CN112410033B - Fluorescent material, fluorescent film material and high-heat-dissipation fluorescent film - Google Patents
Fluorescent material, fluorescent film material and high-heat-dissipation fluorescent film Download PDFInfo
- Publication number
- CN112410033B CN112410033B CN202011122993.1A CN202011122993A CN112410033B CN 112410033 B CN112410033 B CN 112410033B CN 202011122993 A CN202011122993 A CN 202011122993A CN 112410033 B CN112410033 B CN 112410033B
- Authority
- CN
- China
- Prior art keywords
- fluorescent
- fluorescent film
- substrate
- silica gel
- dissipation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
- C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
- C09K11/77—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
- C09K11/7766—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals containing two or more rare earth metals
- C09K11/7774—Aluminates
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
- C09K11/02—Use of particular materials as binders, particle coatings or suspension media therefor
- C09K11/025—Use of particular materials as binders, particle coatings or suspension media therefor non-luminescent particle coatings or suspension media
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
- H01L33/502—Wavelength conversion materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/505—Wavelength conversion elements characterised by the shape, e.g. plate or foil
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/642—Heat extraction or cooling elements characterized by the shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0041—Processes relating to semiconductor body packages relating to wavelength conversion elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0075—Processes relating to semiconductor body packages relating to heat extraction or cooling elements
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
- Y02B20/00—Energy efficient lighting technologies, e.g. halogen lamps or gas discharge lamps
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Led Device Packages (AREA)
Abstract
The invention provides a fluorescent material, which comprises inorganic high-temperature resistant silica gel, a light scattering agent and fluorescent powder, wherein the inorganic high-temperature resistant silica gel is double-component silica gel, and comprises inorganic high-temperature resistant silica gel A and inorganic high-temperature resistant silica gel B, and the fluorescent powder comprises one or more of yttrium aluminum garnet fluorescent powder, nitride fluorescent powder, silicate fluorescent powder and beta-sialon fluorescent powder; the mass ratio of the inorganic high-temperature resistant silica gel A to the inorganic high-temperature resistant silica gel B to the light scattering agent to the fluorescent powder is 1:1:0.2:0.4-0.8. In the invention, the inorganic high-temperature resistant silica gel has excellent high-temperature resistance, and the fluorescent powder can generate high Wen Cumie at a higher temperature. Therefore, when the fluorescent powder provided by the invention is used for preparing the fluorescent film, the blue light irradiation resistance of the film can be improved, so that the fluorescent film has excellent temperature quenching characteristics and excellent thermal shock resistance.
Description
Technical Field
The invention relates to the technical field of laser illumination, in particular to a fluorescent material, a fluorescent film material and a high-heat-dissipation fluorescent film.
Background
The existing light conversion materials for white laser illumination, such as fluorescent ceramics, are complex in manufacturing process and high in manufacturing cost; in application, the output light color parameters are difficult to be blended. The laser diode has the characteristics of high photoelectric efficiency, high brightness, high collimation, long irradiation distance, small size and the like. Compared with the LED light source product which is only suitable for the field with medium and low brightness, the laser light source can be suitable for the requirements of all brightness, and has incomparable advantages in the fields of high brightness, high luminous efficiency, strong directivity and the like.
The fluorescent material for laser illumination needs to bear more than ten times and even hundreds times of the power density of blue light irradiation of white light LED illumination. Multiple laser beams are converged on the surface of the fluorescent material at the same time, so that the surface of the material at the laser irradiation position is heated to be more than 200 ℃ rapidly, and rapid thermal expansion and cold contraction are caused, and the fluorescent material is easy to crack. This makes it necessary for the fluorescent material for laser illumination to have a super-strong resistance to blue light irradiation, excellent temperature quenching characteristics, and excellent thermal shock resistance.
Disclosure of Invention
The invention aims to provide a fluorescent material, a fluorescent film material and a high-heat-dissipation fluorescent film, which have super-strong blue light irradiation resistance.
The invention provides a fluorescent material, which comprises inorganic high-temperature resistant silica gel, a light scattering agent and fluorescent powder;
the inorganic high-temperature resistant silica gel is double-component silica gel, and comprises inorganic high-temperature resistant silica gel A and inorganic high-temperature resistant silica gel B, wherein the fluorescent powder comprises one or more of yttrium aluminum garnet fluorescent powder, nitride fluorescent powder, silicate fluorescent powder and beta-sialon fluorescent powder;
the mass ratio of the inorganic high-temperature resistant silica gel A to the inorganic high-temperature resistant silica gel B to the light scattering agent to the fluorescent powder is 1:1 (0.1-0.3) to 0.4-0.8.
Preferably, the chemical composition of the yttrium aluminum garnet fluorescent powder is Y 3 Al 5 O 12 :Ce 3+ 、Lu 3 Al 5 O 12 :Ce 3+ 、Lu x Y 3-x Al 5 O 12 :Ce 3+ Or Y 3 Ga y Al 5-y O 12 :Ce 3+ ，x＝0.8～1.6，y＝0.4～2；
The chemical composition of the silicate fluorescent powder is Sr 3 SiO 5 :Eu 2+ ；
The chemical composition of the nitride fluorescent powder is CaAlSiN 3 :Eu 2+ 。
Preferably, the fluorescent powder is a mixture of one or more of nitride fluorescent powder, silicate fluorescent powder and beta-sialon fluorescent powder and yttrium aluminum garnet fluorescent powder, wherein the mass ratio of one or more of nitride fluorescent powder, silicate fluorescent powder and beta-sialon fluorescent powder to yttrium aluminum garnet fluorescent powder in the mixture is 1 (7-9).
