CN112331756A - Plastic packaging device for light emitting diode - Google Patents
Plastic packaging device for light emitting diode Download PDFInfo
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- CN112331756A CN112331756A CN202011005764.1A CN202011005764A CN112331756A CN 112331756 A CN112331756 A CN 112331756A CN 202011005764 A CN202011005764 A CN 202011005764A CN 112331756 A CN112331756 A CN 112331756A
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- fixedly connected
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67109—Apparatus for thermal treatment mainly by convection
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/6776—Continuous loading and unloading into and out of a processing chamber, e.g. transporting belts within processing chambers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/005—Processes relating to semiconductor body packages relating to encapsulations
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Basic Packing Technique (AREA)
- Packaging Of Annular Or Rod-Shaped Articles, Wearing Apparel, Cassettes, Or The Like (AREA)
Abstract
The invention discloses a plastic package device of a light-emitting diode, which relates to the technical field of light-emitting diode production devices and aims at solving the problem of lower injection molding efficiency, and provides a scheme that the plastic package device comprises a package box, wherein two sides of the package box are respectively provided with a coiling machine, the outer wall of the coiling machine is provided with a placing device, two sides of the placing device are respectively and rotatably connected with a connecting rod which is rotatably connected with the coiling machine, the inner wall of the package box is fixedly connected with a partition plate, one side of the partition plate is provided with a conveying device which is positioned above the placing device, the conveying device is fixedly connected with a grouting device, and one side of the grouting device is provided with an auxiliary device which is fixedly connected with the package box. The production capacity is improved, and meanwhile, in the sealed packaging box, the influence of the external environment on packaging can be reduced, and the packaging is ensured.
Description
Technical Field
The invention relates to the technical field of light-emitting diode production devices, in particular to a plastic packaging device for a light-emitting diode.
Background
Light emitting diodes are referred to as LEDs for short. Is made of a compound containing gallium (Ga), arsenic (As), phosphorus (P), nitrogen (N), etc. When electrons and holes are recombined, visible light is radiated, so that the light-emitting diode can be manufactured. In circuits and instruments as indicator lights or to form text or numerical displays. Gallium arsenide diodes emit red light, gallium phosphide diodes emit green light, silicon carbide diodes emit yellow light, and gallium nitride diodes emit blue light. Organic light emitting diodes OLED and inorganic light emitting diodes LED are classified by their chemical properties.
In the production process of the light emitting diode, in order to guarantee the lighting effect and protect the luminescent material, the light emitting diode needs to be packaged, the existing packaging device generally adopts the mode that the support frame with the diode mounted in the lamp strip stops, then the injection molding is carried out, and then the efficiency of the whole production process is reduced, and partial productivity is influenced.
Disclosure of Invention
The plastic packaging device for the light emitting diode provided by the invention solves the problem of low injection molding efficiency.
In order to achieve the purpose, the invention adopts the following technical scheme:
the utility model provides a light emitting diode's plastic envelope device, includes the encapsulation case, the both sides of encapsulation case all are provided with around the book machine, be provided with placer on the outer wall of around the book machine, placer's both sides all rotate be connected with around the connecting rod that the book machine rotated and is connected, the inner wall fixedly connected with division board of encapsulation case, one side of division board is provided with the conveyor who is located the placer top, fixedly connected with grouting device on the conveyor, one side of grouting device is provided with the auxiliary device with encapsulation case fixed connection.
Preferably, the auxiliary device comprises a protection box fixedly connected with the packaging box, a ventilation plate is fixedly connected to the upper side of the protection box, a fan is fixedly connected to the lower side of the ventilation plate, and a heating wire fixedly connected with the protection box is arranged below the fan.
Preferably, conveyor include with the motor, the output of motor passes through shaft coupling fixedly connected with and encapsulates the case rotation axis of being connected, the fixed cup joint of outer wall of rotation axis has the sprocket, two the meshing is connected with the chain between the sprocket, two one side of chain is rotated and is connected with a plurality of restriction poles, and the other end and the slip casting device rotation of restriction pole are connected.
