CN112394530A - Packaging structure of optical fiber combiner and optical fiber laser - Google Patents

Packaging structure of optical fiber combiner and optical fiber laser Download PDF

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Publication number
CN112394530A
CN112394530A CN202011388506.6A CN202011388506A CN112394530A CN 112394530 A CN112394530 A CN 112394530A CN 202011388506 A CN202011388506 A CN 202011388506A CN 112394530 A CN112394530 A CN 112394530A
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CN
China
Prior art keywords
optical fiber
heat dissipation
heat sink
heat
combiner
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Pending
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CN202011388506.6A
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Chinese (zh)
Inventor
张秀娟
徐海军
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Zhejiang Thermal Stimulation Optical Technology Co ltd
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Zhejiang Thermal Stimulation Optical Technology Co ltd
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Application filed by Zhejiang Thermal Stimulation Optical Technology Co ltd filed Critical Zhejiang Thermal Stimulation Optical Technology Co ltd
Priority to CN202011388506.6A priority Critical patent/CN112394530A/en
Publication of CN112394530A publication Critical patent/CN112394530A/en
Pending legal-status Critical Current

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    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/10Beam splitting or combining systems
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/02Constructional details
    • H01S3/04Arrangements for thermal management
    • H01S3/0405Conductive cooling, e.g. by heat sinks or thermo-electric elements
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/02Constructional details
    • H01S3/04Arrangements for thermal management
    • H01S3/042Arrangements for thermal management for solid state lasers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/05Construction or shape of optical resonators; Accommodation of active medium therein; Shape of active medium
    • H01S3/06Construction or shape of active medium
    • H01S3/063Waveguide lasers, i.e. whereby the dimensions of the waveguide are of the order of the light wavelength
    • H01S3/067Fibre lasers
    • H01S3/06708Constructional details of the fibre, e.g. compositions, cross-section, shape or tapering

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  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • General Physics & Mathematics (AREA)
  • Optical Couplings Of Light Guides (AREA)

Abstract

The application relates to the technical field of fiber lasers, in particular to an optical fiber combiner packaging structure and a fiber laser. The packaging structure of the optical fiber combiner comprises a packaging substrate and a heat dissipation part, wherein an accommodating cavity is formed inside the packaging substrate and used for placing the optical fiber combiner; the heat dissipation piece is positioned in the accommodating cavity, and the outer wall surface of the heat dissipation piece can be tightly attached to the inner wall surface of the accommodating cavity; the inside of radiating piece is formed with the installation through-hole, makes the radiating piece can closely overlap and establish on the output fiber who has the coating, and the one end of radiating piece and the one end parallel and level that the coating is close to the bare fiber section to directly, dispel the heat to the coating of output fiber fast through the radiating piece, reduce the temperature of the coating of output fiber, improve the bearing capacity of output fiber, and then improve the bearing power and the reliability of optical fiber beam combiner to a certain extent.

