CN112396958A - Display panel, preparation method thereof and display device - Google Patents
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- 238000002360 preparation method Methods 0.000 title description 8
- 239000010410 layer Substances 0.000 claims abstract description 252
- 239000000758 substrate Substances 0.000 claims abstract description 31
- 238000000576 coating method Methods 0.000 claims abstract description 29
- 238000005538 encapsulation Methods 0.000 claims abstract description 29
- 239000000463 material Substances 0.000 claims abstract description 29
- 239000011248 coating agent Substances 0.000 claims abstract description 28
- 238000004806 packaging method and process Methods 0.000 claims abstract description 27
- 239000011241 protective layer Substances 0.000 claims abstract description 12
- 239000011159 matrix material Substances 0.000 claims description 27
- 239000011247 coating layer Substances 0.000 claims description 13
- 239000012790 adhesive layer Substances 0.000 claims description 10
- 238000000231 atomic layer deposition Methods 0.000 claims description 9
- 238000005516 engineering process Methods 0.000 claims description 8
- 230000003287 optical effect Effects 0.000 claims description 8
- 238000004519 manufacturing process Methods 0.000 claims description 6
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical group O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 6
- 238000000034 method Methods 0.000 claims description 5
- OJOWICOBYCXEKR-APPZFPTMSA-N (1S,4R)-5-ethylidenebicyclo[2.2.1]hept-2-ene Chemical compound CC=C1C[C@@H]2C[C@@H]1C=C2 OJOWICOBYCXEKR-APPZFPTMSA-N 0.000 claims description 4
- 239000000853 adhesive Substances 0.000 claims description 3
- 230000001070 adhesive effect Effects 0.000 claims description 3
- 230000004888 barrier function Effects 0.000 claims description 2
- 239000010408 film Substances 0.000 description 14
- 239000002356 single layer Substances 0.000 description 14
- 238000002161 passivation Methods 0.000 description 9
- 239000004642 Polyimide Substances 0.000 description 6
- 230000000694 effects Effects 0.000 description 6
- 229920001721 polyimide Polymers 0.000 description 6
- 238000005452 bending Methods 0.000 description 5
- 239000010409 thin film Substances 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 230000003014 reinforcing effect Effects 0.000 description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 239000012044 organic layer Substances 0.000 description 3
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 3
- 229910052814 silicon oxide Inorganic materials 0.000 description 3
- 238000002834 transmittance Methods 0.000 description 3
- 229910052581 Si3N4 Inorganic materials 0.000 description 2
- UMIVXZPTRXBADB-UHFFFAOYSA-N benzocyclobutene Chemical compound C1=CC=C2CCC2=C1 UMIVXZPTRXBADB-UHFFFAOYSA-N 0.000 description 2
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- 239000011651 chromium Substances 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000002708 enhancing effect Effects 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 230000005525 hole transport Effects 0.000 description 2
- 230000001965 increasing effect Effects 0.000 description 2
- 229910010272 inorganic material Inorganic materials 0.000 description 2
- 239000011147 inorganic material Substances 0.000 description 2
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 2
- -1 polyethylene terephthalate Polymers 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 2
- 229920001621 AMOLED Polymers 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- 239000004696 Poly ether ether ketone Substances 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- JUPQTSLXMOCDHR-UHFFFAOYSA-N benzene-1,4-diol;bis(4-fluorophenyl)methanone Chemical compound OC1=CC=C(O)C=C1.C1=CC(F)=CC=C1C(=O)C1=CC=C(F)C=C1 JUPQTSLXMOCDHR-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000005524 ceramic coating Methods 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 230000002999 depolarising effect Effects 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 229920006351 engineering plastic Polymers 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229920002530 polyetherether ketone Polymers 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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Classifications
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/301—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements flexible foldable or roll-able electronic displays, e.g. thin LCD, OLED
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- Physics & Mathematics (AREA)
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- Engineering & Computer Science (AREA)
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- Electroluminescent Light Sources (AREA)
Abstract
A display panel includes an array substrate, and the display panel further includes: a plurality of electroluminescent devices arranged on the array substrate; an encapsulation layer covering the plurality of electroluminescent devices; the protective layer comprises a hard coating and a self-healing layer, the hard coating is arranged on the packaging layer and covers the packaging layer, and the self-healing layer comprises a self-healing material and covers the hard coating; wherein, the packaging layer is a single inorganic layer.
