CN112358823A - 一种电子皮肤及其制备方法 - Google Patents
一种电子皮肤及其制备方法 Download PDFInfo
- Publication number
- CN112358823A CN112358823A CN202011127671.6A CN202011127671A CN112358823A CN 112358823 A CN112358823 A CN 112358823A CN 202011127671 A CN202011127671 A CN 202011127671A CN 112358823 A CN112358823 A CN 112358823A
- Authority
- CN
- China
- Prior art keywords
- layer
- electronic skin
- induction
- substrate
- epoxy resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000002360 preparation method Methods 0.000 title claims abstract description 9
- 210000003491 skin Anatomy 0.000 claims abstract description 33
- 230000006698 induction Effects 0.000 claims abstract description 31
- 239000000758 substrate Substances 0.000 claims abstract description 30
- 239000003822 epoxy resin Substances 0.000 claims abstract description 19
- 230000017525 heat dissipation Effects 0.000 claims abstract description 19
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 19
- 238000004806 packaging method and process Methods 0.000 claims abstract description 15
- 239000000835 fiber Substances 0.000 claims abstract description 13
- 229920005749 polyurethane resin Polymers 0.000 claims abstract description 12
- 229920002748 Basalt fiber Polymers 0.000 claims abstract description 9
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 9
- 239000002033 PVDF binder Substances 0.000 claims abstract description 9
- 239000004642 Polyimide Substances 0.000 claims abstract description 9
- 229910021389 graphene Inorganic materials 0.000 claims abstract description 9
- 229920001721 polyimide Polymers 0.000 claims abstract description 9
- 229920002981 polyvinylidene fluoride Polymers 0.000 claims abstract description 9
- 229920002379 silicone rubber Polymers 0.000 claims abstract description 8
- 210000000438 stratum basale Anatomy 0.000 claims abstract description 7
- 230000004044 response Effects 0.000 claims abstract description 6
- 238000005538 encapsulation Methods 0.000 claims abstract description 3
- 239000002184 metal Substances 0.000 claims description 19
- 229910052751 metal Inorganic materials 0.000 claims description 19
- 238000000034 method Methods 0.000 claims description 15
- 239000011248 coating agent Substances 0.000 claims description 13
- 238000000576 coating method Methods 0.000 claims description 13
- 239000000243 solution Substances 0.000 claims description 13
- 239000011259 mixed solution Substances 0.000 claims description 11
- 238000004528 spin coating Methods 0.000 claims description 10
- 239000004744 fabric Substances 0.000 claims description 9
- 229920001296 polysiloxane Polymers 0.000 claims description 7
- 239000004519 grease Substances 0.000 claims description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 4
- 238000004519 manufacturing process Methods 0.000 claims description 4
- 239000000741 silica gel Substances 0.000 claims description 4
- 229910002027 silica gel Inorganic materials 0.000 claims description 4
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 3
- 229910052737 gold Inorganic materials 0.000 claims description 3
- 239000010931 gold Substances 0.000 claims description 3
- 238000002156 mixing Methods 0.000 claims description 3
- 239000002994 raw material Substances 0.000 claims description 3
- 229910052709 silver Inorganic materials 0.000 claims description 3
- 239000004332 silver Substances 0.000 claims description 3
- 238000003756 stirring Methods 0.000 claims description 3
- 239000003292 glue Substances 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000036541 health Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000004816 latex Substances 0.000 description 1
- 229920000126 latex Polymers 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 239000011664 nicotinic acid Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 230000037152 sensory function Effects 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/29—Laminated material
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/18—Manufacture of films or sheets
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D163/00—Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D175/00—Coating compositions based on polyureas or polyurethanes; Coating compositions based on derivatives of such polymers
- C09D175/04—Polyurethanes
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
- G01D5/00—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable
- G01D5/12—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable using electric or magnetic means
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2327/00—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Derivatives of such polymers
- C08J2327/02—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Derivatives of such polymers not modified by chemical after-treatment
- C08J2327/12—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Derivatives of such polymers not modified by chemical after-treatment containing fluorine atoms
- C08J2327/16—Homopolymers or copolymers of vinylidene fluoride
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2363/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2377/00—Characterised by the use of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Derivatives of such polymers
- C08J2377/10—Polyamides derived from aromatically bound amino and carboxyl groups of amino carboxylic acids or of polyamines and polycarboxylic acids
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2379/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2361/00 - C08J2377/00
- C08J2379/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C08J2379/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2383/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon only; Derivatives of such polymers
- C08J2383/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2427/00—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Derivatives of such polymers
- C08J2427/02—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Derivatives of such polymers not modified by chemical after-treatment
- C08J2427/12—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Derivatives of such polymers not modified by chemical after-treatment containing fluorine atoms
- C08J2427/16—Homopolymers or copolymers of vinylidene fluoride
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2463/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2477/00—Characterised by the use of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Derivatives of such polymers
- C08J2477/10—Polyamides derived from aromatically bound amino and carboxyl groups of amino carboxylic acids or of polyamines and polycarboxylic acids
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2479/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2461/00 - C08J2477/00
- C08J2479/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C08J2479/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K7/00—Use of ingredients characterised by shape
- C08K7/02—Fibres or whiskers
- C08K7/04—Fibres or whiskers inorganic
- C08K7/06—Elements
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K7/00—Use of ingredients characterised by shape
- C08K7/02—Fibres or whiskers
- C08K7/04—Fibres or whiskers inorganic
- C08K7/10—Silicon-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2427/00—Presence of halogenated polymer
- C09J2427/006—Presence of halogenated polymer in the substrate
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2463/00—Presence of epoxy resin
- C09J2463/006—Presence of epoxy resin in the substrate
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2475/00—Presence of polyurethane
- C09J2475/006—Presence of polyurethane in the substrate
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2477/00—Presence of polyamide
- C09J2477/006—Presence of polyamide in the substrate
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2479/00—Presence of polyamine or polyimide
- C09J2479/08—Presence of polyamine or polyimide polyimide
- C09J2479/086—Presence of polyamine or polyimide polyimide in the substrate
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2483/00—Presence of polysiloxane
- C09J2483/006—Presence of polysiloxane in the substrate
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Wood Science & Technology (AREA)
- Life Sciences & Earth Sciences (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Laminated Bodies (AREA)
Abstract
本发明涉及电子皮肤技术领域,尤其涉及一种电子皮肤及其制备方法。包括基底层、设置于基地层上的感应层、设置于所述感应层上的封装层、设置于所述基底层底部的胶合层和设置于所述胶合层上的离型纸。所述基底层和封装层上分别设置有散热层;所述感应层上设置有导电层和微型传感器;所述基底层由聚酰亚胺、聚偏氟乙烯、聚芳酰胺和环氧树脂原料制作而成;所述感应层由石墨烯纤维、玄武岩纤维和硅橡胶原料制作而成;所述封装层由环氧树脂和聚氨酯树脂原料制作而成;以提高电子皮肤的导电性和增加耐磨程度。
Description
技术领域
本发明涉及电子皮肤技术领域,尤其涉及一种电子皮肤及其制备方法。
背景技术
电子皮肤在智能机器人、仿生假肢、健康实时监测等领域具有巨大的应用前景。电子皮肤用来模仿皮肤的感觉功能如触觉、温度感知等功能。其结构简单,可被加工成各种形状,能附着在设备表面,能够让设备感知到物体的地点和方位以及硬度等信息。现有的电子皮肤导电性差,制作复杂,而且不耐磨,不适用于工业上使用。
发明内容
本发明所要解决的技术问题,是针对上述存在的技术不足,提供了一种电子皮肤及其制备方法,以提高电子皮肤的导电性和增加耐磨程度。
为解决上述技术问题,本发明所采用的技术方案是:包括基底层、设置于基地层上的感应层、设置于所述感应层上的封装层、设置于所述基底层底部的胶合层和设置于所述胶合层上的离型纸。所述基底层和封装层上分别设置有散热层;所述感应层上设置有导电层和微型传感器。
进一步优化本技术方案,所述基底层由聚酰亚胺、聚偏氟乙烯、聚芳酰胺和环氧树脂原料制作而成。
进一步优化本技术方案,所述感应层由石墨烯纤维、玄武岩纤维和硅橡胶原料制作而成。
进一步优化本技术方案,所述封装层由环氧树脂和聚氨酯树脂原料制作而成。
进一步优化本技术方案,所述散热层为在基底层涂抹散热硅胶。
进一步优化本技术方案,所述导电层由导电金属线条连接而成,所述导电金属为金或银。
进一步优化本技术方案,所述微型传感器为接触传感器。
进一步优化本技术方案,包括以下步骤:
S1、首先将制备好的聚酰亚胺、聚偏氟乙烯、聚芳酰胺和环氧树脂溶液按比例混合搅拌成混合溶液,通过旋涂法将混合溶液均匀地涂覆在模具基片上,形成基底薄膜;
S2、然后将散热硅脂均匀涂抹在基底薄膜上;
S3、然后将金属线条根据每个感应点放置在基底薄膜上,通过金属线条连接起每个感应点;
S4、将制备好的石墨烯纤维和玄武岩纤维,用纤维织布机制作成网格布,放置在金属线条上,然后在金属线条上安装多个接触传感器;
S5、将制备好的硅橡胶溶液通过旋涂法覆盖在细纱布上,形成感应薄膜;然后均匀涂抹散热硅脂;
S6、将制备好的环氧树脂和聚氨酯树脂溶液通过旋涂法均匀的涂覆在感应薄膜上,或者包覆在基底薄膜和感应薄膜上。
进一步优化本技术方案,所述感应点为每个接触传感器安装的位置;多个所述感应点成方格形分布在基底薄膜上。
进一步优化本技术方案,多个所述接触传感器电性连接在工控机上。
与现有技术相比,本发明具有以下优点:
1、使用聚酰亚胺、聚偏氟乙烯、聚芳酰胺和环氧树脂制作基底层,保证了电子皮肤可以耐高温,不易变形的特性;
2、使用石墨烯纤维、玄武岩纤维和硅橡胶制作制作成感应层,保证了微型传感器不会受到影响,具有良好的导电性,散热程度好;
3、使用环氧树脂和聚氨酯树脂制作封装层,保证了电子皮肤可以增加耐磨性能和耐高温;
4、使用接触传感器采用方格形分布,保证接触范围更加均匀,不会受到影响。
附图说明
图1为一种电子皮肤及其制备方法总结构示意图。
图2为一种电子皮肤及其制备方法感应层示意图。
图中:1、基底层;2、感应层;3、封装层;4、胶合层;5、离型纸;6、散热层;7、导电层;8、微型传感器;9、导电金属线条。
具体实施方式
为使本发明的目的、技术方案和优点更加清楚明了,下面结合具体实施方式并参照附图,对本发明进一步详细说明。应该理解,这些描述只是示例性的,而并非要限制本发明的范围。此外,在以下说明中,省略了对公知结构和技术的描述,以避免不必要地混淆本发明的概念。
实施例
本发明提供了一种电子皮肤,包括基底层1、设置于所述基底层1上的感应层2、设置于所述感应层2上的封装层3、设置于所述基底层1底部的胶合层4和设置于所述胶合层4上的离型纸5。所述基底层1和封装层3上分别设置有散热层6;所述感应层2上设置有导电层7和微型传感器8;所述基底层1由聚酰亚胺、聚偏氟乙烯、聚芳酰胺和环氧树脂原料制作而成;所述感应层2由石墨烯纤维、玄武岩纤维和硅橡胶原料制作而成;所述封装层3由环氧树脂和聚氨酯树脂原料制作而成;所述散热层6为在基底层1和封装层3涂抹散热硅胶;所述导电层7由导电金属线条9连接而成,所述导电金属线条9为金或银;所述微型传感器8为接触传感器。
本发明提供了一种电子皮肤的制备方法,包括以下步骤:
S1、首先将制备好的聚酰亚胺、聚偏氟乙烯、聚芳酰胺和环氧树脂溶液按比例混合搅拌成混合溶液,通过旋涂法将混合溶液均匀地涂覆在模具基片上,形成基底薄膜;
S2、然后将散热硅脂均匀涂抹在基底薄膜上;
S3、然后将金属线条根据每个感应点放置在基底薄膜上,通过金属线条连接起每个感应点;
S4、将制备好的石墨烯纤维和玄武岩纤维,用纤维织布机制作成网格布,放置在金属线条上,然后在金属线条上安装多个接触传感器;
S5、将制备好的硅橡胶溶液通过旋涂法覆盖在细纱布上,形成感应薄膜;然后均匀涂抹散热硅脂;
S6、将制备好的环氧树脂和聚氨酯树脂溶液通过旋涂法均匀的涂覆在感应薄膜上,或者包覆在基底薄膜和感应薄膜上。
优选的,所述感应点为每个接触传感器安装的位置;多个所述感应点成方格形分布在基底薄膜上;多个所述接触传感器电性连接在工控机上。
由图1-2可以看出,电子皮肤分为五层组成,撕下离型纸贴在设备上,然后线路连接在工控机上,胶合层采用乳胶自粘胶,保证操作简单,还可以包覆在设备上,不易脱落;将制备好的混合溶液分别倒入匀胶机中,通过转速和混合溶液的浓度制成规定的薄膜,然后一次次叠加倒入基底层混合溶液、感应层混合溶液和封装层混合溶液,完成制作。
综上所述,电子皮肤的基底层采用的聚酰亚胺、聚偏氟乙烯和聚芳酰胺原料具有耐高温和耐氧化的性能,可以防止电子皮肤不易发生塑性形变;电子皮肤的感应层用的石墨烯纤维和玄武岩纤维网格布,通过纤维织布机将两种纤维纺织成网格布,铺设在感应层内,具有良好的韧性和强度;在用硅树脂旋涂在网格布上,形成感应层;涂抹的散热硅胶可以降低电子皮肤的温度;封装层采用的聚氨酯树脂具有高强度、抗撕裂、耐磨的特性。
应当理解的是,本发明的上述具体实施方式仅仅用于示例性说明或解释本发明的原理,而不构成对本发明的限制。因此,在不偏离本发明的精神和范围的情况下所做的任何修改、等同替换、改进等,均应包含在本发明的保护范围之内。此外,本发明所附权利要求旨在涵盖落入所附权利要求范围和边界、或者这种范围和边界的等同形式内的全部变化和修改例。
Claims (10)
1.一种电子皮肤,其特征在于:包括基底层(1)、设置于所述基底层(1)上的感应层(2)、设置于所述感应层(2)上的封装层(3)、设置于所述基底层(1)底部的胶合层(4)和设置于所述胶合层(4)上的离型纸(5)。所述基底层(1)和封装层(3)上分别设置有散热层(6);所述感应层(2)上设置有导电层(7)和微型传感器(8)。
2.根据权利要求1所述的一种电子皮肤,其特征在于:所述基底层(1)由聚酰亚胺、聚偏氟乙烯、聚芳酰胺和环氧树脂原料制作而成。
3.根据权利要求1所述的一种电子皮肤,其特征在于:所述感应层(2)由石墨烯纤维、玄武岩纤维和硅橡胶原料制作而成。
4.根据权利要求1所述的一种电子皮肤,其特征在于:所述封装层(3)由环氧树脂和聚氨酯树脂原料制作而成。
5.根据权利要求1所述的一种电子皮肤,其特征在于:所述散热层(6)为在基底层(1)和封装层(3)涂抹散热硅胶。
6.根据权利要求1所述的一种电子皮肤,其特征在于:所述导电层(7)由导电金属线条(9)连接而成,所述导电金属线条(9)为金或银。
7.根据权利要求1所述的一种电子皮肤,其特征在于:所述微型传感器(8)为接触传感器。
8.一种电子皮肤的制备方法,其特征在于:包括以下步骤:
S1、首先将制备好的聚酰亚胺、聚偏氟乙烯、聚芳酰胺和环氧树脂溶液按比例混合搅拌成混合溶液,通过旋涂法将混合溶液均匀地涂覆在模具基片上,形成基底薄膜;
S2、然后将散热硅脂均匀涂抹在基底薄膜上;
S3、然后将金属线条根据每个感应点放置在基底薄膜上,通过金属线条连接起每个感应点;
S4、将制备好的石墨烯纤维和玄武岩纤维,用纤维织布机制作成网格布,放置在金属线条上,然后在金属线条上安装多个接触传感器;
S5、将制备好的硅橡胶溶液通过旋涂法覆盖在细纱布上,形成感应薄膜;然后均匀涂抹散热硅脂;
S6、将制备好的环氧树脂和聚氨酯树脂溶液通过旋涂法均匀的涂覆在感应薄膜上,或者包覆在基底薄膜和感应薄膜上。
9.根据权利要求8所述的一种电子皮肤的制备方法,其特征在于:所述感应点为每个接触传感器安装的位置;多个所述感应点成方格形分布在基底薄膜上。
10.根据权利要求9所述的一种电子皮肤的制备方法,其特征在于:多个所述接触传感器电性连接在工控机上。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202011127671.6A CN112358823A (zh) | 2020-10-20 | 2020-10-20 | 一种电子皮肤及其制备方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202011127671.6A CN112358823A (zh) | 2020-10-20 | 2020-10-20 | 一种电子皮肤及其制备方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN112358823A true CN112358823A (zh) | 2021-02-12 |
Family
ID=74510487
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202011127671.6A Pending CN112358823A (zh) | 2020-10-20 | 2020-10-20 | 一种电子皮肤及其制备方法 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN112358823A (zh) |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN206228336U (zh) * | 2016-08-18 | 2017-06-09 | 云南科威液态金属谷研发有限公司 | 一种电子皮肤 |
CN108045032A (zh) * | 2017-11-29 | 2018-05-18 | 宁国市龙晟柔性储能材料科技有限公司 | 一种基于石墨烯的导电传感织物的制备方法 |
CN110058738A (zh) * | 2019-04-11 | 2019-07-26 | 清华大学深圳研究生院 | 一种离子型的柔性触控传感器 |
CN209847154U (zh) * | 2019-03-07 | 2019-12-27 | 景德镇全球亮科技有限公司 | 仿生电子皮肤 |
-
2020
- 2020-10-20 CN CN202011127671.6A patent/CN112358823A/zh active Pending
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN206228336U (zh) * | 2016-08-18 | 2017-06-09 | 云南科威液态金属谷研发有限公司 | 一种电子皮肤 |
CN108045032A (zh) * | 2017-11-29 | 2018-05-18 | 宁国市龙晟柔性储能材料科技有限公司 | 一种基于石墨烯的导电传感织物的制备方法 |
CN209847154U (zh) * | 2019-03-07 | 2019-12-27 | 景德镇全球亮科技有限公司 | 仿生电子皮肤 |
CN110058738A (zh) * | 2019-04-11 | 2019-07-26 | 清华大学深圳研究生院 | 一种离子型的柔性触控传感器 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN109883583B (zh) | 一种弹性体薄膜及其制备方法与包含该弹性体薄膜的柔性压力传感器 | |
CN106482628B (zh) | 一种大变形柔性应变传感器及其制备方法 | |
CN106908176A (zh) | 具有微结构化的多相介电层电容式压力传感器及其制法 | |
CN110108375B (zh) | 一种基于MXene材料的电子皮肤及其制备方法 | |
CN108918906B (zh) | 一种流速传感器的制备方法 | |
CN109883584B (zh) | 基于微结构的柔性仿生触觉传感器及其制备方法 | |
CN108318162A (zh) | 一种柔性传感器及其制备方法 | |
CN108318161A (zh) | 可穿戴压力传感器及其制造方法 | |
CN208350249U (zh) | 一种高灵敏度柔性压力传感器 | |
CN110174195A (zh) | 一种仿生柔性压力传感器 | |
Zhao et al. | Washable patches with gold nanowires/textiles in wearable sensors for health monitoring | |
CN111855036A (zh) | 超宽量程柔性传感器及其制备方法和分布式压力监测系统 | |
CN110701992B (zh) | 以砂纸表面微结构为模板的电容式应变传感器制作方法 | |
CN108288513A (zh) | 一种基于分形结构银微粒的柔性和可拉伸导体及其制备方法 | |
CN113218296B (zh) | 一种弹性应变传感器及其制备方法 | |
CN107504893A (zh) | 高灵敏度网状石墨烯/弹性体应变传感器及其制备方法 | |
CN105115414A (zh) | 一种环保型的可穿戴应变传感器及其制备方法 | |
CN109738097A (zh) | 一种多功能电子皮肤及其制作方法、平面外力检测方法 | |
CN111786590A (zh) | 可同时检测温度和压力的摩擦纳米发电机及柔性传感器 | |
Lin et al. | Microcracked strain sensor based on carbon nanotubes/copper composite film with high performance and waterproof property for underwater motion detection | |
CN112781757A (zh) | 一种基于石墨烯的柔性电容式压力传感器及其制备方法 | |
CN210783050U (zh) | 一种智能手套 | |
CN112358823A (zh) | 一种电子皮肤及其制备方法 | |
CN105509937B (zh) | 一种压感传感器、压力检测方法及制造工艺 | |
Xu et al. | Stretchable, Adhesive, and Bioinspired Visual Electronic Skin with Strain/Temperature/Pressure Multimodal Non-Interference Sensing |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
RJ01 | Rejection of invention patent application after publication |
Application publication date: 20210212 |
|
RJ01 | Rejection of invention patent application after publication |