CN112345914A - Automatic burning and function testing jig - Google Patents
Automatic burning and function testing jig Download PDFInfo
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- CN112345914A CN112345914A CN202011054102.3A CN202011054102A CN112345914A CN 112345914 A CN112345914 A CN 112345914A CN 202011054102 A CN202011054102 A CN 202011054102A CN 112345914 A CN112345914 A CN 112345914A
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- 238000012360 testing method Methods 0.000 title claims abstract description 41
- 239000000872 buffer Substances 0.000 claims abstract description 13
- 230000000903 blocking effect Effects 0.000 claims description 34
- 239000011159 matrix material Substances 0.000 claims description 12
- 230000003139 buffering effect Effects 0.000 claims description 6
- 239000000969 carrier Substances 0.000 claims description 3
- 238000011990 functional testing Methods 0.000 claims 1
- 238000000034 method Methods 0.000 description 7
- 230000005540 biological transmission Effects 0.000 description 5
- CXKIGWXPPVZSQK-UHFFFAOYSA-N 1,2,4-trichloro-3-(2,4-dichlorophenyl)benzene Chemical compound ClC1=CC(Cl)=CC=C1C1=C(Cl)C=CC(Cl)=C1Cl CXKIGWXPPVZSQK-UHFFFAOYSA-N 0.000 description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 230000003028 elevating effect Effects 0.000 description 4
- 230000000712 assembly Effects 0.000 description 2
- 238000000429 assembly Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 230000002950 deficient Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 210000001503 joint Anatomy 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2832—Specific tests of electronic circuits not provided for elsewhere
- G01R31/2834—Automated test systems [ATE]; using microprocessors or computers
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
- G01R31/2803—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP] by means of functional tests, e.g. logic-circuit-simulation or algorithms therefor
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- General Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Tests Of Electronic Circuits (AREA)
Abstract
The invention discloses an automatic burning and function testing jig which comprises a conveyor belt group, a jacking carry mechanism and a lower driving carry mechanism, wherein the conveyor belt group is arranged above the jacking carry mechanism; when the micro needle module is processed, the jacking carry mechanism lifts the carrier upwards to be separated from the conveyor belt group, the lower driving carry mechanism drives the upper micro needle downwards to press the PCB assembly, the jacking carry mechanism lifts the carrier upwards to enable the micro needle module to be aligned with and close to the connector of the PCB assembly, and the lower driving carry mechanism drives the buffer part downwards to push the connector to be electrically connected with the micro needle module. The automatic burning and function testing jig has the advantage of compact structure.
Description
Technical Field
The invention relates to the technical field of burning function testing, in particular to an automatic burning and function testing jig.
Background
In the PCB assembly design and manufacturing industry, a program needs to be written into a chip on a PCB assembly, and then specific performance indexes of the PCB assembly are detected to screen qualified PCB assemblies and defective products. The existing automatic burning and function testing equipment has a huge structure and is easy to damage a PCB assembly.
Therefore, a compact automatic programming and functional testing fixture is needed to overcome the above-mentioned drawbacks.
Disclosure of Invention
The invention aims to provide an automatic burning and function testing jig with a compact structure.
In order to achieve the purpose, the automatic burning and functional testing jig is used for burning and testing a PCB assembly on a carrier and comprises a conveyor belt group, a jacking carry mechanism and a lower driving carry mechanism, wherein the conveyor belt group is arranged above the jacking carry mechanism; when the micro needle module is processed, the jacking carry mechanism lifts the carrier upwards to be separated from the conveyor belt group, the lower driving carry mechanism drives the upper micro needle downwards to press the PCB assembly, the jacking carry mechanism lifts the carrier upwards again to enable the micro needle module to be aligned with and close to the connector of the PCB assembly, and the lower driving carry mechanism drives the buffer part downwards to push the connector to be electrically connected with the micro needle module.
Preferably, the automatic burning and function testing jig further comprises a mounting frame, the conveyor belt group and the jacking carry mechanism are mounted on the mounting frame, the jacking carry mechanism comprises a primary jacking device and a secondary jacking device, the primary jacking device is mounted on the mounting frame, the secondary jacking device is mounted at the output end of the primary jacking device, the primary jacking device drives the secondary jacking device to move up and down, the microneedle module is mounted at the output end of the secondary jacking device, and the secondary jacking device drives the microneedle module to move up and down.
