CN112337860A - Cleaning equipment for chip production - Google Patents
Cleaning equipment for chip production Download PDFInfo
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- CN112337860A CN112337860A CN202010927325.XA CN202010927325A CN112337860A CN 112337860 A CN112337860 A CN 112337860A CN 202010927325 A CN202010927325 A CN 202010927325A CN 112337860 A CN112337860 A CN 112337860A
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- cleaning
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/02—Cleaning by the force of jets or sprays
- B08B3/022—Cleaning travelling work
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/08—Cleaning involving contact with liquid the liquid having chemical or dissolving effect
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F26—DRYING
- F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
- F26B21/00—Arrangements or duct systems, e.g. in combination with pallet boxes, for supplying and controlling air or gases for drying solid materials or objects
- F26B21/004—Nozzle assemblies; Air knives; Air distributors; Blow boxes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
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- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
The invention relates to a cleaning device for chip production, which comprises a main body, a workbench, a water storage box, a connecting pipe, a spray pipe, a plurality of spray heads, a cleaning mechanism and a rotating mechanism, wherein the rotating mechanism comprises a placing plate, two rotating assemblies and two supporting rods, each rotating assembly comprises a rotating gear, a first bearing, a rotating shaft, a worm wheel, a worm and a transmission unit, the cleaning mechanism comprises a connecting box, two driving assemblies, a plurality of nozzles and a plurality of branch pipes, each driving assembly comprises a motor, a driving shaft, a driving rod, an air bag, a spring, a fixing plate, a pressing plate, an air inlet pipe and an air outlet pipe, the cleaning device for chip production drives a wafer to rotate through the rotating mechanism, can spray cleaning liquid to each part of the wafer, enlarges the cleaning range, and can blow off the cleaning liquid adhered to the wafer by blowing to the wafer through the cleaning mechanism, the wafer is prevented from being oxidized and generating defects because the wafer is covered by the cleaning liquid for a long time.
Description
Technical Field
The invention relates to the field of chips, in particular to a cleaning device for chip production.
Background
The cleaning equipment is an equipment for effectively removing the impurities of micro-dust, metal ions and organic matters remained on the wafer by using chemical solution or gas on the premise of not damaging the surface characteristics and the electrical characteristics of the wafer.
When cleaning the wafer, the existing cleaning equipment is fixed with the spray head, so that the spray range of the spray head is limited, the wafer can not be cleaned sufficiently, the cleaning quality is reduced, and moreover, when cleaning the wafer, the cleaning solution is easily covered on the wafer, if the cleaning solution is not removed in time, the wafer surface is easily oxidized to generate defects, the performance of the wafer is influenced, and the reliability of the existing cleaning equipment is reduced.
Disclosure of Invention
The technical problem to be solved by the invention is as follows: in order to overcome the defects of the prior art, a cleaning device for chip production is provided.
The technical scheme adopted by the invention for solving the technical problems is as follows: a cleaning device for chip production comprises a main body, a workbench, a water storage box, a connecting pipe, a spraying pipe and a plurality of spray heads, wherein the workbench is fixed at the bottom in the main body, the water storage box is fixed at the top in the main body, the spraying pipe is communicated with the inside of the water storage box through the connecting pipe, cleaning liquid is arranged in the water storage box, the spray heads are uniformly arranged on the spraying pipe and are communicated with the spraying pipe, the spray heads are arranged towards the workbench, a valve is arranged inside the connecting pipe, a PLC is arranged inside the main body and is electrically connected with the PLC, the cleaning device further comprises a cleaning mechanism and a rotating mechanism, a notch is arranged above the workbench, the notch is circular, the rotating mechanism is arranged inside the notch, the cleaning mechanism is arranged on the workbench, and the cleaning mechanism is connected with the rotating mechanism;
