CN112389074A - Substrate laminating method and substrate laminating device - Google Patents
Substrate laminating method and substrate laminating device Download PDFInfo
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- CN112389074A CN112389074A CN202011131821.0A CN202011131821A CN112389074A CN 112389074 A CN112389074 A CN 112389074A CN 202011131821 A CN202011131821 A CN 202011131821A CN 112389074 A CN112389074 A CN 112389074A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/18—Handling of layers or the laminate
- B32B38/1825—Handling of layers or the laminate characterised by the control or constructional features of devices for tensioning, stretching or registration
- B32B38/1833—Positioning, e.g. registration or centering
- B32B38/1841—Positioning, e.g. registration or centering during laying up
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/20—Displays, e.g. liquid crystal displays, plasma displays
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Physics & Mathematics (AREA)
- Fluid Mechanics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention relates to the technical field of display assembly manufacturing, and discloses a substrate attaching method and a substrate attaching device. The substrate attaching method includes the steps of: s1, fixing the first substrate on the carrier assembly; s2, coating glue on the preset position of the first substrate; s3, pressing the second substrate on the preset position of the first substrate; s4, standing the first substrate and the second substrate together for a preset time to enable the glue to be flat; and S5, calibrating the position of the second substrate to push the second substrate to the preset position of the first substrate again. The substrate attaching method can reduce the influence of glue flowing on the attaching relative position of the two substrates and improve the attaching precision of the substrates. The substrate bonding device can improve the bonding position precision of the two substrates by adopting the substrate bonding method.
Description
Technical Field
The invention relates to the technical field of display assembly processing, in particular to a substrate attaching method and a substrate attaching device.
Background
The display assembly comprises a step of attaching a glass substrate to a wafer through liquid optical cement in a production process. The process of attaching a glass panel to a wafer in the prior art includes: fixing the wafer on a carrying platform, coating liquid optical cement on the upper surface of the wafer, respectively photographing the wafer and the glass substrate, and accurately pressing the glass panel on the wafer according to the comparison result of the photographing information. The substrate attaching method can ensure the position precision when the glass substrate is placed on the wafer, but when the glass substrate is pressed on the wafer, the liquid optical cement is extruded to generate deformation flow, and after the pressing is finished, the liquid optical cement generates certain flow in the standing and leveling process, so that the glass substrate is driven to generate position deviation relative to the wafer. The glass panel which is attached by the substrate attaching method in the prior art has errors of about 0.15mm in the horizontal X direction and the horizontal Y direction, and the levelness is about 0.05mm, so that the requirements of customers with high-precision requirements cannot be met.
Therefore, it is desirable to provide a substrate bonding method and a substrate bonding apparatus to solve the above problems.
Disclosure of Invention
The invention aims to provide a substrate bonding method, which is high in relative position precision of two bonded substrates.
A second object of the present invention is to provide a substrate bonding apparatus capable of improving the positional accuracy of bonding of two substrates by using the above substrate bonding method.
In order to achieve the purpose, the invention adopts the following technical scheme:
a substrate attaching method includes the steps:
s1, fixing the first substrate on the carrier assembly;
s2, coating glue on the preset position of the first substrate;
s3, pressing a second substrate at the preset position of the first substrate;
s4, standing the first substrate and the second substrate together for a preset time to enable the glue to be leveled;
s5, calibrating the position of the second substrate to push the second substrate to the preset position of the first substrate again.
Optionally, the position of the second substrate is calibrated in step S5 by a calibration assembly, the calibration assembly including two push rods capable of performing a clamping action and an opening action in a horizontal plane, and the process of calibrating the second substrate in step S5 includes:
s51, the two push rods perform a first preset clamping action so as to enable the two push rods to be respectively abutted against one group of opposite two sides of the second substrate and then opened;
s52, the carrying platform component drives the first substrate and the second substrate to rotate together for 90 degrees in the horizontal plane;
and S53, performing a second preset clamping action on the two push rods so as to enable the two push rods to be respectively abutted against the two opposite sides of the other group of the second substrate.