Preferably, the primary jacking device of the invention comprises a first jacking cylinder, a jacking mounting plate and a plurality of guide sliding parts, wherein the first jacking cylinder is mounted on the mounting frame, the jacking mounting plate is mounted at the output end of the first jacking cylinder, the first jacking cylinder drives the jacking mounting plate to move up and down, the guide sliding parts are mounted on the mounting frame, the jacking mounting plate is mounted at the output end of the guide sliding parts, and the secondary jacking device is mounted on the jacking mounting plate.
Preferably, the secondary jacking device of the invention comprises a second jacking cylinder, a lower bearing frame and the microneedle modules, wherein the output end of the second jacking cylinder is mounted on the jacking mounting plate, the lower bearing frame is mounted on the output end of the second jacking cylinder, and the microneedle modules are mounted on the top of the lower bearing frame in a matrix arrangement.
Preferably, the secondary jacking device further comprises a plurality of lower microneedles, the lower microneedles are arranged on the top of the lower bearing frame in a matrix manner, and each row of microneedle modules is arranged beside each row of the lower microneedles.
Preferably, the lower drive carry mechanism of the present invention includes a lower drive carry device, an upper bearing frame, the upper microneedles and the buffering members, the upper bearing frame is detachably mounted at an output end of the lower drive carry device, the upper microneedles are mounted at a bottom of the upper bearing frame in a matrix arrangement, the buffering members are mounted at a bottom of the upper bearing frame in a matrix arrangement, and each row of the buffering members is disposed beside each of the upper microneedles.
Preferably, the lower driving carry device of the present invention includes an upper driver, a lower driver, an upper transmission assembly and a lower transmission assembly, wherein an input end of the upper transmission assembly is mounted at an output end of the upper driver, the lower transmission assembly is mounted at an output end of the upper driver, and the upper bearing frame is detachably mounted on the mounting base.
Preferably, the mounting base of the present invention is provided with mounting slot structures facing the mounting slot structures at intervals, the upper bearing frame is mounted on the mounting slot structures, the mounting base is provided with a plurality of locking members, and the upper bearing frame is detachably mounted on the mounting base by means of the locking members.
Preferably, the side edge of the bottom of the upper bearing frame is provided with a jacking positioning piece, the side edge of the top of the lower bearing frame is provided with a jacking fixing seat, the jacking fixing seat is provided with a positioning hole for inserting and positioning the jacking positioning piece, and the positioning hole is arranged opposite to the jacking positioning piece.
Preferably, the automatic burning and function testing jig further comprises a jacking blocking assembly mounted on the mounting frame, the jacking blocking assembly is arranged on the output end side of the conveyor belt group, the jacking blocking assembly comprises an assembling frame, a blocking cylinder and a blocking piece, the assembling frame is mounted on the mounting frame, the blocking cylinder is mounted on the assembling frame, the blocking piece is mounted at the output end of the blocking cylinder, and the blocking cylinder drives the blocking piece to cross the conveyor belt group or move back to the position below the conveyor belt group.
Compared with the prior art, the automatic burning and function testing jig is more compact in structure because the lower driving carry mechanism, the conveyor belt group and the jacking carry mechanism are arranged from top to bottom. And, the PCB subassembly is divided into four sections processes and is fixed a position, after jacking carry mechanism drives the rebound carry of PCB subassembly promptly, the carry mechanism that drives down orders about the microneedle downwards again and pushes down the PCB subassembly, realize the preliminary location to the PCB subassembly, later jacking carry mechanism drives PCB subassembly carry again upwards, make microneedle module and connector aim at and draw close, realize the complete positioning to the PCB subassembly, later the carry mechanism that drives down orders about the bolster downwards again and pushes away the connector downstream, make connector and microneedle module realize the electrical property and meet. From this, can carry out accurate location with the PCB subassembly, guarantee that micropin, micropin module and PCB subassembly can good electrical contact, be convenient for follow-up burn record and test the PCB subassembly. Moreover, because the PCB assembly is positioned in a four-section process, the impact on the PCB assembly can be effectively reduced when the PCB assembly is positioned, and the damage to the PCB assembly caused at regular time is avoided.