the rotating mechanism comprises a placing plate, two rotating assemblies and two supporting rods, the placing plate is in a ring shape, the placing plate and a notch are coaxially arranged, the two supporting rods are symmetrically arranged relative to the axis of the placing plate, an annular groove is formed in the bottom of the notch, one end of each supporting rod is fixedly connected with the lower portion of the placing plate, the other end of each supporting rod is arranged inside the annular groove, the other end of each supporting rod is matched with the annular groove, fixed teeth are uniformly fixed on the periphery of the placing plate in the circumferential direction, the two rotating assemblies are symmetrically arranged relative to the axis of the placing plate, the rotating assemblies are connected with the fixed teeth, and the rotating assemblies are connected with the cleaning mechanism;
the rotating assembly comprises a rotating gear, a first bearing, a rotating shaft, a worm wheel, a worm and a transmission unit, the first bearing is fixed at the bottom in the notch, two ends of the rotating shaft are respectively and fixedly connected with an inner ring of the first bearing and the rotating gear, the rotating gear is meshed with fixed teeth, the worm wheel is fixed on the rotating shaft and meshed with the worm, two round holes are formed in the workbench and correspond to the transmission unit one by one, the worm is connected with the transmission unit, and the transmission unit is connected with the cleaning mechanism;
the cleaning mechanism comprises a connecting box, two driving assemblies, a plurality of nozzles and a plurality of branch pipes, wherein the number of the nozzles is equal to that of the branch pipes, the nozzles are in one-to-one correspondence with the branch pipes, the connecting box is annular, the inner ring of the connecting box is fixedly connected with the periphery of the workbench, the two driving assemblies are symmetrically arranged about the axis of the connecting box, the driving assemblies are in one-to-one correspondence with the transmission units, the driving assemblies are connected with the connecting box, the nozzles are uniformly fixed above the workbench in the circumferential direction, the nozzles are communicated with the connecting box through the branch pipes, and the nozzles are arranged towards the placing plate;
the utility model discloses a pneumatic control valve, including main body, drive assembly, fixed plate, clamp plate, intake pipe and outlet duct, drive assembly includes motor, drive shaft, actuating lever, gasbag, spring, fixed plate, clamp plate, intake pipe and outlet duct, the motor is fixed on the inner wall of main part, the motor is connected with the one end transmission of drive shaft, the one end and the drive shaft fixed connection of actuating lever, the fixed plate is fixed on the connecting box, the clamp plate level sets up the top at the fixed plate, the top and the below of gasbag respectively with the below of clamp plate and the top fixed connection of fixed plate, one side and the intake pipe intercommunication of the connecting box of keeping away from of gasbag, the inside intercommunication of outlet duct and connecting box is passed through to the opposite side of gasbag, all be equipped with the check valve in intake pipe and the outlet duct, the check.
Preferably, in order to transmit power, the transmission unit includes a second bearing, a connecting shaft, a first gear and a second gear, the second bearing is fixed on an inner wall of the main body, one end of the connecting shaft is fixedly connected with an inner ring of the second bearing, the other end of the connecting shaft passes through the circular hole and is arranged inside the notch, the other end of the connecting shaft is fixedly connected with the worm, the connecting shaft and the worm are coaxially arranged, the first gear and the second gear are respectively fixedly connected with the connecting shaft and the driving shaft, and the first gear is engaged with the second gear.
Preferably, in order to reduce wear, the driving assembly further comprises a ball, a notch is formed in one end, away from the driving shaft, of the driving rod, the ball is matched with the notch, and the center of the ball is arranged inside the notch.
Preferably, in order to limit the moving direction of the pressing plate, the driving assembly further comprises two limiting blocks, the two limiting blocks are fixedly connected with two ends of one side, close to the connecting box, of the pressing plate respectively, four sliding grooves are formed in the connecting box, the sliding grooves correspond to the limiting blocks one to one, the limiting blocks are arranged inside the sliding grooves and matched with the sliding grooves, the limiting blocks are connected with the sliding grooves in a sliding mode, and the sliding grooves are dovetail grooves.
Preferably, the motor is a servo motor for precise and stable operation of the motor.
Preferably, in order to make the connecting shaft rotate smoothly, lubricating oil is coated on the first gear and the second gear.
Preferably, in order to realize the anti-skid function, anti-skid lines are arranged above the placing plate.
Preferably, in order to improve the spraying effect, the spray head is an atomizing spray head.
