CN112341720B - Preparation method and application of epoxy resin cleaning glue - Google Patents
Preparation method and application of epoxy resin cleaning glue Download PDFInfo
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- CN112341720B CN112341720B CN202011371508.4A CN202011371508A CN112341720B CN 112341720 B CN112341720 B CN 112341720B CN 202011371508 A CN202011371508 A CN 202011371508A CN 112341720 B CN112341720 B CN 112341720B
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
- C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
- C08L23/16—Elastomeric ethene-propene or ethene-propene-diene copolymers, e.g. EPR and EPDM rubbers
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
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- C08K2003/2241—Titanium dioxide
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
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- C—CHEMISTRY; METALLURGY
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- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
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Abstract
The invention discloses a preparation method of epoxy resin cleaning glue, which comprises the steps of preparing base glue, preparing oil, preparing kneading glue and preparing cleaning glue, and utilizes the swelling effect of an oligomer PTMEG on cured epoxy resin, combines the high penetrability of micromolecular alcohol amine, and performs penetrating stripping on the swelled epoxy resin, and finally removes and cleans the cured epoxy resin by utilizing the adhesion effect of the base glue, thereby having good cleaning effect. The invention also discloses application of the epoxy resin cleaning adhesive in cleaning residual epoxy resin for mold press curing in a metal mold, and the cleaning method is simple and convenient, has long operation time window and good cleaning effect, and does not cause secondary pollution.
Description
Technical Field
The invention relates to the technical field of mold cleaning, in particular to a preparation method of epoxy resin cleaning glue and application of the epoxy resin cleaning glue in cleaning residual epoxy resin for mold pressing and curing of a metal mold.
Background
In the field of electronic packaging, epoxy resin is often used for packaging electronic devices, and epoxy resin needs to be cured at a high temperature in a metal mold during packaging, however, after long-time curing, the surface of the metal mold can remain dirt of the epoxy resin to form cured epoxy resin fine particles, so that the surface quality of a subsequently packaged electronic product is affected, and therefore, the epoxy resin remaining on the surface of the metal mold needs to be cleaned regularly.
At present, a plurality of cleaning methods for the metal mold are divided into an offline cleaning technology and an online cleaning technology. The off-line cleaning technology comprises a solvent cleaning method, a sand blasting cleaning method, an electrochemical cleaning method, an ultrasonic cleaning method and the like, but the methods all need to cool and disassemble the metal mold, the labor intensity is high, the period is long, and the mold is easy to damage when disassembled, so that the mold closing precision is affected. The online cleaning technology comprises a laser cleaning method, a dry ice spraying cleaning method and a curable adhesive cleaning method, and has the advantages of no need of disassembling a die, high cleaning speed, short cleaning time, small abrasion of the die and the like, but the laser cleaning method has high equipment investment and poor cleaning effect on edges, corners, seams and Kong Dengwei of the die; the dry ice spray cleaning method has the defects as well, and the original production condition can be recovered only by heating for a long time after cleaning due to the cooling effect of the dry ice; the curable adhesive cleaning method is an important method for cleaning the electronic packaging mold by adding a rubber curing system at the original production temperature and adhering the cured epoxy resin particles so as to realize on-line rapid cleaning of the mold.
Due to the limited use of sulfur and sulfur-containing compounds on electronic devices, the rubber curing system employed in the curable glue cleaning process is a peroxide system. Currently, manufacturers begin to adopt solid epoxy resin systems in order to improve the high temperature resistance of packaged products, which leads to a significant increase in the curing temperature (not less than 180 ℃). Therefore, this presents a new challenge for the mold cleaning method, since the cured rubber cleaning method is only suitable for medium and high temperatures (120-170 ℃), and the curing time of the rubber is required to be consistent with the curing time of the epoxy resin in order to improve the production efficiency in terms of simple operation. On the one hand, the original rubber curing system narrows the operation time window of the mold cleaning at a new high temperature, namely, the rubber curing at the high temperature is quick, and the mold filling is difficult to complete, especially for the mold with a fine structure, which leads to the reduction of the cleaning effect; on the other hand, the curing time of epoxy resin is generally longer than that of rubber, and the long-time high-temperature curing can cause aging, decomposition and adhesion of cleaning rubber to a mold, resulting in secondary pollution of the mold. Therefore, research into a new cleaning agent for removing the residual epoxy resin for mold press curing is an urgent need in the field of electronic packaging.
