CN112327579A - Exposure apparatus and method for manufacturing article - Google Patents
Exposure apparatus and method for manufacturing article Download PDFInfo
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- CN112327579A CN112327579A CN202010758630.0A CN202010758630A CN112327579A CN 112327579 A CN112327579 A CN 112327579A CN 202010758630 A CN202010758630 A CN 202010758630A CN 112327579 A CN112327579 A CN 112327579A
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70775—Position control, e.g. interferometers or encoders for determining the stage position
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70716—Stages
- G03F7/70725—Stages control
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/7085—Detection arrangement, e.g. detectors of apparatus alignment possibly mounted on wafers, exposure dose, photo-cleaning flux, stray light, thermal load
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
- G03F9/7088—Alignment mark detection, e.g. TTR, TTL, off-axis detection, array detector, video detection
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
Abstract
The invention provides an exposure apparatus and a method for manufacturing an article. Provided is a technique advantageous in terms of accuracy of pattern formation for forming a pattern on a substrate under scanning exposure. An exposure apparatus that exposes a shot region of a substrate by scanning the substrate with exposure light includes: a measuring section that measures surface positions of the imaging region at a plurality of measurement points before exposure of the imaging region with the exposed light in a scanning process of the substrate; and a control unit configured to perform tilt control of the substrate based on a measurement result of the measurement unit, the tilt control of the substrate being started when a surface position is measured at a predetermined number of measurement points among the plurality of measurement points, the control unit determining a control curve used for the tilt control of the substrate based on a time difference between a start time of the tilt control of the substrate and an exposure start time of the imaging region by the exposed light.
Description
Technical Field
The present invention relates to an exposure apparatus and a method of manufacturing an article.
Background
As one of apparatuses used in a manufacturing process (photolithography process) of a semiconductor device or the like, an exposure apparatus is known which performs scanning exposure of an imaging region of a substrate by scanning the substrate with exposure light. In such an exposure apparatus, during scanning of the substrate, the surface position of the substrate is measured (focus measurement) before the shot area is exposed to the exposure light, and the height control and tilt control of the substrate are performed based on the measurement result.
In recent years, in order to improve the throughput, scanning exposure is performed also in a defective imaging region where only a part of the pattern of the original plate is transferred in the peripheral portion of the substrate. In such a defective imaging region, since a part of a plurality of measurement target portions to be focus-measured is defective, it may be difficult to accurately perform height control and tilt control of the substrate when using the focus measurement result at the defective measurement target portion. Patent document 1 proposes the following method: the validity/invalidity of the focus measurement is determined in advance based on the layout information of the imaging area, and the height control and tilt control of the substrate are performed based on the determination result so as not to use the focus measurement value at the missing measurement target portion.
Documents of the prior art
Patent document
Patent document 1: japanese laid-open patent publication No. 10-116877
Disclosure of Invention
For example, the height control of the substrate can be performed using the results of focus measurement at least one measurement target site, but if the results of focus measurement at least two measurement target sites are not used, the tilt control of the substrate cannot be performed. That is, in the scanning exposure of the defective imaging region, the tilt control of the substrate is started later than the height control of the substrate, and the time difference between the start time of the tilt control of the substrate and the exposure start time is shortened. In this case, the vibration of the substrate that is generated during the tilt control of the substrate and remains even after the start of exposure may affect the pattern forming accuracy of the pattern formed on the substrate.
Accordingly, an object of the present invention is to provide a technique advantageous in terms of accuracy of pattern formation for forming a pattern on a substrate under scanning exposure.
In order to achieve the above object, an exposure apparatus according to an aspect of the present invention is an exposure apparatus for exposing a shot region of a substrate by scanning the substrate with exposure light, the exposure apparatus including: a measuring section that measures surface positions of the imaging region at a plurality of measurement points before exposure of the imaging region with the exposed light in a scanning process of the substrate; and a control unit configured to perform tilt control of the substrate based on a measurement result of the measurement unit, the tilt control of the substrate being started when a surface position is measured at a predetermined number of measurement points among the plurality of measurement points, the control unit determining a control curve used for the tilt control of the substrate based on a time difference between a start time of the tilt control of the substrate and an exposure start time of the imaging region by the exposed light.
Further objects or other aspects of the present invention will become apparent from the following description of preferred embodiments with reference to the accompanying drawings.
According to the present invention, for example, a technique advantageous in terms of pattern formation accuracy in forming a pattern on a substrate under scanning exposure can be provided.
Drawings
Fig. 1 is a schematic diagram showing the configuration of an exposure apparatus.
Fig. 2 is a diagram showing a positional relationship among the imaging region, the irradiation region, and a plurality of measurement points in the measurement unit.
Fig. 3 is a control block diagram of the height and tilt of the substrate.
Fig. 4A is a diagram for explaining scanning exposure for a plurality of shooting regions.
Fig. 4B is a diagram for explaining scanning exposure for a plurality of shooting regions.
Fig. 4C is a diagram for explaining scanning exposure for a plurality of shooting regions.
Fig. 5 is a diagram showing a control curve of the substrate and vibration of the substrate W.
Fig. 6 is a diagram showing an example of determining a tilt control curve of a substrate.
Fig. 7 is a flowchart showing the scanning exposure process.
Fig. 8 is a flowchart showing a tilt control curve determination process.
Description of the reference numerals
100: an exposure device; 101: a projection optical system; 102: a measuring section; 103: a mask stage; 104: a control unit; 105: a substrate mounting table; 106: an illumination optical system; 201: a shooting area; 202: irradiating the area; 203-205: and measuring points.
Detailed Description
Hereinafter, embodiments will be described in detail with reference to the drawings. The following embodiments do not limit the invention according to the claims. In the embodiments, a plurality of features are described, but these plurality of features are not essential to the invention, and a plurality of features may be arbitrarily combined. In the drawings, the same or similar components are denoted by the same reference numerals, and redundant description thereof is omitted.
