CN112331587A - Purification chamber and semiconductor process equipment - Google Patents
Purification chamber and semiconductor process equipment Download PDFInfo
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- CN112331587A CN112331587A CN202011155222.2A CN202011155222A CN112331587A CN 112331587 A CN112331587 A CN 112331587A CN 202011155222 A CN202011155222 A CN 202011155222A CN 112331587 A CN112331587 A CN 112331587A
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- 238000000034 method Methods 0.000 title claims abstract description 60
- 238000000746 purification Methods 0.000 title claims abstract description 43
- 239000004065 semiconductor Substances 0.000 title claims abstract description 24
- 238000007789 sealing Methods 0.000 claims abstract description 203
- 238000005202 decontamination Methods 0.000 claims description 16
- 230000003588 decontaminative effect Effects 0.000 claims description 16
- 229920001971 elastomer Polymers 0.000 claims description 9
- 238000012545 processing Methods 0.000 claims description 8
- 239000006260 foam Substances 0.000 claims description 3
- 230000002093 peripheral effect Effects 0.000 claims description 3
- 239000007787 solid Substances 0.000 claims description 3
- 238000010926 purge Methods 0.000 description 10
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 9
- 229910052710 silicon Inorganic materials 0.000 description 9
- 239000010703 silicon Substances 0.000 description 9
- 230000003647 oxidation Effects 0.000 description 7
- 238000007254 oxidation reaction Methods 0.000 description 7
- 229920002635 polyurethane Polymers 0.000 description 5
- 239000004814 polyurethane Substances 0.000 description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 3
- 229920002943 EPDM rubber Polymers 0.000 description 3
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 239000007789 gas Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000004140 cleaning Methods 0.000 description 2
- 230000006835 compression Effects 0.000 description 2
- 238000007906 compression Methods 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 235000012239 silicon dioxide Nutrition 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- 238000013459 approach Methods 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005187 foaming Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/6719—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the processing chambers, e.g. modular processing chambers
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Gasket Seals (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention provides a purification chamber and semiconductor process equipment, wherein the purification chamber is used in the semiconductor equipment and is connected with a process chamber in the semiconductor equipment, the purification chamber comprises a chamber body, a first chamber cover and a second chamber cover, the chamber body is at least provided with a first chamber port and a second chamber port, the first chamber port is used for transmitting a workpiece to be processed with the process chamber, the second chamber port deviates from the first chamber port, and the first chamber cover and the second chamber cover are respectively used for opening and closing the first chamber port and the second chamber port; the purifying cavity further comprises a sealing structure, the sealing structure is at least arranged at the end part of the cavity body, which is positioned at the first cavity opening in a sealing mode, and is used for sealing the surface between the end part of the cavity body, which is positioned at the first cavity opening, and the first cavity cover when the first cavity cover closes the first cavity opening. The purification chamber and the semiconductor process equipment provided by the invention can improve the sealing property of the purification chamber and improve the process result.
Description
Technical Field
The invention relates to the technical field of semiconductor equipment, in particular to a purification chamber and semiconductor process equipment.
Background
When a vertical oxidation furnace is used as heat treatment process equipment to perform a silicon dioxide film growth process, in order to enable a silicon wafer to be processed to perform oxide film growth only in the vertical oxidation furnace so as to enable the silicon wafer to be processed to grow a silicon dioxide film without defects and uniformly, a purification chamber is required to be arranged in the vertical oxidation furnace equipment, the purification chamber is used for temporarily storing the silicon wafer to be processed and performing purification treatment on the silicon wafer to be processed, and the silicon wafer to be processed is enabled to be subjected to oxygen-free intervention in the whole process of entering the vertical oxidation furnace.
The decontamination chamber generally includes a chamber body having two chamber ports and two sealing covers for respectively opening or closing the two chamber ports. In the process that the silicon wafer to be processed enters the vertical oxidation furnace, firstly one sealing cover is opened, the silicon wafer to be processed is transmitted into the cavity body through one cavity opening, then high-purity nitrogen is introduced into the cavity body, the cavity body is purged to be in an oxygen-free environment, then the other sealing cover is opened, and the silicon wafer to be processed is transmitted into the vertical oxidation furnace through the other cavity opening for processing.
In the existing sealing mode of the sealing cover and the cavity opening, a sealing ring is usually arranged on the sealing cover, when the sealing cover and the cavity opening are closed, the end part of the cavity body, which is positioned at the cavity opening, is abutted against the sealing ring on the sealing cover so as to extrude the sealing ring, so that the sealing ring deforms to generate deformation force which is reacted with the end part of the cavity body, and a sealing structure is formed.
