CN112366076A - Inductor and manufacturing method thereof - Google Patents
Inductor and manufacturing method thereof Download PDFInfo
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- CN112366076A CN112366076A CN202011244468.7A CN202011244468A CN112366076A CN 112366076 A CN112366076 A CN 112366076A CN 202011244468 A CN202011244468 A CN 202011244468A CN 112366076 A CN112366076 A CN 112366076A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
- H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/29—Terminals; Tapping arrangements for signal inductances
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
- H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
- H01F41/10—Connecting leads to windings
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Abstract
The invention provides an inductor and a manufacturing method thereof. The inductor of the invention forms the spiral inductance channel in the multilayer ceramic plate which is hot-pressed and formed in advance, and then the spiral inductance channel is filled with the conductive material to be integrally formed, and all parts of the conductive material have no connection points and are uniform in thickness. The gas outlet is arranged in the first ceramic substrate, so that the conductive material can be conveniently filled, and the gas outlet filled with the conductive material can be used as an external connection point, so that flexible access of different inductors is realized.
Description
Technical Field
The invention relates to the field of semiconductor device manufacturing, in particular to an inductor and a manufacturing method thereof.
Background
Inductive passive devices are indispensable functional components in integrated circuits. In the fabrication of semiconductor devices, the three-dimensional inductor is usually fabricated by forming a first portion on a substrate, then forming a second portion, a third portion, and so on (in a build-up manner), and finally combining these portions into a spiral inductor structure. The manufacturing method is complex and high in cost, and current aggregation is generated at the joint positions of a plurality of parts of the spiral inductor, so that the stability of inductance signals is not facilitated.
Disclosure of Invention
In order to solve the above problems, the present invention provides a method for manufacturing an inductor, including the steps of:
(1) providing a first ceramic plate, a second ceramic plate, a third ceramic plate, a fourth ceramic plate, and a fifth ceramic plate; the upper surface of the first ceramic plate is provided with a plurality of first grooves which are arranged in parallel, and an inlet section and an outlet section which are connected with the plurality of first grooves, and the plurality of first grooves are respectively provided with a first end and a second end; the second ceramic plate having a plurality of first through holes therein corresponding to the first ends and a plurality of second through holes therein corresponding to the second ends; the third ceramic plate has a plurality of third through holes therein corresponding to the plurality of first through holes and a fourth through hole therein corresponding to the plurality of second through holes; the fourth ceramic plate has a plurality of fifth through holes therein corresponding to the plurality of third through holes and a plurality of sixth through holes therein corresponding to the plurality of fourth through holes; the lower surface of the fifth ceramic plate is provided with a plurality of second grooves which are arranged in parallel, each second groove is provided with a third end and a fourth end, the third ends correspond to the fifth through holes, and the fourth ends correspond to the sixth through holes;
(2) hot pressing the first, second, third, fourth, and fifth ceramic plates together to form a stacked substrate structure, wherein first ends of the plurality of first grooves communicate with third ends of the plurality of second grooves through the plurality of first through holes, the plurality of third through holes, and the plurality of fifth through holes, second ends of the plurality of first grooves communicate with fourth ends of the plurality of second grooves through the plurality of second through holes, the plurality of fourth through holes, and the plurality of sixth through holes, such that the plurality of first grooves, the plurality of second grooves, and the plurality of first to sixth through holes communicate to form a spiral channel, and head and tail sections of the spiral channel connect the inlet section and the outlet section, respectively;
(3) filling the spiral channel with a conductive material from the inlet section, wherein the conductive material fills the spiral channel and excess conductive material flows out through the outlet section; forming a spiral inductor structure via curing the conductive material, the spiral inductor structure including a first connection portion at a head end and a second connection portion at a tail end;
(4) forming a plurality of conductive blind holes penetrating the first to fourth ceramic plates in the stacked substrate, a first conductive blind hole of the plurality of conductive blind holes being electrically connected to the first connection portion, a second conductive blind hole of the plurality of conductive blind holes being electrically connected to the second connection portion.