< embodiment 1 >
An exposure apparatus 100 according to embodiment 1 of the present invention will be described. The exposure apparatus 100 of the present embodiment is, for example, a so-called scanning repetition type exposure apparatus (scanning exposure apparatus) that performs scanning exposure of an imaging region of a substrate W by scanning the substrate W with respect to exposure light (slit light, pattern light) emitted from a projection optical system. In the following description, an axis parallel to the optical axis AX of the projection optical system is referred to as a Z axis, and two axes orthogonal to each other in a plane perpendicular to the Z axis are referred to as an X axis and a Y axis. The scanning direction of the mask M and the substrate W (i.e., the scanning direction of the irradiation region on the substrate) is defined as the Y direction.
[ Structure of Exposure apparatus ]
Fig. 1 is a schematic diagram showing the configuration of an exposure apparatus 100 according to the present embodiment. The exposure apparatus 100 may include, for example, an illumination system 106, a mask stage 103, a projection optical system 101, a substrate stage 105, a measurement unit 102, and a control unit 104.
The illumination system 106 forms slit light by shaping light emitted from a light source (not shown) such as an excimer laser, and illuminates the mask M (original plate). The mask M is made of, for example, quartz glass or the like, and has a pattern (for example, a circuit pattern) to be transferred onto a substrate. The mask stage 103 includes a chuck for holding the mask M, and is movable at least in the direction of each axis X, Y. The mask stage 103 scans a surface perpendicular to the optical axis AX of the projection optical system 101, i.e., in the Y-axis direction (arrow 103a) at a constant speed during exposure of the substrate W. The positional information of the mask stage 103 in each axial direction can be measured at any time using the 1 st interferometer 121 for detecting the position of the mask stage 103 and the bar mirror 120 provided on the mask stage 103.
The projection optical system 101 projects the light transmitted through the mask M onto the substrate at a predetermined projection magnification. The image plane (focal plane) of the projection optical system 101 is in a perpendicular relationship to the Z-axis direction. The substrate W is, for example, a single crystal silicon substrate, and a resist (photosensitive agent) can be applied to the surface. The substrate mounting table 105 includes a chuck for holding the substrate W, and is movable (rotatable) in the directions of the respective axes X, Y, Z and the directions of θ x, θ y, and θ z, which are rotational directions of the respective axes. The substrate mounting table 105 scans the substrate W at a constant speed in a Y-axis direction (arrow 105a) which is a plane direction perpendicular to the optical axis AX of the projection optical system 101 during exposure. The positional information of the substrate mounting table 105 in each axial direction can be measured at any time using the bar mirror 123 provided on the substrate mounting table 105 and the 2 nd interferometer 124 for detecting the position of the substrate mounting table 105.
The measurement unit 102 performs surface position measurement (focus measurement) on the substrate W held by the substrate mounting table 105. The measurement unit 102 according to embodiment 1 may include: a projection unit of an oblique incidence type for obliquely irradiating light to the substrate W, the projection unit projecting a light beam for measurement to the substrate W; a light receiving unit that receives the light beam (reflected light beam) projected by the projecting unit and reflected by the substrate W; and a processing section 126.
The projection unit may include, for example, a light source 110, a collimator lens 111, a slit member 112, a projection optical system 113, and a mirror 114. The light source 110 includes, for example, a lamp, a light emitting diode, or the like, and emits a light beam having a wavelength that does not expose the resist on the substrate. The collimator lens 111 makes the light flux emitted from the light source 110 into parallel light having a substantially uniform light intensity distribution in cross section. The slit member 112 is formed of a pair of prisms bonded to each other with their inclined surfaces facing each other, and a light-shielding film made of chromium or the like having a plurality of openings (9 pin holes in the present embodiment) formed therein is provided on the bonding surface. The projection optical system 113 is a two-sided telecentric optical system, and causes a plurality of light beams (9 light beams in the present embodiment) generated by passing through a plurality of openings formed in the slit member 112, respectively, to be incident on the substrate via the mirror 114.
The plane having the plurality of openings and the plane including the surface of the substrate W can be configured to satisfy a Scheimpflug (Scheimpflug) condition with respect to the projection optical system 113. In the present embodiment, the incident angle (angle with respect to the optical axis) of each light beam from the projecting unit when entering the substrate W is 70 ° or more. The plurality of light beams emitted from the projection unit are incident on different positions on the substrate in directions rotated by θ ° (for example, 22.5 °) in the XY plane from the X direction so that the surface height at the position where each light beam is incident can be measured independently of each other.
The light receiving unit may include, for example, a mirror 115, a light receiving optical system 116, a correction optical system 117, and a photoelectric conversion unit 118. The mirror 115 guides the plurality of light fluxes reflected by the substrate W to the light receiving optical system 116. The light receiving optical system 116 is a bilateral telecentric optical system, and cuts off high-order diffracted light (noise light) generated due to a pattern formed on a substrate by a stop diaphragm provided in common for a plurality of light beams. The correction optical system 117 includes a plurality of lenses corresponding to the plurality of light fluxes, and forms a plurality of light fluxes having optical axes parallel to each other by the light receiving optical system 116 into spot lights having the same size on the light receiving surface of the photoelectric conversion unit 118. The photoelectric conversion unit 118 may include, for example, a number of photoelectric conversion elements (9 in the present embodiment) corresponding to a plurality of light beams. Each photoelectric conversion element includes a CCD line sensor or the like, detects the intensity (light intensity) of the light beam incident on the light receiving surface, and outputs the intensity to the processing unit 126 (arithmetic circuit). The processing unit 126 is configured by a computer having a CPU, a memory, and the like, for example, and measures (obtains) the surface position of the substrate W at each measurement point based on the output from the photoelectric conversion unit 118.
In the light receiving optical system 116, the correction optical system 117, and the photoelectric conversion unit 118, skew correction is performed in advance so that each measurement point on the substrate and the light receiving surface of the photoelectric conversion unit 118 are conjugate to each other. Therefore, there is no change in the position of the pinhole image on the light-receiving surface due to the local inclination of each measurement point, and the position of the pinhole image on the light-receiving surface changes in response to the change in the height of each measurement point in the optical axis direction AX. Here, the photoelectric conversion unit 118 of the present embodiment is configured by a 1-dimensional CCD line sensor, but a photoelectric conversion unit in which a plurality of 2-dimensional position measurement elements are arranged may be used.