Preferably, the light scattering agent is an inorganic silica particle.
The invention provides a fluorescent film material, which comprises a light conversion substrate 1 and a fluorescent layer 2 adhered on the surface of the light conversion substrate 1, wherein the fluorescent layer 2 is prepared from the fluorescent material in the technical scheme.
Preferably, the thickness of the light conversion substrate 1 is 0.4mm to 1mm;
the thickness of the fluorescent layer 2 is 20-80 μm.
The invention provides a high-heat-dissipation reflective fluorescent film, which comprises a high-heat-dissipation substrate 3 with a groove at the center and a fluorescent film layer fixed in the groove, wherein the fluorescent film layer is made of the fluorescent film material according to the technical scheme, and the fluorescent layer 2 in the fluorescent film material is adhered to the surface of the high-heat-dissipation substrate 3; the heat conductivity of the high heat dissipation substrate 3 is greater than 200W/mK.
Preferably, the high heat dissipation substrate 3 having a groove in the center has the following dimensions: 6 mm-10 mm long, 6 mm-10 mm wide and 2 mm-3 mm high;
the size of the fluorescent film layer is as follows: 3 mm-4 mm long, 3 mm-4 mm wide and 0.5 mm-1.08 mm high.
The invention provides a high-heat-dissipation transmission type fluorescent film, which comprises an annular high-heat-dissipation transparent substrate 4 and a fluorescent film layer fixed on the surface of the annular high-heat-dissipation transparent substrate, wherein the fluorescent film layer is made of the fluorescent film material according to the technical scheme, and a fluorescent layer 2 in the fluorescent film material is adhered on the surface of the annular high-heat-dissipation transparent substrate 4; the thermal conductivity of the annular high-heat-dissipation transparent substrate 4 is greater than 200W/mK.
Preferably, the dimensions of the fluorescent thin film layer are: diameter is 6 mm-10 mm, thickness is 0.5 mm-1 mm;
the diameter of the inner ring of the annular high-heat-dissipation transparent substrate 4 is 2-4 mm, the diameter of the outer ring is equal to the diameter of the fluorescent film layer, and the thickness is 0.1-0.2 mm.
The invention provides an automatic heat dissipation fluorescent film, which comprises a sapphire substrate 1, an annular copper sheet 5 adhered on the surface of the sapphire substrate, and a fluorescent layer 2 printed at the hollow position of the annular copper sheet, wherein the fluorescent layer 2 is prepared from the fluorescent material in the technical scheme.
Preferably, the diameter of the fluorescent layer 2 is 2 mm-4 mm, and the thickness is 20 μm-80 μm;
the outer diameter of the annular copper sheet 5 is equal to the outer diameter of the sapphire substrate 1, and is 6-10 mm, and the thickness is 20-0.5 mm;
the thickness of the sapphire substrate 1 is 0.5 mm-1 mm.
The invention provides a fluorescence light-emitting device, which comprises a blue laser 6, an optical lens 7, an optical scattering sheet 8 and a fluorescence film 9 which are sequentially arranged along a laser path;
the fluorescent film 9 is the high heat dissipation reflective fluorescent film according to the above technical scheme, the high heat dissipation transmissive fluorescent film according to the above technical scheme or the self-heat dissipation fluorescent film according to the above technical scheme;
the optical diffusion sheet 8 is disposed at the focal point of the optical lens 7;
the distance between the optical scattering sheet 8 and the fluorescent film 9 is 0.05-0.3 mm.
The invention provides a fluorescent material, which comprises inorganic high-temperature resistant silica gel, a light scattering agent and fluorescent powder, wherein the inorganic high-temperature resistant silica gel is double-component silica gel, and comprises inorganic high-temperature resistant silica gel A and inorganic high-temperature resistant silica gel B, and the fluorescent powder comprises one or more of yttrium aluminum garnet fluorescent powder, nitride fluorescent powder, silicate fluorescent powder and beta-sialon fluorescent powder; the mass ratio of the inorganic high-temperature resistant silica gel A to the inorganic high-temperature resistant silica gel B to the light scattering agent to the fluorescent powder is 1:1 (0.1-0.3) to 0.4-0.8. In the invention, the inorganic high-temperature resistant silica gel has excellent high-temperature resistance, and the fluorescent powder can generate high Wen Cumie at a higher temperature (480K). Therefore, when the fluorescent material provided by the invention is used for preparing the fluorescent film, the blue light irradiation resistance of the film can be improved, so that the fluorescent film has excellent temperature quenching characteristics and excellent thermal shock resistance.
According to the high-heat-dissipation reflective fluorescent film, the high-heat-dissipation transmissive fluorescent film and the self-heat-dissipation fluorescent film, the fluorescent film layer is borne by the high-heat-dissipation substrate, and the heat dissipation area is increased by the groove structure and the annular structure, so that better heat dissipation of the fluorescent film layer is realized, and the thermal shock resistance of the fluorescent film can be further improved.