Drawings
Fig. 1 is a schematic three-dimensional structure diagram of the automatic recording and function testing fixture of the present invention.
Fig. 2 is a schematic perspective view illustrating a structure of the lower drive mechanism in which the upper carriage is separated from the lower drive device.
Fig. 3 is a front view of the automatic recording and function testing fixture of fig. 1 with the hidden conveyor set, the hidden carry-down device and the hidden carrier.
Fig. 4 is a schematic partial three-dimensional structure diagram of the automatic recording and function testing fixture in fig. 1 after the carrier is hidden, and the upper bearing frame and the lower bearing frame are close to each other to position the PCB assembly.
Fig. 5 is a schematic perspective view of the lift-up carry mechanism of the present invention.
Fig. 6 is a perspective view of the upper bearing frame of the present invention.
Detailed Description
In order to explain technical contents and structural features of the present invention in detail, the following description is made with reference to the embodiments and the accompanying drawings.
As shown in fig. 1 to 6, the automatic programming and functional testing jig 100 of the present invention is used for programming and testing the PCB assembly 90 on the carrier 80, and the automatic programming and functional testing jig 100 includes a conveyor belt group 10, a lift-up carry mechanism 20, and a lower drive carry mechanism 30. Conveyer group 10 is located the top of jacking carry mechanism 20, drives down carry mechanism 30 and locates the top of conveyer group 10, and conveyer group 10 is used for carrying carrier 80, and jacking carry mechanism 20 is used for upwards jacking carrier 80 on conveyer group 10, drives down and is equipped with a plurality of micropins 33 and bolster 34 on the output of carry mechanism 30, is equipped with a plurality of micropin modules 223 on the output of jacking carry mechanism 20. During processing, the lifting-up carry mechanism 20 lifts up the carrier 80 to separate from the conveyor belt group 10, the lower driving carry mechanism 30 drives the upper microneedles 33 downwards to press the PCB assembly 90, the lifting-up carry mechanism 20 lifts up the carrier 80 upwards again to align and draw together the microneedles 223 and the connector of the PCB assembly 90, and the lower driving carry mechanism 30 drives the buffer 34 downwards to push the connector to be electrically connected with the microneedles 223. Thus, the downward driving carry mechanism 30, the conveyor belt group 10 and the jacking carry mechanism 20 are arranged from top to bottom, so the automatic burning and functional testing jig 100 of the invention has a more compact structure. Furthermore, the PCB assembly 90 is positioned in four-segment process, that is, after the elevating carry mechanism 20 drives the upward movement carry of the PCB assembly 90, the lower drive carry mechanism 30 drives the upper microneedle 33 downward to press the PCB assembly 90, so as to realize the preliminary positioning of the PCB assembly 90, and then the elevating carry mechanism 20 drives the PCB assembly 90 upward to carry, so that the microneedle module 223 is aligned with the connector and close to the connector, so as to realize the complete positioning of the PCB assembly 90, and then the lower drive carry mechanism 30 drives the buffer 34 downward to push the connector to move downward, so as to realize the electrical connection between the connector and the microneedle module 223. From this, can carry out accurate location with PCB subassembly 90, guarantee that micropin 33, micropin module 223 and PCB subassembly 90 can good electrical contact, be convenient for follow-up burn record and test PCB subassembly 90. Moreover, because the PCB assembly 90 is positioned in a four-section process, the impact on the PCB assembly 90 can be effectively reduced when the PCB assembly 90 is positioned, and the damage to the PCB assembly 90 caused at regular time is avoided. Preferably, in the present embodiment, the PCB assembly 90 includes a PCB board 91 and an FPC board 92 electrically connected to each other, and the connector is disposed on the FPC board 92. When positioning, the upper micro-needle 33 presses against the PCB board 91 to achieve the initial positioning, but is not limited thereto. By pushing the FPC board 92 downwards by the buffer member 34, the buffer member 34 can more smoothly push the FPC board 92 to move, thereby avoiding damaging the FPC board 92. More specifically, the upper micro-needle 33 is pressed on the nickel sheet on the PCB 91, so that the upper micro-needle 33 is in electrical contact with the PCB 91 when the upper micro-needle 33 positions the PCB 91, but is not limited thereto.
