TW202349137A - Scanning exposure apparatus, scanning exposure method, article manufacturing method, information processing apparatus, information processing method and memory medium having a scanning exposure apparatus with a measurement unit and a control unit - Google Patents

Abstract

The invention provides a technology that facilitates performing focus leveling control at a good scanning exposure accuracy. A scanning exposure apparatus includes: a measurement unit and a control unit. The measurement unit is configured to measure a surface height distribution of a substrate to be measured. The control unit is configured to control a scanning exposure of the substrate based on a piece of pre-generated drive control information and control at least one of a height and an inclination degree of the substrate according to the surface height distribution of the substrate measured by the measurement unit. The drive control information includes adjustment information to adjust at least one of the height and the inclination degree of the substrate during the scanning exposure. The control unit is configured to update the drive control information based on the surface height distribution of the substrate measured by the measurement unit when the substrate is in the scanning exposure.

Description

Scanning exposure device, scanning exposure method, article manufacturing method, information processing device, information processing method and memory medium

The present invention relates to a scanning exposure device, a scanning exposure method, a manufacturing method of an article, an information processing device, an information processing method and a storage medium.

As one of the devices used in the manufacturing process (lithography process) of semiconductor devices and the like, a scanning exposure device is known that performs scanning exposure of the substrate by scanning the substrate with exposure light. In such a scanning exposure apparatus, during scanning exposure of the substrate, the surface position of the substrate is measured (focus measurement) before exposure light is irradiated, and the height and inclination of the substrate are controlled (focus adjustment) based on the measurement results. level control). Patent Document 1 discloses a method of calculating in advance an offset value (correction value) for correcting a measurement error factor depending on the pattern structure of the irradiation area of the substrate, and using the focus measurement result based on the correction value After performing the correction, perform focus leveling control. [Prior technical literature] [Patent Document]

[Patent Document 1] Japanese Patent Application Laid-Open No. 9-45608

[Problem to be solved by the invention]

In a scanning exposure device, if defocus occurs during scanning exposure, exposure failure may occur and it may become difficult to accurately form a pattern on the substrate. Therefore, focus leveling control with better accuracy is required.

Therefore, an object of the present invention is to provide a technology that facilitates highly accurate focus leveling control in scanning exposure. [Means used to solve problems]

In order to achieve the above object, a scanning exposure apparatus according to one aspect of the present invention includes: a measurement unit that measures the surface height distribution of a substrate; and a control unit that controls the scanning exposure of the substrate based on previously generated drive control information. The scanning drive of the substrate is controlled while controlling at least one of the height and the inclination of the substrate according to the surface height distribution of the substrate measured by the measuring unit; the drive control information includes information for adjusting the scanning Adjustment information for at least one of the height and inclination of the substrate during exposure, the control unit updates the drive based on the surface height distribution of the substrate measured by the measurement unit during scanning exposure of the substrate Control information.

Further objects and other aspects of the present invention will become clear from preferred embodiments described below with reference to the drawings. [Invention effect]

According to the present invention, for example, it is possible to provide a technology that facilitates precise focus leveling control in scanning exposure.

Hereinafter, embodiments will be described in detail with reference to the drawings. In addition, the following embodiments do not limit the scope of the patent claims of the inventors. Although a plurality of features are described in the embodiments, it is not limited to the case where all of the features are necessary for the invention; in addition, the features may be combined arbitrarily. In addition, in the drawings, the same or identical components are denoted by the same reference symbols, and repeated explanations are omitted.

In this specification and the accompanying drawings, the direction is represented by an XYZ coordinate system in which the Z direction is parallel to the optical axis of the projection optical system, that is, the XYZ coordinate system in which the image plane of the projection optical system is the XY plane. Let the directions parallel to each of the X-axis, Y-axis and Z-axis in the XYZ coordinate system be the X-direction, Y-direction and Z-direction; let the rotation around the X-axis, the rotation around the Y-axis and the rotation around the Z-axis Each of them is θX, θY and θZ. The control and drive (movement) of the X-axis, Y-axis, and Z-axis respectively represent the control or drive (movement) in the direction parallel to the X-axis, the direction parallel to the Y-axis, and the direction parallel to the Z-axis. In addition, the control or driving of the θX axis, θY axis, and θZ axis respectively means control of rotation about an axis parallel to the X axis, rotation about an axis parallel to the Y axis, and rotation about an axis parallel to the Z axis. or drive.

<First Embodiment> The first embodiment of the present invention will be described. FIG. 1 is a schematic diagram illustrating a structural example of the scanning exposure device 100 according to this embodiment. The scanning exposure device 100 performs scanning exposure of the substrate 5 by relatively scanning and driving the original plate 2 and the substrate 5 with respect to the exposure light (slit light) having a rectangular or arcuate cross-sectional shape, and converts the pattern of the original plate 2 Printed on substrate 5. Such a scanning exposure device 100 is also called a step scanning exposure device or a scanning exposure machine.

As shown in FIG. 1 , the scanning exposure apparatus 100 includes an illumination optical system 1 , a master stage 3 , a projection optical system 4 , a substrate stage 6 , a measurement unit 7 , and a control unit 20 . The master stage 3 and the substrate stage 6 can constitute a positioning device for positioning the master 2 and the substrate 5 relative to each other.

The illumination optical system 1 illuminates the original plate 2 using light emitted from an exposure light source (not shown) that generates pulse light such as an excimer laser. The illumination optical system 1 includes, for example, a beam shaping optical system, an optical integrator, a collimating lens, a reflecting mirror, etc., and efficiently transmits or reflects pulse light in the far ultraviolet range and emits it as exposure light (slit light). A beam shaping optical system has a mechanism (such as a slit) that shapes the cross-sectional shape (size) of incident light into a preset shape (such as a rectangular shape or an arc shape), and uses light from an exposure light source to generate exposure light (a slit). sewing light). The exposure light has a cross-sectional shape that defines an illumination area on the original plate 2 , that is, a light irradiation area on the substrate 5 . In the case of this embodiment, the beam shaping optical system is configured to generate exposure light having a rectangular cross-sectional shape using light from the exposure light source. In addition, the optical integrator makes the light distribution characteristics uniform and illuminates the original plate 2 with uniform illumination.

The projection optical system 4 projects an image of the pattern of the original plate 2 illuminated by the illumination optical system 1 onto the substrate 5 . In FIG. 1 , the optical axis AX of the projection optical system 4 extends in the Z direction, and the image plane of the projection optical system 4 is a plane perpendicular to the Z direction (that is, the XY plane). The exposure light emitted from the illumination optical system 1 irradiates the original plate 2 , and an image of the pattern of the original plate 2 is formed on the projection optical system 4 at the magnification of the projection optical system 4 (for example, 1/4, 1/2, 1/5). Face.

