CN112341980A - Acid-resistant alkali-resistant ultraviolet-curing peelable glue suitable for secondary anode process after deplating and preparation method thereof - Google Patents

Acid-resistant alkali-resistant ultraviolet-curing peelable glue suitable for secondary anode process after deplating and preparation method thereof Download PDF

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CN112341980A
CN112341980A CN202011067165.2A CN202011067165A CN112341980A CN 112341980 A CN112341980 A CN 112341980A CN 202011067165 A CN202011067165 A CN 202011067165A CN 112341980 A CN112341980 A CN 112341980A
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acid
resistant
alkali
acrylate
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李帅
刘涛
曹阳
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Xiamen Weiertong Technology Co ltd
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Xiamen Weiertong Technology Co ltd
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    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J175/00Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
    • C09J175/04Polyurethanes
    • C09J175/14Polyurethanes having carbon-to-carbon unsaturated bonds
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02Non-macromolecular additives
    • C09J11/04Non-macromolecular additives inorganic
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02Non-macromolecular additives
    • C09J11/06Non-macromolecular additives organic
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/08Macromolecular additives
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D11/00Electrolytic coating by surface reaction, i.e. forming conversion layers
    • C25D11/02Anodisation
    • C25D11/022Anodisation on selected surface areas
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D11/00Electrolytic coating by surface reaction, i.e. forming conversion layers
    • C25D11/02Anodisation
    • C25D11/04Anodisation of aluminium or alloys based thereon
    • C25D11/16Pretreatment, e.g. desmutting
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00Polymer mixtures characterised by other features
    • C08L2205/03Polymer mixtures characterised by other features containing three or more polymers in a blend
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00Polymer mixtures characterised by other features
    • C08L2205/14Polymer mixtures characterised by other features containing polymeric additives characterised by shape
    • C08L2205/16Fibres; Fibrils

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Inorganic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

The invention discloses an acid-resistant alkali-resistant ultraviolet-curable peelable glue suitable for a secondary anode process after deplating and a preparation method thereof, wherein the peelable glue comprises the following raw materials in parts by weight: 30-70 parts of urethane acrylate, 20-60 parts of reactive monomer diluent, 1-8 parts of photoinitiator, 0.5-3 parts of coupling agent, 2-10 parts of thixotropic agent, 2-4 parts of toughening agent, 1-3 parts of metal high-temperature adhesive, 4-6 parts of ceramic powder, 2-3 parts of glass powder and 3-5 parts of polyamide fiber. The ultraviolet curing peelable glue prepared by the invention is used for temporary protection in the secondary anode process, the bonding strength of the ultraviolet curing peelable glue with good acid and alkali resistance is not obviously reduced in strong acid and strong alkali environments, and the yield of the deplating process can be improved by the ultraviolet curing peelable glue, so that the yield of the whole process is improved, and the cost of the secondary anode process is reduced.

Description

Acid-resistant alkali-resistant ultraviolet-curing peelable glue suitable for secondary anode process after deplating and preparation method thereof
Technical Field
The invention relates to the technical field of ultraviolet curing glue, in particular to an acid-resistant alkali-resistant ultraviolet curing peelable glue suitable for a secondary anode process after deplating and a preparation method thereof.
Background
The ultraviolet curing technology is a high-efficiency, energy-saving and environment-friendly high-new technology, and has the characteristics of high curing speed, room-temperature curing, high production efficiency, energy conservation, suitability for flow line production, small equipment volume, small occupied area, low investment and the like. In addition, the emission of VOC (volatile organic compounds) of the ultraviolet curing technology is low or none, and the environment-friendly requirement is met. The technology is mainly applied to the technical fields of coatings, printing ink, adhesives and the like.
