CN112339284B - 感应焊接温度的远程检测 - Google Patents
感应焊接温度的远程检测 Download PDFInfo
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- CN112339284B CN112339284B CN202010650789.0A CN202010650789A CN112339284B CN 112339284 B CN112339284 B CN 112339284B CN 202010650789 A CN202010650789 A CN 202010650789A CN 112339284 B CN112339284 B CN 112339284B
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- welding
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- linear fiber
- sensor
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Classifications
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- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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- B29C66/73—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset
- B29C66/739—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of the parts to be joined being a thermoplastic or a thermoset
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- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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- B29C66/863—Robotised, e.g. mounted on a robot arm
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Abstract
本公开涉及感应焊接温度的远程检测。提供了用于控制焊接的系统和方法。一个实施方式是一种用于控制复合零件的焊接的方法。该方法包括以下步骤:将线性光纤传感器沿着复合零件定位,该复合零件包括通过纤维增强的热塑性塑料的基质;经由所述线性光纤传感器测量沿着焊接线的温度;沿着所述焊接线在所述复合零件处执行感应焊接;确定沿着所述焊接线的一连串焊接温度;以及基于所述一连串焊接温度来控制所述感应焊接。
Description
技术领域
本公开涉及复合材料领域,并且具体地,涉及制造复合零件。
背景技术
复合零件各自包括通过纤维增强的材料的基质。例如,一些复合零件由单向碳纤维层制成,这些碳纤维以不同的方向堆叠在热塑性基质中。为了将热塑性复合零件粘附在一起,零件可被感应焊接,以形成一体的复合零件。在感应焊接期间,复合零件中的纤维与施加的磁场反应,从而导致复合零件处发热。这使复合零件的界面处的热塑性基质的温度升高至熔融温度。在这种状态下,复合零件中的热塑性材料融合在一起,并且在冷却后,这两个复合零件的热塑性基质会固化成一体。
尽管感应焊接提供了优于现有技术的大量益处,但是控制感应焊接的执行温度仍然是困难的过程。这是不适当的,因为如果未在特定温度范围内执行感应焊接,则焊接可能与所期望的参数不相符。
因此,期望有至少考虑以上所讨论问题中的至少一些以及其他可能问题的方法和设备。
发明内容
本文中描述的实施方式提供了利用远程感测技术来推断用于将热塑性复合零件感应焊接在一起的焊接线处的温度的系统和方法。这些技术是非侵入式的并且不需要将传感器直接放置在焊接界面内,这使焊接强度增加并且使费用减少。此外,因为传感器没有被直接放置在焊接界面处,所以传感器不需要耐高温或实质性牺牲。因此,在焊接过程期间用外部传感器监测焊接温度是对实现感应焊接所期望的物理性能的重大改进。
一个实施方式是一种用于控制复合零件的焊接的方法。该方法包括以下步骤:将线性光纤传感器沿着复合零件定位,该复合零件包括通过纤维增强的热塑性塑料的基质;经由所述线性光纤传感器测量沿着焊接线的温度;沿着所述焊接线在所述复合零件处执行感应焊接;确定沿着所述焊接线的一连串焊接温度;以及基于所述一连串焊接温度来控制所述感应焊接。
其他实施方式是一种实施编程指令的非暂态计算机可读介质,所述编程指令在由处理器执行时能进行操作,以执行一种方法。该方法包括以下步骤:将线性光纤传感器沿着复合零件定位,该复合零件包括通过纤维增强的热塑性塑料的基质;经由所述线性光纤传感器测量沿着焊接线的温度;沿着所述焊接线在所述复合零件处执行感应焊接;确定沿着所述焊接线的一连串焊接温度;以及基于所述一连串焊接温度来控制所述感应焊接。