Optionally, the preset position of the second substrate on the first substrate includes a first horizontal position and a second horizontal position, where the first horizontal position is perpendicular to the second horizontal position;
and the stroke of the first preset clamping action and the stroke of the second preset clamping action of the two push rods are respectively and correspondingly set according to the first horizontal direction position and the second horizontal direction position.
Optionally, in the vertical direction, a gap H is provided between the lower surface of the push rod and the upper surface of the first substrate.
Optionally, the thickness of the second substrate is B, wherein H is more than or equal to 0.2mm and less than or equal to 0.6B.
Optionally, in step S3, the step of pressing the second substrate at the predetermined position includes:
s31, photographing the first substrate and obtaining the position information of the first substrate;
s32, photographing the second substrate and obtaining the position information of the second substrate;
and S33, according to the comparison result of the position information of the first substrate and the second substrate, transporting the second substrate to a preset position of the first substrate and pressing.
A substrate bonding apparatus using the above substrate bonding method, the substrate bonding apparatus comprising:
the carrying platform assembly is used for carrying and fixing the first substrate;
the grabbing and pressing assembly is used for grabbing the second substrate and pressing the second substrate at a preset position of the first substrate;
the rotary driving component is used for driving the carrying platform component to rotate in a horizontal plane;
the calibration assembly comprises a push rod driving source and two push rods, wherein the push rod driving source can drive the two push rods to be close to each other so as to be respectively abutted against two opposite sides of the second substrate.
Optionally, the push rod comprises:
a body part connected with the push rod driving source;
the pushing portion is connected with one end of the pushing portion and comprises a vertical face, the vertical face is used for being abutted against the side face of the second substrate, and chamfers are not arranged at the upper end and the lower end of the vertical face.
Optionally, a size of the pushing portion in a vertical direction is smaller than a size of the body portion in the vertical direction;
a guide surface is arranged between the pushing part and the body part.
Optionally, the stage assembly includes a stage body and a first vacuum chuck disposed on an upper surface of the stage body, where the stage body is configured to support the first substrate, and the first vacuum chuck is configured to adsorb and fix the first substrate on the stage body; and/or
The grabbing press-fit assembly comprises a second vacuum chuck, and the grabbing press-fit assembly grabs the second substrate through the adsorption of the second vacuum chuck.
The invention has the beneficial effects that:
according to the substrate attaching method, after the second substrate is pressed on the first substrate, the second substrate is placed for a certain time to enable glue to be leveled, the second substrate deviates relative to the first substrate along with the horizontal flowing of the glue in the process, after the placement is finished, the position of the second substrate relative to the first substrate is calibrated, the influence of the flowing of the glue on the relative position of the two substrates is reduced, and the attaching precision of the substrates is improved.
The substrate bonding apparatus according to the present invention can improve the positional accuracy of bonding two substrates by using the substrate bonding method.
Drawings
Fig. 1 is a flowchart of a first substrate bonding method according to an embodiment of the present invention;
FIG. 2 is a flow chart of a second method for bonding a substrate according to an embodiment of the present invention;
FIG. 3 is a schematic diagram of the mechanism of the present invention providing an embodiment of the first substrate in one orientation;
FIG. 4 is a schematic diagram of a first substrate in another orientation according to an embodiment of the present invention;
FIG. 5 is a front view of a putter in accordance with an embodiment of the present invention;
FIG. 6 is a bottom view of FIG. 5;
fig. 7 is a side view of fig. 3.
In the figure:
1-a first substrate;
2-a second substrate;
3-a push rod; 31-a body portion; 32-a pushing part; 33-guide surface.
Detailed Description
The present invention will be described in further detail with reference to the accompanying drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the invention and are not limiting of the invention. It should be further noted that, for the convenience of description, only some of the structures related to the present invention are shown in the drawings, not all of the structures.