The substrate 5 is, for example, a wafer with a resist (photosensitive agent) coated on its surface. On the substrate 5, a plurality of irradiation areas (exposed areas) having the same pattern structure formed by the previous photolithography process are arranged. The substrate stage 6 is a stage that moves the substrate 5 in order to hold it, and has a chuck that holds (adsorbs, fixes) the substrate 5 . In addition, the substrate stage 6 may include: an XY stage that can move horizontally in the X direction and the Y direction respectively; a Z stage that can move in the Z direction parallel to the optical axis AX of the projection optical system 4 (the height direction). Furthermore, the substrate stage 6 may also include: an adjustment platform that can rotate (tilt) in the θX direction about the . In this way, the substrate stage 6 can constitute a six-axis drive system for aligning the pattern image of the original plate 2 with the irradiation area of the substrate 5 . The positions of the substrate stage 6 in the X direction, the Y direction, and the Z direction can be measured at any time by the strip mirror 9 and the interferometer 22 arranged on the substrate stage 6 .

The original plate 2 (mask, reticle) has the pattern of each of the plurality of irradiation areas to be transferred to the substrate 5 and is held by the original plate 3 . The original plate 3 is scanned in the Y direction in a plane perpendicular to the optical axis AX of the projection optical system 4 . At this time, the master stage 3 is scanned so that the position in the Y direction of the master stage 3 always maintains the target position. The positions of the original plate 3 in the X direction and the Y direction can be measured at any time by the strip mirror 8 and the interferometer 21 arranged on the original plate 3 .

The measurement unit 7 measures the surface height distribution (surface position, surface shape) of the substrate 5 . In the case of this embodiment, the measurement unit 7 performs a pre-reading measurement during the scanning exposure of the substrate 5. In the pre-reading measurement, the substrate 5 (substrate stage 6) is in a moving state when the exposure light is irradiated. Previously, the surface height distribution of the substrate 5 was measured. In the example of FIG. 1 , the measurement unit 7 is of an oblique incidence type that irradiates light onto the substrate 5 from a direction, and includes an irradiation system that irradiates light to the substrate 5 and a light receiving system that receives light reflected by the substrate 5 . In addition, in the following, the measurement of the surface height distribution of the substrate 5 by the measurement unit 7 may be described as "focus measurement", and the measurement value obtained by the focus measurement may be described as "focus measurement value".

The illumination system of the measurement unit 7 may include, for example, the light source 70 , the collimating lens 71 , the slit member 72 , the optical system 73 , and the reflecting mirror 74 . The light source 70 is composed of, for example, a white lamp or a high-brightness light-emitting diode having a plurality of mutually different peak wavelengths, and emits light for focus measurement (measurement light). As the measurement light emitted from the light source 70, it is preferable to use light with a wavelength to which the resist on the substrate is not sensitive to light. The collimator lens 71 converts the light emitted from the light source 70 into a parallel beam with a substantially uniform cross-sectional light intensity distribution. The slit member 72 is composed of a pair of prisms bonded so that their inclined surfaces face each other. The bonding surface 72a is provided with a light-shielding film (chrome, etc.) in which a plurality of openings (for example, 6 pins) are formed. hole). The optical system 73 is a telecentric optical system on both sides, and allows a plurality of (for example, six) light beams that have passed through a plurality of openings in the slit member 72 (bonding surface 72 a ) to be incident on the substrate via the reflecting mirror 74 . The optical system 73 is configured so that the surface on which the opening is formed and the surface including the surface of the substrate 5 satisfy the Scheimpflug condition. By making the plurality of light beams incident on the substrate 5 in this way, focused measurement can be performed individually at each of the plurality of measurement points.

The light receiving system of the measurement unit 7 may include, for example, a reflecting mirror 75 , a light receiving optical system 76 , a correction optical system 77 , a photoelectric conversion unit 78 and a processing unit 79 . The reflecting mirror 75 guides the plurality of light beams reflected on the substrate 5 to the light-receiving optical system 76 . The light-receiving optical system 76 is a telecentric optical system on both sides and includes blocking apertures commonly provided for a plurality of light beams. Furthermore, the high-order diffracted light (noise light) generated by the circuit pattern formed on the substrate is blocked through the blocking aperture included in the light-receiving optical system 76 . The correction optical system 77 has a plurality of lenses (for example, six) corresponding to the plurality of light beams, and images the plurality of light beams on the light-receiving surface of the photoelectric conversion unit 78 to form pinhole images on the light-receiving surface. The photoelectric conversion unit 78 includes a plurality of (for example, 6) photoelectric conversion elements corresponding to a plurality of light beams. As the photoelectric conversion element, for example, a one-dimensional line sensor or a two-dimensional sensor composed of a CCD sensor, a CMOS sensor, or the like can be used. Furthermore, the processing unit 79 calculates the surface height (surface position) of the substrate at each measurement point on the substrate 5 based on the position of each pinhole image on the light-receiving surface of the photoelectric conversion unit 78 . Thereby, the measurement part 7 (processing part 79) can measure the surface height distribution of the area|region (range) to which a plurality of light beams are irradiated in the substrate 5.

The control unit 20 is composed of, for example, a computer including a processor such as a central processing unit (CPU) and a storage unit such as a memory, and controls scanning exposure of the substrate 5 by overall controlling each part of the scanning exposure apparatus 100 . The control unit 20 controls the master stage 3 holding the master 2 and the substrate stage 6 holding the substrate 5 so that the exposure light that has passed through the master 2 forms an image in a predetermined area (irradiation area) of the substrate 5 . For example, the control unit 20 controls the original plate stage 3 and the substrate stage 6 to adjust the positions of the original plate 2 and the substrate 5 in the XY plane (the position in the XY direction and the rotation in the θZ direction) and the position in the Z direction (θX direction and the respective rotations in the θY direction). In addition, the control unit 20 causes the master stage 3 and the substrate stage 6 to scan in synchronization with the projection optical system 4 . In this way, the control unit 20 controls the exposure process (scanning exposure) of exposing each irradiation area of the substrate 5 while scanning the substrate 5 with exposure light through the substrate stage 6 . For example, during scanning exposure of the substrate 5, the control unit 20 scan-drives the master stage 3 (master 2) in the direction of arrow A1, and moves the substrate stage 6 (substrate 5) in the direction of arrow A2 to correct the projection. The optical system 4 is scan-driven at a speed after magnification (magnification reduction). The scanning speed of the original plate 3 can be based on the width of the masking sheet in the illumination optical system 1 in the scanning direction and the sensitivity of the resist applied on the surface of the substrate 5 (or the intensity of the exposure light irradiated on the substrate 5). Decide in a way that is beneficial to the throughput.

Here, the pattern alignment of the original plate 2 in the XY plane can be performed based on the position of the original plate stage 3 , the position of the substrate stage 6 , and the position of each irradiation area on the substrate 5 relative to the substrate stage 6 . As mentioned above, the position of the master stage 3 and the position of the substrate stage 6 are measured by the interferometer 21 and the interferometer 22, respectively. The position of each irradiation area on the substrate 5 relative to the substrate stage 6 is obtained by detecting the position of the mark provided on the substrate stage 6 and the position of the alignment mark formed on the substrate 5 using an alignment detection unit (not shown). .