However, since the wall of the chamber body is thin, the end of the chamber body is in line contact with the sealing ring, and therefore if the end of the chamber body is not aligned with the surface axis of the sealing ring, or if the surface of the sealing ring is not flat due to quality problems or deformation of the sealing ring caused by external force, the sealing ring may not be tightly sealed with the end of the chamber body, resulting in poor sealing of the cleaning chamber.
Disclosure of Invention
The invention aims to at least solve one technical problem in the prior art, and provides a purification chamber and semiconductor process equipment, which can improve the sealing property of the purification chamber and improve the process result.
The invention provides a purification chamber used in a semiconductor device and connected with a process chamber in the semiconductor device, wherein the purification chamber comprises a chamber body, a first chamber cover and a second chamber cover, wherein the chamber body is at least provided with a first chamber port and a second chamber port, the first chamber port is used for transmitting a workpiece to be processed with the process chamber, the second chamber port is deviated from the first chamber port, and the first chamber cover and the second chamber cover are respectively used for opening and closing the first chamber port and the second chamber port;
the purification cavity further comprises a sealing structure, wherein the sealing structure is at least arranged at the end part of the cavity body, which is positioned at the first cavity opening in a sealing mode, and is used for sealing the surface between the end part of the cavity body, which is positioned at the first cavity opening, and the first cavity cover when the first cavity cover is closed.
Preferably, the sealing structure comprises an annular first resilient seal and an annular sealing protrusion, wherein the first resilient seal is configured to make surface contact with the first chamber lid when the first chamber lid closes the first chamber port to seal the surface of the chamber body between the end of the first chamber port and the first chamber lid;
the annular sealing convex part is connected with the first elastic sealing piece and the cavity body is located on one side, opposite to the end part of the first cavity opening, of the cavity body, the annular sealing convex part is provided with a supply, the cavity body is located in an annular groove, extending into the end part of the first cavity opening, of the cavity body is located in the annular groove, and the end part of the first cavity opening is connected with the annular groove in a sealing mode.
Preferably, the annular groove is glued to the end of the chamber body projecting into it at the first chamber port.
Preferably, the inner peripheral wall of the annular groove is provided with a convex part which is obliquely convex towards the end part of the chamber body located at the first chamber opening.
Preferably, the first resilient sealing member comprises a foam tube of sponge rubber.
Preferably, the sealing structure further comprises an annular second elastic sealing element, the second elastic sealing element is circumferentially arranged along the first elastic sealing element and connected with the first elastic sealing element, and the second elastic sealing element is used for being in contact with the first chamber cover together with the first elastic sealing element when the first chamber cover closes the first chamber opening so as to jointly perform multi-stage sealing between the end part of the chamber body located at the first chamber opening and the first chamber cover.
Preferably, the second elastic sealing member extends in a direction away from an inner side of the first elastic sealing member and is bent in a direction approaching the first chamber cover.
Preferably, the second resilient seal comprises a solid rubber strip.
Preferably, the purification chamber further comprises a pressure relief component, the pressure relief component is arranged on the chamber body, preset pressure is preset, and the pressure relief component is used for releasing the pressure inside the chamber body when the pressure inside the chamber body is greater than the preset pressure, so as to adjust the pressure inside the chamber body to the preset pressure.
Preferably, the sealing structure is further disposed at an end of the chamber body located at the second chamber opening, and is configured to perform surface sealing between the end of the chamber and the second chamber cover when the second chamber cover closes the corresponding second chamber opening.
The invention also provides semiconductor process equipment which comprises a process chamber and the purification chamber provided by the invention, wherein the purification chamber is connected with the process chamber in an on-off manner through the first chamber cover.
The invention has the following beneficial effects:
the purifying chamber provided by the invention has the advantages that the sealing structure is arranged at the end part of the chamber body positioned at the first chamber port, and the sealing structure and the end part of the chamber body positioned at the first chamber port are arranged in a sealing way, so that the sealing structure is sealed between the end part of the chamber body positioned at the first chamber port when the sealing structure is arranged at the end part of the chamber body positioned at the first chamber port, and the sealing structure can not be separated from the end part of the chamber body positioned at the first chamber port when the first chamber cover opens the first chamber port, therefore, the sealing structure and the end part of the chamber body positioned at the first chamber port can not be sealed tightly, in addition, because the surface of the contact between the first chamber cover and the sealing structure is a plane when the first chamber cover closes the first chamber port, and the area of the plane is larger than that of the chamber body positioned at the end part of the first chamber port, when the first chamber cover closes the first chamber port, the end part located at the first chamber opening relative to the chamber body can be in contact with the sealing structure in a larger area, so that the first chamber cover can form surface contact with the sealing structure when the first chamber opening is closed, and therefore when the first chamber opening is closed by the first chamber cover, the sealing structure can be used for performing surface sealing between the end part located at the first chamber opening and the first chamber cover of the chamber body, the sealing performance of the purification chamber can be improved, and the process result is improved.