Disclosure of Invention
The invention aims to provide a preparation method of epoxy resin cleaning glue, and the prepared epoxy resin cleaning glue has good cleaning effect on epoxy resin.
The invention also aims to provide the application of the epoxy resin cleaning adhesive, which is applied to cleaning residual epoxy resin for mold press curing in a metal mold, has long operation time window and good cleaning effect, and does not cause secondary pollution.
In order to achieve the above object, the solution of the present invention is:
the preparation method of the epoxy resin cleaning glue comprises the following steps:
step 1, preparing base adhesive: adding solid rubber into a kneader, and kneading for 5-10 min at 40-70 ℃ to obtain base rubber for later use;
step 2, preparing oil: mixing 5-7 parts of liquid triethanolamine, 10-20 parts of PTMEG (polytetrahydrofuran), 5 parts of precipitated white carbon black and 10 parts of light calcium carbonate at the temperature of 30-50 ℃ to obtain powdered oil;
step 3, preparing kneading glue: then adding 100 parts of the base adhesive obtained in the step 1 into a kneader, sequentially adding 3-6 parts of an antioxidant MB, 1-3 parts of an antioxidant BHT, 2-5 parts of paraffin wax, 3-5 parts of oleamide, 0.5 part of spice, 30-50 parts of precipitated white carbon black, 10-30 parts of light calcium carbonate, 3-6 parts of titanium dioxide and 0.5-1.5 parts of a crosslinking auxiliary agent TAIC, kneading for 5-10 min at 30-50 ℃, and cooling to room temperature to obtain kneaded adhesive;
step 4, preparing cleaning glue: and (3) sequentially adding 0.5-3 parts of peroxide and the oil material obtained in the step (2) into the kneading glue obtained in the step (3), carrying out advanced kneading for 5-10 min at 50-80 ℃, and cooling for 20-24 h to obtain the epoxy resin cleaning glue.
In step 1, the solid rubber is EPDM (ethylene propylene diene monomer).
In step 2, the PTMEG is PTMEG250 or PTMEG650.
In the step 4, the peroxide is dicumyl peroxide or 2, 5-di-tert-butyl peroxy-2, 5-dimethylhexane.
The application of the epoxy resin cleaning glue is that the epoxy resin cleaning glue is applied to cleaning residual epoxy resin for mold press curing in a metal mold, and comprises the following steps: cutting and forming the epoxy resin cleaning glue according to 105-110% of the volume of the inner cavity of the metal mold to be cleaned, then placing the epoxy resin cleaning glue into the metal mold to be cleaned, curing, demolding, taking out the epoxy resin cleaning glue, and cleaning residual epoxy resin dirt for molding curing in the metal mold.
The curing temperature is 170-190 ℃, the curing pressure is 1-5 MPa, and the curing time is 5-15 min.
After the technical scheme is adopted, the preparation method of the epoxy resin cleaning adhesive has the following advantages:
1. the cleaning system of the epoxy resin cleaning adhesive is formed by base adhesive, micromolecular alcohol amine and oligomer PTMEG, the swelling effect of the oligomer PTMEG on the cured epoxy resin is utilized to swell the epoxy resin particles on the surface of a metal mold, the high penetrability of liquid triethanolamine is combined, the swelled epoxy resin is penetrated and stripped, and finally the cured epoxy resin is removed and cleaned by the adhesion effect of the base adhesive;
2. the rubber curing system adopts a high-temperature peroxide system, and an antioxidant BHT, a crosslinking auxiliary agent TAIC and peroxide are compounded, so that the defect that the peroxide is easy to burn at high temperature is overcome, the high-temperature resistance of the cleaning adhesive is improved, the window time of the cleaning operation is prolonged, the cleaning adhesive is easy to fill a mold, and the full cleaning of a metal mold is realized;
3. the epoxy resin cleaning glue has no corrosiveness to metal molds and is low in preparation cost;
4. the epoxy resin cleaning adhesive is applied to cleaning residual epoxy resin for mold pressing curing in a metal mold, and has the advantages of simple cleaning method, long operation time window, good cleaning effect and no secondary pollution.