其他实施方式是一种用于促成复合零件的焊接的设备。该设备包括:末端执行器,其产生电磁场,所述电磁场致使所述复合零件的焊接线产生热,从而导致感应焊接;线性光纤传感器,其沿着所述焊接线被设置在所述复合零件处;以及控制器,其经由所述线性光纤传感器测量沿着所述焊接线的温度,确定沿着所述焊接线的一连串焊接温度以及基于所述一连串焊接温度来控制所述感应焊接。
下面,可描述其他例示性实施方式(例如,与前述实施方式相关的方法和计算机可读介质)。已讨论的特征、功能和优点可在各种实施方式中独立地实现或者可在其他实施方式组合,可参照以下描述和附图发现这些方面的其他细节。
附图说明
现在,只以举例方式参照附图来描述本公开的一些实施方式。在所有附图上,相同的附图标记表示相同的元件或相同类型的元件。
图1例示了例示性实施方式中的感应焊接系统。
图2是例示了例示性实施方式中的用于操作感应焊接系统的方法的流程图。
图3是例示了例示性实施方式中的用于操作感应焊接系统的其他方法的流程图。
图4是例示性实施方式中的操作感应线圈以产生感应焊接的感应焊接系统的立体图。
图5是例示性实施方式中的操作感应线圈以产生感应焊接的感应焊接系统的俯视图。
图6是例示性实施方式中的操作感应线圈以产生感应焊接的感应焊接系统的端视图。
图7是例示了例示性实施方式中的感应焊接温度与散热器温度之间的关系的图表。
图8是例示了例示性实施方式中的检测到的电压与感应电流之间的关系的图表。
图9是例示了例示性实施方式中的用于经由线性光纤传感器监视温度的方法的流程图。
图10是例示性实施方式中的监测温度的线性光纤传感器的立体图。
图11是例示性实施方式中的线性光纤传感器的透视图。
图12是描绘了例示性实施方式中的线性光纤传感器测得的一连串温度的图表。
图13是例示性实施方式中的飞行器制造和保养方法的流程图。
图14是例示性实施方式中的飞行器的框图。
具体实施方式
附图和以下描述提供了本公开的特定例示性实施方式。因此,将理解,本领域的技术人员将能够设计出各种布置,尽管这些布置未在本文中明确描述或示出,但这些布置实施本公开的原理并且被包括在本公开的范围内。此外,本文中描述的任何示例旨在帮助理解本公开的原理,并且将被解释为不限于这种具体阐述的示例和条件。结果,本公开不限于下述的特定实施方式或示例,而是由权利要求书及其等同物限定。
图1是例示性实施方式中的感应焊接系统100的框图。感应焊接系统100包括能进行操作以产生磁场的任何系统、装置或部件,这些磁场感应加热热塑性复合零件之间的界面,以便形成感应焊接。在该实施方式中,感应焊接系统100包括机器人110,机器人100包括控制器112和存储器114,控制器112和存储器114用于管理包括致动器115和刚性体117的运动链116的操作。通过控制运动链116的运动,可以调节承载感应线圈119的末端执行器118的位置、速度和/或方向。控制器112还可以控制施加到感应线圈119的电流量,以便增加或减少由感应线圈119产生的磁场。这进而控制了期望进行感应焊接的层压件120-121之间的焊接界面130的温度。例如,控制器112可以被实现为定制电路、执行编程指令的硬件处理器或其某种组合。控制器112还可以按照存储在存储器114中的数控(NC)程序中的指令来指导机器人110的各种部件进行操作。
感应线圈119响应于施加的电流而产生磁场。产生的磁场强度基于施加的电流量。因此,感应线圈119可以被可控地调节,以便产生所期望强度的磁场。
由于感应线圈119的设计,感应线圈119产生的磁场在接近层压件120-121之间的焊接界面130处最强。响应于受到的磁场,纤维124-125(例如,碳纤维)像感受器一样进行操作并产生热。这增加了层压件120-121处的热塑性塑料122-123的温度,从而致使热塑性塑料122-123达到玻璃化转变温度。在玻璃化转变温度下,层压件120中的热塑性塑料122与另一个层压件121中的热塑性塑料123融合或焊接在一起。这样将层压件120-121中的热塑性塑料122-123合并成一体物质,该一体物质被冷却成单个热塑性塑料基质。热塑性塑料122-123可以包含诸如聚醚醚酮(PEEK)、聚醚酮酮(PEKK)等这样的任何合适的热塑性塑料。心轴150在执行感应焊接期间支撑层压件。
散热器140与焊接界面130被层压件120-121中的一个或更多个分隔开,在焊接界面130处发生感应焊接。散热器140从层压件120的表面132吸收热并散发热。这确保了在层压件120内在焊接界面130(例如,层压件的焊接界面)处产生的热没有致使表面132(例如,层压件的一部分)超过玻璃化转变温度(这将导致层压件120和/或层压件121的不期望的结构改变)。
在该实施方式中,传感器160被内置在散热器140内,并且在距焊接界面130的距离D处测量温度(或指示磁场强度的电压)。然而,在其他实施方式中,传感器160可被放置在散热器的左边缘或右边缘处,或焊接界面130的左边缘或右边缘处,或层压件121的下方。基于焊接界面130处的温度与散热器140处的温度之间的已知关系(或者基于测得的磁场强度与施加到感应线圈119的电流之间的已知关系),可以确定在焊接界面130处执行的感应焊接的温度。传感器160可以包括热电偶或电磁场(EMF)传感器(例如,具有含至少两百个回路的校准回路的EMG传感器),诸如被设计用于以1至5MHz之间的取样速率进行操作以获取测量值的传感器。在其他实施方式中,传感器160包括测量温度的红外(IR)传感器。
将针对图2至图3讨论感应焊接系统100的操作的例示性细节。对于该实施方式,假定为了形成感应焊接已经彼此贴着地铺放了多个热塑性层压件,感应焊接使层压件成为单个一体复合零件。例如,这可包括在启动感应焊接之前将复合零件/层压件放置成与另一复合零件/层压件接触。