Drawings
FIG. 1 is a schematic diagram of a main cross-sectional structure of a fluorescent film according to an embodiment of the present invention;
FIG. 2 is a schematic diagram of a main cross-sectional structure of a reflective fluorescent film with high heat dissipation according to an embodiment of the present invention;
FIG. 3 is a schematic diagram of a main cross-sectional structure of a high heat dissipation transmissive fluorescent film according to an embodiment of the present invention;
FIG. 4 is a schematic diagram of a main cross-sectional structure of an auto-thermal fluorescent film according to an embodiment of the present invention;
fig. 5 is a schematic exploded view of a transmissive light emitting device according to an embodiment of the present invention;
fig. 6 is a schematic exploded view of a reflective light emitting device according to an embodiment of the present invention;
wherein 1 is a light conversion substrate (specifically, 1 in fig. 4 is a sapphire substrate), 2 is a fluorescent layer, 3 is a high heat dissipation substrate with a groove in the center, 4 is an annular high heat dissipation transparent substrate, 5 is an annular copper sheet, 6 is a blue laser, 7 is an optical lens, 8 is an optical scattering sheet, 9 is a fluorescent film, 9-1 is a transmission fluorescent film, and 9-2 is a reflection fluorescent film.
Detailed description of the preferred embodiments
The invention provides a fluorescent material, which comprises inorganic high-temperature resistant silica gel, a light scattering agent and fluorescent powder;
the inorganic high-temperature resistant silica gel is double-component silica gel, and comprises inorganic high-temperature resistant silica gel A and inorganic high-temperature resistant silica gel B, wherein the fluorescent powder comprises one or more of yttrium aluminum garnet fluorescent powder, nitride fluorescent powder, silicate fluorescent powder and beta-sialon fluorescent powder;
the mass ratio of the inorganic high-temperature resistant silica gel A to the inorganic high-temperature resistant silica gel B to the light scattering agent to the fluorescent powder is 1:1 (0.1-0.3) to 0.4-0.8.
All the substances according to the invention are commercial products unless otherwise specified.
The fluorescent material provided by the invention comprises inorganic high-temperature-resistant silica gel, wherein the inorganic high-temperature-resistant silica gel is double-component silica gel and comprises inorganic high-temperature-resistant silica gel A and inorganic high-temperature-resistant silica gel B. In the invention, the double-component silica gel has higher high temperature resistance and can resist 480K high temperature.
The fluorescent material provided by the invention comprises fluorescent powder, wherein the fluorescent powder comprises one or more of yttrium aluminum garnet fluorescent powder, nitride fluorescent powder, silicate fluorescent powder and beta-sialon fluorescent powder. In the invention, the chemical composition of the yttrium aluminum garnet fluorescent powder is preferably Y 3 Al 5 O 12 :Ce 3+ 、Lu 3 Al 5 O 12 :Ce 3+ 、Lu x Y 3-x Al 5 O 12 :Ce 3+ Or Y 3 Ga y Al 5-y O 12 :Ce 3+ X=0.8 to 1.6, and y=0.4 to 2. In the invention, the chemical composition of the silicate fluorescent powder is preferably Sr 3 SiO 5 :Eu 2+ . In the present invention, the chemical composition of the nitride phosphor is preferably CaAlSiN 3 :Eu 2+ 。
In the invention, when the fluorescent powder is multiple, the fluorescent powder mixture comprises a first component and a second component, wherein the first component is one or more of nitride fluorescent powder, silicate fluorescent powder and beta-sialon fluorescent powder, the second component is yttrium aluminum garnet fluorescent powder, and the mass ratio of the first component to the second component in the fluorescent powder mixture is preferably 1 (7-9). In the invention, the fluorescent powder is higher Wen Cumie at a higher temperature (480K), the main reason for causing the higher Wen Cumie in the prior art is caused by the concentration of Ce ions, and the concentration of Ce ions in the fluorescent powder is controlled to be 1.0-1.5 mol percent, so that the high Wen Cumie temperature of the fluorescent film can be improved.
The fluorescent material provided by the invention comprises a light scattering agent, wherein the light scattering agent is an electron-grade light scattering agent, the type of the light scattering agent is not particularly limited, and the light scattering agent known to a person skilled in the art, such as inorganic silica particles, can be adopted.
In the invention, the mass ratio of the inorganic high-temperature resistant silica gel A to the inorganic high-temperature resistant silica gel B to the light scattering agent to the fluorescent powder is 1:1:0.1-0.3:0.4-0.8, and is preferably 1:1:0.2:0.5-0.6.
The preparation method of the fluorescent material according to the technical scheme is not particularly limited, and the technical scheme of preparing the fluorescent material by using the composition well known to the person skilled in the art can be adopted. In an embodiment of the present invention, the preparation method of the fluorescent material preferably includes the steps of:
and defoaming and mixing the inorganic high-temperature-resistant silica gel, the light scattering agent and the fluorescent powder to obtain the fluorescent material.
The apparatus used for the defoaming mixing is not particularly limited, and a defoaming mixer well known to those skilled in the art may be used. In the present invention, the time for deaerating the mixture is preferably 30 to 60 minutes, more preferably 40 to 50 minutes.
The invention also provides a fluorescent film material, which comprises a light conversion substrate 1 and a fluorescent layer 2 glued on the surface of the light conversion substrate 1, wherein the fluorescent layer 2 is prepared from the fluorescent material in the technical scheme.