In addition, the control unit 20 can perform focus leveling control (also referred to as focus leveling drive) of the substrate 5 based on the measurement results of the measurement unit 7 . Focus leveling control refers to controlling the height (position in the Z direction) of the substrate 5 through the substrate stage 6 so that the surface of the substrate 5 (specifically, the surface of the light irradiation area on the substrate 5) is arranged at the target surface position. and tilt (tilt in the ωX direction and ωY direction). The target plane position can be set, for example, to the optimal focus position of the projection optical system 4 (image plane position of the projection optical system 4). In the case of this embodiment, the control unit 20 causes the measurement unit 7 to measure the surface height distribution of the substrate 5 (light irradiation area) during scanning exposure of the substrate 5 (each irradiation area). Focus leveling control of the substrate 5 is performed based on the height distribution of the substrate 5 . In addition, in the following, an example will be described in which focus leveling control is performed by using the substrate stage 6 to control both the height and the inclination of the substrate 5 during scanning exposure of the substrate 5. However, it is also possible to control only the height and inclination of the substrate 5. party.

Next, focus measurement using the measurement unit 7 will be described. FIG. 2 is a diagram illustrating the positional relationship between a plurality of (six) measurement points 31 to 32 formed on the irradiation area 5 a of the substrate by the measurement unit 7 and the light irradiation area 30 . The light irradiation area 30 is an area irradiated with exposure light from the projection optical system 4 as described above. In FIG. 2 , the light irradiation area 30 has a rectangular shape, but it may also have an arc shape. The measurement points 31 to 32 are points at which the surface height is measured by the measurement unit 7 before the exposure light of the light irradiation area 30 is irradiated, and are switched according to the scanning direction of the substrate 5 (substrate stage 6).

For example, when the substrate 5 is scan-driven in the direction of the arrow F to perform scanning exposure of the irradiation area 5a, focus measurement using three measurement points 31 is performed discretely before the exposure light is irradiated in the light irradiation area 30. . In this case, the control unit 20 obtains the surface height distribution of the portion where the focus measurement was performed based on the results of the focus measurement at the three measurement points 31 (focus measurement values), and sequentially calculates (determines) the distribution of the focus measurements. Partially configured focus leveling drive amount for the target surface position. Then, the control unit 20 supplies a command value corresponding to the calculated focus leveling drive amount to the substrate stage 6 so that the portion is arranged at the target plane position (the image plane position of the projection optical system 4 ) before reaching the light irradiation area 30 ). In this way, focus leveling control of the substrate 5 is performed. On the other hand, when scanning the substrate 5 in the direction of the arrow R to perform scanning exposure of the irradiation area 5a, focusing using three measurement points 32 is discretely performed before irradiation of the exposure light in the light irradiation area 30. Measurement. In this case, the focus leveling control of the substrate 5 can be performed in the same manner as when the substrate 5 is scan-driven in the direction of arrow F, except that the measurement point 32 is used for focus measurement instead of the measurement point 31 .

Next, the control of the substrate stage 6 by the control unit 20 will be described. FIG. 3 shows a control calculation unit of the substrate stage 6 included in the control unit 20 . The position information of the substrate stage 6 is input to the signal input unit 201 . The position information may include an interferometer 22 that measures the position of the substrate stage 6 in the XY direction, an interferometer (not shown) that measures the relative position of the substrate stage 6 and the stage, and/or an interferometer that measures the position of the substrate stage 6 in the Z direction. Each position data output by the Z sensor (not shown) of the position. This position information is delivered to the correction processing unit 202 and processed into data indicating the current position of each axis. The correction processing unit 202 reflects (references) the correction information 208 and corrects the position (height) and inclination (posture) of the substrate table 6 in the Z direction corresponding to the position in the XY direction of the substrate table 6 in real time. In the correction information 208, the position correction amount and the inclination correction amount of the substrate stage 6 in the Z direction are set as a function or table using the position of the substrate stage 6 in the XY direction as a variable.

The profiler 207 is configured to prevent continuous changes in the control target position (control target value) of the substrate stage 6 from being applied to the substrate stage 6 by acceleration exceeding a predetermined acceleration (upper limit acceleration) of the substrate stage 6 . That is, the analyzer 207 is used to move the substrate stage 6 by gradually changing the control target position so that the acceleration of the substrate stage 6 does not exceed a predetermined acceleration. The difference calculation unit 203 compares the output of the analyzer 207 with the output of the correction processing unit 202, and calculates the amount of deviation between the control target position and the current position. The deviation amount calculated by the difference calculation unit 203 is supplied to the servo compensation unit 204 . The servo compensation unit 204 implements a compensation function that takes into account the mechanical characteristics of the substrate stage 6 , such as a PID regulator, a notch filter, etc., and outputs a target control amount of the substrate stage 6 . The thrust distribution unit 205 distributes the target control amount output from the servo compensation unit 204 to each of the plurality of actuators provided on the substrate stage 6 . Specifically, the thrust distribution unit 205 determines the target operation amount of each actuator so that the target control amount is generated for the plurality of actuators as a whole. The target operation amount determined by the thrust distribution unit 205 is supplied to each actuator of the substrate stage 6 through the drive output unit 206 .

However, in the above-mentioned configuration, when the focus leveling driving amount is calculated based on the result of the focus measurement by the measuring unit 7 , it may be necessary to drive the substrate stage 6 (substrate 5 ) rapidly. That is, before the portion where the focus measurement is performed reaches the light irradiation area, it may become difficult to drive the substrate stage 6 in accordance with the focus leveling driving amount calculated from the result of the focus measurement. In this case, during the scanning exposure of the substrate 5 (each irradiation area), focus leveling control cannot be performed with high accuracy, and exposure defects caused by unintentional defocusing may occur. That is, it may become difficult to accurately form a pattern on the substrate.

FIG. 4 is a diagram for explaining the phenomenon of defocusing due to rapid driving of the substrate stage 6 . FIG. 4(a) shows the change in the inclination of the substrate table 6; FIG. 4(b) shows the attenuation tendency of the deviation amount of the substrate table 6. As shown in FIG. 4 , when the substrate stage 6 is driven rapidly, it takes time until the deviation amount of the substrate stage 6 becomes stable, and defocusing easily occurs.

Therefore, during the scanning exposure of the substrate 5 , the scanning exposure apparatus 100 of this embodiment controls the scanning drive of the substrate 5 based on the drive control information generated in advance, and also controls the scanning drive of the substrate 5 based on the surface height distribution of the substrate 5 measured by the measurement unit 7 for focus leveling control. The drive control information is information for controlling the drive of the substrate 5 during scanning exposure, and includes adjustment information for adjusting at least one of the height and inclination of the substrate 5 during scanning exposure. Here, at least one of the height and the inclination of the substrate 5 is regarded as indicating the height of the substrate 5 , the inclination of the substrate 5 , or the height and inclination of the substrate 5 . According to such control, at least one of the height and the inclination of the substrate 5 is corrected to a certain extent by scanning and driving the substrate 5 based on the drive control information (adjustment information). Therefore, the focus leveling drive amount calculated from the focus measurement result in the measurement unit 7 can be reduced. That is, sudden driving of the substrate stage 6 can be reduced. Therefore, the driving of at least one of the height and the inclination of the substrate 5 can be made to follow the focus leveling drive amount, and focus leveling control can be performed with high accuracy.