In the description of the present invention, unless expressly stated or limited otherwise, the terms "connected," "connected," and "fixed" are to be construed broadly, e.g., as meaning permanently connected, removably connected, or integral to one another; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
In the present invention, unless otherwise expressly stated or limited, "above" or "below" a first feature means that the first and second features are in direct contact, or that the first and second features are not in direct contact but are in contact with each other via another feature therebetween. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.
In the description of the present embodiment, the terms "upper", "lower", "right", etc. are used in an orientation or positional relationship based on that shown in the drawings only for convenience of description and simplicity of operation, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used only for descriptive purposes and are not intended to have a special meaning.
The embodiment relates to the technical field of display assembly production, and provides a substrate attaching method. In this embodiment, a substrate bonding method is applied to a process of bonding a glass substrate to a wafer, where a first substrate represents a wafer and a second substrate represents a glass substrate. Of course, in other embodiments, the substrate attaching method may also be used in other fields, and the process of precisely attaching two plate-shaped workpieces by using glue is also used. As shown in fig. 1, the method for bonding a substrate of the present embodiment includes the steps of:
s1, fixing the first substrate 1 on the stage assembly;
s2, coating glue on the preset position of the first substrate 1;
s3, pressing the second substrate 2 on the preset position of the first substrate 1;
s4, standing the first substrate 1 and the second substrate 2 together for a preset time to flatten the glue;
s5, the position of the second substrate 2 is calibrated to push the second substrate 2 to the predetermined position of the first substrate 1 again.
According to the substrate attaching method, after the second substrate 2 is pressed on the first substrate 1, the second substrate 2 is placed for a certain time to enable glue to be leveled, in the process, the second substrate 2 deviates relative to the first substrate 1 along with the horizontal flowing of the glue, after the placing is finished, the position of the second substrate 2 relative to the first substrate 1 is recalibrated, the influence of the flowing of the glue on the attaching relative position of the two substrates is reduced, and therefore the attaching precision of the substrates is improved.
Specifically, in this embodiment, the second substrate 2 is bonded to the first substrate 1 and then left standing for five minutes. In other embodiments, the glue can be leveled to the standard, and the preset standing time is selected and set according to the actual situation.
Preferably, the stage assembly used in the substrate attaching method of the present embodiment includes a stage body and a first vacuum chuck disposed on an upper surface of the stage body, where the stage body is configured to support the first substrate 1, and the first vacuum chuck is configured to fix the first substrate 1 on the stage by suction; furthermore, in the process of pressing the second substrate 2 on the first substrate, the grabbing pressing assembly is adopted and comprises a second vacuum chuck, the grabbing pressing assembly grabs the second substrate 2 through the second vacuum chuck and presses the second substrate 2 on the first substrate 1, and the vacuum adsorption mode is convenient for taking and placing the substrates and is not easy to damage the substrates. In this embodiment, the grabbing and pressing assembly further comprises a manipulator, the second vacuum chuck is connected with the manipulator, and after the second vacuum chuck adsorbs the second substrate 2, the manipulator conveys and presses the second substrate 2 to the preset position of the first substrate 1.
Preferably, as shown in fig. 2, the step of pressing the second substrate 2 at the predetermined position of the first substrate 1 in step S3 includes:
s31, the first CCD detection assembly shoots the first substrate 1 and obtains the position information of the first substrate 1;
s32, the second CCD detecting component photographs the second substrate 2 and obtains the position information of the second substrate 2;
s33, according to the comparison result of the position information of the first substrate 1 and the second substrate 2, the second substrate 2 is transported to the predetermined position of the first substrate 1 and pressed.
The first CCD detection assembly and the second CCD detection assembly are used for respectively obtaining the accurate position information of the first substrate 1 and the second substrate 2, and the relative position relation between the first substrate 1 and the second substrate 2 can be calculated, namely the position where the grabbing pressing assembly actually needs to move is calculated, so that the position accuracy of the second substrate 2 placed on the first substrate 1 is improved.