Detailed Description
In order to further explain the technical scheme of the invention, the invention is explained in detail by specific examples.
1. Preparation of epoxy resin cleaning glue
Example 1
The preparation method of the epoxy resin cleaning glue comprises the following steps:
step 1, preparing base adhesive: adding EPDM into a kneader, and kneading for 10min at 40 ℃ to obtain base rubber for later use;
step 2, preparing oil: mixing 7 parts of liquid triethanolamine, 10 parts of PTMEG650, 5 parts of precipitated white carbon black and 10 parts of light calcium carbonate at 30 ℃ to obtain powdered oil;
step 3, preparing kneading glue: then adding 100 parts of the base adhesive obtained in the step 1 into a kneader, sequentially adding 3 parts of an antioxidant MB, 3 parts of an antioxidant BHT, 2 parts of paraffin, 5 parts of oleamide, 0.5 part of spice, 30 parts of precipitated white carbon black, 30 parts of light calcium carbonate, 3 parts of titanium dioxide and 0.5 part of a crosslinking auxiliary agent TAIC, kneading for 5min at 50 ℃, and cooling to room temperature to obtain kneaded adhesive;
step 4, preparing cleaning glue: and 3 parts of dicumyl peroxide and the oil material obtained in the step 2 are sequentially added into the kneading glue obtained in the step 3, and after the kneading glue is subjected to advanced kneading for 5min at 80 ℃, the epoxy resin cleaning glue is obtained after cooling for 24 h.
Example 2
The preparation method of the epoxy resin cleaning glue comprises the following steps:
step 1, preparing base adhesive: adding EPDM into a kneader, and kneading for 8min at 50 ℃ to obtain base rubber for later use;
step 2, preparing oil: mixing 6 parts of liquid triethanolamine, 12 parts of PTMEG250, 5 parts of precipitated white carbon black and 10 parts of light calcium carbonate at 40 ℃ to obtain powdered oil;
step 3, preparing kneading glue: then adding 100 parts of the base adhesive obtained in the step 1 into a kneader, sequentially adding 4 parts of an antioxidant MB, 2 parts of an antioxidant BHT, 3 parts of paraffin, 4 parts of oleamide, 0.5 part of spice, 35 parts of precipitated white carbon black, 25 parts of light calcium carbonate, 4 parts of titanium dioxide and 0.8 part of a crosslinking auxiliary agent TAIC, kneading for 8min at 40 ℃, and cooling to room temperature to obtain kneaded adhesive;
step 4, preparing cleaning glue: and (3) sequentially adding 2.5 parts of dicumyl peroxide and the oil obtained in the step (2) into the kneading gum obtained in the step (3), carrying out advanced kneading for 8min at 60 ℃, and cooling for 20h to obtain the epoxy resin cleaning gum.
Example 3
The preparation method of the epoxy resin cleaning glue comprises the following steps:
step 1, preparing base adhesive: adding EPDM into a kneader, and kneading for 10min at 70 ℃ to obtain base rubber for later use;
step 2, preparing oil: mixing 5 parts of liquid triethanolamine, 20 parts of PTMEG250, 5 parts of precipitated white carbon black and 10 parts of light calcium carbonate at 50 ℃ to obtain powdered oil;
step 3, preparing kneading glue: then adding 100 parts of the base adhesive obtained in the step 1 into a kneader, sequentially adding 6 parts of an antioxidant MB, 1 part of an antioxidant BHT, 5 parts of paraffin, 3 parts of oleamide, 0.5 part of spice, 50 parts of precipitated white carbon black, 10 parts of light calcium carbonate, 6 parts of titanium dioxide and 1.5 parts of a crosslinking auxiliary agent TAIC, kneading for 10min at 30 ℃, and cooling to room temperature to obtain kneaded adhesive;
step 4, preparing cleaning glue: and (3) sequentially adding 0.5 part of 2, 5-di-tert-butyl peroxy-2, 5-dimethylhexane and the oil obtained in the step (2) into the kneading gum obtained in the step (3), kneading for 5min at 80 ℃, and cooling for 24h to obtain the epoxy resin cleaning gum.