In addition, it is necessary to perform focus leveling control with higher accuracy, and to perform at least one of the height and inclination of the substrate 5 by scanning and driving the substrate 5 based on the drive control information (adjustment information) with higher accuracy. Correction is better. Therefore, the scanning exposure apparatus 100 of this embodiment updates (corrects, corrects) the drive control information (adjustment information) based on the surface height distribution of the substrate 5 measured by the measurement unit 7 during the scanning exposure of the substrate 5 . In addition, the drive control information can also be understood as information (data) indicating the drive target and/or trajectory of the substrate stage 6 (substrate 5) during scanning exposure.

Hereinafter, an operation example of the scanning exposure device 100 of this embodiment will be described. 5A to 5B are flowcharts illustrating the operation of the scanning exposure device 100 in this embodiment. The flowchart shown in FIGS. 5A and 5B shows an example of performing exposure processing (scanning exposure) on each of a plurality of substrates 5 included in one batch. In addition, each program in the flowchart shown in FIGS. 5A and 5B can be executed by the control unit 20 .

FIG. 5A shows the exposure process for the first (first, starting) substrate 5 among the plurality of substrates 5 in one batch. In the case of this embodiment, the first substrate 5 is a substrate (specific substrate) used to generate adjustment information included in the drive control information. In the following, the first substrate 5 may be described as "the first substrate 5". substrate".

In step S101 , the control unit 20 controls a substrate transport mechanism (not shown) to transport the first substrate onto the substrate stage 6 and hold (adsorb, fix) the first substrate on the substrate stage 6 . Next, in step S102, the control unit 20 performs focus measurement through the measurement unit 7 on several irradiation areas (sample irradiation areas) selected from the plurality of irradiation areas on the first substrate. The sample irradiation area can be selected arbitrarily (can be set). However, in the case of this embodiment, as shown in FIG. 6 , the irradiation area 5a1 among the plurality of irradiation areas 5a in the first substrate (substrate 5) can be selected. ~5a4 serves as the sample irradiation area.

In step S103, the control unit 20 calculates the tilt component (primary tilt amount) of the entire first substrate based on the surface height distribution obtained by the focus measurement in step S102, and drives the substrate stage 6 to correct the tilt component. For example, the control unit 20 performs a first-order approximation on the surface height distribution obtained in the focus measurement in step S102, thereby determining the entire first substrate as a first-order plane (hereinafter, may be described as an overall approximate plane). Then, the substrate stage 6 is driven so as to correct the tilt component of the overall approximate plane. That is, as shown in FIG. 7 , the control unit 20 drives the substrate stage 6 to reduce the entire tilt component (primary tilt amount α) of the first substrate (substrate 5 ), thereby adjusting the tilt of the first substrate. Here, when the first substrate is a substrate on which a device pattern (pattern structure) has been formed, an alignment process of the first substrate is performed. For example, the control unit 20 causes an alignment detection unit (not shown) to detect the positions of the alignment marks in the sample irradiation areas 5a1 to 5a4, and performs statistical processing on the detection results, thereby obtaining the values of the plurality of irradiation areas in the first substrate. Arrange information. Such alignment processing is called overall alignment. This allows the device pattern for each irradiation area and the measurement location of the focus measurement to be consistent within the range of alignment accuracy. That is, for each of the plurality of irradiation areas, focus measurement can be performed using the same portion of the same pattern structure in the irradiation area as the measurement portion.

In step S104, the control unit 20 drives the substrate stage 6 to arrange the first substrate at the start position of the scanning drive for the irradiation area to be subjected to the exposure process (hereinafter, sometimes referred to as the target irradiation area). That is, the first substrate is moved stepwise. When the step movement is completed, the control unit 20 starts scanning driving of the first substrate (target irradiation area) in step S105, and performs scanning exposure of the target irradiation area in step S106. In the scanning exposure, in step S107, the control unit 20 causes the measurement unit 7 to sequentially perform focus measurement of the target irradiation area before the exposure light (light irradiation area) approaches, and sequentially performs focusing on the first substrate based on the results of the focus measurement. Leveling control. Then, in step S108, the control unit 20 combines the focus measurement value during scanning exposure (that is, the surface height distribution of the target irradiation area) and the position of the first substrate (for example, the position of the light irradiation area in the target irradiation area). ) to establish correspondence and memorize them one by one. When the scanning exposure of the target irradiation area is completed, the control unit 20 ends the scanning drive of the first substrate (the target irradiation area) in step S109. As mentioned above, in this embodiment, the first substrate is used as a specific substrate for generating adjustment information. Therefore, in the scanning exposure of the first substrate, the height of the substrate based on the adjustment information is not performed. and control of at least one of incline.

In step S110, the control unit 20 determines whether scanning exposure has been performed on all of the plurality of irradiation areas on the first substrate. When there is an unprocessed irradiation area that has not been subjected to scanning exposure, steps S104 to S109 are performed using the unprocessed irradiation area as the target irradiation area. On the other hand, when all the irradiation areas have been scanned and exposed, the process proceeds to step S111 and the control unit 20 controls the substrate transport mechanism (not shown) to transport the first substrate from the substrate stage 6 .

In step S112, the control unit 20 generates drive control information (adjustment information) based on the focus measurement value memorized in step S108 (that is, the surface height distribution of the first substrate). For example, the control unit 20 determines the difference between the surface height distribution of the first substrate memorized in step S108 and the target plane position (image plane position of the projection optical system 4). Then, a drive curve for driving (adjusting) at least one of the height and the inclination of the substrate to correct the difference is generated as drive control information (adjustment information). In addition, drive control information (adjustment information) can be generated according to the radiation area. In addition, the drive control information (adjustment information) can be generated based on the overall approximate plane obtained in step S103.

FIG. 8 shows an example of displaying drive control information. The range RG shown by the dotted line in FIG. 8 represents the irradiation area (that is, the range of scanning exposure). The drive control information may include, for example, information on the target speed "V" of the substrate 5 during scanning exposure (Fig. 8(a)), and information on the target height "Z" (target position in the Z direction) (Fig. 8(b) ) and the information of the target inclination "Leveling" (Figure 8(c)). As shown in FIG. 8(a) , in the scanning exposure according to this embodiment, the substrate 5 is driven at a constant speed from the time the exposure light is irradiated to the irradiation area to the end. In addition, the target height information shown in FIG. 8(b) and the target inclination information shown in FIG. 8(c) may be used to adjust at least one of the height and inclination of the substrate during scanning exposure. adjustment information.