Preferably, the position of the second substrate 2 is calibrated in step S5 by a calibration assembly, as shown in fig. 2-4, the calibration assembly includes two push rods 3 capable of performing a clamping action and an opening action in a horizontal plane, and the process of calibrating the second substrate 2 in step S5 includes:
s51, the two push rods 3 perform a first preset clamping action to make the two push rods 3 respectively abut against a set of two opposite sides of the second substrate 2, and then perform an opening action;
s52, the carrying platform drives the first substrate 1 and the second substrate 2 to rotate together by 90 degrees in the horizontal plane;
s53, the two pushing rods 3 perform a second predetermined clamping operation to make the two pushing rods 3 respectively abut against the two opposite sides of the other group of the second substrate.
In this embodiment, the preset position of the second substrate 2 on the first substrate 1 includes a first horizontal position (i.e., a position in the X direction in fig. 3) and a second horizontal position (i.e., a position in the Y direction in fig. 3), with the first substrate 1 itself as a reference, and the first horizontal direction is perpendicular to the second horizontal direction. In the calibration process, the two push rods 3 perform a first preset clamping action, and can push and abut against a pair of side surfaces of the second substrate 2 along a first horizontal direction (X direction) of the first substrate 1, so that the position calibration of the second substrate 2 relative to the first substrate 1 along the X direction is realized; then the first substrate 1 and the second substrate 2 rotate together by 90 degrees; at this time, as shown in fig. 4, when the clamping direction of the push rods 3 is the Y direction which is the second horizontal direction with respect to the first substrate 1, the two push rods 3 perform the second predetermined clamping operation and can be brought into contact with the other pair of side surfaces of the second substrate 2 in the Y direction which is the second horizontal direction of the first substrate 1, respectively, thereby achieving the positional alignment of the second substrate 2 with respect to the first substrate 1 in the Y direction and finally achieving the positional alignment of the entire second substrate 2 with respect to the first substrate 1.
Specifically, the clamping action and the opening action of the two push rods 3 are realized through the push rod driving sources, wherein the push rod driving sources are arranged in two groups, each group of linear driving sources is used for driving one push rod 3 to move, each group of push rod driving sources comprises a servo motor and a group of screw nut pairs, the push rods 3 are connected with nuts, and the servo motors drive the screw rods to rotate so that the nuts drive the push rods 3 to do linear motion. In other embodiments, the push rod driving source may also be two linear cylinders, or other components or assemblies capable of driving the push rod 3 to move linearly.
Specifically, the first preset clamping action stroke and the second preset clamping action stroke of the two push rods 3 are respectively set correspondingly according to the preset first horizontal direction position and the preset second horizontal direction position on the drawing, so that the stroke of each clamping action of the two push rods 3 is ensured to be matched with the current direction of the first substrate 1. With the substrate bonding method of the present embodiment, the positional accuracy of the first substrate 1 and the second substrate 2 can be controlled within 0.05mm in both the X direction and the Y direction.
As shown in fig. 5 and 6, the push rods 3 used in the substrate attaching method of the present embodiment include a body portion 31 and a pushing portion 32 connected to one end of the body portion 31, and the pushing portion 32 includes vertical surfaces for making abutting contact with the end surfaces of the second substrate 2, so that the vertical surfaces of the pushing portions 32 of the two push rods 3 are respectively in abutting contact with the end surfaces of the two opposite ends of the second substrate, so that the levelness of the second substrate 2 can be corrected. Specifically, in the present embodiment, the body portion 31 is connected to the output end of the pusher drive source. Preferably, the upper and lower both ends of vertical face do not set up the chamfer to can guarantee that the contact surface of promotion portion 32 and second base plate 2 is strict plane, improve the correction effect to second base plate 2 levelness. By the substrate bonding method of the present embodiment, the levelness of the second substrate 2 can be controlled within 0.03 mm.
Further, as shown in fig. 6, the size of the pushing portion 32 in the vertical direction is smaller than that of the body portion 31, and since the machining accuracy requirement of the vertical surface of the pushing portion 32 is high, the machining cost of the push rod 3 can be reduced appropriately by making the height size of the pushing portion 32 smaller than that of the body portion 31; in addition, the guide surface 33 is arranged between the pushing part 32 and the body part 31, so that the connection between the body part 31 and the pushing part 32 is smoother, and the problem of stress concentration between the body part 31 and the pushing part 32 is avoided.