Preferably, the slip casting device includes the working plate that is connected with conveyor, a plurality of extrusion devices of fixedly connected with on the working plate, one side fixedly connected with connecting pipe of extrusion device, and the other end of connecting pipe connects netted pipe, one side of netted pipe is connected with the hose, and one side fixedly connected with swivelling joint pipe of hose, the one end of swivelling joint pipe rotate be connected with encapsulation case fixed connection's conveying pipeline, be connected with flow control valve on the connecting pipe.
Preferably, the extrusion device includes the temporary storage box with working plate fixed connection, the temporary storage box is linked together with the connecting pipe, a plurality of heating pipes of fixed fixedly connected with in the temporary storage box, the downside fixedly connected with telescopic link of temporary storage box, the output fixedly connected with carriage release lever of telescopic link, and the other end fixedly connected with of carriage release lever move the pipe, the inner wall of moving the pipe slides and cup joints the discharging pipe with temporary storage box fixed connection, the bottom fixedly connected with of moving the pipe combines the pipe.
Preferably, the placing device comprises a rotating rod rotatably connected with the connecting rod, the other end of the rotating rod is rotatably connected with a placing box, and a limiting frame is placed in the placing box.
Preferably, both sides of the placing device are fixedly sleeved with conductive bars, and the conductive bars are connected with the packaging box in a sliding manner.
Preferably, one side of the partition plate is provided with a first air outlet plate fixedly connected with the packaging box, the upper side of the first air outlet plate is fixedly connected with a first air inlet pipe, a first air suction plate fixedly connected with the packaging box is arranged below the first air outlet plate, and the lower side of the first air suction plate is fixedly connected with a first air outlet pipe.
Preferably, one side of the partition plate is provided with a second air outlet plate fixedly connected with the packaging box, the upper side of the second air outlet plate is fixedly connected with a second air inlet pipe, a second air suction plate fixedly connected with the packaging box is arranged below the second air outlet plate, and the lower side of the second air suction plate is fixedly connected with a second air outlet pipe.
The invention has the beneficial effects that:
1: through mutually supporting of a plurality of devices, can carry out the encapsulation work that does not shut down, and then reduce going on of shutting down, increase the efficiency of whole work, improve the productivity, simultaneously in inclosed encapsulation incasement, can reduce the influence of external environment to the encapsulation, guarantee going on of encapsulation.
2: through mutually supporting of a plurality of devices, can be earlier stage to the diode heating, the later stage cooling, and then when reducing the material internal stress of encapsulation, reduce the influence of the difference in temperature to the material, guarantee the solidification of resin, guarantee off-the-shelf quality.
Drawings
Fig. 1 is a schematic front sectional view of a plastic packaging device for a light emitting diode according to the present invention;
fig. 2 is a schematic left-side sectional view of a part of a plastic packaging device for a light emitting diode according to the present invention;
fig. 3 is a schematic front sectional view of a conveying device of a plastic packaging device for light emitting diodes according to the present invention;
fig. 4 is a schematic front sectional view of an auxiliary device of a plastic packaging device for light emitting diodes according to the present invention;
fig. 5 is a schematic cross-sectional front view of an extrusion device of a plastic packaging device for light emitting diodes according to the present invention;
fig. 6 is an enlarged schematic view of a position a of a plastic packaging device for a light emitting diode according to the present invention.