Preferably, in order to avoid the support rod from being separated from the annular groove, the annular groove is a dovetail groove.
Preferably, in order to control the operation of the equipment, a plurality of keys are fixed on the inner wall of the main body and electrically connected with the PLC.
The invention has the advantages that the cleaning equipment for chip production can drive the wafer to rotate through the rotating mechanism, so that the spray head can spray cleaning solution to all parts of the wafer, thereby enlarging the cleaning range, leading the wafer to be cleaned fully and improving the cleaning quality, compared with the prior rotating mechanism, the rotating mechanism can provide the cleaning solution adhered on the placing plate with a force towards the direction far away from the axis of the placing plate through the action of centrifugal force, leading the cleaning solution to be distributed uniformly at all parts above the wafer, thereby improving the cleaning effect, leading the spray nozzle to blow air to the wafer through the cleaning mechanism, thereby blowing off the cleaning solution adhered on the wafer, avoiding the secondary pollution of the wafer caused by the cleaning solution adhered on the wafer, avoiding the defect of the wafer due to the fact that the wafer is covered by the cleaning solution for a long time and being oxidized, thereby improving the reliability of the equipment, compared with the existing cleaning mechanism, the cleaning mechanism and the rotating mechanism are integrated into a linkage mechanism, and the same driving source is adopted, so that the use of electric energy is reduced, and the environmental protection of equipment is improved.
Drawings
The invention is further illustrated with reference to the following figures and examples.
FIG. 1 is a schematic structural view of a cleaning apparatus for chip production according to the present invention;
FIG. 2 is a schematic structural view of a cleaning mechanism of the cleaning apparatus for chip production of the present invention;
FIG. 3 is an enlarged view of portion A of FIG. 2;
FIG. 4 is a top view of a cleaning mechanism of the cleaning apparatus for chip production of the present invention;
in the figure: 1. the automatic spraying device comprises a main body, 2 parts of a workbench, 3 parts of a water storage box, 4 parts of a connecting pipe, 5 parts of a spraying pipe, 6 parts of a spray head, 7 parts of a placing plate, 8 parts of a supporting rod, 9 parts of a rotating gear, 10 parts of a rotating shaft, 11 parts of a worm wheel, 12 parts of a worm, 13 parts of a connecting shaft, 14 parts of a first gear, 15 parts of a second gear, 16 parts of a motor, 17 parts of a driving shaft, 18 parts of a driving rod, 19 parts of a ball, 20 parts of a pressing plate, 21 parts of an air bag, 22 parts of a spring, 23 parts of a fixing plate, 24 parts of an air inlet pipe, 25 parts of an air outlet pipe, 26 parts of a connecting.
Detailed Description
The present invention will now be described in further detail with reference to the accompanying drawings. These drawings are simplified schematic views illustrating only the basic structure of the present invention in a schematic manner, and thus show only the constitution related to the present invention.
As shown in figure 1, a cleaning device for chip production comprises a main body 1, a workbench 2, a water storage box 3, a connecting pipe 4, a spraying pipe 5 and a plurality of spray heads 6, wherein the workbench 2 is fixed at the bottom in the main body 1, the water storage box 3 is fixed at the top in the main body 1, the spraying pipe 5 is communicated with the inside of the water storage box 3 through the connecting pipe 4, cleaning liquid is arranged in the water storage box 3, the spray heads 6 are uniformly arranged on the spraying pipe 5, the spray heads 6 are communicated with the spraying pipe 5, the spray heads 6 are arranged towards the workbench 2, a valve is arranged inside the connecting pipe 4, a PLC is arranged inside the main body 1 and electrically connected with the PLC, the cleaning device further comprises a cleaning mechanism and a rotating mechanism, a notch is arranged above the workbench 2, the shape of the notch is circular, the rotating mechanism is arranged inside the notch, the cleaning mechanism is arranged on the workbench 2, the cleaning mechanism is connected with the rotating mechanism;
PLCs, i.e., programmable logic controllers, are generally used for the processing of data and the receipt and output of instructions for central control. When cleaning the wafer during operation, the user places the wafer in the top of placing board 7, and control flap opens, and the cleaning solution in the water storage box 3 of being convenient for passes through the inside of connecting pipe 4 leading-in spray pipe 5, again with in the leading-in shower nozzle 6 of cleaning solution for shower nozzle 6 sprays the cleaning solution to the wafer, has realized the function of clean wafer.