The fluorescent film material provided by the invention comprises a light conversion substrate 1, the type of the light conversion substrate 1 is not particularly limited, and a person skilled in the art can select a corresponding substrate, such as an aluminum substrate, a sapphire substrate, a ceramic substrate or a glass substrate, according to the application mode of the film; when the application is reflective, the light conversion substrate 1 is preferably an aluminum substrate or a ceramic substrate, and when the application is transmissive, the light conversion substrate 1 is preferably a sapphire substrate or a glass substrate. In the invention, the sapphire substrate is a transparent sapphire substrate with a photonic crystal film having functions of enhancing blue light transmission and blocking yellow light reverse transmission. The reflectivity of the aluminum substrate is more than 90%. In the invention, the ceramic substrate is a ceramic substrate with aluminum plated (aluminum plated ceramic substrate) or silver plated (silver plated ceramic substrate); the reflectivity of the silver-plated ceramic substrate is more than 90%.
In the present invention, the thickness of the light conversion substrate 1 is preferably 0.4mm to 1mm, such as may be specifically 0.4mm, 0.5mm or 0.8mm.
The fluorescent film material provided by the invention comprises a fluorescent layer 2 glued on the surface of the light conversion substrate 1, and in the invention, the gluing is preferably realized by adopting heat-conducting silica gel. In the present invention, the thickness of the fluorescent layer 2 is preferably 20 μm to 80 μm, more preferably 40 μm to 50 μm.
In an embodiment of the present invention, the structure of the fluorescent thin film material is shown in fig. 1, wherein 1 is a light conversion substrate, and 2 is a fluorescent layer.
The preparation method of the fluorescent film material is not particularly limited, and a technical scheme of preparing the fluorescent film material, which is well known to those skilled in the art, such as a screen printing method or a doctor blade coating method, is adopted, and the fluorescent material according to the technical scheme is glued on the surface of the light conversion substrate 1 to form the fluorescent layer 2.
The fluorescent film material provided by the invention can be used as a fluorescent film layer in light conversion equipment, and particularly, the invention provides several fluorescent films in the light conversion equipment.
The invention provides a high-heat-dissipation reflective fluorescent film, which comprises a high-heat-dissipation substrate 3 with a groove at the center and a fluorescent film layer fixed in the groove, wherein the fluorescent film layer is made of the fluorescent film material according to the technical scheme, and a fluorescent layer 2 in the fluorescent film material is adhered to the surface of the high-heat-dissipation substrate; the heat conductivity coefficient of the high heat dissipation substrate is larger than 200W/mK.
The high-heat-dissipation reflective fluorescent film material provided by the invention comprises a high-heat-dissipation substrate, wherein the center of the high-heat-dissipation substrate is provided with a groove structure. In the invention, the heat conductivity coefficient of the high heat dissipation substrate with the groove at the center is more than 200W/mK, and the type of the high heat dissipation substrate is not particularly limited, so that the requirement of the heat conductivity coefficient can be met. In an embodiment of the present invention, the high heat dissipation substrate may be a copper substrate or an aluminum substrate, and in particular may be a copper sheet or a copper block.
In the present invention, the shape of the high heat dissipation substrate with a groove at the center is preferably a cuboid, and the size is preferably: 6 mm-10 mm long, 6 mm-10 mm wide and 2 mm-3 mm high; more preferably 9mm long, 9mm wide and 2mm high. In the invention, the center of the groove structure coincides with the center of the high heat dissipation substrate, the shape of the groove structure is preferably cuboid, and the size is preferably: 3 mm-4 mm long, 3 mm-4 mm wide and 0.5 mm-1.08 mm high.
The high-heat-dissipation reflective fluorescent film comprises a fluorescent film layer fixed in the groove structure, wherein the size of the fluorescent film layer is consistent with the size of the groove structure. The fluorescent film layer is prepared from the fluorescent film material in the technical scheme.
In the invention, the mode of fixing the fluorescent film layer is preferably gluing or mechanical fixing, the glue for gluing is preferably heat-conducting silica gel, and the glue consumption for gluing is preferably 0.2-0.5 g/cm 2 . The mechanical fixation is preferably: and coating heat conduction silver colloid on the inner wall of the groove structure, and fixing the fluorescent layer and the high-heat-dissipation substrate in a welding mode. Specifically, in the embodiment of the present invention, the fluorescent thin film material according to the above technical solution is fixed in the groove structure, where the fluorescent layer contacts with the upper surface of the high heat dissipation substrate. In the invention, the coating amount of the heat-conducting silver colloid is preferably 0.1-0.3 g/cm 2 。
In the embodiment of the invention, the structure of the high heat dissipation reflective fluorescent film is shown in fig. 2, wherein 3 is a high heat dissipation substrate with a groove at the center, 1 is a light conversion substrate, 2 is a fluorescent layer, 1 and 2 form a fluorescent film layer, and the fluorescent layer 2 is fixed in contact with the high heat dissipation substrate 3 with a groove at the center.
The preparation method of the high-heat-dissipation reflective fluorescent film is not particularly limited, and the technical scheme of preparing the high-heat-dissipation reflective fluorescent film, such as a screen printing method or a doctor blade coating method, which is well known to those skilled in the art, can be adopted.
