CN112317245A - Anti-leakage semiconductor packaging glue dispensing device utilizing pneumatic linkage - Google Patents
Anti-leakage semiconductor packaging glue dispensing device utilizing pneumatic linkage Download PDFInfo
- Publication number
- CN112317245A CN112317245A CN202011158675.0A CN202011158675A CN112317245A CN 112317245 A CN112317245 A CN 112317245A CN 202011158675 A CN202011158675 A CN 202011158675A CN 112317245 A CN112317245 A CN 112317245A
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- Prior art keywords
- fixedly connected
- pipe
- glue
- air
- dispensing
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
- B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
- B05C5/0208—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work for applying liquid or other fluent material to separate articles
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B15/00—Details of spraying plant or spraying apparatus not otherwise provided for; Accessories
- B05B15/50—Arrangements for cleaning; Arrangements for preventing deposits, drying-out or blockage; Arrangements for detecting improper discharge caused by the presence of foreign matter
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
- B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
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Abstract
The invention relates to the technical field of semiconductor manufacturing, and discloses an anti-leakage semiconductor packaging and dispensing device utilizing pneumatic linkage, which comprises a dispensing table, wherein the top of the dispensing table is fixedly connected with a side plate, one side of the side plate is fixedly connected with an air bag, the air outlet end of the air bag is fixedly connected with an air conveying pipe, the outer side wall of the air conveying pipe is fixedly connected with a supporting pipe and a branch pipe, and the outer side wall of the supporting pipe is fixedly connected with a vertical pipe; the device does not need the mode of hydraulic pressure or pump just can glue, a large amount of electric quantities have been saved, and simultaneously, owing to set up into gluey head and interior fender ring, after the completion is glued to the point, gaseous discharge standpipe, make sliding support no longer receive gaseous support, make the sliding sleeve on the sliding support restore to the throne downwards under the effect of gravity and spring, make into gluey head slip in interior fender ring, the entrance point that makes into gluey head both sides is blockked by interior fender ring, thereby effectively avoided overflowing of colloid, promote the device's the quality of gluing.
Description
Technical Field
The invention relates to the technical field of semiconductor manufacturing, in particular to an anti-leakage semiconductor packaging and dispensing device utilizing pneumatic linkage.
Background
A semiconductor chip refers to a semiconductor device which is etched and wired on a semiconductor wafer to realize a certain function. The semiconductor packaging refers to a process of processing a wafer passing a test according to a product model and a functional requirement to obtain an independent chip. The packaging process comprises the following steps: the wafer from the previous process of the wafer is cut into small chips through a scribing process, then the cut chips are pasted on the corresponding small islands of the substrate frame through glue, and then the bonding pads of the chips are connected to the corresponding pins of the substrate through superfine metal wires or conductive resin to form a required circuit; then the independent chip is packaged and protected by a plastic shell, and at present, the semiconductor package is mainly packaged by a dispenser.
In the prior art, when semiconductor is packaged and dispensed, a hydraulic or pump mode is mostly adopted to convey resin colloid to a dispensing head for dispensing, so that a large amount of electric quantity is consumed for dispensing, meanwhile, the anti-overflow effect cannot be well achieved, and in addition, in the dispensing process, if the dispensing head contains residues, the subsequent dispensing operation can be influenced.
Disclosure of Invention
Technical problem to be solved
Aiming at the defects of the prior art, the invention provides an anti-leakage semiconductor packaging dispensing device utilizing pneumatic linkage, which has the advantages of utilizing pneumatic control for dispensing operation, avoiding using redundant electric appliances, saving electric power, simultaneously avoiding overflowing phenomenon and utilizing an airflow control cutting knife to cut residual resin colloid, avoiding residual, solving the problems that when packaging dispensing is carried out on a semiconductor, a hydraulic or pump mode is mostly adopted to convey the resin colloid to a dispensing head for dispensing, so that the dispensing needs to consume a large amount of electric quantity, and meanwhile, the anti-overflowing effect cannot be well achieved.