This a cleaning equipment for chip production passes through slewing mechanism, can drive the wafer and rotate, make shower nozzle 6 can spray the cleaning solution to each of wafer, thereby the clear scope has been enlarged, make the wafer can be by abundant washing, the cleaning quality has been improved, through clean mechanism, make nozzle 28 blow to the wafer, thereby can blow off the cleaning solution of adhesion on the wafer, avoid the cleaning solution adhesion on the wafer and cause the secondary pollution of wafer, avoid the wafer to be covered by the cleaning solution for a long time and the defect appears by the oxidation, thereby the reliability of equipment has been improved.
As shown in fig. 1-2, the rotating mechanism includes a placing plate 7, two rotating assemblies and two supporting rods 8, the placing plate 7 is in a ring shape, the placing plate 7 is coaxially arranged with a notch, the two supporting rods 8 are symmetrically arranged about the axis of the placing plate 7, an annular groove is arranged at the bottom inside the notch, one end of each supporting rod 8 is fixedly connected with the lower part of the placing plate 7, the other end of each supporting rod 8 is arranged inside the annular groove, the other end of each supporting rod 8 is matched with the annular groove, fixing teeth are uniformly fixed on the periphery of the placing plate 7 in the circumferential direction, the two rotating assemblies are symmetrically arranged about the axis of the placing plate 7, the rotating assemblies are connected with the fixing teeth, and the rotating assemblies are connected with the cleaning mechanism;
the rotating assembly comprises a rotating gear 9, a first bearing, a rotating shaft 10, a worm wheel 11, a worm 12 and a transmission unit, the first bearing is fixed at the bottom in the notch, two ends of the rotating shaft 10 are fixedly connected with an inner ring of the first bearing and the rotating gear 9 respectively, the rotating gear 9 is meshed with fixed teeth, the worm wheel 11 is fixed on the rotating shaft 10, the worm wheel 11 is meshed with the worm 12, two circular holes are formed in the workbench 2, the circular holes correspond to the transmission unit one by one, the worm 12 is connected with the transmission unit, and the transmission unit is connected with the cleaning mechanism;
when performing the cleaning work, the user places the wafer on the placing plate 7, the cleaning mechanism works, so that the transmission unit works, thereby driving the worm 12 to rotate, and through the meshing of the worm 12 and the worm wheel 11, the worm wheel 11 rotates, thereby driving the rotating shaft 10 to rotate, enabling the rotating gear 9 to rotate, enabling the fixed teeth to rotate through the meshing of the rotating gear 9 and the fixed teeth, thereby driving the placing plate 7 to rotate, so that the wafer rotates, thereby the spray head 6 can spray cleaning solution to all parts of the wafer, thereby enlarging the cleaning range, leading the wafer to be fully cleaned, improving the cleaning effect, by the action of the centrifugal force, a force is given to the cleaning liquid adhering to the placing plate 7 in a direction away from the axis of the placing plate 7, the cleaning liquid can be uniformly distributed at all positions above the wafer, so that the cleaning effect is improved.