Description

Packaging structure of optical fiber combiner and optical fiber laser
Technical Field
The application relates to the technical field of fiber lasers, in particular to an optical fiber combiner packaging structure and a fiber laser.
Background
The high-power optical fiber beam combiner belongs to an optical fiber device and is mainly used for pump coupling of an optical fiber laser; with the technical progress of the fiber laser, the power index of pump coupling directly influences the improvement of the power of the fiber laser, so that the breakthrough of the bearable power index of the fiber combiner is of great importance.
The main factors restricting the device performance in the optical fiber combiner are that stray laser with coupling loss and waste light at the coating layer interface become waste heat in the device, and the combiner is damaged. The existing optical fiber beam combiner generally adopts a packaging structure to conduct light guiding and heat conducting, but the temperature of an output optical fiber coating layer which restricts the coupling bearing power of the optical fiber beam combiner is not directly radiated; the coating layer of the output optical fiber usually adopts a coating with a low refractive index, partial laser with coupling loss overflows from the optical fiber and enters the coating layer of the output optical fiber, so that the temperature of the coating layer is increased, the temperature which can be borne by the coating layer is limited, and the coating layer is easy to burn and damage due to high temperature, so that the bearable power of the optical fiber combiner is greatly restricted.
Disclosure of Invention
The invention aims to provide a packaging structure of an optical fiber combiner and an optical fiber laser, which are used for efficiently and quickly radiating a coating layer of an output optical fiber of the optical fiber combiner.
The invention provides a packaging structure of an optical fiber beam combiner, which comprises a packaging substrate and a heat dissipation piece, wherein the packaging substrate is provided with a plurality of through holes; an accommodating chamber is formed in the packaging substrate and used for placing an optical fiber combiner, and a fusion joint point of an input optical fiber and an output optical fiber of the optical fiber combiner is positioned in the accommodating chamber; the heat dissipation piece is positioned in the accommodating cavity, and the outer wall of the heat dissipation piece is attached to the inner wall of the accommodating cavity; the heat dissipation piece is provided with a mounting through hole, so that the heat dissipation piece can be sleeved on the optical fiber section of the output optical fiber with the coating layer; the inner wall of the heat dissipation piece is attached to the coating layer of the output optical fiber, and one end of the heat dissipation piece is flush with the end part of the coating layer of the output optical fiber.
Further, the heat dissipation member comprises a heat dissipation base and a heat dissipation cover plate; the heat dissipation base is provided with a mounting groove, the output optical fiber can be embedded into the mounting groove, and the outer wall of the coating layer of the output optical fiber is attached to the inner wall of the mounting groove; the heat dissipation cover plate is covered on the mounting groove and is pressed on the coating layer; the heat dissipation cover plate is used for sealing the installation groove to form the installation through hole.
Furthermore, the heat dissipation base and the heat dissipation cover plate are made of sapphire or diamond.
Further, the length of the heat sink is 1cm to 3 cm.
Furthermore, high-folding UV glue is filled between the mounting through hole and the coating layer so as to bond and fix the output optical fiber and the heat dissipation piece.
Further, the package substrate comprises a package base and a package cover plate; the packaging base is provided with a containing groove, the packaging cover plate is covered on the containing groove, and the packaging cover plate is used for sealing the containing groove to form the containing cavity; and the high-folding UV glue is filled between the outer wall of the heat dissipation piece and the inner wall of the containing cavity.
Furthermore, the packaging base and the packaging cover plate are made of quartz.
Furthermore, the packaging structure of the optical fiber combiner further comprises a heat sink; the heat sink comprises a heat sink base and a heat sink cover plate; a groove is formed in the heat sink base, the packaging substrate is placed in the accommodating groove, and the side wall of the packaging substrate is attached to the inner wall of the groove; the heat sink cover plate is pressed on the packaging substrate and detachably connected with the heat sink base through a fastener.
Furthermore, the heat sink is made of a metal material with high heat conductivity coefficient, and a matte coating is formed on the inner wall of the heat sink.
The invention also provides an optical fiber laser which comprises the packaging structure of the optical fiber combiner.
Compared with the prior art, the invention has the beneficial effects that:
the packaging structure of the optical fiber combiner provided by the invention comprises a packaging substrate and a heat dissipation piece.
An accommodating cavity is formed in the packaging substrate, the optical fiber combiner comprises an input optical fiber and an output optical fiber which are welded together, the optical fiber combiner can be placed in the accommodating cavity, and the welding point of the input optical fiber and the output optical fiber is positioned in the accommodating cavity; the radiating piece is located the containing cavity of the packaging substrate, the radiating piece is matched with the containing cavity in shape and size, when the radiating piece is placed in the containing cavity, the outer wall surface of the radiating piece can be tightly attached to the inner wall surface of the containing cavity, and therefore sufficient heat conduction area is formed between the radiating piece and the packaging substrate, and heat exchange can be conducted between the radiating piece and the packaging substrate quickly and effectively.
