesive so as to fix the first optical fiber on the optical substrate.
9. The grating array coupling package structure of claim 1,
the surface of the first optical fiber far away from the optical substrate is in contact with the surface of the photonic integrated chip provided with the grating coupling element; the method comprises the following steps:
and the surface of the first optical fiber, which is far away from the optical substrate, and the surface of the photonic integrated chip, which is provided with the grating coupling element, are mounted in an active alignment mode.
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115185040A (en) * | 2022-09-09 | 2022-10-14 | 之江实验室 | Passive alignment optical packaging structure of silicon photonic chip and optical switch equipment |
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| CN104765102A (en) * | 2015-04-21 | 2015-07-08 | 四川飞阳科技有限公司 | Packaging structure for silicon photon chip |
| CN105336795A (en) * | 2015-08-26 | 2016-02-17 | 中国科学院微电子研究所 | Photon chip packaging structure based on grating interface, and manufacturing method for photon chip packaging structure |
| CN106461889A (en) * | 2014-05-15 | 2017-02-22 | 纳米精密产品股份有限公司 | Optical connection of optical fibers to grating couplers |
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| CN106461889A (en) * | 2014-05-15 | 2017-02-22 | 纳米精密产品股份有限公司 | Optical connection of optical fibers to grating couplers |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN115185040A (en) * | 2022-09-09 | 2022-10-14 | 之江实验室 | Passive alignment optical packaging structure of silicon photonic chip and optical switch equipment |
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