CN112358849B - Peelable gasket adhesive and preparation method thereof - Google Patents
Peelable gasket adhesive and preparation method thereof Download PDFInfo
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- CN112358849B CN112358849B CN202011245601.0A CN202011245601A CN112358849B CN 112358849 B CN112358849 B CN 112358849B CN 202011245601 A CN202011245601 A CN 202011245601A CN 112358849 B CN112358849 B CN 112358849B
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- 230000001070 adhesive effect Effects 0.000 title claims abstract description 30
- 239000000853 adhesive Substances 0.000 title claims abstract description 28
- 238000002360 preparation method Methods 0.000 title claims abstract description 8
- 239000003822 epoxy resin Substances 0.000 claims abstract description 35
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 35
- 239000002904 solvent Substances 0.000 claims abstract description 18
- 239000003292 glue Substances 0.000 claims abstract description 15
- 229920000058 polyacrylate Polymers 0.000 claims abstract description 11
- 238000003756 stirring Methods 0.000 claims description 22
- 238000006243 chemical reaction Methods 0.000 claims description 20
- 238000001723 curing Methods 0.000 claims description 19
- 238000010438 heat treatment Methods 0.000 claims description 19
- 239000000203 mixture Substances 0.000 claims description 19
- 238000005303 weighing Methods 0.000 claims description 16
- 239000007787 solid Substances 0.000 claims description 15
- 239000002253 acid Substances 0.000 claims description 14
- 239000003054 catalyst Substances 0.000 claims description 14
- 239000000178 monomer Substances 0.000 claims description 13
- 239000003999 initiator Substances 0.000 claims description 12
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims description 10
- 239000003795 chemical substances by application Substances 0.000 claims description 10
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 claims description 9
- 238000001035 drying Methods 0.000 claims description 9
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 claims description 6
- 238000000034 method Methods 0.000 claims description 6
- 238000012360 testing method Methods 0.000 claims description 6
- 239000011888 foil Substances 0.000 claims description 5
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 claims description 4
- CXXSQMDHHYTRKY-UHFFFAOYSA-N 4-amino-2,3,5-tris(oxiran-2-ylmethyl)phenol Chemical compound C1=C(O)C(CC2OC2)=C(CC2OC2)C(N)=C1CC1CO1 CXXSQMDHHYTRKY-UHFFFAOYSA-N 0.000 claims description 4
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims description 4
- 239000004845 glycidylamine epoxy resin Substances 0.000 claims description 4
- OZAIFHULBGXAKX-UHFFFAOYSA-N 2-(2-cyanopropan-2-yldiazenyl)-2-methylpropanenitrile Chemical compound N#CC(C)(C)N=NC(C)(C)C#N OZAIFHULBGXAKX-UHFFFAOYSA-N 0.000 claims description 3
- DKPFZGUDAPQIHT-UHFFFAOYSA-N Butyl acetate Natural products CCCCOC(C)=O DKPFZGUDAPQIHT-UHFFFAOYSA-N 0.000 claims description 3
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052797 bismuth Inorganic materials 0.000 claims description 3
- -1 bismuth carboxylate Chemical class 0.000 claims description 3
- 239000011248 coating agent Substances 0.000 claims description 3
- 238000000576 coating method Methods 0.000 claims description 3
- FUZZWVXGSFPDMH-UHFFFAOYSA-N hexanoic acid Chemical compound CCCCCC(O)=O FUZZWVXGSFPDMH-UHFFFAOYSA-N 0.000 claims description 3
- 238000010030 laminating Methods 0.000 claims description 3
- CERQOIWHTDAKMF-UHFFFAOYSA-M methacrylate group Chemical group C(C(=C)C)(=O)[O-] CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 claims description 3
- 150000003606 tin compounds Chemical class 0.000 claims description 3
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 claims description 2
- 238000009833 condensation Methods 0.000 claims description 2
- 230000005494 condensation Effects 0.000 claims description 2
- 238000007599 discharging Methods 0.000 claims description 2
- 239000008096 xylene Substances 0.000 claims description 2
- 239000000463 material Substances 0.000 abstract description 16
- 239000004593 Epoxy Substances 0.000 abstract description 10
- 238000004132 cross linking Methods 0.000 abstract description 3
- 239000004925 Acrylic resin Substances 0.000 abstract description 2
- 229920000178 Acrylic resin Polymers 0.000 abstract description 2