The part of the output optical fiber, which is positioned in the packaging substrate, comprises a bare optical fiber section and an optical fiber section coated with a coating layer, a mounting through hole is formed in the heat radiating piece, the mounting through hole is matched with the output optical fiber with the coating layer, so that the heat radiating piece can be tightly sleeved on the output optical fiber with the coating layer, and one end of the heat radiating piece in the length direction is flush with one end of the coating layer, which is close to the bare optical fiber section, so that the coating layer which generates heat because the coating layer is close to the bare optical fiber section and absorbs stray laser can quickly conduct heat into the heat radiating piece, and then the heat is further; thereby directly, dispel the heat to output fiber fast through the radiating piece, reduce the temperature of the coating of output fiber, avoid the coating to improve output fiber's bearing capacity because of high temperature damages, and then improve the bearing power and the reliability of optical fiber beam combiner to a certain extent.
The invention also provides an optical fiber laser which comprises the packaging structure of the optical fiber combiner, so that the optical fiber laser also has the beneficial effect of the packaging structure of the optical fiber combiner.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and other drawings can be obtained by those skilled in the art without creative efforts.
Fig. 1 is a schematic structural diagram of a package substrate of a package structure of an optical fiber combiner according to an embodiment of the present invention;
fig. 2 is a schematic structural diagram of a package structure of an optical fiber combiner according to an embodiment of the present invention at a first viewing angle;
fig. 3 is a schematic structural diagram of a package structure of an optical fiber combiner according to an embodiment of the present invention at a second viewing angle;
FIG. 4 is an enlarged view taken at A in FIG. 3;
fig. 5 is a schematic structural diagram of a package structure of an optical fiber combiner according to an embodiment of the present invention at a third viewing angle.
Reference numerals:
1-package substrate, 11-package base, 12-package cover plate, 2-heat dissipation member, 21-heat dissipation base, 3-heat sink, 31-heat sink base, 32-heat sink cover plate, 4-input optical fiber and 5-output optical fiber.
Detailed Description
The technical solutions of the present invention will be described clearly and completely with reference to the accompanying drawings, and it should be understood that the described embodiments are some, but not all embodiments of the present invention.
The components of embodiments of the present invention generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations. Thus, the following detailed description of the embodiments of the present invention, presented in the figures, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention.
All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
The following describes a package structure of an optical fiber combiner and an optical fiber laser according to some embodiments of the present application with reference to fig. 1 to 5.
The application provides a packaging structure of optical fiber combiner for encapsulate optical fiber combiner, and derive stray laser and waste heat that optical fiber combiner produced. As shown in fig. 1 to 5, the optical fiber combiner package structure includes a heat sink 3, a package substrate 1, and a heat sink 2.
As shown in fig. 2 to 4, a containing chamber is formed inside the package substrate 1, and both ends of the rectangular shape of the package substrate 1 form a wire inlet and a wire outlet communicated with the containing chamber. The optical fiber combiner comprises an input optical fiber 4 and an output optical fiber 5 which are welded together, the optical fiber combiner can be placed in the accommodating cavity, the welding point of the input optical fiber 4 and the output optical fiber 5 is located in the accommodating cavity, one end of the input optical fiber 4 extends out of the packaging substrate 1 through the wire inlet, and one end of the output optical fiber 5 extends out of the packaging substrate 1 through the wire outlet. High-folding UV glue is filled in the wire inlet and the wire outlet to seal the wire inlet and the wire outlet, and simultaneously the optical fiber beam combiner is bonded with the packaging substrate 1.
In this embodiment, preferably, as shown in fig. 1 to 4, the package substrate 1 includes a package base 11 and a package cover plate 12, a receiving groove is formed on an upper end surface of the package base 11, and a wire inlet slot and a wire outlet slot communicated with the receiving groove are respectively formed at two ends of the receiving groove in a length direction; the package cover plate 12 can be covered on the package substrate 1 to seal the upper open end of the accommodating groove, the wire inlet groove and the wire outlet groove, thereby forming an accommodating chamber and wire inlets and wire outlets at two ends of the accommodating chamber. The optical fiber combiner can be more conveniently placed in the packaging substrate 1 by arranging the packaging substrate 1 into the split packaging base 11 and the split packaging cover plate 12.
Preferably, the package base 11 and the package cover plate 12 are made of quartz; when the optical fiber combiner is used, laser transmitted through the input optical fiber 4 is coupled to the output optical fiber 5, and stray laser at the welding point of the input optical fiber 4 and the output optical fiber 5 can escape; the package base 11 and the package cover plate 12 are made of quartz with a high refractive index, stray laser formed by coupling loss of the optical fiber combiner can be rapidly guided out, and damage to the optical fiber combiner due to the fact that the stray laser cannot be guided out in time to become waste heat is avoided.