Reference numbers in the figures: 1. packaging the box; 2. an auxiliary device; 4. a first gas outlet plate; 5. a conveying device; 6. a grouting device; 7. a first intake pipe; 8. a partition plate; 9. a second intake pipe; 10. A second gas outlet plate; 12. a connecting rod; 13. a placement device; 14. a winding machine; 15. a second air outlet pipe; 16. a second suction plate; 17. a first air outlet pipe; 18. a first gas-absorbing panel; 19. a conductive rod; 20. a conductive strip; 21. a protective box; 22. a fan; 23. a gas permeable plate; 24. heating wires; 51. a rotating shaft; 52. a sprocket; 53. a chain; 54. a motor; 61. a working plate; 62. An extrusion device; 63. a connecting pipe; 64. a hose; 65. rotating the tube; 66. a delivery pipe; 67. A mesh tube; 621. a temporary storage box; 622. heating a tube; 623. a discharge pipe; 624. a coupling tube; 625. moving the tube; 626. a travel bar; 627. a telescopic rod; 131. placing the box; 132. a limiting frame; 133. rotating the rod.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments.
Referring to fig. 1-6, a plastic packaging device for light emitting diodes, comprising a packaging box 1, wherein two sides of the packaging box 1 are respectively provided with a winding machine 14, the outer wall of the winding machine 14 is provided with a placing device 13, two sides of the placing device 13 are respectively and rotatably connected with a connecting rod 12 rotatably connected with the winding machine 14, the inner wall of the packaging box 1 is fixedly connected with a partition plate 8, one side of the partition plate 8 is provided with a conveying device 5 positioned above the placing device 13, the conveying device 5 is fixedly connected with a grouting device 6, one side of the grouting device 6 is provided with an auxiliary device 2 fixedly connected with the packaging box 1, when in operation, firstly, the mounted diodes are placed on the placing device 13 through manual work or external automatic mechanical equipment, then the placing device 13 is driven by the winding machine 14 to enter the packaging box 1 through driving, and then the diodes are heated by the auxiliary device, the initial temperature is improved, the internal stress generated by the temperature difference during subsequent grouting is reduced, the heated diode continues to move and reaches the position below the conveying device 5, the conveying device 5 is debugged before working and is guaranteed to be the same as the moving speed of the placing device 13, at the moment, under the working of the winding machine 14 and the conveying device 5, the light-emitting diode and the grouting device 6 synchronously move to guarantee the completion of grouting, then the light-emitting diode moves to the outer side of the packaging box 1 along with the movement of the placing device 13 and is taken out through manual work or external automatic mechanical equipment, and the packaging work is completed.
Auxiliary device 2 includes protective housing 21 with 1 fixed connection of encapsulation case, the upside fixedly connected with gas permeable plate 23 of protective housing 21, the downside fixedly connected with fan 22 of gas permeable plate 23, the below of fan 22 is provided with and protective housing 21 fixed connection heater strip 24, when carrying out work, fan 22 is through external control, carry out work, and then make the gas of 1 upside of encapsulation case blow on heater strip 24, make the gas heated, the temperature risees, then blow on placer 13, carry out preliminary heating to the diode.
The conveying device 5 comprises a motor 54, the output end of the motor 54 is fixedly connected with a rotating shaft 51 which is rotatably connected with the packaging box 1 through a coupler, a chain wheel 52 is fixedly sleeved on the outer wall of the rotating shaft 51, a chain 53 is meshed between the two chain wheels 52, one side of the two chains 53 is rotatably connected with a plurality of limiting rods, the other ends of the limiting rods are rotatably connected with the grouting device 6, when the conveying device works, the rotating speed of the motor 51 can be controlled through controlling the motor 54, the rotating speeds of the rotating shaft 51 and the chain wheel 52 are further controlled, the moving speed of the chain 53 is further well controlled, the conveying device is suitable for the movement of the placing device 13, the movement of the grouting device 6 is further driven, the completion of grouting is ensured, the plurality of limiting rods ensure that the grouting device 6 is balanced and stable when the chain wheels are brought in a later period, and the limitation of a certain degree of freedom can be carried, the grouting device 6 is ensured to move,
the grouting device 6 comprises a working plate 61 connected with the conveying device 5, a plurality of extrusion devices 62 are fixedly connected to the working plate 61, one side of each extrusion device 62 is fixedly connected with a connecting pipe 63, the other end of each connecting pipe 63 is connected with a mesh-shaped pipe 67, one side of each mesh-shaped pipe 67 is connected with a hose 64, one side of each hose 64 is fixedly connected with a rotary pipe 65, one end of each rotary pipe 65 is rotatably connected with a conveying pipe 66 fixedly connected with the packaging box 1 through a rotary joint, each connecting pipe 63 is connected with a flow control valve, resin is heated and melted outside and then enters the rotary pipes 65 through the conveying pipes 66, further enters the extrusion devices 62 through the hoses 64, the mesh-shaped pipes 67 and the connecting pipes 63 and is extruded to complete work, and the flow control valves on the connecting pipes 63 control flow.