The semiconductor process equipment provided by the invention can improve the sealing performance of the purification chamber by virtue of the purification chamber provided by the invention, and can improve the process result by connecting the purification chamber provided by the invention with the process chamber through the first chamber cover in a manner of being capable of being switched on and off.
Drawings
FIG. 1 is a schematic structural diagram of a decontamination chamber provided in accordance with an embodiment of the present invention;
FIG. 2 is a schematic diagram of a purge chamber and semiconductor processing equipment according to an embodiment of the present invention;
FIG. 3 is an enlarged cross-sectional view taken along line A-A of FIG. 1;
FIG. 4 is a schematic structural diagram of a sealing structure of a decontamination chamber provided by an embodiment of the invention;
FIG. 5 is an enlarged cross-sectional view taken along line B-B of FIG. 4;
description of reference numerals:
1-a process chamber; 2-a chamber body; 31-a first chamber lid; 32-a second chamber lid; 4-a sealing structure; 41-a first resilient sealing member; 42-annular sealing boss; 421-an annular groove; 422-convex part; 43-a second resilient seal; 5-a pressure relief component; 6-air intake and exhaust components; 71-a first lifting device; 72-second lifting device.
Detailed Description
In order to make those skilled in the art better understand the technical solution of the present invention, the following describes the purge chamber and the semiconductor processing apparatus provided by the present invention in detail with reference to the accompanying drawings.
As shown in fig. 1, the present embodiment provides a purge chamber, which is used in a semiconductor device and connected to a process chamber in the semiconductor device, and includes a chamber body 2, a first chamber lid 31 and a second chamber lid 32, where the chamber body 2 is at least provided with a first chamber port and a second chamber port, the first chamber port is used for transmitting a workpiece to be processed with the process chamber, the second chamber port deviates from the first chamber port, and the first chamber lid 31 and the second chamber lid 32 are respectively used for opening and closing the first chamber port and the second chamber port; the purification chamber further comprises a sealing structure 4, wherein the sealing structure 4 is at least arranged at the end part of the chamber body 2 located at the first chamber port in a sealing mode, and is used for sealing the surface between the end part of the chamber body 2 located at the first chamber port and the first chamber cover 31 when the first chamber cover 31 closes the first chamber port.
In the purification chamber provided by the embodiment, the sealing structure 4 is arranged at the end part of the chamber body 2 located at the first chamber port, and the sealing structure 4 and the end part of the chamber body 2 located at the first chamber port are arranged in a sealing manner, so that the sealing structure 4 is sealed between the end part of the chamber body 2 located at the first chamber port when the sealing structure is arranged at the end part of the chamber body 2 located at the first chamber port, and the sealing structure 4 is not separated from the end part of the chamber body 2 located at the first chamber port when the first chamber cover 31 opens the first chamber port, so that the sealing structure 4 and the end part of the chamber body 2 located at the first chamber port cannot be sealed tightly, and because the surface of the first chamber cover 31 contacting with the sealing structure 4 is a plane when the first chamber port is closed, and the area of the plane is larger than the area of the end part of the chamber body 2 located at the first chamber port, therefore, when the first chamber opening is closed, the first chamber cover 31 can have a larger area to be in contact with the sealing structure 4 relative to the end part of the chamber body 2 located at the first chamber opening, so that the first chamber cover 31 can form surface contact with the sealing structure 4 when the first chamber opening is closed, and therefore when the first chamber cover 31 closes the first chamber opening, the sealing structure 4 can perform surface sealing between the end part of the chamber body 2 located at the first chamber opening and the first chamber cover 31, the sealing performance of the purification chamber can be improved, and the process result is improved.