In the current internet era, mobile devices such as notebook computers, tablet computers and mobile phones are developing more and more rapidly. The widely used metallic aluminum materials for the housing and keyboard skeleton of notebook computers, tablet computers and mobile phone housings must be anodized on the aluminum surface. The principle of anodization is that an aluminum or aluminum alloy product is used as an anode, and is placed in an electrolyte solution for electrification treatment, and an aluminum oxide film is formed on the surface of the aluminum or aluminum alloy product by utilizing the electrolysis action, which is called anodic oxidation treatment of aluminum and aluminum alloy. After anodic oxidation treatment, the surface of the aluminum can generate an oxide film of several microns to hundreds of microns, and compared with a natural oxide film of aluminum alloy, the corrosion resistance, the wear resistance and the decoration performance of the aluminum alloy are obviously improved and enhanced.
In the anodizing treatment process, the screw hole and the tapping structure of the aluminum piece need to be protected temporarily to prevent the anolyte from corroding the structures to cause dimensional deviation, and meanwhile, the temporary protection is also needed for special positions of the aluminum surface which do not need to be anodized. Generally, the appearance of the aluminum part after the primary anode is poor, such as shadow, glossiness difference, color difference and the like, and the defective products need to be processed by a secondary anode.
At present, the temporary protection method for a specific area in the anodizing process in the market comprises rubber plug filling and film pasting, and the method has the advantages of high labor cost, low efficiency and difficulty in improving the yield. The ultraviolet curing adhesive with proper adhesive force is used for the temporary protection means of anodization, the efficiency and yield of the whole process can be improved, and meanwhile, the cost can be reduced. The ultraviolet curing adhesive capable of being subjected to secondary anodic treatment has higher requirements on acid resistance and alkali resistance.
Disclosure of Invention
The invention aims to solve the defects in the prior art, and provides an acid-resistant alkali-resistant ultraviolet-curable peelable glue suitable for a secondary anode process after deplating and a preparation method thereof.
In order to achieve the purpose, the invention adopts the following technical scheme:
the acid-resistant alkali-resistant ultraviolet-curable peelable glue is suitable for temporarily protecting a local reserved area in a secondary anodizing process after deplating and preventing anolyte from corroding the local reserved area, and comprises the following raw materials in parts by weight: 30-70 parts of urethane acrylate, 20-60 parts of reactive monomer diluent, 1-8 parts of photoinitiator, 0.5-3 parts of coupling agent, 2-10 parts of thixotropic agent, 2-4 parts of toughening agent, 1-3 parts of metal high-temperature adhesive, 4-6 parts of ceramic powder, 2-3 parts of glass powder and 3-5 parts of polyamide fiber;
wherein, the length of the polyamide fiber is 1-1.5 mm, and the polyamide fiber is arranged in a partially staggered and overlapped type orientation way along the extension direction of the glue layer plane of the acid-resistant, alkali-resistant and ultraviolet-curable peelable glue, so that the cohesive strength of the glue layer is 2-10 times of that of the glue layer without the polyamide fiber; meanwhile, the cohesive strength of the glue layer of the acid-resistant alkali-resistant ultraviolet curing peelable glue is 0.5-2 times of the bonding strength between the glue layer and the surface layer of the bonded object.
Preferably, the cohesive strength of the glue layer of the acid and alkali resistant ultraviolet curing peelable glue is 2-10 times of that of the glue layer without the polyamide fiber.
Preferably, the acid and alkali resistance means that the strong acid has a pH =1.5-2.5, and the strong base has a pH = 12-13;
under the strong acid and strong alkali environment, the bonding strength between the adhesive layer and the surface layer of the bonded object is reduced by less than 10%.
Preferably, the urethane acrylate is a difunctional aliphatic urethane acrylate, and the viscosity range of the urethane acrylate is required to be 40000-100000cps at 25 degrees celsius, and the preferred viscosity is 55000-85000cps at 25 degrees celsius.
Preferably, the reactive monomer diluent is a monofunctional acrylate monomer, and is selected from one or a mixture of more than two of tetrahydrofuran methacrylate, iso-glacial methacrylate, butyl acrylate, iso-octyl acrylate, hydroxyethyl methacrylate, hydroxypropyl methacrylate, dicyclopentadienyl acrylate, alkoxylated nonylphenol acrylate, ethoxylated bisphenol A dimethacrylate, lauryl acrylate, lauryl methacrylate, 2-phenoxyethyl acrylate, iso-decyl acrylate, dimethylacrylamide and acryloyl morpholine.