- 239000004841 bisphenol A epoxy resin Substances 0.000 abstract description 2
- 125000003700 epoxy group Chemical group 0.000 abstract description 2
- 229910052751 metal Inorganic materials 0.000 abstract description 2
- 239000002184 metal Substances 0.000 abstract description 2
- 238000012986 modification Methods 0.000 abstract description 2
- 230000004048 modification Effects 0.000 abstract description 2
- 239000002131 composite material Substances 0.000 abstract 1
- 239000007769 metal material Substances 0.000 abstract 1
- 238000001816 cooling Methods 0.000 description 5
- 239000010410 layer Substances 0.000 description 3
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 3
- 239000004926 polymethyl methacrylate Substances 0.000 description 3
- PLIKAWJENQZMHA-UHFFFAOYSA-N 4-aminophenol Chemical compound NC1=CC=C(O)C=C1 PLIKAWJENQZMHA-UHFFFAOYSA-N 0.000 description 2
- 238000003754 machining Methods 0.000 description 2
- 229920000193 polymethacrylate Polymers 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 229920002845 Poly(methacrylic acid) Polymers 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- GQVCNZBQZKXBMX-UHFFFAOYSA-N butan-2-one;toluene Chemical compound CCC(C)=O.CC1=CC=CC=C1 GQVCNZBQZKXBMX-UHFFFAOYSA-N 0.000 description 1
- 239000003153 chemical reaction reagent Substances 0.000 description 1
- 125000002347 octyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- AFEQENGXSMURHA-UHFFFAOYSA-N oxiran-2-ylmethanamine Chemical compound NCC1CO1 AFEQENGXSMURHA-UHFFFAOYSA-N 0.000 description 1
- 230000005501 phase interface Effects 0.000 description 1
- 238000002464 physical blending Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J187/00—Adhesives based on unspecified macromolecular compounds, obtained otherwise than by polymerisation reactions only involving unsaturated carbon-to-carbon bonds
- C09J187/005—Block or graft polymers not provided for in groups C09J101/00 - C09J185/04
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F299/00—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers
- C08F299/02—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers from unsaturated polycondensates
- C08F299/08—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers from unsaturated polycondensates from polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G81/00—Macromolecular compounds obtained by interreacting polymers in the absence of monomers, e.g. block polymers
- C08G81/02—Macromolecular compounds obtained by interreacting polymers in the absence of monomers, e.g. block polymers at least one of the polymers being obtained by reactions involving only carbon-to-carbon unsaturated bonds
- C08G81/024—Block or graft polymers containing sequences of polymers of C08C or C08F and of polymers of C08G
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- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Sealing Material Composition (AREA)
Abstract
The invention discloses a peelable gasket adhesive and a preparation method thereof, and mainly solves the problems that the peelable gasket adhesive in the current market has low bonding strength and the like. Compared with the conventional physical modification, the POSS modified epoxy resin is designed, and acrylate polymer-containing epoxy POSS reacts with bisphenol A epoxy resin to combine a polyacrylate elastic chain segment with an epoxy resin molecular chain and completely reserve an epoxy group, so that a modified solution is prepared, the modified solution not only keeps the excellent adhesive property of the epoxy resin to metal, but also has the good film-forming property of acrylic resin, and meanwhile, the introduction of POSS can ensure that the material has the good heat resistance, solvent resistance, high mechanical stability and other properties; in addition, the multifunctional epoxy resin and the conventional epoxy resin are compounded for use in the project, so that the crosslinking strength is improved, the structure of the glue layer is ensured, and the temperature resistance of the glue is greatly improved. The invention is applied to the bonding of the metal material strippable gasket or the composite material strippable gasket, and the prepared strippable gasket glue can be used for the assembly of parts in the field of aviation.
Description
Technical Field
The invention relates to a peelable gasket adhesive and a preparation method thereof.
Background
The peelable gasket is named as a layer tearing gasket, a tearable gasket, a hand tearing gasket and the like, mechanical tolerance exists in machining of all machined parts, the tolerance can be accumulated quickly in complex assembly of the parts, and the tolerance gap which cannot be estimated and avoided as much as possible can be found after the assembly is completed. Severe wear may result from an improper fit of the assembly, which may cause severe mechanical failure early in use. This has resulted in a solution for a peelable gasket. The peelable gasket is prepared by adhering and curing a certain amount of foils with the same thickness by adopting an adhesive bonding and curing process, and machining the foils into a required shape. The biggest characteristic of the adhesive is that the adhesive can be peeled to the required thickness according to the requirement in the subsequent use. Because the strippable gasket can be processed into various shapes and arbitrarily stripped into different thicknesses according to the requirements, compared with the common fixed gasket, the strippable gasket is convenient to use, can avoid filing processing, shortens the period and improves the working conditions. The finished product is characterized in that the base materials are required to be uniform and dense in texture, the whole performance of the whole gasket cannot be influenced by the failure of the adhesive, the strength of the base materials is higher than the adhesive force among the base materials, the peeling strength of the adhesive is controllable, and the base materials are tightly adhered and easy to peel. The performance of the peelable gasket basically depends on the quality of the peelable gasket glue, at present, domestic patents aiming at the report are very few, and the institute of science and petrochemical in Heilongjiang province invented a CN201610247846.4 water-based peelable gasket adhesive and a preparation method thereof.
Disclosure of Invention
Compared with the conventional physical modification, the POSS modified epoxy resin is designed, and is prepared by reacting epoxy POSS containing acrylate polymer with bisphenol A epoxy resin to bond a polyacrylate elastic chain segment with an epoxy resin molecular chain and completely reserve an epoxy group, so that a modified solution is prepared, the modified solution not only keeps the excellent adhesive property of the epoxy resin to metal, but also has good film-forming property of acrylic resin, and the introduction of POSS can ensure that the material has good heat resistance, solvent resistance, high mechanical stability and other properties; in addition, the multifunctional epoxy resin and the conventional epoxy resin are compounded for use, so that the crosslinking strength is improved, the structure of a glue layer is ensured, and the temperature resistance of the glue is greatly improved; aiming at the technical adjustment, the invention provides a peelable gasket adhesive and a preparation method thereof.
The strippable gasket adhesive comprises, by weight, 10-20 parts of epoxy resin, 10-20 parts of acrylate POSS monomer, 1-2 parts of initiator, 0.1-0.5 part of catalyst, 1-2 parts of polyfunctional group epoxy resin and 60-80 parts of solvent;
wherein the solid epoxy resin is one or more of bisphenol A type solid epoxy resin; wherein GT7070 or GT6099 by Hensman; or NPES901 or NPES904 produced in south asia; the molecular structure is as follows:
wherein n is greater than 0.7
The acrylate monomer is methacrylate-based heptaepoxy POSS, and is prepared by condensation and a top end cap method, wherein n =1, 2, 3, 4 \8230;
wherein the initiator is one or a mixture of azodiisobutyronitrile or azodiisoheptonitrile;
wherein the catalyst is one or a mixture of several of an organic tin compound or a bismuth carboxylate catalyst;
wherein, the multifunctional epoxy resin is one or a mixture of four functional glycidyl amine epoxy resin or triglycidyl p-aminophenol. The molecular formula is as follows:
wherein the solvent is one or more of ethyl acetate, butanone, butyl acetate, toluene and xylene.
Wherein the curing agent is one or a mixture of 5200 or DY9577 produced by Henschel;
a preparation method of a peelable gasket adhesive specifically comprises the following steps:
1. the polyacrylate based heptaepoxy POSS is prepared according to the following steps: weighing 20 parts of acrylate POSS monomer, 2 parts of initiator, 0.5 part of catalyst and 100 parts of solvent according to the weight; after stirring evenly, the mixture reacts for 12 hours at the temperature of 60 ℃, and then the solvent is removed and dried.
2. Weighing 10-20 parts of epoxy resin, 1-2 parts of initiator, 0.1-0.5 part of catalyst and 80-100 parts of solvent by weight; adding the polyacrylate POSS weighed in the first step into a reaction kettle, stirring and heating to 70 ℃, controlling the dropwise adding to be completed within 2 hours when no solid exists in the reaction kettle, and slowly heating to 90 ℃; keeping the temperature for reaction for 3h, measuring the acid value after three hours, controlling the acid value below 5mgKOH/g, and stopping heating;
3. after the product in the second step is cooled, adding 1-2 parts of polyfunctional epoxy resin, and uniformly stirring;
4. adding the product obtained in the third step into a latent curing agent, uniformly stirring, discharging, storing in a dark place at a low temperature, and obtaining peelable gasket glue with the solid content of 20-40%;
5. coating the peelable gasket glue obtained in the fourth step on an aluminum foil, drying at 70-80 ℃ for 2min, and after drying, laminating and curing; the curing temperature is controlled between 120 ℃ and 150 ℃; controlling the pressure at 0.3-0.5Mpa to obtain the molecular structure of the gasket as the following formula;
the invention has the following beneficial effects:
1. the addition of polyacrylate long-chain POSS and the network polymer which mutually interpenetrates with the epoxy resin performance lead the flexibility of the epoxy resin to be good, the flexibility can relieve the internal stress caused by the curing shrinkage of the material, and the film forming performance and the water absorption performance of the epoxy resin are improved;
2. the epoxy resin is improved by a chemical method, so that the problem of separation or layering of a physical blending phase interface is solved, and the problems of whitish appearance and the like after the glue layer is stripped are solved;
3. polyfunctional group epoxy resin and conventional epoxy resin are compounded and used, improve crosslinking strength, have guaranteed the glue film structure on the one hand, the temperature resistance of the glue that promotes greatly on the other hand.
Drawings
The invention is further illustrated with reference to the following figures and examples.
FIG. 1 is a photograph showing the peel-off of the surface of a single-layer peelable gasket prepared in examples 1-5.
The specific implementation mode is as follows:
embodiments of the present invention will now be described in detail with reference to the following examples, which are provided for illustration only and should not be construed as limiting the scope of the invention. The examples were carried out under conventional conditions without specifying the specific conditions. The reagents or instruments used are conventional products which are not indicated by manufacturers and are commercially available.
Specific examples of a peelable gasket adhesive are as follows:
preparing polymethacrylate-based hepta epoxy POSS: weighing 20 parts of methacrylate POSS monomer, or 20 parts of methacrylate heptyl-based POSS monomer, or methacrylate octyl-based hepta-epoxy POSS or acrylate lauryl-based hepta-epoxy POSS according to the weight, 2 parts of initiator, 0.5 part of catalyst and 100 parts of solvent; after being stirred uniformly, the mixture reacts for 12 hours at the temperature of 60 ℃, the solvent is removed, and the polyacrylate-based hepta-epoxy POSS without chain segment is obtained after drying for standby.
Example one
Weighing 10 parts of acrylate POSS monomer, 1 part of initiator, 0.1 part of catalyst and 80 parts of solvent by weight; after being stirred uniformly, the mixture reacts for 5 to 12 hours at the temperature of 60 ℃, the solvent is removed, and the polyacrylate POSS is prepared for standby after drying;
secondly, weighing 10 parts of NPES901 epoxy resin, 1 part of azodiisobutyronitrile serving as an initiator, 0.1 part of an organic tin compound serving as a catalyst, and 80 parts of a solvent, namely 1 part of ethyl acetate and 1 part of butyl acetate by weight; weighing the materials according to the first step, adding the materials into a reaction kettle, stirring and heating to 70 ℃, starting to dropwise add 20 parts of polymethacrylate POSS into the reaction kettle when no solid exists in the reaction kettle, stirring and heating to 70 ℃, controlling the dropwise addition to be completed within 2 hours when no solid exists in the reaction kettle, and slowly heating to 90 ℃; keeping the temperature for reaction for 3h, measuring the acid value after three hours, controlling the acid value below 5mgKOH/g, and stopping heating; after cooling, adding 2 parts of tetra-functional group glycidyl amine epoxy resin, and uniformly stirring; finally, 5 parts of curing agent is added, after uniform stirring, the material is discharged and stored in a dark place at low temperature, and the peelable gasket adhesive with the solid content of 32 percent is obtained;
example two
Weighing 15 parts of GT7070 epoxy resin, 1.5 parts of initiator azobisisoheptonitrile, 0.15 part of catalyst bismuth carboxylate and 90 parts of solvent which is butanone toluene 1 in proportion; weighing the materials according to the first step, adding the materials into a reaction kettle, stirring and heating to 70 ℃, starting to dropwise add 15 parts of hepta-methyl methacrylate hepta-epoxy POSS when no solid exists in the reaction kettle, controlling the dropwise addition to be completed within 2 hours, and slowly heating to 90 ℃; keeping the temperature for reaction for 3h, measuring the acid value after three hours, controlling the acid value below 5mgKOH/g, and stopping heating; after cooling, adding 2 parts of triglycidyl p-aminophenol, and uniformly stirring; finally, 5 parts of curing agent is added, after uniform stirring, the material is discharged and stored in a dark place at low temperature, and the strippable gasket adhesive with the solid content of 29 percent is obtained;
EXAMPLE III
Weighing GT7070: 20 parts of epoxy resin with the NPES901 ratio of 1; weighing the mixture according to the first step, adding the mixture into a reaction kettle, stirring and heating to 70 ℃, starting to dropwise add 10 parts of mixed monomer of polymethyl methacrylate seven-epoxy POSS and polymethyl methacrylate seven-epoxy POSS according to a ratio of 1; keeping the temperature for reaction for 3h, measuring the acid value after three hours, controlling the acid value below 5mgKOH/g, and stopping heating; after cooling, adding 1 part of tetrafunctional group glycidyl amine epoxy resin, and uniformly stirring; finally, 5 parts of curing agent is added, after uniform stirring, the material is discharged and stored in a dark place at low temperature, and the peelable gasket adhesive with the solid content of 28 percent is obtained;
example four
Weighing GT7070: 20 parts of epoxy resin with the NPES904 proportion of 1; weighing the mixture according to the first step, adding the mixture into a reaction kettle, stirring and heating to 70 ℃, starting to dropwise add 10 parts of a mixed monomer of polylauryl acrylate and polymethyl methacrylate hepta-epoxy POSS according to a ratio of 1; keeping the temperature for reaction for 3h, measuring the acid value after three hours, controlling the acid value below 5mgKOH/g, and stopping heating; after cooling, 1 part of triglycidyl p-aminophenol is added and stirred uniformly; finally, 5 parts of curing agent is added, after uniform stirring, the material is discharged and stored in a dark place at low temperature, and the peelable gasket adhesive with the solid content of 28 percent is obtained;
EXAMPLE five
Weighing GT6099: 20 parts of epoxy resin with the NPES901 ratio of 1; weighing the mixture according to the first step, adding the mixture into a reaction kettle, stirring and heating to 70 ℃, starting to dropwise add 10 parts of a mixed monomer of polylauryl acrylate and polymethacrylic acid octyl heptaepoxy POSS according to a ratio of 1; keeping the temperature for reaction for 3h, measuring the acid value after three hours, controlling the acid value below 5mgKOH/g, and stopping heating; after cooling, adding 2 parts of triglycidyl para-aminophenol and tetrafunctional group glycidylamine into the mixture according to the ratio of 1; finally, 5 parts of curing agent is added, after uniform stirring, the material is discharged and stored in a dark place at low temperature, and the peelable gasket adhesive with the solid content of 28 percent is obtained;
coating the peelable gasket glue prepared in the above embodiments 1 to 5 on an aluminum foil, drying at 70 to 80 ℃ for 2min, and after drying, laminating and curing; the curing temperature is controlled between 120 ℃ and 150 ℃; the pressure is controlled to be 0.3-0.5MPa, the strippable gasket is obtained, and the test results are as follows:
1.90 degree peel test results
2.180 ° peel test results
3. Results of surface roughness test
4. Flatness test results
| Sample number | Numerical value |
| Example 1 | 0.0663 |
| Example 2 | 0.0580 |
| Example 3 | 0.0624 |
| Example 4 | 0.0656 |
| Example 5 | 0.0 747 |
Claims (7)
1. The peelable gasket adhesive is characterized in that the adhesive formula mainly comprises the following components in parts by weight:
epoxy resin: 10-20 parts of
Acrylate POSS monomer: 10-20 parts of
Initiator: 2 to 4 portions of
Catalyst: 0.2 to 1 portion
Polyfunctional epoxy resin: 1-2 parts of
Solvent: 160-200 parts of
Curing agent: 5 parts of a mixture;
the epoxy resin is one or more of bisphenol A type solid epoxy resin; the multifunctional epoxy resin is one or a mixture of four-functional glycidyl amine epoxy resin or triglycidyl p-aminophenol;
the acrylate POSS monomer is methacrylate-based heptaepoxy POSS and is prepared by condensation and a top end cap method, wherein n =1, 2, 3 and 4 \ 8230; the molecular formula of the acrylate POSS monomer is as follows:
2. the peelable gasket adhesive of claim 1, wherein: the initiator is one or a mixture of azodiisobutyronitrile or azodiisoheptonitrile.
3. The peelable gasket adhesive of claim 1, wherein: the catalyst is one or a mixture of several of an organic tin compound or a bismuth carboxylate catalyst.
4. The peelable gasket adhesive of claim 1, wherein: the solvent is one or more of ethyl acetate, butanone, butyl acetate, toluene and xylene.
5. The peelable gasket adhesive of claim 1, wherein: the curing agent is one or a mixture of 5200 or DY9577 produced by Henschel.
6. A method of preparing a peelable gasket adhesive according to any of claims 1-5, wherein: the preparation method comprises the following steps:
(1) Weighing 10-20 parts of acrylate POSS monomer according to the mass ratio, 1-2 parts of initiator, 0.1-0.5 part of catalyst and 80-100 parts of solvent, uniformly stirring, reacting at 60 ℃ for 5-12h, removing the solvent, and drying to obtain polyacrylate POSS;
(2) Weighing 10-20 parts of epoxy resin, 1-2 parts of initiator, 0.1-0.5 part of catalyst and 80-100 parts of solvent by weight, adding into a reaction kettle, stirring and heating to 70 ℃, dropwise adding the polyacrylate POSS in the step (1) when no solid exists in the reaction kettle, controlling the dropwise adding to be finished within 2 hours, and slowly heating to 90 ℃; keeping the temperature for reaction for 3h, measuring the acid value after three hours, controlling the acid value below 5mgKOH/g, and stopping heating;
(3) After the product in the step (2) is cooled, adding 1-2 parts of polyfunctional epoxy resin, and uniformly stirring;
(4) And (4) adding a curing agent into the product obtained in the step (3), uniformly stirring, discharging, and storing at low temperature in a dark place to obtain the peelable gasket glue with the solid content of 20-40%.
7. The method of preparing a peelable gasket adhesive according to claim 6, wherein: the testing method of the peelable gasket glue comprises the steps of coating the peelable gasket glue on an aluminum foil, drying at 70-80 ℃ for 2min, and laminating and curing after drying; the curing temperature is controlled between 120 ℃ and 150 ℃; the pressure is controlled between 0.3 MPa and 0.5MPa.
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101186799A (en) * | 2007-11-19 | 2008-05-28 | 河北大学 | Fire resistant anaerobic adhesive containing cage-type silsesquioxane and preparation method thereof |
| CN101993670A (en) * | 2010-10-29 | 2011-03-30 | 黑龙江省科学院石油化学研究院 | Active group containing polyacrylate flexibilizer, preparation method thereof and epoxy resin adhesive modified by same |
| CN105860889A (en) * | 2016-04-20 | 2016-08-17 | 黑龙江省科学院石油化学研究院 | Water-based strippable gasket adhesive and preparation method thereof |
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| CN101770171B (en) * | 2008-12-31 | 2012-06-27 | 财团法人工业技术研究院 | Photosensitive composition, sealing structure and manufacturing method of sealing structure |
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Denomination of invention: A peelable gasket adhesive and its preparation method Granted publication date: 20221220 Pledgee: Bank of Nanjing Co.,Ltd. Changzhou Branch Pledgor: ICLOUD ADVANCED MATERIAL TECHNOLOGY Co.,Ltd. Registration number: Y2024980000678 |