(II) technical scheme
In order to achieve the purpose, the invention provides the following technical scheme: an anti-leakage semiconductor packaging glue dispensing device utilizing pneumatic linkage comprises a glue dispensing table, wherein the top of the glue dispensing table is fixedly connected with a side plate, one side of the side plate is fixedly connected with an air bag, the air outlet end of the air bag is fixedly connected with an air conveying pipe, the outer side wall of the air conveying pipe is fixedly connected with a supporting pipe and a branch pipe, the outer side wall of the supporting pipe is fixedly connected with a vertical pipe, the other side of the side plate is fixedly connected with a glue storage box, the top of the glue storage box is fixedly connected with a glue supplementing pipe, the bottom of the glue storage box is fixedly connected with a glue dispensing cylinder, the inner side wall of the glue dispensing cylinder is fixedly connected with an inner retaining ring, the bottom of the glue dispensing cylinder is fixedly connected with a sliding sleeve, the outer side wall of the sliding sleeve is fixedly connected with a sliding support, the bottom of the sliding, the top end of the connecting rubber tube is fixedly connected with a rubber inlet head;
the lower part of the dispensing head is movably connected with a shear plate, the outer side wall of the shear plate is connected with a cam in a sliding mode, and one side of the shear plate is fixedly connected with a reset spring and a cutting knife.
Preferably, the air inlet end of the supporting tube is communicated with the conveying air pipe, the air outlet end of the supporting tube is communicated with the vertical tube, and the pulse air flow in the conveying air pipe is conveyed into the vertical tube through the supporting tube.
Preferably, the inside wall sliding connection of standpipe has sliding support, the lateral wall fixedly connected with snuffle valve of standpipe, the pulse air current in the standpipe promotes the sliding support in the standpipe, and simultaneously, the snuffle valve is discharged the air current, makes sliding support promote to certain degree after, and the air current is discharged by the snuffle valve, and the air current no longer exerts the holding power to sliding support, resets under the effect of gravity.
Preferably, the inner baffle ring is a pipe body with upper and lower ends sunken inwards, the inner baffle ring is located at the middle section position of the dispensing cylinder, the inner baffle ring is tightly attached to the glue inlet head, and the inlet end of the glue inlet head is blocked by the inner baffle ring.
Preferably, the glue inlet head is a three-way pipe, the two sides of the glue inlet head are inlet ends, the bottom end of the glue inlet head is an outlet end, and the resin colloid enters from the two ends of the glue inlet head and is discharged from the bottom end of the glue inlet head.
Preferably, the output shaft of the cam is fixedly connected with a driving wheel through a connecting rod, the driving wheel is positioned right below the branch pipe, the branch pipe ejects pulsed airflow, so that the pulsed airflow pushes the driving wheel to rotate, and the driving wheel drives the cam connected with the driving wheel to rotate.
Preferably, one side of the air bag is fixedly connected with a driving pipe, the driving pipe is communicated with an external air source through a pulse valve, and the external air source applies pulse thrust to the air bag under the action of the pulse valve, so that the air bag can be regularly contracted.
(III) advantageous effects
Compared with the prior art, the invention provides an anti-leakage semiconductor packaging and dispensing device utilizing pneumatic linkage, which has the following beneficial effects:
1. the anti-leakage semiconductor packaging glue dispensing device utilizing pneumatic linkage comprises a glue dispensing table, wherein an air bag is arranged on the glue dispensing table, a driving pipe is arranged on one side of the air bag, the driving pipe is connected with an external air source, a pulse valve is arranged at the joint of the driving pipe and the air source end, the driving pipe can convey high-pressure air to the air bag regularly and quantitatively, when glue dispensing is carried out, the air bag is pushed by the high-pressure air, the air bag conveys pulse airflow to the conveying air pipe, supporting pipes on the conveying air pipe regularly blow airflow, the airflow pushes a sliding support on the inner side wall of a vertical pipe to ascend, the sliding support drives a sliding sleeve to move upwards, a connecting rubber pipe on the sliding sleeve drives a glue inlet head to ascend continuously, the glue inlet head slides out of an inner retaining ring, the inlet ends on two sides of the glue inlet head are not blocked, and resin glue in the glue dispensing cylinder enters the connecting rubber pipe from the, at last, the resin colloid again by connecting the rubber tube entry point and gluing the head, accomplish the operation of gluing, make the device need not hydraulic pressure or the mode of pump just can glue, a large amount of electric quantities have been saved, and simultaneously, owing to set up into glue head and interior fender ring, after gluing the completion, the gas outgoing standpipe, make the sliding support no longer receive gas to support, make the sliding sleeve on the sliding support reset downwards under the effect of gravity and spring, make into advance glue the head and slide in the fender ring, the entrance point that makes into glue head both sides is blockked by interior fender ring, thereby effectively avoided overflowing of colloid, promote the device's the quality of gluing.