Preferably, as shown in fig. 7, in the substrate attaching method according to this embodiment, when the clamping action and the opening action are performed, a distance H is provided between the lower surface of the push rod 3 and the upper surface of the first substrate 1 along the vertical direction, so that the push rod 3 is prevented from being scratched to the upper surface of the first substrate 1 when the clamping action and the opening action are performed, and the first substrate 1 is prevented from being damaged. Further, the thickness of the second substrate 2 is B, wherein H is greater than or equal to 0.2mm and less than or equal to 0.6B, which can ensure that the push rod 3 and the first substrate 1 have a sufficient distance to prevent the first substrate 1 from being scratched, and when the push rod 3 pushes the second substrate 2, the lowest stress point of the second substrate 2 is not too high, so that the second substrate 2 is easy to be pushed.
The embodiment also provides a substrate attaching device, and the substrate attaching device adopts the substrate attaching method, so that the relative position precision of two substrates can be improved during attaching. Specifically, the substrate attaching device comprises a carrier assembly, a grabbing press-fit assembly, a rotary driving assembly and a calibration assembly, wherein the carrier assembly is used for bearing and fixing a first substrate 1, the grabbing press-fit assembly is used for grabbing a second substrate 2 and pressing the second substrate 2 at a preset position of the first substrate 1, the rotary driving assembly is used for driving the carrier assembly to rotate in a horizontal plane, the calibration assembly comprises a push rod driving source and two push rods 3, and the push rod driving source can drive the two push rods 3 to be close to each other so as to be respectively abutted to two opposite sides of the second substrate 2. Wherein, microscope carrier subassembly, snatch pressing components and calibration subassembly can all be supported in the frame of base plate laminating device.
It should be understood that the above-described embodiments of the present invention are merely examples for clearly illustrating the invention and are not to be construed as limitations of the embodiments of the present invention, but may be modified in various embodiments and applications by those skilled in the art according to the spirit of the present invention, and the content of the present description should not be construed as a limitation of the present invention. Any modification, equivalent replacement, and improvement made within the spirit and principle of the present invention should be included in the protection scope of the claims of the present invention.
Claims (10)
1. A substrate attaching method is characterized by comprising the following steps:
s1, fixing the first substrate (1) on the carrying platform assembly;
s2, coating glue on the preset position of the first substrate (1);
s3, pressing a second substrate (2) at a preset position of the first substrate (1);
s4, standing the first substrate (1) and the second substrate (2) together for a preset time to enable the glue to be leveled;
s5, calibrating the position of the second substrate (2) to push the second substrate (2) to the preset position of the first substrate (1) again.
2. The substrate bonding method according to claim 1, wherein the position of the second substrate (2) is calibrated by a calibration assembly in step S5, the calibration assembly including two push rods (3) capable of performing a clamping action and an opening action in a horizontal plane, and the process of calibrating the second substrate (2) in step S5 includes:
s51, the two push rods (3) perform a first preset clamping action so that the two push rods (3) are respectively abutted against one group of opposite two sides of the second base plate (2) and then are opened;
s52, the carrying platform component drives the first substrate (1) and the second substrate (2) to rotate together for 90 degrees in the horizontal plane;
and S53, carrying out a second preset clamping action on the two push rods (3) so as to enable the two push rods (3) to be respectively abutted against the two opposite sides of the other group of the second base plate (2).
3. The substrate bonding method according to claim 2, wherein the predetermined position of the second substrate (2) on the first substrate (1) comprises a first horizontal position and a second horizontal position, wherein the first horizontal direction is perpendicular to the second horizontal direction;
the stroke of the first preset clamping action and the stroke of the second preset clamping action of the two push rods (3) are correspondingly set according to the first horizontal direction position and the second horizontal direction position respectively.