The drive control information is determined as the substrate surface shape based on the position of the first substrate (the positions Xij and Yij of the substrate stage 6) and the focus measurement value (the Z-direction position Zjk (k=1 to p) of the surface) memorized in step S108. The function Fnp(x, y) is generated as follows.

Based on the focus measurement value Zjk at the measurement point in the irradiation area, n×p substrate surface shape functions Fnp(x, y) are determined. The number of data points for each surface shape function is the m point of the sample irradiation grid Si (i=1~m). The degree and expansion formula of the curved surface of these substrate surface shape functions Fnp(x, y) are preset in the form of a predetermined polynomial. For example, if n×p is 7 or more, a 6th degree polynomial can also be used for approximation. In this case, the target height information (the trajectory of the focus correction drive) shown in FIG. 8(b) can be calculated according to the following formula using a0 to a6 as coefficients of the polynomial. The target inclination information (the trajectory of the inclination correction drive) shown in Figure 8(c) can also be calculated in the same way.

The coefficients of the polynomial are obtained by using the measured value Zjk as the surface position data and finding the coefficients that satisfy the following expression using the least squares method or the like. Based on the result calculated in this way, the information of the target height (the trajectory of the focus correction drive) and the information of the target inclination (the trajectory of the tilt correction drive) can be obtained as adjustment information. The adjustment information obtained in this way is set as correction information 208 in FIG. 3 . In addition, in the above description, although the degree of the curved surface of the substrate surface shape function Fnp(x, y) is set to 6th degree, it is not limited to 6th degree.

FIG. 5B shows the exposure process for the second and subsequent substrates 5 in the same batch as the first substrate. In the following, the second and subsequent substrates 5 may be described as “second substrates”.

In step S113 , the control unit 20 controls a substrate transport mechanism (not shown) to carry the second substrate onto the substrate stage 6 and hold (adsorb, fix) the second substrate on the substrate stage 6 . Next, in step S114, the control unit 20 performs focus measurement through the measurement unit 7 on several irradiation areas (sample irradiation areas) selected from the plurality of irradiation areas on the second substrate. In step S115, the control unit 20 obtains the overall approximate plane of the second substrate and drives the substrate stage 6 so that the inclination component of the overall approximate plane is corrected. In addition, steps S113 to S115 are the same procedures as the aforementioned steps S101 to S103, so detailed description here is omitted.

In step S116, the control unit 20 drives the substrate stage 6 to arrange the second substrate at the starting position of the scanning drive for the target irradiation area. That is, the second substrate is moved stepwise. When the step movement is completed, the control unit 20 starts scanning driving of the second substrate (target irradiation area) in step S117, and performs scanning exposure of the target irradiation area in step S118. During the scanning exposure of the second substrate, the control unit 20 controls the scanning drive of the second substrate (at least one of the height and inclination of the second substrate) based on the drive control information (adjustment information) generated in step S112 of FIG. 5A driver). In addition, during scanning exposure, in step S119, the control unit 20 causes the measurement unit 7 to sequentially perform focus measurement of the target irradiation area before the exposure light (light irradiation area) approaches, and sequentially performs the first step corresponding to the result of the focus measurement. 2 substrate focus leveling control. Then, in step S120, the control unit 20 uses the measured value obtained by the focus measurement during scanning exposure (that is, the surface height distribution of the target irradiation area) and the position of the second substrate (for example, the height distribution in the target irradiation area). The position of the light irradiation area) is established and memorized successively. When the scanning exposure of the target irradiation area is completed, the control unit 20 ends the scanning drive of the first substrate (the target irradiation area) in step S121.

Here, regarding the difference in the focus track for each irradiation area between the case where the adjustment information included in the drive control information is used as the correction information 208 in FIG. 3 during scanning exposure and the case where it is not used, refer to FIGS. 9 to 9 10 while explaining. When the adjustment information is not used in the scanning exposure, as shown by the arrow 40 in FIG. 9 , the focus correction drive and the tilt correction drive are not performed, so the plurality of irradiation areas 5 a are at certain Z-direction positions with respect to the XY plane. The substrate 5 is scan-driven. Therefore, the measured value obtained by the focus measurement during scanning exposure becomes large depending on the irradiation area, and it becomes difficult to drive the substrate 5 so as to follow the focus leveling drive amount corresponding to the measured value. On the other hand, when the adjustment information is used in scanning exposure, as shown by arrows 41 to 43 in FIG. 10 , the substrate 5 is scanned and driven using a drive track set for each irradiation area 5 a with respect to the XY plane. That is, the substrate 5 is scan-driven on a track corresponding to the surface shape of each irradiation area 5a. Therefore, the focus measurement value obtained during scanning exposure becomes smaller, and the substrate 5 can be driven to follow the focus leveling drive amount corresponding to the focus measurement value.

In step S122, the control unit 20 determines whether scanning exposure has been performed on all of the plurality of irradiation areas on the second substrate. When there is an unprocessed irradiation area that has not been subjected to scanning exposure, steps S116 to S121 are performed using the unprocessed irradiation area as the target irradiation area. On the other hand, when all the irradiation areas have been scanned and exposed, the process proceeds to step S123 and the control unit 20 controls the substrate transport mechanism (not shown) to transport the second substrate from the substrate stage 6 .

In step S124, the control unit 20 updates the drive control information (adjustment information) based on the focus measurement value memorized in step S120 (that is, the surface height distribution of the second substrate). For example, the control unit 20 determines the difference between the surface height distribution of the second substrate memorized in step S120 and the target plane position (image plane position of the projection optical system 4). Then, the driving amount of at least one of the height and the inclination of the substrate in the adjustment information is corrected (corrected) so as to reduce (correct) the difference, thereby updating the drive control information (adjustment information). In addition, the drive control information (adjustment information) can be updated according to the radiation area. In addition, the drive control information (adjustment information) can be updated based on the overall approximate plane obtained in step S115.

Here, when the control unit 20 has previously performed scanning exposure on two or more substrates, step S124 may be based on the surface height distribution obtained through focus measurement in each scanning exposure of the two or more substrates. , update driver control information. For example, the control unit 20 may newly generate adjustment information based on the surface height distribution obtained by scanning exposure of the first substrate and the surface height distribution obtained by scanning exposure of the second substrate. Specifically, the control unit 20 performs statistical processing using the surface height distribution obtained for each irradiation area by scanning exposure through the first substrate and the surface height distribution obtained for each irradiation area by scanning exposure through the second scanning exposure. Then, at least one of the height and the inclination for driving (adjusting) the substrate is newly generated in such a manner that the difference between the value obtained through the statistical processing and the target plane position (the image plane position of the projection optical system 4 ) is reduced. adjustment information. In addition, in this embodiment, newly generated drive control information (adjustment information) is considered to be included in the "update of drive control information".