The extrusion device 62 comprises a temporary storage tank 621 fixedly connected with the working plate 61, the temporary storage tank 621 is communicated with the connecting pipe 63, a plurality of heating pipes 622 are fixedly connected in the temporary storage tank 621, an expansion link 627 is fixedly connected with the lower side of the temporary storage tank 621, an output end of the expansion link 627 is fixedly connected with a moving rod 626, the other end of the moving rod 626 is fixedly connected with a moving pipe 625, a discharge pipe 623 fixedly connected with the temporary storage tank 621 is sleeved on the inner wall of the moving pipe 625 in a sliding manner, a combining pipe 624 is fixedly connected with the bottom end of the moving pipe 625, when the extrusion work is carried out, the moving pipe 625 is moved through the work of the expansion link 627 to enter a mold for preparation, then the resin extruded in the connecting pipe 63 enters the temporary storage tank 621, further enters the moving pipe 625 through the discharge pipe 623, and further enters the combining pipe 624 for extrusion, and the work is completed, after the completion of the work, the telescopic rod 627 works synchronously, so that the moving pipe 625 is retracted to complete the work, wherein the heating pipe 622 performs the heating work in the working process to ensure the temperature of the raw material.
A first air outlet plate 4 fixedly connected with the packaging box 1 is arranged on one side of a partition plate 8, a first air inlet pipe 7 is fixedly connected with the upper side of the first air outlet plate 4, a first air absorbing plate 18 fixedly connected with the packaging box 1 is arranged below the first air outlet plate 4, a first air outlet pipe 17 is fixedly connected with the lower side of the first air absorbing plate 18, a second air outlet plate 10 fixedly connected with the packaging box 1 is arranged on one side of the partition plate 8, a second air inlet pipe 9 is fixedly connected with the upper side of the second air outlet plate 10, a second air absorbing plate 16 fixedly connected with the packaging box 1 is arranged below the second air outlet plate 10, a second air outlet pipe 15 is fixedly connected with the lower side of the second air absorbing plate 16, when the air conditioner works, inert gas can be introduced through the first air inlet pipe 7 and then discharged from the first air outlet plate 4, and then passes through the first air absorbing plate 18 and is discharged from the first air outlet pipe 17, so as to protect the work, meanwhile, during working, low-temperature nitrogen is introduced through the second air inlet pipe 9, discharged through the second air outlet plate 10 and discharged through the second air suction plate 16 and the second air outlet pipe 15, and cooling and protection are performed.