图2是例示了例示性实施方式中的用于基于远程检测到的温度来操作感应焊接系统的方法200的流程图。虽然参照图1的感应焊接系统100描述了方法200的步骤,但是本领域的技术人员将理解,可在其他系统中执行方法200。本文中描述的流程图的步骤并不全面,可包括未示出的其他步骤。也可按替代顺序执行本文中描述的步骤。
在步骤202中,控制器112启动沿着复合零件的焊接界面(例如,沿着层压件120处的焊接界面130)的感应焊接,该复合零件包括通过纤维124增强的热塑性塑料122的基质。沿着层压件120的交接处执行感应焊接。启动感应焊接可以包括:向感应线圈119施加电流以便产生磁场;以及沿着焊接线移动感应线圈119,以便沿着相当大的距离(例如,几英尺到许多英尺)融合来自两个不同层压件的热塑性塑料。在其他实施方式中,感应线圈119相对于层压件120-121移动,层压件120-121相对于感应线圈119移动,或者执行其某种组合。
焊接复合零件/层压件包括响应于施加的磁场而在复合零件/层压件的纤维124内产生热。焊接线的宽度可以明显小于长度,并且可以例如为1英寸或更小,而焊接线可以继续任何可行的距离(例如,数百英尺)。
在步骤204中,控制器112确定复合零件的一部分(例如,表面132)的远程温度,该部分在感应焊接期间经由传导从焊接界面(例如,焊接界面130)接收热。即,控制器112可查询来自传感器160的温度数据以确定表面132的温度,在该实施方式中,传感器160被设置在散热器140处。表面132已被层压件120-121内的纤维124-125感应加热。该热由散热器140控制,以吸收从在焊接界面130下方和上方的纤维124-125产生的热。可一直、周期性(例如,每1毫秒、每10毫秒等)或在某些处理检查点(例如,在末端执行器118移动到新位置之后的一定时间量)获取温度读数。
在步骤206中,控制器112在感应焊接期间基于远程温度来确定复合零件的焊接界面(例如,焊接界面130)处的焊接温度。在一些实施方式中,该确定是基于从实验结果确定的已知相关性进行的。例如,控制器112可查阅模型(例如,线性模型或其他模型),以基于先前通过实验证明的结果,基于来自传感器160的输入来推导焊接界面130处的温度。在一个实施方式中,基于远程温度以及该部分(例如,表面132)与焊接界面(例如,焊接界面130)之间的距离来确定焊接温度的推断。
控制器112还可存储与指示末端执行器118沿着焊接线的位置的信息相关的该温度信息,以便随后报告给技术人员。该报告可包括指示焊接界面130处的温度是否在所期望范围内的图形或文本系列的陈述。
在其他实施方式中,控制器112可以基于所确定的焊接温度来实时控制施加到感应线圈119的电流量。这使得控制器112能够通过调节磁场强度来控制感应焊接。例如,如果焊接温度在超过阈值时间段(例如,几毫秒)内低于所期望的操作范围,则控制器112可以增大施加到感应线圈119的电流量。或者,如果焊接温度在超过阈值时间段(例如,几毫秒)内高于所期望的操作范围,则控制器112可以减小施加到感应线圈119的电流量。在其他实施方式中,控制器112基于推断出的焊接温度来调节末端执行器118沿着焊接线移动的速度。以这种方式,控制器112可以基于焊接温度来控制感应焊接。控制器112还可控制沿着焊接线的感应焊接的速率。
方法200提供了优于现有技术的显著优点,因为它使得感应焊接的温度能够经由远程感测装置来准确确定。因此,在焊接界面处不需要感测装置,这使设置和执行感应焊接的复杂度和成本降低。这样就不再需要在焊接界面130处添加用于测量焊接温度的元件。这样的元件将使得在所期望公差内产生焊缝更加困难,并且将在结构中添加重量。此外,因为方法200能够沿着整个焊接线准确地推断感应焊接温度,因此执行方法200的技术人员能够快速且高效地识别沿着焊接线的可能期望进一步检查的位置。
图3是例示了例示性实施方式中的用于基于指示磁场强度的远程检测到的电压来操作感应焊接系统的方法300的流程图。虽然参照图1的感应焊接系统100描述了方法300中的步骤,但是本领域的技术人员将理解,可在其他系统中执行方法300。
在步骤302中,控制器112通过操作感应线圈19启动沿着第一复合零件的焊接界面(例如,沿着层压件120处的焊接界面130)的感应焊接,该第一复合零件包括通过纤维124增强的热塑性塑料122的基质。执行该步骤是为了将第一复合零件与第二复合零件(例如,层压件121)接合。启动感应焊接可包括:向感应线圈119施加电流以便产生磁场;以及将感应线圈119沿着焊接线移动,以便沿着相当大的距离(例如,具有几英尺到许多英尺的长度)融合来自两个不同层压件的热塑性塑料。焊接线的宽度可明显小于长度,并且可例如为1英寸或更小。
在步骤304中,控制器112确定在与感应线圈119不同的位置处的测得的磁场强度。(例如,在散热器140内的传感器160处)。在一个实施方式中,该步骤包括控制器112测量传感器160处的均方根(RMS)电压,并且基于测得的RMS电压与场强之间的已知关系来确定测得的磁场强度。可一直、周期性(例如,每1毫秒、每10毫秒等)或在某些处理检查点(例如,在末端执行器118移动到新位置之后的一定时间量)获取这些读数。
在步骤306中,控制器112在感应焊接期间基于测得的磁场强度与阈值磁场强度之间的差异来确定第一复合零件的焊接界面(例如,焊接界面130)处的焊接温度。当纤维124被磁场加热时,用于在感应线圈119处产生磁场的能量被纤维124吸收。这使磁场强度降低。因此,磁场已经从阈值(诸如,在目前量的电流正被施加到感应线圈119的情况下没有层压件正从磁场吸收能量时的基线或预计量的强度)减小的量指示正用于加热焊接界面130的能量的量。该能量的量可通过实验测得,并且与焊接界面130处的特定温度相关。