Example 4
The preparation method of the epoxy resin cleaning glue comprises the following steps:
step 1, preparing base adhesive: adding EPDM into a kneader, and kneading for 6min at 60 ℃ to obtain base rubber for later use;
step 2, preparing oil: mixing 5 parts of liquid triethanolamine, 10 parts of PTMEG650, 5 parts of precipitated white carbon black and 10 parts of light calcium carbonate at 50 ℃ to obtain powdered oil;
step 3, preparing kneading glue: then adding 100 parts of the base adhesive obtained in the step 1 into a kneader, sequentially adding 5 parts of an antioxidant MB, 3 parts of an antioxidant BHT, 2 parts of paraffin, 5 parts of oleamide, 0.5 part of spice, 40 parts of precipitated white carbon black, 20 parts of light calcium carbonate, 3 parts of titanium dioxide and 0.5 part of a crosslinking auxiliary agent TAIC, kneading for 5min at 50 ℃, and cooling to room temperature to obtain kneaded adhesive;
step 4, preparing cleaning glue: and (3) sequentially adding 0.5 part of dicumyl peroxide and the oil obtained in the step (2) into the kneading gum obtained in the step (3), carrying out advanced kneading for 5min at 80 ℃, and cooling for 24h to obtain the epoxy resin cleaning gum.
Comparative example 1
The preparation method of the epoxy resin cleaning glue is approximately the same as that of the embodiment 1, and the difference is that: no PTMEG650 was added to the oil of step 2.
Comparative example 2
The preparation method of the epoxy resin cleaning glue is approximately the same as that of the embodiment 1, and the difference is that: the oil of step 2 replaces PTMEG650 with PTMEG1000.
Comparative example 3
The preparation method of the epoxy resin cleaning glue is approximately the same as that of the embodiment 1, and the difference is that: the step 2 oil is not added with liquid triethanolamine.
Comparative example 4
The preparation method of the epoxy resin cleaning glue is approximately the same as that of the embodiment 1, and the difference is that: and 3, adding no antioxidant BHT into the kneaded glue in the step 3.
Comparative example 5
The preparation method of the epoxy resin cleaning glue is approximately the same as that of the embodiment 1, and the difference is that: the cross-linking auxiliary TAIC is not added into the kneaded glue in the step 3.
Comparative example 6
The preparation method of the epoxy resin cleaning glue is approximately the same as that of the embodiment 1, and the difference is that: the kneading rubber in the step 3 is not added with an antioxidant BHT and a cross-linking auxiliary agent TAIC, and is replaced by adding 2 parts of a vulcanization accelerator TMTD, 0.5 part of an accelerator OTOS and 1 part of a scorch retarder CTP, and the step 4 is not added with dicumyl peroxide, namely, the rubber curing system is replaced by a peroxide system into a sulfur system.
2. Application of epoxy resin cleaning glue
1. Selecting metal mould to be cleaned
And (3) selecting an LED packaging die as a metal die to be cleaned, and performing 400 times of injection molding on the metal die to be cleaned by adopting an epoxy resin molding compound EMC at the die temperature of 190 ℃ for 5min, so that residual epoxy resin dirt for compression molding and curing is formed on the inner surface of the metal die to be cleaned.
2. Application of
Application example 1
The epoxy resin cleaning adhesives prepared in the examples 1, 4 and comparative examples 1 to 6 were cut and molded respectively according to 105% of the volume of the inner cavity of the metal mold to be cleaned, then put into the metal mold to be cleaned, cured at 190 ℃ and 1MPa for 5min, and demolded to take out the epoxy resin cleaning adhesive, thereby completing the cleaning of residual epoxy resin dirt for molding curing in the metal mold for 1 time.