As shown in fig. 1, taking the case that the chamber body 2 is provided with a first chamber port and a second chamber port, the purification chamber comprises a first chamber cover 31 and a second chamber cover 32 for opening and closing the first chamber port and the second chamber port respectively, the chamber body 2 may be formed by an annular wall body, two ports of the annular wall body may be used as the first chamber port and the second chamber port, the end of the chamber body 2 located at the first chamber port and the end located at the second chamber port may be respectively provided with the sealing structures 4 in a sealing manner, or only the end of the chamber body 2 located at the first chamber port may be provided with the sealing structures 4 in a sealing manner, that is, there may be two sealing structures 4 or only one sealing structure, when there are two sealing structures 4, the two sealing structures 4 are respectively arranged at the end of the chamber body 2 located at the first chamber port and at the end located at the second chamber port, when there is one sealing structure 4, the sealing structure 4 is only arranged at the end part of the chamber body 2, which is located at the first chamber opening, in a sealing manner, the sealing structure 4 which is arranged at the end part of the chamber body 2, which is located at the first chamber opening, cannot move along with the movement of the first chamber cover 31 for opening and closing the first chamber opening, and the sealing structure 4 which is arranged at the end part of the chamber body 2, which is located at the first chamber opening, cannot move along with the movement of the second chamber cover 32 for opening and closing the second chamber opening.
The first chamber cover 31 and the second chamber cover 32 can respectively open and close the first chamber opening and the second chamber opening by arranging the first lifting device 71 and the second lifting device 72 on the chamber body 2, connecting the first lifting device 71 and the second lifting device 72 with the first chamber cover 31 and the second chamber cover 32 respectively, and driving the first chamber cover 31 and the second chamber cover 32 to lift and lower through the first lifting device 71 and the second lifting device 72 respectively so that the first chamber cover 31 and the second chamber cover 32 can respectively open and close the first chamber opening and the second chamber opening. However, the first chamber lid 31 and the second chamber lid 32 are not limited to the above-described embodiments in which the first chamber port and the second chamber port are opened and closed, respectively.
Taking the sealing structure 4 as an example to be hermetically arranged at the end of the chamber body 2 located at the first chamber port, as shown in fig. 1 and fig. 2, taking the first chamber port of the chamber body 2 as an example for conveying the workpiece to be processed with the process chamber 1 of the vertical oxidation furnace, the first chamber port of the chamber body 2 faces the inside of the process chamber 1, and the second chamber port faces the outside of the process chamber 1, during the process of conveying the workpiece to be processed into the process chamber 1, the second chamber lid 32 is firstly opened, so that the second chamber port is in an opened state, so that the workpiece to be processed can be conveyed into the chamber body 2 through the second chamber port, and then the second chamber lid 32 is closed, so that the second chamber port is in a closed state, at this time, the first chamber port and the second chamber port are both in a closed state, then the inside of the chamber body 2 is subjected to a purification treatment, so that the inside of the chamber body 2 forms an oxygen-free environment, the first chamber lid 31 is then opened to open the first chamber port, so that the workpiece to be processed can be transferred to the inside of the process chamber 1 through the first chamber port, thereby completing the transfer of the workpiece to be processed into the process chamber 1.
Alternatively, the workpiece to be processed may be a silicon wafer to be processed.
As shown in fig. 1, in a preferred embodiment of the present invention, the chamber body 2 may be provided with an air inlet and outlet part 6, and the air inlet and outlet part 6 may include an air inlet and an air outlet to perform a cleaning process on the inside of the chamber body 2 in a manner that air inside the chamber body 2 is pressed out of the air outlet by supplying nitrogen gas or inert gas from the air inlet to the inside of the chamber body 2 after transferring the workpiece to be processed into the chamber body 2 and closing the second chamber lid 32.
As shown in fig. 3 to 5, in a preferred embodiment of the present invention, the sealing structure 4 may include a first elastic sealing member 41 having an annular shape and an annular sealing protrusion 42, wherein the first elastic sealing member 41 is configured to make a surface contact with the first chamber lid 31 when the first chamber lid 31 closes the first chamber port, so as to perform a surface sealing between the end of the chamber body 2 located at the first chamber port and the first chamber lid 31; the annular sealing protrusion 42 is connected to the opposite side of the end of the first elastic sealing element 41 and the end of the chamber body 2 located at the first chamber port, an annular groove 421 for the end of the chamber body 2 located at the first chamber port to extend into is arranged on the annular sealing protrusion 42, and the end of the chamber body 2 located at the first chamber port extends into the annular groove 421 and is connected with the annular groove 421 in a sealing manner.
