CN112396988A - 隐形透光罩 - Google Patents

隐形透光罩 Download PDF

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CN112396988A
CN112396988A CN202011296066.1A CN202011296066A CN112396988A CN 112396988 A CN112396988 A CN 112396988A CN 202011296066 A CN202011296066 A CN 202011296066A CN 112396988 A CN112396988 A CN 112396988A
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layer
character
circuit board
led chip
connecting piece
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范昭君
周文浩
王雪
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Guizhou Huayang Electrical Co ltd
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Guizhou Huayang Electrical Co ltd
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    • GPHYSICS
    • G09EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09FDISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F13/00Illuminated signs; Luminous advertising
    • G09F13/04Signs, boards or panels, illuminated from behind the insignia
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B64AIRCRAFT; AVIATION; COSMONAUTICS
    • B64DEQUIPMENT FOR FITTING IN OR TO AIRCRAFT; FLIGHT SUITS; PARACHUTES; ARRANGEMENTS OR MOUNTING OF POWER PLANTS OR PROPULSION TRANSMISSIONS IN AIRCRAFT
    • B64D43/00Arrangements or adaptations of instruments
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B64AIRCRAFT; AVIATION; COSMONAUTICS
    • B64DEQUIPMENT FOR FITTING IN OR TO AIRCRAFT; FLIGHT SUITS; PARACHUTES; ARRANGEMENTS OR MOUNTING OF POWER PLANTS OR PROPULSION TRANSMISSIONS IN AIRCRAFT
    • B64D47/00Equipment not otherwise provided for
    • B64D47/02Arrangements or adaptations of signal or lighting devices
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52Encapsulations
    • H01L33/56Materials, e.g. epoxy or silicone resin
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58Optical field-shaping elements
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64Heat extraction or cooling elements
    • H01L33/644Heat extraction or cooling elements in intimate contact or integrated with parts of the device other than the semiconductor body

Abstract

本发明公开了一种隐形透光罩,外壳(1)内分别卡入平面发光器(2)、显示片(3),所述平面发光器(2)由反射框(4)、LED芯片(5)、连杆(6)、电路板(7)、连接件(8)、引脚(9)、触点(10)、弹簧(11)组成,反射框(4)内用环氧树脂封装LED芯片(5),LED芯片(5)通过连杆(6)连通电路并固定电路板(7),电路板(7)固定安装在连接件(8)上,连接件(8)上插入弹簧(11)卡入触点(10),引脚(9)穿过连接件(8)连通电路板(7)电路。本发明避免昼间显示器件上的字符、标识可见对飞行员造成误判操纵干扰,提高光电转换率,延长显示器件寿命,提高飞机安全性、减轻飞行员的工作负荷。