The control unit 104 includes a main control unit 127, a mask position control unit 122, and a substrate position control unit 125. Each control unit may be constituted by a computer including a CPU, a memory, and the like, for example. The main control unit 127 is connected to each component of the exposure apparatus 100 via a line, and performs centralized control of operations of the components in accordance with a program or the like. The mask position control unit 122 controls the operation of the mask stage 103 in accordance with a command from the main control unit 127. The substrate position control unit 125 controls the operation of the substrate mounting table 105 in accordance with a command from the main control unit 127.
The main control unit 127 controls the scanning exposure of the imaging area of the substrate W while controlling the height and the inclination of the substrate W based on the measurement result of the measurement unit 102. That is, the main controller 127 controls the height and inclination of the substrate W and relatively scans the mask stage 103 and the substrate stage 105 at a speed ratio corresponding to the projection magnification of the projection optical system 101. This allows the irradiation region irradiated with the exposure light from the projection optical system 101 (i.e., the region where the pattern image of the mask M is projected by the projection optical system 101) to be moved on the substrate, thereby transferring the pattern of the mask M to the imaging region on the substrate. Such scanning exposure is sequentially performed for each of the plurality of imaging regions of the substrate W while stepping the substrate mounting table 105, and the exposure process for 1 substrate W can be completed.
[ scanning exposure of shot region ]
The scanning exposure of the imaging region of the substrate W in the exposure apparatus 100 will be described. Fig. 2 is a diagram showing a positional relationship among an imaging region 201 of a target to be subjected to scanning exposure, an irradiation region 202 to which exposure light is irradiated from the projection optical system 101, and a plurality of measurement points (9 measurement points in the present embodiment) at which the measurement unit 102 measures the surface position of the substrate W. In fig. 2, the irradiation region 202 is a rectangular region surrounded by a dotted line. The measurement points 203(203a to 203c) are measurement points at which the surface position of the substrate W is measured inside the irradiation region 202. The measurement points 204(204a to 204c) and the measurement points 205(205a to 205c) are measurement points at which the surface position of the substrate W is measured before exposure in the irradiation region 202 (measurement points are read first). The measurement point 204 and the measurement point 205 are disposed at positions separated by a distance Lp in the scanning direction from the measurement point 203 in the irradiation region 202. In the present embodiment, each of the measurement points 203, 204, and 205 is constituted by 3 measurement points arranged in the direction (X direction) intersecting the scanning direction (Y direction), but the present invention is not limited thereto, and may be constituted by two measurement points or 4 or more measurement points. In addition, the measurement point 203 can be used to make corrections to the measurement results at the measurement point 204 and the measurement point 205.
In the measurement unit 102 configured as described above, the measurement points used for measuring the surface position of the substrate W before the exposure of the irradiation region 202 are switched according to the scanning direction (moving direction) of the substrate W. For example, when scanning exposure of the imaging region 201 is performed by moving the substrate W in the direction F, the measurement points 204(204a to 204c) are used. In this case, the main control unit 127 drives the substrate mounting table 105 based on the measurement result at the measurement point 204 so that the substrate surface in the irradiation region 202 is disposed at the best focus position of the projection optical system 101, thereby controlling (adjusting) the height and the inclination of the substrate W. On the other hand, when scanning exposure of the imaging region 201 is performed by moving the substrate W in the direction R, the measurement points 205(205a to 205c) are used. In this case, the main control unit 127 drives the substrate mounting table 105 based on the measurement result at the measurement point 205 so that the substrate surface in the irradiation region 202 is arranged at the best focus position of the projection optical system 101, thereby controlling (adjusting) the height and the inclination of the substrate W. Further, the best focus position is also referred to as an optimal exposure image plane position.
Fig. 3 is an example of a control block diagram related to driving of the substrate mounting table 105 for controlling the height and inclination of the substrate W. In the present control block diagram, an example of applying PID (Proportional-Integral-Differential) control is shown, and can include a subtractor 127a, a PID compensator 127b, a filter 127c, and a limiter 127 d. The subtractor 127a, the PID compensator 127b, the filter 127c, and the limiter 127d may be provided as components of the main control unit 127. In fig. 3, the PID compensator 127b is provided with a P gain (proportional gain), a D gain (differential gain), and an I gain (integral gain). The filter 127c is, for example, a low-pass filter, and is provided with a filter constant (cutoff frequency). The limiter 127d has a drive limit value set for limiting the drive amount of the substrate mounting table 105. The main control unit 127 calculates a deviation between the surface position of the substrate W measured by the measurement unit 102 and the best focus position (target position) by using the subtractor 127a, and applies a PID compensator 127b (gain), a filter 127c, and a limiter 127d (drive limit value) to the deviation. This makes it possible to determine the operation amount (target drive amount) of the substrate mounting table 105 for controlling the height and the inclination of the substrate W.
Next, scanning exposure for a plurality of imaging regions will be described with reference to fig. 4A to 4C. Fig. 4A to 4C show a shooting area 201a where the scanning exposure has ended, a shooting area 201b where the scanning exposure is performed next to the shooting area 201a, and a shooting area 201C where the scanning exposure is performed next to the shooting area 201 b. The imaging regions 201a and 201b are full imaging regions that are disposed in the center of the substrate W, do not include the edge of the substrate W, and have the pattern of the entire mask M transferred thereto. On the other hand, the imaging region 201c is a defective imaging region which is disposed at the peripheral edge portion of the substrate W, includes the edge of the substrate W, and has only a part of the pattern of the mask M transferred thereto (in other words, a part of the pattern of the mask M is not transferred thereto).
The circle marks and the x marks in fig. 4A to 4C represent measurement target portions on the imaging region that is the target of the surface position measurement by the measurement unit 102 (the measurement points 203 to 205). The circle symbol indicates an effective measurement target portion located inside the substrate W, and the x symbol indicates an ineffective measurement target portion located outside the substrate W. In the example shown in fig. 4A to 4C, measurement target parts 311 to 313 are set in the imaging area 201b, and measurement target parts 321 to 323 are set in the imaging area 201C. Here, in fig. 4A to 4C, for ease of illustration and description, the measurement target portions are arranged at intervals wider than the interval (distance Lp) between the measurement points in the measurement unit 102 in the scanning direction (Y direction), but may actually be arranged at intervals narrower than the interval between the measurement points. The measurement target portion is set in advance based on layout information (design information) of the imaging region on the substrate W, and the validity/invalidity can be determined by using the method described in patent document 1, for example.