The annular sealing convex part 42 is connected to the side of the first elastic sealing element 41 opposite to the end of the chamber body 2 at the first chamber port, that is, the annular sealing convex part 42 is close to the end of the chamber body 2 at the first chamber port relative to the first elastic sealing element 41, the annular sealing convex part 42 is provided with an annular groove 421 into which the end of the chamber body 2 at the first chamber port extends, the end of the chamber body 2 at the first chamber port extends into the annular groove 421 and is in sealing connection with the annular groove 421, so that the sealing structure 4 is in sealing connection with the end of the chamber body 2 at the first chamber port through the sealing convex part 422, and by extending the end of the chamber body 2 at the first chamber port into the annular groove 421, the contact area between the sealing structure 4 and the end of the chamber body 2 at the first chamber port can be increased, thereby improving the sealing performance of the sealing structure 4, so as to further improve the sealing performance of the purification chamber and improve the process result. And, the first elastic sealing member 41 is in contact with the first chamber cover 31 when the first chamber cover 31 closes the first chamber opening, so that the first elastic sealing member 41 is elastically deformed by the pressure of the first chamber cover 31 on the end portion of the chamber body 2 at the first chamber opening, thereby increasing the contact area between the elastic sealing member and the first chamber cover 31, further improving the sealing performance of the purge chamber, and improving the process result.
In a preferred embodiment of the present invention, the first elastic sealing member 41 may include a foam tube of sponge rubber. However, the type of the first elastic seal 41 is not limited thereto.
Optionally, the rubber material of the sponge rubber foaming tube may be Ethylene Propylene Diene Monomer (EPDM for short).
Alternatively, the amount of compression of first resilient seal 41 may range from 3mm to 5 mm. On the one hand, good sealing performance can be achieved, on the other hand, the first elastic sealing element 41 can be avoided, when the first chamber cover 31 closes the first chamber opening, too much resistance is caused to the first chamber cover 31, so that the first chamber opening can be smoothly closed by the first chamber cover 31, and the use stability of the purification chamber can be improved.
Optionally, the surface of the second elastic sealing element 43 may be coated with polyurethane (abbreviated as polyurethane), so as to improve the sealing effect of the first elastic sealing element 41 on the chamber body 2 between the end of the first chamber port and the first chamber cover 31 by virtue of the adhesiveness of polyurethane, thereby further improving the sealing property of the purge chamber and improving the process effect.
In a preferred embodiment of the invention, as shown in fig. 3, the annular recess 421 may be glued to the end of the chamber body 2 projecting into it at the first chamber port. That is, the end of the chamber body 2 extending into the annular groove 421 and located at the first chamber port is glued in the annular groove 421, the annular groove 421 and the end of the chamber body 2 extending into the annular groove 421 are connected in a sealing manner, and compared with the way of forming a threaded hole on the end of the chamber body 2 located at the first chamber port and forming a through hole on the annular groove 421, the way of connecting the end of the chamber body 2 located at the first chamber port and the annular groove 421 by a bolt can prevent the gas in the chamber body 2 from leaking outwards from the through hole and the threaded hole, thereby further improving the sealing performance of the purification chamber and improving the process result.
Alternatively, the material of the annular recess 421 and the end of the chamber body 2 projecting into it at the first chamber port may comprise a pressure sensitive adhesive. On one hand, the pressure sensitive adhesive has good sealing performance and high polymer cohesion, and can firmly adhere the annular sealing convex part 42 to the end part of the cavity body 2 positioned on the first cavity opening after being pressed by external force so as to realize good sealing performance, and on the other hand, the pressure sensitive adhesive has stable performance and cannot generate particles to pollute a semiconductor process, thereby improving the process result.
As shown in fig. 3 and 5, in a preferred embodiment of the present invention, the inner circumferential wall of the annular groove 421 may be provided with a protrusion 422 that protrudes obliquely toward the end of the chamber body 2 located at the first chamber port. That is, a barb-like structure is formed on the inner peripheral wall of the annular groove 421, and the contact area between the annular groove 421 and the end of the chamber body 2 at the first chamber opening can be increased by the convex portion 422 which is obliquely convex toward the end of the chamber body 2 at the first chamber opening, so that the sealing property of the purge chamber is further improved, and the process result is improved. Moreover, when the annular groove 421 and the end part of the chamber body 2 extending into the annular groove are glued at the first chamber port, the area of the annular groove 421 and the end part of the chamber body 2 extending into the annular groove at the first chamber port can be increased, so that the sealing performance of the purification chamber is further improved, and the process result is improved.
As shown in fig. 3 to 5, in a preferred embodiment of the present invention, the sealing structure 4 may further include an annular second elastic sealing member 43, the second elastic sealing member 43 is circumferentially disposed along the first elastic sealing member 41 and is connected to the first elastic sealing member 41, and the second elastic sealing member 43 is configured to contact the first chamber cover 31 together with the first elastic sealing member 41 when the first chamber cover 31 closes the first chamber opening, so as to jointly perform multi-stage sealing between the end of the chamber body 2 located at the first chamber opening and the first chamber cover 31.