The invention also provides a preparation method of the high-heat-dissipation transmission type fluorescent film, which comprises an annular high-heat-dissipation transparent substrate 4 and a fluorescent film layer fixed on the surface of the annular high-heat-dissipation transparent substrate, wherein the material of the annular fluorescent film layer is the fluorescent film material according to the technical scheme, and a fluorescent layer 2 in the fluorescent film material is adhered on the surface of the annular high-heat-dissipation transparent substrate 4; the heat conductivity coefficient of the annular high-heat-dissipation transparent substrate is larger than 200W/mK.
The high-heat-dissipation transmission type fluorescent film provided by the invention comprises an annular high-heat-dissipation transparent substrate 4, wherein the material of the annular high-heat-dissipation transparent substrate 4 is preferably glass or sapphire. In the present invention, the annular high heat dissipation transparent substrate 4 is preferably a cylindrical ring, and the size is preferably: the inner diameter is 2 mm-4 mm, the outer diameter is 6 mm-10 mm, and the thickness is 0.5 mm-1 mm.
The high-heat-dissipation transmission type fluorescent film provided by the invention comprises a fluorescent film layer which is fixed on the surface of the annular high-heat-dissipation transparent substrate 4 and is used for blocking annular holes. In the present invention, the fixing manner is identical to the fixing manner of the high heat dissipation reflective fluorescent film substrate and the film layer in the above technical scheme, and will not be described herein.
In the invention, the fluorescent film layer is prepared from the fluorescent film material in the technical scheme. In the present invention, the fluorescent thin film layer and the annular high heat dissipation transparent substrate 4 are preferably concentric, the diameter is equal to the outer diameter of the annular high heat dissipation transparent substrate, and the thickness is preferably: 0.1 mm-0.2 mm.
In the embodiment of the invention, the structure of the high heat dissipation transmission type fluorescent film is shown in fig. 3, wherein 4 is an annular high heat dissipation transparent substrate, 1 is a light conversion substrate, 2 is a fluorescent layer, 1 and 2 form a fluorescent film layer, and the fluorescent layer 2 is fixed in contact with the annular high heat dissipation transparent substrate 4.
The preparation method of the high-heat-dissipation transmission type fluorescent film is not particularly limited, and the technical scheme of preparing the high-heat-dissipation transmission type fluorescent film, such as a screen printing method or a doctor blade coating method, which are well known to those skilled in the art, can be adopted.
The invention also provides an self-heat-dissipation fluorescent film, which comprises a sapphire substrate 1, an annular copper sheet 5 adhered to the surface of the sapphire substrate, and a fluorescent layer 2 printed at the hollow position of the annular copper sheet 5, wherein the fluorescent layer 2 is prepared from the fluorescent material in the technical scheme.
The structure of the self-heat-dissipation fluorescent film increases the contact area of the copper sheet, the fluorescent layer and the sapphire substrate, and can provide better heat dissipation for the fluorescent film material, thereby increasing the tolerant power density.
The self-heat-dissipation film provided by the invention comprises a sapphire substrate 1, wherein the shape of the sapphire substrate is preferably cylindrical, and the size is preferably: the diameter is 6 mm-10 mm, and the thickness is 0.5 mm-1 mm.
The self-heat-dissipation fluorescent film structure provided by the invention comprises an annular copper sheet 5 glued on the surface of the sapphire substrate 1. In the present invention, the adhesive is preferably a heat conductive silica gel; the adhesive amount for the adhesion is preferably 0.2-0.5 g/cm 2 . In the invention, the annular copper sheet 6 is concentric with the sapphire substrate 1 and hollow. The size of the annular copper sheet is preferably: the diameter of the inner ring is 2 mm-4 mm, the diameter of the outer ring=the diameter of the sapphire substrate is 6 mm-10 mm, and the thickness is 20 mu m-0.5 mm.
The self-heat-dissipation fluorescent film provided by the invention comprises a fluorescent layer 2 printed on the hollow position of the annular copper sheet 5 and the surface of the sapphire substrate 1, wherein the fluorescent layer is prepared from the fluorescent material in the technical scheme. In the present invention, the diameter of the fluorescent layer is the same as the diameter of the inner ring of the copper ring sheet 5, and the thickness is preferably 20 μm to 80 μm.
In the embodiment of the invention, the structure of the self-heat-dissipation fluorescent film is shown in fig. 4, wherein 1 is a sapphire substrate, 5 is a ring-shaped copper sheet, and 2 is a fluorescent layer.
The preparation method of the self-heat-dissipation fluorescent film is not particularly limited, and the technical scheme of fluorescent film preparation, such as screen printing or doctor blade coating, which is well known to those skilled in the art, can be adopted.
The invention also provides a fluorescence light-emitting device, which comprises a blue laser 6, an optical lens 7, an optical scattering sheet 8 and a fluorescence film 9 which are sequentially arranged along a laser path;
the fluorescent film 9 is the high heat dissipation reflective fluorescent film according to the above technical scheme, the high heat dissipation transmissive fluorescent film according to the above technical scheme or the self-heat dissipation fluorescent film according to the above technical scheme;
the optical diffusion sheet 8 is disposed at the focal point of the optical lens 7;
the distance between the optical scattering sheet 8 and the fluorescent film 9 is 0.05-0.3 mm.
In the invention, the number of the blue lasers can be single or multiple, and the blue lasers can be used as laser sources; the laser emitted by the laser is collimated and bunched by the optical lens and uniformly irradiated to the surface of the fluorescent film by the optical scattering sheet, the fluorescent film converts the wavelength of the excitation light source into yellow light, and the residual blue light is mixed with the light emitted by the fluorescent film to obtain uniform white light with high brightness.