Fig. 4A shows a state just before scanning exposure of the photographing region 201b is started. When the irradiation region 202 is out of the imaging region 201a and scanning exposure of the imaging region 201a is completed, the main control unit 127 completes driving of the substrate mounting table 105 in the direction R (+ Y direction) and drives the substrate mounting table 105 in the-X direction by an amount corresponding to the width of the imaging region 201 a. This brings the state shown in fig. 4A. Then, the main control unit 127 starts driving the substrate mounting table 105 in the direction F (-Y direction) (scanning of the substrate W) to perform the next scanning exposure of the imaging region 201 b.
During the scanning exposure of the imaging region 201B, the surface position of the measurement target portion 311 is measured by the measurement unit 102 (measurement point 204) at the timing when the measurement point 204 is disposed at the measurement target portion 311 as shown in fig. 4B during the scanning of the substrate W in the direction F. The main control unit 127 performs height control and tilt control of the substrate W using the substrate mounting table 105 so that the substrate surface in the irradiation region 202 is placed at the best focus position when the measurement target portion 311 is placed in the irradiation region 202, based on the measurement result. The same control is performed for the other measurement target portions 312 and 313 … in the imaging region 201 b. When the irradiation region 202 is out of the imaging region 201b and the scanning exposure of the imaging region 201b is completed, the main control unit 127 ends the driving of the substrate mounting table 105 in the direction F, and drives the substrate mounting table 105 in the-X direction by an amount corresponding to the width of the imaging region 201 b. Then, in order to perform the next scanning exposure of the imaging region 201c, the driving of the substrate mounting table 105 (scanning of the substrate W) in the direction R (+ Y direction) is started.
During the scanning exposure of the imaging region 201C, the surface position of the measurement target portion 321 is measured by the measurement unit 102 (measurement point 205) at the timing when the measurement point 205 is arranged on the measurement target portion 321 as shown in fig. 4C during the scanning of the substrate W in the direction R. The main control unit 127 performs height control and tilt control of the substrate W using the substrate mounting table 105 so that the substrate surface in the irradiation region 202 is placed at the best focus position when the measurement target portion 321 is placed in the irradiation region 202, based on the measurement result. The same control is performed for the other measurement target portions 322 and 323 … in the imaging region 201 b. When the irradiation region 202 is out of the imaging region 201c and the scanning exposure of the imaging region 201c is completed, the main control section 127 ends the driving of the substrate mounting table 105 in the direction F.
Here, if there are 1 or more effective measurement target portions (circle marks) among the plurality of measurement target portions arranged in the X direction, the height (Z-direction position) of the substrate W during the scanning exposure can be controlled. That is, the height control of the substrate W is started when the surface position measurement is performed at 1 measurement point of the plurality of measurement points 204a to 204c (or 205a to 205c) in the measurement unit 102. On the other hand, if there are no two or more effective measurement target portions (circle marks) among the plurality of measurement target portions arranged in the X direction, the tilt (tilt around the Y axis) of the substrate W during the scanning exposure cannot be controlled. That is, when the surface position measurement is performed at two of the plurality of measurement points 204a to 204c (or 205a to 205c) in the measurement unit 102, the tilt control of the substrate W is started.
In the present embodiment, the height control of the substrate W is started when the surface position measurement is performed at 1 measurement point, but the present invention is not limited thereto, and the height control of the substrate W may be started when the surface position measurement is performed at 1 st measurement point set in advance. Similarly, the tilt control of the substrate W is started when the surface position measurement is performed at two measurement points, but the present invention is not limited to this, and the height control of the substrate W may be started when the surface position measurement is performed at 2 nd (predetermined) number of measurement points set in advance. Wherein the 2 nd number is greater than the 1 st number.
For example, in the scanning exposure of the imaging region 201c as the defective imaging region, only 1 effective measurement target site (circle mark) is present at the measurement target site 321 at which the surface position measurement at the measurement point 205 is first performed. On the other hand, at the measurement target portion 322 where the surface position measurement at the measurement point 205 is performed next, there are two effective measurement target portions (circle marks). Therefore, the height control of the substrate W is started at the time of the first measurement of the measurement target portion 321, whereas the tilt control of the substrate W is not started at the time of the first measurement of the measurement target portion 321, but is started at the time of the next measurement of the measurement target portion 322. That is, in the scan exposure of the defective imaging region, the period up to the start timing of the tilt control of the substrate W and the exposure start timing in the irradiation region 202 is shortened as compared with the scan exposure of the complete imaging region.
In such a scanning exposure of the defective imaging region, when the tilt control of the substrate W is performed in the same manner as the scanning exposure of the complete imaging region, it is difficult to make the vibration (amplitude) of the substrate W generated in the tilt control of the substrate W fall within the allowable range before the exposure start time. As a result, the transfer accuracy of the pattern of the mask M may be degraded. That is, the vibration of the substrate that is generated in the tilt control of the substrate and remains even after the start of exposure may affect the pattern forming accuracy of the pattern formed on the substrate. Here, the vibration (amplitude) of the substrate W can be defined as a control deviation with respect to the target height and the target inclination of the substrate W. Further, since the substrate W is held by the substrate mounting table 105 and the substrate W and the substrate mounting table 105 can be considered as one body, the vibration of the substrate W can be understood as a control deviation with respect to the target height and the target inclination of the substrate mounting table 105.
The above-described matters will be specifically described with reference to fig. 5. Fig. 5 is a diagram showing a control curve of the height Z (Z-direction position) and the inclination TiltX (skew about the Y-axis) of the substrate W and the vibration (control deviation Err) of the substrate W at this time. The horizontal axis represents time T. Fig. 5(a) to (b) show the case of scanning exposure of the entire imaging region (for example, the imaging region 201b), fig. 5(a) shows the control amount of the height Z and the tilt TiltX of the substrate W, and fig. 5(b) shows the vibration of the substrate W. Fig. 5(c) to (d) show the case of scanning exposure of a defective imaging region (for example, the imaging region 201c), fig. 5(c) shows the control amounts of the height Z and the tilt TiltX of the substrate W, and fig. 5(d) shows the vibration of the substrate W.