The third ceramic plate further comprises a magnetic core material, the third through holes and the fourth through holes are located on two sides of the magnetic core material, and the magnetic core material penetrates through the third ceramic substrate.
The first ceramic plate is provided with a plurality of first grooves, and the first ceramic plate is provided with a gas outlet hole inside.
Wherein, in step (3), the gas outlet holes are simultaneously filled with the conductive material, which is exposed at the lower surface of the first ceramic plate.
The conductive blind holes are formed at four corners of the stacked substrate.
The invention also provides an inductor formed by the manufacturing method of the inductor, which specifically comprises the following steps:
a stacked substrate structure comprising a first ceramic plate, a second ceramic plate, a third ceramic plate, a fourth ceramic plate, and a fifth ceramic plate thermally pressed together in sequence; the upper surface of the first ceramic plate is provided with a plurality of first grooves which are arranged in parallel, and an inlet section and an outlet section which are connected with the plurality of first grooves, and the plurality of first grooves are respectively provided with a first end and a second end; the second ceramic plate having a plurality of first through holes therein corresponding to the first ends and a plurality of second through holes therein corresponding to the second ends; the third ceramic plate has a plurality of third through holes therein corresponding to the plurality of first through holes and a fourth through hole therein corresponding to the plurality of second through holes; the fourth ceramic plate has a plurality of fifth through holes therein corresponding to the plurality of third through holes and a plurality of sixth through holes therein corresponding to the plurality of fourth through holes; the lower surface of the fifth ceramic plate is provided with a plurality of second grooves which are arranged in parallel, each second groove is provided with a third end and a fourth end, the third ends correspond to the fifth through holes, and the fourth ends correspond to the sixth through holes; the first ends of the first grooves are communicated with the third ends of the second grooves through the first through holes, the third through holes and the fifth through holes, the second ends of the first grooves are communicated with the fourth ends of the second grooves through the second through holes, the fourth through holes and the sixth through holes, so that the first grooves, the second grooves and the first through sixth through holes are communicated to form spiral channels, and the head and tail sections of the spiral channels are respectively connected with the inlet section and the outlet section;
the spiral inductor structure is formed by filling a conductive material in the spiral channel to be conformal with the spiral channel, and comprises a first connecting part at the head end and a second connecting part at the tail end;
a plurality of conductive blind holes formed in the stacked substrate and penetrating the first to fourth ceramic plates, a first conductive blind hole of the plurality of conductive blind holes being electrically connected to the first connection portion, a second conductive blind hole of the plurality of conductive blind holes being electrically connected to the second connection portion.
Wherein the third ceramic board further comprises a magnetic core material therein, the magnetic core material extending along an axis of the spiral inductor structure.
The first ceramic plate is provided with a plurality of first grooves, the first ceramic plate is provided with a plurality of air outlets, the air outlets are communicated with one of the plurality of first grooves and filled with the conductive material, and the conductive material is exposed out of the lower surface of the first ceramic plate.
The conductive blind holes are formed at four corners of the stacked substrate.
Wherein the conductive material is conductive ink or a resin material with conductive particles, and the like.
The inductor of the invention forms the spiral inductance channel in the multilayer ceramic plate which is hot-pressed and formed in advance, and then the spiral inductance channel is filled with the conductive material to be integrally formed, and all parts of the conductive material have no connection points and are uniform in thickness. The gas outlet is arranged in the first ceramic substrate, so that the conductive material can be conveniently filled, and the gas outlet filled with the conductive material can be used as an external connection point, so that flexible access of different inductors is realized.
Drawings
FIGS. 1-8b are schematic flow charts of methods of manufacturing inductors in accordance with the present invention; wherein fig. 7b is a perspective view of the inductor in fig. 7a and fig. 8b is a perspective view of the inductor in fig. 8 a.
Detailed Description
The present technology, which relates to an inductor, will be described with reference to the drawings in the embodiments.
It will be understood that the present technology may be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the technology to those skilled in the art. Indeed, the technology is intended to cover alternatives, modifications and equivalents of these embodiments, which are included within the scope and spirit of the technology as defined by the appended claims. Furthermore, in the following detailed description of the present technology, numerous specific details are set forth in order to provide a thorough understanding of the present technology. It will be apparent, however, to one skilled in the art that the present technology may be practiced without these specific details.
The terms "top" and "bottom", "upper" and "lower" and "vertical" and "horizontal" and their various forms as used herein are for purposes of illustration and description only and are not intended to limit the description of the technology as the referenced items may be interchanged in position and orientation. Also, as used herein, the terms "substantially" and/or "about" mean that the specified dimensions or parameters may vary within acceptable manufacturing tolerances for a given application.
The inductor and the method for manufacturing the same according to the present invention will be described with reference to fig. 1 to 8b, and the inductor according to the present invention includes a multi-layer ceramic plate as shown in fig. 1 to 5, which may be a conventional heat-dissipating ceramic material such as alumina ceramic, aluminum nitride ceramic, etc., and specifically includes the first ceramic plate 10 of fig. 1, the second ceramic plate 17 of fig. 2, the third ceramic plate 20 of fig. 3, the fourth ceramic plate 24 of fig. 4, and the fifth ceramic plate 27 of fig. 5. Wherein the second ceramic plate 17 has the same structure and thickness as the fourth ceramic plate 24 and is symmetrically arranged with respect to said third ceramic plate 20.
The third ceramic plate 20 comprises a magnetic core material 23, which magnetic core material 23 may be a ferroelectric material. The thickness of the third ceramic plate 20 may be the largest and it may be formed by laminating a plurality of ceramic plates, which may make the thickness of the magnetic core material 23 larger.
The upper surface of the first ceramic plate 10 has a plurality of first grooves 11 arranged in parallel, and an inlet section 14 and an outlet section 15 connecting the plurality of first grooves 11, the plurality of first grooves 11 having first ends 12 (i.e., head ends) and second ends 13 (i.e., tail ends), respectively. The plurality of first grooves 11 have a non-right angle with a side length direction (first direction) of the first ceramic plate 10, and the plurality of first grooves 11 are uniformly arranged with the same pitch. The first ceramic plate 10 further has an air outlet 16 therein, and the air outlet 16 is communicated with one of the first grooves 11. The air outlet 16 extends through the first ceramic plate 10 and is used to ensure the convenience of subsequent filling with conductive material.
The second ceramic plate 17 has a plurality of first through holes 18 therein corresponding to the first end 12 and a plurality of second through holes 19 therein corresponding to the second end 13. The first through holes 18 and the second through holes 19 are all arranged in a line along the first direction.
The third ceramic plate 20 has therein a plurality of third through holes 21 corresponding to the plurality of first through holes 18 and a fourth through hole 22 corresponding to the plurality of second through holes 19. The third through holes 21 and the fourth through holes 22 are all arranged in a straight line along the first direction and are located on two sides of the magnetic core material 23.
The fourth ceramic plate 24 has a plurality of fifth through holes 25 corresponding to the plurality of third through holes 21 and a plurality of sixth through holes 26 corresponding to the plurality of fourth through holes 22 therein. The fifth through holes 25 and the sixth through holes 26 are all arranged in a line along the first direction. The structure of the fourth ceramic plate 24 is identical to the structure and thickness of the second ceramic plate 17, and its thickness may be small, mainly to ensure insulation.
The lower surface of the fifth ceramic plate 27 has a plurality of second grooves 28 arranged in parallel, and the plurality of second grooves 28 respectively have a third end 29 (i.e., a head end) and a fourth end 30 (i.e., a tail end), wherein the third end 29 corresponds to the plurality of fifth through holes 25, and the fourth end 30 corresponds to the plurality of sixth through holes 26. Wherein the plurality of first grooves 11 and the plurality of second grooves 28 are arranged crosswise in vertical projection to ensure the formation of the subsequent spiral channel.
Referring to fig. 6, which is a stacked substrate structure formed by thermocompression bonding of first to fifth ceramic plates, first ends 12 of the plurality of first grooves 11 communicate with third ends 29 of the plurality of second grooves 28 through the plurality of first through holes 18, the plurality of third through holes 21, and the plurality of fifth through holes 25, and second ends 13 of the plurality of first grooves 11 communicate with fourth ends 30 of the plurality of second grooves 28 through the plurality of second through holes 19, the plurality of fourth through holes 22, and the plurality of sixth through holes 26, so that the plurality of first grooves 11, the plurality of second grooves 28, and the plurality of first to sixth through holes communicate to form a spiral channel, and the leading and trailing sections of the spiral channel connect the inlet section 14 and the outlet section 15, respectively.
Next, see fig. 7a and 7b, where fig. 7b is a schematic diagram of an inductor structure. The inlet section 14 is filled with a conductive material which fills the spiral channel and excess conductive material flows out through the outlet section. During filling, the air outlet holes 16 discharge air from the interior of the spiral channel, so that the filling is complete. And then heating and curing the conductive material to form a spiral inductor structure, wherein the spiral inductor structure is formed in a conformal manner with the spiral channel. The spiral inductor structure includes a plurality of first horizontal portions 31, a plurality of second horizontal portions 33, and a vertical connection portion 32 connecting the plurality of first horizontal plates 31 and the plurality of second horizontal portions 33. The spiral inductor structure includes a first connection portion 34 at the head end and a second connection portion 35 at the tail end at both ends. Wherein the magnetic core material 23 extends along the axis of the spiral inductor structure.
Wherein the gas outlet holes 16 are simultaneously filled with the conductive material exposed at the lower surface of the first ceramic plate 10. The air outlet 16 with conductive material is formed as an external connector 36, and the external connector 36 can be used as an access terminal for adjusting inductance value of inductor, which can realize access of different inductors, and is flexible and convenient.
The conductive material is liquid during filling, can flow, and can realize filling of the spiral channel by means of spraying or vacuum suction, and the material can be selected from conductive ink or resin material with conductive particles and the like.
Finally, referring to fig. 8a and 8b, a plurality of conductive blind holes are formed in the stacked substrate through the first to fourth ceramic plates, a first conductive blind hole 38 of the plurality of conductive blind holes electrically connecting the first connection portion 34, and a second conductive blind hole 37 of the plurality of conductive blind holes electrically connecting the second connection portion 35. The first conductive blind hole 37, the second conductive blind hole 37, and the external connection member 36 can be used as electrodes of an inductor, which can realize three inductors of three different inductance values.
The plurality of conductive blind holes can also ensure the reliability of bonding among the plurality of ceramic plates, and the function of the conductive blind holes can be a rivet function to prevent the ceramic plates from being layered. In particular, the conductive blind holes are positioned at four corners of the stacked substrate.
The inductor of the invention forms the spiral inductance channel in the multilayer ceramic plate which is hot-pressed and formed in advance, and then the spiral inductance channel is filled with the conductive material to be integrally formed, and all parts of the conductive material have no connection points and are uniform in thickness. The gas outlet is arranged in the first ceramic substrate, so that the conductive material can be conveniently filled, and the gas outlet filled with the conductive material can be used as an external connection point, so that flexible access of different inductors is realized.
The foregoing detailed description of the technology has been presented for purposes of illustration and description. It is not intended to be exhaustive or to limit the technology to the precise form disclosed. Many modifications and variations are possible in light of the above teaching. The described embodiments were chosen in order to best explain the principles of the technology and its practical application to thereby enable others skilled in the art to best utilize the technology in various embodiments and with various modifications as are suited to the particular use contemplated. The scope of the present technology is defined by the appended claims.
The expressions "exemplary embodiment," "example," and the like, as used herein, do not refer to the same embodiment, but are provided to emphasize different particular features. However, the above examples and exemplary embodiments do not preclude their implementation in combination with features of other examples. For example, even in a case where a description of a specific example is not provided in another example, unless otherwise stated or contrary to the description in the other example, the description may be understood as an explanation relating to the other example.
The terminology used in the present invention is for the purpose of illustrating examples only and is not intended to be limiting of the invention. Unless the context clearly dictates otherwise, singular expressions include plural expressions.
While example embodiments have been shown and described, it will be apparent to those skilled in the art that modifications and changes may be made without departing from the scope of the invention as defined by the claims.
Claims (10)
1. A method of manufacturing an inductor, comprising the steps of:
(1) providing a first ceramic plate, a second ceramic plate, a third ceramic plate, a fourth ceramic plate, and a fifth ceramic plate; the upper surface of the first ceramic plate is provided with a plurality of first grooves which are arranged in parallel, and an inlet section and an outlet section which are connected with the plurality of first grooves, and the plurality of first grooves are respectively provided with a first end and a second end; the second ceramic plate having a plurality of first through holes therein corresponding to the first ends and a plurality of second through holes therein corresponding to the second ends; the third ceramic plate has a plurality of third through holes therein corresponding to the plurality of first through holes and a fourth through hole therein corresponding to the plurality of second through holes; the fourth ceramic plate has a plurality of fifth through holes therein corresponding to the plurality of third through holes and a plurality of sixth through holes therein corresponding to the plurality of fourth through holes; the lower surface of the fifth ceramic plate is provided with a plurality of second grooves which are arranged in parallel, each second groove is provided with a third end and a fourth end, the third ends correspond to the fifth through holes, and the fourth ends correspond to the sixth through holes;
(2) hot pressing the first, second, third, fourth, and fifth ceramic plates together to form a stacked substrate structure, wherein first ends of the plurality of first grooves communicate with third ends of the plurality of second grooves through the plurality of first through holes, the plurality of third through holes, and the plurality of fifth through holes, second ends of the plurality of first grooves communicate with fourth ends of the plurality of second grooves through the plurality of second through holes, the plurality of fourth through holes, and the plurality of sixth through holes, such that the plurality of first grooves, the plurality of second grooves, and the plurality of first to sixth through holes communicate to form a spiral channel, and head and tail sections of the spiral channel connect the inlet section and the outlet section, respectively;
(3) filling the spiral channel with a conductive material from the inlet section, wherein the conductive material fills the spiral channel and excess conductive material flows out through the outlet section; forming a spiral inductor structure via curing the conductive material, the spiral inductor structure including a first connection portion at a head end and a second connection portion at a tail end;
(4) forming a plurality of conductive blind holes penetrating the first to fourth ceramic plates in the stacked substrate, a first conductive blind hole of the plurality of conductive blind holes being electrically connected to the first connection portion, a second conductive blind hole of the plurality of conductive blind holes being electrically connected to the second connection portion.
2. The method of manufacturing an inductor according to claim 1, wherein: still include the magnetic core material among the third ceramic plate, a plurality of third through-holes and a plurality of fourth through-hole are located the both sides of magnetic core material, just the magnetic core material link up the third ceramic substrate.
3. The method of manufacturing an inductor according to claim 1, wherein: the first ceramic plate is also internally provided with an air outlet which is communicated with one of the first grooves.
4. The method of manufacturing an inductor according to claim 3, wherein: in step (3), the gas outlet holes are simultaneously filled with the conductive material, and the conductive material is exposed at the lower surface of the first ceramic plate.
5. The method of manufacturing an inductor according to claim 1, wherein: the conductive blind holes are formed at four corners of the stacked substrate.
6. An inductor formed by the method of manufacturing an inductor of claim 1, comprising:
a stacked substrate structure comprising a first ceramic plate, a second ceramic plate, a third ceramic plate, a fourth ceramic plate, and a fifth ceramic plate thermally pressed together in sequence; the upper surface of the first ceramic plate is provided with a plurality of first grooves which are arranged in parallel, and an inlet section and an outlet section which are connected with the plurality of first grooves, and the plurality of first grooves are respectively provided with a first end and a second end; the second ceramic plate having a plurality of first through holes therein corresponding to the first ends and a plurality of second through holes therein corresponding to the second ends; the third ceramic plate has a plurality of third through holes therein corresponding to the plurality of first through holes and a fourth through hole therein corresponding to the plurality of second through holes; the fourth ceramic plate has a plurality of fifth through holes therein corresponding to the plurality of third through holes and a plurality of sixth through holes therein corresponding to the plurality of fourth through holes; the lower surface of the fifth ceramic plate is provided with a plurality of second grooves which are arranged in parallel, each second groove is provided with a third end and a fourth end, the third ends correspond to the fifth through holes, and the fourth ends correspond to the sixth through holes; the first ends of the first grooves are communicated with the third ends of the second grooves through the first through holes, the third through holes and the fifth through holes, the second ends of the first grooves are communicated with the fourth ends of the second grooves through the second through holes, the fourth through holes and the sixth through holes, so that the first grooves, the second grooves and the first through sixth through holes are communicated to form spiral channels, and the head and tail sections of the spiral channels are respectively connected with the inlet section and the outlet section;
the spiral inductor structure is formed by filling a conductive material in the spiral channel to be conformal with the spiral channel, and comprises a first connecting part at the head end and a second connecting part at the tail end;
a plurality of conductive blind holes formed in the stacked substrate and penetrating the first to fourth ceramic plates, a first conductive blind hole of the plurality of conductive blind holes being electrically connected to the first connection portion, a second conductive blind hole of the plurality of conductive blind holes being electrically connected to the second connection portion.
7. The inductor of claim 6, wherein: the third ceramic board further includes a magnetic core material therein, the magnetic core material extending along an axis of the spiral inductor structure.
8. The inductor of claim 6, wherein: the first ceramic plate is provided with a plurality of first grooves, and the first ceramic plate is provided with a gas outlet hole which is communicated with one of the plurality of first grooves and is filled with the conductive material, and the conductive material is exposed out of the lower surface of the first ceramic plate.
9. The inductor of claim 6, wherein: the conductive blind holes are formed at four corners of the stacked substrate.
10. The inductor of claim 6, wherein: the conductive material is conductive ink or a resin material with conductive particles, and the like.
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| CN202011244468.7A CN112366076B (en) | 2020-11-10 | 2020-11-10 | Inductor and manufacturing method thereof |
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| CN202011244468.7A CN112366076B (en) | 2020-11-10 | 2020-11-10 | Inductor and manufacturing method thereof |
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Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
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| GB1321545A (en) * | 1971-12-08 | 1973-06-27 | Ibm | Method of fabricating multilayer circuits |
| JPH0637454A (en) * | 1992-07-14 | 1994-02-10 | Nec Corp | Multilayer interconnection ceramic board |
| KR20020090507A (en) * | 2001-05-28 | 2002-12-05 | 주식회사 쎄라텍 | Manufacturing surface mounted chip inductor and method therefor |
| JP2003017325A (en) * | 2001-06-27 | 2003-01-17 | Murata Mfg Co Ltd | Lamination type metal magnetic electronic component and its manufacturing method |
| CN1971776A (en) * | 2005-11-21 | 2007-05-30 | 安捷伦科技有限公司 | Planar inductor using liquid metal mems technology |
| CN102810382A (en) * | 2011-05-31 | 2012-12-05 | 三星电机株式会社 | Chip-type coil component |
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2020
- 2020-11-10 CN CN202011244468.7A patent/CN112366076B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB1321545A (en) * | 1971-12-08 | 1973-06-27 | Ibm | Method of fabricating multilayer circuits |
| JPH0637454A (en) * | 1992-07-14 | 1994-02-10 | Nec Corp | Multilayer interconnection ceramic board |
| KR20020090507A (en) * | 2001-05-28 | 2002-12-05 | 주식회사 쎄라텍 | Manufacturing surface mounted chip inductor and method therefor |
| JP2003017325A (en) * | 2001-06-27 | 2003-01-17 | Murata Mfg Co Ltd | Lamination type metal magnetic electronic component and its manufacturing method |
| CN1971776A (en) * | 2005-11-21 | 2007-05-30 | 安捷伦科技有限公司 | Planar inductor using liquid metal mems technology |
| CN102810382A (en) * | 2011-05-31 | 2012-12-05 | 三星电机株式会社 | Chip-type coil component |
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| CN112366076B (en) | 2022-10-11 |
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