As shown in fig. 2 to 4, the cleaning mechanism includes a connection box 26, two driving assemblies, a plurality of nozzles 28 and a plurality of branch pipes 27, the number of the nozzles 28 is equal to the number of the branch pipes 27, the nozzles 28 correspond to the branch pipes 27 one by one, the connection box 26 is annular, the inner ring of the connection box 26 is fixedly connected with the outer circumference of the worktable 2, the two driving assemblies are symmetrically arranged about the axis of the connection box 26, the driving assemblies correspond to the transmission units one by one, the driving assemblies are connected with the transmission units, the driving assemblies are connected with the connection box 26, the nozzles 28 are uniformly fixed above the worktable 2 in the circumferential direction, the nozzles 28 are communicated with the connection box 26 through the branch pipes 27, and the nozzles 28 are arranged toward the placing plate 7;
the driving component comprises a motor 16, a driving shaft 17, a driving rod 18, an air bag 21, a spring 22, a fixing plate 23, a pressure plate 20, an air inlet pipe 24 and an air outlet pipe 25, the motor 16 is fixed on the inner wall of the main body 1, the motor 16 is connected with one end of a driving shaft 17 in a transmission way, one end of the driving rod 18 is fixedly connected with the driving shaft 17, the fixing plate 23 is fixed on the connecting box 26, the pressing plate 20 is horizontally arranged above the fixing plate 23, the upper part and the lower part of the air bag 21 are respectively and fixedly connected with the lower part of the pressing plate 20 and the upper part of the fixing plate 23, one side of the air bag 21 far away from the connecting box 26 is communicated with an air inlet pipe 24, the other side of the air bag 21 is communicated with the inside of the connecting box 26 through an air outlet pipe 25, check valves are arranged in the air inlet pipe 24 and the air outlet pipe 25 and electrically connected with the PLC, and two ends of the spring 22 are respectively connected with the top and the bottom of the air bag 21.
When rinsing the wafer, drive motor 16 starts, drive shaft 17 rotates, make actuating lever 18 rotate, make actuating lever 18 can be intermittent type lean on and make clamp plate 20 move down with clamp plate 20, compress air bag 21, make the inside of the leading-in connecting box 26 of air in the air bag 21 through outlet duct 25, in the leading-in nozzle 28 of rethread branch pipe 27, make nozzle 28 blow to the wafer, thereby can blow off the cleaning solution of adhesion on the wafer, avoid the cleaning solution adhesion to cause the secondary pollution of wafer on the wafer, avoid the wafer to be covered by the cleaning solution for a long time and the oxidation defect appears, thereby the reliability of equipment has been improved, along with the flow of cleaning solution, can take away the impurity of adhesion on the wafer, the function of dust removal has been realized, thereby cleaning effect has been promoted.
Preferably, in order to transmit power, the transmission unit includes a second bearing, a connecting shaft 13, a first gear 14 and a second gear 15, the second bearing is fixed on the inner wall of the main body 1, one end of the connecting shaft 13 is fixedly connected with the inner ring of the second bearing, the other end of the connecting shaft 13 passes through the circular hole and is arranged inside the notch, the other end of the connecting shaft 13 is fixedly connected with the worm 12, the connecting shaft 13 is coaxially arranged with the worm 12, the first gear 14 and the second gear 15 are respectively fixedly connected with the connecting shaft 13 and the driving shaft 17, and the first gear 14 is meshed with the second gear 15.
When the driving shaft 17 rotates, the second gear 15 is driven to rotate, and the first gear 14 is driven to rotate by the meshing of the first gear 14 and the second gear 15, so that the connecting shaft 13 is driven to rotate, the worm 12 can be driven to rotate, and the function of transmitting power is realized.
Preferably, in order to reduce wear, the driving assembly further comprises a ball 19, the end of the driving rod 18 away from the driving shaft 17 is provided with a notch, the ball 19 is matched with the notch, and the center of the ball 19 is arranged inside the notch.
When the driving rod 18 abuts against the pressure plate 20, the friction force generated when the driving rod 18 abuts against the pressure plate 20 is reduced through the arranged balls 19, so that the abrasion of the pressure plate 20 is reduced, and the service life of the pressure plate 20 is prolonged.
Preferably, in order to limit the moving direction of the pressing plate 20, the driving assembly further includes two limiting blocks 29, the two limiting blocks 29 are respectively and fixedly connected with two ends of one side of the pressing plate 20 close to the connecting box 26, the connecting box 26 is provided with four sliding grooves, the sliding grooves are in one-to-one correspondence with the limiting blocks 29, the limiting blocks 29 are arranged inside the sliding grooves, the limiting blocks 29 are matched with the sliding grooves, the limiting blocks 29 are slidably connected with the sliding grooves, and the sliding grooves are dovetail grooves.