Application example 2
Cutting and forming the epoxy resin cleaning glue prepared in the embodiment 2 according to 110% of the volume of the inner cavity of the metal mold to be cleaned, then placing the epoxy resin cleaning glue into the metal mold to be cleaned, curing for 10min at 180 ℃ and 3MPa, demolding, taking out the epoxy resin cleaning glue, and completing the cleaning of residual epoxy resin dirt for molding curing in the metal mold for 1 time.
Application example 3
Cutting and forming the epoxy resin cleaning glue prepared in the embodiment 3 according to 110% of the volume of the inner cavity of the metal mold to be cleaned, then placing the epoxy resin cleaning glue into the metal mold to be cleaned, curing for 15min at 170 ℃ and 5MPa, demolding, taking out the epoxy resin cleaning glue, and completing the cleaning of residual epoxy resin dirt for molding curing in the metal mold for 1 time.
3. Evaluation of the Effect of epoxy resin cleaning glue
1. Cleaning effect evaluation method
After 3 times of operation according to the cleaning method in application examples 1 to 3, the following cleaning effect evaluation was performed on the inner surface of each metal mold to be cleaned:
(1) The inner surface of the metal mold after cleaning was visually inspected, the cleaning effect was evaluated well as ∈, the cleaning effect was generally marked as ∈, the cleaning effect was not good as ∈, and the results are shown in table 1;
(2) HATR-FTIR test is respectively carried out on the inner surface of the metal mold, and the test spectrogram is analyzed, wherein the characteristic peak of the aromatic ether of the epoxy resin is 1297cm -1 、1181cm -1 The presence of the mark is marked as #, the absence of the mark is marked as X, and the methyl deformation vibration characteristic absorption peak of the EPDM is 1377cm -1 The presence of the mark is marked as #, the absence of the mark is marked as X, and the TMTD characteristic peak is 1510cm -1 、1240cm -1 The presence of the label ∈ and the absence of the label ×, the results are shown in table 1;
when the characteristic peak of the epoxy resin appears in the infrared spectrum of the metal mold, the internal surface of the metal mold still has tiny and invisible epoxy resin residual dirt; when an EPDM characteristic peak appears in the infrared spectrum of the metal mold, the EPDM is possibly aged at high temperature, and new dirt is formed on the inner surface of the mold; when a sulfur vulcanization system is used, a TMTD characteristic peak appears in the infrared spectrum of the metal mold, which indicates that the vulcanization system forms new dirt on the inner surface of the metal mold.
2. The strength evaluation method comprises the following steps:
the epoxy resin cleaning adhesives prepared in each example and comparative example were molded and cut into samples under corresponding vulcanization conditions (e.g., in example 1, the vulcanization conditions correspond to 190 ℃ and 1MPa for 5 min), and each sample was tested for tear strength according to GB/T529-2008, and the higher the tear strength value, the less likely the corresponding epoxy resin cleaning adhesive was broken during demolding, as shown in table 1.
3. The operation time window evaluation method comprises the following steps:
the epoxy resin cleaning glue prepared in each example and comparative example was cured for 5min under the corresponding curing conditions (as in example 1, the curing conditions were 190 ℃ and 1 MPa), the curing curve of the epoxy resin cleaning glue was tested by using a rotor-free curing apparatus, the time t10 of 10% of the torque change was recorded, and the longer the t10 indicated a longer operating time window as shown in table 1.
4. Evaluation result analysis
TABLE 1 evaluation of Effect of epoxy cleaning Adhesives
As can be seen from the infrared absorption peak results in Table 1, the inner surfaces of the metal molds after the cleaning with the epoxy resin cleaning paste prepared in examples 1 to 4 were found no epoxy resin characteristic peaks and no EPDM characteristic peaks, indicating that the inner surfaces were clean and did not cause secondary pollution.