Preferably, the photoinitiator is one or a mixture of any several of Irgacure 1173, Irgacure 184, Irgacure 651, Irgacure 819, Irgacure 907 and TPO.
Preferably, the coupling agent is selected from one or a mixture of two or more of the following: gamma-aminopropyltriethoxysilane, gamma- (2, 3-epoxypropoxy) propyltrimethylsilane, gamma- (methacryloyloxy) propyltrimethoxysilane, gamma-mercaptopropyltriethoxysilane, and gamma-mercaptopropyltrimethoxysilane.
Preferably, the thixotropic agent is fumed silica. Fumed silica comprising one or more of H8, H20, H30 from Waker, TS-530 from Cabot, TS720, R972, R974, R976, R202, R8200 from Degussa.
Preferably, the toughening agent may be one of Ethylene Propylene Rubber (EPR), polybutadiene rubber (BB) and butyl rubber.
Preferably, the ceramic powder has a particle mesh size of 800-1000.
Preferably, the glass powder is transparent glass powder, and the mesh number of the powder is 800-.
The invention also provides a preparation method of the acid-resistant alkali-resistant ultraviolet curing peelable glue suitable for the secondary anode process after deplating, which comprises the following steps:
s1: weighing the polyurethane acrylate oligomer, the acrylate reactive diluent, the photoinitiator, the coupling agent, the toughening agent, the metal high-temperature adhesive, the ceramic powder and the glass powder in the weight percentage range, sequentially adding the materials into a double-planet hybrid reaction kettle, and fully mixing and stirring the materials for 1 to 2 hours;
s2: after uniformly stirring, adding polyamide fibers into a double-planet hybrid reaction kettle in a mode of blowing by an air blower for at least more than two times and vertically falling, stirring for 15-20 minutes clockwise during the first addition, then stirring for a second time at intervals of at least 2 minutes, stirring for 5-10 minutes anticlockwise during the second addition, and if the addition times are more than two times, sequentially and circularly adding the polyamide fibers according to the sequence until the polyamide fibers are subjected to partially staggered overlapping type directional arrangement along the extension direction of the glue layer plane of the acid-resistant alkali-resistant ultraviolet curing peelable glue;
s3: weighing the thixotropic agent within the weight ratio range, adding the thixotropic agent into the reaction kettle, stirring the thixotropic agent at a low speed (less than 100 plus 140 rpm) clockwise for 0.5h, strictly avoiding white light in the stirring process, performing wall scraping treatment, continuously stirring the thixotropic agent at the low speed clockwise for 0.5h, vacuumizing and defoaming, discharging the thixotropic agent, and sealing and packaging the thixotropic agent.
The ultraviolet curing peelable glue prepared by the invention is used for temporary protection of a secondary anode process, the bonding strength between a glue layer and a surface layer of an adhered object is not obviously reduced (lower than 10%) under the environment of strong acid (PH = 1.5-2.5) and strong base (PH = 12-13), meanwhile, the cohesion strength of the glue layer of the acid and alkali resistant ultraviolet curing peelable glue is 2-10 times of the cohesion strength of the glue layer without the polyamide fiber by adding polyamide fiber with the length of 1-1.5 mm and carrying out partially staggered overlapping type directional arrangement treatment along the plane extension direction of the glue layer of the acid and alkali resistant ultraviolet curing peelable glue, and the cohesion strength of the glue layer of the acid and alkali resistant ultraviolet curing peelable glue is 0.5-2 times of the bonding strength between the glue layer and the surface layer of the adhered object, the elasticity and toughness of the glue layer along a specific direction are strengthened through the polyamide fibers, so that the elasticity and toughness of the photocuring peelable glue are greatly improved, after the temporary protection effect is achieved, the glue layer can be better stripped at one time without residues, the phenomenon that part of glue residues are difficult to clean due to glue layer fracture is avoided, the stripping efficiency reduction condition caused by glue layer breakage, fracture and the like in the stripping process is greatly reduced, the yield of the deplating process is improved, the yield of the whole process is improved, and the cost of the secondary anode process is reduced.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is further described in detail with reference to the following embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
The ultraviolet curing adhesive prepared by the invention is used for temporary protection in the secondary anode process, and the quality of the ultraviolet curing adhesive in acid and alkali resistance can directly influence the yield of a temporary protection adhesive layer in the deplating process, thereby influencing the secondary anode process. Therefore, the strong acid and strong base environment which can be adapted to the cured ultraviolet curing adhesive prepared by the method is specifically strong acid PH =1.5-2.5, strong base PH =12-13, and the ultraviolet curing peelable adhesive with good acid and alkali resistance can improve the yield of the deplating process, so that the yield of the whole process is improved.