When the pressing plate 20 moves, the limiting block 29 is driven to move along the sliding groove, so that the moving direction of the pressing plate 20 is limited, and the pressing plate 20 is more stable when moving.
Preferably, the motor 16 is a servo motor in order to allow precise and stable operation of the motor 16.
Preferably, in order to make the connecting shaft 13 smoothly rotate, the first gear 14 and the second gear 15 are both coated with lubricating oil, so that the friction force between the first gear 14 and the second gear 15 is reduced, the first gear 14 and the second gear 15 smoothly rotate, and the smoothness of the connecting shaft 13 during rotation is improved.
Preferably, in order to realize the anti-skid function, anti-skid lines are arranged above the placing plate 7.
When placing the wafer on placing board 7, through the anti-skidding line that sets up, increased the wafer and placed the frictional force between the board 7 for the wafer is difficult to drop from placing board 7, also can drive the wafer rotation when making to place board 7 and rotate simultaneously.
Preferably, the spray head 6 is an atomizing spray head in order to improve the spraying effect.
Preferably, in order to avoid the support bar 8 from being disengaged from the annular groove, the annular groove is a dovetail groove.
Preferably, a plurality of keys 30 are fixed on the inner wall of the main body 1 for controlling the operation of the device, and the keys 30 are electrically connected with the PLC.
Through setting up button 30, the user can be through pressing different button 30 with this opening and close of control valve and the opening and close of motor 16 to can controlgear work, improved the intelligent degree of equipment.
When performing the cleaning work, the user places the wafer on the placing plate 7, the cleaning mechanism works, so that the transmission unit works, thereby driving the worm 12 to rotate, and through the meshing of the worm 12 and the worm wheel 11, the worm wheel 11 rotates, thereby driving the rotating shaft 10 to rotate, enabling the rotating gear 9 to rotate, enabling the fixed teeth to rotate through the meshing of the rotating gear 9 and the fixed teeth, thereby driving the placing plate 7 to rotate, so that the wafer rotates, thereby the spray head 6 can spray cleaning solution to all parts of the wafer, thereby enlarging the cleaning range, leading the wafer to be fully cleaned, improving the cleaning effect, by the action of the centrifugal force, a force is given to the cleaning liquid adhering to the placing plate 7 in a direction away from the axis of the placing plate 7, the cleaning liquid can be uniformly distributed at all positions above the wafer, so that the cleaning effect is improved. When rinsing the wafer, drive motor 16 starts, drive shaft 17 rotates, make actuating lever 18 rotate, make actuating lever 18 can be intermittent type lean on and make clamp plate 20 move down with clamp plate 20, compress air bag 21, make the inside of the leading-in connecting box 26 of air in the air bag 21 through outlet duct 25, in the leading-in nozzle 28 of rethread branch pipe 27, make nozzle 28 blow to the wafer, thereby can blow off the cleaning solution of adhesion on the wafer, avoid the cleaning solution adhesion to cause the secondary pollution of wafer on the wafer, avoid the wafer to be covered by the cleaning solution for a long time and the oxidation defect appears, thereby the reliability of equipment has been improved, along with the flow of cleaning solution, can take away the impurity of adhesion on the wafer, the function of dust removal has been realized, thereby cleaning effect has been promoted.
Compared with the prior art, the cleaning equipment for chip production can drive the wafer to rotate through the rotating mechanism, so that the spray head 6 can spray cleaning solution to all parts of the wafer, thereby enlarging the cleaning range, so that the wafer can be fully cleaned, the cleaning quality is improved, compared with the existing rotating mechanism, the rotating mechanism can provide the force of the cleaning solution adhered on the placing plate 7 to the direction far away from the axis of the placing plate 7 through the action of centrifugal force, so that the cleaning solution can be uniformly distributed at all parts above the wafer, thereby improving the cleaning effect, the nozzle 28 can blow the wafer through the cleaning mechanism, thereby blowing down the cleaning solution adhered on the wafer, avoiding the secondary pollution of the wafer caused by the cleaning solution adhered on the wafer, avoiding the wafer from being covered by the cleaning solution for a long time and being oxidized to generate defects, thereby improving the reliability of the equipment, compared with the existing cleaning mechanism, the cleaning mechanism and the rotating mechanism are integrated into a linkage mechanism, and the same driving source is adopted, so that the use of electric energy is reduced, and the environmental protection of equipment is improved.