2. This utilize antiseep semiconductor package adhesive deposite device of pneumatic linkage, below through gluing the head sets up the shear plate, the inboard of shear plate is equipped with reset spring and cutting knife, the outside of cutting knife is equipped with the cam, in-process gluing, carry the trachea to carry pulse airflow to branch pipe department, make the downward pulse airflow that spouts of branch pipe, it is rotatory to make the air current promote the drive wheel, it is rotatory to make the drive wheel drive the cam of being connected with it, make the cam constantly rotatory and drive shear plate lateral shifting, make the shear plate drive the continuous inside reciprocating motion of cutting knife, make the cutting knife cut the resin colloid of gluing the completion, and then effectively avoided the head of gluing's residue, further promoted the quality of gluing, promote semiconductor package's yields.
Drawings
FIG. 1 is a schematic structural view of a dispensing table according to the present invention;
FIG. 2 is a schematic structural view of a dispensing cartridge according to the present invention;
FIG. 3 is an enlarged view taken at the point A of FIG. 2, in which the inlet end of the glue inlet head is blocked by the inner blocking ring and is in a closed state;
FIG. 4 is a schematic structural view of the present invention, wherein the inlet end of the glue inlet head is not blocked by the inner blocking ring and is in an open-close state;
FIG. 5 is a first diagram of the position relationship of the cutting blade of the present invention;
FIG. 6 is a second diagram of the position relationship of the cutting blade of the present invention;
fig. 7 is a side view of the cam and shear plate of the present invention.
In the figure: 1. a glue dispensing table; 11. a side plate; 2. an air bag; 21. a gas delivery pipe; 22. supporting a tube; 23. a vertical tube; 24. a branch pipe; 3. a glue storage box; 31. repairing the rubber tube; 32. dispensing a glue cylinder; 33. an inner baffle ring; 4. a sliding sleeve; 41. a sliding support; 42. dispensing a glue head; 43. connecting a rubber tube; 44. feeding a rubber head; 5. a shear plate; 51. a cam; 511. a drive wheel; 52. a return spring; 53. a cutting knife; 6. the tube is driven.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1-7, an anti-leakage semiconductor packaging dispensing device using pneumatic linkage comprises a dispensing table 1, a side plate 11 is fixedly connected to the top of the dispensing table 1, an air bag 2 is fixedly connected to one side of the side plate 11, a driving pipe 6 is fixedly connected to one side of the air bag 2, the driving pipe 6 is communicated with an external air source through a pulse valve, the external air source applies pulse thrust to the air bag 2 under the action of the pulse valve, so that the air bag 2 can regularly contract, an air outlet end of the air bag 2 is fixedly connected with an air delivery pipe 21, a supporting pipe 22 and a branch pipe 24 are fixedly connected to the outer side wall of the air delivery pipe 21, a vertical pipe 23 is fixedly connected to the outer side wall of the supporting pipe 22, an air inlet end of the supporting pipe 22 is communicated with the air delivery pipe 21, an air outlet end of the supporting pipe 22 is communicated with the vertical pipe 23, a, the pulse airflow in the vertical tube 23 pushes the sliding support 41 in the vertical tube 23, meanwhile, the air release valve discharges the airflow, so that after the sliding support 41 is pushed to a certain degree, the airflow is discharged by the air release valve, the airflow no longer exerts a supporting force on the sliding support 41, and is reset under the action of gravity, the pulse airflow in the air conveying pipe 21 is conveyed into the vertical tube 23 by the supporting tube 22, the other side of the side plate 11 is fixedly connected with the glue storage box 3, the