The working principle is as follows: firstly, the installed diode is placed on the placing device 13 through manual or external automatic mechanical equipment, then the placing device 13 is driven by the winding machine 14 to enter the packaging box 1, then the fan 22 is controlled by the outside to work, further the gas on the upper side of the packaging box 1 is blown onto the heating wire 24, the gas is heated, the temperature is increased, then the gas is blown onto the placing device 13 to primarily heat the diode, the initial temperature is increased, the internal stress generated by temperature difference during subsequent grouting is reduced, the heated diode continuously moves, the rotating speed of the motor 51 is controlled, the rotating speeds of the rotating shaft 51 and the chain wheel 52 are further controlled, further the moving speed of the chain 53 is well controlled, the moving speed of the placing device 13 is adapted, the moving of the working plate 61 is further driven, and the completion of grouting is ensured, the limiting rods ensure that the working plate 61 is balanced and stable normally and can limit a certain degree of freedom when a chain wheel is brought at a later stage, the working plate 61 moves at the same speed as the placing device 13, at the moment, under the work of the winding machine 14 and the conveying device 5, the light emitting diode and the extruding device 62 synchronously move, the telescopic rod 627 works to enable the moving pipe 625 to move and enter a mold for preparation, then resin extruded in the connecting pipe 63 enters the temporary storage box 621, further enters the moving pipe 625 through the discharge pipe 623, further enters the combining pipe 624 for extrusion and completion of work, after the work is completed, the telescopic rod 627 synchronously works to enable the moving pipe 625 to be retracted and complete the work, wherein the heating pipe 622 heats during the work to ensure the temperature of raw materials and ensure the completion of grouting, then, the placing device 13 moves to the outside of the packaging box 1, and the packaging box is taken out manually or by an external automatic mechanical device, thereby completing the packaging work.
In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", and the like, indicate orientations and positional relationships based on those shown in the drawings, and are used only for convenience of description and simplicity of description, and do not indicate or imply that the equipment or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be considered as limiting the present invention.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically defined otherwise.
The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be considered to be within the technical scope of the present invention, and the technical solutions and the inventive concepts thereof according to the present invention should be equivalent or changed within the scope of the present invention.
Claims (9)
1. The utility model provides a light emitting diode's plastic envelope device, includes encapsulation case (1), its characterized in that, the both sides of encapsulation case (1) all are provided with around a book machine (14), be provided with placer (13) on the outer wall around book machine (14), the both sides of placer (13) all rotate be connected with around a connecting rod (12) that book machine (14) rotate and be connected, the inner wall fixedly connected with division board (8) of encapsulation case (1), one side of division board (8) is provided with conveyor (5) that are located placer (13) top, fixedly connected with slip casting device (6) on conveyor (5), one side of slip casting device (6) is provided with auxiliary device (2) with encapsulation case (1) fixed connection.
2. The plastic packaging device for the light-emitting diode according to claim 1, wherein the auxiliary device (2) comprises a protection box (21) fixedly connected with the packaging box (1), a ventilation plate (23) is fixedly connected to the upper side of the protection box (21), a fan (22) is fixedly connected to the lower side of the ventilation plate (23), and a heating wire (24) fixedly connected with the protection box (21) is arranged below the fan (22).
3. The plastic packaging device for the light-emitting diodes as claimed in claim 1, wherein the conveying device (5) comprises a motor (54), the output end of the motor (54) is fixedly connected with a rotating shaft (51) rotatably connected with the packaging box (1) through a coupler, the outer wall of the rotating shaft (51) is fixedly sleeved with chain wheels (52), two chain wheels (52) are connected with chains (53) in a meshing manner, one side of each chain (53) is rotatably connected with a plurality of limiting rods, and the other ends of the limiting rods are rotatably connected with the grouting device (6).
4. The plastic packaging device for the light-emitting diode as claimed in claim 1, wherein the grouting device (6) comprises a work plate (61) connected with a conveying device (5), a plurality of extruding devices (62) are fixedly connected to the work plate (61), a connecting pipe (63) is fixedly connected to one side of each extruding device (62), the other end of each connecting pipe (63) is connected with a mesh pipe (67), a hose (64) is connected to one side of each mesh pipe (67), a rotating pipe (65) is fixedly connected to one side of each hose (64), a conveying pipe (66) fixedly connected with the packaging box (1) is rotatably connected to one end of each rotating pipe (65) through a rotating joint, and a flow control valve is connected to each connecting pipe (63).