As shown in fig. 1 to 6, the automatic burning and function testing fixture 100 of the present invention further includes a mounting frame 40, the conveyor belt group 10 and the lift carry mechanism 20 are mounted on the mounting frame 40, the lift carry mechanism 20 includes a first-stage lift device 21 and a second-stage lift device 22, the first-stage lift device 21 is mounted on the mounting frame 40, the second-stage lift device 22 is mounted at an output end of the first-stage lift device 21, the first-stage lift device 21 drives the second-stage lift device 22 to move up and down, the microneedle module 223 is mounted at an output end of the second-stage lift device 22, and the second-stage lift device 22 drives the. In this way, the conveyor belt group 10 and the jacking and carrying mechanism 20 are mounted on the mounting frame 40, so that the automatic burning and function testing jig 100 of the invention has a more compact structure and is easy to mount and arrange. The jacking carry mechanism 20 is simple in structure and easy to arrange and implement. The first-stage jacking device 21 drives the second-stage jacking device 22 to move upwards, so that the second-stage jacking device 22 supports the carrier 80 and drives the carrier 80 to separate from the conveyor belt assembly 10. The secondary jacking device 22 jacks up the carrier 80, so that the microneedle module 223 is close to the connector on the FPC board 92.
As shown in fig. 1 to 6, the first-stage jacking device 21 includes a first jacking cylinder 211, a jacking mounting plate 212 and a plurality of guiding sliding pieces 213, the first jacking cylinder 211 is installed on the mounting frame 40, the jacking mounting plate 212 is installed at the output end of the first jacking cylinder 211, the first jacking cylinder 211 drives the jacking mounting plate 212 to move up and down, the guiding sliding pieces 213 are installed on the mounting frame 40, the jacking mounting plate 212 is installed at the output end of the guiding sliding pieces 213, and the second-stage jacking device 22 is installed on the jacking mounting plate 212. The primary jacking device 21 is simple in structure and easy to install and arrange. And the secondary lifting device 22 can be smoothly moved up and down by the guide slide 213. For example, the guide sliding member 213 is a sliding bearing, but not limited thereto. Specifically, the second-stage jacking device 22 includes a second jacking cylinder 221, a lower carriage 222 and microneedle modules 223, an output end of the second jacking cylinder 221 is mounted on the jacking mounting plate 212, the lower carriage 222 is mounted on an output end of the second jacking cylinder 221, and the microneedle modules 223 are mounted on the top of the lower carriage 222 in a matrix arrangement. The secondary jacking device 22 is simple in structure and easy to install and arrange. In order to burn and test the PCB assembly 90 more flexibly, the second-stage jacking device 22 further includes a plurality of lower microneedles 224, the lower microneedles 224 are mounted on the top of the lower carrier 222 in a matrix arrangement, and each row of microneedle modules 223 is disposed beside each row of the lower microneedles 224. When the PCB assembly 90 is burned and tested, the upper micro-needle 33 and the lower micro-needle 224 can be selected to be electrically connected with the PCB assembly 90 at the same time, so as to realize multi-point electrical access to the PCB assembly 90, but not limited thereto.