top of the glue storage box 3 is fixedly connected with the glue supplementing tube 31, the bottom of the glue storage box 3 is fixedly connected with the glue dispensing tube 32, the inner side wall of the glue dispensing tube 32 is fixedly connected with the inner baffle ring 33, the inner baffle ring 33 is a tube body with the upper end and the lower end being sunken inwards, the inner baffle ring 33 is positioned at the middle position of the glue dispensing tube 32, the inner baffle ring 33 is tightly attached to the glue inlet head 44, so that the inlet end of the glue inlet head 44 is blocked by the inner, the outer side wall of the sliding sleeve 4 is fixedly connected with a sliding support 41, the bottom of the sliding sleeve 4 is fixedly connected with a dispensing head 42, the top of the sliding sleeve 4 is fixedly connected with a connecting rubber tube 43, the top end of the connecting rubber tube 43 is fixedly connected with a rubber inlet head 44, the rubber inlet head 44 is a three-way tube, the two sides of the rubber inlet head 44 are inlet ends, the bottom end of the rubber inlet head 44 is an outlet end, and resin colloid enters from the two ends of the rubber inlet head 44 and is discharged from the bottom end of the rubber inlet head 44;
the lower part of the dispensing head 42 is movably connected with a shear plate 5, the outer side wall of the shear plate 5 is connected with a cam 51 in a sliding mode, the output shaft of the cam 51 is fixedly connected with a driving wheel 511 through a connecting rod, the driving wheel 511 is located right below the branch pipe 24, the branch pipe 24 sprays pulse airflow to enable the pulse airflow to push the driving wheel 511 to rotate, the driving wheel 511 drives the cam 51 connected with the driving wheel 511 to rotate, and one side of the shear plate 5 is fixedly connected with a reset spring 52 and a cutting knife 53.
The working principle is as follows: during dispensing operation, the air bag 2 is pushed by high-pressure air, so that the air bag 2 conveys pulse air flow to the air conveying pipe 21, the supporting pipe 22 on the air conveying pipe 21 regularly blows air flow, the air flow pushes the sliding support 41 on the inner side wall of the vertical pipe 23 to ascend, the sliding support 41 drives the sliding sleeve 4 to move upwards, the connecting rubber pipe 43 on the sliding sleeve 4 drives the rubber inlet head 44 to continuously ascend, the rubber inlet head 44 slides out of the inner retaining ring 33, the inlet ends on the two sides of the rubber inlet head 44 are not blocked, resin colloid in the dispensing cylinder 32 enters the connecting rubber pipe 43 from the rubber inlet head 44, finally the resin colloid enters the rubber inlet head 42 from the connecting rubber pipe 43 to complete dispensing operation, meanwhile, after dispensing is completed, air is discharged from the vertical pipe 23, the sliding support 41 is not supported by air, and the sliding sleeve 4 on the sliding support 41 is reset downwards under the action of gravity and a spring, the glue inlet head 44 slides into the inner retaining ring 33, so that the inlet ends at two sides of the glue inlet head 44 are blocked by the inner retaining ring 33, thereby effectively avoiding the overflow of glue and improving the glue dispensing quality of the device.
The structure and process are shown in fig. 1 to 4.
Meanwhile, in the dispensing process, the air delivery pipe 21 delivers the pulse air flow to the branch pipe 24, so that the branch pipe 24 ejects the pulse air flow downwards, the air flow pushes the driving wheel 511 to rotate, the driving wheel 511 drives the cam 51 connected with the driving wheel 511 to rotate, the cam 51 continuously rotates and drives the shear plate 5 to move transversely, the shear plate 5 drives the cutting knife 53 to continuously reciprocate inwards, and the cutting knife 53 cuts the resin colloid after dispensing.