In fig. 5, time t0 is a time when the height control of the substrate W is started by measuring the surface position at 1 of the plurality of measurement points 204a to 204c (or 205a to 205c) in the measurement unit 102. Time t1 is a time when the tilt control of the substrate W is started by performing the surface position measurement at two of the plurality of measurement points 204a to 204c (or 205a to 205c) in the measurement unit 102. The time t2 is a time (exposure start time) when the irradiation region 202 reaches the imaging region and exposure of the imaging region is started.
Since the first surface position measurement is performed at two or more measurement points in the scanning exposure of the entire imaging region (e.g., the imaging region 201b), the height control of the substrate W and the tilt control of the substrate W can be started at the same timing (i.e., at time t0 ≈ time t1) as shown in fig. 5 (a). In the present embodiment, the height control and the tilt control of the substrate W are performed using a control curve set such that the vibration (control deviation Err) of the substrate W converges within the allowable range at the time difference between the time t0(t1) and the exposure start time t 2. As a result, as shown in fig. 5(b), the vibration of the substrate W can be made to fall within the allowable range before the exposure start time t 2. Here, the control curve may be defined as a drive curve of the substrate mounting table 105, and may be determined based on, for example, a target height and a target inclination of the substrate W, a drive speed, a drive limit value, a drive time, and the like of the substrate mounting table 105. In the present embodiment, the driving speed, the driving limit value, and the driving time of the substrate mounting table 105 are related to the driving of the substrate mounting table 105 in the height direction and the tilt direction of the substrate W, respectively.
On the other hand, in the scanning exposure of the defect imaging region (for example, the imaging region 201c), since the tilt control of the substrate W is not started in the first surface position measurement, as shown in fig. 5(c), the time difference between the start time t1 of the tilt control of the substrate W and the exposure start time t2 is shortened. In this case, the tilt control of the substrate W is conventionally performed using the same control curve as the entire imaging region, but in this case, as shown in fig. 5(d), the vibration of the substrate W caused by the tilt control of the substrate W may remain after the start of exposure. That is, it may be difficult to make the vibration of the substrate W generated by the tilt control of the substrate W converge to the allowable range before the exposure start time t 2.
Therefore, the exposure apparatus 100 (main control unit 127) of the present embodiment determines (changes) the control curve used for the tilt control of the substrate W based on the time difference between the start time t1 of the tilt control of the substrate W and the exposure start time t2 (hereinafter, may be simply referred to as "time difference"). For example, the main controller 127 preferably determines the control curve so that the vibration of the substrate W caused by the tilt control of the substrate W when the time difference is smaller than the threshold value is smaller than the time difference larger than the threshold value. The main controller 127 may determine the control curve so that the smaller the time difference, the smaller the vibration of the substrate W caused by the tilt control of the substrate W. Thus, for example, in the scanning exposure of the defective imaging region, the vibration of the substrate W that is generated by the tilt control of the substrate W and remains even after the start of the exposure can be reduced. An example of determining the control curve corresponding to the time difference between the start time t1 of the tilt control of the substrate W and the exposure start time t2 will be described below.
[ example of determination of control Curve ]
Fig. 6 is a diagram showing an example of determining a control curve (tilt control curve) for tilt control of the substrate W in the present embodiment. In fig. 6, a solid line (Z) represents a height control curve of the substrate W, a broken line (TiltX) represents a tilt control curve of the conventional substrate W, and a dashed-dotted line (TiltX') represents a tilt control curve of the substrate W in the present embodiment. The horizontal axis represents time T. Here, the tilt control curve of the substrate W can be defined as the drive curve of the substrate mounting table 105 as described above, and can be determined, for example, according to the target tilt of the substrate W, the drive speed of the substrate mounting table 105 in the tilt direction of the substrate W, the drive limit value, the drive time, and the like.
Fig. 6(a) is a diagram showing an example of determining the tilt control curve of the substrate W by changing the drive limit value of the substrate mounting table 105. For example, in the past (TiltX), even at the time difference threshold tlimEven in a case where the image is small (defective image pickup area), the tilt of the substrate W is controlled by using the value Limit used for scanning exposure of the entire image pickup area as the drive Limit value of the substrate mounting table 105. On the other hand, in the present embodiment (TiltX'), the main controller 127 compares the time difference with the threshold tlimIf the value is small, the drive Limit value of the substrate mounting table 105 is changed to a value Limit' smaller than the value Limit used in the scanning exposure of the entire imaging region, and the tilt of the substrate W is controlled. This allows the tilt of the substrate W to be changed smoothly, and thus vibration of the substrate W caused by the tilt control of the substrate W can be reduced, and vibration of the substrate W remaining after the start of exposure can be reduced.
In addition, the main control unit 127 may compare the time difference with the threshold tlimIf the target inclination is small, the target inclination of the substrate W is changed. Specifically, the Target tilt of the substrate W may be changed to a value Target' smaller than the value Target used in the scanning exposure of the entire imaging region. This also allows the tilt of the substrate W to be changed smoothly, and thus vibration of the substrate W caused by the tilt control of the substrate W can be reduced.
Fig. 6 b is a diagram showing an example of determining the tilt control curve of the substrate W by changing the driving speed of the substrate mounting table 105 at the start timing of the tilt control of the substrate W (hereinafter, may be referred to as "initial driving speed"). For example, in the past (TiltX), even at the time difference threshold tlimEven in a case where the value Vd is small (defective imaging region), the tilt of the substrate W is controlled by using the value Vd used for the scanning exposure of the entire imaging region as the initial driving speed of the substrate mounting table 105. On the other hand, in the present embodiment (TiltX'), the main controller 127 compares the time difference with the threshold tlimWhen the initial driving speed of the substrate mounting table 105 is small, the initial driving speed is changed to be faster than that in the case of the complete imagingThe tilt of the substrate W is controlled by a value Vd 'smaller than the value Vd' used for the scanning exposure of the region. In this case, in a manner similar to the conventional tilt control, the driving speed of the substrate mounting table 105 before the substrate W reaches the Target tilt Target is preferably controlled (in the example shown in fig. 6(b), the driving speed is constantly set to the value Vd'). This also allows the tilt of the substrate W to be changed smoothly, and thus vibration of the substrate W caused by the tilt control of the substrate W can be reduced.