As shown in fig. 1 to 6, the lower driving mechanism 30 includes a lower driving device 31, an upper carrier 32, upper microneedles 33 and buffers 34, the upper carrier 32 is detachably mounted at an output end of the lower driving device 31, the upper microneedles 33 are mounted at a bottom of the upper carrier 32 in a matrix arrangement, the buffers 34 are mounted at a bottom of the upper carrier 32 in a matrix arrangement, and each row of the buffers 34 is disposed beside each upper microneedle 33. The upper bearing frame 32 is detachably mounted on the output end of the lower driving device 31, so as to facilitate replacement, overhaul or maintenance of the upper bearing frame 32 and the parts on the upper bearing frame 32. Specifically, the lower driving device 31 includes an upper driver 311, a lower driving assembly 312 and a mounting seat 313, wherein an input end of the lower driving assembly 312 is mounted at an output end of the upper driver 311, the mounting seat 313 is mounted at an output end of the lower driving assembly 312, and the upper bearing frame 32 is detachably mounted on the mounting seat 313. The lower driving carry device 31 is simple in structure and easy to install and arrange. For example, the lower driving device 31 is a stepping motor, and the up-down transmission assembly 312 is a screw-nut pair, so as to smoothly and rapidly drive the mounting seat 313 to move up and down. More specifically, the mounting base 313 is provided with mounting slot structures 3131 facing the spaced arrangement, the upper carrier 32 is mounted on the mounting slot structures 3131, the mounting base 313 is provided with a plurality of locking members 3132, and the upper carrier 32 is detachably mounted on the mounting base 313 through the locking members 3132. Thus, the mounting and dismounting of the upper bearing frame 32 and the mounting seat 313 are easier and more convenient by the mounting slot structure 3131, and the upper bearing frame 32 can be firmly and reliably locked on the mounting seat 313 by the locking element 3132. For example, the locking element 3132 is a screw element, such as a screw rod, disposed on the mounting seat 313, but is not limited thereto.
As shown in fig. 1 to 6, a jacking positioning element 321 is installed at a bottom side of the upper bearing frame 32, a jacking fixing seat 2221 is installed at a top side of the lower bearing frame 222, a positioning hole 2222 for inserting and positioning the jacking positioning element 321 is formed in the jacking fixing seat 2221, and the positioning hole 2222 is arranged opposite to the jacking positioning element 321. In the process that the upper bearing frame 32 and the lower bearing frame 222 are close to each other, the jacking positioning piece 321 is inserted into the positioning hole 2222, so that the upper bearing frame 32 and the lower bearing frame 222 accurately get close to each other to position the carrier 80, and it is ensured that the upper microneedle 33 and the lower microneedle 224 can be accurately pressed on the nickel sheet of the PCB 91, and the microneedle module 223 and the connector can be aligned to each other and get close to each other. In order to make the upper and lower housings 32, 222 better interface with the carrier 80, the upper latch 322 is installed at the bottom peripheral side of the upper housing 32, and the lower latch 2223 and the positioning pin 2224 are installed at the top peripheral side of the lower housing 222, but not limited thereto. The upper latch 322 is inserted into a predetermined positioning groove of the carrier 80, so that the upper carrier 32 is accurately abutted with the carrier 80, and the lower latch 2223 and the positioning pin 2224 are inserted into a predetermined positioning groove of the carrier 80, so that the lower carrier 222 is accurately abutted with the carrier 80.
As shown in fig. 1 to 6, the automatic recording and function testing fixture 100 of the present invention further includes a jacking-blocking assembly 50 mounted on the mounting frame 40, the jacking-blocking assembly 50 is disposed at an output end side of the conveyor belt group 10, the jacking-blocking assembly 50 includes a mounting frame 51, a blocking cylinder 52 and a blocking member 53, the mounting frame 51 is mounted on the mounting frame 40, the blocking cylinder 52 is mounted on the mounting frame 51, the blocking member 53 is mounted at an output end of the blocking cylinder 52, and the blocking cylinder 52 drives the blocking member 53 to cross the conveyor belt group 10 or retreat below the conveyor belt group 10. Thus, when the carrier 80 of the belt set 10 reaches the position right above the lift-up carry mechanism 20, the blocking cylinder 52 drives the blocking piece 53 to move upward and cross the belt set 10, so as to block the carrier 80 to continue to be conveyed backward, and enable the lift-up carry mechanism 20 to accurately lift up the carrier 80 to leave the belt set 10. Preferably, the jacking blocking assembly 50 is further electrically connected with the sensor, the sensor senses whether the carrier 80 flows over the jacking carry mechanism 20, and when the carrier 80 flows over the lifting carry mechanism 20, the jacking blocking assembly 50 is controlled to act, so that the carrier 80 is blocked to be conveyed backwards, and the automation degree of production is further improved.