In the embodiment of the invention, the device corresponding to the high-heat-dissipation transmission type fluorescent film is a transmission type fluorescent light-emitting device, the structure is shown in fig. 5, wherein 6 is a blue laser, 7 is an optical lens, 8 is an optical scattering sheet, and 9-1 is a transmission type fluorescent film; the device corresponding to the high heat dissipation reflective fluorescent film is a reflective fluorescent light-emitting device, and the structure is shown in fig. 6, wherein 6 is a blue laser, 7 is an optical lens, 8 is an optical scattering sheet, and 9-2 is a reflective fluorescent film.
The following describes a fluorescent material, a fluorescent film material and a fluorescent film with high heat dissipation according to the present invention in detail with reference to examples, but they should not be construed as limiting the scope of the present invention.
Example 1
According to 1:1:0.6: the mass ratio of 0.2 is to weigh inorganic high temperature resistant silica gel A, inorganic high temperature resistant silica gel B, fluorescent powder and electron-grade light scattering agent inorganic silica particles, wherein the fluorescent powder is chemical composition Y 3 Al 5 O 12 :Ce 3+ Yttrium aluminum garnet of (2);
putting the weighed components into a vacuum defoaming mixer for defoaming mixing, wherein the defoaming mixing time is 40min, and obtaining fluorescent powder slurry;
using sapphire (thickness 0.8mm, diameter 8 mm) as a base material, fixing a base sapphire substrate on a screen printer by using a clamp, and printing fluorescent powder slurry on the sapphire substrate by using a screen printing mode;
and drying the printed fluorescent film in a drying oven at 160 ℃ for 30min to form a fluorescent layer with the thickness of 80 mu m on the surface of the sapphire substrate, thereby obtaining the transmission type fluorescent film.
And bonding the fluorescent layer in the obtained transmission fluorescent film with an annular copper sheet to obtain the high-heat-dissipation transmission fluorescent film, wherein the diameter of the inner ring of the annular copper sheet is 3mm, the diameter of the outer ring of the annular copper sheet is 8mm, and the thickness of the annular copper sheet is 0.2mm (the structure is shown in figure 3).
Example 2
According to 1:1:0.8:0.2 of weight ratio of inorganic high temperature resistant silica gel A, inorganic high temperature resistant silica gel B, fluorescent powder and electronic grade light scattering agent, wherein the fluorescent powder is Lu 3 Al 5 O 12 :Ce 3+ Lutetium aluminum garnet;
putting the weighed components into a vacuum defoaming mixer for defoaming mixing, wherein the defoaming mixing time is 50min, and obtaining fluorescent powder slurry;
using high reflectivity aluminum (length 4mm, width 3mm, thickness 1 mm) as a substrate, fixing the aluminum substrate on a scraper coater by using a clamp, coating fluorescent powder slurry on the aluminum substrate, and obtaining a fluorescent film by adopting a scraper coating mode;
and (3) placing the coated fluorescent film in a drying oven, drying at 160 ℃ for 30min, and forming a fluorescent layer with the thickness of 80 mu m on the surface of the aluminum substrate to obtain the reflective fluorescent film.
Cutting the copper sheet to obtain a copper sheet with a groove in the center, wherein the copper sheet has the following dimensions: the length is 9mm, the width is 9mm, the height is 2mm, and the groove size is: 4mm long, 3mm wide and 1.08mm high.
And bonding the obtained fluorescent film in the groove, and bonding a fluorescent layer in the fluorescent film on the surface of the copper sheet to obtain the high-heat-dissipation reflective fluorescent film.
Example 3
According to 1:1:0.8:0.2The mass ratio of the inorganic high-temperature resistant silica gel A, the inorganic high-temperature resistant silica gel B, the fluorescent powder mixture and the electronic grade light scattering agent is measured, wherein the fluorescent powder mixture is prepared from the following components in mass ratio 7:1 Lu 3 Al 5 O 12 :Ce 3+ A mixture of lutetium aluminum garnet and nitride;
putting the weighed components into a vacuum defoaming mixer for defoaming mixing, wherein the defoaming mixing time is 30min, and obtaining fluorescent powder slurry;
spin-coating the obtained fluorescent powder slurry on the central position (diameter is 3 mm) of a cleaned sapphire substrate (diameter is 8mm and thickness is 0.5 mm);
and (3) placing the coated fluorescent film in a drying oven, drying at 160 ℃ for 30min, and forming a fluorescent layer with the thickness of 80 mu m at the central position of the sapphire substrate to obtain the transmission type fluorescent film material.
Punching a hole with the diameter of 3mm in the middle of a copper sheet with the thickness of 0.5mm, cleaning, and drying for later use;
and fixing the perforated copper sheet on the sapphire substrate of the transmission type fluorescent film in an adhesive mode, and curing to obtain the self-radiating fluorescent film (the structure is shown in figure 4).
Performance test:
blue laser with output light power of 3.5W is used to respectively debug 10W/mm through collimation, scattering and focusing 2 、11W/mm 2 、12W/mm 2 、……、20W/mm 2 (Power Density rise amplitude is 1W/mm) 2 ) Light emitting devices of different power densities. The three kinds of fluorescent films obtained in examples 1 to 3 were placed under devices of different optical densities, respectively, and the results showed that the fluorescent films of examples 1 to 3 were 15W/mm 2 And the following power density, the fluorescent film is intact at 16W/mm 2 In the device with the power density, the fluorescent film has dead spots.