5. The plastic packaging device for the light-emitting diode according to claim 4, wherein the extruding device (62) comprises a temporary storage box (621) fixedly connected with the working plate (61), the temporary storage box (621) is communicated with the connecting pipe (63), a plurality of heating pipes (622) are fixedly connected in the temporary storage box (621), an expansion link (627) is fixedly connected to the lower side of the temporary storage box (621), a moving rod (626) is fixedly connected to an output end of the expansion link (627), a moving pipe (625) is fixedly connected to the other end of the moving rod (626), a discharging pipe (623) fixedly connected with the temporary storage box (621) is slidably sleeved on the inner wall of the moving pipe (625), and a combining pipe (624) is fixedly connected to the bottom end of the moving pipe (625).
6. The plastic packaging device for the light-emitting diode as claimed in claim 1, wherein the placing device (13) comprises a rotating rod (133) rotatably connected with the connecting rod (12), and the other end of the rotating rod (133) is rotatably connected with a placing box (131), and the limiting frame (132) is placed in the placing box (131).
7. A device for encapsulating light-emitting diodes according to claim 1, characterized in that both sides of said holding device (13) are fixedly sleeved with conductive strips (20), said conductive strips (20) being slidably connected with conductive rods (19) fixedly connected with the encapsulating box (1).
8. The plastic packaging device for the light-emitting diodes as claimed in claim 1, wherein a first air outlet plate (4) fixedly connected with the packaging box (1) is arranged on one side of the partition plate (8), a first air inlet pipe (7) is fixedly connected to the upper side of the first air outlet plate (4), a first air suction plate (18) fixedly connected with the packaging box (1) is arranged below the first air outlet plate (4), and a first air outlet pipe (17) is fixedly connected to the lower side of the first air suction plate (18).
9. The plastic packaging device for the light-emitting diodes as claimed in claim 1, wherein a second air outlet plate (10) fixedly connected with the packaging box (1) is arranged on one side of the partition plate (8), a second air inlet pipe (9) is fixedly connected to the upper side of the second air outlet plate (10), a second air suction plate (16) fixedly connected with the packaging box (1) is arranged below the second air outlet plate (10), and a second air outlet pipe (15) is fixedly connected to the lower side of the second air suction plate (16).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011005764.1A CN112331756B (en) | 2020-09-22 | 2020-09-22 | Plastic packaging device for light emitting diode |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011005764.1A CN112331756B (en) | 2020-09-22 | 2020-09-22 | Plastic packaging device for light emitting diode |
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| Publication Number | Publication Date |
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| CN112331756A true CN112331756A (en) | 2021-02-05 |
| CN112331756B CN112331756B (en) | 2021-11-02 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202011005764.1A Active CN112331756B (en) | 2020-09-22 | 2020-09-22 | Plastic packaging device for light emitting diode |
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| CN114018546A (en) * | 2021-11-11 | 2022-02-08 | 星源电子科技(深圳)有限公司 | Flaw measurement auxiliary system for Micro-LED |
| CN114373853A (en) * | 2022-01-11 | 2022-04-19 | 深圳市华天迈克光电子科技有限公司 | Packaging device and stable component of high-power flip LED chip |
| CN116817198A (en) * | 2023-05-22 | 2023-09-29 | 长兴泛亚智慧照明有限公司 | Anti-dripping color RGB lamp assembly device and assembly process thereof |
| CN114373853B (en) * | 2022-01-11 | 2024-05-17 | 深圳市华天迈克光电子科技有限公司 | Packaging device for high-power flip LED chip |
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| CN114373853A (en) * | 2022-01-11 | 2022-04-19 | 深圳市华天迈克光电子科技有限公司 | Packaging device and stable component of high-power flip LED chip |
| CN114373853B (en) * | 2022-01-11 | 2024-05-17 | 深圳市华天迈克光电子科技有限公司 | Packaging device for high-power flip LED chip |
| CN116817198A (en) * | 2023-05-22 | 2023-09-29 | 长兴泛亚智慧照明有限公司 | Anti-dripping color RGB lamp assembly device and assembly process thereof |
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| CN112331756B (en) | 2021-11-02 |
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