The results of comparative examples 1 to 6 and the epoxy resin cleaning paste prepared in example 1 were compared, and the results were as follows:
because PTEMG is not added into the oil material in the comparative example 1, the swelling of epoxy resin is lacking, the subsequent penetration stripping effect of micromolecular alcohol amine is reduced, and the adhesion cleaning effect of solid rubber is further reduced, and the cleaning effect is general; as for mechanical strength, PTEMG has a smaller molecular weight than rubber, and a plasticizing effect is shown in a rubber system, so that PTEMG is added in example 1, and the mechanical strength is slightly weakened.
In the oil material of comparative example 2, PTEMG1000 was added, and the molecular weight of PTEMG added in comparative example 2 was higher than that of example 1, and the swelling effect on the cured epoxy resin was poor, and the subsequent penetration and peeling of the small molecule alcohol amine substances were also unfavorable, so that the cleaning effect was also general.
In the oil of comparative example 3, no small-molecular alcohol amine was added, and the cleaning system lacked penetration and peeling of the cured epoxy resin, so the cleaning effect was poor.
In the kneading glue of comparative example 4, the antioxidant BHT was not added, and the adjustment of the operation time of the peroxide system was lacking, so that the operation time was short, the mold filling of the cleaning glue and the subsequent bonding of the swollen cured epoxy resin were not facilitated, the cleaning effect was poor, and the cleaning glue was easily aged at a high temperature, resulting in newly increased residues in the metal mold, and secondary pollution.
In the kneading glue of comparative example 5, no crosslinking auxiliary agent TAIC was added, and TAIC in the peroxide system, besides adjusting the operation time, the crosslinking network was also adjusted to increase the degree of network crosslinking, so that no TAIC was added, the operation time for cleaning the glue was shortened, the adhesion to the cured epoxy resin was reduced, and the strength of the cleaning glue was slightly reduced, which was unfavorable for the subsequent demolding operation.
In comparative example 6, the peroxide system is replaced with a sulfur system, and the sulfur system has more convenient operation time adjustment than the peroxide system and the sulfur crosslinked network has better stress dispersion effect, so the corresponding cleaning gel has long operation time and high strength; however, the accelerator in the sulfur system is easy to cause secondary pollution of the metal mold, so that the cleaning effect of the metal mold is reduced.
To sum up, the preparation method of the epoxy resin cleaning glue has the following beneficial effects:
1. the cleaning system of the epoxy resin cleaning adhesive is formed by base adhesive, micromolecular alcohol amine and oligomer PTMEG, the swelling effect of the oligomer PTMEG on the cured epoxy resin is utilized to swell the epoxy resin particles on the surface of a metal mold, the high penetrability of liquid triethanolamine is combined, the swelled epoxy resin is penetrated and stripped, and finally the cured epoxy resin is removed and cleaned by the adhesion effect of the base adhesive;
2. the rubber curing system adopts a high-temperature peroxide system, and an antioxidant BHT, a crosslinking auxiliary agent TAIC and peroxide are compounded, so that the defect that the peroxide is easy to burn at high temperature is overcome, the high-temperature resistance of the cleaning adhesive is improved, the window time of the cleaning operation is prolonged, the cleaning adhesive is easy to fill a mold, and the full cleaning of a metal mold is realized;
3. the epoxy resin cleaning glue has no corrosiveness to metal molds and is low in preparation cost;
4. the epoxy resin cleaning adhesive is applied to cleaning residual epoxy resin for mold pressing curing in a metal mold, and has the advantages of simple cleaning method, long operation time window, good cleaning effect and no secondary pollution.
The above embodiments are not intended to limit the form or style of the present invention, and any suitable changes or modifications made by those skilled in the art should be construed as not departing from the scope of the present invention.