A blue laser diode with the power of 3.5W is used for obtaining proper light spot size through collimation, scattering and focusing, then a temperature detector is placed at a certain position, the temperature of the temperature detector is controlled by adjusting the input current of the laser diode, and the test temperature is as follows: starting at 150℃and expanding at 10℃to 200 ℃. The results show that the fluorescent films of examples 1 to 3 begin to be damaged at 200 ℃.
Test results show that the fluorescent film provided by the invention has better high-temperature resistance.
The foregoing is merely a preferred embodiment of the present invention and it should be noted that modifications and adaptations to those skilled in the art may be made without departing from the principles of the present invention, which are intended to be comprehended within the scope of the present invention.
Claims (10)
1. A fluorescent material comprises inorganic high-temperature resistant silica gel, a light scattering agent and fluorescent powder;
the inorganic high-temperature resistant silica gel is double-component silica gel, comprises inorganic high-temperature resistant silica gel A and inorganic high-temperature resistant silica gel B, and the fluorescent powder is Lu 3 Al 5 O 12 :Ce 3+ A mixture of lutetium aluminum garnet and nitride phosphor;
the mass ratio of the inorganic high-temperature resistant silica gel A to the inorganic high-temperature resistant silica gel B to the light scattering agent to the fluorescent powder is 1:1 (0.1-0.3) to 0.8;
the chemical composition of the nitride fluorescent powder is CaAlSiN 3 :Eu 2+ ；
The concentration of Ce ions in the fluorescent powder is 1.0mol percent to 1.5mol percent;
the nitride fluorescent powder and Lu 3 Al 5 O 12 :Ce 3+ The mass ratio of lutetium aluminum garnet is 1 (7-9);
the light scattering agent is inorganic silica particles.
2. A fluorescent film material comprising a light-converting substrate (1) and a fluorescent layer (2) glued to the surface of the light-converting substrate (1), the fluorescent layer (2) being made of the fluorescent material of claim 1.
3. The fluorescent film material according to claim 2, characterized in that the thickness of the light-converting substrate (1) is 0.4 mm-1 mm;
the thickness of the fluorescent layer (2) is 20-80 mu m.
4. The high heat dissipation reflective fluorescent film comprises a high heat dissipation substrate (3) with a groove at the center and a fluorescent film layer fixed in the groove, wherein the fluorescent film layer is made of the fluorescent film material as set forth in claim 2 or 3, and the fluorescent layer (2) in the fluorescent film material is adhered to the surface of the high heat dissipation substrate (3) with the groove at the center; the heat conductivity coefficient of the high heat dissipation substrate (3) with the groove at the center is larger than 200W/mK.
5. The high heat dissipation reflective fluorescent film as claimed in claim 4, characterized in that the high heat dissipation substrate (3) with a groove in the center has the dimensions of: 6 mm-10 mm long, 6 mm-10 mm wide and 2 mm-3 mm high;
the size of the fluorescent film layer is as follows: 3 mm-4 mm long, 3 mm-4 mm wide and 0.5 mm-1.08 mm high.
6. The high-heat-dissipation transmission type fluorescent film comprises an annular high-heat-dissipation transparent substrate (4) and a fluorescent film layer fixed on the surface of the annular high-heat-dissipation transparent substrate, wherein the fluorescent film layer is made of the fluorescent film material as set forth in claim 2 or 3, and a fluorescent layer (2) in the fluorescent film material is adhered on the surface of the annular high-heat-dissipation transparent substrate (4); the heat conductivity coefficient of the annular high-heat-dissipation transparent substrate (4) is larger than 200W/mK.
7. The high heat dissipation transmissive fluorescent film of claim 6, wherein the dimensions of the fluorescent film layer are: diameter is 6 mm-10 mm, thickness is 0.5 mm-1 mm;
the diameter of the inner ring of the annular high-heat-dissipation transparent substrate (4) is 2-4 mm, the diameter of the outer ring is equal to the diameter of the fluorescent film layer, and the thickness is 0.1-0.2 mm.
8. An self-heat-dissipation fluorescent film comprises a sapphire substrate (1), an annular copper sheet (5) adhered to the surface of the sapphire substrate, and a fluorescent layer (2) printed on the hollow position of the annular copper sheet and on the surface of the sapphire substrate (1), wherein the fluorescent layer is prepared from the fluorescent material of claim 1.
9. The fluorescent film according to claim 8, characterized in that the diameter of the fluorescent layer (2) is 2-4 mm and the thickness is 20-80 μm;
the outer diameter of the annular copper sheet (5) is equal to the outer diameter of the sapphire substrate (1), and is 6-10 mm, and the thickness of the annular copper sheet is 20-0.5 mm;
the thickness of the sapphire substrate (1) is 0.5 mm-1 mm.