When the first chamber cover 31 closes the second chamber opening, the second elastic sealing member 43 arranged circumferentially around the first elastic sealing member 41 and connected with the first elastic sealing member 41 is in contact with the first chamber cover 31 together with the first elastic sealing member 41 to jointly perform multi-stage sealing between the end of the chamber body 2 located at the first chamber opening and the first chamber cover 31, that is, when the first chamber cover 31 closes the second chamber opening, not only the first elastic sealing member 41 is in surface contact with the first chamber cover 31 but also the end of the chamber body 2 located at the first chamber opening is sealed between the first chamber opening and the first chamber cover 31, and the second elastic sealing member 43 is also in contact with the first chamber cover 31 to seal between the end of the chamber body 2 located at the first chamber opening and the first chamber cover 31. On one hand, the contact area of the first chamber cover 31 and the sealing structure 4 can be further increased, so that the sealing performance of the purification chamber can be further improved, and the process result is improved. On the other hand, because the second elastic sealing element 43 is arranged around the first elastic sealing element 41 in the circumferential direction, the impurities in the chamber body 2 can be prevented from leaking out of the chamber body 2 by means of the first elastic sealing element 41, so that the sealing performance of the purification chamber can be further improved, and meanwhile, the impurities, such as air and dust, outside the chamber body 2 can be prevented from entering the chamber body 2 by means of the second elastic sealing element 43, so that the interior of the chamber body 2 is polluted, so that under the condition that the sealing performance of the purification chamber is improved, the internal pollution of the chamber body 2 is simultaneously avoided, and further, the process result can be further improved.
In a preferred embodiment of the present invention, the second resilient seal 43 may comprise a solid rubber strip. However, the type of the second elastic seal 43 is not limited thereto.
Optionally, the rubber material of the dense rubber strip may be ethylene propylene diene monomer.
Alternatively, the amount of compression of second resilient seal 43 may range from 3mm to 6 mm. On the one hand, good sealing performance can be achieved, on the other hand, the second elastic sealing element 43 can be avoided, when the first chamber cover 31 closes the chamber opening, too large resistance is caused to the first chamber cover 31, so that the first chamber cover 31 can smoothly close the chamber opening, and the use stability of the purification chamber can be improved.
Alternatively, the surface of the second elastic sealing member 43 may be coated with polyurethane, so as to improve the sealing effect of the second elastic sealing member 43 on the chamber body 2 between the end of the first chamber port and the first chamber lid 31 by the adhesion of the polyurethane, thereby further improving the sealing property of the purge chamber and improving the process effect.
In a preferred embodiment of the present invention, as shown in fig. 3 and 5, the second elastic sealing member 43 may extend in a direction away from the inner side of the first elastic sealing member 41 and be bent in a direction to approach the first chamber lid 31. When the first chamber cover 31 closes the first chamber opening, the first chamber cover 31 presses the portion of the second elastic sealing member 43 bent toward the direction close to the first chamber cover 31 in the direction opposite to the bending direction of the portion, so that the portion is flush with the portion of the second elastic sealing member 43 which is not bent, and thus the second elastic sealing member 43 can achieve good surface contact with the first chamber cover 31, so that the second elastic sealing member 43 can perform surface sealing on the end portion of the chamber body 2 located at the first chamber opening and the first chamber cover 31, further the sealing performance of the purge chamber can be further improved, and the process result is further improved.
As shown in fig. 1, in a preferred embodiment of the present invention, the purification chamber further includes a pressure relief component 5, and the pressure relief component 5 is disposed on the chamber body 2 and is preset with a preset pressure, and is used for releasing the pressure inside the chamber body 2 when the pressure inside the chamber body 2 is greater than the preset pressure, so as to adjust the pressure inside the chamber body 2 to the preset pressure.
The design is that in the process of closing the second chamber port by the second chamber cover 32, the second chamber cover 32 can press the air outside the chamber body 2 into the chamber body 2 through the second chamber port, and the air pressed into the chamber body 2 can raise the pressure inside the chamber body 2 after the second chamber cover 32 closes the second chamber port, so that the pressure inside the chamber body 2 and the pressure outside the chamber body 2 form a pressure difference, and the pressure difference may cause the first chamber cover 31 to seal the first chamber port untight, so that the gas inside the chamber body 2 enters the process chamber 1 through the first chamber port, the oxygen content inside the process chamber 1 exceeds the standard, and the process result is affected.