Description

隐形透光罩
技术领域
本发明属于灯光告警技术领域,具体涉及一种隐形透光罩。
背景技术
飞机内的显示器件中。显示控制器件是飞机上灯光告警系统的重要部件,飞行员通过显示器件所显示的不同级别(警告级、注意级、提示级)信息对飞机进行下一的步操作。现有技术中的显示器件上存在:光源不点亮时,显示片上的字符需不可见,但不点亮时字符可见度越低,则显示片透过率越低,会造成光源的光衰减变大,要保证整个显示器件规定的亮度,只能靠加大电流来满足亮度要求,造成功耗变大,浪费了多余的电能转化为热能,发热量增多,严重影响了发光器件的寿命。
发明内容
本发明的目的在于克服上述缺点而提供一种避免昼间显示器件上的字符、标识可见对飞行员造成误判操纵干扰,提高光电转换率,延长显示器件寿命,提高飞机安全性、减轻飞行员的工作负荷的隐形透光罩。
本发明的目的及解决其主要技术问题是采用以下技术方案来实现的:
本发明的一种隐形透光罩,其特征在于:外壳内分别卡入平面发光器、显示片,所述平面发光器由反射框、LED芯片、连杆、电路板、连接件、引脚、触点、弹簧组成,反射框内用环氧树脂封装LED芯片,LED芯片通过连杆连通电路并固定电路板,电路板固定安装在连接件上,连接件上插入弹簧卡入触点,引脚穿过连接件连通电路板电路。
所述显示片由散射层、字符保护层、字符层、减光层组成,散射层下面放有字符保护层,字符保护层下面放有字符层,字符层下面放有减光层,散射层、字符保护层、字符层、减光层用环氧树脂周围封装。
所述散射层、字符保护层、字符层、减光层均是采用环氧树脂制成,散射层添加有散射剂,字符层内有字符。
所述电路板上设置的电路触点与连接件上设置的触点接触。
所述触点是可上下移动的弹性触点。
所述连杆是用能通电的金属做成。
所述反射框内用环氧树脂封装LED芯片中的环氧树脂添加有散射剂。
由以上技术方案可知,本技术方案与现有技术方案相比具有明显有益效果,本技术方案通过在外壳内分别卡入平面发光器、显示片,反射框内用环氧树脂封装LED芯片,LED芯片通过连杆连通电路并固定电路板,电路板固定安装在连接件上,连接件上插入弹簧卡入触点,引脚穿过连接件连通电路板电路。散射层下面放有字符保护层,字符保护层下面放有字符层,字符层下面放有减光层,散射层、字符保护层、字符层、减光层用环氧树脂周围封装。隐形透光罩上显示片采用光学、环氧树脂、高分子材料的多层复合结构,由上到下分别为散射层、字符保护层、字符层、减光层共四层组成,散射层具有散射效果,可以使显示片表面形成漫反射面,保护层在字符层上方,可以在多次按压磨损时保护字符完整有效;减光层主要吸收外界自然光,使字符光源不点亮时不可见,通过对显示片各层透过率及厚度的调节,显示片能实现未点亮时字符不可见,点亮后清晰显示,透光率提高一倍,点亮后字符更清晰,隐形透光罩使用平面发光器作为光源,平面发光器采用环氧树脂灌封的封装结构,由反射框、环氧树脂、LED芯片、电路板组成,通过在环氧树脂中添加散射剂,平面发光器不需散光片即可实现面发光,显示更均匀。且电路板上分布有凸起的电阻加上连杆形成了一个镂空的框架,连接件上面也是镂空框架,当LED芯片、电路板发热时,通过电路板上分布有凸起的电阻加上连杆形成镂空的框架、连接件上面的镂空框架连通外壳上设置的散热孔散热,电路板上设置的镀金触点与触点形成弹性接触,实现了避免昼间显示器件上的字符、标识可见对飞行员造成误判操纵干扰,提高光电转换率,延长显示器件寿命,提高飞机安全性、减轻飞行员的工作负荷。
附图说明
图1为本发明的结构示意图;
图2为本发明的俯视图;
图3为本发明平面发光器的结构示意图;
图4为本发明反射框、LED芯片、连杆、电路板的结构示意图;
图5为本发明反射框、LED芯片、连杆、电路板的主视图;
图6为本发明连杆的主视图;
图7为本发明连杆的俯视图;
图8为本发明连接件、引脚、触点、弹簧的结构示意图;
图9为本发明显示片的主视图;
图10为本发明显示片的结构示意图。
图中标识:
1、外壳,2、平面发光器,3、显示片,4、反射框,5、LED芯片,6、连杆,7、电路板,8、连接件,9、引脚,10、触点,11、弹簧,12、散射层,13、字符保护层,14、字符层,15、减光层。
具体实施方式:
以下结合附图及较佳实施例,对依据本发明提出的具体实施方式、结构、特征及其功效,详细说明如后。
本发明的一种隐形透光罩,其特征在于:外壳1内分别卡入平面发光器2、显示片3,所述平面发光器2由反射框4、LED芯片5、连杆6、电路板7、连接件8、引脚9、触点10、弹簧11组成,反射框4内用环氧树脂封装LED芯片5,LED芯片5通过连杆6连通电路并固定电路板7,电路板7固定安装在连接件8上,连接件8上插入弹簧11卡入触点10,引脚9穿过连接件8连通电路板7电路。
所述显示片3由散射层12、字符保护层13、字符层14、减光层15组成,散射层12下面放有字符保护层13,字符保护层13下面放有字符层14,字符层14下面放有减光层15,散射层12、字符保护层13、字符层14、减光层15用环氧树脂周围封装。
所述散射层12、字符保护层13、字符层14、减光层15均是采用环氧树脂制成,散射层12添加有散射剂,字符层14内有字符。
所述电路板7上设置的电路触点与连接件8上设置的触点10接触。
所述触点10是可上下移动的弹性触点。
所述连杆8是用能通电的金属做成。
所述反射框4内用环氧树脂封装LED芯片5中的环氧树脂添加有散射剂。
使用时,将隐形透光罩安装在显示器上,引脚9显示器电路,当告警系统告警时,告警系统电路连通显示器,显示器连通引脚9,引脚9连通电路板7,电路板7连通连杆6,连杆6连通LED芯片5,LED芯片5点亮发光,光透过减光层15,再透过字符层14,字符层14上的字再透过保护层13,最后透过散射层12清晰可见字符层14上的字符即可,当LED芯片5、电路板7发热时,通过电路板7上分布有凸起的电阻加上连杆6形成镂空的框架、连接件8上面的镂空框架连通外壳1上设置的散热孔散热。
以上所述,仅是本发明的较佳实施例而已,并非对本发明作任何形式上的限制,任何未脱离本发明技术方案内容,依据本发明的技术实质对以上实施例所作的任何简单修改、等同变化与修饰,均仍属于本发明技术方案的范围内。

Claims (7)

1.一种隐形透光罩,其特征在于:外壳(1)内分别卡入平面发光器(2)、显示片(3),所述平面发光器(2)由反射框(4)、LED芯片(5)、连杆(6)、电路板(7)、连接件(8)、引脚(9)、触点(10)、弹簧(11)组成,反射框(4)内用环氧树脂封装LED芯片(5),LED芯片(5)通过连杆(6)连通电路并固定电路板(7),电路板(7)固定安装在连接件(8)上,连接件(8)上插入弹簧(11)卡入触点(10),引脚(9)穿过连接件(8)连通电路板(7)电路。
2.如权利要求1所述的隐形透光罩,其特征在于:所述显示片(3)由散射层(12)、字符保护层(13)、字符层(14)、减光层(15)组成,散射层(12)下面放有字符保护层(13),字符保护层(13)下面放有字符层(14),字符层(14)下面放有减光层(15),散射层(12)、字符保护层(13)、字符层(14)、减光层(15)用环氧树脂周围封装。
3.如权利要求2所述的隐形透光罩,其特征在于:所述散射层(12)、字符保护层(13)、字符层(14)、减光层(15)均是采用环氧树脂制成,散射层(12)添加有散射剂,字符层(14)内有字符。
4.如权利要求1所述的隐形透光罩,其特征在于:所述电路板(7)上设置的电路触点与连接件(8)上设置的触点(10)接触。
5.如权利要求1或3所述的隐形透光罩,其特征在于:所述触点(10)是可上下移动的弹性触点。
6.如权利要求1所述的隐形透光罩,其特征在于:所述连杆(8)是用能通电的金属做成。
7.如权利要求1所述的隐形透光罩,其特征在于:所述反射框(4)内用环氧树脂封装LED芯片(5)中的环氧树脂添加有散射剂。
CN202011296066.1A 2020-11-18 2020-11-18 隐形透光罩 Pending CN112396988A (zh)

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN201465478U (zh) * 2009-07-24 2010-05-12 胡安好 一种超薄发光指示导向牌
CN206819698U (zh) * 2017-06-26 2017-12-29 深圳市木树智库有限公司 太阳能led平面显示灯
CN109203994A (zh) * 2017-06-29 2019-01-15 矢崎总业株式会社 车辆显示装置
CN209401255U (zh) * 2019-01-23 2019-09-17 协鸿光电科技(昆山)有限公司 一种电子屏用led模组
CN110579776A (zh) * 2018-06-08 2019-12-17 株式会社久保田 搭载于作业车的激光雷达

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN201465478U (zh) * 2009-07-24 2010-05-12 胡安好 一种超薄发光指示导向牌
CN206819698U (zh) * 2017-06-26 2017-12-29 深圳市木树智库有限公司 太阳能led平面显示灯
CN109203994A (zh) * 2017-06-29 2019-01-15 矢崎总业株式会社 车辆显示装置
CN110579776A (zh) * 2018-06-08 2019-12-17 株式会社久保田 搭载于作业车的激光雷达
CN209401255U (zh) * 2019-01-23 2019-09-17 协鸿光电科技(昆山)有限公司 一种电子屏用led模组

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Application publication date: 20210223