The acid and alkali resistance of the ultraviolet curing adhesive is evaluated through the ultraviolet curing adhesive after curing in the application, the reduction degree of the bonding strength between the adhesive layer of the ultraviolet curing adhesive and the surface layer (such as the surface of aluminum or aluminum alloy) of an adhered object in the simulated deplating process (in a strong acid environment and a strong alkaline environment) and the permeation condition of the adhesive layer in the strong acid environment and the strong alkaline environment. The specific implementation mode is as follows:
simulating a deplating process, namely soaking a 12.7mm by 25.4mm transparent PC substrate on which the ultraviolet curing adhesive is cured in an 80 ℃ NaOH solution (PH = 12-13) for 20min, then placing the cut sample into a 90 ℃ oven for heat treatment for 10min, airing to normal temperature, then placing the cut sample into a cutting fluid for soaking for 1h, and placing the cut sample into 80 ℃ HNO3Soaking in solution (pH = 1.5-2.5) for 20min, placing in oven at 90 deg.C for heat treatment for 5min, air-drying to room temperature, testing its bonding strength (also called shear strength), comparing with bonding strength of untreated sample wafer (also called shear strength), calculating attenuation ratio, and calculating theoretical attenuation ratioThe lower the attenuation ratio, the better the acid and alkali resistance.
Dispensing a block of 10mm by 50mm by 1mm on the anodized aluminum sheet by a dispenser, and irradiating with UV lamp (light intensity of 200 mW/cm)2Irradiating for 15 s) to solidify into a glue film. Soaking in 80 deg.C NaOH solution (pH = 12-13) for 20min, heat treating in 90 deg.C oven for 10min, air drying to room temperature, soaking in cutting fluid for 1h, and adding 80 deg.C HNO3Soaking in the solution (PH = 1.5-2.5) for 20min, placing in a 90 ℃ oven for heat treatment for 5min, airing to room temperature, applying red ink on the edge of the rubber block, observing the permeation condition of the rubber layer, wherein theoretically, the less permeation condition, the better the acid and alkali resistance.
Specifically, the use method of the acid-resistant alkali-resistant ultraviolet-curable peelable glue in the secondary anode process is as follows:
1) coating the prepared strippable acid-resistant alkali-resistant ultraviolet curing adhesive solution on the position of an aluminum sample piece to be protected;
2) irradiating with UV lamp at a light intensity of 200mW/cm2 for 10s to obtain adhesive film;
3) the aluminum piece is subjected to deplating process treatment, and the specific process flow is as follows: soaking aluminum piece in 80 deg.C NaOH solution (PH = 12-13) for 20min, heat treating at 90 deg.C for 10min, air drying to room temperature, soaking cutting fluid for 1h, and placing in 80 deg.C HNO3The solution (pH = 1.5-2.5) is soaked for 20min and then heat treated at 90 deg.C for 5 min.
4) And (3) polishing, cleaning, sandblasting and other processes of the deplating aluminum piece, then carrying out secondary anodic treatment, and finally tearing off the cured adhesive layer in a one-time residue-free manner.
Example 1
The acid-resistant alkali-resistant ultraviolet-curing strippable collagen material comprises 50 parts of urethane acrylate, 25 parts of tetrahydrofuran acrylate, 10 parts of isobornyl methacrylate, 5 parts of hydroxyethyl methacrylate, 11734 parts of Irgacure, 1 part of gamma-aminopropyltriethoxysilane, R2027 parts of Ethylene Propylene Rubber (EPR)2 parts, 3 parts of metal high-temperature adhesive, 4 parts of ceramic powder, 2 parts of glass powder and 3 parts of polyamide fiber.