The material of the package base 11 and the package cover 12 is not limited to quartz, and may be a transparent material having a high refractive index, such as diamond or sapphire.
In one embodiment of the present application, the heat sink 2 is used to directly dissipate heat from the output optical fiber 5. The part of the output optical fiber 5 in the package substrate 1 comprises a bare fiber section and a fiber section coated with a coating layer, and the output optical fiber 5 is welded with the input optical fiber 4 through the bare fiber section. Some laser that input fiber 4 and output fiber 5 coupling loss formed can spill over from naked optic fibre, then gets into output fiber 5's coating, and output fiber 5's coating material is the material of low refracting index, and the bearable temperature of coating is limited, and laser gets into and can heat after the coating, if in time with the heat derivation in the coating, the coating can burn out the damage because of high temperature, and then influences the normal use of optical fiber beam combiner.
In this embodiment, preferably, as shown in fig. 3 and 4, the heat sink 2 is located in the accommodating cavity of the package substrate 1, and the heat sink 2 is adapted to the shape and size of the accommodating cavity, so that when the heat sink 2 is placed in the accommodating cavity, the outer wall surface of the heat sink 2 can closely fit with the inner wall surface of the accommodating cavity, so that a sufficient heat conduction area is provided between the heat sink 2 and the package substrate 1, and the heat sink 2 and the package substrate 1 can perform rapid and effective heat exchange.
A mounting through hole is formed in the heat dissipation member 2, the mounting through hole is matched with the output optical fiber 5 with the coating layer, so that the heat dissipation member 2 can be tightly sleeved on the output optical fiber 5 with the coating layer, one end of the heat dissipation member 2 in the length direction is aligned with one end of the coating layer close to the bare optical fiber section, the coating layer which is close to the bare optical fiber section and absorbs stray laser to generate heat can rapidly conduct the heat into the heat dissipation member 2, and then the heat is further conducted out through the packaging substrate 1; thereby directly, dispel the heat to output fiber 5 fast through heat dissipation piece 2, reduce the temperature of the coating of output fiber 5, avoid the coating to improve output fiber 5 can the bearing capacity because of high temperature damages, and then improve the bearing power and the reliability of optical fiber beam combiner to a certain extent.
In this embodiment, the heat dissipation element 2 is preferably made of a material having high thermal conductivity and high light transmittance, and the heat dissipation element 2 is preferably made of sapphire or diamond. The high thermal conductivity of the heat sink 2 enables the heat sink 2 to quickly absorb heat in the coating layer of the output optical fiber 5 and quickly transmit the absorbed heat out, thereby ensuring that the coating layer of the output optical fiber 5 is not damaged by excessive temperature.
In this embodiment, the length of the heat dissipation member 2 is preferably 1cm to 3cm, so as to ensure that heat in the coating layer of the output optical fiber 5 affected by the stray laser can be quickly conducted out, improve the bearing capacity of the output optical fiber 5, and further improve the bearable power of the optical fiber combiner.
In one embodiment of the present application, preferably, as shown in fig. 3 and 4, the heat sink 2 includes a separate heat sink base 21 and a heat sink cover plate. An installation groove is formed on the upper end face of the heat dissipation base 21 and is matched with the output optical fiber 5 with the coating layer, so that the output optical fiber 5 can be tightly embedded in the heat dissipation base 21; the depth of the mounting groove is slightly larger than the diameter of the output optical fiber 5, and the heat dissipation cover plate can be covered above the mounting groove and downwards compresses the output optical fiber 5; so as to limit the output optical fiber 5 in the installation through hole surrounded with the installation groove of the heat radiation cover plate and the heat radiation base 21.
Preferably, the high-folding UV glue is filled between the coating layers of the mounting through hole and the output optical fiber 5, so that the output optical fiber 5 and the heat dissipation member 2 are bonded and fixed by the high-folding UV glue, and the heat dissipation member 2 and the output optical fiber 5 are always located at the position where the end of the heat dissipation member 2 is flush with the end of the coating layer. Simultaneously, the gap between the coating layer and the mounting through hole is filled by high-folding UV glue, so that the coating layer is more fully contacted with the inside of the mounting through hole, and the heat dissipation piece 2 is uniformly conducted with the coating layer in a geothermal conduction manner.
In one embodiment of the present application, preferably, a high-refractive UV glue is also filled between the heat dissipation member 2 and the contact surface of the accommodating chamber of the package substrate 1 for fixing the heat dissipation member 2 and the package substrate 1, and simultaneously, the contact between the heat dissipation member 2 and the package substrate 1 is made more sufficient, so as to better conduct light and heat between the heat dissipation member 2 and the package substrate 1.