The working principle of the automatic recording and function testing fixture 100 of the present invention is described with reference to fig. 1 to 6: multiple PCB assemblies 90 are placed onto carrier 80 in advance before burn-in and testing. The carriers 80 are then placed on the belt set 10 for transport. When the conveyor belt assembly 10 conveys the carrier 80 to the position right above the jacking carry mechanism 20, the blocking cylinder 52 drives the blocking piece 53 to move upwards to cross the conveyor belt assembly 10, and the blocking piece 53 blocks the carrier 80 to continue to convey backwards. The first jacking cylinder 211 then drives the jacking mounting plate 212 upward, causing the lower carrier 222 to jack the carrier 80 off the belt set 10. Then, the lower carry driver 31 drives the upper carrier 32 to move downward, the jacking positioning element 321 is inserted into the positioning hole 2222 of the jacking fixing seat 2221, so as to realize the accurate butt joint of the upper carrier 32 and the lower carrier 222, the upper fixture block 322 is clamped into a preset positioning groove of the carrier 80, and the lower fixture block 2223 and the positioning pin 2224 are clamped into a preset positioning groove of the carrier 80, so as to accurately position the carrier 80. Then, the second jacking cylinder 221 drives the lower carrier 222 to move upward, so that the microneedle module 223 is aligned with the connector on the FPC board 92. Finally, the lower driving device 31 drives the upper bearing frame 32 to move downward by 1-2mm, and the buffer 34 pushes the connector on the FPC board 92 to be buckled on the micro-needle module 223, so that the connector is electrically connected with the micro-needle module 223. Thus, the PCB assembly 90 can be burned or tested. The working principle is as described above.
Compared with the prior art, the automatic burning and function testing jig 100 has a more compact structure because the lower driving carry mechanism 30, the conveyor belt group 10 and the jacking carry mechanism 20 are arranged from top to bottom. Furthermore, the PCB assembly 90 is positioned in four-segment process, that is, after the elevating carry mechanism 20 drives the upward movement carry of the PCB assembly 90, the lower drive carry mechanism 30 drives the upper microneedle 33 downward to press the PCB assembly 90, so as to realize the preliminary positioning of the PCB assembly 90, and then the elevating carry mechanism 20 drives the PCB assembly 90 upward to carry, so that the microneedle module 223 is aligned with the connector and close to the connector, so as to realize the complete positioning of the PCB assembly 90, and then the lower drive carry mechanism 30 drives the buffer 34 downward to push the connector to move downward, so as to realize the electrical connection between the connector and the microneedle module 223. From this, can carry out accurate location with PCB subassembly 90, guarantee that micropin 33, micropin module 223 and PCB subassembly 90 can good electrical contact, be convenient for follow-up burn record and test PCB subassembly 90. Moreover, because the PCB assembly 90 is positioned in a four-section process, the impact on the PCB assembly 90 can be effectively reduced when the PCB assembly 90 is positioned, and the damage to the PCB assembly 90 caused at regular time is avoided.
The above disclosure is only a preferred embodiment of the present invention, and should not be taken as limiting the scope of the invention, so that the appended claims are intended to cover all such modifications and changes as fall within the true spirit of the invention.
Claims (10)
1. The utility model provides an automatic burn and reach functional test tool for burn and record test to the PCB subassembly on the carrier, its characterized in that: the automatic carrying device comprises a conveyor belt group, a jacking carry mechanism and a lower driving carry mechanism, wherein the conveyor belt group is arranged above the jacking carry mechanism, the lower driving carry mechanism is arranged above the conveyor belt group, the conveyor belt group is used for conveying carriers, the jacking carry mechanism is used for jacking the carriers on the conveyor belt group upwards, a plurality of upper microneedles and buffer members are arranged at the output end of the lower driving carry mechanism, and a plurality of microneedle modules are arranged at the output end of the jacking carry mechanism; when the micro needle module is processed, the jacking carry mechanism lifts the carrier upwards to be separated from the conveyor belt group, the lower driving carry mechanism drives the upper micro needle downwards to press the PCB assembly, the jacking carry mechanism lifts the carrier upwards again to enable the micro needle module to be aligned with and close to the connector of the PCB assembly, and the lower driving carry mechanism drives the buffer part downwards to push the connector to be electrically connected with the micro needle module.