10. A fluorescent light-emitting device comprises a blue laser (6), an optical lens (7), an optical scattering sheet (8) and a fluorescent film (9) which are sequentially arranged along a laser path;
the fluorescent film (9) is the high heat dissipation reflective fluorescent film according to any one of claims 4 to 5, the high heat dissipation transmissive fluorescent film according to any one of claims 6 to 7 or the self-heat dissipation fluorescent film according to any one of claims 8 to 9;
the optical diffusion sheet (8) is arranged at the focus of the optical lens (7);
the distance between the optical scattering sheet (8) and the fluorescent film (9) is 0.05-0.3 mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011122993.1A CN112410033B (en) | 2020-10-20 | 2020-10-20 | Fluorescent material, fluorescent film material and high-heat-dissipation fluorescent film |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011122993.1A CN112410033B (en) | 2020-10-20 | 2020-10-20 | Fluorescent material, fluorescent film material and high-heat-dissipation fluorescent film |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN112410033A CN112410033A (en) | 2021-02-26 |
| CN112410033B true CN112410033B (en) | 2023-06-30 |
Family
ID=74840978
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011122993.1A Active CN112410033B (en) | 2020-10-20 | 2020-10-20 | Fluorescent material, fluorescent film material and high-heat-dissipation fluorescent film |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112410033B (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101533882A (en) * | 2009-04-20 | 2009-09-16 | 南京工业大学 | fluorescent powder prefabricated film for white light LED and preparation method thereof |
| CN104830325A (en) * | 2015-04-23 | 2015-08-12 | 华南农业大学 | Preparation method for fluorescent carbon quantum dot/SiO2/inorganic fluorescent powder ternary composite temperature sensing material |
| WO2017148344A1 (en) * | 2016-03-01 | 2017-09-08 | 深圳市绎立锐光科技开发有限公司 | Wavelength conversion device and light source system |
| WO2017197794A1 (en) * | 2016-05-18 | 2017-11-23 | 中国人民大学 | Laser white light emitting apparatus for lighting or display |
| CN108649113A (en) * | 2018-04-28 | 2018-10-12 | 上海应用技术大学 | A kind of new application technique improving LED yields |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8017035B2 (en) * | 2004-08-04 | 2011-09-13 | Intematix Corporation | Silicate-based yellow-green phosphors |
-
2020
- 2020-10-20 CN CN202011122993.1A patent/CN112410033B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101533882A (en) * | 2009-04-20 | 2009-09-16 | 南京工业大学 | fluorescent powder prefabricated film for white light LED and preparation method thereof |
| CN104830325A (en) * | 2015-04-23 | 2015-08-12 | 华南农业大学 | Preparation method for fluorescent carbon quantum dot/SiO2/inorganic fluorescent powder ternary composite temperature sensing material |
| WO2017148344A1 (en) * | 2016-03-01 | 2017-09-08 | 深圳市绎立锐光科技开发有限公司 | Wavelength conversion device and light source system |
| WO2017197794A1 (en) * | 2016-05-18 | 2017-11-23 | 中国人民大学 | Laser white light emitting apparatus for lighting or display |
| CN108649113A (en) * | 2018-04-28 | 2018-10-12 | 上海应用技术大学 | A kind of new application technique improving LED yields |
Non-Patent Citations (1)
| Title |
|---|
| 白光LED封装中荧光粉直涂工艺研究;周行龙;《中国优秀硕士学位论文全文数据库》;20141231(第03期);1-73 * |
Also Published As
| Publication number | Publication date |
|---|---|
| CN112410033A (en) | 2021-02-26 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR101419661B1 (en) | Light source device | |
| WO2017148344A1 (en) | Wavelength conversion device and light source system | |
| WO2017169117A1 (en) | Wavelength conversion member, manufacturing method therefor, and light-emitting device | |
| JP6399017B2 (en) | Light emitting device | |
| US20110194306A1 (en) | Light emitting device | |
| KR20140053837A (en) | White-light light-emitting diode lamp with a remote reflective photoluminescent converter | |
| CN106195925A (en) | A kind of Wavelength converter, light-emitting device and projection arrangement | |
| KR20130114671A (en) | Optoelectronic semiconductor component and method for producing same | |
| CN109798457B (en) | Transmission-type blue laser lighting assembly | |
| CN111213075B (en) | Wavelength conversion member and light emitting device | |
| CN108474543B (en) | Wavelength conversion member and light emitting device | |
| WO2017126441A1 (en) | Wavelength conversion member and light-emitting device | |
| CN112410033B (en) | Fluorescent material, fluorescent film material and high-heat-dissipation fluorescent film | |
| CN113701125A (en) | Transmission type wavelength conversion device and light emitting device thereof | |
| CN109703120A (en) | A kind of reflective blue laser light fixture | |
| CN215264353U (en) | Wavelength conversion device and light source system | |
| JP6990065B2 (en) | Wavelength conversion member, its manufacturing method and light emitting device | |
| WO2019136831A1 (en) | Wavelength conversion apparatus and light source therefor | |
| CN110494776B (en) | Wavelength conversion member and light emitting device | |
| CN113551203A (en) | Transmission type wavelength conversion device and light emitting device thereof | |
| WO2019024768A1 (en) | Light emitting device, backlight module employing same, light source module, and manufacturing method thereof | |
| JP2013105647A (en) | Light source device, emission chromaticity adjusting method, and manufacturing method for light source device | |
| CN213542121U (en) | Color temperature adjustable laser lighting system | |
| JP2013214629A (en) | Wavelength conversion member and light emitting device | |
| CN109854980B (en) | Fluorescent sheet for illuminating light source by generating white light through laser excitation and preparation method thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |