CN112351377A

CN112351377A - Method for manufacturing plane loudspeaker diaphragm

Info

Publication number: CN112351377A
Application number: CN202011177627.6A
Authority: CN
Inventors: 冯勃程
Original assignee: Individual
Current assignee: Individual
Priority date: 2020-10-29
Filing date: 2020-10-29
Publication date: 2021-02-09

Abstract

The invention discloses a manufacturing method of a planar loudspeaker diaphragm, wherein the loudspeaker diaphragm comprises a diaphragm substrate layer and a conducting layer, the conducting layer is arranged on the surface of the diaphragm substrate, and the conducting layer and the diaphragm substrate are directly attached through hot pressing or are attached into a whole through an adhesive layer. According to the invention, the conductive circuit is prepared by adopting the punching process, so that the processing is simple and convenient, and the punched conductive circuit can be very light and thin to be 6 nanometers or less; therefore, the weight of the vibrating diaphragm can be reduced, and the vibration efficiency, the sensitivity and the transient characteristic of the vibrating diaphragm are improved. In addition, the conductive circuit is attached to the diaphragm body through an adhesive, so that the type of a carrier material is not limited; materials with corrosion resistance do not need to be used, so that the material selection range of the diaphragm is increased.

Description

Method for manufacturing plane loudspeaker diaphragm

Technical Field

The invention relates to the technical field of loudspeaker diaphragm manufacturing, in particular to a manufacturing method of a planar loudspeaker diaphragm.

Background

The surface of the planar loudspeaker diaphragm is provided with a conductive circuit capable of vibrating together with the diaphragm, the traditional conductive circuit usually uses a Polyimide (PI) film as a base material, a copper foil is pasted on the base material, and chemical liquid medicine is adopted for etching to form the conductive circuit. However, since etching is corrosive, the diaphragm substrate is required to have corrosion resistance, and the material of the substrate is limited. In addition, due to process limitations, the etched conductive circuit is generally thick, which results in a thick diaphragm, increased mass, low vibration efficiency, reduced sensitivity, and reduced transient characteristics. Therefore, there is a need for improvements to existing fabrication methods.

Disclosure of Invention

The present invention is directed to a method for manufacturing a planar loudspeaker diaphragm, so as to solve the problems mentioned in the background art.

In order to achieve the purpose, the invention provides the following technical scheme: the utility model provides a plane loudspeaker diaphragm, loudspeaker diaphragm includes vibrating diaphragm substrate and conducting layer, the conducting layer sets up in vibrating diaphragm substrate surface, the conducting layer is directly laminated or is laminated into whole through the adhesive layer through hot pressing with the vibrating diaphragm substrate.

Preferably, the manufacturing method comprises the following steps:

A. preparing a composite film material, namely bonding the vibrating diaphragm substrate and the conducting layer into a whole composite film in a gluing or hot pressing mode;

B. preparing a conductive circuit; and preparing a conductive circuit on the whole conductive medium in a laser engraving or punching mode.

Preferably, in the step a, the diaphragm base material is made of PET, PEN, PEEK or TPU.

Preferably, the material of the conductive layer in step a is a conductive film, including but not limited to metal aluminum or metal copper.

Preferably, the conductive circuit in the step B is processed and manufactured by a picosecond laser cutting device.

Preferably, when the conductive circuit is processed and manufactured, the picosecond laser cutting device cuts the composite film material on the conductive layer side to form the conductive circuit, and the conductive layer is cut off, and the base material layer is not cut off.

Compared with the prior art, the invention has the beneficial effects that: according to the invention, the conductive circuit is prepared by adopting the punching process, so that the processing is simple and convenient, and the punched conductive circuit can be very light and thin to be 6 nanometers or less; therefore, the weight of the vibrating diaphragm can be reduced, and the vibration efficiency, the sensitivity and the transient characteristic of the vibrating diaphragm are improved. In addition, the conductive circuit is attached to the diaphragm body through an adhesive, so that the type of a carrier material is not limited; need not to use the material that has corrosion resistance certainly to increased the selection material scope of vibrating diaphragm, can have more dominant materials on the material selection type, can adopt the macromolecular material lighter than the polyimide material, let high frequency ductility better, thereby the efficiency of increase high frequency. Because the conducting layer is nanoscale in thickness, if the conducting layer is attached to the circuit and is easy to break, damage or adhere to and deform, the conducting circuit can be prepared after the composite film material is prepared, the production difficulty can be reduced, the product yield can be greatly improved, the practicability is high, and the method has strong popularization significance.

Drawings

FIG. 1 is a schematic partial cross-sectional view of a planar loudspeaker diaphragm made in accordance with the present invention;

fig. 2 is a schematic diagram of one of the conductive circuit structures of the planar loudspeaker diaphragm of fig. 1.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

In the description of the present invention, it should be noted that the terms "upper", "lower", "inner", "outer", "front", "rear", "both ends", "one end", "the other end", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "disposed," "connected," and the like are to be construed broadly, such as "connected," which may be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.

The first embodiment is as follows:

referring to fig. 1-2, the present invention provides a technical solution: the utility model provides a plane loudspeaker diaphragm, loudspeaker diaphragm includes diaphragm substrate 1 and conducting layer 2, conducting layer 1 sets up in diaphragm substrate 2 surfaces, conducting layer 1 and diaphragm substrate 2 directly laminate or laminate into a whole through adhesive layer 3 through the hot pressing.

The manufacturing method of the embodiment comprises the following steps:

And B, in the step A, the vibrating diaphragm base material is made of PET, PEN, PEEK and TPU.

The material of the conductive layer in step a is a conductive film, including but not limited to metal aluminum or metal copper.

In the invention, the conducting circuit in the step B is processed and manufactured by adopting a picosecond laser cutting device; when the conducting circuit is processed and manufactured, the picosecond laser cutting device cuts the composite film material on the side of the conducting layer to form the conducting circuit, the conducting layer is cut off, and the base material layer is not cut off.

In the embodiment, when the adhesion is adopted in the step a, the adhesive comprises, by weight, 4-10 parts of carbon nanotubes, 10-20 parts of double-layer graphene, and 3-9 parts of polyamide imide. The graphene and the carbon nano tube can realize the grafting of groups by methods such as carboxylation, hydroxylation, amination and sulfonation; the polyamide imide is mixed with the carbon nano tube and the graphene and then is polymerized in situ, so that the bonding strength and the conductivity are improved.

Example two:

the utility model provides a plane loudspeaker diaphragm, loudspeaker diaphragm includes diaphragm substrate 1 and conducting layer 2, conducting layer 1 sets up in diaphragm substrate 2 surfaces, conducting layer 1 and diaphragm substrate 2 directly laminate or laminate into a whole through adhesive layer 3 through the hot pressing.

The manufacturing method of the embodiment comprises the following steps:

In the embodiment, when the adhesion is adopted in the step a, the adhesive comprises, by weight, 4-10 parts of carbon nanotubes, 10-20 parts of double-layer graphene, and 3-9 parts of polyamide imide. The carbon nano tube has good mechanical property, good flexibility, good conductivity and good heat transfer property; the double-layer graphene has good toughness, can be bent, has good heat conduction performance, has super hydrophobicity and super lipophilicity, and can realize the grafting of groups by carboxylation, hydroxylation, amination, sulfonation and other methods; the polyamide-imide has good wear resistance and alkali resistance, good adhesion and storage stability, and excellent mechanical properties; the polyamide-imide is mixed with the carbon nano tube and the graphene, and then is subjected to in-situ polymerization, so that the bonding strength and the conductivity are improved, the tensile strength of the adhesive can reach 15MPA, the shear strength can reach 10MPA, the impact strength can reach 9MPA, and the high temperature resistance can reach 160 ℃.

In this embodiment, a step of attaching a support frame is added before or after the second step to form the diaphragm with the support, and the support frame may be formed of a medium, a material, or a speaker accessory that can serve as a support, such as but not limited to a PCB or a speaker cover, as needed. Therefore, the planar loudspeaker diaphragm can be used for preparing a conductive circuit which is attached to other loudspeaker parts or other parts after the preparation is finished, and the loudspeaker diaphragm is convenient to mount.

In conclusion, the invention prepares the conductive circuit by adopting the punching process, so that the processing is simple and convenient, and the punched conductive circuit can be very light and thin to be 6 nanometers or less; therefore, the weight of the vibrating diaphragm can be reduced, and the vibration efficiency, the sensitivity and the transient characteristic of the vibrating diaphragm are improved. In addition, the conductive circuit is attached to the diaphragm body through an adhesive, so that the type of a carrier material is not limited; need not to use the material that has corrosion resistance certainly to increased the selection material scope of vibrating diaphragm, can have more dominant materials on the material selection type, can adopt the macromolecular material lighter than the polyimide material, let high frequency ductility better, thereby the efficiency of increase high frequency. Because the conducting layer is nanoscale in thickness, if the conducting layer is attached to the circuit and is easy to break, damage or adhere to and deform, the conducting circuit can be prepared after the composite film material is prepared, the production difficulty can be reduced, the product yield can be greatly improved, the practicability is high, and the method has strong popularization significance.

It will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.

Claims

1. A planar loudspeaker diaphragm, characterized in that: the loudspeaker diaphragm comprises a diaphragm base material (1) and a conducting layer (2), wherein the conducting layer (1) is arranged on the surface of the diaphragm base material (2), and the conducting layer (1) and the diaphragm base material (2) are directly attached through hot pressing or are integrally attached through an adhesive layer (3).

2. The method for manufacturing the diaphragm of the planar loudspeaker in claim 1 is characterized in that: the manufacturing method comprises the following steps:

3. The method of claim 2, wherein the method further comprises the steps of: and in the step A, the vibrating diaphragm base material is made of PET, PEN, PEEK and TPU.

4. The method of claim 1, wherein the method further comprises: the material of the conductive layer in the step a is a conductive film, including but not limited to metal aluminum or metal copper.

5. The method of claim 1, wherein the method further comprises: and B, processing and manufacturing the conducting circuit by adopting a picosecond laser cutting device.

6. The method of claim 5, wherein the method further comprises the steps of: when the conducting circuit is processed and manufactured, the picosecond laser cutting device cuts the composite film material on the side of the conducting layer to form the conducting circuit, the conducting layer is cut off, and the base material layer is not cut off.