Description
Technical Field
The application relates to the technical field of display devices, in particular to a display panel, a preparation method of the display panel and a display device.
Background
The flexible folding screen at present may cause a series of bending performance problems such as peeling (peeling), unevenness (waviness), etc. or optical problems such as White Angle Dependency (WAD) due to an excessively thick thickness.
Therefore, it is desirable to provide a new display panel, a method for manufacturing the same, and a display device to solve the above problems.
Disclosure of Invention
The embodiment of the application provides a display panel, a preparation method thereof and a display device, wherein a packaging layer is set as a single-layer inorganic layer, the thickness of the packaging layer is less than or equal to 5 microns, and the packaging layer is prepared by an atomic layer deposition technology to enhance the compactness of a film layer; and a hard coating and a self-healing layer are arranged on the packaging layer, so that the thickness of the display panel is reduced.
The application provides a display panel, including an array base plate, display panel still includes: the electroluminescent devices are arranged on the array substrate; an encapsulation layer covering the plurality of electroluminescent devices; the protective layer comprises a hard coating and a self-healing layer, the hard coating is arranged on the packaging layer and covers the packaging layer, and the self-healing layer comprises a self-healing material and covers the hard coating; wherein, the packaging layer is a single-layer inorganic layer.
In some embodiments, the display panel further includes a black matrix layer disposed on a surface of the encapsulation layer facing away from the light emitting device layer, the black matrix layer having a plurality of openings, each of the openings corresponding to one of the electroluminescent devices, and a color resistor disposed in each of the openings; the protective layer is arranged on one side, away from the packaging layer, of the black matrix layer.
In some embodiments, the display panel further includes a touch layer disposed on a side of the black matrix layer facing away from the encapsulation layer, the protection layer is disposed on a side of the touch layer facing away from the black matrix layer, and the protection layer covers the touch layer.
In some embodiments, the display panel further comprises a protective layer, the protective layer comprises a hard coating layer and a self-healing layer, the hard coating layer is disposed on the touch layer and covers the touch layer, and the self-healing layer comprises a self-healing material and covers the hard coating layer.
In some embodiments, the thickness of the encapsulation layer is less than or equal to 5 μm.
In some embodiments, the material of the encapsulation layer is aluminum oxide.
In some embodiments, the self-healing layer has a thickness of less than 20 μm.
In some embodiments, the self-healing material is 5-ethylidene-2-norbornene.
In some embodiments, the protective layer further includes an adhesive layer disposed between the hard coating layer and the self-healing layer, and the adhesive layer is made of an optical adhesive.
The application also provides a display device comprising the display panel.
The application also provides a preparation method of the display panel, which comprises the following steps:
providing an array substrate and forming a plurality of electroluminescent devices on the array substrate;
forming an encapsulation layer covering the plurality of electroluminescent devices by an atomic layer deposition technology; and the number of the first and second groups,
the packaging layer deviates from a hard coating and a self-healing layer are sequentially formed on the surface of one side of the array substrate, and the self-healing layer comprises a self-healing material and covers the hard coating.
According to the display panel, the preparation method thereof and the display device, the packaging layer of the display panel is set to be the single-layer inorganic layer, the thickness of the single-layer inorganic layer is less than or equal to 5 microns, the packaging layer is made of aluminum oxide, and the single-layer inorganic layer is prepared through the atomic layer deposition technology so as to enhance the compactness of the film layer of the single-layer inorganic layer; and, replace traditional apron through setting up a hardcoat in order to improve display panel and display device's bending performance, through setting up a self-healing layer in order to cover the hardcoat, the self-healing layer includes self-healing material just the thickness of self-healing layer is less than 20 μm, is used for the reinforcing hardcoat's surface hardness to reinforcing packaging effect. This application display panel can prevent to arouse the optical lapping problem because of the rete is too thick to synthesize and realize the attenuate display panel thickness's purpose.
Drawings
The technical solution and other advantages of the present application will become apparent from the detailed description of the embodiments of the present application with reference to the accompanying drawings.
Fig. 1 is a schematic structural diagram of a conventional display panel.
Fig. 2 is a schematic structural diagram of a display panel in the present application.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. It is to be understood that the embodiments described are only a few embodiments of the present application and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
Referring to fig. 2, fig. 2 is a schematic structural diagram of a display panel according to the present application. In the present embodiment, a display panel is provided. As shown in fig. 2, the display panel includes: an array substrate 100; a plurality of electroluminescent devices 200 disposed on the array substrate 100; an encapsulation layer 300 covering the plurality of electroluminescent devices 200; a black matrix layer 400, wherein the black matrix layer 400 is disposed on a surface of the encapsulation layer 300 facing away from the array substrate 100, the black matrix layer 400 has a plurality of openings 401, and each opening 401 corresponds to one of the electroluminescent devices 200; a plurality of color resistors 500, each color resistor 500 being disposed in one of the openings 401. Moreover, the display panel further includes a touch layer 700, and the touch layer 700 is disposed on a side of the black matrix layer 400 away from the encapsulation layer 300. And, the display panel further includes a protection layer 800, the protection layer 800 includes a hard coating 801 and a self-healing layer 803, the hard coating 803 set up in on the touch layer 700 and cover the touch layer 700, the self-healing layer 803 includes self-healing material and covers the hard coating 801.
In the embodiment of the present application, in order to realize the thinning design of the display panel, the encapsulation layer 300 is a single-layer film layer. Specifically, the encapsulation layer 300 is preferably a single inorganic layer, and the material of the single inorganic layer is preferably alumina. In the present preferred embodiment, the thickness of the encapsulation layer 300, i.e., the single inorganic layer, is 5 μm or less. The packaging layer 300 replaces a three-layer structure of an inorganic layer, an organic layer and an inorganic layer in a conventional packaging layer, and the effect of reducing the thickness of the display panel can be achieved to a great extent.
Referring to fig. 2, the protection layer 800 includes a hard coating layer 801 and a self-healing layer 803, which are sequentially stacked, the hard coating layer 801 is disposed on the touch layer 700 and covers the touch layer 700, the self-healing layer 803 includes a self-healing material, and the self-healing layer 803 is disposed on the hard coating layer 801 and covers the hard coating layer 801. In the present application, the hard coating 801 is used to replace the conventional cover plate to improve the bending performance of the display panel and the display device.
Preferably, the thickness of the self-healing layer 803 is less than 20 μm.
In the present application, the self-healing material of the self-healing layer 803 is preferably 5-ethylidene-2-norbornene (5-ethylidene-2-norbomene), wherein the self-healing material is used for the coating process, the concentration ratio of the self-healing layer 803 is 20%, the self-healing layer 803 is used for enhancing the surface hardness of the hard coating 801, thereby enhancing the encapsulation protection effect and preventing the problem of optical coiling caused by the excessive thickness of the film layer.
In this embodiment, as shown in fig. 2, the protection layer 800 of the display panel further includes an adhesive layer 802, the adhesive layer 802 is disposed between the hard coating layer 801 and the self-healing layer 803, and the adhesive layer 802 is used to bond and fix the self-healing layer 803 and the hard coating layer 801; therefore, the protective layer 800, namely the hard coating 801, the bonding layer 802 and the self-healing layer 803, is used for replacing the traditional cover plate, so that the thickness of the display panel is reduced.
See also fig. 2. The black matrix layer 400 includes a plurality of black matrices 402, each of the openings 401 of the black matrix layer 400 is used to separate two adjacent black matrices 402, and the black matrices 402 and the openings 401 are spaced apart from each other. As shown in fig. 2, the plurality of openings 401 are disposed at intervals, each of the openings 401 is disposed corresponding to one of the electroluminescent devices 200, that is, each of the openings 401 is disposed corresponding to one of the pixel units, and each of the openings 401 is disposed corresponding to one of the color resists 500. Specifically, the orthographic projection area of each electroluminescent device 200 on the array substrate 100 overlaps with the orthographic projection area of each opening 401 on the array substrate 100.
In the present application, each of the electroluminescent devices 200 corresponds to a pixel unit, and the pixel units are a red pixel unit, a green pixel unit and a blue pixel unit. Since each of the color resistors 500 is disposed in each of the openings 401 of the black matrix layer 400, and each of the color resistors 500 corresponds to one of the pixel units, the color resistors 500 can be a red color resistor, a green color resistor, and a blue color resistor.
In addition, the display panel further includes a passivation layer 600, wherein the passivation layer 600 is disposed on a surface of the black matrix layer 400 facing away from the encapsulation layer 300 and covers the black matrix layer 400 and the plurality of color resists 500 disposed in the openings 401.
See also fig. 2. The touch layer 700 is disposed on a surface of the passivation layer 600 facing away from the black matrix layer 400, the touch layer 700 is preferably a built-in touch (DOT) layer, which is beneficial to increase the transmittance of the display panel, and a metal trace or a metal mesh wire is disposed in the touch layer 700.
It should be noted that, in the embodiment of the present application, the black matrix layer 400 and the plurality of color resistors 500 are disposed on the encapsulation layer 300 by using a depolarizing technique (POL-less) to replace the polarizer in the conventional display panel, and are combined with the touch layer 700 to increase the transmittance of the display panel, thereby further reducing the thickness of the display panel to a great extent.
Referring to fig. 1, fig. 1 is a schematic structural diagram of a conventional display panel, as shown in fig. 1, the conventional display panel includes a substrate 1, a buffer layer 2, an active layer 3, a first gate insulating layer 4, a first gate 5, a second gate insulating layer 6, a second gate 7, a dielectric layer 8, a source/drain layer 9, a planarization layer 10, a pixel electrode layer 11, a pixel definition layer 12, a light emitting layer 13, a first inorganic layer 14, an organic layer 15, a second inorganic layer 16, a passivation layer 17, a touch layer 18, a polarizer 19, and a cover plate 20, which are sequentially disposed. The display panel in fig. 2 in the present application has a reduced thickness to a large extent compared to the conventional display panel.
The present application also provides a method for manufacturing the display panel as described above, and a method for manufacturing the display panel is described in detail below. The preparation method comprises the following steps:
step S01: providing an array substrate 100 and forming a plurality of electroluminescent devices 200 on the array substrate 100;
in this step, as shown in fig. 2, the array substrate 100 includes a substrate 110, a plurality of tfts 120, a planarization layer 130, at least one pixel electrode 140, and a pixel defining layer 150, which are sequentially stacked.
In this step, as shown in fig. 2, the substrate base plate 110 includes a first substrate 111 and a buffer layer 112 disposed on the first substrate 111. Preferably, the material of the first substrate 111 is PI (Polyimide, scientific name Polyimide), which is one of the varieties with better heat resistance in the current engineering plastics, and has the advantages of good mechanical properties, fatigue resistance, flame retardancy, dimensional stability, electrical properties, wear resistance and the like. In other embodiments, the first substrate 111 may be selected from any one of PEEK resin, PET plastic (polyethylene terephthalate), PI material, PC material, and FRP material. The buffer layer 112 may be formed of at least one of silicon oxide (SiOx), silicon nitride (SiNx), silicon oxynitride (SioxNy), aluminum oxide (AlOx), and aluminum nitride (AlNx), and may have a single-layer or multi-layer structure.
In this step, as shown in fig. 2, the thin film transistor 120 includes: an active layer 10, the active layer 10 being formed on the substrate 110; a first gate insulating layer 11, the first gate insulating layer 11 being formed on the active layer 10 and covering the active layer 10 and the base substrate 110; a first gate electrode 12, the first gate electrode 12 being formed on the first gate insulating layer 11; a second gate insulating layer 13, wherein the second gate insulating layer 13 is formed on the first gate 12 and covers the first gate 12; a second gate electrode 14, the second gate electrode 14 being formed on the second gate insulating layer 13; a dielectric layer 15, wherein the dielectric layer 15 is formed on the second gate 14 and covers the second gate 14; and a source/drain electrode 16 formed on the dielectric layer 15.
In this embodiment, a dual-gate thin film transistor is adopted, and it should be specifically noted that, in other embodiments, the present invention does not exclude the thin film transistor 120 from being in the form of a top gate, a low gate or other types of dual gates, and the specific form may be selected by those skilled in the art according to the desired effect.
Preferably, the material of the active layer 10 is preferably polycrystalline silicon (Poly-Si); the materials of the first gate insulating layer 11 and the second gate insulating layer 13 are preferably at least one of inorganic materials such as silicon oxide, silicon nitride, or metal oxide, and may include a single layer or a plurality of layers; the first gate electrode 12, the second gate electrode 14, the source electrode 16, and the drain electrode 17 may each independently include a single layer or a multilayer of gold (Au), silver (Ag), copper (Cu), molybdenum (Mo), nickel (Ni), platinum (Pt), aluminum (Al), or chromium (Cr), or an alloy thereof.
In this step, as shown in fig. 2, the planarization layer 130 is formed on the plurality of thin film transistors 120 and covers the plurality of thin film transistors 120. Preferably, the planarization layer 130 is preferably an organic material, and the planarization layer 130 may be any one of acryl system, Polyimide (PI) system, or benzocyclobutene (BCB).
In this step, as shown in fig. 2, each of the pixel electrodes 140 is formed on the planarization layer 130 and is correspondingly connected to one of the thin film transistors 120; preferably, each of the pixel electrodes 140 serves as an anode layer of the electroluminescent device 200, and the pixel electrodes 140 are transparent electrodes.
In this step, as shown in fig. 2, the pixel defining layer 150 is formed on the pixel electrode 140 and is used to define the pixel unit, the pixel defining layer 150 has a plurality of slots 151, each slot 151 corresponds to each opening 401, and an orthogonal projection area of the slot 151 of the pixel defining layer 150 on the array substrate 100 overlaps an orthogonal projection area of the plurality of openings 401 of the black matrix layer 400 on the array substrate 100. And each of the electroluminescent devices 200 is correspondingly disposed in one of the slots 151, that is, each of the slots 151 corresponds to a pixel unit, and each of the color resists 500 is formed in the slot 151 and the opening 401.
Preferably, the electroluminescent device 200 comprises: a hole transport layer (not shown) disposed on the pixel electrode 140; a light-emitting layer (201) disposed on the hole transport layer; an electron transport layer (not shown) disposed on the light emitting layer; and a cathode (not shown) disposed on the electron transport layer.
Step S02: forming an encapsulation layer 300 covering the plurality of electroluminescent devices 200 by atomic layer deposition;
in this step, as shown in fig. 2, in the present embodiment, the encapsulation layer 300 is formed on the plurality of electroluminescent devices 200 and covers the plurality of electroluminescent devices 200, wherein the encapsulation layer 300 is a single inorganic layer.
It should be noted that, since the Atomic Layer Deposition (ALD) technology has a higher density in film formation compared to the Chemical Vapor Deposition (CVD) technology, that is, the compactness of the film layer is better, in the embodiment of the present application, the ALD technology is preferably used to prepare the film layer of the encapsulation layer 300, and the material of the single inorganic layer is preferably alumina, because the surface of the film layer of the alumina has the compactness, so as to achieve the purpose of increasing the compactness of the single film layer of the encapsulation layer 300.
In the present preferred embodiment, the thickness of the encapsulation layer 300, i.e., the single inorganic layer, is 5 μm or less.
The packaging layer 300 replaces a three-layer structure of an inorganic layer, an organic layer and an inorganic layer in a conventional packaging layer, and the effect of reducing the thickness of the display panel can be achieved to a great extent.
Step S03, forming a black matrix layer 400 and a plurality of color resists 500 on the surface of the packaging layer 300 facing away from the array substrate 100;
in this step, the black matrix layer 400 has a plurality of openings 401, each of the openings 401 corresponds to one of the electroluminescent devices 200, and a color barrier 500 is formed in each of the openings 401.
In addition, the preparation method of the display panel further comprises the following steps:
step S04: forming a touch layer 700 on a side of the black matrix layer 400 facing away from the package layer 300;
it should be noted that, after the step S03 and before the step S04, a step of forming a passivation layer 600 on the color film layer 500 is further included, wherein the passivation layer 600 covers the black matrix layer 400 and the plurality of color resistors 500, and the material of the passivation layer 600 is an inorganic material.
See also fig. 2. The touch layer 700 is formed above the passivation layer 600, and the touch layer 700 is combined with the black matrix layer 400 and the color film layer 500, so that the transmittance of POL-Less is increased, and the thickness of the display panel is reduced to a greater extent.
Step S05, sequentially forming a hard coating 801 and a self-healing layer 803 on a side of the touch layer 700 away from the color film layer 500, wherein the self-healing layer 803 comprises a self-healing material and covers the hard coating 801;
in this step, a protection layer 800 is formed on a surface of the touch layer 700 facing away from the passivation layer 600, and the protection layer 800 includes a hard coating layer 801, an adhesive layer 802, and a self-healing layer 803 which are sequentially formed. The hard coating 801 is equivalent to replace a traditional cover plate so as to improve the bending performance of the touch layer 700, and the material of the hard coating 801 is preferably any one of a metal-based coating and a ceramic coating; then, coating transparent optical adhesive (OCA) as an adhesive layer 802 on the surface of the hard coating layer 801 facing away from the touch layer 700; finally, a self-healing material, preferably 5-ethylidene-2-norbornene (5-ethylidene-2-norbomene), is coated on the surface of the adhesive layer 802 facing away from the hard coating 801 to form a self-healing layer 803, and the self-healing layer 803 can improve the surface hardness of the hard coating 801, enhance the encapsulation performance and prevent the optical rolling screen problem caused by the excessive thickness of the film.
In the present application, the display panel manufactured by the manufacturing method includes, but is not limited to, OLED, LCD, AMOLED, and the like.
In addition, the application also provides a display device which comprises the display panel.
According to the display panel, the packaging layer 300 is set to be a single-layer inorganic layer, the thickness of the single-layer inorganic layer is less than or equal to 5 microns, the single-layer inorganic layer is prepared through an atomic layer deposition technology, and the material of the single-layer inorganic layer is preferably aluminum oxide so as to enhance the compactness of a film layer; and, through setting up a protective layer 800 and replacing traditional apron, utilize a hardcoat 801 of protective layer 800 to improve display panel and display device's bending performance is through setting up a self-healing layer 803 in order to cover hardcoat 801, self-healing layer 803 includes self-healing material just the thickness of self-healing layer 803 is less than 20 μm, is used for the reinforcing hardcoat 801's surface hardness to reinforcing packaging effect, and prevent to arouse optical problem because of the rete is too thick. The embodiment of the application finally realizes the aim of reducing the thickness of the display panel.
In the foregoing embodiments, the descriptions of the respective embodiments have respective emphasis, and for parts that are not described in detail in a certain embodiment, reference may be made to related descriptions of other embodiments.
The display panel, the manufacturing method thereof, and the display device provided in the embodiments of the present application are described in detail above, and specific examples are applied in the description to explain the principle and the implementation of the present application, and the description of the embodiments above is only used to help understanding the technical solution and the core idea of the present application; those of ordinary skill in the art will understand that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; such modifications or substitutions do not depart from the spirit and scope of the present disclosure as defined by the appended claims.
Claims (10)
1. A display panel comprising an array substrate, the display panel further comprising:
the electroluminescent devices are arranged on the array substrate;
an encapsulation layer covering the plurality of electroluminescent devices; and the number of the first and second groups,
the protective layer comprises a hard coating and a self-healing layer, the hard coating is arranged on the packaging layer and covers the packaging layer, and the self-healing layer comprises a self-healing material and covers the hard coating; wherein,
the packaging layer is a single inorganic layer.
2. The display panel of claim 1, further comprising a black matrix layer disposed on a surface of the encapsulation layer facing away from the light emitting device layer, the black matrix layer having a plurality of openings, each of the openings corresponding to one of the electroluminescent devices, and a color barrier disposed in each of the openings; the protective layer is arranged on one side, away from the packaging layer, of the black matrix layer.
3. The display panel of claim 2, further comprising a touch layer disposed on a side of the black matrix layer facing away from the encapsulation layer, wherein the protection layer is disposed on a side of the touch layer facing away from the black matrix layer and covers the touch layer.
4. The display panel according to claim 1, wherein the thickness of the encapsulation layer is 5 μm or less.
5. The display panel according to claim 4, wherein the material of the encapsulation layer is aluminum oxide.
6. The display panel according to claim 1, wherein the self-healing layer has a thickness of less than 20 μm.
7. The display panel according to claim 6, wherein the self-healing material is 5-ethylidene-2-norbornene.
8. The display panel of claim 1, wherein the protective layer further comprises an adhesive layer disposed between the hard coating layer and the self-healing layer, and the adhesive layer is made of an optical adhesive.
9. A display device comprising the display panel according to any one of claims 1 to 8.
10. A method for manufacturing a display panel according to any one of claims 1 to 8, comprising the steps of:
providing an array substrate and forming a plurality of electroluminescent devices on the array substrate;
forming an encapsulation layer covering the plurality of electroluminescent devices by an atomic layer deposition technology; and the number of the first and second groups,
the packaging layer deviates from a hard coating and a self-healing layer are sequentially formed on the surface of one side of the array substrate, and the self-healing layer comprises a self-healing material and covers the hard coating.
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