In light of the foregoing description of the preferred embodiment of the present invention, many modifications and variations will be apparent to those skilled in the art without departing from the spirit and scope of the invention. The technical scope of the present invention is not limited to the content of the specification, and must be determined according to the scope of the claims.
Claims (10)
1. The utility model provides a cleaning equipment for chip production, includes main part (1), workstation (2), water storage box (3), even pipe (4), spray pipe (5) and a plurality of shower nozzle (6), bottom in main part (1) is fixed in workstation (2), the top in main part (1) is fixed in water storage box (3), spray pipe (5) are through even inside intercommunication of pipe (4) and water storage box (3), be equipped with the cleaning solution in water storage box (3), shower nozzle (6) evenly set up on spray pipe (5), shower nozzle (6) and spray pipe (5) intercommunication, shower nozzle (6) set up towards workstation (2), the inside of even pipe (4) is equipped with the valve, the inside of main part (1) is equipped with PLC, the valve is connected with the PLC electricity, its characterized in that still includes clean mechanism and slewing mechanism, a notch is arranged above the workbench (2), the notch is circular, the rotating mechanism is arranged inside the notch, the cleaning mechanism is arranged on the workbench (2), and the cleaning mechanism is connected with the rotating mechanism;
the rotating mechanism comprises a placing plate (7), two rotating assemblies and two supporting rods (8), the placing plate (7) is annular, the placing plate (7) and a notch are coaxially arranged, the two supporting rods (8) are symmetrically arranged relative to the axis of the placing plate (7), an annular groove is formed in the bottom of the notch, one end of each supporting rod (8) is fixedly connected with the lower portion of the placing plate (7), the other end of each supporting rod (8) is arranged in the annular groove, the other end of each supporting rod (8) is matched with the annular groove, fixing teeth are uniformly fixed on the periphery of the placing plate (7) in the circumferential direction, the two rotating assemblies are symmetrically arranged relative to the axis of the placing plate (7), the rotating assemblies are connected with the fixing teeth, and the rotating assemblies are connected with the cleaning mechanism;
the rotating assembly comprises a rotating gear (9), a first bearing, a rotating shaft (10), a worm wheel (11), a worm (12) and a transmission unit, the first bearing is fixed at the bottom in the notch, two ends of the rotating shaft (10) are fixedly connected with an inner ring of the first bearing and the rotating gear (9) respectively, the rotating gear (9) is meshed with fixed teeth, the worm wheel (11) is fixed on the rotating shaft (10), the worm wheel (11) is meshed with the worm (12), two round holes are formed in the workbench (2), the round holes correspond to the transmission unit one by one, the worm (12) is connected with the transmission unit, and the transmission unit is connected with the cleaning mechanism;
the cleaning mechanism comprises a connecting box (26), two driving assemblies, a plurality of nozzles (28) and a plurality of branch pipes (27), wherein the number of the nozzles (28) is equal to that of the branch pipes (27), the nozzles (28) correspond to the branch pipes (27) one by one, the connecting box (26) is annular, an inner ring of the connecting box (26) is fixedly connected with the periphery of the workbench (2), the two driving assemblies are symmetrically arranged relative to the axis of the connecting box (26), the driving assemblies correspond to the transmission units one by one, the driving assemblies are connected with the transmission units, the driving assemblies are connected with the connecting box (26), the nozzles (28) are uniformly fixed above the workbench (2) in the circumferential direction, the nozzles (28) are communicated with the connecting box (26) through the branch pipes (27), and the nozzles (28) are arranged towards the placing plate (7);
the driving assembly comprises a motor (16), a driving shaft (17), a driving rod (18), an air bag (21), a spring (22), a fixing plate (23), a pressing plate (20), an air inlet pipe (24) and an air outlet pipe (25), the motor (16) is fixed on the inner wall of the main body (1), the motor (16) is in transmission connection with one end of the driving shaft (17), one end of the driving rod (18) is fixedly connected with the driving shaft (17), the fixing plate (23) is fixed on a connecting box (26), the pressing plate (20) is horizontally arranged above the fixing plate (23), the upper part and the lower part of the air bag (21) are respectively fixedly connected with the lower part of the pressing plate (20) and the upper part of the fixing plate (23), one side of the air bag (21) far away from the connecting box (26) is communicated with the air inlet pipe (24), and the other side of the air bag (21) is communicated with the inside of the connecting box (26, the air inlet pipe (24) and the air outlet pipe (25) are internally provided with one-way valves which are electrically connected with the PLC, and two ends of the spring (22) are respectively connected with the top and the bottom of the air bag (21).