The main controller 127 may change the average driving speed of the substrate mounting table 105 until the substrate W reaches the Target inclination Target without changing the initial driving speed of the substrate mounting table 105. Specifically, the main control unit 127 may be configured to compare the time difference with the threshold tlimIf the average drive speed is small, the average drive speed of the substrate mounting table 105 is changed to a value smaller than that used for scanning exposure of the entire imaging region, and the tilt of the substrate W is controlled.
Fig. 6(c) is a diagram showing an example of determining the tilt control curve of the substrate W by changing the driving time of the substrate mounting table 105 until the substrate W reaches the Target tilt Target. For example, in the past (TiltX), even at the time difference threshold tlimEven in a case where the image is small (defective imaging region), the tilt of the substrate W is controlled by using the value Td used for scanning exposure of the entire imaging region as the driving time of the substrate mounting table 105. On the other hand, in the present embodiment (TiltX'), the main controller 127 compares the time difference with the threshold tlimIf the value is small, the drive time of the substrate mounting table 105 is changed to a value Td' longer than the value Td used for scanning exposure of the entire imaging region, and the tilt of the substrate W is controlled. This also allows the tilt of the substrate W to be changed smoothly, and thus vibration of the substrate W caused by the tilt control of the substrate W can be reduced.
In addition, even if the filter constant (cut-off frequency) of the filter 127c is changed, the same effect can be obtained. Specifically, the main control unit 127 can reduce the vibration of the substrate W caused by the tilt control of the substrate W by changing the filter constant (cutoff frequency) of the filter 127c to a value smaller than the value used for the scanning exposure of the entire imaging region.
Here, according to the configuration of the apparatus such as the substrate mounting table 105, as shown in fig. 6(d), the drive time of the substrate mounting table 105 can be changed to a value shorter than the value used for scanning exposure of the entire imaging region. Alternatively, the drive speed (initial drive speed, average drive speed) of the substrate mounting table 105 may be changed to a value larger than that used for scanning exposure of the entire imaging region. In this case, since the inclination of the substrate W can be made to reach the target inclination in a short time, the period from the end of driving of the substrate mounting table 105 for controlling the inclination of the substrate W to the exposure start time t2 can be extended. That is, in this case, although there is a possibility that the vibration of the substrate W generated by the tilt control of the substrate W increases, the period until the exposure start time t2 is extended, and therefore, the amount of reduction in the vibration of the substrate W until the exposure start time t2 can be increased, and the vibration of the substrate W remaining after the start of exposure can be reduced. The same effect can be obtained even if the control gain of the PID compensator 127b is changed.
As described above, the exposure apparatus 100 according to the present embodiment determines (changes) the tilt control curve of the substrate W based on the time difference between the start time t1 of the tilt control of the substrate W and the exposure start time t 2. Accordingly, even when the time difference is shortened, for example, in scanning exposure of the defective imaging region, the vibration of the substrate W caused by the tilt control of the substrate W can be reduced, and the vibration of the substrate W remaining after the start of exposure can be reduced.
< embodiment 2 >
Embodiment 2 of the present invention will be described. Here, a flow of the scanning exposure process of the present invention will be described. Fig. 7 is a flowchart showing the scanning exposure process. Each step in the flowchart can be controlled by the main control unit 127. In addition, this embodiment basically inherits embodiment 1, and the device configuration, the content of the scanning exposure, and the like are the same as those described in embodiment 1.
In S1, the main control unit 127 carries the substrate W onto the substrate mounting table 105 using a substrate conveyance mechanism not shown, and holds the substrate W on the chuck. In S2, the main control section 127 performs preliminary measurement and correction for the global alignment process (pre-alignment process) of S6 described later. Specifically, the main controller 127 measures and corrects the deviation amount of the position, rotation, and the like of the substrate W using a low power alignment scope, not shown, so that the mark of the substrate enters the field of view of the high power alignment scope, not shown, used for the global alignment. In S3, the main controller 127 measures the surface heights of a plurality of portions of the substrate using the measuring unit 102, for example, and calculates and corrects the tilt of the entire substrate W (global tilt process). In this step, several imaging regions (sample imaging regions) among the plurality of imaging regions on the substrate W can be selected as a plurality of portions for measuring the surface height.
In S4, the main control unit 127 performs a determination process for determining a height control curve and a tilt control curve of the substrate W for scanning exposure. In the case where the height control curve is determined in advance without changing, only the tilt control curve can be determined in this step. This determination process is performed using, for example, a batch of front substrates and dummy substrates including a plurality of substrates W subjected to the same pretreatment, and this step can be omitted for the substrates W after the tilt control curve is determined. Here, the tilt control curve determination process may be performed for each imaging region of the substrate W (for example, front substrate or dummy substrate), but for example, imaging regions having the same shape may be grouped, and may be performed only for the representative imaging region of each group. The details of this step will be described later.
In S5, the main control unit 127 calculates and corrects correction values such as the tilt and field curvature of the projection lens in the projection optical system 101 (projection lens correction step). For the calculation of the correction value, a light amount sensor and a reference mark provided on the substrate stage 105 and a reference plate provided on the mask stage 103 can be used. Specifically, the main controller 127 causes the light quantity sensor to measure the change in the light quantity of the exposure light when the substrate mounting table 105 is scanned in each of the XYZ axes directions. Then, the main control section 127 obtains the amount of deviation of the reference mark from the reference plate based on the amount of change in the light amount which is the output of the light amount sensor, and calculates a correction value for correcting the amount of deviation.