2. The automatic burning and functional testing jig of claim 1, further comprising a mounting frame, wherein the conveyor belt group and the jacking carry mechanism are installed on the mounting frame, the jacking carry mechanism comprises a first-stage jacking device and a second-stage jacking device, the first-stage jacking device is installed on the mounting frame, the second-stage jacking device is installed at the output end of the first-stage jacking device, the first-stage jacking device drives the second-stage jacking device to move up and down, the microneedle module is installed at the output end of the second-stage jacking device, and the second-stage jacking device drives the microneedle module to move up and down.
3. The automatic burning and functional testing jig of claim 2, wherein the first-stage jacking device comprises a first jacking cylinder, a jacking mounting plate and a plurality of guiding sliding pieces, the first jacking cylinder is mounted on the mounting frame, the jacking mounting plate is mounted at an output end of the first jacking cylinder, the first jacking cylinder drives the jacking mounting plate to move up and down, the guiding sliding pieces are mounted on the mounting frame, the jacking mounting plate is mounted at an output end of the guiding sliding pieces, and the second-stage jacking device is mounted on the jacking mounting plate.
4. The automatic burning and functional testing jig according to claim 3, wherein the secondary jacking device includes a second jacking cylinder, a lower bearing frame and the micro needle modules, an output end of the second jacking cylinder is mounted on the jacking mounting plate, the lower bearing frame is mounted on an output end of the second jacking cylinder, and the micro needle modules are mounted on a top of the lower bearing frame in a matrix arrangement.
5. The automatic burning and functional testing jig according to claim 4, wherein the secondary jacking device further comprises a plurality of lower microneedles, the lower microneedles are mounted on the top of the lower bearing frame in a matrix arrangement, and each row of microneedle modules is arranged beside each row of the lower microneedles.
6. The automatic burning and functional testing jig according to claim 4, wherein the lower driving mechanism comprises a lower driving device, an upper bearing frame, the upper microneedles and the buffering members, the upper bearing frame is detachably mounted at the output end of the lower driving device, the upper microneedles are mounted at the bottom of the upper bearing frame in a matrix arrangement, the buffering members are mounted at the bottom of the upper bearing frame in a matrix arrangement, and each row of the buffering members is arranged beside each upper microneedle.
7. The automatic programming and function testing fixture of claim 6, wherein the lower driving device comprises an upper driver, a lower driver, an upper driving assembly and a lower driving assembly, the input end of the upper driving assembly is mounted to the output end of the upper driver, the mounting base is mounted to the output end of the upper driving assembly, and the upper bearing frame is detachably mounted to the mounting base.
8. The automatic programming and function testing fixture of claim 7, wherein the mounting base has a slot structure facing the mounting base, the upper carrier is mounted in the slot structure, the mounting base has a plurality of locking members, and the upper carrier is detachably mounted on the mounting base via the locking members.
9. The automatic burning and functional testing fixture as claimed in claim 6, wherein a jacking positioning member is installed at a bottom side of the upper bearing frame, a jacking fixing seat is installed at a top side of the lower bearing frame, the jacking fixing seat is provided with a positioning hole for inserting and positioning the jacking positioning member, and the positioning hole is opposite to the jacking positioning member.
10. The automatic burning and functional testing jig of claim 2, further comprising a jacking blocking assembly installed on the mounting frame, wherein the jacking blocking assembly is disposed at an output end side of the conveyor belt group, the jacking blocking assembly comprises an assembling frame, a blocking cylinder and a blocking piece, the assembling frame is installed on the mounting frame, the blocking cylinder is installed on the assembling frame, the blocking piece is installed at an output end of the blocking cylinder, and the blocking cylinder drives the blocking piece to cross the conveyor belt group or move back to a position below the conveyor belt group.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011054102.3A CN112345914B (en) | 2020-09-29 | 2020-09-29 | Automatic burning and function testing jig |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011054102.3A CN112345914B (en) | 2020-09-29 | 2020-09-29 | Automatic burning and function testing jig |
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| Publication Number | Publication Date |
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| CN112345914A true CN112345914A (en) | 2021-02-09 |
| CN112345914B CN112345914B (en) | 2024-02-06 |
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| CN202011054102.3A Active CN112345914B (en) | 2020-09-29 | 2020-09-29 | Automatic burning and function testing jig |
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Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
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| KR19980028356A (en) * | 1996-10-22 | 1998-07-15 | 김영환 | Semiconductor device comprising burn-in test circuit and test method thereof |
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