2. The cleaning apparatus for chip production according to claim 1, wherein the transmission unit comprises a second bearing, a connecting shaft (13), a first gear (14) and a second gear (15), the second bearing is fixed on the inner wall of the main body (1), one end of the connecting shaft (13) is fixedly connected with an inner ring of the second bearing, the other end of the connecting shaft (13) passes through the circular hole to be arranged inside the notch, the other end of the connecting shaft (13) is fixedly connected with the worm (12), the connecting shaft (13) is coaxially arranged with the worm (12), the first gear (14) and the second gear (15) are respectively fixedly connected with the connecting shaft (13) and the driving shaft (17), and the first gear (14) is meshed with the second gear (15).
3. The cleaning apparatus for chip production according to claim 1, wherein the driving assembly further comprises a ball (19), an end of the driving rod (18) away from the driving shaft (17) is provided with a notch, the ball (19) is matched with the notch, and a center of the ball (19) is arranged inside the notch.
4. The cleaning device for chip production according to claim 1, wherein the driving assembly further comprises two limiting blocks (29), the two limiting blocks (29) are respectively and fixedly connected with two ends of one side of the pressure plate (20) close to the connecting box (26), four sliding grooves are arranged on the connecting box (26), the sliding grooves correspond to the limiting blocks (29) one by one, the limiting blocks (29) are arranged inside the sliding grooves, the limiting blocks (29) are matched with the sliding grooves, the limiting blocks (29) are slidably connected with the sliding grooves, and the sliding grooves are dovetail grooves.
5. The cleaning apparatus for chip production according to claim 1, wherein the motor (16) is a servo motor.
6. The cleaning apparatus for chip production according to claim 2, wherein the first gear (14) and the second gear (15) are each coated with a lubricating oil.
7. The cleaning apparatus for chip production according to claim 1, wherein the placing plate (7) is provided with anti-slip lines on the upper side.
8. The cleaning apparatus for chip production according to claim 1, wherein the spray head (6) is an atomizing spray head.
9. The cleaning apparatus for chip production according to claim 1, wherein the annular groove is a dovetail groove.
10. The cleaning equipment for chip production according to claim 1, wherein a plurality of keys (30) are fixed on the inner wall of the main body (1), and the keys (30) are electrically connected with the PLC.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010927325.XA CN112337860A (en) | 2020-09-07 | 2020-09-07 | Cleaning equipment for chip production |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010927325.XA CN112337860A (en) | 2020-09-07 | 2020-09-07 | Cleaning equipment for chip production |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112337860A true CN112337860A (en) | 2021-02-09 |
Family
ID=74357221
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010927325.XA Withdrawn CN112337860A (en) | 2020-09-07 | 2020-09-07 | Cleaning equipment for chip production |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112337860A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114887964A (en) * | 2022-04-29 | 2022-08-12 | 河北时硕微芯科技有限公司 | Cavity cleaning device for producing surface acoustic wave filter |
-
2020
- 2020-09-07 CN CN202010927325.XA patent/CN112337860A/en not_active Withdrawn
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114887964A (en) * | 2022-04-29 | 2022-08-12 | 河北时硕微芯科技有限公司 | Cavity cleaning device for producing surface acoustic wave filter |
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Application publication date: 20210209 |