Claims (4)
1. A preparation method of epoxy resin cleaning glue is characterized in that: the method comprises the following steps:
step 1, preparing base adhesive: adding solid rubber into a kneader, and kneading for 5-10 min at 40-70 ℃ to obtain base rubber for later use;
step 2, preparing oil: mixing 5-7 parts of liquid triethanolamine, 10-20 parts of PTMEG, 5 parts of precipitated white carbon black and 10 parts of light calcium carbonate at the temperature of 30-50 ℃ to obtain powdered oil;
step 3, preparing kneading glue: then adding 100 parts of the base adhesive obtained in the step 1 into a kneader, sequentially adding 3-6 parts of an antioxidant MB, 1-3 parts of an antioxidant BHT, 2-5 parts of paraffin wax, 3-5 parts of oleamide, 0.5 part of spice, 30-50 parts of precipitated white carbon black, 10-30 parts of light calcium carbonate, 3-6 parts of titanium dioxide and 0.5-1.5 parts of a crosslinking auxiliary agent TAIC, kneading for 5-10 min at 30-50 ℃, and cooling to room temperature to obtain kneaded adhesive;
step 4, preparing cleaning glue: sequentially adding 0.5-3 parts of peroxide and the oil material obtained in the step 2 into the kneading glue obtained in the step 3, carrying out advanced kneading for 5-10 min at 50-80 ℃, and cooling for 20-24 h to obtain the epoxy resin cleaning glue;
in step 2, the PTMEG is PTMEG250 or PTMEG650, and in step 4, the peroxide is dicumyl peroxide or 2, 5-di-tert-butylperoxy-2, 5-dimethylhexane.
2. The method for preparing the epoxy resin cleaning gel according to claim 1, wherein the method comprises the following steps: in step 1, the solid rubber is EPDM.
3. The use of the epoxy resin cleaning gel prepared by the preparation method according to claim 1, wherein: the epoxy resin cleaning glue is applied to cleaning residual epoxy resin for mold press curing in a metal mold, and comprises the following steps: cutting and forming the epoxy resin cleaning glue according to 105-110% of the volume of the inner cavity of the metal mold to be cleaned, then placing the epoxy resin cleaning glue into the metal mold to be cleaned, curing, demolding, taking out the epoxy resin cleaning glue, and cleaning residual epoxy resin dirt for molding curing in the metal mold.
4. The use of an epoxy cleaning gel as claimed in claim 3, wherein: the curing temperature is 170-190 ℃, the curing pressure is 1-5 MPa, and the curing time is 5-15 min.
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| CN202011371508.4A CN112341720B (en) | 2020-11-30 | 2020-11-30 | Preparation method and application of epoxy resin cleaning glue |
| PCT/CN2021/119218 WO2022111004A1 (en) | 2020-11-30 | 2021-09-18 | Preparation method for epoxy resin cleaning adhesive, and application thereof |
| ZA2023/01501A ZA202301501B (en) | 2020-11-30 | 2023-02-06 | Preparation method for epoxy resin cleaning adhesive, and application thereof |
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| CN202011371508.4A CN112341720B (en) | 2020-11-30 | 2020-11-30 | Preparation method and application of epoxy resin cleaning glue |
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| CN106554571A (en) * | 2015-09-25 | 2017-04-05 | 厦门三龙达胶业有限公司 | Mold cleaning glue in situ |
| CN106674757A (en) * | 2016-10-24 | 2017-05-17 | 上海众力投资发展有限公司 | Rubber composition for cleaning molds and processing technique thereof |
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| CN112341720B (en) * | 2020-11-30 | 2023-05-16 | 黎明职业大学 | Preparation method and application of epoxy resin cleaning glue |
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2020
- 2020-11-30 CN CN202011371508.4A patent/CN112341720B/en active Active
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2021
- 2021-09-18 WO PCT/CN2021/119218 patent/WO2022111004A1/en active Application Filing
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2023
- 2023-02-06 ZA ZA2023/01501A patent/ZA202301501B/en unknown
Non-Patent Citations (1)
| Title |
|---|
| adhesion ADHESIVES + SEALANTS;Adhesion Adhesives & Sealants group;《adhesion ADHESIVES + SEALANTS》;第16卷(第2期);第30-31页 * |
Also Published As
| Publication number | Publication date |
|---|---|
| ZA202301501B (en) | 2023-05-31 |
| CN112341720A (en) | 2021-02-09 |
| WO2022111004A1 (en) | 2022-06-02 |
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