In addition, the control unit 20 may update the drive control information based on the surface height distribution obtained by scanning exposure of two or more second substrates. Specifically, the control unit 20 obtains a representative value of the surface height distribution obtained for each irradiation area in the scanning exposure of two or more second substrates. Then, the driving amount of at least one of the height and inclination of the substrate in the adjustment information is corrected (corrected) in such a way that the difference between the representative value and the target plane position (image plane position of the projection optical system 4) is reduced, thereby Update driver control information (adjustment information). In addition, as the representative value, any of the minimum value, the maximum value, and the average value (moving average) can be applied, but it is preferable to use the average value. Therefore, for example, when scanning exposure is performed on each of a plurality of substrates having the same pattern structure in the same batch, the drive control information (adjustment information) is updated every time scanning exposure is performed.

Furthermore, when the number of substrates is increased and the exposure process is continued, the control unit 20 may also compare the drive control information of each irradiation area averaged through statistical processing with the n-th substrate (n=1～ The focus measurement values in N) substrates are compared to determine abnormalities in the measurement values in the irradiation area. For example, the control unit 20 may compare the focus measurement value in the irradiation area of the n-th substrate with the focus measurement value in the irradiation area at the same position up to the (n-1)-th substrate, and determine whether the change amount is greater than the preset value. If the set quality judgment reference value (allowable value) is large, it is determined to be an abnormal value. When an abnormal value occurs, defocus can be reduced by excluding it from the calculation of the correction position of the substrate (that is, the calculation of the focus leveling drive amount) during scanning exposure of the substrate. Alternatively, you can also use the quality criterion to drive within a predetermined range. When the drive upper limit value is set in advance for the focus leveling drive amount, rapid drive of the substrate 5 (substrate stage 6) can be avoided, and therefore the effect of reducing the occurrence of defocus can be expected.

In step S125, the control unit 20 determines whether scanning exposure has been performed on all the plurality of substrates in the batch. If there is an unprocessed substrate that has not been subjected to scanning exposure, steps S113 to S124 are performed using the unprocessed substrate as the second substrate. In the scanning exposure in this case, the scanning drive of the second substrate is controlled based on the drive control information (adjustment information) updated in step S124 for the previous substrate. On the other hand, when all the substrates in the batch are scanned and exposed, the process ends.

As described above, during the scanning exposure of the substrate 5 , the scanning exposure apparatus 100 of this embodiment controls the scanning drive of the substrate 5 based on the drive control information generated in advance, and the surface of the substrate 5 measured by the measurement unit 7 Height distribution for focus leveling control. In addition, the drive control information (adjustment information) is updated based on the surface height distribution of the substrate 5 measured by the measurement unit 7 during the scanning exposure of the substrate 5 . This can reduce the situation in which the driving of the substrate cannot follow the focus leveling drive amount corresponding to the focus measurement value during scanning exposure, and a stable exposure process can be performed. That is, defocusing during scanning exposure can be reduced, and the pattern of the master plate can be accurately transferred to the substrate.

<Second Embodiment> A second embodiment of the present invention will be described. In the above-described first embodiment, an example has been described in which the first substrate (first substrate) in the batch is used as a specific substrate for generating adjustment information. The focus measurement value obtained by scanning the exposure is used to generate drive control information (adjustment information). In this embodiment, an example will be described. In this example, a substrate to be subjected to scanning exposure is used. Prior to the scanning exposure, focus measurement is performed while scanning the substrate without irradiation of exposure light. Based on the transmission The surface height distribution obtained by focusing the measurement is used to generate drive control information (adjustment information). In addition, this embodiment basically succeeds the first embodiment, and can comply with the first embodiment except for the matters mentioned below.

11A to 11B are flowcharts illustrating the operation of the scanning exposure device 100 according to this embodiment. The flowchart shown in FIGS. 11A and 11B shows an example of performing exposure processing (scanning exposure) on each of a plurality of substrates 5 included in one batch. In addition, each program in the flowchart shown in FIGS. 11A and 11B can be executed by the control unit 20 .

FIG. 11A shows the process of generating adjustment information. In the case of this embodiment, the adjustment information can be generated using the first (first, starting) substrate among the plurality of substrates 5 in one batch.

In step S201 , the control unit 20 controls a substrate transport mechanism (not shown) to carry the substrate onto the substrate stage 6 and hold (adsorb, fix) the substrate on the substrate stage 6 . Next, in step S202, the control unit 20 performs focus measurement through the measurement unit 7 on several irradiation areas (sample irradiation areas) selected from a plurality of irradiation areas on the substrate. In step S203, the control unit 20 obtains the overall approximate plane of the substrate and drives the substrate stage 6 so that the inclination component of the overall approximate plane is corrected. In addition, steps S201 to S203 are the same procedures as steps S101 to S103 in FIG. 5A described in the first embodiment, so detailed description here is omitted.

In step S204, the control unit 20 drives the substrate stage 6 to arrange the substrate at the start position of the scanning drive for the irradiation area (hereinafter, sometimes referred to as the target irradiation area) that is the target for focus measurement. That is, the substrate is moved stepwise. When the step movement is completed, the control unit 20 starts the scanning drive of the substrate (target irradiation area) in step S205, and causes the measurement unit 7 to sequentially perform focus measurement of the target irradiation area in step S206. Then, in step S207 , the control unit 20 associates the measurement values obtained through the focus measurement (that is, the surface height distribution of the target irradiation area) with the positions of the substrate and sequentially memorizes them. When the focus measurement of the target irradiation area is completed, the control unit 20 ends the scanning drive of the substrate (the target irradiation area) in step S208.

In step S209, the control unit 20 determines whether focus measurement has been performed on all of the plurality of irradiation areas in the substrate. If there is an irradiation area for which focus measurement has not been performed, steps S204 to S208 are performed using the irradiation area as the target irradiation area. On the other hand, when the entire irradiation area is scanned and exposed, the process proceeds to step S210. In step S210, the control unit 20 generates drive control information (adjustment information) based on the focus measurement value memorized in step S207 (that is, the surface height distribution of the substrate). Step S210 is the same procedure as step S112 of FIG. 5A described in the first embodiment, so detailed description here is omitted.

FIG. 11B shows the exposure process for each of the plurality of substrates in the batch. Hereinafter, the substrate to be subjected to the exposure process among the plurality of substrates 5 in the batch may be described as a “target substrate”. In addition, in the case of this embodiment, the first exposure process in FIG. 11B is performed using the substrate used for generating the adjustment information in FIG. 11A as the target substrate.

In step S211, the control unit 20 performs focus measurement through the measurement unit 7 on several irradiation areas (sample irradiation areas) selected from a plurality of irradiation areas on the target substrate. In step S212, the control unit 20 obtains a general approximate plane of the target substrate and drives the substrate stage 6 so that the tilt component of the general approximate plane is corrected. In addition, steps S211 to S212 are the same procedures as steps S114 to S115 in FIG. 5B described in the first embodiment, so detailed description here is omitted. In addition, if it is known in advance that the change in at least one of the height and the inclination of the substrate based on the procedure of FIG. 11A is small, steps S211 to S212 may be omitted.