Preparing an ultraviolet curing adhesive: (1) sequentially adding 50 parts of urethane acrylate, 25 parts of tetrahydrofuran acrylate, 10 parts of isobornyl methacrylate, 5 parts of hydroxyethyl methacrylate, 4 parts of Irgacure 1173, 1 part of gamma-aminopropyltriethoxysilane, 2 parts of Ethylene Propylene Rubber (EPR), 3 parts of metal high-temperature adhesive, 4 parts of ceramic powder and 2 parts of glass powder into a double-planet mixed power reaction kettle, and stirring and mixing for 1.5 hours;
(2) adding polyamide fibers into a double-planet hybrid reaction kettle in a mode of blowing by an air blower for 2 times and vertically falling, wherein the first time of adding is clockwise stirring for 20 minutes, then the second time of adding is carried out at intervals of at least 2 minutes, and the second time of adding is anticlockwise stirring for 10 minutes, so that the polyamide fibers are subjected to partially staggered and overlapped directional arrangement along the extension direction of the glue layer plane of the acid-resistant alkali-resistant ultraviolet curing peelable glue;
(3) adding 7 parts of R202, stirring and mixing at a low speed clockwise for 0.5h, performing wall scraping treatment, continuing stirring for 0.5h, vacuumizing and defoaming, and discharging. The test results are shown in Table 1.
Example 2
The acid-resistant alkali-resistant ultraviolet-curing strippable collagen material comprises 45 parts of urethane acrylate, 23 parts of tetrahydrofuran methacrylate, 10 parts of isobornyl acrylate, 8 parts of hydroxypropyl methacrylate, Irgacure 11733 parts, 2 parts of TPO, 0.5 part of gamma-mercaptopropyl trimethoxy silane, 208.5 parts of H, 3 parts of Ethylene Propylene Rubber (EPR), 2 parts of metal high-temperature adhesive, 5 parts of ceramic powder, 2 parts of glass powder and 4 parts of polyamide fiber.
Preparing an ultraviolet curing adhesive: (1) adding 45 parts of urethane acrylate, 23 parts of tetrahydrofuran methacrylate, 10 parts of isobornyl acrylate, 8 parts of hydroxypropyl methacrylate, 3 parts of Irgacure 1173, 2 parts of TPO, 0.5 part of gamma-mercaptopropyltrimethoxysilane, 3 parts of Ethylene Propylene Rubber (EPR), 2 parts of metal high-temperature adhesive, 5 parts of ceramic powder and 2 parts of glass powder into a double-planet mixed power reaction kettle in sequence, and stirring and mixing for 1.5 hours;
(2) adding polyamide fibers into a double-planet hybrid reaction kettle in a mode of blowing by an air blower for 4 times and vertically falling, wherein clockwise stirring is carried out for 15 minutes in the first time, then at least 2 minutes are carried out, the second time of adding is carried out, anticlockwise stirring is carried out for 5 minutes in the second time of adding, then clockwise stirring is carried out for 15 minutes in the third time of adding, then at least 2 minutes are carried out, the fourth time of adding is carried out, anticlockwise stirring is carried out for 5 minutes in the fourth time of adding, and the polyamide fibers are subjected to partially staggered overlapped type directional arrangement along the glue layer plane extension direction of the acid-resistant alkali-resistant ultraviolet curing peelable glue;
(3) adding 8.5 parts of H20, stirring and mixing clockwise at a low speed for 0.5H, performing wall scraping treatment, continuing stirring for 0.5H, vacuumizing and defoaming, and discharging. The test results are shown in Table 1.
Example 3
The acid-resistant alkali-resistant ultraviolet-curing strippable collagen material comprises 42 parts of urethane acrylate, 32 parts of tetrahydrofuran acrylate, 6 parts of dimethylacrylamide, 8 parts of ethoxylated bisphenol A dimethacrylate, 1843 parts of Irgacure, 1 part of gamma-aminopropyltriethoxysilane, 308 parts of H308 parts of polybutadiene rubber (BB), 2 parts of a metal high-temperature adhesive, 5 parts of ceramic powder, 3 parts of glass powder and 4 parts of polyamide fiber.