And can release the pressure inside the chamber body 2 when the pressure inside the chamber body 2 is greater than the preset pressure with the help of the pressure relief component 5, so as to adjust the pressure inside the chamber body 2 to the preset pressure, when the first chamber mouth can be tightly sealed by adjusting the preset pressure to the first chamber cover 31, the pressure inside the chamber body 2, so as to enable the second chamber cover 32 to press in the air inside the chamber body 2 when the second chamber mouth is closed by the second chamber cover 32, and the air is discharged by the pressure relief component 5, so that the gas inside the chamber body 2 is prevented from leaking, the sealing performance of the purification chamber can be further improved, and the process result is improved.
And, because the pressure release part 5 can make the second chamber lid 32 impress to the inside air escape of cavity body 2 when the second chamber lid 32 closes the second chamber mouth, thereby can avoid being impressed to the inside air of cavity body 2 by the second chamber lid 32, when first chamber lid 31 closes first chamber mouth, cause too big resistance to first chamber lid 31, so that first chamber lid 31 can be smooth close first chamber mouth, thereby can improve the stability in use who purifies the cavity.
Optionally, the pressure relief means 5 may comprise a one-way pressure relief valve.
In a preferred embodiment of the present invention, the sealing structure 4 may be further hermetically disposed at an end of the chamber body 2 located at the second chamber opening, and is used for performing a surface sealing between the end of the chamber body 2 and the second chamber cover 32 when the second chamber cover 32 closes the corresponding second chamber opening.
In this case, in a manner similar to the manner in which the sealing structure 4 is sealingly disposed at the end of the chamber body 2 located at the first chamber port, the description thereof will not be repeated. By arranging the sealing structure 4 at the end part of the chamber body 2 positioned at the second chamber opening, and arranging the sealing structure 4 and the end part of the chamber body 2 positioned at the second chamber opening in a sealing manner, when the sealing structure 4 is arranged at the end part of the chamber body 2 positioned at the second chamber opening, the sealing structure 4 is sealed between the sealing structure 4 and the end part of the chamber body 2 positioned at the second chamber opening, and when the second chamber cover 32 opens the second chamber opening, the sealing structure 4 is not separated from the end part of the chamber body 2 positioned at the second chamber opening, so that the sealing structure 4 and the end part of the chamber body 2 positioned at the second chamber opening are not in a poor sealing condition, and because the surface of the second chamber cover 32 contacting with the sealing structure 4 is a plane when the second chamber opening is closed, and the area of the plane is larger than the area of the end part of the chamber body 2 positioned at the second chamber opening, therefore, second chamber lid 32 is when closed second chamber mouth, the tip that is located the second chamber mouth for cavity body 2 can have bigger area and seal structure 4 to contact, so that second chamber lid 32 can form face contact with seal structure 4 when closed second chamber mouth, thereby when second chamber lid 32 closes the second chamber mouth with the help of seal structure 4, can be located the face seal between tip and the second chamber lid 32 of second chamber mouth to cavity body 2, further improve the leakproofness of purifying the cavity, improve the technology result.
As shown in fig. 2, as another technical solution, an embodiment of the present invention further provides a semiconductor processing apparatus, including a process chamber 1, such as a purge chamber provided in the embodiment of the present invention, and the purge chamber is connected to the process chamber 1 through a first chamber lid 31 in an on-off manner.
The semiconductor processing equipment provided by the embodiment of the invention can improve the sealing performance of the purification chamber by virtue of the purification chamber provided by the embodiment of the invention, and can improve the process result by enabling the purification chamber provided by the embodiment of the invention to be in on-off connection with the process chamber 1 through the first chamber cover 31.
In summary, the decontamination chamber and the semiconductor processing equipment provided by the embodiment can improve the sealing performance of the decontamination chamber and improve the processing result.
It is to be understood that the above embodiments are merely exemplary embodiments that have been employed to illustrate the principles of the present invention, and that the present invention is not limited thereto. It will be apparent to those skilled in the art that various modifications and improvements can be made without departing from the spirit and substance of the invention, and these modifications and improvements are also considered to be within the scope of the invention.
Claims (11)
1. A purification chamber is used in semiconductor equipment and connected with a process chamber in the semiconductor equipment, and is characterized by comprising a chamber body, a first chamber cover and a second chamber cover, wherein the chamber body is at least provided with a first chamber port and a second chamber port, the first chamber port is used for conveying a workpiece to be processed with the process chamber, the second chamber port deviates from the first chamber port, and the first chamber cover and the second chamber cover are respectively used for opening and closing the first chamber port and the second chamber port;
the purification cavity further comprises a sealing structure, wherein the sealing structure is at least arranged at the end part of the cavity body, which is positioned at the first cavity opening in a sealing mode, and is used for sealing the surface between the end part of the cavity body, which is positioned at the first cavity opening, and the first cavity cover when the first cavity cover is closed.