为了推断焊接温度,控制器112可以查询模型(例如,线性模型或其他模型),以基于先前通过实验证明的结果,以来自传感器160的输入为基础来推导焊接界面130处的温度。控制器112还可以存储与指示末端执行器118沿着焊接线的位置的信息相关的该温度信息,以便随后报告给技术人员。该报告可包括指示焊接界面130处的温度是否在所期望范围内的图形或文本系列的陈述。
在一个实施方式中,基于测得的电压以及该部分(例如,表面132)与焊接界面(例如,焊接界面130)之间的距离来确定焊接温度的推断。在这样的实施方式中,确定焊接温度可以包括:基于RMS电压来计算感应线圈119处的电流,并且基于感应线圈处的电流来确定焊接温度。在其他实施方式中,涉及其他参数,包括焊接速度、散热器参数、任一层压件中的纤维层数、线圈与焊接线的距离、正被焊接的材料的厚度和类型等。
在其他实施方式中,控制器112可以基于所确定的焊接温度来实时控制施加到感应线圈119的电流量。例如,如果焊接温度在超过阈值时间段(例如,几毫秒)内低于所期望的操作范围,则控制器112可以增大施加到感应线圈119的电流量。或者,如果焊接温度在超过阈值时间段(例如,几毫秒)内高于所期望的操作范围,则控制器112可以减小施加到感应线圈119的电流量,以调节磁场强度。在其他实施方式中,控制器112可以基于推断出的焊接温度来调节末端执行器118沿着焊接线移动的速度,并且实时地识别沿着焊接线的超出公差位置。
确定、推断和控制的步骤可以在感应焊接期间在闭环中迭代地执行。以这种方式,控制器112基于感应线圈119的电流和末端执行器118的沿着层压件120的焊接界面(即,焊接界面130)的行进速度,对在感应焊接期间施加的功率量执行闭环控制。
方法300提供了优于现有技术的显著优点,因为它使得感应焊接的温度能够经由远程感测装置来实时地准确确定。因此,在焊接界面处不需要感测装置,这使设置和执行感应焊接的复杂度和成本降低。此外,因为方法300能够沿着整个焊接线(即,基于焊接道次期间测得的温度)准确地推断感应焊接温度,因此执行方法300的技术人员能够快速且高效地识别沿着焊接线的可能期望进一步检查的位置,甚至可在这些位置出现时识别它们。
图4是例示性实施方式中的操作感应线圈412以产生感应焊接的感应焊接系统400的立体图。图4未按比例绘制。在图4中,机器人410将感应线圈412沿着焊接方向414平移,以沿着层压件420与层压件430之间的焊接界面440产生具有最大场强的磁场。层压件430被铺在心轴460上,并且散热器450被设置在层压件420的顶部,以便散热。层压件420可被实现为宽面板,但是为了清楚起见以其当前的窄尺寸示出。在其他实施方式中,散热器450延伸超过焊接线,以控制从边缘442到边缘444的焊接线的结合温度。
图5是例示性实施方式中的操作感应线圈以产生感应焊接的图4的感应焊接系统的俯视图,并且对应于图4的视图箭头5。在图5中,如焊接线一样(例如,具有约1英寸的宽度并且从左到右地连续),描绘了散热器450。图5未按比例绘制,以便允许更有效地例示某些特征。还描绘了内置在每个散热器450内的传感器510(例如,E型热电偶、EMF传感器等)的阵列500。
尽管这些传感器未物理地接触焊接界面440,但是它们能够确定远程温度(或RMS电压),可以根据远程温度(或RMS电压)推断出焊接界面处的温度。
在一个实施方式中,当移动末端执行器时,控制器112识别阵列中的最靠近末端执行器或感应线圈设置的热电偶,并且通过操作该热电偶来确定远程温度。在另一实施方式中,控制器112识别阵列中的最靠近末端执行器或感应线圈设置的EMF传感器,并且经由EMF传感器的操作(例如,基于EMF传感器处所确定的电压)识别磁场强度。
在其他实施方式中,在感应焊接期间,传感器和末端执行器以相同的速度在相同的方向上跨复合零件行进,使得传感器在感应焊接过程的持续时间内保持被直接设置在末端执行器下方。换句话说,存在成对的EMF传感器和感应线圈,使得即使感应线圈没有移动而是焊接界面移动,线圈到EMF传感器的所期望定位也得以保持。
图6是例示性实施方式中的操作感应线圈以产生感应焊接的图4的感应焊接系统的端视图,并且对应于图4的视图箭头6。如图6中所示,传感器610、620和640可包括温度传感器,该温度传感器能够向操作感应线圈412的机器人的控制器报告远程温度。此外,传感器610、620、630、640、650和660可包括用于确定测得的磁场强度的RMS电压传感器或所有位置处的热电偶和磁场传感器二者。在其他实施方式中,感应焊接系统可以利用图6中描绘的传感器中的任一个或组合来推断焊接界面440处的温度。如图6中所示,心轴460以力F被压贴在层压件430上,以便确保层压件430和层压件420被充分压紧,以产生所期望强度的感应焊接。
图7是例示了例示性实施方式中的感应焊接温度与散热器温度之间的关系的图表700。在以上讨论的方法200的步骤206期间可考虑这些关系。在图7中,描绘了针对多种不同材料(例如,热塑性塑料或热塑性塑料与纤维的组合)中的每一种的焊接温度与散热器温度之间的关系。每种关系都被描绘为实验数据所支持的最佳拟合线(例如,线710、线720、线730)。该关系可被用于确定感应焊接是否正在所期望的操作范围740内执行。