4. The substrate bonding method according to claim 2 or 3, wherein a distance H is provided between a lower surface of the pusher (3) and an upper surface of the first substrate (1) in a vertical direction.
5. The method of claim 4, wherein the second substrate (2) has a thickness B, wherein H is 0.2mm or less and H is 0.6B or less.
6. The substrate bonding method according to any one of claims 1 to 3, wherein the step of pressing the second substrate (2) at the predetermined position in step S3 includes:
s31, photographing the first substrate (1) and obtaining the position information of the first substrate (1);
s32, photographing the second substrate (2) and obtaining the position information of the second substrate (2);
s33, according to the comparison result of the position information of the first substrate (1) and the second substrate (2), the second substrate (2) is transported to the preset position of the first substrate (1) and pressed.
7. A substrate bonding apparatus, characterized in that the substrate bonding method according to any one of claims 1 to 6 is used, the substrate bonding apparatus comprising:
a carrier assembly for carrying and fixing the first substrate (1);
the grabbing and pressing assembly is used for grabbing the second substrate (2) and pressing the second substrate (2) at a preset position of the first substrate (1);
the rotary driving component is used for driving the carrying platform component to rotate in a horizontal plane;
the calibration assembly comprises a push rod driving source and two push rods (3), wherein the push rod driving source can drive the two push rods (3) to be close to each other so as to be respectively abutted against two opposite sides of the second base plate (2).
8. The substrate bonding apparatus according to claim 7, wherein the push rod (3) comprises:
a body part (31) connected to the pusher drive source;
the pushing portion (32) is connected to one end of the pushing portion (32), the pushing portion (32) comprises a vertical face, the vertical face is used for being abutted to the side face of the second substrate (2), and chamfers are not arranged at the upper end and the lower end of the vertical face.
9. The substrate bonding apparatus according to claim 8, wherein the pushing portion (32) has a size in a vertical direction smaller than that of the body portion (31);
a guide surface (33) is provided between the pushing portion (32) and the body portion (31).
10. The substrate bonding apparatus according to claim 7, wherein the stage assembly comprises a stage body and a first vacuum chuck disposed on an upper surface of the stage body, the stage body is configured to support the first substrate (1), and the first vacuum chuck is configured to suck and fix the first substrate (1) on the stage body; and/or
The grabbing press-fit assembly comprises a second vacuum chuck, and the grabbing press-fit assembly grabs the second substrate (2) through the second vacuum chuck in an adsorption mode.
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| CN202011131821.0A CN112389074B (en) | 2020-10-21 | 2020-10-21 | Substrate bonding method and substrate bonding device |
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| CN202011131821.0A CN112389074B (en) | 2020-10-21 | 2020-10-21 | Substrate bonding method and substrate bonding device |
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| CN109555766A (en) * | 2018-10-30 | 2019-04-02 | 信利半导体有限公司 | A kind of full fitting production method of display module |
| CN111483210A (en) * | 2020-04-20 | 2020-08-04 | 丽水学院 | Manufacturing method and processing equipment of corrosion-resistant titanium door with double-layer sandwich structure |
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2020
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|---|---|---|---|---|
| CN108263071A (en) * | 2018-03-23 | 2018-07-10 | 沭阳崇至工贸有限公司 | A kind of multi-plate bonding device convenient for gluing |
| CN108177420A (en) * | 2018-03-26 | 2018-06-19 | 沭阳崇至工贸有限公司 | A kind of multiple-plate laminating apparatus |
| CN109397840A (en) * | 2018-10-25 | 2019-03-01 | 浙江西溪玻璃有限公司 | A kind of doubling glass laminating apparatus for avoiding generating bubble |
| CN109555766A (en) * | 2018-10-30 | 2019-04-02 | 信利半导体有限公司 | A kind of full fitting production method of display module |
| CN111483210A (en) * | 2020-04-20 | 2020-08-04 | 丽水学院 | Manufacturing method and processing equipment of corrosion-resistant titanium door with double-layer sandwich structure |
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