In one embodiment of the present application, preferably, as shown in fig. 2 to 5, the package structure of the optical fiber combiner further includes a heat sink 3; the heat sink 3 is sleeved on the outer side of the package substrate 1, the heat sink 3 is made of a metal material with high heat conduction efficiency, and preferably, the heat sink 3 is made of copper or aluminum alloy. The heat dissipation part 2 can be quickly transmitted to the heat sink 3 through the packaging substrate 1 after absorbing the heat of the coating layer, and finally dissipated through the heat sink 3, so that the optical fiber combiner is always kept at a proper use temperature, and the bearing power of the optical fiber combiner is improved.
In this embodiment, the heatsink 3 preferably includes a heatsink cover plate 32 and a heatsink base 31; the heat sink base 31 is formed with a groove, the package substrate 1 equipped with the heat sink 2 and the optical fiber combiner can be placed in the groove of the heat sink base 31, then the heat sink cover plate 32 is covered on the heat sink base 31, and the heat sink base 31 and the heat sink cover plate 32 are connected through a fastener.
Preferably, the heat sink 3 and the package substrate 1 may be fixed by high-folding UV glue.
Preferably, the inner wall surface of the heat sink 3 is coated with a matte surface, so that when the package substrate 1 guides out stray laser inside the package substrate, the stray laser is reflected at the inner wall surface of the heat sink 3, thereby being more beneficial to guiding out the stray laser formed by the optical fiber combiner, and avoiding the stray laser from accumulating inside the package substrate 1 to become waste heat to influence the use reliability of the optical fiber combiner.
This application all sets up the form of base and the apron of components of a whole that can function independently with radiating element 2, packaging substrate 1 and heat sink 3 of the packaging structure of optic fibre beam combiner, makes it more convenient assemble with optic fibre beam combiner. In the assembling process, firstly, fixing the heat dissipation base 21 of the heat dissipation sheet in the accommodating groove of the packaging base 11, and adhering and fixing the joint surface of the heat dissipation base 21 and the accommodating groove through high folding UV glue; and then, putting the input optical fiber 4 and the output optical fiber 5 which are welded into the accommodating groove of the packaging base 11, so that the welding point of the input optical fiber 4 and the output optical fiber 5 is positioned in the accommodating groove, and the optical fiber section of the output optical fiber 5 with the coating layer is placed in the mounting groove of the heat dissipation base 21.
Then adjusting the relative position of the output optical fiber 5 and the heat dissipation base 21, in the adjusting process, firstly, respectively clamping and fixing the input optical fiber 4 and the output optical fiber 5 which are positioned at two ends of the packaging base 11 through a clamping device, and then moving the packaging base 11 and the heat dissipation base 21 along the length direction of the optical fiber beam combiner, so that one end of the heat dissipation base 21 is moved to be aligned with the end face of the coating layer of the output optical fiber 5.
After the coating layers of the heat dissipation base 21 and the output optical fiber 5 are aligned, high-folding UV glue is injected into the mounting groove of the heat dissipation base 21 and irradiates an ultraviolet lamp to solidify the high-folding UV glue. When glue is injected to one end close to the aligned end face, the glue injection point is away from the end part by a preset distance, and then the glue flows to the end parts of the heat dissipation base 21 and the coating layer by means of the surface tension of the high-folding UV glue.
After being full of the high UV of rolling over glues in the mounting groove, cover the heat dissipation apron, the heat dissipation apron can be pressed and put on the tangent plane of going up of coating, makes the lateral wall and the radiating part 2 full contact of output optical fiber 5's coating, does not have the air gap to improve the heat conduction efficiency between coating and the radiating part 2, make the used heat that gets into the laser conversion of coating can be derived fast, reduce the temperature on coating.
After the heat dissipation member 2 and the output optical fiber 5 are mounted, the package cover plate 12 is covered on the package base 11, and since the size of the accommodating groove of the package base 11 is matched with the size of the heat dissipation member 2, when the package cover plate 12 is covered on the package base 11, the package cover plate 12 can be tightly pressed above the heat dissipation cover plate, so that the outer surface of the heat dissipation member 2 is tightly attached to the inner surface of the package substrate 1. And then plugging the wire inlet and the wire outlet at two ends of the packaging substrate 1 by high-radiation UV glue, and simultaneously bonding and fixing the input optical fiber 4 and the output optical fiber 5 with the packaging substrate 1 respectively.
After the heat dissipation member 2, the package substrate 1 and the optical fiber combiner are assembled, the two are fixed to the metal heat sink 3, and the optical fiber combiner is packaged.
The application also provides an optical fiber laser, which comprises the packaging structure of the optical fiber combiner of any embodiment.
In this embodiment, the fiber laser includes the packaging structure of the optical fiber combiner, so the fiber laser has all the beneficial effects of the packaging structure of the optical fiber combiner, and details are not repeated here.
Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; while the invention has been described in detail and with reference to the foregoing embodiments, it will be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; and the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present invention.

