CN1123780C - System and method for screening ICT test blindspots to make mask board for visual check - Google Patents
System and method for screening ICT test blindspots to make mask board for visual check Download PDFInfo
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- CN1123780C CN1123780C CN 00124418 CN00124418A CN1123780C CN 1123780 C CN1123780 C CN 1123780C CN 00124418 CN00124418 CN 00124418 CN 00124418 A CN00124418 A CN 00124418A CN 1123780 C CN1123780 C CN 1123780C
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Abstract
The present invention relates to a system and a method of screening test blind spots of an ICT (integrated circuit tester) for manufacturing a visual inspection housing plate, which is used for screening elements which are easily and wrongly judged by the ICT and elements which are not detected by the ICT from an original ICT data file and a BOM file and storing the information of the elements to a housing plate data file; the housing plate data file can be supplied to a laser cutting device for manufacturing the visual inspection housing plate for manual visual inspection. The method makes not all elements on a mainboard need examining when elements are absent in the visual inspection, and only the elements easily and wrongly judged by the ICT and not detected by the ICT need examining. The method has the advantages of increased examination efficiency of testers, accelerated product output speed and labor cost saving.
Description
Technical field
The invention relates to the System and method for of a kind of screening ICT (intercircuit test: intermediate circuit is tested) test blindspot, and particularly screen ICT test blindspot system to carry out the method for follow-up manufacturing mask board for visual check relevant for a kind of the utilization with the manufacturing mask board for visual check.
Background technology
In the manufacture process of motherboard, must be through the step of test.To be tested errorless after, could be with the finished product shipment.And in the process therein, (SurfaceMount Technology after operation SMT), normally utilizes ICT testing apparatus (testtools) that motherboard is carried out testing electrical property to motherboard through surface-mounted technology.Motherboard carries out the program of Manual Visual Inspection then by after the ICT test.Because of ICT tests the possibility that element is had erroneous judgement, the scope of adding its test approximately only contains 75 percent element, and about in addition 25 percent is elements that ICT does not detect.So must further detect by means of the program of Manual Visual Inspection.
And before carrying out Manual Visual Inspection, must make a mask board for visual check in advance.Mask board for visual check is according to the position of components magnitude proportion on the motherboard to be measured, and with a plank hollow out that is equivalent to the motherboard size.When Manual Visual Inspection, with this mask board for visual check directly cover be put in the upper surface of motherboard, in order to check the element Short Item whether on the main frame.With at present, Manual Visual Inspection still must detect whole element on the motherboard.So for stressing now fast and efficient, ICT and Manual Visual Inspection have duplicate detection similar elements part, and the shortcoming that increases the detection required time is arranged.Therefore labor intensive and time, increase the burden of cost again.
Summary of the invention
In view of this, purpose of the present invention is exactly to provide a kind of ICT of screening test blindspot to make the System and method for of mask board for visual check.Make the tester when visual inspection is tested, do not need to check all elements, only need to check in the ICT testing electrical property and easily judge by accident and undetected element.Therefore can shorten tester's supervision time, accelerate production speed, and save manpower cost cost.
According to purpose of the present invention, a kind of ICT test blindspot that screens is proposed to make the method for mask board for visual check, the method is to produce a cover plate data file in order to screening in an ICT raw data file and a BOM file.And this cover plate data file can be made a mask board for visual check in order to offer a laser cutting device.Method of the present invention at first is step a, in the ICT raw data file, finds out the position of the SMT element that ICT do not detect; Then carry out step b, the position and the BOM file of the SMT element that does not detect with ICT compare, and find out the item number and the name of an article of the SMT element that ICT do not detect; Then in step c, in the BOM file, find out position, item number and the name of an article of the bigger element of easy erroneous judgement of ICT and area; At last in steps d, position, item number and the name of an article of the SMT element that ICT is not detected, the ICT element that easily element of erroneous judgement and area are bigger export the cover plate data file to.
Wherein, above-mentioned steps a also comprises following substep.In step a1, open the ICT raw data file; Then carry out step a2, delete the testing procedure of non-SMT element; In step a3, delete the testing procedure that ICT had detected immediately; Then in step a4, delete the testing procedure of DIP element; Then carry out step a5, in step a5, the testing procedure that the position of components of deletion and other testing procedures repeats.
According to purpose of the present invention, a kind of ICT of screening test blindspot is proposed in addition to make the system of mask board for visual check, utilize the position of the element that easily position of the element of erroneous judgement and area are bigger of ICT in the position of the SMT element that ICT does not detect in the ICT raw data file and the BOM file to obtain a cover plate data file, and output cover plate data file; Utilize a laser cutting device again, receive the cover plate data file, and make mask board for visual check according to the cover plate data file.
For above-mentioned purpose of the present invention, feature and advantage can be become apparent, a most preferred embodiment cited below particularly, and in conjunction with the accompanying drawings, be described in detail below.
Description of drawings
Fig. 1 illustrates according to the screening ICT test blindspot of a most preferred embodiment of the present invention to make the system chart of mask board for visual check.
Fig. 2 illustrates the process flow diagram into the conversion cover plate program among Fig. 1.
Fig. 3 illustrates the process flow diagram for the method for the position of seeking the SMT element that ICT do not detect among Fig. 2.
Embodiment
After production line is produced motherboard, must be by the electrical characteristics test of ICT.But ICT can produce erroneous judgement or the possibility that does not detect is arranged for motherboard top element.So, must pass through the inspection of Manual Visual Inspection again through the motherboard after the ICT test.And in motherboard, include element made from surface-mounted technology and the element made from DIP (Dual-in Packing: double-row type encapsulates).The present invention utilizes a conversion cover plate program to find out easily erroneous judgement and not the SMT element of detecting in the ICT electrical characteristics are tested, and exports a cover plate data file that has item number, the name of an article of these elements and be positioned at the position on the motherboard.So-called " position " is meant that an element is positioned at the position on the motherboard.In the present invention, this position is represented with code (character string).This cover plate data file is can be in order to make a mask board for visual check.The size of this mask board for visual check is consistent with the upper surface of motherboard, and with the relative position hollow out on the motherboard of examine element place, indicates the item number and the name of an article of element.When the visual inspection Short Item is tested, with this mask board for visual check directly cover be put in the upper surface of motherboard, in order to check the element Short Item whether on the motherboard.
At first please refer to Fig. 1, it illustrates according to the screening ICT test blindspot of a preferred embodiment of the present invention to make the system chart of mask board for visual check.In Fig. 1, the present invention includes a cover plate converse routine 13, it needs two input file: BOM (bill of material: material list) file 11 and ICT raw data file 12.All testing procedures when ICT raw data file 12 carries out the test of ICT electrical characteristics for record motherboard to be measured.In ICT raw data file 12, each testing procedure writes down its ICT testing procedure order at least, is positioned at position, test target (as an element or the pin of an element) and columns such as " whether detecting " on the motherboard.And BOM file 11 is for element item number, the name of an article of record motherboard and be positioned at data such as position on the motherboard.Cover plate converse routine 13 is exported a cover plate data file 14 to laser cutting device 15 after reading BOM file 11 and ICT raw data file 12 and conversion process.Cover plate data file 14 is writing down should be by the location name of the element of hollow out, element item number and the name of an article on the mask board for visual check.Via laser cutting device 15, produce mask board for visual check 16 again, as the test of visual inspection Short Item according to cover plate data file 14.Wherein, the description of relevant cover plate converse routine 13 please refer to Fig. 2.
Figure 2 shows that the process flow diagram of the cover plate converse routine 13 among Fig. 1.Step 21 therein at first in the ICT raw data file, is found out the position of the SMT element that ICT do not detect.Then enter step 23.
Wherein, the substep relevant for step 21 please also refer to Fig. 3.Figure 3 shows that the method flow diagram of the position of the SMT element that searching ICT does not detect among Fig. 2.In step 31, at first open the ICT raw data file, then carry out step 33.In step 33, comprise the testing procedure of non-SMT element in the deletion ICT raw data file, only keep the testing procedure of SMT element.And the SMT element is positioned at location name on the motherboard is to be beginning with " R ", " L ", " C ", " D ", " Q ", " U ", " JL ", " JR ", " EC ", is respectively resistance (R), inductance (L), electric capacity (C), diode (D), power electric crystal (Q), QFP (U), inductance (JL), resistance (JR), electric capacity (EC) usually.So step but to be the delete position title non-is the testing procedure of beginning with " R ", " L ", " C ", " D ", " Q ", " U ", " JL ", " JR ", " EC ".
Then carry out step 35, he is the testing procedure that deletion ICT had detected, keeps the testing procedure that ICT does not detect.Because in the ICT raw data file, whether " whether detecting " column of each testing procedure can write down is the not detecting step of ICT.For example " whether detect " if column value " SKIP " represents that then this testing procedure is the not detecting step of ICT.So in step 35, be to can be the testing procedure that deletion does not contain " SKIP ", can keep the step that ICT does not detect at this.Then carry out step 37.
In step 37, deletion includes the testing procedure of DIP element.Because in step 33, be only afraid of to filter out fully the testing procedure of DIP element, so in this step 37, in order to filter the testing procedure of DIP element.And the DIP element is the character string that includes "/NC ", " LAN ", " LCD ", " RJ ", " CK ", " NP/N " or " DIP " in the location name of motherboard, above-mentioned DIP element be respectively usually do not go up part (/NC), networking card part (LAN), LCD part (LCD), JUMPER (RJ), DIP part (CK), do not go up part (NP/N), DIP part (DIP).So step 37 is to can be to include one of them testing procedure of above-mentioned word string in the title of delete position.Then carry out step 39.
In step 39, the testing procedure deletion that will repeat with the location name of other testing procedures.Because of in the ICT raw data file, a position of components often comprises many testing procedures on the motherboard.And the usefulness of Fig. 3 means in order to finding out the position of the SMT element that ICT do not detect, so in identical position but when a plurality of testing procedure was arranged, only need keep a testing procedure was that representative gets final product.
In addition, in step 39, also can avoid repeating again with easily erroneous judgement and the bigger element deletion of area of ICT with the element of step 25.
In addition, still identical if step 33,35,37 and 39 order are exchanged arbitrarily in Fig. 3 with spirit of the present invention, can also reach identical result.But for investigating the speed of carrying out the method, the sequence of steps shown in Fig. 3 is the flow process for optimum efficiency.
Please refer to Fig. 2, in step 23, is the location name and the comparison of the data in the BOM file of the SMT element do not detected with ICT, finds out the item number and the name of an article of the SMT element that these ICT do not detect.Then enter step 25.
In step 25, find out easy erroneous judgement of ICT and the bigger element of area in the BOM file.In reality test as can be known: the element that ICT more easily judges by accident is a diode, and the location name of diode is to be beginning with " D ".So as long as seek the location name of element in the BOM file is to be the element of beginning with " D ", is exactly the element that ICT more easily judges by accident.In addition, because when the visual inspection Short Item is tested, mask board for visual check must be placed on the motherboard.If mask board for visual check does not hollow out the position of the big element of area, then mask board for visual check can't be pressed close to motherboard, the erroneous judgement when therefore being easy to cause the visual inspection Short Item.So in this step, also filter out the bigger element of area.And the location name of the big element of these areas is to be beginning with " U " or " Q ", and to seek out in the BOM file location name be to be the element of beginning with " D ", " U " or " Q " so step 25 can be, and write down its element item number, the name of an article and location name.Then enter step 27.
In step 27, with ICT do not detect, location name, the item number of the element of erroneous judgement easily and the bigger element of area export with the name of an article and be stored to a cover plate data file.With can be as among Fig. 1, laser cutting device 15 manufactures a mask board for visual check 16 according to this cover plate data file, and it is used the testing process of visual inspection Short Item.
The disclosed screening of the above embodiment of the present invention ICT test blindspot is to make the method for mask board for visual check, make when the visual inspection Short Item, do not need to check whole elements, only need to check ICT institute not detecting and the element of judging by accident easily, therefore its advantage is for can promote test man's checking efficiency, accelerate the speed of product turnout, and save manpower cost cost.
In sum; though the present invention discloses as above with a preferred embodiment; yet it is not in order to limit the present invention; any those skilled in the art; without departing from the spirit and scope of the present invention; when can being used for a variety of modifications and variations, so protection scope of the present invention should be as the criterion with claims restricted portion.
Claims (11)
1. the method for screening ICT (middle test circuit) test blindspot produces a cover plate data file in order to screening in an ICT raw data file and a BOM (material list) file, and to carry out the operation of follow-up mask board for visual check, this method comprises:
A. in this ICT raw data file, find out the position of SMT (surface-mounted technology) element that a plurality of ICT do not detect;
B. position and this BOM file of the SMT element of not detecting with these ICT compare, and find out the item number and the name of an article of the SMT element that these ICT do not detect;
C. in this BOM file, find out position, item number and the name of an article of the bigger element of easy element of judging by accident of a plurality of ICT and area; And
D. position, item number and the name of an article of the element that the element of the SMT element that these ICT are not detected, the easy erroneous judgement of ICT and area are bigger export this cover plate data file to.
2. method according to claim 1 is characterized in that described step a also comprises following substep:
A1. open described ICT raw data file;
A2. delete the testing procedure of non-SMT element;
A3. delete the testing procedure that ICT had detected;
A4. delete the testing procedure of DIP (double-row type encapsulation) element; And
A5. the testing procedure that repeats of deletion and the position of components of other testing procedures.
3. method according to claim 2, it is characterized in that described step a2 be the delete position non-be the testing procedure of beginning with " R ", " L ", " C ", " D ", " Q ", " U ", " JL ", " JR ", " EC ".
4. method according to claim 2 is characterized in that described step a3 deletes the testing procedure that does not contain " SKIP ".
5. method according to claim 2 is characterized in that described step a4 is the testing procedure that includes "/NC ", " LAN ", " LCD ", " RJ ", " CK ", " NP/N " or " DIP " character string in the title of delete position.
6. method according to claim 1 is characterized in that described steps d is that to seek out in the ROM file location name be to be the element of beginning with " D ", " U " or " Q ".
7. screening ICT (intermediate circuit test) test blindspot comprises to make the system of mask board for visual check:
First device is in order to provide ICT raw data file;
Second device is in order to provide BOM (material list) file;
The device of cover plate converse routine, in order to receive this ICT raw data file and BOM file, utilize the position of the element that the position of the element of erroneous judgement and area are bigger easily of a plurality of ICT in the position of the SMT that a plurality of ICT do not detect in this ICT raw data file (surface-mounted technology) element and this BOM file and obtain the cover plate data file and export this cover plate data file; And
Laser cutting device in order to receiving this cover plate data file, and is made this mask board for visual check according to this cover plate data file.
8. system according to claim 7, the position that it is characterized in that the SMT element that these ICT do not detect be by this ICT raw data file delete element, DIP (double-row type encapsulation) element and other repeated tests that non-SMT element, ICT detected element the position and get.
9. system according to claim 8 is characterized in that described non-SMT element is is the element of beginning with " R ", " L ", " C ", " D ", " Q ", " U ", " JL ", " JR ", " EC ".
10. system according to claim 8 is characterized in that described DIP element is is the element of beginning with "/NC ", " LAN ", " LCD ", " RJ ", " CK ", " NP/N " or " DIP ".
11. system according to claim 7, the position that it is characterized in that these ICT element that easily position of the element of erroneous judgement and area are bigger is to be the position of the element of beginning with " D ", " U " or " Q ".
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 00124418 CN1123780C (en) | 2000-09-11 | 2000-09-11 | System and method for screening ICT test blindspots to make mask board for visual check |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 00124418 CN1123780C (en) | 2000-09-11 | 2000-09-11 | System and method for screening ICT test blindspots to make mask board for visual check |
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| Publication Number | Publication Date |
|---|---|
| CN1342907A CN1342907A (en) | 2002-04-03 |
| CN1123780C true CN1123780C (en) | 2003-10-08 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN 00124418 Expired - Fee Related CN1123780C (en) | 2000-09-11 | 2000-09-11 | System and method for screening ICT test blindspots to make mask board for visual check |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105572570B (en) * | 2016-03-08 | 2018-04-13 | 中通维易科技服务有限公司 | The detection device of element on a kind of printed circuit board |
| CN106980715A (en) * | 2017-03-13 | 2017-07-25 | 郑州云海信息技术有限公司 | A kind of method for not having to add ICT measuring point networks in quick inspection PCB |
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| CN1342907A (en) | 2002-04-03 |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Owner name: MINGSHUO COMPUTER(SUZHOU ) CO., LTD.; HESHUO JOIN Free format text: FORMER OWNER: HUASHUO COMPUTER CO LTD Effective date: 20081107 |
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Effective date of registration: 20081107 Address after: Chinese in Jiangsu province Suzhou City Jinfeng Road 233, zip code: 215011 Co-patentee after: Pegatron Corporation Patentee after: Ming Shuo computer (Suzhou) Co., Ltd. Address before: Taipei city of Taiwan Province Patentee before: Huashuo Computer Co., Ltd. |
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| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20031008 Termination date: 20120911 |