Preparing an ultraviolet curing adhesive: (1) adding 42 parts of urethane acrylate, 32 parts of tetrahydrofuran methacrylate, 6 parts of dimethylacrylamide, 8 parts of ethoxylated bisphenol A di (meth) acrylate, 3 parts of Irgacure 184, 1 part of gamma-aminopropyltriethoxysilane, 4 parts of polybutadiene rubber (BB), 2 parts of a metal high-temperature adhesive, 5 parts of ceramic powder and 3 parts of glass powder into a double-planet hybrid reaction kettle in sequence, and stirring and mixing for 1.5 hours;
(2) adding polyamide fibers into a double-planet hybrid reaction kettle in a mode of blowing by an air blower for 3 times and vertically falling, wherein the first time of adding is clockwise stirring for 16 minutes, then the second time of adding is at least 2 minutes, the second time of adding is anticlockwise stirring for 8 minutes, and the third time of adding is clockwise stirring for 16 minutes, so that the polyamide fibers are subjected to partially staggered overlapping type directional arrangement along the plane extension direction of the acid-resistant alkali-resistant ultraviolet curing peelable glue layer;
(3) adding 8 parts of H30, stirring and mixing clockwise at a low speed for 0.5H, performing wall scraping treatment, continuing stirring for 0.5H, vacuumizing and defoaming, and discharging. The test results are shown in Table 1.
Example 4
The acid-resistant alkali-resistant ultraviolet-curing strippable collagen material comprises, by weight, 52 parts of urethane acrylate, 25 parts of tetrahydrofuran acrylate, 10 parts of isobornyl methacrylate, 5 parts of ethoxylated bisphenol A dimethacrylate, 6512 parts of Irgacure, 1 part of gamma-mercaptopropyltriethoxysilane, 205 parts of H, 4 parts of polybutadiene rubber (BB), 3 parts of a metal high-temperature adhesive, 6 parts of ceramic powder, 3 parts of glass powder and 4 parts of polyamide fiber.
Preparing an ultraviolet curing adhesive: (1) adding 52 parts of urethane acrylate, 25 parts of tetrahydrofuran acrylate, 10 parts of isobornyl methacrylate, 5 parts of ethoxylated bisphenol A di (meth) acrylate, 2 parts of Irgacure 651, 1 part of gamma-mercaptopropyltriethoxysilane, 4 parts of polybutadiene rubber (BB), 3 parts of metal high-temperature adhesive, 6 parts of ceramic powder and 3 parts of glass powder into a double-planet mixed power reaction kettle in sequence, and stirring and mixing for 1.5 hours;
(2) adding polyamide fibers into a double-planet hybrid reaction kettle in a mode of blowing by an air blower for 6 times and vertically falling, wherein clockwise stirring is carried out for 15 minutes during the first addition, then the second addition is carried out at intervals of at least 2 minutes, anticlockwise stirring is carried out for 5 minutes during the second addition, the third addition to the sixth addition are sequentially completed according to the sequence, and the polyamide fibers are subjected to partially staggered and overlapped type directional arrangement along the extension direction of the glue layer plane of the acid-resistant alkali-resistant ultraviolet curing peelable glue;
(3) adding 5 parts of H20, stirring and mixing clockwise for 0.5H, performing wall scraping treatment, continuing stirring for 0.5H, vacuumizing and defoaming, and discharging. The test results are shown in Table 1
Example 5
The acid-resistant alkali-resistant ultraviolet-curing strippable collagen material comprises 48 parts of polyurethane acrylate, 28 parts of tetrahydrofuran acrylate, 10 parts of isobornyl acrylate, 4 parts of acryloyl morpholine, Irgacure 1842 parts, 1 part of TPO, 1 part of gamma-aminopropyltriethoxysilane, R2026 parts, 4 parts of butyl rubber, 3 parts of metal high-temperature adhesive, 6 parts of ceramic powder, 3 parts of glass powder and 5 parts of polyamide fiber.