Steps S213 to S218 are procedures for performing scanning exposure of the target substrate. Steps S213 to S218 are the same procedures as steps S116 to S121 in FIG. 5B described in the first embodiment, so detailed description here is omitted. Next, in step S219, the control unit 20 determines whether scanning exposure has been performed on all of the plurality of irradiation areas in the target substrate. If there is an unprocessed irradiation area that has not been subjected to scanning exposure, steps S213 to S218 are performed using the unprocessed irradiation area as the target irradiation area. On the other hand, when all the irradiation areas have been scanned and exposed, the process proceeds to step S219 and the control unit 20 controls the substrate transport mechanism (not shown) to transport the first substrate from the substrate stage 6 .

In step S221, the control unit 20 updates the drive control information (adjustment information) based on the focus measurement value memorized in step S217 (that is, the surface height distribution of the target substrate). Step S221 is the same procedure as step S124 in FIG. 5B described in the first embodiment, so detailed description here is omitted.

In step S222, the control unit 20 determines whether scanning exposure has been performed on all the plurality of substrates in the batch. If there is an unprocessed substrate that has not been subjected to scanning exposure, the process proceeds to step S223 , where the unprocessed substrate is loaded onto the substrate stage 6 as a target substrate, and the target substrate is held (adsorbed, fixed) on the substrate stage 6 . Then, steps S211 to S221 are performed on the target substrate. In the scanning exposure in this case, the scanning drive of the target substrate is controlled based on the drive control information (adjustment information) updated in step S221 for the previous substrate. On the other hand, when all the substrates in the batch are scanned and exposed, the process ends.

As described above, in this embodiment, drive control information (adjustment information) is generated based on the result of focus measurement while scanning the drive substrate without irradiation of exposure light. According to this embodiment, like the first embodiment, it is possible to reduce the situation where the driving of the substrate cannot follow the focus leveling drive amount corresponding to the focus measurement value during scanning exposure, and a stable exposure process can be performed. That is, defocusing during scanning exposure can be reduced, and the pattern of the master plate can be accurately transferred to the substrate.

<3rd Embodiment> A third embodiment of the present invention will be described. In the above-mentioned first and second embodiments, an example in which the drive control information (adjustment information) is generated in the scanning exposure device 100 has been described. In this embodiment, an example in which drive control information is generated and updated in an external information processing device communicably connected to the scanning exposure device 100 will be described. In addition, this embodiment basically succeeds the first and second embodiments, and can comply with the first and second embodiments except for the matters mentioned below.

FIG. 12 is a schematic diagram illustrating a configuration example of the system S according to this embodiment. The system S of this embodiment may include a scanning exposure device 100 and an information processing device 200 . Since the scanning exposure device 100 is the same as the first embodiment, detailed description is omitted.

The information processing device 200 is communicatively connected to the scanning exposure device 100 (control unit 20 ), and may include a processing unit 13 , a display unit 17 and an input unit 18 . The processing unit 13 is composed of, for example, a computer including a processor such as a central processing unit (CPU) and a storage unit such as a memory. The processing unit 13 of this embodiment may include: an acquisition unit 14 that acquires information from the scanning exposure device 100; a generation unit 15 that generates (updates) drive control information based on the information acquired by the acquisition unit 14; and a supply unit 16 , which supplies (sends, provides) drive control information to the scanning exposure device 100 . The acquisition unit 14 and the supply unit 16 can also be understood as a unit, and this unit constitutes a communication unit that communicates with the scanning exposure device 100 to send and receive information.

The acquisition unit 14 acquires information such as the surface height distribution of the substrate obtained through focus measurement by the measurement unit 7 of the scanning exposure apparatus 100 .

The generation unit 15 determines the difference between the surface height distribution of the substrate acquired by the acquisition unit 14 and the target plane position (the image plane position of the projection optical system 4 ). Then, the generation unit 15 generates (updates) a drive curve for driving (adjusting) at least one of the height and inclination of the substrate so as to correct the difference, as drive control information (adjustment information). The generation (update) of drive control information (adjustment information) is the same as in the first embodiment, so detailed description is omitted.

The supply unit 16 supplies (transmits, provides) the drive control information generated (updated) by the generation unit 15 to the scanning exposure apparatus 100 .

In addition, the information processing device 200 can also be connected to a plurality of scanning exposure devices 100 in a communicable manner, obtain information such as the surface height distribution of the substrate from each of the plurality of scanning exposure devices 100, and provide the information to the plurality of scanning exposure devices 100. Each scanning exposure device of 100 supplies drive control information.

In addition, the information processing device 200 can also generate (update) drive control information for a plurality of batches to which the substrates 5 having the same pattern structure belong.

In addition, the information processing device 200 can also be connected to an external memory unit (not shown) with a larger capacity to store information such as the height distribution of the substrate measured by the scanning exposure device 100 and the generated (updated) drive control information. As a result, more information is stored in the external memory, and the information processing device 200 can use a large amount of information for statistical processing, thereby improving the reliability of the generated (updated) drive control information.

As described above, in this embodiment, the information processing device 200 generates (updates) drive control information. Thereby, the processing for generating (updating) the drive control information is dispersed, and a delay in the processing by the control unit 20 in the scanning exposure apparatus 100 is suppressed.

In addition, during the scanning exposure of the substrate 5 , the scanning exposure device 100 controls the scanning drive of the substrate 5 based on the generated drive control information, and uses the scanning exposure device 100 to control the scanning drive of the substrate 5 based on the surface height of the substrate 5 measured by the measurement unit 7 . Distributed for focus leveling control. In addition, the information processing device 200 updates the drive control information (adjustment information) based on the surface height distribution of the substrate 5 measured by the measurement unit 7 during the scanning exposure of the substrate 5 and supplies it to the scanning exposure device 100 . This can reduce the situation in which the driving of the substrate cannot follow the focus leveling drive amount corresponding to the focus measurement value during scanning exposure, and a stable exposure process can be performed. That is, defocusing during scanning exposure can be reduced, and the pattern of the master plate can be accurately transferred to the substrate.

＜Embodiment of manufacturing method of article＞ The method of manufacturing an article according to an embodiment of the present invention is suitable for manufacturing articles such as microdevices such as semiconductor devices and elements having a fine structure. The manufacturing method of an article according to this embodiment includes: a process of forming a latent image pattern on a photosensitive agent applied to a substrate using the above-mentioned scanning exposure device (a process of exposing the substrate); and processing the substrate on which the latent image pattern is formed. (Development) process; and the process of manufacturing articles from the processed substrate. Furthermore, the manufacturing method includes other well-known procedures (oxidation, film formation, evaporation, doping, planarization, etching, resist stripping, cutting, bonding, packaging, etc.). The method of manufacturing an article according to this embodiment is advantageous in at least one of the performance, quality, productivity, and production cost of the article compared with conventional methods.