In S6, the alignment mark on the substrate W is measured using a high magnification alignment scope (not shown), and the misalignment amount (including the rotational misalignment amount) of the entire substrate W and the misalignment amount common to the respective imaging regions are calculated and corrected (global alignment step). Here, in order to measure the alignment mark with high accuracy, the contrast of the alignment mark must be an optimal contrast position (height). For the measurement of the optimal contrast position, the measurement section 102 and the alignment observer can be used. Specifically, the main control unit 127 repeats the following steps several times: the substrate mounting table 105 is moved to a predetermined height (Z direction), the alignment scope is caused to measure the contrast, and the measuring unit 102 is caused to measure the surface height. At this time, the main control unit 127 stores the measurement result of the surface height in association with the measurement result of the contrast corresponding to each surface height. Then, the main control unit 127 determines the surface height with the highest contrast from the obtained measurement results of the plurality of contrasts, and determines the surface height as the optimum contrast position (height).
In S7, the main control unit 127 causes the measurement unit 102 to perform scanning exposure while measuring the surface position of the imaging region to be exposed (scanning exposure step). This step can be performed according to the method described in embodiment 1. Specifically, the main control unit 127 performs surface position measurement of the imaging area at the measurement point (204 or 205) of the measurement unit 102 before exposure of the irradiation area 202 while scanning the substrate W (imaging area), and performs height control and tilt control of the substrate W based on the measurement result. In the height control and the tilt control of the substrate W in this step, the height control curve and the tilt control curve determined in S4 can be applied to the imaging region of the exposure target. In this step, the entire imaging region on the substrate W can be scanned and exposed. In S8, the main controller 127 finishes holding the substrate W on the substrate mounting table 105, and carries the substrate W out of the substrate mounting table 105 by using a substrate transfer mechanism not shown. Thus, the series of exposure steps for 1 substrate W is completed. When another substrate W is present, the scanning exposure process can be repeated.
Next, the determination process of the tilt control curve performed in S4 of the flowchart shown in fig. 7 will be described. Fig. 8 is a flowchart showing a tilt control curve determination process. Each step in the flowchart can be controlled by the main control unit 127. In the present embodiment, an example will be described in which the substrate mounting table 105 is driven under a plurality of driving conditions having different driving parameters from each other, and the tilt control curve is determined using the driving condition in which the maximum value of the vibration (control deviation) of the substrate W is minimized among the plurality of driving conditions. As the drive parameters, for example, as described in embodiment 1, a drive limit value, a drive speed, a drive time, and the like of the substrate mounting table 105 can be used. In the following description, an example will be described in which the driving time of the substrate mounting table 105 is used as the driving parameter, and 4 types of driving conditions each differing by 1ms are used as the plurality of driving conditions in a period of the driving time of 8ms to 5 ms.
In S4-1, the main control portion 127 sets 1 driving condition of the plurality of driving conditions. In S4-2, the main controller 127 drives the substrate mounting base 105 using the 1 driving condition set in S4-1. In this step, it is preferable to drive the substrate mounting table 105 in the same manner as the scanning exposure in the step of S7, without irradiating the substrate W with exposure light. In this step, the surface position of the substrate W can be measured by the measuring unit 102 (which may be any of the measuring points 203 to 205) while the substrate mounting table 105 is being driven.
In S4-3, the main control section 127 acquires (calculates) the vibration (control deviation) of the substrate W from the result of the substrate surface measurement by the measuring section 102 during the driving of the substrate mounting table 105 in S4-2. In S4-4, the main control portion 127 determines whether or not the vibration of the substrate W is acquired under all of the plurality of driving conditions. In the present embodiment, it is determined whether or not the vibration of the substrate W is acquired for each of the 4 types of drive times 8ms, 7ms, 6ms, and 5ms as described above. In the case where the vibration of the substrate W is not acquired under all the driving conditions, the process returns to S4-1, the driving conditions are changed, and S4-1 to S4-3 are repeated. On the other hand, when the vibration of the substrate W is acquired under all the driving conditions, the process proceeds to S4-5.
In S4-5, the main control unit 127 determines a tilt control curve. For example, the main control unit 127 selects a driving condition that minimizes the maximum value of the vibration (control deviation) of the substrate W from among the plurality of driving conditions, and determines the tilt control curve by applying the selected driving condition to the driving curve of the substrate mounting table 105. The main controller 127 may determine the inclination control curve by applying the driving condition that minimizes the standard deviation of the vibration (control deviation) of the substrate W to the driving curve of the substrate mounting table 105, instead of applying the driving condition that minimizes the maximum value of the vibration of the substrate W to the driving curve of the substrate mounting table 105. Such a determination process of the tilt control curve can be performed for each imaging region (or each representative imaging region).
Here, the driving time of the substrate mounting table 105 is used as the driving parameter, but a driving limit value and a driving speed of the substrate mounting table 105 may be used as the driving parameter. For example, the amount of drive of the substrate stage 105 for disposing the surface of the substrate W at the best focus position differs depending on the flatness of the substrate W. When the flatness of the substrate W is low, the driving amount of the substrate mounting table 105 becomes large correspondingly, and when driving exceeding the driving performance of the substrate mounting table 105 is performed, the vibration of the substrate W may become large. Therefore, when a batch of substrates having a low flatness of the substrates W is subjected to exposure processing, it is preferable to use the drive limit value of the substrate mounting table 105 as the drive parameter. The flatness of the substrate W can be measured in advance by, for example, an external measuring device.
In addition, when the drive limit value of the substrate mounting table 105 is used as the drive parameter, the tilt of the substrate W does not reach the initial Target tilt (Target), and a control residual occurs, which may be disadvantageous in terms of the pattern forming accuracy of forming a pattern on the substrate. Therefore, when scanning exposure of the substrate W (batch) requiring high pattern formation accuracy is performed, or when the depth of focus of the projection optical system 101 is small, at least one of the drive time and the drive speed of the substrate mounting table 105 may be used as the drive parameter.
The time interval between the start of driving the substrate mounting table 105 and the start of exposure in the imaging region in the irradiation region 202 differs depending on the scanning speed of the substrate W (substrate mounting table 105) during scanning exposure. That is, the slower the scanning speed of the substrate W, the longer the time interval. Thus, if the time interval comparison is longer (than a predetermined interval), that is, if the scanning speed of the substrate W is slower (than a predetermined speed), it is effective to use at least one of the driving time and the driving speed of the substrate mounting table 105 as the driving parameter. For example, when exposure processing is performed on a substrate W (batch) whose scanning speed is relatively slow, at least one of the driving time and the driving speed of the substrate mounting table 105 is preferably used as the driving parameter. Further, even if the control gain of the PID compensator 127b is changed, the same effect can be obtained.