图8是例示了例示性实施方式中的检测到的电压与感应电流之间的关系的图表800。在以上讨论的方法300的步骤306期间可考虑这些关系。在图8中,对于指示不同量的材料正被加热的多种不同情况(例如,线810是没有层压件,线820是有一个层压件,并且线830是有两个层压件),已知(由传感器)检测到的RMS电压与(施加到感应线圈的)感应电流之间的关系。每种关系都被描绘为实验数据所支持的最佳拟合线。可使用这些已知情况之间的差异来确定预计的磁场与测得的磁场之间的差异,该差异可表明感应焊接是否正在所期望的温度操作范围内执行。
在其他实施方式中,利用光纤传感器来沿着焊接线跟踪整个一连串的温度。图9是例示了例示性实施方式中的经由线性光纤传感器1100(图11)监视温度的方法900的流程图。方法900使得能够在执行感应焊接时实时地获取和更新整个一连串的温度。如本文中讨论的,由线性光纤传感器1100执行的感测基于发生在传感器内部的瑞利散射(RayleighScattering)。可观察到这种现象,以确定温度变化导致的传感器尺寸的变化。具体地,测得的光频率的变化可指示传感器处的温度变化。
在步骤902中,将线性光纤传感器1100沿着复合零件定位在焊接线处,该复合零件包括通过纤维增强的热塑性塑料的基质。线性光纤传感器1100包括沿着预计的焊接线行进的细长线。在一些实施方式中,焊接线遵循轮廓,并且线性光纤传感器1100适形于该轮廓。线性光纤传感器1100包括感测元件,这些感测元件的长度响应于温度变化以及响应于施加的力而变化。线性光纤传感器1100还可包括罩,该罩屏蔽线性光纤传感器1100的元件以在执行感应焊接的同时免受物理应变。在一个实施方式中,罩是刚性的,并且在感应焊接期间基本上不热膨胀,这意味着罩不产生使元件拉伸的应变。
在步骤904中,经由线性光纤传感器1100沿着焊接线测量温度。这可包括测量来自激光器的光从线性光纤传感器1100的端部行进到线性光纤传感器1100内的元件的参考光频移。在该过程期间,控制器操作激光器以沿线性光纤传感器1100传输光。在线性光纤传感器1100内的每个元件处,激光中的一部分被朝向激光器反射回。通过在激光器的光到达每个元件并从其返回时测量激光的光学频移,构造一连串基线、环境温度光学频移。在其他实施方式中,这些技术还被用于制造的复合零件内,以便测量应变变化而非温度变化(或者将应变变化与温度变化一起测量)。可利用应变的测量值来实时地确定复合零件在服役时接头的应力/负载。
在步骤906中,在复合零件处沿着焊接线(可平行于线性光纤传感器1100)执行感应焊接。在感应焊接期间,复合零件被加热,并且该热经由传导被传递到线性光纤传感器1100。线性光纤传感器1100的加热导致光纤传感器的元件热膨胀,这样使元件的长度增加,因此改变来自横穿线性光纤传感器1100的来自激光器的光的频率。这些频移是能测量的,并且能够与已知温度相关。
在步骤908中,控制器测量焊接光频移,这些焊接光频移是在正执行感应焊接的同时当来自激光器的光从线性光纤传感器1100的端部行进到元件时光的光频率的变化。在步骤910中,控制器例如基于元件的参考光频移和焊接光频移之间的差异来确定沿着焊接线的一连串焊接温度。在一个实施方式中,控制器通过以下步骤来确定沿着焊接线的一连串焊接温度:基于元件中的每一个的参考光频移与焊接光频移之间的差异来沿着线性光纤传感器100确定传感器温度,并且基于传感器温度与焊接温度之间的已知关系用每个传感器温度来确定焊接温度。已知关系可以基于制成复合零件的材料、复合零件的厚度、复合零件内的纤维取向以及线性光纤传感器1100与焊接线的距离。在一个实施方式中,确定沿着焊接线的一连串焊接温度包括确定在彼此间隔小于1毫米的多个位置(例如,各自对应于线性光纤传感器1100的不同元件)中的每一个处的焊接温度。
在步骤912中,控制器基于这一连串焊接温度来控制感应焊接。控制感应焊接包括调节感应线圈在焊接线上方的速度、调节施加到感应线圈的电流量或执行其他操作来管理沿着这一连串温度的一个或更多个位置处测得的温度。
在其他实施方式中,线性光纤传感器1100被设置在复合零件内,并且出于检查或通信的目的,在复合零件中利用线性光纤传感器1100来传输光信号。在其他实施方式中,线性光纤传感器1100被设置在被焊接在一起的纤维增强复合物中的任一个内。因此,线性光纤传感器1100成为被焊接在一起的结构内的一体纤维。然后,在焊接完成之后使用线性光纤传感器1100,以便在操作和维护期间监视结合接头的健康状况。例如,可经由线性光纤传感器1100监视在结合接头处承受的应变。
图10是例示性实施方式中的监测温度的线性光纤传感器1100的立体图。图10例示了在环境1000内,线性光纤传感器1100可被设置在成形在心轴1030上的复合零件1020和复合零件1010之间的焊接线1022附近的位置1040、1060和/或1070处。线性光纤传感器1100甚至可被设置在复合零件中的一个内的位置1050处或其他位置处。这些位置包括被设置在焊接线1022的任一侧、焊接线1022上方、或甚至焊接线1022下方在心轴1030内、正好焊接线本身上方、可如以上讨论地设置热电偶的任何位置中的位置。
图11是例示性实施方式中的线性光纤传感器的透视图,并且对应于图10的视图箭头11。根据图11,线性光纤传感器1100包括罩1110(也被称为护套),罩1100用作元件1120的物理屏蔽件,所述物理屏蔽件保护元件1120免受因外力引起的物理应变。元件1120是光学透明的,并且各自延伸不到1毫米。每个元件1120都反射由激光器1130产生的光1134的一部分。例如,在该实施方式中,被反射部分1136被提供回到激光器1130,并且这些被反射部分的定时指示行进的距离。当元件1120中的一个被加热时,其长度从基线长度(L)增加至更大长度(L+Δ)。这导致能被检测的光频率有差异。因此,可以基于光频率的变化通过实验确定元件1120中的每一个处的温度。基于元件1120与焊接线的距离和正被加热的材料的类型,元件1120中的每一个处的温度与焊接线处的温度相关。