Preparing an ultraviolet curing adhesive: (1) adding 48 parts of urethane acrylate, 28 parts of tetrahydrofuran acrylate, 10 parts of isobornyl acrylate, 4 parts of acryloyl morpholine, 2 parts of Irgacure 184, 1 part of TPO, 1 part of gamma-aminopropyltriethoxysilane, 4 parts of butyl rubber, 3 parts of metal high-temperature adhesive, 6 parts of ceramic powder and 3 parts of glass powder into a double-planet mixed power reaction kettle in sequence, and stirring and mixing for 1.5 hours;
(2) adding polyamide fibers into a double-planet hybrid reaction kettle in a mode of blowing by an air blower twice and vertically falling, wherein clockwise stirring is carried out for 18 minutes in the first adding process, then adding is carried out for the second time at intervals of at least 2 minutes, and anticlockwise stirring is carried out for 6 minutes in the second adding process, so that the polyamide fibers are subjected to partially staggered and overlapped type directional arrangement along the glue layer plane extension direction of the acid-resistant alkali-resistant ultraviolet curing peelable glue;
(3) adding 6 parts of R202, stirring and mixing at a low speed clockwise for 0.5h, performing wall scraping treatment, continuing stirring for 0.5h, vacuumizing and defoaming, and discharging. The test results are shown in Table 1.
The results of the tests for examples 1-5 above are shown in Table 1 below:
Figure DEST_PATH_IMAGE002
as shown in Table 1, under strong acid and strong alkali environment, the adhesive layer of the acid and alkali resistant ultraviolet light curing peelable glue and the bonding strength between the surface layers of the bonded objects decrease by 3.6% -9.1%, and the adhesive strength is lower than 10%, when the acid and alkali resistant ultraviolet light curing peelable glue is applied to the secondary anodizing treatment process after the stripping, the adhesive strength between the adhesive layer and the surface layers of the bonded objects is not obviously decreased, the ultraviolet light curing peelable glue has good acid and alkali resistance, the yield of the stripping technological process can be effectively improved, and the yield of the whole technological process is improved.
The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be considered to be within the technical scope of the present invention, and the technical solutions and the inventive concepts thereof according to the present invention should be equivalent or changed within the scope of the present invention.

Claims (10)

1. The utility model provides an acidproof alkali-resistant ultraviolet curing can peel and glue, is applicable to the back secondary anodization after the deplating in-process, prevents that anolyte from corroding to the interim protection of local reservation region, its characterized in that:
the acid-resistant alkali-resistant ultraviolet-curable peelable glue comprises the following raw materials in parts by weight: 30-70 parts of urethane acrylate, 20-60 parts of reactive monomer diluent, 1-8 parts of photoinitiator, 0.5-3 parts of coupling agent, 2-10 parts of thixotropic agent, 2-4 parts of toughening agent, 1-3 parts of metal high-temperature adhesive, 4-6 parts of ceramic powder, 2-3 parts of glass powder and 3-5 parts of polyamide fiber;
wherein the length of the polyamide fiber is 1-1.5 mm, and the polyamide fiber is partially staggered and overlapped in an oriented arrangement along the plane extension direction of the glue layer of the acid-resistant, alkali-resistant and ultraviolet-curable peelable glue; the cohesive strength of the glue layer of the acid-resistant alkali-resistant ultraviolet-curable peelable glue is 0.5-2 times of the bonding strength between the glue layer and the surface layer of the bonded object.
2. The acid and alkali resistant ultraviolet curable peelable glue according to claim 1, wherein:
the cohesive strength of the glue layer of the acid-resistant alkali-resistant ultraviolet-curable peelable glue is 2-10 times that of the glue layer without the polyamide fiber.
3. The acid and alkali resistant ultraviolet curable peelable glue according to claim 1, wherein:
the acid resistance and alkali resistance means that the pH of strong acid is =1.5-2.5, and the pH of strong base is = 12-13;
under the strong acid and strong alkali environment, the bonding strength between the adhesive layer and the surface layer of the bonded object is reduced by less than 10%.