< embodiment of Process for producing article >
The method for manufacturing an article according to the embodiment of the present invention is suitable for manufacturing articles such as a micro device such as a semiconductor device and an element having a microstructure, for example. The method of manufacturing an article according to the present embodiment includes a step of forming a latent image pattern on a photosensitive agent applied to a substrate by using the exposure apparatus (a step of exposing the substrate), and a step of developing (processing) the substrate on which the latent image pattern has been formed in such a step. Further, such a manufacturing method includes other known steps (oxidation, film formation, vapor deposition, doping, planarization, etching, resist stripping, dicing, bonding, packaging, and the like). The method for manufacturing an article according to the present embodiment is advantageous in at least 1 of the performance, quality, productivity, and production cost of the article, as compared with the conventional method.
Other embodiments
Embodiments of the present invention may be implemented by a computer of a system or apparatus that reads and executes computer-executable instructions (e.g., one or more programs) recorded on a storage medium (also more fully referred to as a non-transitory computer-readable storage medium) to implement the functions of one or more of the above-described embodiments, and/or that includes one or more circuits (e.g., Application Specific Integrated Circuits (ASICs)) that implement the functions of one or more of the above-described embodiments, or by a method performed by a computer of a system or apparatus, such as: for example, computer-executable instructions are read from a storage medium and executed to implement the functions of one or more of the above-described embodiments and/or to control one or more circuits to implement the functions of one or more of the above-described embodiments. The computer may include one or more processors (e.g., a Central Processing Unit (CPU), a Microprocessor (MPU)) and may include a separate computer or a network of separate processors to read out and execute computer-executable commands. The computer-executable commands may be provided to the computer from a network or a storage medium, for example. The storage medium may include, for example, one or more hard disks, Random Access Memories (RAMs), Read Only Memories (ROMs), distributed computing storage systems, optical disks (e.g., Compact Disks (CDs), Digital Versatile Disks (DVDs), or blu-ray disks (BDs)), flash memories, memory cards, and so forth.
OTHER EMBODIMENTS
The embodiments of the present invention can also be realized by a method in which software (programs) that perform the functions of the above-described embodiments are supplied to a system or an apparatus through a network or various storage media, and a computer or a Central Processing Unit (CPU), a Micro Processing Unit (MPU) of the system or the apparatus reads out and executes the methods of the programs.
The present invention is not limited to the above-described embodiments, and various changes and modifications can be made without departing from the spirit and scope of the invention. Thus, the claims are added to disclose the scope of the invention.
Claims (10)
1. An exposure apparatus that exposes a shot region of a substrate by scanning the substrate with exposure light, the exposure apparatus comprising:
a measuring section that measures surface positions of the imaging region at a plurality of measurement points before exposure of the imaging region with the exposed light in a scanning process of the substrate; and
a control unit for controlling the inclination of the substrate based on the measurement result of the measurement unit,
starting tilt control of the substrate in a case where a surface position is measured at a predetermined number of measurement points among the plurality of measurement points,
the control unit determines a control curve used for tilt control of the substrate based on a time difference between a start time of tilt control of the substrate and an exposure start time of the imaging region by the exposure light.
2. The exposure apparatus according to claim 1,
the control unit determines the control curve so that the vibration of the substrate generated in the tilt control of the substrate when the time difference is smaller than a threshold value is smaller than the vibration of the substrate generated in the tilt control of the substrate when the time difference is larger than the threshold value.
3. The exposure apparatus according to claim 1,
the control unit determines the control curve so that the smaller the time difference is, the smaller the vibration of the substrate generated in the tilt control of the substrate is.
4. The exposure apparatus according to claim 1,
the control unit further controls the height of the substrate based on the measurement result of the measurement unit,
starting the height control of the substrate in a case where the surface position is measured at the 1 st number of measurement points among the plurality of measurement points,
starting tilt control of the substrate in a case where the surface position is measured at the predetermined number of measurement points among the plurality of measurement points, the predetermined number being a 2 nd number that is more than the 1 st number.
5. The exposure apparatus according to claim 1,
the exposure apparatus further includes a stage that holds the substrate and is movable,
the control unit controls the inclination of the substrate by driving the mounting table, and determines a driving curve of the mounting table as the control curve based on the time difference.
6. The exposure apparatus according to claim 5,
the control unit determines the drive curve by changing at least 1 of a drive speed of the table, a drive limit value for limiting a drive amount of the table, and a drive time of the table.
7. The exposure apparatus according to claim 1,
the plurality of measurement points are arranged in a direction intersecting with a scanning direction of the substrate.
8. The exposure apparatus according to claim 1,
the control unit determines the control curve based on the time difference when exposing a defective imaging region to which only a part of the pattern of the original plate is transferred.
9. The exposure apparatus according to claim 1,
the substrate includes a plurality of photographing regions,
the control unit determines the control curve for each imaging region.
10. A method of manufacturing an article, comprising:
an exposure step of exposing a substrate using the exposure apparatus according to any one of claims 1 to 9; and
a processing step of processing the substrate exposed in the exposure step,
and manufacturing an article from the substrate processed in the processing step.
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| JP2000003870A (en) * | 1999-06-14 | 2000-01-07 | Nikon Corp | Method and device for scanning exposure and manufacture of device using the same |
| JP2001168024A (en) * | 1999-09-29 | 2001-06-22 | Nikon Corp | Aligner and device producing method |
| JP2003203855A (en) * | 2002-01-10 | 2003-07-18 | Nikon Corp | Exposure method and aligner, and device manufacturing method |
| JP2010251788A (en) * | 2010-06-21 | 2010-11-04 | Canon Inc | Scanning-type exposure apparatus and device manufacturing method |
| CN109100920A (en) * | 2017-06-21 | 2018-12-28 | 佳能株式会社 | The manufacturing method of exposure device and article |
Also Published As
| Publication number | Publication date |
|---|---|
| JP7312053B2 (en) | 2023-07-20 |
| JP2021026113A (en) | 2021-02-22 |
| KR20210018057A (en) | 2021-02-17 |
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