Claims (10)

1. The packaging structure of the optical fiber beam combiner is characterized by comprising a packaging substrate and a heat dissipation piece;
an accommodating chamber is formed in the packaging substrate and used for placing an optical fiber combiner, and a fusion joint point of an input optical fiber and an output optical fiber of the optical fiber combiner is positioned in the accommodating chamber;
the heat dissipation piece is positioned in the accommodating cavity, and the outer wall of the heat dissipation piece is attached to the inner wall of the accommodating cavity;
the heat dissipation piece is provided with a mounting through hole, so that the heat dissipation piece can be sleeved on the optical fiber section of the output optical fiber with the coating layer;
the inner wall of the heat dissipation piece is attached to the coating layer of the output optical fiber, and one end of the heat dissipation piece is flush with the end part of the coating layer of the output optical fiber.
2. The package structure of an optical fiber combiner according to claim 1, wherein the heat sink comprises a heat sink base and a heat sink cover;
the heat dissipation base is provided with a mounting groove, the output optical fiber can be embedded into the mounting groove, and the outer wall of the coating layer of the output optical fiber is attached to the inner wall of the mounting groove;
the heat dissipation cover plate is covered on the mounting groove and is pressed on the coating layer; the heat dissipation cover plate is used for sealing the installation groove to form the installation through hole.
3. The package structure of the optical fiber combiner according to claim 2, wherein the heat dissipation base and the heat dissipation cover plate are made of sapphire or diamond.
4. The package structure of an optical fiber combiner according to claim 1, wherein the length of the heat dissipation member is 1cm to 3 cm.
5. The package structure of an optical fiber combiner according to claim 1, wherein a high-refractive UV glue is filled between the mounting through hole and the coating layer to bond and fix the output optical fiber and the heat sink.
6. The package structure of the optical fiber combiner as claimed in claim 5, wherein the package substrate comprises a package base and a package cover;
the packaging base is provided with a containing groove, the packaging cover plate is covered on the containing groove, and the packaging cover plate is used for sealing the containing groove to form the containing cavity;
and the high-folding UV glue is filled between the outer wall of the heat dissipation piece and the inner wall of the containing cavity.
7. The package structure of claim 6, wherein the package base and the package cover are made of quartz.
8. The package structure of the optical fiber combiner according to claim 1, further comprising a heat sink;
the heat sink comprises a heat sink base and a heat sink cover plate;
a groove is formed in the heat sink base, the packaging substrate is placed in the groove, and the side wall of the packaging substrate is attached to the inner wall of the groove;
the heat sink cover plate is pressed on the packaging substrate and detachably connected with the heat sink base through a fastener.
9. The package structure of the optical fiber combiner according to claim 8, wherein the heat sink is made of a metal material with a high thermal conductivity, and the inner wall of the heat sink is formed with a matte coating.
10. A fiber laser comprising the package structure of the optical fiber combiner according to any one of claims 1 to 9.
CN202011388506.6A 2020-12-01 2020-12-01 Packaging structure of optical fiber combiner and optical fiber laser Pending CN112394530A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202011388506.6A CN112394530A (en) 2020-12-01 2020-12-01 Packaging structure of optical fiber combiner and optical fiber laser

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202011388506.6A CN112394530A (en) 2020-12-01 2020-12-01 Packaging structure of optical fiber combiner and optical fiber laser

Publications (1)

Publication Number Publication Date
CN112394530A true CN112394530A (en) 2021-02-23

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114296176A (en) * 2022-01-06 2022-04-08 上海昊量光电设备有限公司 Suspended glue-free high-power optical fiber bundle and manufacturing method thereof

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114296176A (en) * 2022-01-06 2022-04-08 上海昊量光电设备有限公司 Suspended glue-free high-power optical fiber bundle and manufacturing method thereof
CN114296176B (en) * 2022-01-06 2023-09-26 上海昊量光电设备有限公司 Suspended glue-free high-power optical fiber bundle and manufacturing method thereof

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