图12是描绘了例示性实施方式中的线性光纤传感器测得的一连串温度1210的图表。根据图12,一连串温度1210由沿着线性光纤传感器的长度确定的温度构成,并且被实时更新。区域1230中的温度已经下降至阈值水平1220以下。基于该信息,控制器确定将在区域1230处执行感应焊接线圈的附加道次。在其他实施方式中,作为执行附加道次的补充或替代,调节线圈强度或者调节线圈速度,以增加在焊接线处产生的热的量。
实例
在以下实例中,在感应焊接系统的背景下描述附加的过程、系统和方法。
更具体地参照附图,可在如图13中所示的飞行器制造和保养方法1300和如图14中所示的飞行器1302的背景下描述本公开的实施方式。在生产前过程中,方法1300可包括飞行器1302的规格和设计1304和材料采购1306。在生产期间,执行飞行器1302的部件和子组件制造1308和系统整合1310。此后,飞行器1302可经过检定和交付1312,以便投入服役1314。在被客户投入服役期间,飞行器1302被安排进行维护保养1316的例行工作(也可包括改造、重构、翻新等)。可在方法1300中描述的生产和保养的任一个或更多个合适阶段(例如,规格和设计1304、材料采购1306、部件和子组件制造1308、系统整合1310、认证和交付1312、服役1314、维护保养1316)期间和/或飞行器1302的任何合适部件(例如,机身1318、系统1320、内部1322、推进系统1324、电气系统1326、液压系统1328、环境系统1330)中采用本文中实施的设备和方法。
可由系统集成商、第三方及/或运营商(例如,客户)进行或执行方法1300的处理中的每一个。出于本描述的目的,系统集成商可包括但不限于任一数量的飞行器制造商与主系统分包商;第三方可包括但不限于任一数量的供应商、转包商以及供货商;并且运行方可以是航空公司、租赁公司、军事实体、服务组织等。
如图14中所示,用方法1300生产的飞行器1302可包括具有多个高级系统1320和内部1322的机身1318。系统1320的示例包括推进系统1324、电气系统1326、液压系统1328和环境系统1330中的一个或更多个。可包括任何数量的其他系统。尽管示出了航空航天的示例,但是本发明的原理可应用于诸如汽车工业这样的其他工业。
如以上已经提到的,可在方法1300中描述的生产和维护的任一个或更多个阶段期间采用本文中实施的设备和方法。例如,能以类似于飞行器1302在服役时生产部件或子组件的方式,制成或制造与部件和子组件制造1308对应的部件或子组件。另外,可在子组件制造1308和系统整合1310期间,例如,通过大幅地加快飞行器1302的组装或减少飞行器1302的成本,利用一个或更多个设备实施方式、方法实施方式或其组合。类似地,可在飞行器1302在服役(例如而不限于维护和保养1316期间)时利用设备实施方式、方法实施方式或其组合中的一个或更多个。例如,本文中描述的技术和系统可用于材料采购1306、部件和子组件制造1308、系统整合1310、服役1314和/或维护和保养1316、和/或可用于机身1318和/或内部1322。这些技术和系统甚至可用于系统1320,这些系统包括例如推进系统1324、电气系统1326、液压系统1328和/或环境系统1330。
在一个实施方式中,零件包括机身1318的一部分,并且在部件和子组件制造1308期间制造。然后,可在系统整合1310中将零件组装到飞行器上,然后在服役1314中利用,直到磨损致使零件无法使用为止。然后,在维护和保养1316中,零件可被丢弃并被新制造的零件替换。为了制造新零件,可在整个部件和子组件制造1308中利用本发明的部件和方法。
图中示出或本文中描述的各种控制元件(例如,电气或电子部件)中的任一个都可被实现为硬件、实现软件的处理器、实现固件的处理器或这些的某种组合。例如,元件可被实现为专用硬件。专用硬件元件可被称为“处理器”、“控制器”或一些类似术语。当由处理器提供时,这些功能可由单个专用处理器、单个共享处理器或多个单独的处理器提供,这些处理器中的一些可被共享。此外,术语“处理器”或“控制器”的明确使用不应被解释为排他性地指能够执行软件的硬件,并且可隐含地包括而不限于数字信号处理器(DSP)硬件、网络处理器、专用集成电路(ASIC)或其他电路、现场可编程门阵列(FPGA)、用于存储软件的只读存储器(ROM)、随机存取存储器(RAM)、非易失性存储器、逻辑器件、或某种其他物理硬件部件或模块。
另外,控制元件可被实现为可由处理器或计算机执行以执行该元件的功能的指令。指令的一些示例是软件、程序代码和固件。指令在由处理器执行时是可操作的,以指导处理器执行元件的功能。指令可被存储在处理器可读的存储装置上。存储装置的一些示例是数字或固态存储器、诸如磁盘和磁带这样的磁存储介质、硬驱动器或光学可读数字数据存储介质。
尽管本文中描述了特定的实施方式,但是本公开的范围不限于那些特定的实施方式。本公开的范围由随附权利要求书及其任何等同物限定。
出于完整性的原因,在以下编号的条款中阐述了本发明的各个方面。
条款1.一种用于控制复合零件的焊接的方法,该方法包括以下步骤:
将线性光纤传感器沿着复合零件定位,该复合零件包括通过纤维增强的热塑性塑料的基质;
经由所述线性光纤传感器测量沿着焊接线的温度;
沿着所述焊接线在所述复合零件处执行感应焊接;
确定沿着所述焊接线的一连串焊接温度;以及
基于所述一连串焊接温度来控制所述感应焊接。
条款2.根据条款1所述的方法,其中:
测量所述温度包括:在执行所述感应焊接之前,测量从所述线性光纤传感器的端部行进到所述线性光纤传感器内的元件的激光的参考光频移。
条款3.根据条款1或2中任一项所述的方法,其中:
所述焊接线平行于所述线性光纤传感器。
条款4.根据条款1至3中任一项的方法,所述方法还包括以下步骤:
测量所述温度包括:在正执行所述感应焊接的同时,测量从所述线性光纤传感器的端部行进到所述线性光纤传感器内的元件的激光的焊接光频移。
条款5.根据条款4所述的方法,其中:
测量所述温度是基于所述线性光纤传感器的元件的参考光频移与焊接光频移之间的差异进行的。
条款6.根据条款1至5中任一项所述的方法,其中,
确定沿着所述焊接线的所述一连串焊接温度包括:确定在彼此间隔小于1毫米的多个位置中的每一个处的焊接温度。
条款7.根据条款1至6中任一项的方法,所述方法还包括以下步骤:
屏蔽所述线性光纤传感器的元件以在执行所述感应焊接的同时免受物理应变。
条款8.根据条款1至7中任一项所述的方法,其中,
所述焊接线遵循轮廓,并且所述方法还包括使所述线性光纤传感器适形于所述轮廓。
条款9.根据条款1至8中任一项所述的方法,其中:
确定沿着所述焊接线的所述一连串焊接温度包括以下步骤:
基于所述线性光纤传感器的多个元件中的每一个的参考光频移与焊接光频移之间的差异,确定沿着所述线性光纤传感器的传感器温度;以及
基于所述传感器温度与焊接温度之间的已知关系,用每个传感器温度确定焊接温度。
条款10.根据条款9所述的方法,其中:
所述已知关系基于制成所述复合零件的材料、厚度、纤维取向以及所述线性光纤传感器与所述焊接线的距离。
条款11.根据条款1至10中任一项所述的方法,其中:
所述线性光纤传感器被设置在所述复合零件内。
条款12.根据条款1至11中任一项所述的方法组装的飞行器的一部分。
条款13.一种实施编程指令的非暂态计算机可读介质,所述编程指令在由处理器执行时能进行操作,以执行用于控制复合零件的焊接的方法,所述方法包括以下步骤:
将线性光纤传感器沿着复合零件定位,该复合零件包括通过纤维增强的热塑性塑料的基质;
经由所述线性光纤传感器测量沿着焊接线的温度;
沿着所述焊接线在所述复合零件处执行感应焊接;
确定沿着所述焊接线的一连串焊接温度;以及
基于所述一连串焊接温度来控制所述感应焊接。
条款14.根据条款13所述的介质,其中:
测量所述温度包括:在执行所述感应焊接之前,测量从所述线性光纤传感器的端部行进到所述线性光纤传感器内的元件的激光的参考光频移。
条款15.根据条款13或14所述的介质,其中:
所述焊接线平行于所述线性光纤传感器。
条款16.根据条款13至15中任一项所述的介质,其中,所述方法还包括以下步骤:
测量所述温度包括:在正执行所述感应焊接的同时,测量从所述线性光纤传感器的端部行进到所述线性光纤传感器内的元件的激光的焊接光频移。
条款17.根据条款16所述的介质,其中:
测量所述温度是基于所述元件的所述参考光频移与所述焊接光频移之间的差异进行的。
条款18.根据条款13至17中任一项所述的介质,其中:
确定沿着所述焊接线的所述一连串焊接温度包括:确定在彼此间隔小于1毫米的多个位置中的每一个处的焊接温度。
条款19.根据条款13至18中任一项所述的介质,其中,所述方法还包括以下步骤:
屏蔽所述线性光纤传感器的元件以在执行所述感应焊接的同时免受物理应变。
条款20.根据条款13至19中任一项所述的介质,其中:
所述焊接线遵循轮廓,并且所述方法还包括使所述线性光纤传感器适形于所述轮廓。
条款21.根据条款13至21中任一项所述的介质,其中:
确定沿着所述焊接线的所述一连串焊接温度包括以下步骤:
基于所述线性光纤传感器的多个元件中的每一个的参考光频移与焊接光频移之间的差异,确定沿着所述线性光纤传感器的传感器温度;以及
基于所述传感器温度与焊接温度之间的已知关系,用每个传感器温度确定焊接温度。
条款22.根据条款21所述的介质,其中:
所述已知关系基于制成所述复合零件的材料、厚度、纤维取向以及所述线性光纤传感器与所述焊接线的距离。
条款23.根据条款13至22中任一项所述的介质,其中:
所述线性光纤传感器被设置在所述复合零件内。
条款24.一种根据在条款13至23中任一项所述的计算机可读介质上存储的指令所定义的方法组装的飞行器的一部分。
条款25.一种用于促成复合零件的焊接的设备,该设备包括:
末端执行器,其产生电磁场,所述电磁场致使所述复合零件的焊接线产生热,从而导致感应焊接;
线性光纤传感器,其沿着所述焊接线被设置在所述复合零件处;以及
控制器,其经由所述线性光纤传感器测量沿着所述焊接线的温度,确定沿着所述焊接线的一连串焊接温度以及基于所述一连串焊接温度来控制所述感应焊接。
条款26.根据条款25所述的设备,其中:
所述控制器通过以下步骤来测量温度:在感应焊接之前,测量从所述线性光纤传感器的端部行进到所述线性光纤传感器内的元件的激光的参考光频移;以及在正执行所述感应焊接的同时,测量从所述线性光纤传感器的端部行进到所述线性光纤传感器内的元件的激光的焊接光频移。
条款27.根据条款26所述的设备,其中:
所述一连串温度基于所述线性光纤传感器的元件的参考光频移与焊接光频移之间的差异。
条款28.根据条款25至27中任一项所述的设备,其中:
所述控制器通过确定在彼此间隔小于1毫米的多个位置中的每一个处的焊接温度来确定沿着所述焊接线的所述一连串焊接温度。
条款29.根据条款25至28中任一项的设备,所述设备还包括:
罩,其包围并屏蔽所述线性光纤传感器的元件以在所述感应焊接期间免受物理应变。
条款30.根据条款25至29中任一项所述的设备,其中:
所述焊接线遵循轮廓,并且所述线性光纤传感器适形于所述轮廓。
条款31.根据条款25至30中任一项所述的设备,其中:
所述控制器通过以下步骤来确定沿着所述焊接线的所述一连串焊接温度:基于所述线性光纤传感器的多个元件中的每一个的参考光频移与焊接光频移之间的差异,确定沿着所述线性光纤传感器的传感器温度;以及基于所述传感器温度与焊接温度之间的已知关系,用每个传感器温度确定焊接温度。
条款32.根据条款25至31中任一项所述的设备,其中:
所述线性光纤传感器被设置在所述复合零件内。
条款33.使用根据条款25至32中任一项所述的设备制造飞行器的一部分。
条款34.一种用于控制复合零件的焊接的方法,该方法包括以下步骤:
将线性光纤传感器沿着复合零件定位,该复合零包括通过纤维增强的热塑性塑料的基质;
在感应焊接之前,测量从所述线性光纤传感器的端部行进到所述线性光纤传感器内的元件的激光的参考光频移;
沿着焊接线在所述复合零件处执行感应焊接;
在感应焊接期间,测量从所述线性光纤传感器的端部行进到所述线性光纤传感器内的元件的激光的参考光频移;以及
基于在感应焊接之前和期间测得的参考光频移来控制所述感应焊接。
条款35.根据条款34所述的方法,其中:
基于在感应焊接之前和期间测得的参考光频移来确定感应焊接期间的一连串焊接温度。
条款36.根据条款34所述的方法,其中:
沿着平行于所述线性光纤传感器的线进行感应焊接。
条款37.根据条款34的方法,所述方法还包括以下步骤:
屏蔽所述线性光纤传感器的元件以在执行感应焊接的同时免受物理应变。
条款38.根据条款34所述的方法,其中:
确定沿着所述焊接线的一连串焊接温度包括以下步骤:
基于所述线性光纤传感器的多个元件中的每一个的参考光频移与焊接光频移之间的差异,确定沿着所述线性光纤传感器的传感器温度;以及
基于所述传感器温度与焊接温度之间的已知关系,用每个传感器温度确定焊接温度。
Claims (14)
1.一种用于控制复合零件的焊接的方法,该方法包括以下步骤:
将线性光纤传感器沿着复合零件定位,该复合零件包括通过纤维增强的热塑性塑料的基质;
经由所述线性光纤传感器测量沿着焊接线的温度;
沿着所述焊接线在所述复合零件处执行感应焊接;
确定沿着所述焊接线的一连串焊接温度;以及
基于所述一连串焊接温度来控制所述感应焊接,
其中,确定沿着所述焊接线的所述一连串焊接温度包括以下步骤:
基于所述线性光纤传感器的多个元件中的每一个的参考光频移与焊接光频移之间的差异,确定沿着所述线性光纤传感器的传感器温度;以及
基于传感器温度与焊接温度之间的已知关系,用每个传感器温度确定焊接温度,以及
其中,所述已知关系基于制成所述复合零件的材料、所述复合零件的厚度、所述复合零件内的纤维取向以及所述线性光纤传感器与所述焊接线的距离。
2.根据权利要求1所述的方法,其中:
测量所述温度包括:在执行所述感应焊接之前,测量从所述线性光纤传感器的端部行进到所述线性光纤传感器内的元件的激光的参考光频移。
3.根据权利要求1所述的方法,其中:
沿着平行于所述线性光纤传感器的线进行感应焊接。
4.根据权利要求1所述的方法,所述方法还包括以下步骤:
测量所述温度包括:在正执行所述感应焊接的同时,测量从所述线性光纤传感器的端部行进到所述线性光纤传感器内的元件的激光的焊接光频移。
5. 根据权利要求4所述的方法,其中:
测量所述温度包括:在执行所述感应焊接之前,测量从所述线性光纤传感器的端部行进到所述线性光纤传感器内的元件的激光的参考光频移,以及
测量所述温度是基于所述线性光纤传感器的元件的参考光频移与焊接光频移之间的差异进行的。
6.根据权利要求1所述的方法,其中:
确定沿着所述焊接线的所述一连串焊接温度包括:确定在彼此间隔小于1毫米的多个位置中的每一个处的焊接温度。
7.根据权利要求1所述的方法,所述方法还包括以下步骤:
屏蔽所述线性光纤传感器的元件以在执行所述感应焊接的同时免受物理应变。
8.根据权利要求1所述的方法,其中:
所述线性光纤传感器被设置在所述复合零件内。
9.一种根据权利要求1所述的方法组装的飞行器的一部分。
10.一种用于促成复合零件的焊接的设备,该设备包括:
末端执行器,其产生电磁场,所述电磁场致使复合零件的焊接线产生热,从而导致感应焊接;
线性光纤传感器,其沿着所述焊接线被设置在所述复合零件处;以及
控制器,其经由所述线性光纤传感器测量沿着所述焊接线的温度,确定沿着所述焊接线的一连串焊接温度以及基于所述一连串焊接温度来控制所述感应焊接,
其中,确定沿着所述焊接线的所述一连串焊接温度包括以下步骤:
基于所述线性光纤传感器的多个元件中的每一个的参考光频移与焊接光频移之间的差异,确定沿着所述线性光纤传感器的传感器温度;以及
基于传感器温度与焊接温度之间的已知关系,用每个传感器温度确定焊接温度,以及
其中,所述已知关系基于制成所述复合零件的材料、所述复合零件的厚度、所述复合零件内的纤维取向以及所述线性光纤传感器与所述焊接线的距离。
11.根据权利要求10所述的设备,其中:
所述控制器通过确定在彼此间隔小于1毫米的多个位置中的每一个处的焊接温度来确定沿着所述焊接线的所述一连串焊接温度。
12.根据权利要求10所述的设备,所述设备还包括:
罩,其包围和屏蔽所述线性光纤传感器的元件以在所述感应焊接期间免受物理应变。
13.根据权利要求10所述的设备,其中:
所述焊接线遵循轮廓,并且所述线性光纤传感器适形于所述轮廓。
14.根据权利要求10所述的设备,其中:
所述线性光纤传感器被设置在所述复合零件内。
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