4. The acid and alkali resistant ultraviolet curable peelable glue according to any one of claims 1 to 3, wherein: the polyurethane acrylate is a difunctional aliphatic polyurethane acrylate, and the viscosity range of the polyurethane acrylate is required to be 40000-100000cps at 25 ℃, and the preferable viscosity is 55000-85000cps at 25 ℃.
5. The acid and alkali resistant UV curable peelable adhesive according to any one of claims 1-4, wherein: the reactive monomer diluent is a monofunctional acrylate monomer, and is selected from one or a mixture of more than two of the following components: tetrahydrofuran methacrylate, iso-glacial methacrylate, butyl acrylate, iso-octyl acrylate, hydroxyethyl methacrylate, hydroxypropyl methacrylate, dicyclopentadienyl acrylate, alkoxylated nonylphenol acrylate, ethoxylated bisphenol a dimethacrylate, lauryl acrylate, lauryl methacrylate, 2-phenoxyethyl acrylate, iso-decyl acrylate, dimethylacrylamide and acryloylmorpholine.
6. The acid and alkali resistant UV curable peelable adhesive according to any one of claims 1-5, wherein: the photoinitiator is one or a mixture of any several of Irgacure 1173, Irgacure 184, Irgacure 651, Irgacure 819, Irgacure 907 and TPO.
7. The acid and alkali resistant UV curable peelable adhesive according to any one of claims 1-6, wherein: the coupling agent is selected from one or a mixture of more than two of the following materials: gamma-aminopropyltriethoxysilane, gamma- (2, 3-epoxypropoxy) propyltrimethylsilane, gamma- (methacryloyloxy) propyltrimethoxysilane, gamma-mercaptopropyltriethoxysilane, and gamma-mercaptopropyltrimethoxysilane.
8. The acid and alkali resistant ultraviolet curable peelable glue according to claim 1, wherein: the thixotropic agent is fumed silica; the toughening agent is one of Ethylene Propylene Rubber (EPR), polybutadiene rubber (BB) and butyl rubber.
9. The acid and alkali resistant ultraviolet curable peelable glue according to claim 1, wherein: the particle mesh number of the ceramic powder is 800-1000; the glass powder is transparent glass powder, and the mesh number of the powder is 800-1000.
10. A method for preparing the acid and alkali resistant ultraviolet curable peelable glue according to any one of claims 1 to 10, wherein the method comprises the following steps: the method comprises the following steps:
s1: weighing the polyurethane acrylate oligomer, the acrylate reactive diluent, the photoinitiator, the coupling agent, the toughening agent, the metal high-temperature adhesive, the ceramic powder and the glass powder in the weight percentage range, sequentially adding the materials into a double-planet mixed power reaction kettle, and mixing and stirring the materials for 1 to 2 hours;
s2: after uniformly stirring, adding polyamide fibers into a double-planet hybrid reaction kettle in a mode of blowing vertically for at least two times through an air blower, stirring for 15-20 minutes clockwise during the first addition, then stirring for a second time at intervals of at least 2 minutes, stirring for 5-10 minutes anticlockwise during the second addition, and if the adding times are more than two times, sequentially and circularly adding the polyamide fibers according to the sequence until the polyamide fibers are subjected to partially staggered overlapping type directional arrangement along the extension direction of the glue layer plane of the acid-resistant alkali-resistant ultraviolet curing peelable glue;
s3: weighing the thixotropic agent within the weight ratio range, adding the thixotropic agent into the reaction kettle, stirring the thixotropic agent at a low speed clockwise for 0.5h, strictly avoiding white light in the stirring process, scraping the wall, continuously stirring the thixotropic agent at a low speed clockwise for 0.5h, vacuumizing and defoaming the thixotropic agent, and sealing and packaging the thixotropic agent after discharging.
CN202011067165.2A 2020-10-05 2020-10-05 Acid-resistant alkali-resistant ultraviolet-curing peelable glue suitable for secondary anode process after deplating and preparation method thereof Pending CN112341980A (en)

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