2. The decontamination chamber of claim 1, wherein the sealing structure comprises an annular first resilient seal and an annular sealing protrusion, wherein the first resilient seal is configured to make face contact with the first chamber lid when the first chamber lid closes the first chamber port to provide a face seal between the end of the chamber body at the first chamber port and the first chamber lid;
the annular sealing convex part is connected with the first elastic sealing piece and the cavity body is located on one side, opposite to the end part of the first cavity opening, of the cavity body, the annular sealing convex part is provided with a supply, the cavity body is located in an annular groove, extending into the end part of the first cavity opening, of the cavity body is located in the annular groove, and the end part of the first cavity opening is connected with the annular groove in a sealing mode.
3. The decontamination chamber of claim 2, wherein the annular groove is glued to the end of the chamber body projecting therein at the first chamber port.
4. The decontamination chamber of claim 2, wherein the inner peripheral wall of the annular recess is provided with a projection projecting obliquely towards the end of the chamber body at the first chamber port.
5. The decontamination chamber of claim 2, wherein the first resilient seal comprises a foam tube.
6. The decontamination chamber of claim 2, wherein the sealing structure further comprises a second elastomeric seal in the form of a ring circumferentially disposed around and coupled to the first elastomeric seal, the second elastomeric seal for cooperating with the first elastomeric seal to contact the first chamber lid when the first chamber lid closes the first chamber port to cooperatively seal the chamber body between the end of the first chamber port and the first chamber lid in multiple stages.
7. The decontamination chamber of claim 6, wherein the second resilient seal extends in a direction away from an inner side of the first resilient seal and is bent in a direction toward the first chamber cover.
8. The decontamination chamber of claim 6, wherein the second resilient seal comprises a solid rubber strip.
9. The decontamination chamber of claim 1, further comprising a pressure relief component disposed on the chamber body and pre-set with a preset pressure for releasing the pressure inside the chamber body to adjust the pressure inside the chamber body to the preset pressure when the pressure inside the chamber body is greater than the preset pressure.
10. The decontamination chamber of any one of claims 1-9, wherein the sealing structure is further sealingly disposed at an end of the chamber body at the second chamber port for sealing a face between the end of the chamber body and the second chamber lid when the second chamber lid closes the corresponding second chamber port.
11. A semiconductor processing apparatus comprising a process chamber and a decontamination chamber of any one of claims 1-10, the decontamination chamber being switchably connected to the process chamber by the first chamber lid.
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|---|---|---|---|
| CN202011155222.2A CN112331587B (en) | 2020-10-26 | 2020-10-26 | Decontamination chamber and semiconductor process equipment |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202011155222.2A CN112331587B (en) | 2020-10-26 | 2020-10-26 | Decontamination chamber and semiconductor process equipment |
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| CN112331587B CN112331587B (en) | 2024-03-26 |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050274459A1 (en) * | 2004-06-14 | 2005-12-15 | Yoshiaki Tanase | Slit valve door seal |
| US20060185189A1 (en) * | 2003-11-13 | 2006-08-24 | Airex Co., Ltd. | Method of decontamination and decontamination apparatus |
| DE102016114640A1 (en) * | 2016-08-08 | 2018-02-08 | Von Ardenne Gmbh | VACUUM CASE ASSEMBLY, CHAMBER BODY AND CHAMBER COVER |
| CN111312621A (en) * | 2018-12-12 | 2020-06-19 | 株式会社斯库林集团 | Processing chamber and substrate processing apparatus |
-
2020
- 2020-10-26 CN CN202011155222.2A patent/CN112331587B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20060185189A1 (en) * | 2003-11-13 | 2006-08-24 | Airex Co., Ltd. | Method of decontamination and decontamination apparatus |
| US20050274459A1 (en) * | 2004-06-14 | 2005-12-15 | Yoshiaki Tanase | Slit valve door seal |
| DE102016114640A1 (en) * | 2016-08-08 | 2018-02-08 | Von Ardenne Gmbh | VACUUM CASE ASSEMBLY, CHAMBER BODY AND CHAMBER COVER |
| CN111312621A (en) * | 2018-12-12 | 2020-06-19 | 株式会社斯库林集团 | Processing chamber and substrate processing apparatus |
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