Please refer to fig. 5 to 7 for the above structure and process.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (7)
1. The utility model provides an utilize antiseep semiconductor package adhesive deposite device of pneumatic linkage, includes dispensing table (1), its characterized in that: the glue dispensing table is characterized in that a side plate (11) is fixedly connected to the top of the glue dispensing table (1), an air bag (2) is fixedly connected to one side of the side plate (11), an air delivery pipe (21) is fixedly connected to the air outlet end of the air bag (2), a supporting pipe (22) and a branch pipe (24) are fixedly connected to the outer side wall of the air delivery pipe (21), a vertical pipe (23) is fixedly connected to the outer side wall of the supporting pipe (22), a glue storage box (3) is fixedly connected to the other side of the side plate (11), a glue supplementing pipe (31) is fixedly connected to the top of the glue storage box (3), a glue dispensing cylinder (32) is fixedly connected to the bottom of the glue storage box (3), an inner blocking ring (33) is fixedly connected to the inner side wall of the glue dispensing cylinder (32), a sliding sleeve (4) is fixedly connected to the bottom of the glue dispensing cylinder (, the bottom of the sliding sleeve (4) is fixedly connected with a dispensing head (42), the top of the sliding sleeve (4) is fixedly connected with a connecting rubber tube (43), and the top end of the connecting rubber tube (43) is fixedly connected with a rubber inlet head (44);
the lower part of the dispensing head (42) is movably connected with a shear plate (5), the outer side wall of the shear plate (5) is connected with a cam (51) in a sliding mode, and one side of the shear plate (5) is fixedly connected with a reset spring (52) and a cutting knife (53).
2. The device of claim 1, wherein the device further comprises a pneumatic linkage for preventing the semiconductor package from being leaked: the air inlet end of the supporting pipe (22) is communicated with the air conveying pipe (21), and the air outlet end of the supporting pipe (22) is communicated with the vertical pipe (23).
3. The device of claim 1, wherein the device further comprises a pneumatic linkage for preventing the semiconductor package from being leaked: the inner side wall of the vertical pipe (23) is connected with the sliding support (41) in a sliding mode, and the outer side wall of the vertical pipe (23) is fixedly connected with an air release valve.
4. The device of claim 1, wherein the device further comprises a pneumatic linkage for preventing the semiconductor package from being leaked: the inner blocking ring (33) is a pipe body with the upper end and the lower end sunken inwards, and the inner blocking ring (33) is located at the middle section of the dispensing cylinder (32).
5. The device of claim 1, wherein the device further comprises a pneumatic linkage for preventing the semiconductor package from being leaked: the glue inlet head (44) is a three-way pipe, the two sides of the glue inlet head (44) are inlet ends, and the bottom end of the glue inlet head (44) is an outlet end.
6. The device of claim 1, wherein the device further comprises a pneumatic linkage for preventing the semiconductor package from being leaked: an output shaft of the cam (51) is fixedly connected with a driving wheel (511) through a connecting rod, and the driving wheel (511) is positioned right below the branch pipe (24).
7. The device of claim 1, wherein the device further comprises a pneumatic linkage for preventing the semiconductor package from being leaked: one side of the air bag (2) is fixedly connected with a driving pipe (6), and the driving pipe (6) is communicated with an external air source through a pulse valve.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011158675.0A CN112317245A (en) | 2020-10-26 | 2020-10-26 | Anti-leakage semiconductor packaging glue dispensing device utilizing pneumatic linkage |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011158675.0A CN112317245A (en) | 2020-10-26 | 2020-10-26 | Anti-leakage semiconductor packaging glue dispensing device utilizing pneumatic linkage |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112317245A true CN112317245A (en) | 2021-02-05 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011158675.0A Withdrawn CN112317245A (en) | 2020-10-26 | 2020-10-26 | Anti-leakage semiconductor packaging glue dispensing device utilizing pneumatic linkage |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112317245A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116899820A (en) * | 2023-09-14 | 2023-10-20 | 常州银河世纪微电子股份有限公司 | Double-hole dispensing head for chip and dispensing method thereof |
-
2020
- 2020-10-26 CN CN202011158675.0A patent/CN112317245A/en not_active Withdrawn
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116899820A (en) * | 2023-09-14 | 2023-10-20 | 常州银河世纪微电子股份有限公司 | Double-hole dispensing head for chip and dispensing method thereof |
| CN116899820B (en) * | 2023-09-14 | 2024-01-02 | 常州银河世纪微电子股份有限公司 | Double-hole dispensing head for chip and dispensing method thereof |
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Application publication date: 20210205 |
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| WW01 | Invention patent application withdrawn after publication |