<Other Examples> The present invention can also provide a program that implements one or more functions of the above-described embodiments to a system or device through a network or a storage medium, and use one or more processors in a computer of the system or device to execute the program. The processing of reading and executing is realized. In addition, it can also be implemented through a circuit (for example, ASIC) that implements more than one function.

The invention is not limited to the above-described embodiments, and various changes and modifications can be made without departing from the spirit and scope of the invention. Therefore, the patent application is drafted to disclose the scope of the invention.

1: Illumination optical system 2:Original version 3:Original station 4: Projection optical system 5:Substrate 6:Substrate table 7: Measurement Department 20:Control Department

[Fig. 1] Schematic diagram illustrating a configuration example of a scanning exposure device [Fig. 2] A diagram illustrating the positional relationship between a plurality of measurement points using the measurement unit and the light irradiation area. [Fig. 3] Diagram illustrating the control arithmetic unit of the substrate stage included in the control unit [Fig. 4] A diagram for explaining the phenomenon of defocusing due to rapid driving of the substrate stage. [Fig. 5A] A flowchart illustrating the operation of the scanning exposure device according to the first embodiment. [Fig. 5B] A flowchart illustrating the operation of the scanning exposure device according to the first embodiment. [Fig. 6] Diagram illustrating selection examples of sample irradiation areas [Fig. 7] A diagram for explaining the tilt component of the entire substrate [Fig. 8] Diagram illustrating an example of drive control information [Figure 9] A diagram used to illustrate the focus track when adjustment information is not used in scan exposure. [Figure 10] A diagram for explaining the focus track when adjustment information is used in scan exposure. [Fig. 11A] A flowchart illustrating the operation of the scanning exposure device according to the second embodiment. [Fig. 11B] A flowchart illustrating the operation of the scanning exposure device according to the second embodiment. [Fig. 12] Schematic diagram illustrating a configuration example of the system according to the third embodiment.

1: Illumination optical system

2:Original version

3:Original station

4: Projection optical system

5:Substrate

6:Substrate table

7: Measurement Department

8: Strip reflector

9: Strip reflector

20:Control Department

21:Interferometer

22:Interferometer

70:Light source

71:Collimating lens

72: Slit member

72a: Fitting surface

73:Optical system

74:Reflector

75:Reflector

76: Light-receiving optical system

77:Correction optical system

78: Photoelectric conversion department

79:Processing Department

100:Exposure device

A1: Arrow

A2:Arrow

AX: optical axis

Claims (14)

A scanning exposure device, Has: a measurement unit that measures the surface height distribution of the substrate; and A control unit that, during scanning exposure of the substrate, controls the scanning drive of the substrate based on drive control information generated in advance and controls the height and height of the substrate based on the surface height distribution of the substrate measured by the measurement unit. at least one of the inclinations; The aforementioned drive control information includes adjustment information for adjusting at least one of the height and inclination of the aforementioned substrate during scanning exposure, The control unit updates the drive control information based on the surface height distribution of the substrate measured by the measurement unit during scanning exposure of the substrate. The scanning exposure apparatus according to claim 1, wherein when the control unit performs scanning exposure on two or more substrates, the control unit measures based on the measurement unit during the scanning exposure of each of the two or more substrates. The surface height distribution is updated to update the aforementioned drive control information. The scanning exposure device of claim 2, wherein, The control unit updates the drive control information based on the representative value of the surface height distribution measured by the measurement unit during the scanning exposure of the two or more substrates, The aforementioned representative value is any one of the maximum value, the minimum value, and the average value. The scanning exposure device of claim 2 or 3, wherein the two or more substrates are included in the same batch. The scanning exposure device of any one of claims 1 to 3, wherein, The aforementioned substrate includes a plurality of irradiation areas that are respectively subjected to scanning exposure, The aforementioned drive control information is generated according to the radiation area and updated according to the radiation area. The scanning exposure apparatus according to any one of claims 1 to 3, wherein the control section is based on the measurement section of the specific substrate measured by the measurement section during the scanning exposure of the specific substrate performed before the scanning exposure of the substrate. Surface height distribution generates the aforementioned drive control information. The scanning exposure apparatus of claim 6, wherein the scanning exposure of the specific substrate is performed by scanning and driving the substrate without using the drive control information. The scanning exposure apparatus of claim 6, wherein the specific substrate is included in the same batch as the substrate. The scanning exposure apparatus according to any one of claims 1 to 3, wherein the control unit generates the drive control information based on a result of causing the measurement unit to measure the surface height distribution of the substrate before scanning exposure of the substrate. A scanning exposure method, Include: A generation program that generates drive control information, where the drive control information includes adjustment information for adjusting at least one of the height and inclination of the substrate during scanning exposure; An exposure program that controls at least one of the height and inclination of the substrate based on the measured value of the surface height distribution of the substrate while controlling the scanning drive of the substrate based on the drive control information generated by the generation process. , thereby performing scanning exposure of the aforementioned substrate; and An update program updates the drive control information based on the measured value of the surface height distribution of the substrate obtained in the exposure process. A method of making an item, including: A process of performing scanning exposure of the substrate using the scanning exposure method of claim 10; A procedure for processing the aforementioned substrate subjected to the aforementioned scanning exposure; and A process for manufacturing articles from the processed substrates described above. An information processing device is communicatively connected to a scanning exposure device that performs scanning exposure of a substrate, Has: an acquisition unit that acquires the surface height distribution of the substrate measured by the measurement unit of the scanning exposure device; A generating unit that generates drive control information based on the surface height distribution of the substrate acquired through the acquisition unit. The drive control information includes at least one of the height and inclination of the substrate before the scanning exposure. adjustment information for users; and a supply unit that supplies the drive control information generated by the generation unit to the scanning exposure device; The scanning exposure device controls the scanning drive of the substrate based on the drive control information supplied through the supply unit, and controls the height and inclination of the substrate based on the surface height distribution of the substrate measured by the measurement unit. At least one of the degrees, The generating unit updates the drive control information based on the surface height distribution of the substrate measured by the measuring unit during scanning exposure of the substrate. An information processing method for processing information of a scanning exposure device that performs scanning exposure of a substrate, Include: An acquisition program for acquiring the surface height distribution of the substrate measured by the measurement unit of the scanning exposure device; A generation program that generates drive control information based on the surface height distribution of the substrate obtained in the acquisition process, and the drive control information includes at least one of the height and inclination of the substrate before the scanning exposure. Adjustment information for one use; A supply program that supplies the aforementioned driving control information generated by the aforementioned generating program to the aforementioned scanning exposure device; The scanning exposure device controls the scanning drive of the substrate based on the drive control information supplied in the supply process, and controls the height and inclination of the substrate based on the surface height distribution of the substrate measured by the measurement unit. at least one of, The method further includes an update program, wherein the update program updates the drive control information based on the surface height distribution of the substrate measured by the measurement unit during scanning exposure of the substrate. A memory medium that stores a program for causing a computer to execute the information processing method of claim 13.

Images